JP2001290443A - Display device - Google Patents
Display deviceInfo
- Publication number
- JP2001290443A JP2001290443A JP2000108074A JP2000108074A JP2001290443A JP 2001290443 A JP2001290443 A JP 2001290443A JP 2000108074 A JP2000108074 A JP 2000108074A JP 2000108074 A JP2000108074 A JP 2000108074A JP 2001290443 A JP2001290443 A JP 2001290443A
- Authority
- JP
- Japan
- Prior art keywords
- display device
- filler
- led
- light emitting
- driving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
- G09F9/3026—Video wall, i.e. stackable semiconductor matrix display modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、あらゆる方向からの水
の侵入を防止することができる表示装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a display device capable of preventing water from entering from all directions.
【０００２】[0002]
【従来の技術】今日、低消費電力、軽量、薄型化可能な
大型表示装置として発光ダイオード（ＬＥＤ）を利用し
たＬＥＤディスプレイが種々の場所に設置されている。
特に、ＲＧＢ（赤色、緑色、青色）が１０００ｍｃｄ以
上にも及ぶ超高輝度に発光可能なＬＥＤが開発されたこ
とに伴い野外においてもフルカラーやマルチカラー表示
可能な大型ディスプレイとして注目されている。2. Description of the Related Art Today, LED displays using light emitting diodes (LEDs) are installed in various places as large display devices that can be reduced in power consumption, weight, and thickness.
In particular, with the development of an LED capable of emitting ultra-high brightness of RGB (red, green, blue) of 1000 mcd or more, it has attracted attention as a large display capable of full-color or multi-color display even outdoors.
【０００３】このようなＬＥＤディスプレイは、ＲＧＢ
がそれぞれ発光可能なＬＥＤを近接して配置させ、混色
により１画素として利用する。各ＬＥＤは駆動ＩＣ等に
よって所望の時間や輝度を点灯させ、各ＬＥＤの混色に
より所望の色表示をさせることができる。ＬＥＤディス
プレイは、樹脂製などの筐体内に複数のＬＥＤを配置さ
せたＬＥＤユニットを組み合わせ構成させる。各ＬＥＤ
ユニットは、ビルの壁面に設けられた取付フレームに固
定させることができる。各ＬＥＤユニットをそれぞれ電
気的に通信コネクタによって接続させることにより、大
型ＬＥＤディスプレイを構成させることができる。[0003] Such an LED display is a RGB display.
Are arranged in close proximity to each other to emit light, and are used as one pixel by color mixing. Each LED can be turned on for a desired time or brightness by a driving IC or the like, and a desired color can be displayed by mixing colors of the LEDs. The LED display is configured by combining an LED unit in which a plurality of LEDs are arranged in a housing made of resin or the like. Each LED
The unit can be fixed to a mounting frame provided on the wall of the building. A large-sized LED display can be configured by electrically connecting each LED unit with a communication connector.
【０００４】従来のＬＥＤユニットは、筐体内に複数の
ＬＥＤを配置させたＬＥＤ基板および駆動ＩＣ等の内部
回路を配置したＩＣ基板と共に筐体内取り付けられる構
成される。ＩＣ基板は、筐体内のＬＥＤ基板の背面に取
り付けられ、筐体の内壁とＬＥＤ基板とをシリコンゴム
等からなる充填材によって覆うことによって、それぞれ
のＬＥＤとＩＣ基板とを雨水等の侵入から保護してい
た。また、通信コネクタは、ＩＣ基板からＬＥＤユニッ
トの筐体の背面側から取り出し、それぞれのＬＥＤユニ
ットと接続していた。A conventional LED unit is configured to be mounted in a housing together with an LED substrate having a plurality of LEDs disposed in the housing and an IC substrate having an internal circuit such as a driving IC disposed therein. The IC board is attached to the back of the LED board in the housing, and the inner wall of the housing and the LED board are covered with a filler made of silicon rubber or the like, thereby protecting each LED and the IC board from intrusion of rainwater or the like. Was. In addition, the communication connector is taken out from the back side of the housing of the LED unit from the IC board and connected to each LED unit.
【０００５】[0005]
【発明が解決使用とする課題】しかしながら、従来のＬ
ＥＤユニットは、表示面側からの防水構造を有するのみ
であり、したがって背面側は取り付けフレーム等によっ
て防水性を確保する必要があった。また、接続コネクタ
の接続は、ＬＥＤユニットの背面で行う必要があり、Ｌ
ＥＤユニットの設置作業に多くのスペースを要してい
た。However, the conventional L
The ED unit only has a waterproof structure from the display surface side. Therefore, it is necessary to secure waterproofness on the back side by a mounting frame or the like. The connection of the connector must be made on the back of the LED unit.
The installation of the ED unit required a lot of space.
【０００６】そこで、本発明は、あらゆる方向からの水
の侵入を防止することができる表示装置を提供すること
を目的とする。Accordingly, an object of the present invention is to provide a display device that can prevent water from entering from all directions.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
に、本発明の表示装置は、筐体内に複数の発光素子が配
置された表示装置において、前記発光素子を駆動する駆
動回路が配置された駆動基板が、前記筐体の内壁の背面
との間に空間を形成して取り付けられており、前記筐体
の内壁の背面から前記駆動基板が充填材によって覆われ
ている。In order to achieve the above object, a display device according to the present invention comprises a plurality of light emitting elements arranged in a housing, wherein a driving circuit for driving the light emitting elements is provided. The drive substrate is attached with a space formed between the drive substrate and the back surface of the inner wall of the housing, and the drive substrate is covered with a filler from the back surface of the inner wall of the housing.
【０００８】また、本発明の表示装置は、前記駆動基板
は複数の開口部を有する。Further, in the display device of the present invention, the driving substrate has a plurality of openings.
【０００９】また、本発明の表示装置は、前記駆動基板
は複数の通気孔を有する。Further, in the display device of the present invention, the driving substrate has a plurality of ventilation holes.
【００１０】また、本発明の表示装置は、前記発光素子
は、少なくともレンズ部とリード部から構成され、前記
充填材は、該充填材の表面が前記発光素子のレンズ部と
リード部の接合部よりも上方となるように充填されてい
る。Further, in the display device according to the present invention, the light emitting element includes at least a lens portion and a lead portion, and the filler has a surface where the surface of the filler is a joint between the lens portion and the lead portion of the light emitting element. It is filled so as to be above.
【００１１】また、本発明の表示装置は、さらに、前記
駆動基板に接続された防水型の通信コネクタを有し、該
通信コネクタは前記筐体の側面または表示面側から取り
出される。Further, the display device of the present invention further has a waterproof communication connector connected to the drive board, and the communication connector is taken out from a side surface or a display surface side of the housing.
【００１２】また、本発明の表示装置は、前記筐体の内
壁の背面は、金属板から構成される。Further, in the display device according to the present invention, the back surface of the inner wall of the housing is formed of a metal plate.
【００１３】また、本発明の表示装置は、前記発光素子
は、前記駆動基板に配置されている。Further, in the display device according to the present invention, the light emitting element is disposed on the drive substrate.
【００１４】また、本発明の表示装置は、さらに、格子
状に形成されたインナーフレームを有し、前記充填材
は、該充填材の表面が少なくとも前記インナーフレーム
に達するように充填される。Further, the display device of the present invention further has an inner frame formed in a lattice shape, and the filler is filled so that a surface of the filler reaches at least the inner frame.
【００１５】また、本発明の表示装置は、前記インナー
フレームは、前記駆動基板上に取り付けられ、さらに、
前記インナーフレームは、前記駆動基板側に凹部を有す
る。Further, in the display device according to the present invention, the inner frame is mounted on the driving board, and
The inner frame has a concave portion on the drive substrate side.
【００１６】[0016]
【発明の実施の形態】（実施の形態）図１に本発明にか
かる筐体内に複数の発光素子が配置された表示装置とし
て、複数のＬＥＤが配置されたＬＥＤユニットの正面図
を示す。ＬＥＤユニットは、ＬＥＤユニット本体部１と
通信コネクタ２から構成される。通信コネクタ２は防水
型コネクタが用いられる。ＬＥＤユニットは、１画素毎
に配置されたＬＥＤを点灯制御することによって、画像
を表示する。図１中の１０は１画素を示し、ここでは８
×８（８行８列）画素からなるＬＥＤユニットの例を示
した。(Embodiment) FIG. 1 shows a front view of an LED unit in which a plurality of LEDs are arranged as a display device in which a plurality of light emitting elements are arranged in a housing according to the present invention. The LED unit includes an LED unit main body 1 and a communication connector 2. The communication connector 2 is a waterproof connector. The LED unit displays an image by controlling lighting of an LED arranged for each pixel. 1 in FIG. 1 indicates one pixel, and here, 8
The example of the LED unit composed of × 8 (8 rows and 8 columns) pixels is shown.
【００１７】図１において示したＡ−Ａ部の拡大斜視図
を図２に示す。ＬＥＤ１３はアウターフレーム１１内に
配置され、アウターフレーム１１の表示面側には前カバ
ー１２が前カバー固定ビス１４によって取り付けられ
る。前カバー１２は、外光がＬＥＤの周辺に射し込むこ
とを防止するルーバーを有し、ルーバーは各画素間では
ルーバーのない部分が設けられる。これによって、視覚
上、表示された画面においてＬＥＤユニット間の境界部
が認識されることを防止することができる。また、前カ
バー１２は樹脂製のものが好ましい。太陽光等の外光に
よって、筐体内が高温となることが低減されるからであ
る。ＬＥＤユニット本体部１は、ＬＥＤユニット固定ビ
ス１５によって壁面等に固定される。FIG. 2 is an enlarged perspective view of the AA portion shown in FIG. The LED 13 is disposed in the outer frame 11, and a front cover 12 is attached to a display surface side of the outer frame 11 by a front cover fixing screw 14. The front cover 12 has a louver for preventing external light from radiating around the LED. The louver is provided with a louver-free portion between pixels. Thus, it is possible to prevent the boundary between the LED units from being visually recognized on the displayed screen. The front cover 12 is preferably made of resin. This is because external light such as sunlight reduces the temperature inside the housing. The LED unit main body 1 is fixed to a wall surface or the like by an LED unit fixing screw 15.
【００１８】ＬＥＤ１３は、たとえば図３に示す砲弾型
のＬＥＤが用いられる。ＬＥＤ１３はリード部１３ｂの
一方にＬＥＤチップ１３ｃが配置され、ＬＥＤチップ１
３ｃからリード部１３ｂの他方にワイヤ１３ｄによって
接続される。ＬＥＤチップ１３ｃはエポキシ樹脂、ユリ
ア樹脂等からなるレンズ部１３ａに封入される。図３中
にＦは、レンズ部１３ａの表面とリード部１３ｂとの接
合部を示す。As the LED 13, for example, a bullet-shaped LED shown in FIG. 3 is used. The LED 13 has an LED chip 13c arranged on one side of a lead portion 13b,
3c is connected to the other of the lead portions 13b by a wire 13d. The LED chip 13c is sealed in a lens portion 13a made of epoxy resin, urea resin, or the like. In FIG. 3, F indicates a joint between the surface of the lens portion 13a and the lead portion 13b.
【００１９】図４は、図１において示したＡ−Ａ部の拡
大正面図である。ここでは１画素が、２つの赤色ＬＥ
Ｄ、１つの緑色ＬＥＤ、１つの青色ＬＥＤから構成され
た例を示す。ＬＥＤユニット固定ビス１５は、アウター
フレーム１１の一部であるＬＥＤユニット固定ビス挿入
部１１ａに挿入されることによって、ＬＥＤユニットを
固定する。FIG. 4 is an enlarged front view of AA section shown in FIG. Here, one pixel consists of two red LEs
D shows an example composed of one green LED and one blue LED. The LED unit fixing screw 15 fixes the LED unit by being inserted into the LED unit fixing screw insertion portion 11a which is a part of the outer frame 11.
【００２０】図５に、図４において示したＢ−Ｂ線の断
面概略図を示す。アウターフレーム１１の背面には背面
板１６が配置され、筐体が構成される。背面板１６は、
駆動基板１７等から発生する熱を放熱するよう放熱性の
高い材料あるいは形状、たとえば放熱フィンを有する形
状で構成される。また、背面板１６は、固定されるべき
壁面等と接触しないようにアウターフレーム１１に取り
付けられる。これによって、ＬＥＤユニット背面の通風
性が確保され、放熱を効率的に行うことができる。特
に、ＬＥＤ背面はアウターフレーム１１と壁面等によっ
て外気が閉ざされないことが好ましい。FIG. 5 is a schematic sectional view taken along the line BB shown in FIG. A rear plate 16 is arranged on the rear surface of the outer frame 11 to form a housing. The back plate 16
It is made of a material or a shape having a high heat dissipation property, such as a shape having a heat dissipation fin, so as to radiate heat generated from the drive board 17 and the like. The back plate 16 is attached to the outer frame 11 so as not to contact a wall surface or the like to be fixed. Thereby, ventilation of the back of the LED unit is ensured, and heat can be efficiently dissipated. In particular, it is preferable that the outer surface of the LED is not closed by the outer frame 11 and the wall surface.
【００２１】アウターフレーム１１内には、ＬＥＤおよ
びＬＥＤの駆動回路であるＩＣ等が配置される駆動基板
１７が、駆動基板１７と背面板１６との間に空間を形成
して取り付けられる。駆動基板１７は、第１の開口部１
７ａを有する。この第１の開口部１７ａは、画素の近傍
に形成され、ＬＥＤユニットにおける画素１０の数と同
数程度形成されることが好ましい。さらに、駆動基板１
７上には、インナーフレーム１８が取り付けられる。イ
ンナーフレーム１７上には、前カバー１２が取り付けら
れる。筐体内には、ＬＥＤ１３および駆動基板１７の防
水のためにシリコンゴム等からなる充填材１９が、筐体
の内壁の背面から駆動基板１７が覆われるように充填さ
れている。充填材１９は、背面板１６から少なくともＬ
ＥＤ１３のリード部１３ｂとレンズ部１３ａの接合部Ｆ
に、充填材１９の表面が達するように充填される。In the outer frame 11, a driving board 17 on which LEDs and ICs as driving circuits of the LEDs are arranged is formed with a space formed between the driving board 17 and the back plate 16. The drive substrate 17 is provided with the first opening 1.
7a. The first openings 17a are formed near the pixels, and are preferably formed in the same number as the number of pixels 10 in the LED unit. Further, the driving substrate 1
An inner frame 18 is mounted on 7. The front cover 12 is mounted on the inner frame 17. The casing is filled with a filler 19 made of silicon rubber or the like for waterproofing the LED 13 and the drive board 17 so as to cover the drive board 17 from the back of the inner wall of the casing. The filling material 19 is at least L
Joint F between lead portion 13b of ED 13 and lens portion 13a
Is filled so as to reach the surface of the filler 19.
【００２２】図６に、図２において示したＣ−Ｃ線の断
面概略図を示す。ＬＥＤユニット固定ビス挿入部１１ａ
は、アウターフレーム１１と一体に突起状に形成され
る。ＬＥＤユニット固定ビス１５は、固定部１５ａ、シ
ャフト部１５ｂおよびネジ部１５ｃから構成される。Ｌ
ＥＤユニット固定ビス挿入部１１ａの最小内径は、ネジ
部１５ｃの最大外径よりもやや小さく形成されており、
これによってＬＥＤユニット固定ビス１５の抜け落ちを
防止する。ＬＥＤユニット固定ビス挿入部１１ａの外径
はＬＥＤユニット固定ビス１５の固定部１５ａよりも大
きく形成され、ＬＥＤユニットを壁面等から取り外すこ
となく、前カバー１２を取り外すことができる。また、
通信コネクタ２は、駆動基板１７からＬＥＤユニットの
表示面側に取り出し可能に構成されており、前カバーを
取り外すことによって、表示面側から通信コネクタ２の
接続作業を行うことができる。この前カバー１２は、Ｌ
ＥＤ表示面部分と通信コネクタ収納部分の複数の領域に
分割して構成することが好ましい。FIG. 6 is a schematic sectional view taken along the line CC shown in FIG. LED unit fixing screw insertion part 11a
Are formed integrally with the outer frame 11 in a projecting shape. The LED unit fixing screw 15 includes a fixing portion 15a, a shaft portion 15b, and a screw portion 15c. L
The minimum inner diameter of the ED unit fixing screw insertion portion 11a is formed slightly smaller than the maximum outer diameter of the screw portion 15c.
This prevents the LED unit fixing screw 15 from falling off. The outer diameter of the LED unit fixing screw insertion part 11a is formed larger than the fixing part 15a of the LED unit fixing screw 15, and the front cover 12 can be removed without removing the LED unit from a wall surface or the like. Also,
The communication connector 2 is configured to be detachable from the drive board 17 to the display surface side of the LED unit. By removing the front cover, the connection work of the communication connector 2 can be performed from the display surface side. The front cover 12 is L
It is preferable that the ED display surface portion and the communication connector housing portion be divided into a plurality of regions.
【００２３】図７に、表示面側から見たＬＥＤ１３が配
置された駆動基板１７およびインナーフレーム１８の概
略図を示す。駆動基板１７上には、画素の近傍にＬＥＤ
ユニット内の画素数と同数程度の第１の開口部１７ａが
形成される。また、この第１の開口部１７ａは、画素に
対応する列あるいは行毎に配置位置が変更される。ここ
では、列毎に第１の開口部１７ａの配置位置が、各画素
１０の上下に交互に形成される例を示した。FIG. 7 is a schematic view of the drive board 17 on which the LEDs 13 are arranged and the inner frame 18 as viewed from the display surface side. On the driving board 17, an LED is provided near the pixel.
About the same number of first openings 17a as the number of pixels in the unit are formed. Further, the arrangement position of the first opening 17a is changed for each column or row corresponding to a pixel. Here, an example is shown in which the arrangement positions of the first openings 17a are alternately formed above and below each pixel 10 for each column.
【００２４】駆動基板１７は、ＬＥＤユニット固定ビス
挿入部１１ａが挿入される第２の開口部１７ｂが形成さ
れる。インナーフレーム１８も、同様に、ＬＥＤユニッ
ト固定ビス挿入部１１ａが挿入される挿入部１８ｂを有
する。さらに、駆動基板１７は、充填材１９の充填時に
駆動基板１７と背面板１６の間に形成された空間から空
気を抜くための通気孔１７ｃを有する。これによって、
駆動基板１７と背面板１６の間に形成された空間に充填
された充填材１９内に気泡が残留することを防止でき
る。また、インナーフレーム１８は、フレーム下面に形
成された凹部１８ｄに、充填材１９の充填をスムーズに
行うためのインナーフレーム開口部１８ｃを有する。The drive board 17 has a second opening 17b into which the LED unit fixing screw insertion portion 11a is inserted. Similarly, the inner frame 18 has an insertion portion 18b into which the LED unit fixing screw insertion portion 11a is inserted. Further, the driving substrate 17 has a vent hole 17c for bleeding air from a space formed between the driving substrate 17 and the back plate 16 when the filler 19 is filled. by this,
It is possible to prevent air bubbles from remaining in the filler 19 filling the space formed between the driving substrate 17 and the back plate 16. Further, the inner frame 18 has an inner frame opening 18c for smoothly filling the filler 19 in a concave portion 18d formed on the lower surface of the frame.
【００２５】図８に、第１の開口部１７ａ、第２の開口
部１７ｂおよび通気孔１１ｃの配置を示した駆動基板１
７の概略図を示す。また、図９ａにインナーフレーム１
８の概略正面図を、図９ｂに断面Ｄ−Ｄの側面概略図を
それぞれ示す。インナーフレーム１８は、充填材１９が
駆動基板１７の表示面側において十分拡散できるよう凹
部１８ｄが形成される。また、インナーフレーム開口部
１８ｃは、凹部１８ｄ部分に形成される。インナーフレ
ーム１８は、充填材１９の割れ等の劣化を防止するため
に、筐体１１内の充填材１９を充填する領域を分割する
ように、格子状に形成される。（実施例）以下に本発明
の実施例を説明する。たとえばアルミニウム、ステンレ
ス等の金属からなる背面板１６が取り付けられた筐体内
に、ＬＥＤおよびＬＥＤの駆動回路であるＩＣ等が配置
された駆動基板１７が、駆動基板１７と背面板１６の間
に空間を形成して取り付けられる。駆動基板１７上に、
凹部１８ｄを駆動基板１７側に向けたインナーフレーム
１８を取り付ける。次に、充填ニードルを用いて第１の
開口部１７ａからエポキシ樹脂等の充填材１９を充填す
る。充填材１９は、背面板１６から少なくともＬＥＤ１
３のリード部１３ｂとレンズ部１３ａの接合部Ｆよりも
上方となるよう、つまり充填材１９の表面が接合部Ｆに
達するように充填される。ただし、ここでは筐体背面か
ら表示面方向を上方とする。さらに、充填材１９の表面
は、ＬＥＤ１３に配置されたＬＥＤチップ１３ｃよりも
下方に形成されることが好ましい。この充填材１９の充
填は、駆動基板１７に通信コネクタ２が接続された状態
で行われる。通信コネクタ２は筐体アウターフレーム１
１の側面または表示面側から取り出される。充填材１９
は、黒色等に着色されることが好ましい。そして、前カ
バー１２が、前カバー固定ビス１４によって取り付けら
れる。FIG. 8 shows the drive board 1 showing the arrangement of the first opening 17a, the second opening 17b, and the ventilation hole 11c.
7 shows a schematic diagram. Also, FIG.
8 is a schematic front view, and FIG. 9b is a schematic side view of a cross section DD. The inner frame 18 has a recess 18d so that the filler 19 can sufficiently diffuse on the display surface side of the drive substrate 17. The inner frame opening 18c is formed in the recess 18d. The inner frame 18 is formed in a lattice shape so as to divide a region of the housing 11 where the filler 19 is filled, in order to prevent the filler 19 from deteriorating due to cracking or the like. (Embodiment) An embodiment of the present invention will be described below. For example, a drive board 17 on which an LED and an IC which is a drive circuit of the LED are arranged in a housing to which a back plate 16 made of a metal such as aluminum or stainless steel is attached, a space is provided between the drive board 17 and the back plate 16. Formed and attached. On the drive board 17,
The inner frame 18 with the recess 18d facing the drive board 17 is attached. Next, a filling material 19 such as an epoxy resin is filled from the first opening 17a using a filling needle. Filling material 19 is at least LED1 from back plate 16.
The filler 19 is filled so as to be higher than the joint F between the lead portion 13b and the lens portion 13a, that is, the surface of the filler 19 reaches the joint F. However, here, the display surface direction is set to be upward from the rear surface of the housing. Further, it is preferable that the surface of the filler 19 is formed below the LED chip 13 c arranged on the LED 13. The filling of the filler 19 is performed in a state where the communication connector 2 is connected to the drive board 17. Communication connector 2 is housing outer frame 1
1 is taken out from the side surface or the display surface side. Filling material 19
Is preferably colored black or the like. Then, the front cover 12 is attached by the front cover fixing screw 14.
【００２６】このように構成されたＬＥＤユニットは、
たとえば壁面に複数個取り付けられ、通信コネクタ２に
よってそれぞれが接続されることによって大型ディスプ
レイを構成することができる。本発明のＬＥＤユニット
は雨水等の侵入を、表示面側からだけでなくすべての方
向から防止することができる。これによって、どのよう
な場所にでもディスプレイを設置することができる。し
たがって、たとえばビルの壁面にあらかじめＬＥＤユニ
ットの背面側を防水構造とした取り付けフレームを設置
する必要がなくなる。さらには、水中でも使用可能にな
り、ディスプレイをプールや噴水等に設置することが可
能になる。The LED unit configured as described above is
For example, a large-sized display can be configured by attaching a plurality of units to a wall surface and connecting each of them by the communication connector 2. The LED unit of the present invention can prevent intrusion of rainwater or the like not only from the display surface side but also from all directions. This allows the display to be installed anywhere. Therefore, for example, it is not necessary to install a mounting frame having a waterproof structure on the back side of the LED unit in advance on the wall surface of the building. Furthermore, the display can be used underwater, and the display can be installed in a pool, a fountain, or the like.
【００２７】[0027]
【発明の効果】以上説明した通り、本発明によって、あ
らゆる方向からの水の侵入を防止することができるＬＥ
Ｄ表示装置を提供することができる。As described above, according to the present invention, an LE that can prevent water from entering from all directions can be prevented.
A D display device can be provided.
【図１】本発明にかかるＬＥＤユニットの正面図であ
る。FIG. 1 is a front view of an LED unit according to the present invention.
【図２】図１におけるＬＥＤユニットのＡ−Ａ部の拡大
斜視図である。FIG. 2 is an enlarged perspective view of an AA part of the LED unit in FIG.
【図３】本発明に用いられるＬＥＤの一例である。FIG. 3 is an example of an LED used in the present invention.
【図４】図１におけるＬＥＤユニットのＡ−Ａ部の拡大
正面図である。FIG. 4 is an enlarged front view of an AA part of the LED unit in FIG. 1;
【図５】図２におけるＬＥＤユニットのＢ−Ｂ線の断面
概略図である。5 is a schematic cross-sectional view of the LED unit in FIG. 2 taken along line BB.
【図６】図２におけるＬＥＤユニットのＣ−Ｃ線の断面
概略図である。FIG. 6 is a schematic cross-sectional view taken along line CC of the LED unit in FIG. 2;
【図７】駆動基板およびインナーフレームの位置関係を
示す概略図である。FIG. 7 is a schematic diagram showing a positional relationship between a driving board and an inner frame.
【図８】駆動基板の概略図である。FIG. 8 is a schematic view of a drive substrate.
【図９】インナーフレームの概略図である。FIG. 9 is a schematic view of an inner frame.
１・・・ＬＥＤユニット本体部 ２・・・通信コネクタ １１・・・アウターフレーム １１ａ・・・ＬＥＤユニット固定ビス挿入部 １２・・・前カバー １３・・・ＬＥＤ １４・・・前カバー固定ビス １５・・・ＬＥＤユニット固定ビス １６・・・背面板 １７・・・駆動基板 １７ａ・・・第１の開口部 １７ｂ・・・第２の開口部 １７ｃ・・・通気孔 １８・・・インナーフレーム １８ｂ・・・挿入部 １８ｃ・・・インナーフレーム開口部 １８ｄ・・・凹部 １９・・・充填材 DESCRIPTION OF SYMBOLS 1 ... LED unit main body part 2 ... Communication connector 11 ... Outer frame 11a ... LED unit fixing screw insertion part 12 ... Front cover 13 ... LED 14 ... Front cover fixing screw 15 ... LED unit fixing screw 16 ... Back plate 17 ... Drive board 17a ... First opening 17b ... Second opening 17c ... Ventilation hole 18 ... Inner frame 18b ... Insertion part 18c ... Inner frame opening 18d ... Recess 19 ... Filling material
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 5C094 AA38 BA23 CA19 CA24 DA01 ED01 FA01 FB15 5C096 AA17 BA04 CA06 CC06 CC23 CC28 CC30 CG02 DA01 EB15 5E348 AA06 AA08 AA09 AA40 5F041 AA31 AA33 AA34 DA07 DA18 DA43 DA44 DA46 DB01 DC07 DC23 DC75 FF06 ──────────────────────────────────────────────────続 き Continued on front page F term (reference) 5C094 AA38 BA23 CA19 CA24 DA01 ED01 FA01 FB15 5C096 AA17 BA04 CA06 CC06 CC23 CC28 CC30 CG02 DA01 EB15 5E348 AA06 AA08 AA09 AA40 5F041 AA31 AA33 AA34 DC07 DA18 FF06
Claims (9)
装置において、 前記発光素子を駆動する駆動回路が配置された駆動基板
が、前記筐体の内壁の背面との間に空間を形成して取り
付けられており、 前記筐体の内壁の背面から前記駆動基板が充填材によっ
て覆われていることを特徴とする表示装置。1. A display device in which a plurality of light emitting elements are arranged in a housing, wherein a driving substrate on which a driving circuit for driving the light emitting elements is arranged forms a space between the driving substrate and a back surface of an inner wall of the housing. A display device, wherein the driving substrate is covered with a filler from a back surface of an inner wall of the housing.
を特徴とする請求項１に記載の表示装置。2. The display device according to claim 1, wherein the driving substrate has a plurality of openings.
を特徴とする請求項１乃至２に記載の表示装置。3. The display device according to claim 1, wherein the driving substrate has a plurality of ventilation holes.
ード部から構成され、前記充填材は、該充填材の表面が
前記発光素子のレンズ部とリード部の接合部よりも上方
となるように充填されていることを特徴とする請求項１
乃至３に記載の表示装置。4. The light-emitting element includes at least a lens portion and a lead portion, and the filler is arranged such that a surface of the filler is higher than a joint portion between the lens portion and the lead portion of the light-emitting device. 2. The method according to claim 1, wherein said filler is filled.
4. The display device according to any one of items 1 to 3.
続された防水型の通信コネクタを有し、該通信コネクタ
は前記筐体の側面または表示面側から取り出されること
を特徴とする請求項１乃至４に記載の表示装置。5. The display device according to claim 1, further comprising a waterproof communication connector connected to the driving board, wherein the communication connector is taken out from a side surface or a display surface of the housing. The display device according to any one of claims 1 to 4.
されることを特徴とする請求項１乃至５に記載の表示装
置。6. The display device according to claim 1, wherein a rear surface of the inner wall of the housing is formed of a metal plate.
ていることを特徴とする請求項１乃至６に記載の表示装
置。7. The display device according to claim 1, wherein the light emitting element is arranged on the driving substrate.
れたインナーフレームを有し、前記充填材は、該充填材
の表面が少なくとも前記インナーフレームに達するよう
に充填されることを特徴とする請求項１乃至７に記載の
表示装置。8. The display device further includes an inner frame formed in a lattice shape, wherein the filler is filled so that a surface of the filler reaches at least the inner frame. The display device according to claim 1.
に取り付けられ、さらに、前記インナーフレームは、前
記駆動基板側に凹部を有することを特徴とする請求項８
に記載の表示装置。9. The device according to claim 8, wherein the inner frame is mounted on the drive board, and the inner frame has a concave portion on the drive board side.
The display device according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000108074A JP3640158B2 (en) | 2000-04-10 | 2000-04-10 | Display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000108074A JP3640158B2 (en) | 2000-04-10 | 2000-04-10 | Display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001290443A true JP2001290443A (en) | 2001-10-19 |
| JP3640158B2 JP3640158B2 (en) | 2005-04-20 |
Family
ID=18620981
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000108074A Expired - Fee Related JP3640158B2 (en) | 2000-04-10 | 2000-04-10 | Display device |
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| Country | Link |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005165041A (en) * | 2003-12-03 | 2005-06-23 | Eteitsuku:Kk | Display device |
| JP2005275178A (en) * | 2004-03-25 | 2005-10-06 | Koha Co Ltd | Outdoor display unit |
| JP2009198631A (en) * | 2008-02-20 | 2009-09-03 | Panasonic Corp | Display |
| JP2013045983A (en) * | 2011-08-26 | 2013-03-04 | Nichia Chem Ind Ltd | Led light emitting device |
| JP2013074186A (en) * | 2011-09-28 | 2013-04-22 | Fujitsu Frontech Ltd | Led unit |
| JP2014107463A (en) * | 2012-11-29 | 2014-06-09 | Mitsubishi Electric Corp | Display device |
| JP2016095464A (en) * | 2014-11-17 | 2016-05-26 | 三菱電機株式会社 | Image display device and manufacturing method of image display device |
-
2000
- 2000-04-10 JP JP2000108074A patent/JP3640158B2/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005165041A (en) * | 2003-12-03 | 2005-06-23 | Eteitsuku:Kk | Display device |
| JP2005275178A (en) * | 2004-03-25 | 2005-10-06 | Koha Co Ltd | Outdoor display unit |
| JP2009198631A (en) * | 2008-02-20 | 2009-09-03 | Panasonic Corp | Display |
| JP2013045983A (en) * | 2011-08-26 | 2013-03-04 | Nichia Chem Ind Ltd | Led light emitting device |
| JP2013074186A (en) * | 2011-09-28 | 2013-04-22 | Fujitsu Frontech Ltd | Led unit |
| JP2014107463A (en) * | 2012-11-29 | 2014-06-09 | Mitsubishi Electric Corp | Display device |
| JP2016095464A (en) * | 2014-11-17 | 2016-05-26 | 三菱電機株式会社 | Image display device and manufacturing method of image display device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3640158B2 (en) | 2005-04-20 |
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