JP2001313500A - Device for mounting electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve accurate mounting by surely fitting a pin or protrusion projected to the mold of a part with a lead such as a connector to a hole opened at a printed circuit board. SOLUTION: An electronic part Pn is image picked up by a recognizing camera 16, and the electronic part Pn is recognized by a recognition processing part 33, based on the image. That is, the electronic part Pn is recognized based on the part data of 'group 1 data', 'group 2 data', 'group 3 data', and 'group 4 data' related with the image picked-up image. As for the recognized result, the 'group 1 data' are used for the lead inspection (dimension inspection of deviation in position or lead bending or the like), the 'group 2 data' and the 'group 3 data' are used for the calculation of the correction amounts of X and Y directions, and the 'group 4 data' are used for the calculation of the correction amounts of a θ direction.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for picking up an electronic component with a recognition camera, performing recognition processing on a recognition processing section based on the imaged result, and mounting the electronic component on a printed circuit board.

[0002]

2. Description of the Related Art Such an electronic component mounting apparatus is disclosed in Japanese Unexamined Patent Publication No.
As disclosed in JP-A-8993, conventional components with leads, such as connectors, usually recognize only the leads (electrodes, balls) or recognize only the mold to perform component positioning. In this case, all pieces of information such as leads and molds registered in advance are subjected to recognition processing, and the position and angle of the electronic component are obtained from all the recognition processing results.

[0003]

However, especially when a component with a lead such as a connector is positioned only by recognizing the position of the tip of the lead, the accuracy of the component itself is poor, and the angular accuracy with respect to the mold is not obtained. In some cases, pins or protrusions protruding from the printed circuit board do not fit into the holes formed in the printed circuit board.

SUMMARY OF THE INVENTION It is an object of the present invention to accurately mount a component with a lead such as a connector so that a pin or a protrusion protruding from a mold fits into a hole formed in a printed circuit board.

[0005]

According to the present invention, there is provided an electronic component mounting apparatus for capturing an image of an electronic component with a recognition camera, performing recognition processing based on the captured image, and mounting the electronic component on a printed circuit board. A memory for categorizing portions to be recognized by the processing unit and rewritably storing the use of the recognition result for each group; and a use of the result of the recognition process by the recognition processing unit based on the content stored in the memory. And a control unit for executing the above.

In the present invention, the application is to calculate a correction amount of a position of the electronic component or to inspect a dimension such as a lead bending.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of an electronic component mounting apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a plan view of an electronic component mounting apparatus 1. A component supply unit for supplying various electronic components to a component pick-up portion (component suction position) one by one on a base 2 of the electronic component mounting apparatus 1. 3 are provided side by side. A supply conveyor 4, a positioning unit 5, and a discharge conveyor 6 are provided between the opposing units 3 groups. The supply conveyer 4 conveys the printed circuit board P received from the upstream to the positioning section 5, and after the electronic components are mounted on the substrate P positioned by the positioning mechanism (not shown) by the positioning section 5, the conveyed sheet is conveyed to the discharge conveyor 6. Is done.

Reference numeral 8 denotes a pair of beams long in the X direction.
The screw shaft 10 is rotated by the drive of the shaft motor 9, and the upper part of the printed circuit board P and the component pick-up portion (component suction position) of the component supply unit 3 is individually moved along the pair of left and right guides 11.
Move in the direction.

Each beam 8 is provided with a mounting head 7 which moves along a guide (not shown) by an X-axis motor 12 in the longitudinal direction, that is, the X direction. Each mounting head 7 is equipped with two vertical motors 14 for vertically moving two suction nozzles (not shown), and two θ-axis motors 15 for rotating around a vertical axis. Have been. Therefore, each suction nozzle of the two mounting heads 7 can move in the X and Y directions, can rotate around a vertical line, and can move up and down. By providing one θ-axis motor that can rotate the mounting head about a vertical line and one vertical axis motor that moves the mounting head up and down, only the suction nozzle selected as a result is moved up and down. It is also possible.

Numeral 16 denotes a recognition camera for recognizing a component position. Four cameras are provided, two for each of the mounting heads 7. A total of four electronic components are sucked and held with a positional shift with respect to the suction nozzle. The electronic components are imaged in order to recognize the position in the XY directions and the rotation angles, but two electronic components can be imaged at the same time. Reference numeral 17 denotes a nozzle stocker for storing nozzles, which can store a maximum of 10 nozzles, but stores 9 nozzles.

FIG. 2 is a control block diagram of the electronic component mounting apparatus 1. For convenience, an X-axis motor 12, a Y-axis motor 9, and θ
Only one shaft motor 15 and one vertical shaft motor 14 will be shown and described below.

Reference numeral 20 denotes a CPU (mounting control unit) as a control unit for integrally controlling the mounting apparatus 1. The CPU 20 has a RAM (random access memory) 22 and a ROM (read) via a bus line.・ Only memory) 23
Is connected. Then, the CPU 20 executes the RAM 2
Based on the data stored in the ROM 2, the operation related to the component mounting operation of the electronic component mounting apparatus 1 is generally controlled in accordance with the program stored in the ROM 23.

That is, the CPU 20 controls the interface 2
4 and the drive circuit 25 to drive the X-axis motor 12, the interface 24 and the drive circuit 28 to drive the Y-axis motor 9, and the interface 24 and the drive circuit 32 to drive the θ-axis motor 15. Drive the
Further, the drive of the vertical shaft motor 14 is controlled via the interface 24 and the drive circuit 30.

The RAM 22 stores mounting data related to component mounting as shown in FIG. 3, and in each mounting order (each step number), in the X direction (indicated by X) on the printed circuit board. Information on the Y direction (indicated by Y) and angular position (indicated by θ), arrangement number information of each component supply unit 3, and the like are stored. The RAM 22 stores component arrangement data as shown in FIG. 4, which stores the type (component ID) of each electronic component corresponding to the arrangement number of each component supply unit 3. . Further, the RAM
22 stores component data (parts library data), which is component recognition data indicating the characteristics of each electronic component as shown in FIG. 5, and will be described later in detail.

Reference numeral 33 denotes a recognition processing unit connected to the CPU 20 via an interface 24. The recognition processing unit 33 recognizes an image captured and captured by the recognition camera 16 based on the parts library data. The processing result is sent to the CPU 20. That is, CPU
20 outputs an instruction to the recognition processing unit 33 to perform recognition processing (calculation of the amount of displacement, etc.) on the image captured by the recognition camera 16, and outputs the recognition processing result to the recognition processing unit 33.
From what you receive.

Reference numeral 34 denotes a keyboard as data registration means connected to the CPU 20 via a keyboard driver 35 and the interface 24. Reference numeral 36 denotes a monitor for displaying component images and the like. The keyboard 34 is for inputting characteristics of electronic components based on a format screen. Note that the RAM 22 stores a plurality of formats for creating part library data. Also, a keyboard 3 as the data registration means
In place of 4, a means such as a touch panel may be used.

Next, an operation of registering component data, which is component recognition data, using the electronic component mounting device 1 as an electronic component data creation device will be described. First, the electronic component whose component ID is P1 has a shape as shown in FIGS. 6 and 7, and the bottom surface of the mold is flat. With respect to this component, the parts to be recognized by the recognition processing unit 33 are divided into two groups. The group position of the “group 1 data” of the component data shown in FIG. 8 is based on the X coordinate of the center position of the electronic component main body in the X direction and the X position of the center position of the group 1 in the Y direction. The Y coordinate of the tip position, the lead direction (upward), the number of leads (16), the lead pitch (0.8), and the inspection conditions are input using the keyboard 34 and the monitor 36, and are stored in the RAM 22. The “group 2 data” is similarly created. Each type number 1 is “type 1 data”, and the lead width (0.3), lead length (1.5), and shape (lead) are input as described above and stored in the RAM 22.

The inspection conditions, that is, the uses of the recognition results are stored in the RAM 22 in a rewritable manner for each group. The use of this recognition result is
This means that it is used for calculating the correction amounts in the X direction, the Y direction, and the θ direction, and is also used for lead inspection (dimension inspection for positional deviation, lead bending, and the like).

Next, an electronic component such as a connector whose component ID is Pn has a shape as shown in FIGS. 9 and 10, and a pin or a projection 40 to be inserted into the printed circuit board P is provided on the bottom surface of the mold, for example. I have two. Regarding this part, the part to be recognized by the recognition processing unit 33 is set to 4
Into groups. The group position of the “group 1 data” of the component data shown in FIG. 11 is based on the X coordinate of the center position of the electronic component body from the center position of the electronic component body in the X direction and the group position of the group 1 from the center position of the electronic component body in the Y direction. Y coordinate of tip position, lead direction (upward), number of leads (16), lead pitch (0.8)
The inspection conditions are input using the keyboard 34 and the monitor 36 and stored in the RAM 22. “Group 2 data”, “group 3 data”, and “group 4 data” are created in the same manner, but the group position of the “group 4 data” is the center of the electronic component body (mold portion) in the X direction. The X coordinate from the position to the edge of the mold at the detection point (indicated by X in FIG. 9), the Y coordinate from the center position of the electronic component body in the Y direction to the edge of the mold at the detection point, and the edge direction (downward, That is, the image is input from the keyboard 34 and the monitor 36 with the image (downward from the black mold toward the white background), the number of detected edges (two), the pitch between the detected edges (6.0), and the inspection conditions. And RAM2
2 is stored. Type number 1 is "Type 1 data"
The lead width (0.3), lead length (1.5) and shape (lead) are the same.
, Corner size X (1.5), corner size Y
(1.5) and shape, type number 3 is “type 3 data”, and corner size X (1.5), corner size Y (1.5) and shape, type number 4 is “type 4” With “data”, a shape (edge) is input and stored in the RAM 22.

The use of the recognition result is as follows. For the present electronic component, "Group 1 data" is used for lead inspection (dimension inspection such as displacement or lead bending), and "Group 2 data" and "Group 3 data" are used. This means that “group 4 data” is used for calculating the correction amount in the θ direction for calculating the correction amount in the X direction and the Y direction.

Next, the production operation of the electronic component mounting apparatus 1 will be described.

When the mounting head 7 takes out the electronic component P1 from the component supply unit 3, it is transported onto the recognition camera 16. Next, the camera 16 captures an image of the electronic component P1, and based on the image, the recognition processing unit 33 performs a recognition process on a displacement of the electronic component P1 with respect to the suction nozzle. This recognition processing operation will be described in detail below.

Based on the part data of "group 1 data", "group 2 data" and "type 1 data" stored in the RAM 22, the group position, the lead direction, the number of leads, the lead pitch, The recognition processing unit 33 recognizes the lead width and the lead length.

The recognition result is used for calculating the correction amounts in the X, Y, and θ directions, and is also used for lead inspection (dimension inspection for positional deviation, lead bending, and the like). In other words, based on the recognition result from the recognition processing unit 33, the CPU 20 controls the beam 8 to move the beam 8 in the Y direction by driving the Y-axis motor 9 in the Y direction.
Are moved in the X direction by the driving of the X-axis motor 12 and are rotated by the θ-axis motor 15 by θ, so that X, Y
Correction of the rotation angle position about the direction and the vertical axis is performed. After this correction, the vertical shaft motor 14 is driven to lower the suction nozzle, and the electronic component is mounted at a predetermined position on the printed circuit board P.

When it is determined by the recognition processing of the recognition processing section 33 that a recognition error (should not be attached) occurs, the CPU 2
0, the information is sent, and the part is discarded. This recognition error is, for example, when it is determined that the lead bending is out of the allowable range, and the discard processing is performed as such.

Next, the recognition camera 16 moves the electronic component P
The electronic component Pn is subjected to recognition processing by the recognition processing unit 33 based on the image of n. The processing will be described.
That is, the group position, the lead direction, the number of leads, the lead pitch, the lead width, and the lead length are determined based on the component data of “group 1 data” and “type 1 data” stored in the RAM 22 for the captured image. Based on the part data of “group 2 data”, “group 3 data”, “type 2 data”, and “type 3 data”, the group position, the corner portion dimensions X, Y, and the shape are recognized by the recognition processing unit 33. After the recognition process,
Based on the component data of “data” and “type 4 data”, recognition processing is performed on the group position, the direction of the edge, the number of detected edges, the pitch between the detected edges, and the shape.

As a result of this recognition, the "group 1 data" is subjected to lead inspection (dimension inspection such as positional deviation and lead bending), and the "group 2 data" and "group 3 data" are subjected to X and Y directions. In calculating the correction amount, the “group 4 data” is used to calculate the correction amount in the θ direction. Therefore, after that, the mounting process or the discarding process described above is performed. In the present embodiment, the “group 4 data” is θ
Since the electronic component Pn is used for calculating the direction correction amount, the pin or the projection of the electronic component Pn is surely fitted into the hole formed in the printed circuit board P, and can be accurately mounted.

It should be noted that the recognition processing section 33 classifies the portions to be subjected to the recognition processing into groups and stores the use of the recognition result in the RAM 22 in a rewritable manner for each group.
Since the use of the result of the recognition processing performed by the recognition processing unit 33 based on the content stored in M22 is executed by the CPU 20, the usability is improved. For example, the edge of the lead may be recognized and used for calculating the correction amount in the θ direction.

[0030]

As described above, according to the present invention, an electronic component can be mounted at an accurate position on a printed circuit board. In particular, when the present invention is applied to a component with a lead such as a connector, the position of the tip of the lead is recognized as in the prior art. When positioning with just the component, the accuracy of the component itself is poor, so the angular accuracy with respect to the mold does not come out, and pins and protrusions protruding from the mold when mounting the component may not fit into the holes opened in the printed circuit board. It can be fitted accurately by ensuring that it fits into the hole.

[Brief description of the drawings]

FIG. 1 is a plan view of an electronic component mounting device.

FIG. 2 is a control block diagram of the electronic component mounting device.

FIG. 3 is a diagram showing mounting data.

FIG. 4 is a diagram showing component placement data.

FIG. 5 is a diagram showing component data.

FIG. 6 is a plan view of the component P1.

FIG. 7 is a right side view of the component P1.

FIG. 8 is a diagram showing component data of a component P1.

FIG. 9 is a plan view of a component Pn.

FIG. 10 is a right side view of the component Pn.

FIG. 11 is a diagram showing component data of a component Pn.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 3 Component supply unit 7 Mounting head 16 Recognition camera 20 CPU 22 RAM 33 Recognition processing part 34 Keyboard 35 Keyboard driver 36 Monitor

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hideaki Fukushima 2-5-5 Keihanhondori, Moriguchi-shi, Osaka Sanyo Electric Co., Ltd. (72) Inventor Shosuke Kawai 2-5-2 Keihanhondori, Moriguchi-shi, Osaka No.5 Sanyo Electric Co., Ltd. F term (reference) 5E313 AA02 AA05 AA11 CC04 DD12 EE02 EE03 EE05 EE06 EE24 EE25 EE34 EE37 FF24 FF26 FF28

Claims (2)

[Claims] 1. An electronic component mounting apparatus which picks up an electronic component with a recognition camera, performs a recognition process based on the captured image, and mounts the electronic component on a printed circuit board. An electronic component comprising: a memory for rewritably storing the use of the recognition result for each group; and a control unit for executing the use of the result of the recognition processing by the recognition processing unit based on the contents stored in the memory. Mounting device. 2. The electronic component mounting apparatus according to claim 1, wherein the application is a calculation of a correction amount of a position of the electronic component and a dimensional inspection such as a lead bending.