JP2001134736A - Ic card and producing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC card improved in the strength and reliability of adhesion between an IC module and a card base without requiring heating in the case of adhesion. SOLUTION: Concerning this IC card, the IC module, with which an IC is packaged on a circuit board, is adhered through an adhesive layer to the card base, and this adhesive is composed of a photo setting type viscous adhesive tape containing an adhesive resin, a cationic polymerized compound and an optical cationic polymerization initiator.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an IC card used for, for example, a credit card or a cash card, and a method of manufacturing the same.

[0002]

2. Description of the Related Art An IC card is an information recording medium incorporating an IC (integrated circuit) and has higher security than a magnetic card. Therefore, IC cards are receiving attention as next-generation advanced and complex information recording media such as electronic money.

[0003] IC cards are roughly classified into contact-type IC cards and non-contact-type IC cards. Contact type IC cards are mainly used for credit cards and cash cards, and non-contact type IC cards are mainly used for industrial ID tags and prepaid cards.

[0004] Since a contact type IC card has high security, a method of using it as electronic money is being studied. 2. Description of the Related Art Conventionally, a contact type IC card is configured by bonding an IC module having an IC mounted on a circuit board to a card base made of resin.

As a circuit board material of an IC module,
Glass epoxy, polyimide, and the like, which are used for general printed circuit boards and flexible printed boards, are used. In particular, a glass epoxy substrate is inexpensive and has excellent heat resistance and mechanical strength. Therefore, a glass epoxy substrate is used as a circuit board in many contact IC card modules.

[0006]

Since the contact type IC card is used in a portable manner, the adhesive used for bonding the card base and the IC module has a very high adhesive strength.
Heat resistance and moisture resistance are required. In particular, it is important that the IC module and the card base do not come off even if the card is bent.

However, a glass epoxy board, which is widely used as a circuit board of an IC module, and a card base have different flexural modulus. Accordingly, a large tensile stress is applied to the adhesive layer that bonds the card base and the circuit board of the IC module when the card is bent.

Therefore, when an adhesive material such as a normal double-sided pressure-sensitive adhesive tape is used to constitute the adhesive, the adhesive strength is insufficient. Therefore, at present, adhesives, thermosetting adhesive films, and the like are used.

However, when an adhesive is used, IC
Due to the very small size of the module, the glue had to be applied with high precision. That is, if the application accuracy of the adhesive is not sufficient, there has been a problem that the adhesive protrudes from the bonding portion or that the thickness of the adhesive layer becomes uneven.

[0010] Furthermore, since the adhesive exudes at the time of pressure bonding, it is necessary to clean the card surface after bonding. On the other hand, thermosetting adhesive films require heat for curing, and this heat may deform the card base,
In some cases, printing on the surface of the card base became unclear.

An object of the present invention is to provide a bonding method between an IC module and a card base, which does not require heating, and which can be used to cure the IC module after curing.
An object of the present invention is to provide an IC card which has excellent bonding strength between a C module and a card base and is excellent in reliability, and a method for manufacturing the same.

[0012]

An IC card according to the present invention comprises an IC module having an IC mounted on a circuit board.
In an IC card adhered to a card base via an adhesive layer, the adhesive layer is a photocurable adhesive tape containing an adhesive resin, a cationically polymerizable compound and a cationic photopolymerization initiator. Features.

A first method for manufacturing an IC card according to the present invention is directed to a photocurable adhesive containing an adhesive resin, a cationically polymerizable compound and a cationic photopolymerization initiator on one surface of a film-like support. A step of attaching a photocurable pressure-sensitive adhesive tape having a layer formed thereon to an IC module or a card base from the photocurable pressure-sensitive adhesive layer side; It is characterized by comprising a step of irradiating light from the side of the mold adhesive layer, and a step of attaching the irradiated surface to a card base or an IC module.

In a second method for producing an IC card according to the present invention, an adhesive resin is provided on one side of a film-like support having a transmittance of light having a wavelength for activating a cationic photopolymerization initiator of 30% or more. A photo-curable adhesive tape having a photo-curable adhesive layer containing a cationically polymerizable compound and a photo-cationic polymerization initiator is attached to an IC module or a card base from the photo-curable adhesive layer side. And irradiating the photocurable adhesive layer with light over the film-like support, peeling the film-like support, and exposing the exposed photocurable adhesive layer surface to a card base or Attaching to an IC module.

Hereinafter, the present invention will be described in detail. The IC card according to the present invention is not particularly limited, but is suitably used for a contact type IC card. The IC module in the present invention is not particularly limited, and an appropriate IC module for an IC card having an IC mounted on a circuit board such as a printed circuit board or a flexible printed board (FPC) is used. Also, about card base,
A card base made of an appropriate material such as plastic or paper can be used.

The feature of the IC card according to the present invention is that
The C module is adhered to the card base with a photo-curable adhesive tape. The photocurable adhesive tape comprises a photocurable adhesive composition containing an adhesive resin, a cationically polymerizable compound, and a cationic photopolymerization initiator. In the initial state, the photocurable adhesive tape has tackiness at room temperature, and is cured by irradiating light to give an adhesive cured product similar to an adhesive. In the IC card according to the present invention, the photocurable adhesive composition is taped to form a photocurable adhesive tape.

The thickness of the photocurable adhesive tape is 20 to 20.
It is desirable to set the range to 0 μm. If the thickness is too small, the adhesive thickness becomes small and sufficient adhesive strength may not be expected. On the other hand, in the case of a contact type IC card, JIS X6303
There is a demand for the thickness specified in the above. If the thickness is too large, the thickness of the other portions may decrease, and the mechanical strength of the entire contact type IC card may decrease. However, this does not apply when the standard of the contact type IC card is changed.

In the photo-curable adhesive tape, the photo-cationic polymerization initiator is activated by light irradiation, and the curing proceeds by the cationic polymerization of the cationically polymerizable compound. This cationic polymerization is not affected by oxygen and the reaction proceeds continuously in air. Therefore, the reaction rate can be adjusted by the concentration of the cationic species generated by activating the cationic polymerization initiator. Further, since the cationic polymerization proceeds by a dark reaction, the curing reaction reliably proceeds even after the irradiation of light and after the irradiation of the light is stopped, and finally a sufficient adhesive strength is developed.

The curing by the cationic polymerization can be controlled by the concentration of the generated cationic species and the reaction rate of the cationically polymerizable compound. Therefore, the curing rate can be reduced and the time for which the tackiness is maintained can be extended. . That is, the pot life can be lengthened, and even after polymerization is started once by irradiation of light, it can be adhered to the adherend.

In the above-mentioned photocurable pressure-sensitive adhesive tape, the elastic modulus and the cohesive force increase with time after irradiation with light, and are finally cured by polymerization of the cationically polymerizable compound. Therefore, if cationic polymerization is started by irradiation of light in advance, adhesion and adhesion to adherends of any material
It can be cured and can be applied to opaque materials such as modules and card bases that could not be bonded with conventional photocurable adhesives.

Since the above-mentioned photo-curing type pressure-sensitive adhesive tape cures even at room temperature after bonding, the final cured adhesive exhibits the same adhesive properties as an adhesive, and has a high adhesion required for a contact type IC card. Reliability can be ensured without using heating.

In the present invention, the components constituting the photocurable adhesive tape are as follows. Adhesive Resin The above-mentioned adhesive resin is a component that causes the photocurable adhesive composition to exhibit adhesiveness, and includes polyester, polystyrene, poly (meth) acrylate, polyurethane, and polyvinyl acetate. These polymers may be copolymers or homopolymers.

The adhesive resin is incorporated into a cationic polymerization network formed by a cationically polymerizable compound and a cationic polymerization initiator, and has a cross-linked or pseudo-cross-linked phase structure, thereby improving heat resistance and weather resistance. Therefore, the final adhesive cured product exhibits high durability together with high adhesive strength.

The glass transition point Tg of the adhesive resin is 30.
C. or lower. If the Tg is too high, the initial tackiness may be reduced, and the Tg may be hardened to lower the impact adhesive strength. Further, in order to adjust the glass transition point Tg, a glass transition point adjusting component may be copolymerized. For example, butadiene, alkyl (meth) acrylate, aromatic (meth) acrylate, hydroxyalkyl (meth)
Acrylate or the like may be copolymerized as a glass transition point adjusting component. Or, having compatibility with the adhesive resin,
A polymer having a low glass transition point Tg, for example, rubber or olefin may be blended.

In the present invention, since the photocurable adhesive composition can be crosslinked at the time of curing, the adhesive resin has a functional group capable of reacting with a crosslinking agent or a cationically polymerizable functional group. It may be. Examples of such a functional group include an OH group, a COOH group, an epoxy group, and a double bond. In addition, since a basic functional group such as an amino group may inhibit a cationic polymerization reaction, a smaller amount is preferable.

The adhesive resin is not particularly limited as long as it can exhibit tackiness as described above, but polyester and polyurethane can be particularly preferably used. Polyesters and polyurethanes have high polarity and excellent compatibility with cationically polymerizable compounds. In addition, since the cohesiveness is high, even when the molecular weight is low,
Since sufficient tape film strength can be realized, tape formation is easy. Furthermore, since the molecular weight can be reduced, the pot life described later can be lengthened.

Further, in the case of polyester, AB
It is more preferable to use polyester because it has excellent adhesiveness to plastic materials such as S, PET (polyethylene terephthalate), and polyvinyl chloride, and provides high adhesive strength.

The molecular weight of the polyester or polyurethane is selected depending on the required mechanical strength after curing and the curing speed, but is generally 3,000 to 10 in number average molecular weight.
A range of 0.000 is preferred. If the molecular weight is too small, the cohesive strength may decrease, and if the molecular weight is too large, the compatibility tends to decrease.

Cationic polymerizable compound The cationic polymerizable compound takes in the adhesive resin after curing to form a crosslinked or pseudo-crosslinked phase structure.
The photocurable pressure-sensitive adhesive tape of the present invention is provided with high cohesive strength and adhesiveness.

The cationically polymerizable compound is not particularly limited, but an epoxy resin including an alicyclic epoxy resin, a vinyl ether resin and the like can be suitably used.

The above epoxy resin is manufactured by Yuka Shell Epoxy Co., Ltd., trade name: Epicoat, manufactured by Shell Chemical Co., Ltd., trade name: Epon, manufactured by Asahi Denka Co., Ltd., trade name: Adeka Resin, Adeka Optomer, manufactured by Daicel Chemical Co., Ltd. Product Name: Cyclomer, Epo Friend, Epold, etc.

As the vinyl ether resin, ISP
Company name, product name: rapicure and the like.
Further, as the cationic polymerizable compound, a liquid polymer or oligomer having an epoxy group, an alicyclic epoxy group, a vinyl ether group, an OH group, an ethyleneimine group, an episulfide group, or the like may be used.

The mixing ratio of the cationic polymerizable compound is as follows:
10 to 90 per 100 parts by weight of the total amount with the adhesive resin
It is preferred to be in the range of parts by weight. If the blending ratio of the cationically polymerizable compound is too small, the gel component may be reduced and the heat resistance of the cured adhesive product may be reduced. If the blending ratio is too large, the cured product may be hardened and the impact fracture resistance may be reduced.

In order to make the cationically polymerizable compound react effectively, the amount of the cationically polymerizable functional group contained in the molecule is such that the functional group equivalent expressed as the amount of the compound containing 1 mol of the functional group is 1500 g-resin / mol. Or less, more preferably 1000 g-resi
n / mol or less. When the functional group equivalent is large, the density of the functional group in the molecule becomes low, and it may take a long time to cure.

Photocationic Polymerization Initiator As the above cationic photopolymerization initiator, either an ionic photoacid generating type or a nonionic photoacid generating type photocationic polymerization initiator may be used.

Examples of the cationic photopolymerization initiator of the ionic photoacid generating type include onium salts such as aromatic diazonium salts, aromatic halonium salts, and aromatic sulfonium salts, iron-allene complexes, titanocene complexes, and arylsilanols.
Examples thereof include organometallic complexes such as an aluminum complex. More specifically, for example, Optomer SP
-150 (manufactured by Asahi Denka Kogyo KK), Optmer SP-170
Commercially available compounds such as (Asahi Denka Kogyo), UVE-1014 (General Electronics), and CD-1012 (Sartomer) can be used.

As the nonionic photoacid generating type, nitrobenzyl ester, sulfonic acid derivative, phosphoric acid ester, phenolsulfonic acid ester, diazonaphthoquinone, N-hydroxyimidesulfonate and the like can be used.

The above-mentioned cationic polymerization initiators may be used alone or in combination of two or more. Alternatively, two-stage curing may be performed using a plurality of cationic photopolymerization initiators having different effective active wavelengths.

Further, when a component which is polymerized in another photopolymerization mode is contained, another photopolymerization initiator, for example, a photoradical polymerization initiator or a photoanionic polymerization initiator is used in combination with the above photocationic polymerization initiator. You may. In this case, the wavelength of light for activating the photoradical polymerization initiator or the photoanionic polymerization initiator does not need to be the same as the wavelength of light for activating the photocationic polymerization initiator.

The proportion of the cationic photopolymerization initiator is preferably adjusted according to the amount of the cationically polymerizable compound. The molar ratio of the cationic photopolymerization initiator to the cationically polymerizable functional group of the cationically polymerizable compound is preferably adjusted. 0.
It is desirable to mix them so as to be about 001 to 10 mol%. If the proportion of the photocationic polymerization initiator is too small, the reaction takes a long time to reduce the efficiency. If the proportion is too large, the reaction speed increases, and the time during which the tackiness is maintained after light irradiation (usable Time), and the restriction that the lead time until bonding must be shortened increases.

The photocurable adhesive composition constituting the photocurable adhesive tape of the IC card according to the present invention may further comprise, if necessary, a stabilizer and an adhesive in addition to the above-mentioned essential components. Additives such as property imparting agents, plasticizers, antioxidants, anti-hydrolysis agents, coloring agents, fillers, cohesive agents, stress relaxation agents such as rubber, or various polymers inhibit the object of the present invention. You may add in the range which does not do.

The photocurable pressure-sensitive adhesive tape according to the present invention is obtained by reducing the viscosity of the above-mentioned photocurable pressure-sensitive adhesive composition by using an appropriate organic solvent or water, or by melting or the like. Can be obtained by coating on a film-like support having releasability and forming a tape.

The coating is performed by roll coating, die coating,
It can be performed by an appropriate method such as a gravure coat or a calendar coat, and in some cases, it may be applied in a pattern by screen printing, part coating, or the like. It is preferable that the surface of the photocurable adhesive layer applied on the film support is protected by a second film support having a releasable surface.

Since the photo-curable adhesive is photosensitive, it is generally preferable to cover or package it with a light-shielding material when storage stability is taken into consideration. When used for applications such as adhesive tape, it is also preferable to protect one surface with a light-shielding support in consideration of workability and protect the other surface with a light-transmitting film-like support. . If such a laminated structure is employed, while securing the storage stability by the light-shielding support, it is peeled off at the time of use to perform the attaching operation, and the light irradiation is performed while being protected by the light-transmitting support. It becomes possible.

According to a more specific aspect of the present invention, in the laminated structure in which the photocurable adhesive layer is sandwiched between the film supports as described above, one of the film supports has light transmittance. When the other has no light transmissivity, the peeling force of the other film support is smaller than the peel force of the light transmissive film support. That is, in the case where one of them is composed of a light-transmitting film-shaped support, in use, first, the non-light-transmitting film-shaped support is peeled off from one of the IC module or the card base to be used. After applying an adhesive tape, and then irradiating the light through the other light-transmitting film-like support, the light-transmitting film-like support is peeled off and attached to a card base or an IC module. be able to. When bonding is performed in such a process, the film-like support having no light transmittance is firstly peeled off. Therefore, if the peeling force of the film-like support having no light transmittance is too high, the support may be peeled off. When peeling off the tape peeling surface is not stable,
The tape may partially remain on any of the two film supports, or the tape may be pulled and shifted.

In the method for manufacturing an IC card according to the present invention,
First, the above-mentioned curable adhesive composition is applied to one surface of the above-mentioned film-like support to obtain a photo-curable adhesive tape. In this case, as described above, a film-like support may be laminated on both sides of the curable adhesive layer.

Preferably, the photocurable adhesive tape obtained as described above is processed according to the shape of the region to be bonded to the IC module. About the above processing,
It can be performed by punching, cutting using a cutting jig, or the like. Alternatively, the photocurable adhesive tape may be formed according to the planar shape of the bonding area by each forming method such as part coating or screen printing instead of cutting.

In the cutting and shaping, it is desirable that the photocurable adhesive tape has a structure suitable for the cutting and shaping. For example, in the case of punching, it is preferable that both surfaces of the photocurable adhesive layer are laminated with a film-like support in order to protect the adhesive surface. Further, in order to enhance the cutting property, a photo-curable adhesive may be applied to both surfaces of the core using a film-shaped core to form a photo-curable adhesive. That is, the photocurable adhesive layer may be formed in the form of a double-sided pressure-sensitive adhesive tape with a support.

Next, one side of the above-mentioned photocurable adhesive tape is attached to the adhesive surfaces of a plurality of IC modules or card bases from the side of the curable adhesive layer. In this case, when the film-like support is laminated on both sides of the curable adhesive layer, the film-like support on one side is peeled off, and the photocurable adhesive tape is attached to the IC module. . This sticking may be performed by a pressing method or a roll laminating method, and is not particularly limited. However, since the photocurable adhesive tape has tackiness at room temperature, it can be easily attached to an IC module. can do.

As described above, the plurality of IC modules or card bases adhered to the photocurable adhesive tape may be separated by peeling the film-like support, or may be separated from the photocurable adhesive tape. The adhesive tape may be carried on a film-like support. In particular, IC modules are generally small and have poor handling properties. Therefore, the photocurable adhesive tape is not peeled off from the film-like support, but is carried on the film-like support through the film. And transportability are dramatically improved.

The above-mentioned attachment may be performed at room temperature,
The thermocompression bonding may be performed at a temperature lower than the heat resistant temperature of the module.
By thermocompression bonding, the interfacial adhesion between the IC module and the photocurable adhesive tape is increased, and the final adhesive strength is increased. In particular, when unevenness is present along with the formation of the circuit on the circuit board of the IC module, by applying heat, the adhesive becomes easily wrapped around the unevenness,
The adhesive strength can be further increased.

Next, prior to bonding the other side of the photocurable adhesive tape to a card base or an IC module, light is applied to the photocurable adhesive tape. This light irradiation may be performed by peeling the film-shaped support when the surface opposite to the side attached to the IC module or the card base is covered with the film-shaped support. When the film support has a light-transmitting property, light irradiation may be performed through the film support.

The light irradiation is preferably carried out so that the photocurable pressure-sensitive adhesive tape keeps the tackiness even after the irradiation. Further, the gel fraction is increased with the lapse of time, and the insoluble content in ethyl acetate is 40% by weight or more. It is desirable to perform light irradiation in such a manner. When the gel fraction is low, the cohesive strength is reduced, the tensile adhesive strength in the final cured adhesive product is reduced, and the IC module and the card base may be easily separated.

Next, after the light irradiation, I
The C module and the card base are crimped. in this case,
When light is irradiated through the film-like support, the film-like support is peeled off first, and the IC module and the card base are pressure-bonded.

The press bonding may be performed by either a press method or a roll laminating method, but the press method is preferable in order to more efficiently apply pressure to the bonding surface. Generally, in a contact-type IC card, information is read and written using a reader / writer. At that time, a reading head directly contacts the IC module surface. Therefore, there is almost no step on the surface of the contact type IC card. Therefore, it is difficult to apply sufficient pressure to the bonding surface by the ordinary roll lamination method, and therefore it is desirable to use the pressing method.

The pressure at the time of pressure bonding is 10 to 100 N / c.
It is preferably about m ² . If the pressure is too high, the card base will be deformed. If the pressure is too low, bubbles will be entrained without applying pressure. When air bubbles are involved, the bonding area decreases and the bonding strength decreases.

It is desirable that the temperature at the time of pressure bonding be equal to or lower than room temperature or the heat-resistant temperature of the card base. Although bonding can be performed even at room temperature, irregularities may also be present on the adhered surface of the card base, and heating is desirable in order to improve the ability to follow these irregularities. In any case, since the photocurable pressure-sensitive adhesive tape has tackiness even after light irradiation, it is desirable to minimize the heating.

By leaving the press-bonded IC module and card base as they are, the cationic polymerization of the cationically polymerizable compound proceeds, and the curable adhesive tape is finally cured.

In the photocurable adhesive tape according to the present invention,
Since the photocurable adhesive itself has a sufficient cohesive force, the risk of the module being peeled or displaced during curing is extremely smaller than that of a normal adhesive.

When the photocurable pressure-sensitive adhesive tape finally cures, the adhesive strength of the cured adhesive product is very excellent,
Adhesion reliability, such as heat resistance and moisture resistance, is also significantly improved.
This is because, due to an increase in the gel fraction, in addition to the cured matrix of the cationically polymerizable compound, the adhesive resin is incorporated into the cured matrix to form a cross-linked or pseudo-cross-linked phase structure, and the photo-curable pressure-sensitive adhesive layer has This is because the elastic modulus and the cohesive force are dramatically improved.

As the film-like support, a support made of an appropriate material having releasability from the photocurable adhesive in the initial state can be used. That is,
The film-shaped support can be formed using a plastic such as polyester such as PET or PEN, a vinyl chloride resin, cellulose, polystyrene, or polyolefin, and in some cases, a paper, a cloth, or a nonwoven fabric may be used. Since paper, cloth or nonwoven fabric is porous, a low-viscosity photocurable adhesive composition may leak. Therefore, it is preferable to use a plastic film such as a polyolefin, or when using paper, cloth or non-woven fabric, it is preferable to coat with a filler.

The above-mentioned film-form support is required to have releasability, but when releasability is difficult, it is coated with a non-adhesive resin such as silicone or a polymer having a long-chain alkyl group to release. Preferably, a mold treatment is performed. By the release treatment, it can be easily peeled from the photocurable adhesive layer. If the releasability is low, the adhesive will remain on the film-like support at the time of peeling, that is, adhesive will remain, or will be missing from the film laminated on the other surface of the photocurable adhesive layer. This may cause poor appearance and poor adhesion.

In the production method according to the third aspect of the present invention, the above-mentioned film-like support is used which has a transmittance of 30% or more of light having an active wavelength of the cationic photopolymerization initiator. Light is irradiated through the support.

As described above, by irradiating light through the film-like support, it is possible to suppress the direct application of heat rays and radiant heat contained in light to the photocurable adhesive layer. Therefore, cationic polymerization is promoted by heat, tackiness is reduced, so-called surface hardening can be suppressed, and the adhesion between the adhesive and the surface of the card base when adhered to the card base is increased, Adhesive strength is increased.

The light transmittance of the above film support is 30%.
If it is less than 1, curing of the photocurable pressure-sensitive adhesive tape becomes slow, and the load on the process increases. In addition, it is necessary to irradiate more intense light, and radiant heat that exceeds the heat insulating effect of the film-like support causes damage to the IC and increases the cationic polymerization rate, lowering the tackiness and ultimately bonding. The strength may not be large enough. The light transmittance is a value that can be measured with a general spectrophotometer, or a value that is measured with a luminometer that responds to light having an active wavelength.

In the present invention, in particular, in the case of a small-sized IC module, a light-curable adhesive tape is pressed on a light-curable adhesive layer formed on the surface of a film-like support and supported. Can be used in place of the carrier film, thereby making the bonding process a continuous process.

Generally, an IC module does not transmit light. Therefore, if the film support is light-impermeable,
Although it is necessary to peel off the support and irradiate the light, as described above, the light transmittance of at least one of the film supports is set to 3 or more.
When the content is 0% or more, light irradiation can be performed while the IC module is supported on a long film-shaped support. Therefore, the photocurable adhesive layer can be activated without performing the peeling operation, and the process can be simplified.

[0068]

Hereinafter, the present invention will be described more specifically by describing non-limiting examples of the present invention.

(Photocurable adhesive composition 1) Polyester (manufactured by Toyobo Co., Ltd., trade name: Byron 550, Tg =-
30 parts by weight at 15 ° C.) and bisphenol A type epoxy resin (manufactured by Yuka Shell Epoxy Co., trade name: Epicoat # 8)
28, 70 parts by weight of an epoxy equivalent 190) and 1 part by weight of an aromatic sulfonium salt-type photocationic polymerization initiator (trade name: Optmer SP170, manufactured by Asahi Denka Co., Ltd.) to prepare a photocurable adhesive composition 1 did.

(Photocurable adhesive composition 2) Polyester (product name: Elitel UE3400, manufactured by Unitika Ltd.)
Tg = −16 ° C.) and 40 parts by weight of an alicyclic epoxy resin (manufactured by Daicel Chemical Industries, trade name: Celloxide 2081;
Photocurable adhesive composition 2 comprising 60 parts by weight of an epoxy equivalent 150) and 1 part by weight of an aromatic sulfonium salt-type photocationic polymerization initiator (trade name: Optmer SP170, manufactured by Asahi Denka Co., Ltd.) Was prepared.

(Examples 1 to 4) Preparation of Photocurable Adhesive Tape The photocurable adhesive composition 1 or 2 was dissolved in the same amount of methyl ethyl ketone. Is coated on a release surface of a 100 μm-thick PET film having a silicone release treatment (hereinafter referred to as a release PET film) by a roll coater so as to have a final thickness of 100 μm.
Taped. The photocurable pressure-sensitive adhesive composition layer taped is coated with a silicone release treated polyethylene-coated woodfree paper having a release force smaller than that of a release PET film as a second film-like support. Thus, a photocurable pressure-sensitive adhesive tape coated on both sides with a film-like support was obtained.

The photocurable pressure-sensitive adhesive tape was punched with a square punching die at intervals of 10 mm. However, the release PET film was not completely punched, but was maintained in a continuous sheet shape. In this way, as shown in FIGS. 1A and 1B, a 200 mm × 70 mm rectangular release PET
On a film 1, a photocurable adhesive tape 2 having a square shape of 10 × 10 mm (silicone release high quality paper 3
Sheet whose upper surface is covered by the above) was prepared.

Crimping to IC Module In place of the IC module, a 0.3 mm thick glass epoxy body cut into a 10 mm square was prepared as an alternative to the IC module. Release PET film sheet 1
The high-quality silicone release paper on each of the above photocurable adhesive tapes 2 is peeled off, and the above-mentioned glass epoxy body is pressed on the adhesive surface with a press at a pressure of 20 N / cm ² , a time of 5 seconds and a temperature of room temperature. It crimped on condition.

UV irradiation The adhesive surface was irradiated with UV according to the method shown in Table 1 below. In Table 1, the irradiation method 1 is the same as that of the first embodiment.
Shows that ultraviolet rays were irradiated after the release PET film 1 was peeled off, and the irradiation method 2 shows that in Examples 2 to 4, ultraviolet rays were irradiated through the release PET film. The UV rays were irradiated by using a high-pressure mercury lamp while moving each photo-curable adhesive tape on a conveyor. During irradiation, 2 J / c
Irradiation was performed so as to give a light amount of m ² . In this case, when irradiation is performed through the release PET film, PE
The light amount was set in consideration of the transmittance of the T film.

Crimping to card base As a card base substitute, 0.7 mm x 55 mm x
A 85 mm long vinyl chloride resin sheet was used. The above-mentioned glass epoxy body after ultraviolet irradiation was press-pressed to the center of the vinyl chloride resin sheet. When crimping, the pressure is 2
0 N / cm ² , the time was 5 seconds, and the temperature was room temperature. After crimping to the card base, leave it at room temperature for 5 days,
Cured.

(Comparative Example 1) As an adhesive, a cyanoacrylate-based instant adhesive (trade name: Alon Alpha, manufactured by Toa Gosei Chemical Co., Ltd.) was prepared. The above adhesive was applied to the surface of the glass epoxy instead of the IC module used in Examples 1 to 4.
The composition was applied at a rate of 00 g / m ² , immediately pressed on the same card base as used in Examples 1 to 4, and left at room temperature for 5 days.

Comparative Example 2 An adhesive tape (double tack tape # 570) manufactured by Sekisui Chemical Co., Ltd. was prepared. The above double-sided pressure-sensitive adhesive tape was punched out in the same manner as in the example, and pressure-bonded to a glass epoxy body and a card base in the same manner as in Examples 1 to 4, except that ultraviolet irradiation was not performed, and left at room temperature for 5 days. did.

(Evaluation) An alternative IC card was prepared as described above, and the state of the bonding surface, workability and adhesive strength were evaluated in the following manner.

A) Adhesion surface state: It was visually determined whether or not the adhesion portion protruded or floated. b) Workability: The workability of pressure bonding to a glass epoxy body and ultraviolet irradiation was evaluated. In Table 1 below,
When it was difficult, a cross was given, when it was easy but the work required attention, a triangle was given, and when it was easy, a circle was given. Adhesive strength: Tensile adhesive strength after standing for 5 days was evaluated at a tensile speed of 10 mm / min.

[0080]

[Table 1]

As is evident from Table 1, in Examples 1 to 4, the workability is excellent and the final adhesive strength is high as compared with Comparative Example 1. Regarding the workability, in Examples 1 to 4, it is only necessary to peel off the silicone release high-quality paper and press-bond it. In Comparative Example 1, however, the adhesive could not be applied with high accuracy. Extrusion was observed, and it was necessary to remove the extruded adhesive, which made the operation difficult.

In Comparative Example 2, since an ordinary pressure-sensitive adhesive tape was used, pressure bonding with Examples 1 to 4 could be easily performed, but the final adhesive strength was low. In addition, in each of Examples 2 to 4, compared to Example 1, since the light was irradiated through the release PET film in any case, Steps 1 to 4 could be performed efficiently.

In the process, the glass PET was carried on the continuous PET film in Examples 2 to 4, so that continuous irradiation was possible. In Example 1, the release PET film was used. The glass epoxy body must be handled with care because it must be separated into individual states.

[0084]

In the IC card according to the present invention, the IC module is adhered to the card base by using a photocurable adhesive tape containing an adhesive resin, a cationically polymerizable compound and a cationic photopolymerization initiator. As a result, the adhesive hardly protrudes, and the IC module and the card base can be easily and easily bonded. further,
Since the cationically polymerizable compound is polymerized and cured by light irradiation, the IC module is firmly adhered to the card base.

In the method of manufacturing an IC card according to the second aspect of the present invention, the photocurable adhesive tape having a photocurable adhesive layer formed on one side of a film-like support is used for an IC module or an IC module. After sticking to the card base and peeling off the film-like support, the surface of the photocurable adhesive tape is irradiated with light, and the photocurable adhesive tape is applied to the card base or I
Adhere to C module. In the production method according to the third aspect of the present invention, the photocurable pressure-sensitive adhesive layer is passed through a film-like support having a transmittance of light having a wavelength of activating the photocationic polymerization initiator of 30% or more. After the film is irradiated with light, the film-shaped support is peeled off and attached to a card base or an IC module. Therefore, the IC module and the card base can be easily bonded to each other by utilizing the adhesiveness of the photocurable adhesive tape. In addition, the light irradiation polymerizes the cationically polymerizable compound in the photocurable adhesive tape, and finally the IC module and the card base are firmly adhered.

Therefore, the IC card according to the present invention can be easily manufactured, and the adhesive layer does not protrude, so that a complicated operation such as removal of the protruding adhesive can be omitted.

[Brief description of the drawings]

FIG. 1 is a plan view and a front view for explaining a photocurable adhesive tape prepared in Examples 1 to 4. FIG.

[Explanation of symbols]

 1. PET release film 2. Photocurable adhesive tape

Claims (3)

[Claims] 1. An IC card in which an IC module having an IC mounted on a circuit board is adhered to a card base via an adhesive layer, wherein the adhesive layer comprises an adhesive resin, a cationically polymerizable compound, An IC card, which is a photocurable adhesive tape containing a photocationic polymerization initiator. 2. A photocurable pressure-sensitive adhesive tape having a photocurable adhesive layer containing an adhesive resin, a cationically polymerizable compound and a photocationic polymerization initiator formed on one surface of a film-like support. A step of sticking to the IC module or the card base from the photocurable adhesive layer side, and a step of irradiating light from the exposed photocurable adhesive layer side after peeling off the film-like support. Attaching the irradiation surface to a card base or an IC module. 3. An adhesive resin, a cationically polymerizable compound and a cationic photopolymerization initiator are provided on one side of a film-like support having a transmittance of light of a wavelength for activating the cationic photopolymerization initiator of 30% or more. The photocurable adhesive tape having the photocurable adhesive layer formed thereon is placed on the photocurable adhesive layer from the
Affixing to a C module or a card base; and irradiating the photo-curable adhesive layer with light through the film-shaped support, peeling the film-shaped support, and exposing the exposed photo-curable adhesive. Attaching the surface of the adhesive layer to a card base or an IC module.
Manufacturing method of C card.