JP2001316868A - カソード用シート、電解メッキ装置及び電解メッキ方法 - Google Patents

カソード用シート、電解メッキ装置及び電解メッキ方法

Info

Publication number
JP2001316868A
JP2001316868A JP2000135242A JP2000135242A JP2001316868A JP 2001316868 A JP2001316868 A JP 2001316868A JP 2000135242 A JP2000135242 A JP 2000135242A JP 2000135242 A JP2000135242 A JP 2000135242A JP 2001316868 A JP2001316868 A JP 2001316868A
Authority
JP
Japan
Prior art keywords
cathode
plating
semiconductor wafer
electrolytic plating
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000135242A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001316868A5 (https=
Inventor
Yasushi Yagi
靖司 八木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2000135242A priority Critical patent/JP2001316868A/ja
Publication of JP2001316868A publication Critical patent/JP2001316868A/ja
Publication of JP2001316868A5 publication Critical patent/JP2001316868A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2000135242A 2000-05-08 2000-05-08 カソード用シート、電解メッキ装置及び電解メッキ方法 Pending JP2001316868A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000135242A JP2001316868A (ja) 2000-05-08 2000-05-08 カソード用シート、電解メッキ装置及び電解メッキ方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000135242A JP2001316868A (ja) 2000-05-08 2000-05-08 カソード用シート、電解メッキ装置及び電解メッキ方法

Publications (2)

Publication Number Publication Date
JP2001316868A true JP2001316868A (ja) 2001-11-16
JP2001316868A5 JP2001316868A5 (https=) 2007-06-14

Family

ID=18643356

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000135242A Pending JP2001316868A (ja) 2000-05-08 2000-05-08 カソード用シート、電解メッキ装置及び電解メッキ方法

Country Status (1)

Country Link
JP (1) JP2001316868A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007169773A (ja) * 2005-11-22 2007-07-05 Electroplating Eng Of Japan Co めっき装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007169773A (ja) * 2005-11-22 2007-07-05 Electroplating Eng Of Japan Co めっき装置

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