JP3863424B2 - Electronic component mounting apparatus recognition method and recognition apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a recognition method for an electronic component mounting apparatus that irradiates an electronic component sucked and held by a suction nozzle with a lighting device before the electronic component is mounted on a printed circuit board and recognizes a reflected image thereof, and the recognition device. .
[0002]
[Prior art]
Conventionally, in an electronic component having an electrode on its back surface, the corner portion has an electrode inclined at an angle of 45 degrees. For example, in component recognition such as QFN (Quad Flat Non-Leaded), the electrode at the corner portion In many cases, this electrode could not be recognized. In this case, usually, in an electronic component having an electrode, only the tip, center, or root position of the electrode is detected.
[0003]
[Problems to be solved by the invention]
However, it is difficult to distinguish between the obliquely inclined electrode and the other electrodes by using only the position information, and recognition errors are likely to occur.
[0004]
For this reason, such an electronic component recognizes a silhouette image of the resin mold (transmission recognition processing is often performed, and inspection of the presence / absence of an electrode cannot be performed, and the accuracy of the relative position between the electrode and the resin mold is not good. In this case, there is a problem that the mounting accuracy of the electronic component is affected, and the accuracy is not high.Also, even if the electrode is recognized, it is troublesome to finely adjust the detection position of the electrode for each electronic component. Will occur.
[0005]
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to enable stable electrode recognition and to improve the component mounting accuracy by recognizing this electrode.
[0006]
[Means for Solving the Problems]
Therefore, according to a first aspect of the present invention, there is provided a recognition method for an electronic component mounting apparatus that irradiates an electronic component sucked and held by a suction nozzle with a lighting device before the electronic component is mounted on a printed circuit board and recognizes a reflected image thereof. The detection means detects the principal axis angle of each electrode of the electronic component, the exclusion means excludes the electrode whose principal axis angle detected by the detection means is oblique with respect to the side of the electronic component, and excludes it by the exclusion means The recognition means recognizes the position of the electronic component from the remaining electrode after being applied.
[0007]
According to a second aspect of the present invention, there is provided a recognition apparatus for an electronic component mounting apparatus that irradiates an electronic component sucked and held by a suction nozzle with a lighting device before the electronic component is mounted on a printed circuit board and recognizes a reflected image thereof. Detection means for detecting the principal axis angle of each electrode of the electronic component; exclusion means for eliminating the electrode whose principal axis angle detected by the detection means is oblique with respect to the side of the electronic component; Recognizing means for recognizing the position of the electronic component from the remaining electrode after being formed.
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. In FIG. 1, a pair of rails 5 for guiding the movement of the A beam 3 and the B beam 4 in the Y direction are disposed on a base 2 of the electronic component mounting apparatus 1. The A beam 3 and the B beam 4 are long in the X direction, and mounting heads 7 and 8 each having a suction nozzle 17 are movably disposed along the longitudinal direction. Accordingly, the mounting heads 7 and 8 are movable in the XY directions.
[0009]
More specifically, a ball screw shaft 11 rotated by the A side Y-axis motor 10 is screwed into a nut (not shown) fixed to the A beam 3, and the A beam 3 is rotated by the rotation of the ball screw shaft 11. It can move along. Further, the B beam 4 also moves along the rail 5 when the ball screw shaft 12 having the same structure is rotated by the B side Y axis motor 14.
[0010]
In the upper and lower positions in FIG. 1 of the base 2, component supply units are formed, respectively. In the component supply unit, a plurality of component supply devices 16 that supply various electronic components 15 are arranged in parallel in the X direction. Yes. The suction nozzles 17 of the mounting heads 7 and 8 are for transporting and mounting the electronic component 15 taken out from each component supply device 16 by vacuum suction to a desired position on the printed circuit board 18. The printed circuit board 18 is transported by a transport conveyor 20 installed on the base 2 and positioned and fixed at a predetermined position by a fixing mechanism (not shown).
[0011]
The electronic component 15 taken out from the component supply device 16 is recognized by the component recognition camera 21 to be displaced with respect to the suction nozzle 17. In addition, a nozzle stocker 22 is installed on the base 2, and a suction nozzle 17 attached to the mounting heads 7 and 8 in a replaceable manner is placed thereon.
[0012]
Next, FIG. 2 which is a control block diagram of the electronic component mounting apparatus 1 will be described. Each element of the electronic component mounting apparatus 1 is centrally controlled by the CPU 23, and a ROM 24 storing a program related to the control and a RAM 25 storing various programs and various data are connected via a bus line 26.
[0013]
Further, a CRT 27 for displaying an operation screen and the like and a touch panel 28 formed on the display screen of the CRT 27 are connected to the CPU 23 via an interface 30. The touch panel 28 arbitrarily displays a switch on the screen of the CRT 27.
[0014]
Next, an operation for registering component recognition data (part library data) using the electronic component mounting device 1 as an electronic component data creation device will be described.
[0015]
First, using the touch panel switch 28 as the component recognition data registration means, the electrodes 15A arranged in parallel and corners of the electronic component 15 processed by the reflection type recognition as shown in FIG. Component recognition data necessary for recognizing the position of the electrode 15B inclined in the direction is registered. The registered component recognition data is stored in the RAM 25 as storage means. As shown in FIG. 3, the position and the like of this component recognition data are designated for each of the groups 1, 2, 3, and 4.
[0016]
The electronic component 15 shown in FIG. 3 is an electronic component having electrodes 15A and 15B on the back surface thereof, and is, for example, QFN ((Quad Flat Non-Leaded)).
[0017]
With the above configuration, the production operation of the electronic component mounting apparatus 1 will be described. First, the mounting head 7 is moved in the XY direction, the suction nozzle 17 is lowered, the electronic component 15 shown in FIG. 3 is taken out from the component supply device 16, and is moved again in the XY direction after being lifted and conveyed onto the component recognition camera 21. .
[0018]
Next, the recognition camera 21 captures an image of the electronic component 15 irradiated with light by an illuminating means (not shown), and a positional shift of the electronic component 15 relative to the suction nozzle 17 is recognized based on the reflected image.
[0019]
Hereinafter, this recognition processing operation will be described in detail with reference to FIGS. FIG. 5 shows an outline of the recognition processing operation. After the rough recognition processing, detailed recognition processing is performed and the recognition processing operation is terminated.
[0020]
As shown in the flowchart of FIG. 5, the coarse recognition process detects the position of the electrode 15A at one end or the other end of an arbitrary side and obtains an approximate part position and angle. The detailed recognition process is the coarse recognition process. The positions of all the electrodes 15A are detected from the processing results, and the final positions and angles of the electronic components 15 are obtained.
[0021]
Next, the rough recognition process will be described based on the flowchart of FIG. First, the CPU 23 sets an inspection window. That is, in order to obtain the position of the left end electrode of the vertically long electrode 15A on the upper side of the electronic component 15, an inspection window is cut out from the captured reflection image.
[0022]
Then, the CPU 23 detects the position and area of the electrode block. That is, the clipped image is binarized, the labeled connected component (electrode block) is detected, and the barycentric position and area of the electrode block are obtained. In detail, the clipped image is binarized according to light and dark, and the same label (number) is assigned to all pixels belonging to the same connected component, and different labels are assigned to different connected components. In the binarized image, a pixel having a value of “1” is searched, and the values of eight pixels in the vicinity of the pixel are examined. If there is a pixel having a value of “1”, it is connected to that pixel. Then, the connected component (electrode mass) is detected, and the barycentric position and area of this electrode mass are obtained.
[0023]
Next, the CPU 23 determines the area and the XY dimension ratio of the seven electrode blocks (one dust 31 and six electrodes). That is, electrode candidates whose electrode block area and XY dimension ratio are significantly different from those of the component recognition data shown in FIG. 4 are excluded. In this case, the CPU 23 determines whether or not the difference is greatly different depending on whether or not it is within a predetermined range by a program stored in the ROM 24. For example, the dust 31 has a small area, and the horizontally long electrode 15A has a greatly different XY dimension ratio, and therefore is excluded from the electrode candidates.
[0024]
Then, the CPU 23 detects the main shaft angles of the remaining four electrode blocks except for those excluded from the electrode candidates. That is, the CPU 23 binarizes by setting an individual window at each electrode block position, obtains a labeled connected component, and obtains its center-of-gravity position, area, and spindle angle.
[0025]
Next, the CPU 23 determines the angle of each electrode block. That is, electrode candidates having relatively different angles are excluded. Therefore, the corner electrode 15B is excluded, and the end electrode is determined as the upper left electrode 15A.
[0026]
Accordingly, the CPU 23 determines the electrode position of one end (left end) and returns to the setting of the inspection window since the electrode positions of all the ends have not been determined. In order to obtain the position of the right end electrode of the vertically long electrode 15A, an inspection window is cut out from the captured reflection image, and when the end electrode position of the group 1 is determined repeatedly as described above, the coarse recognition process is terminated.
[0027]
In this flowchart, the example in which the rough recognition process is ended by determining the end electrode position in the group 1 has been described. Similarly, the rough recognition process is ended by determining the end electrode position in any of the groups 2, 3, and 4. There is also a case.
[0028]
Then, a detailed recognition process is performed from the result of the rough recognition process, the positions of all the electrodes 15A are detected, and the final position and angle of the electronic component 15 are obtained. Based on the final position and angle of the electronic component 15, the CPU 23 as a recognition processing unit determines the positional deviation in the XY direction of the electronic component 15 relative to the suction nozzle 17 based on the end electrode position data belonging to group 1 among the recognition results. A deviation angle around the vertical line from the reference of the suction nozzle 17 is calculated.
[0029]
Next, the mounting head 7 transports the electronic component 15 onto the printed circuit board 18, and the calculated displacement amount with respect to the suction nozzle 17 is corrected so as to be positioned at the mounting position at an angle to be mounted. That is, the positioning in the XY directions is performed by the CPU 23 by correcting the positional deviation by the movement of the A beam 3 and the head 7 on the beam 3, and the angular positioning is performed by the suction nozzle 17 itself with a correction amount around the vertical axis. It is made by rotating.
[0030]
As described above, the present invention relates to a recognition method for an electronic component mounting apparatus that performs irradiation processing on an electronic component sucked and held by a suction nozzle with a lighting device before the electronic component is mounted on a printed circuit board and recognizes a reflected image thereof. In this case, the detection means detects the principal axis angle of each electrode of the electronic component, and the exclusion means excludes electrodes having relatively different principal axis angles detected by the detection means, and is excluded by the exclusion means. Since the recognition means recognizes the position of the electronic component from the remaining electrode, stable recognition of the electrode can be performed, and the component mounting accuracy can be improved by the recognition of the electrode. In addition, whether or not there is an obliquely inclined electrode in the corner portion, it is only necessary to set information regarding the electrode, and it is possible to simply create component recognition data. Furthermore, by recognizing the electrodes, it is possible to recognize the difference in the direction of the component if it is an electronic component in which the front and back surfaces of the electronic component and the electrodes are arranged asymmetrically, thereby preventing the production of defective substrates. .
[0031]
Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various alternatives described above without departing from the spirit of the present invention. It includes modifications or variations.
[0032]
【The invention's effect】
As described above, according to the present invention, stable electrode recognition can be performed, and component recognition accuracy can be improved by the electrode recognition. In particular, it has a remarkable effect on the recognition of electronic components processed by the reflection type recognition in which the diagonally inclined electrodes are provided at the corners.
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic component mounting apparatus.
FIG. 2 is a control block diagram of the electronic component mounting apparatus.
FIG. 3 is a plan view of an electronic component.
FIG. 4 is a diagram illustrating component recognition data.
FIG. 5 is a flowchart illustrating an outline of recognition processing.
FIG. 6 is a flowchart of rough recognition processing.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 7, 8 Mounting head 15 Electronic components 15A, 15B Electrode 17 Adsorption nozzle 18 Printed circuit board 21 Component recognition camera 23 CPU
25 RAM

Claims (2)

In a recognition method of an electronic component mounting apparatus in which an electronic device that is sucked and held by a suction nozzle is mounted by a lighting device before the electronic component is mounted on a printed circuit board, and a reflected image thereof is recognized, the recognition method for each electrode of the electronic component The detection means detects the main shaft angle, the main shaft angle detected by the detection means is excluded from the slanting electrode with respect to the side of the electronic component, and the exclusion means excludes the remaining electrode after being excluded by the exclusion means. A recognition method for an electronic component mounting apparatus, wherein the recognition means recognizes the position of the electronic component. In a recognition device for an electronic component mounting apparatus that irradiates an electronic component sucked and held by a suction nozzle with a lighting device before the electronic component is mounted on a printed circuit board and recognizes a reflected image thereof, each of the electrodes of the electronic component is Detection means for detecting the main shaft angle, exclusion means for removing the electrode whose main shaft angle detected by the detection means is oblique with respect to the side of the electronic component , and the remaining electrodes after being excluded by the removal means And a recognition means for recognizing the position of the electronic component.

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