JP2003099749A - Photo-curing adhesive tape and method of manufacturing contact ic card using it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a photo-curing adhesive tape capable of providing an excellent deaerating capability in a crimping process and preventing air from being entrained in an adhesive part, and a method of manufacturing a contact IC card capable of preventing air from being entrained in the adhesive part. SOLUTION: This photo-curing adhesive tape is formed of a photo-cation curing type adhesive agent layer. An emboss formed of fine irregularities is formed on at least one surface thereof, and the surface roughness of the surface of the emboss is 5 to 30 μm. In this method, to adhere an IC module to a card base, the photo-curing adhesive tape is used to bring the emboss surface of the photo-curing adhesive tape into contact with the contact surface of the IC module.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a photocurable adhesive / adhesive tape (including a photocurable adhesive / adhesive sheet and a photocurable adhesive / adhesive film) and a method of manufacturing a contact type IC card using the same. Regarding

[0002]

2. Description of the Related Art An IC card is an information recording medium incorporating an IC (integrated circuit) and has higher security than a conventional magnetic card. Therefore, next-generation advanced information media such as electronic money and complex information media. Has been attracting attention and is being used.

Generally, IC cards are roughly classified into contact type IC cards and non-contact type IC cards. Contact type IC cards are mainly used as credit cards and cash cards. Non-contact type IC cards are mainly used in industry. For I
It is used as a D tag, prepaid card, etc.

Of these, the contact type IC card has high security, and therefore its use mainly as electronic money is being studied. This contact type IC card is composed of at least a base resin plate (hereinafter referred to as "card base") and a substrate on which an IC chip is mounted (hereinafter referred to as "IC module"), and these are bonded with an adhesive material. And it is one IC card.

As a substrate of an IC module, materials generally used for PCBs and FPCs such as glass epoxy and polyimide are used. In particular, glass epoxy is inexpensive and excellent in heat resistance and mechanical strength. It is widely used as an IC module for IC cards.

Since the contact type IC card is generally carried and used, it is required to have very high adhesive strength and high reliability such as heat resistance and moisture resistance. Especially, even if it is bent, the IC module and the card base are required. Is required to be peeled off.

However, since the flexural modulus of elasticity is different between the glass epoxy and the card base, which are generally the mainstream of the IC module substrate, a high tensile stress is applied to the adhesive material for adhering them. Therefore, in these adhesion, strength is insufficient with a simple adhesive material such as a double-sided adhesive tape, and under the present circumstances, a method using an adhesive or a thermosetting adhesive film, or the present inventors have proposed Method using a light-curing adhesive tape (Japanese Patent Application 2000
-354615) can be used.

However, when an adhesive is used, the size of the IC module is small, so that there is a problem that the adhesive will stick out or the coating thickness will be uneven unless very precise coating is applied. In addition, since the adhesive has stains during pressure bonding, it is necessary to clean the surface of the IC card after the bonding, so that the workability of bonding is extremely poor. Further, when a two-component mixed type adhesive is used, its pot life is short, and therefore it is necessary to frequently replace the adhesive, which is also a problem in terms of efficiency.

Further, when the thermosetting adhesive film is used, there are problems that the card base is curled by the heat at the time of adhesion and the printing of the base becomes unclear.

Further, in the method proposed in Japanese Patent Application No. 2000-354615, a photocurable adhesive tape is proposed as an adhesive layer. According to this method, heating is required at the time of pressure bonding. In addition, the adhesive workability is good, and excellent adhesive strength and high reliability such as heat resistance and moisture resistance can be exhibited. However, when adhering the IC module and the card base with the photo-curing adhesive tape, the adhesive surface of the IC module has a central portion of 10 to 20 μm due to manufacturing reasons.
Since many of them are formed in a recessed shape of about m, it is easy to entrap air between the IC module and the photo-curing adhesive tape, and the IC module part is pressed in a post process to the entrapped air. However, some things do not completely escape the air. If the air is still entrained in this way, there is a problem that the adhesive force is reduced due to a reduction in the contact area, and in particular, it becomes a starting point of peeling during bending.

[0011]

SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a photo-curing adhesive / adhesive tape which has good deaerating property in the crimping step and does not entrap air in the adhesive part.
Another object of the present invention is to provide a method for manufacturing a contact type IC card in which air is not trapped in the adhesive portion.

[0012]

The photocurable adhesive / adhesive tape according to claim 1 is a photocurable adhesive / adhesive tape comprising a photocationic curable adhesive / adhesive layer, at least one of which is provided. It is characterized in that an embossing having fine irregularities is formed on the surface, and the surface roughness of the embossing surface is 5 to 30 μm.

According to a second aspect of the present invention, there is provided a method of manufacturing a contact type IC card, wherein the photocurable adhesive tape according to claim 1 is used for adhering an IC module and a card base. It is characterized in that the embossed surface is brought into contact with the adhesive surface of the IC module.

The photocurable pressure-sensitive adhesive tape of the present invention comprises a photocationic curable pressure-sensitive adhesive layer.

The above-mentioned photo-cationic curable pressure-sensitive adhesives are photo-cationic polymerization initiators that generate cations when irradiated with light and a cationically polymerizable compound capable of undergoing cationic polymerization to initiate cationic polymerization of the cationically polymerizable compound. It is an adhesive material containing an adhesive polymer and having an adhesive property at room temperature, which is cured by being irradiated with light to form an adhesive.

[0016] Cationic polymerization is not affected by oxygen, and the reaction proceeds continuously in air. Therefore, the reaction rate can be changed depending on the concentration of cations generated. Further, as the curing by cationic polymerization progresses, a cross-linked body (gel) of the cationically polymerizable compound is formed, and the elastic modulus is increased (adhesive).

The curing rate by cationic polymerization can be adjusted by the concentration of generated cations, the reaction rate of the cationically polymerizable compound, and the like. Therefore, a photocurable adhesive / adhesive tape comprising a photocationic curable adhesive / adhesive layer. By using, the curing speed of the photo-cationic curable pressure-sensitive adhesive can be slowed down, the time for which the tackiness is maintained is gained, and the adhesive can be easily adhered to the adherend even after the polymerization is started once.

The photocurable pressure-sensitive adhesive tape adhered to the adherend is gradually cured by photocationic polymerization to improve the elastic modulus and cohesive force, and finally the crosslinked body ( gel)
To form and cure. Therefore, by irradiating light in advance to start the photocationic polymerization, it is possible to easily attach and cure to any material (adherend), and whether it has tackiness. Easy adhesion of opaque adherends such as IC modules and card bases that could not be adhered without auxiliary means such as pressing means with conventional photo-curing adhesives with extremely short stickiness duration. You can wear it.

The photocurable adhesive tape after being adhered is
The curing progresses even at room temperature, and finally it becomes a cured product with high elastic modulus and high cohesive strength equivalent to adhesives, so it has excellent adhesive strength and heat resistance and moisture resistance required for contact type IC cards. High reliability can be easily obtained without heating.

The above-mentioned photocationic curable adhesive / adhesive layer is formed from a photocationic curable adhesive / adhesive composition, and the photocationic curable adhesive / adhesive composition comprises an adhesive polymer and a cationically polymerizable compound. And a photocationic polymerization initiator.

Since the adhesive polymer is incorporated into the cationic polymerization network by the below-described cationically polymerizable compound and the photocationic polymerization initiator to form an IPN structure, heat resistance, moisture resistance, weather resistance and the like are remarkably improved and cured. The later adhesive / adhesive layer exhibits high adhesive strength and high reliability.

Examples of the adhesive polymer include polyester, polyurethane, poly (meth) acrylate, polyvinyl acetate and the like. These adhesive polymers may be homopolymers or copolymers. Further, these adhesive polymers may be used alone or in combination of two or more kinds.

The adhesive polymer has a glass transition temperature (T
It is preferable that g) is 30 ° C. or lower. If the Tg of the adhesive polymer exceeds 30 ° C., the tackiness and initial tackiness of the tacky-adhesive layer may be reduced, or the tacky-adhesive layer may be hardened to lower the impact resistance.

In order to adjust the Tg to 30 ° C. or less, the adhesive polymer may be copolymerized with a Tg adjusting component, or a low Tg polymer compatible with the adhesive polymer may be mixed. Is also good. Examples of the Tg adjusting component include butadiene, alkyl (meth) acrylate, aromatic (meth) acrylate, hydroxyalkyl (meth)
Acrylate etc. are mentioned. Examples of the low Tg polymer include elastomers and polyolefins.

Since the adhesive layer may be crosslinked, a functional group capable of reacting with the crosslinking agent or the cationically polymerizable functional group may be introduced into the adhesive polymer. Examples of the functional group include a hydroxyl group, a carboxyl group, an epoxy group, and an unsaturated double bond. However, since a basic functional group such as an amino group may inhibit the cationic polymerization reaction, it is preferable not to introduce it into the adhesive polymer or to introduce it to the minimum necessary amount.

Among the above-mentioned adhesive polymers, polyester and polyurethane are particularly preferably used. Since polyester and polyurethane have high polarity, excellent compatibility with a cationically polymerizable compound, and high cohesive force, it is possible to obtain an adhesive layer having sufficient strength even if the molecular weight is low. Further, since the molecular weight can be lowered, it is easy to form a tacky adhesive tape. Furthermore, by using polyester as the adhesive polymer, the adhesive force to plastic materials such as ABS, PET and polyvinyl chloride can be further improved.

The molecular weight of polyester or polyurethane is
It may be appropriately set according to the required physical properties after curing, the curing speed, etc., but generally, the number average molecular weight is 30
It is preferably from 00 to 100,000. When the number average molecular weight of polyester or polyurethane is less than 3000, the cohesive force of the adhesive layer may be insufficient, and conversely 10
If it exceeds 10,000, the compatibility with the cationically polymerizable compound may decrease.

The cationically polymerizable compound is cationically polymerized by a photo-cationic polymerization initiator which will be described later, and the adhesive polymer such as polyester or polyurethane is contained in the polymer network of the cationically polymerizable compound to restrain the movement or the adhesive property. Since the IPN structure is formed by a cross-linking reaction with a hydroxyl group or a carboxyl group in the polymer to construct a highly cross-linked structure, the cured product of the adhesive layer exhibits high adhesive strength and high reliability. Becomes

As the cationically polymerizable compound, for example,
Examples thereof include epoxy resin and vinyl ether resin. These cationically polymerizable compounds may be used alone or in combination of two or more kinds.

Specific examples of the epoxy resin include, for example,
Yuka Shell Epoxy Co., Ltd.'s trade name "Epicoat" series, Shell's trade name "Epon" series, Asahi Denka Kogyo's trade name "Adeka Resin" series and "Adeka Optomer" series, Daicel Chemical Industries Ltd. The product names of "Cyclomer" series, "Epofriend" series and "Eporide" series are listed. Specific examples of the vinyl ether resin include "RAPICURE" series manufactured by ISP Co., Ltd.

Further, an oligomer or liquid polymer having a functional group such as an epoxy group, an alicyclic epoxy group, a vinyl ether group, a hydroxyl group, a carboxyl group, an ethyleneimine group and an episulfide group in the molecule is also used as a cationically polymerizable compound.

The amount of the cationically polymerizable compound contained in the photocationic curable pressure-sensitive adhesive composition is such that the adhesive polymer 1
10 to 90 parts by weight of the cationically polymerizable compound
It is preferably part by weight. If the amount of the cationically polymerizable compound is less than 10 parts by weight with respect to 100 parts by weight of the adhesive polymer, the density of cross-linking of the cured product of the adhesive layer decreases, resulting in insufficient adhesive strength and heat resistance. On the other hand, if it exceeds 90 parts by weight, the cured product of the adhesive layer may be too hard and the impact resistance may be lowered.

In order to effectively react the cationically polymerizable compound, the molar equivalent of the cationically polymerizable functional group in the cationically polymerizable compound is preferably 1500 or less, more preferably 1000 or less. The molar equivalent of the cationically polymerizable functional group in the cationically polymerizable compound is 150.
If it exceeds 0, the inter-crosslinking density of the cured product of the adhesive layer may decrease, and the adhesive strength and heat resistance may become insufficient.

The photocationic polymerization initiator may be one which can be activated by being irradiated with light to generate a photocationic polymerization initiator and photocationically polymerize the above cationically polymerizable compound with relatively low energy. Good, for example,
It may be an ionic photoacid-generating photocationic polymerization initiator or a nonionic photoacid-generating photocationic polymerization initiator.

Examples of the ionic photoacid-generating photocationic polymerization initiator include onium salts such as aromatic diazonium salts, aromatic halonium salts, aromatic sulfonium salts, iron-allene complexes, titanocene complexes, and arylsilanols. -Organometallic complexes such as aluminum complexes are listed, and specific examples thereof include trade names "Optomer SP-150" and "Optomer SP-" manufactured by Asahi Denka Co., Ltd.
170 ", a product name" U "manufactured by General Electronics Co.
VE-1014 ", trade name" CD-1 "manufactured by Sartomer Company.
Commercially available products such as "012" are mentioned.

Examples of the nonionic photoacid-generating photocationic polymerization initiator include nitrobenzyl ester, sulfonic acid derivative, phosphoric acid ester, phenolsulfonic acid ester, diazonaphthoquinone, N-hydroxyimide sulfonate and the like. Can be mentioned.

These cationic photopolymerization initiators may be used alone or in combination of two or more kinds.

The content of the photocationic polymerization initiator in the photocationic curable pressure-sensitive adhesive composition may be appropriately set depending on the kind and the content of the cationically polymerizable compound.
Generally, it is preferable that the cationic photopolymerization initiator is 0.001 to 10 mol% based on the number of moles of the functional group in the cationically polymerizable compound. If the above-mentioned amount of the cationic photopolymerization initiator is less than 0.001 mol%, the reaction will take a long time and process retention will occur, resulting in contact type IC.
The production efficiency of the card may decrease, and conversely, if it exceeds 10 mol%, the reaction rate will be too fast, and the stickiness duration of the adhesive tape after irradiation with light will be shortened, resulting in the bonding. Lead time is shortened, resulting in a lack of process capability.

The photocationic curable pressure-sensitive adhesive composition used in the present invention contains, in addition to the above-mentioned adhesive polymer, cationically polymerizable compound and photocationic polymerization initiator, within a range not hindering the achievement of the object of the present invention. If necessary, tackifier, cohesiveness agent, stress relaxation agent, hydrolysis inhibitor, filler, softener, plasticizer, antioxidant (antiaging agent), heat stabilizer, colorant, charging 1 of various additives such as inhibitors and flame retardants
One kind or two or more kinds may be mixed.

The form of the adhesive composition may be any of solvent type, emulsion type (dispersion type), hot melt type and the like.

The method of forming the photocationic curable adhesive / adhesive layer from the photocationic curable adhesive / adhesive composition is not special, and examples thereof include roll coating, die coating, gravure coating, flow coating and hot melt. The adhesive composition is applied by a usual coating method such as coat, calendar coat, part coat, screen printing, etc., and if necessary, it is dried or cooled to obtain the desired adhesive strength. An agent layer can be formed.

In the photocurable pressure-sensitive adhesive tape of the present invention, the surface of the photocationic curable pressure-sensitive adhesive layer may be protected by a releasable support in order to prevent adhesion of dust and foreign matter. The releasable support is laminated on the adhesive layer until the adhesive tape is used, and is peeled from the adhesive layer when the adhesive tape is used.

Examples of the peelable support include PET,
On at least one side of a support such as polyester such as PEN, plastic film such as polyvinyl chloride, cellulose, polystyrene, polyolefin, paper, non-woven fabric, woven cloth, etc., a silicone type release agent or a long chain alkyl group pendant type polymer type release agent Examples of the release support include a release support which is subjected to a release treatment with an agent or the like, and among them, a plastic film support having light transmittance is preferably used.

The photocationically curable adhesive / adhesive layer may be formed by applying the photocationically curable adhesive / adhesive composition to the release-treated surface of the releasable support. In this case, when a releasable support comprising a porous support such as paper, non-woven fabric or woven fabric is used, the low-viscosity tacky-adhesive composition may leak out. You may laminate | stack a plastic film or may coat with a sealing agent.

The photocurable pressure-sensitive adhesive tape of the present invention is required to have at least one surface on which an embossment having fine irregularities is formed. As the form of the fine irregularities, various types of irregular patterns mainly composed of a large number of convex portions and concave portions corresponding to the convex portions, or various convex and concave patterns formed of a large number of convex stripes and concave grooves for the convex stripes are adopted. The uneven patterns may be regularly distributed or may be randomly distributed. Further, the heights of the convex portions and the ridges may all be the same or different,
The depths of the concave portions and the concave grooves with respect to the convex portions and the convex stripes may all be the same or different.

The embossed pattern of the embossed surface is generally a pyramid such as a triangular pyramid, a quadrangular pyramid, or a cone, a truncated triangular pyramid, a truncated quadrangular pyramid, a truncated cone such as a truncated cone, or a mountain-like head. And a large number of concave portions corresponding to these convex portions. In addition, it may be composed of a large number of convex stripes having a triangular, quadrangular or trapezoidal cross section and a large number of concave grooves for these convex stripes, and the convex stripes and concave grooves are formed in parallel with each other. Alternatively, it may be formed in a lattice shape. Since these recesses and grooves serve as air passages during deaeration, it is desirable that they communicate with the edge of the tape.

The surface roughness of the embossed surface of the photocurable pressure-sensitive adhesive tape must be in the range of 5 to 30 μm. The surface roughness of this embossed surface is JIS B 060.
It means a ten-point average roughness measured based on 1. If the surface roughness of the embossed surface of the photocurable pressure-sensitive adhesive tape is less than 5 μm, the air passage is narrow and a sufficient deaeration effect may not be obtained. On the other hand, if it exceeds 30 μm, the recesses and grooves of the embossed surface will not be sufficiently collapsed during pressure bonding,
Air may be trapped in bubbles or grooves.

As a method for forming the embossing having fine irregularities on the above-mentioned photocurable adhesive / adhesive tape, the above-mentioned photocationic curable adhesive / adhesive composition is used to release an embossed releasable support. A method of forming a photocationically curable pressure-sensitive adhesive layer by directly coating on the mold-treated surface, and separating a releasable support laminated on the other surface of the formed photocationically curable pressure-sensitive adhesive layer. Examples thereof include a method of forming an emboss by embossing the mold-treated surface and an emboss roll method of passing the surface of the formed photocationic curable pressure-sensitive adhesive layer through an emboss roll.

In the method for producing a contact type IC card of the present invention, a photocurable adhesive / adhesive tape comprising a photocationic curable adhesive / adhesive layer is used.

The photocurable pressure-sensitive adhesive tape used in the production method of the present invention preferably has a thickness of 20 to 200 μm. If the thickness of the photocurable tacky-adhesive tape is less than 20 μm, the adhesive thickness may be thin and the adhesive strength may be insufficient. The contact type IC card is JIS X 63
When the thickness of the photocurable adhesive tape exceeds 200 μm, it is necessary to make the thickness as specified in 03 “IC card with external terminal-physical characteristics and terminal position”. Since the thickness of the other parts is reduced, the mechanical strength of the entire contact IC card may be insufficient.

In the manufacturing method of the present invention, first, the photocurable pressure-sensitive adhesive tape is processed in advance according to the shape of the adhesive surface. The processing according to the shape of the adhesive surface means that the photocurable adhesive tape is previously processed according to the outer dimensions of the counterbore surface of the card base.

Examples of the molding method include various molding methods such as a punching method, a cutting method, a part coat method and a screen printing method, and any method may be adopted. Further, it is preferable that the shape of the photocurable pressure-sensitive adhesive tape at the time of molding is a configuration suitable for the above molding method. For example, when molding is performed by a punching method, it is preferable that both surfaces of the adhesive tape are protected with a peelable support in order to protect the surface of the adhesive layer. If the surface of the adhesive layer is not protected, dust or foreign matter may adhere to the surface of the adhesive layer, or a punching residue may adhere when the adhesive tape is punched with a punching blade.

Next, an embossed surface of the photocurable adhesive tape which has been processed in advance according to the shape of the adhesive surface by the above method,
Attach the adhesive surface of the IC module. The sticking method is
Although it may be a pressing method or a laminating method, since the adhesive tape is adhesive at room temperature, it can be easily attached to the adhesive surface of the IC module. However, IC whose center part is recessed by 10 to 20 μm
In the case of a module, the adhered adhesive tape is in a state in which air is involved. The pasting may be carried out at room temperature or at a heating temperature lower than the heat resistant temperature of the photocurable adhesive tape, but the adhesive tape may be kept at room temperature or after light irradiation. Adhesion is sufficient, and heating is preferably stopped at the minimum necessary temperature.

In the production method of the present invention, the surface of the photo-cationic curable pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape is irradiated with light,
The adhesive layer is activated and photocationic polymerization is started. This may be performed before the adhesive tape is attached to the IC module, or the adhesive tape is attached to the IC module. It may be performed in the next step of wearing.

The above-mentioned light irradiation may be carried out by peeling off the releasable support which protects the surface of the adhesive / adhesive layer and directly irradiating the surface of the adhesive / adhesive layer with light. When the permeable support is light transmissive, light may be indirectly irradiated through the peelable support.

Further, it is preferable that the light irradiation is performed to such an extent that the pressure-sensitive adhesive layer has tackiness at room temperature even after the light irradiation, and the gel fraction of the pressure-sensitive adhesive layer (based on ethyl acetate) It is preferable to carry out so that the weight fraction of insoluble matter) increases with time and the final gel fraction becomes 40% by weight or more. When the final gel fraction of the adhesive / adhesive layer is less than 40% by weight, the cohesive force of the adhesive / adhesive layer is insufficient and the tensile adhesive strength is reduced, so that the IC module and the card base are separated from each other. May be easier to do.

Next, the other surface of the adhesive tape that has been irradiated with light is temporarily adhered (temporarily pressed) to the card base. Since the adhesive layer has already been irradiated with light, it is performed as soon as possible. It is preferable. The method of temporary adhesion (temporary pressure bonding) may be a pressing method or a roll laminating method, but the pressing method is preferable in order to more efficiently apply pressure to the adhesion surface. Generally, a contact type IC card reads and writes information with a reader / writer, but at that time, since the reading head directly contacts the surface of the IC module, there is almost no step. Therefore, it is difficult for pressure to be applied to the adhesive surface by the normal roll laminating method.

Next, the IC module and the card base are finally bonded (pressed) by a pressing method. By adhering (compression bonding) by a pressing method, the air trapped between the IC module and the adhesive tape is degassed using the embossed unevenness of the adhesive tape as a passage.

The pressure for pressing is 98 to 980 k.
Pa is preferable. If the pressing force is less than 98 kPa, the pressure may not be sufficiently applied, and the entrained air may not escape. Conversely, if it exceeds 980 kPa, the card base may be deformed.

The above-mentioned sticking may be carried out at room temperature or at a heating temperature lower than the heat-resistant temperature of the card base, but the interfacial adhesion between the IC module and the adhesive tape and the card In order to further improve the interfacial adhesion between the base and the adhesive tape to further improve the adhesive force, it is preferable to perform the heating at a heating temperature.

[0061]

BEST MODE FOR CARRYING OUT THE INVENTION The following examples are given to illustrate the present invention in more detail, but the present invention is not limited to these examples. In addition, "part" in an Example means a "weight part."

(Example 1) (1) Preparation of adhesive composition Polyester resin (trade name "Vylon 550", Tg:
-15 ° C, manufactured by Toyobo Co., Ltd. 70 parts, alicyclic epoxy resin (trade name "Celoxide 2081", epoxy equivalent: 1
50, manufactured by Daicel Chemical Industries, Ltd.) and an aromatic sulfonium salt type photocationic polymerization initiator (trade name "Optomer SP170", molecular weight: 1280, manufactured by Asahi Denka Co., Ltd.) 1
The parts were uniformly mixed to prepare a photocationic curable pressure-sensitive adhesive composition.

(2) Preparation of Adhesive / Adhesive Tape The above adhesive / adhesive composition was dissolved in the same amount of methyl ethyl ketone, and one side was subjected to a release treatment with a silicone-based release agent. Paper (release paper)
Is coated on a release-treated surface having a surface roughness of 8 μm using a roll coater so that the thickness after drying is 100 μm,
After forming a tacky adhesive layer by drying, a PET film (release PET) having a release treatment heavier than the above release paper on one surface with a silicone release agent on the surface of this tacky adhesive layer The release-treated surfaces of were laminated to prepare a photocurable adhesive tape. The release paper of the photocurable pressure-sensitive adhesive tape produced was peeled off, and the surface roughness was measured and found to be 7 μm. The surface roughness was measured by measuring the ten-point average roughness according to JIS B0601.

(3) Punching of the adhesive tape As shown in FIGS. 1 (a) and 1 (b), 10 mm × 12 m
Using an m-square rectangular punching die,
Punching was performed so that 0 rectangles were continuously arranged, and portions other than the rectangles were removed. However, the release PET was not completely punched, and a continuous sheet state was maintained.

(4) Manufacture of bonded body The release paper in the rectangular portion of the tacky adhesive tape was peeled off, and a high pressure mercury lamp was used on the surface of the exposed tacky adhesive layer to obtain a cumulative light amount of ² J / cm ^2. Was irradiated with ultraviolet rays. In addition, the above-mentioned integrated light amount is measured by a product name “UVR-” manufactured by TOPCON.
T35 ".

Next, as shown in FIG. 2 (a), an IC module (top surface 12 mm × 13 mm square, bottom surface (bonding surface))
The bottom surface side (10 mm × 12 mm square, total thickness 0.4 mm) is adhered to the adhesive layer which has been irradiated with the above ultraviolet rays, and the release P
An IC module was picked up from the ET together with the adhesive tape. The bottom surface (adhesion surface) of the IC module used was recessed at the maximum by 20 μm in the central portion.

As an alternative to the card base, a transparent vinyl chloride resin sheet (thickness: 0.7 mm
Width: 55 mm, length: 85 mm) was used.

As shown in FIG. 2 (b), the picked up adhesive / adhesive tape / IC module laminate was placed on the spot-shaped portion of the vinyl chloride resin sheet, and provisionally pressure-bonded.

Next, the IC module portion of the above joined body was press-pressed under the conditions of pressure of 196 kPa and time of 5 seconds, and the adhesive tape was adhered to the spot-shaped portion of the vinyl chloride resin sheet, and then at 23 ° C. It was cured in an atmosphere for 5 days to produce a joined body.

(5) From the card base surface side of the evaluated bonded body, the presence or absence of air entrapment of the adhesive layer and the dynamic bending test of the card in accordance with JIS X6305 were conducted. The card was tested 500 times in the long side direction and 50 in the short side direction.
It was performed 0 times and the adhesion state was observed. The results are shown in Table 1.

Example 2 The composition of the adhesive composition was changed to polyester resin (trade name "Elitel UE340
0 ", Tg: -16 ° C, manufactured by Unitika Ltd., 60 parts, bisphenol F type epoxy resin (trade name" Epicoat # 80 "
7 ", epoxy equivalent: 150, manufactured by Yuka Shell Epoxy Co., Ltd.) 40 parts and photocationic polymerization initiator" Optomer SP "
A bonded body was produced in the same manner as in Example 1 except that the number of parts was 170 ". The release paper of the photocurable pressure-sensitive adhesive tape produced was peeled off and the surface roughness was measured and found to be 7 μm.

Example 3 A joined body was produced in the same manner as in Example 1 except that the embossed surface roughness of the release treated surface of the release paper was 25 μm. The release paper of the photocurable pressure-sensitive adhesive tape produced was peeled off and the surface roughness was measured and found to be 23 μm.

Comparative Example 1 A joined body was produced in the same manner as in Example 1 except that the embossed surface roughness of the release treated surface of the release paper was 3 μm. The release paper of the photocurable pressure-sensitive adhesive tape produced was peeled off and the surface roughness was measured and found to be 3 μm.

(Comparative Example 2) A bonded body was prepared in the same manner as in Example 1 except that the embossed surface roughness of the release treated surface of the release paper was 40 μm. The release paper of the photocurable pressure-sensitive adhesive tape produced was peeled off and the surface roughness was measured and found to be 38 μm.

Examples 2 and 3, and Comparative Example 1
Also, the presence or absence of air entrapment in the adhesive layer of the joined body of Comparative Example 2 and the dynamic bending test of the card were evaluated in the same manner as in Example 1. The results are shown in Table 1.

[0076]

[Table 1]

[0077]

As described above, according to the present invention, the embossing having fine irregularities is formed on at least one surface of the photocationic curable pressure-sensitive adhesive layer, and the surface roughness of the embossing surface is 5 or less. Since it is ˜30 μm, it is possible to obtain a photocurable pressure-sensitive adhesive tape that has good deaerating property in the pressure bonding step and does not entrap air in the adhesive part.

According to the method of manufacturing a contact type IC card of the present invention, the embossed surface of the above-mentioned photocurable adhesive tape is applied to the IC.
Since the IC module and the card base are adhered to each other by contacting with the adhesive surface of the module, air is not entrapped in the adhesive portion because air is degassed using the unevenness of the embossed surface as a passage.

[Brief description of drawings]

FIG. 1 shows an adhesive tape produced in an example, (a)
Is a plan view thereof, and (b) is a sectional view thereof.

FIG. 2 is a cross-sectional view showing a bonding method according to an embodiment, and FIG. 2 (a) is a cross-sectional view showing a bonding method between an adhesive tape and an IC module.
(B) is sectional drawing which shows the method of adhering the laminated body of an adhesive tape and an IC module to the spot facing shape part of a vinyl chloride resin sheet.

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Claims (2)

[Claims] 1. A photocurable adhesive / adhesive tape comprising a photocationic curable adhesive / adhesive layer, wherein at least one surface of the tape is embossed with fine irregularities, and the embossed surface has a surface roughness. A photocurable pressure-sensitive adhesive tape having a thickness of 5 to 30 μm. 2. The photocurable pressure-sensitive adhesive tape according to claim 1 is used for bonding the IC module and the card base, and the embossed surface of the photocurable pressure-sensitive adhesive tape is brought into contact with the adhesive surface of the IC module. A method for manufacturing a contact type IC card, which is characterized in that