JP2001307054A - Method for sealing ic chip for non-contact data transmission and reception body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To inexpensively manufacture a non-contact data transmission and reception body to prevent destruction and detachment of an IC chip with efficient sealing of the IC chip by realizing block application of sealing materials to an IC chip mounting part in a plurality of antennas without requiring huge equipment. SOLUTION: Antennas 2 of the non-contact data transmission and reception body are formed on a sheet 1 for substrate of the non-contact data transmission and reception body at a state of multi-face mounting and IC chips 9 mounted on the respective antennas 2 are sealed by applying a sealing material 12 consisting of resin by screen printing using a screen printing plate 11 by defining positions corresponding to each of mounting positions of the IC chips 9 as printing part 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for sealing an IC chip for a non-contact type data transceiver such as a non-contact type IC tag.

[0002]

Conventionally, an information recording medium (R) such as a non-contact type IC tag capable of recording and erasing data by transmitting and receiving data in a non-contact state.
F-ID (RadioFrequency IDent)
A non-contact data transmitter / receiver used for the purpose of application (i.f. application)) has a configuration in which an antenna is arranged on a sheet-like base material, and an IC chip is arranged on the antenna. In the antenna, for example, conductive ink is formed by printing with a predetermined antenna pattern, and a predetermined portion for mounting an IC chip is provided in a required portion, and the mounting portion has a bump. The IC chip is mounted by a bonding method.

A non-contact data transmitter / receiver used as an RF-ID information recording medium has a sheet-like base material as described above, and is likely to be bent or twisted when the non-contact data transmitter / receiver is handled normally. It is. The bonding of the IC chip is not performed by bonding alone because the bonding strength with the base material, which is liable to bend or bend, is insufficient. If the IC chip is bent or twisted, the IC chip is broken or detached from the base material. May be released. As a countermeasure, there is a method of applying an underfill agent or an adhesive between the above-mentioned planned mounting portion of the base material and the IC chip to increase the adhesive strength, and furthermore, if the adhesive strength is still insufficient, the IC chip A sealing material (generally, a solvent-evaporating type) is applied to the base material so that the IC chip is covered, and the IC chip is covered with a sealing material fixed to the base material or the IC chip, and the periphery of the IC chip is solidified. It protects the chip and ensures the necessary adhesive strength.

By the way, the method of sealing the IC chip is as follows.
Each time an IC chip is mounted on one antenna, the mounted antenna is sent to a sealing material applying step. In addition, in the method for securing the necessary adhesive strength by using such a sealing material, the application step and the solvent are skipped in each of the steps of providing an underfill agent or an adhesive and providing the sealing material. Large-scale drying process, the equipment required for the process was large, and the manufacturing line for the non-contact data transmitter / receiver was complicated, preventing destruction and detachment of the IC chip. There was a limit to providing information recording media at low cost. In view of the above circumstances, the present invention can apply a sealing material to the IC chip mounting portions of a plurality of antennas at once without requiring a large-scale facility for sealing the IC chip. An object of the present invention is to make sealing possible, and an object of the present invention is to manufacture an inexpensive non-contact data transmitter / receiver in which destruction and detachment of an IC chip are prevented.

[0005]

SUMMARY OF THE INVENTION The present invention has been made in consideration of the above problems, and has a plurality of antennas of a non-contact type data transmitter / receiver arranged on a base sheet of the non-contact type data transmitter / receiver. The IC chip mounted on each of the antennas is coated with a sealing material made of resin by screen printing using a screen printing plate having a printing portion at a position corresponding to each mounting position of the IC chip. Non-contact type data transmitter / receiver I characterized by sealing
An object of the present invention is to solve the above problem by providing a method of sealing a C chip. And in this invention, the said sealing material can be made into a photocurable resin, and the said sealing material can be made into a thermosetting resin.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described in detail with reference to the embodiments shown in FIGS. In the present invention, a plurality of antennas of the non-contact type data transmitting / receiving body are multi-faced in a required arrangement pattern on a base sheet serving as a base material of the non-contact type data transmitting / receiving body, and the multi-face mounting is performed. After mounting the IC chip on each of the plurality of antennas, each of the IC chips is sealed with a sealing material. First, a procedure up to mounting of the IC chip is shown in FIGS. It should be noted that, in the drawings showing up to the mounting of the IC chip, one antenna is shown as a representative, and the process proceeds in a similar manner for a plurality of antennas mounted on multiple surfaces.

First, an antenna 2 is printed and formed on one surface of a base sheet 1 shown in FIG. 1 in a required pattern using conductive ink. As shown in FIG. 2, the antenna 2 has an antenna wire 3 in a substantially loop shape, an antenna end 5 is disposed facing the loop portion 4 of the antenna wire 3, and a part of the antenna wire 3. Is a divided pattern, and the portion is formed as an IC chip attaching portion 6. Next, as shown in FIG. 3, an insulating portion 7 is formed by printing insulating ink so as to cover the loop portion 4 where the antenna end portion 5 faces. Thereafter, as shown in FIG. 4, a jumper section 8 made of conductive ink is printed and formed so as to overlap the insulating section 7, and the antenna 2 is obtained by connecting the jumper section 8 and the antenna end section 5. .

The I 2 of the antenna 2 obtained as described above
The IC chip 9 is mounted on the C chip mounting portion 6. This IC
When mounting the chip 9, an underfill agent, an adhesive, or the like may be provided in advance on the IC chip mounting portion 6. In this way, as shown in FIG. 6, the base sheet 1 in which the antenna 2 having the IC chip 9 mounted thereon is multi-faced is obtained, and the IC of the base sheet 1 is obtained.
A sealing material is applied to the chip mounting portion 6 so as to cover the IC chip 9 as described later.

A description of each of the above members will be given below. When paper is used as the base material of the non-contact data transmitter / receiver, the base material sheet may be a high-quality paper, a mat paper, a coated paper, a synthetic paper, or other known materials. When using a film as the substrate, polyethylene terephthalate resin, polyethylene resin, polypropylene resin, acrylonitrile butadiene styrene copolymer resin, polyvinyl chloride resin, polyphenylene sulfide resin, polyimide resin,
In addition, a film of a known thermoplastic resin or thermosetting resin can be used, and a film whose surface has been subjected to physical or chemical treatment may be used. The base sheet may be in the form of a sheet or a roll, and in any state of the sheet or the roll, an antenna can be formed, an IC chip can be mounted, and the like.
The method for forming the antenna can be performed by a screen printing method, but is not limited thereto. The antenna may be formed by an etching method or the like. As a material for forming the antenna and the insulating portion, commercially available conductive ink and insulating ink can be used, but not limited thereto.

An example of forming the antenna 2 on the base material sheet 1 in multiple faces will be described below. The multi-layered pattern of the antenna is placed on a base sheet made of paper or film.
A mesh emulsion is formed by a printing method using a screen having a thickness of 30 μm (see FIG. 2). In addition, LS-411AW manufactured by Asahi Chemical Laboratory was used as the conductive ink. After curing the conductive ink under the condition of 150 ° C./30 minutes,
Asahi Chemical Laboratory resist ink C as insulating ink
An insulating part is formed at a predetermined position of the antenna using R-44B (see FIG. 3). 150 ° C / 1 of the insulating ink
After curing under the condition of 0 minutes to obtain an insulating portion, a bridge portion is formed on the insulating portion under the curing condition of 150 ° C./30 minutes using the conductive ink (see FIG. 4). As a result, the antenna is obtained in a multi-patterned pattern and mounted on an IC chip (see FIG. 5).

[0011] In the present invention, each of the antennas which are multi-faced on the base material sheet on which the IC chip has been mounted is mounted.
The C chip is sealed with a sealing material using a printing method. As shown in FIGS. 6 and 7, when applying the sealing material, the screen printing plate 11 in which the printing unit 10 is set in advance so as to correspond to each of the mounting positions of the IC chips of the plurality of antennas that are multi-faced. On the base sheet 1. Then, the sealing material 12 is supplied to the screen printing plate 11, and the sealing material 12 is spread over the printing portions 10 by scraping the sealing material 12 in the same manner as in normal screen printing. As shown in FIG. The sealing material 12 is applied to the IC chip mounting portion 6 through the cover 10 to cover the IC chip 9. In FIG. 7, reference numeral 13 denotes a squeegee for scraping the sealing material. As shown in FIG. 8, the base sheet 1 in which the sealing material 12 is applied to the IC chip mounting portion 6 using the screen printing plate 11 is subjected to a curing process described later. Thus, a plurality of antennas in which the IC chip 9 is sealed by the cured sealing material 12 can be obtained collectively.

When the sealing material is applied by a screen printing method, the base material sheet on which the IC chip is mounted has a thickness of 120 to 100%.
It is preferable to use a screen printing plate having 325 mesh and an emulsion thickness of 30 to 100 μm, but it is possible to secure the thickness of the encapsulant by changing the conditions of the screen printing plate and performing overprinting. Thus, a reliable product can be supplied. The following table shows the sealant thickness that can be reported when the conditions of the screen printing plate are changed.

[0013]

[Table 1]

If a greater thickness is required, a metal mask
The thickness can be ensured by using a mask using a plate using a functional material such as vinyl chloride.

When a solvent volatile type is used as the above-mentioned sealing material, a deaeration / drying device for removing the solvent at the time of applying the sealing material and at the time of curing treatment is required. Sealing materials that can be used in place of the solvent volatile type sealing material include a type using a photocurable resin and a type using a thermosetting resin.

(Type Using Photocurable Resin) The type using photocurable resin contains photopolymerizable monomers, oligomers and photopolymerization initiators as essential components. The photopolymerizable monomer,
In the case of photoradical polymerization, acrylate-based and methacrylate-based oligomers can be used, but acrylate-based polymers are more preferable in consideration of the curing speed. In the case of photocationic polymerization, a liquid epoxy type can be used. Photopolymerizable monomers,
By blending the oligomers, it is possible to adjust the viscosity, and in particular, to optimize photopolymerizable monomers having a low glass transition temperature, flexibility by selecting the oligomers, and adhesion to substrates, for example, PET films. It is possible. Next, as for the photopolymerization initiator, when photoradical polymerization is performed by acrylate or methacrylate, halogen-based or aromatic carbonyl-based compounds (benzoin ethers, ketals,
0.5 to 5 parts by mass of a photopolymerization initiator typified by acetophenones), ketone compounds, thioxanthone compounds and the like can be blended with respect to 100 parts by mass of the resin. In this case, the sulfonium salt-based photopolymerization initiator can be blended in an amount of 0.5 to 5 parts by mass based on 100 parts by mass of the resin. A sensitizer may be added to further improve the curability. In addition,
The filler can be blended as silica, calcium carbonate, alumina, talc or the like for controlling the viscosity.

A specific example of a sealing material using the above-mentioned photocurable resin and a method of curing the sealing material are shown as a sealing example 1, and the evaluation of the sealing state will be described below. (Sealing Example 1) One IC chip was sealed by a screen printing method using an ultraviolet-curing resin Desolite KZ8713 (viscosity: 1,000 mPas · s) manufactured by JSR Corporation. Next, this sealing material was irradiated under irradiation conditions of 400 to 500 m.
The composition was irradiated with ultraviolet rays of J / cm ² and cured. At this time, the thickness of the sealing material after curing is 50 to 150 μm. When a bending test and a torsion test were performed using the sealing example 1, when no sealing material was used, detachment occurred at the IC chip mounting portion, but the sealed one did not fall off. Did not.

(Type Using Thermosetting Resin) A type using a thermosetting resin includes a resin and a curing agent as essential components.
As the resin, a silicone resin, an epoxy resin, or an acrylic resin can be used. Viscosity,
It is possible to optimize flexibility by selecting a resin having a low glass transition temperature and to optimize adhesion to a substrate, especially a PET film. As the curing agent, when the resin is a silicone resin, a platinum-based resin is used. When the resin is an epoxy resin, an acid anhydride is used. In particular, when the resin is a fatty acid anhydride, 0.8 to 1 part by mass of the resin is used. .2 parts by mass, 0.5 to 5 parts by mass per 100 parts by mass of resin for imidazole or onium salt, 0.5 to 2 parts by mass per 100 parts by mass of organic peroxide for acrylic resin Can be blended. Further, a catalyst may be added in order to further improve the curability. The filler may be silica, calcium carbonate, alumina, talc or the like, and can be blended for controlling the viscosity.

A specific example of a sealing material using the above-mentioned thermosetting resin and a method of curing the sealing material are shown as a sealing example 2, and the evaluation of each sealing state will be described below. (Sealing Example 2) One-part heat-curable silicone adhesive KE1842 (viscosity: 4,000 mPas · s) manufactured by Shinsen Kagaku Kogyo
Was applied to the IC chip by a screen printing method. Next, the sealing material was thermally cured at a curing condition of 120 ° C./30 minutes to seal an IC chip. The thickness of the sealing material after curing at this time is 50 to 180 μm. When a bending test and a torsion test were performed using the sealing example 2, detachment of the IC chip occurred without the sealing material, but no detachment was observed in the sealed one. Was.

[0020]

As described above, according to the method of sealing an IC chip for a non-contact type data transmitter / receiver of the present invention, the base material sheet of the non-contact type data transmitter / receiver has a non-contact type data transmitter / receiver. Form multiple antennas in a multi-faced state,
The IC chip mounted on each of the antennas is
A sealing material made of a resin is applied by screen printing using a screen printing plate having a printing portion at a position corresponding to each mounting position of the C chip, and sealing is performed. The sealing material can be collectively applied to the IC chip mounting portion, and the sealing of the IC chip can be performed efficiently.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a base material sheet corresponding to one of multiple antennas to be multi-faced in an example of a method of sealing an IC chip for a non-contact data transmitter / receiver according to the present invention.

FIG. 2 is an explanatory diagram showing antenna lines formed in a predetermined pattern.

FIG. 3 is an explanatory diagram showing a state in which an insulating unit is provided.

FIG. 4 is an explanatory diagram showing a state where a bridge unit is provided.

FIG. 5 is an explanatory diagram showing a state where an IC chip is mounted.

FIG. 6 is an explanatory view showing a multi-layered substrate sheet.

FIG. 7 is an explanatory view showing application of a sealing material by a screen printing method.

FIG. 8 is an explanatory view showing a state in which a sealing material is applied to each of the IC chip attachment portions.

FIG. 9 is an explanatory view showing a state in which a sealing material is applied to an IC chip attachment portion.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Base material sheet 2 ... Antenna 3 ... Antenna wire 4 ... Loop part 5 ... Antenna end part 6 ... IC chip attaching part 7 ... Insulating part 8 ... Jumper part 9 ... IC chip 10 ... Printing part 11 ... Screen printing plate 12 … Sealant

Continued on the front page F-term (reference) 2C005 MA08 MA19 MA32 MB06 RA22 RA23 5B035 AA04 AA08 BA05 BB09 CA03 CA23 5F061 AA01 CA12 FA03

Claims (3)

[Claims] 1. A plurality of antennas of a non-contact type data transmitter / receiver are formed on a base sheet of the non-contact type data transmitter / receiver in a multi-faced state.
A non-contact type wherein the C chip is sealed by applying a sealing material made of resin by screen printing using a screen printing plate having a printing portion corresponding to a mounting position of the IC chip. A method for sealing an IC chip for a data transceiver. 2. The method according to claim 1, wherein the sealing material is a photo-curable resin.
3. The method for sealing an IC chip for a non-contact type data transmitter / receiver according to item 1. 3. The method according to claim 1, wherein the sealing material is a thermosetting resin.
3. The method for sealing an IC chip for a non-contact type data transmitter / receiver according to item 1.