JP3640158B2 - Display device - Google Patents

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Publication number
JP3640158B2
JP3640158B2 JP2000108074A JP2000108074A JP3640158B2 JP 3640158 B2 JP3640158 B2 JP 3640158B2 JP 2000108074 A JP2000108074 A JP 2000108074A JP 2000108074 A JP2000108074 A JP 2000108074A JP 3640158 B2 JP3640158 B2 JP 3640158B2
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Japan
Prior art keywords
led
housing
led unit
filler
display device
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JP2001290443A (en
Inventor
剛 保岡
豊太郎 時本
昌利 大石
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Nichia Corp
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Nichia Corp
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
    • G09F9/3026—Video wall, i.e. stackable semiconductor matrix display modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Description

【０００１】
【産業上の利用分野】
本発明は、あらゆる方向からの水の侵入を防止することができる表示装置に関する。
【０００２】
【従来の技術】
今日、低消費電力、軽量、薄型化可能な大型表示装置として発光ダイオード（ＬＥＤ）を利用したＬＥＤディスプレイが種々の場所に設置されている。特に、ＲＧＢ（赤色、緑色、青色）が１０００ｍｃｄ以上にも及ぶ超高輝度に発光可能なＬＥＤが開発されたことに伴い野外においてもフルカラーやマルチカラー表示可能な大型ディスプレイとして注目されている。
【０００３】
このようなＬＥＤディスプレイは、ＲＧＢがそれぞれ発光可能なＬＥＤを近接して配置させ、混色により１画素として利用する。各ＬＥＤは駆動ＩＣ等によって所望の時間や輝度を点灯させ、各ＬＥＤの混色により所望の色表示をさせることができる。ＬＥＤディスプレイは、樹脂製などの筐体内に複数のＬＥＤを配置させたＬＥＤユニットを組み合わせ構成させる。各ＬＥＤユニットは、ビルの壁面に設けられた取付フレームに固定させることができる。各ＬＥＤユニットをそれぞれ電気的に通信コネクタによって接続させることにより、大型ＬＥＤディスプレイを構成させることができる。
【０００４】
従来のＬＥＤユニットは、筐体内に複数のＬＥＤを配置させたＬＥＤ基板および駆動ＩＣ等の内部回路を配置したＩＣ基板と共に筐体内取り付けられる構成される。ＩＣ基板は、筐体内のＬＥＤ基板の背面に取り付けられ、筐体の内壁とＬＥＤ基板とをシリコンゴム等からなる充填材によって覆うことによって、それぞれのＬＥＤとＩＣ基板とを雨水等の侵入から保護していた。また、通信コネクタは、ＩＣ基板からＬＥＤユニットの筐体の背面側から取り出し、それぞれのＬＥＤユニットと接続していた。
【０００５】
【発明が解決使用とする課題】
しかしながら、従来のＬＥＤユニットは、表示面側からの防水構造を有するのみであり、したがって背面側は取り付けフレーム等によって防水性を確保する必要があった。また、接続コネクタの接続は、ＬＥＤユニットの背面で行う必要があり、ＬＥＤユニットの設置作業に多くのスペースを要していた。
【０００６】
そこで、本発明は、あらゆる方向からの水の侵入を防止することができる表示装置を提供することを目的とする。
【０００７】
【課題を解決するための手段】
上記目的を達成するために、本発明の表示装置は、筐体内に複数の発光素子が配置された表示装置において、前記発光素子を駆動する駆動回路が配置された駆動基板が、前記筐体の内壁の背面との間に空間を形成して取り付けられており、前記筐体の内壁の背面から前記駆動基板が充填材によって覆われている。
【０００８】
また、本発明の表示装置は、さらに、格子状に形成されたインナーフレームを有し、前記充填材は、該充填材の表面が少なくとも前記インナーフレームに達するように充填される。
【０００９】
また、本発明の表示装置は、前記インナーフレームが、前記駆動基板上に取り付けられ、さらに、前記インナーフレームが、前記駆動基板側に凹部を有する。
【００１０】
また、本発明の表示装置は、さらに、背面板およびアウターフレームを有し、前記背面板は、固定されるべき壁面等と接触しないように前記アウターフレームに取り付けられる。
【００１１】
【発明の実施の形態】
（実施の形態）
図１に本発明にかかる筐体内に複数の発光素子が配置された表示装置として、複数のＬＥＤが配置されたＬＥＤユニットの正面図を示す。ＬＥＤユニットは、ＬＥＤユニット本体部１と通信コネクタ２から構成される。通信コネクタ２は防水型コネクタが用いられる。ＬＥＤユニットは、１画素毎に配置されたＬＥＤを点灯制御することによって、画像を表示する。図１中の１０は１画素を示し、ここでは８×８（８行８列）画素からなるＬＥＤユニットの例を示した。
【００１２】
図１において示したＡ−Ａ部の拡大斜視図を図２に示す。ＬＥＤ１３はアウターフレーム１１内に配置され、アウターフレーム１１の表示面側には前カバー１２が前カバー固定ビス１４によって取り付けられる。前カバー１２は、外光がＬＥＤの周辺に射し込むことを防止するルーバーを有し、ルーバーは各画素間ではルーバーのない部分が設けられる。これによって、視覚上、表示された画面においてＬＥＤユニット間の境界部が認識されることを防止することができる。また、前カバー１２は樹脂製のものが好ましい。太陽光等の外光によって、筐体内が高温となることが低減されるからである。ＬＥＤユニット本体部１は、ＬＥＤユニット固定ビス１５によって壁面等に固定される。
【００１３】
ＬＥＤ１３は、たとえば図３に示す砲弾型のＬＥＤが用いられる。ＬＥＤ１３はリード部１３ｂの一方にＬＥＤチップ１３ｃが配置され、ＬＥＤチップ１３ｃからリード部１３ｂの他方にワイヤ１３ｄによって接続される。ＬＥＤチップ１３ｃはエポキシ樹脂、ユリア樹脂等からなるレンズ部１３ａに封入される。図３中にＦは、レンズ部１３ａの表面とリード部１３ｂとの接合部を示す。
【００１４】
図４は、図１において示したＡ−Ａ部の拡大正面図である。ここでは１画素が、２つの赤色ＬＥＤ、１つの緑色ＬＥＤ、１つの青色ＬＥＤから構成された例を示す。ＬＥＤユニット固定ビス１５は、アウターフレーム１１の一部であるＬＥＤユニット固定ビス挿入部１１ａに挿入されることによって、ＬＥＤユニットを固定する。
【００１５】
図５に、図４において示したＢ−Ｂ線の断面概略図を示す。アウターフレーム１１の背面には背面板１６が配置され、筐体が構成される。背面板１６は、駆動基板１７等から発生する熱を放熱するよう放熱性の高い材料あるいは形状、たとえば放熱フィンを有する形状で構成される。また、背面板１６は、固定されるべき壁面等と接触しないようにアウターフレーム１１に取り付けられる。これによって、ＬＥＤユニット背面の通風性が確保され、放熱を効率的に行うことができる。特に、ＬＥＤ背面はアウターフレーム１１と壁面等によって外気が閉ざされないことが好ましい。
【００１６】
アウターフレーム１１内には、ＬＥＤおよびＬＥＤの駆動回路であるＩＣ等が配置される駆動基板１７が、駆動基板１７と背面板１６との間に空間を形成して取り付けられる。駆動基板１７は、第１の開口部１７ａを有する。この第１の開口部１７ａは、画素の近傍に形成され、ＬＥＤユニットにおける画素１０の数と同数程度形成されることが好ましい。さらに、駆動基板１７上には、インナーフレーム１８が取り付けられる。インナーフレーム１８上には、前カバー１２が取り付けられる。筐体内には、ＬＥＤ１３および駆動基板１７の防水のためにシリコンゴム等からなる充填材１９が、筐体の内壁の背面から駆動基板１７が覆われるように充填されている。充填材１９は、背面板１６から少なくともＬＥＤ１３のリード部１３ｂとレンズ部１３ａの接合部Ｆに、充填材１９の表面が達するように充填される。
【００１７】
図６に、図４において示したＣ−Ｃ線の断面概略図を示す。ＬＥＤユニット固定ビス挿入部１１ａは、アウターフレーム１１と一体に突起状に形成される。ＬＥＤユニット固定ビス１５は、固定部１５ａ、シャフト部１５ｂおよびネジ部１５ｃから構成される。ＬＥＤユニット固定ビス挿入部１１ａの最小内径は、ネジ部１５ｃの最大外径よりもやや小さく形成されており、これによってＬＥＤユニット固定ビス１５の抜け落ちを防止する。ＬＥＤユニット固定ビス挿入部１１ａの外径はＬＥＤユニット固定ビス１５の固定部１５ａよりも大きく形成され、ＬＥＤユニットを壁面等から取り外すことなく、前カバー１２を取り外すことができる。また、通信コネクタ２は、駆動基板１７からＬＥＤユニットの表示面側に取り出し可能に構成されており、前カバーを取り外すことによって、表示面側から通信コネクタ２の接続作業を行うことができる。この前カバー１２は、ＬＥＤ表示面部分と通信コネクタ収納部分の複数の領域に分割して構成することが好ましい。
【００１８】
図７に、表示面側から見たＬＥＤ１３が配置された駆動基板１７およびインナーフレーム１８の概略図を示す。駆動基板１７上には、画素の近傍にＬＥＤユニット内の画素数と同数程度の第１の開口部１７ａが形成される。また、この第１の開口部１７ａは、画素に対応する列あるいは行毎に配置位置が変更される。ここでは、列毎に第１の開口部１７ａの配置位置が、各画素１０の上下に交互に形成される例を示した。
【００１９】
駆動基板１７は、ＬＥＤユニット固定ビス挿入部１１ａが挿入される第２の開口部１７ｂが形成される。インナーフレーム１８も、同様に、ＬＥＤユニット固定ビス挿入部１１ａが挿入される挿入部１８ｂを有する。さらに、駆動基板１７は、充填材１９の充填時に駆動基板１７と背面板１６の間に形成された空間から空気を抜くための通気孔１７ｃを有する。これによって、駆動基板１７と背面板１６の間に形成された空間に充填された充填材１９内に気泡が残留することを防止できる。また、インナーフレーム１８は、フレーム下面に形成された凹部１８ｄに、充填材１９の充填をスムーズに行うためのインナーフレーム開口部１８ｃを有する。
【００２０】
図８に、第１の開口部１７ａ、第２の開口部１７ｂおよび通気孔１７ｃの配置を示した駆動基板１７の概略図を示す。また、図９ａにインナーフレーム１８の概略正面図を、図９ｂに断面Ｄ−Ｄの側面概略図をそれぞれ示す。インナーフレーム１８は、充填材１９が駆動基板１７の表示面側において十分拡散できるよう凹部１８ｄが形成される。また、インナーフレーム開口部１８ｃは、凹部１８ｄ部分に形成される。インナーフレーム１８は、充填材１９の割れ等の劣化を防止するために、筐体１１内の充填材１９を充填する領域を分割するように、格子状に形成される。
（実施例）
以下に本発明の実施例を説明する。たとえばアルミニウム、ステンレス等の金属からなる背面板１６が取り付けられた筐体内に、ＬＥＤおよびＬＥＤの駆動回路であるＩＣ等が配置された駆動基板１７が、駆動基板１７と背面板１６の間に空間を形成して取り付けられる。駆動基板１７上に、凹部１８ｄを駆動基板１７側に向けたインナーフレーム１８を取り付ける。次に、充填ニードルを用いて第１の開口部１７ａからエポキシ樹脂等の充填材１９を充填する。充填材１９は、背面板１６から少なくともＬＥＤ１３のリード部１３ｂとレンズ部１３ａの接合部Ｆよりも上方となるよう、つまり充填材１９の表面が接合部Ｆに達するように充填される。ただし、ここでは筐体背面から表示面方向を上方とする。さらに、充填材１９の表面は、ＬＥＤ１３に配置されたＬＥＤチップ１３ｃよりも下方に形成されることが好ましい。この充填材１９の充填は、駆動基板１７に通信コネクタ２が接続された状態で行われる。通信コネクタ２は筐体アウターフレーム１１の側面または表示面側から取り出される。充填材１９は、黒色等に着色されることが好ましい。そして、前カバー１２が、前カバー固定ビス１４によって取り付けられる。
【００２１】
このように構成されたＬＥＤユニットは、たとえば壁面に複数個取り付けられ、通信コネクタ２によってそれぞれが接続されることによって大型ディスプレイを構成することができる。本発明のＬＥＤユニットは雨水等の侵入を、表示面側からだけでなくすべての方向から防止することができる。これによって、どのような場所にでもディスプレイを設置することができる。したがって、たとえばビルの壁面にあらかじめＬＥＤユニットの背面側を防水構造とした取り付けフレームを設置する必要がなくなる。さらには、水中でも使用可能になり、ディスプレイをプールや噴水等に設置することが可能になる。
【００２２】
【発明の効果】
以上説明した通り、本発明によって、あらゆる方向からの水の侵入を防止することができるＬＥＤ表示装置を提供することができる。
【図面の簡単な説明】
【図１】本発明にかかるＬＥＤユニットの正面図である。
【図２】図１におけるＬＥＤユニットのＡ−Ａ部の拡大斜視図である。
【図３】本発明に用いられるＬＥＤの一例である。
【図４】図１におけるＬＥＤユニットのＡ−Ａ部の拡大正面図である。
【図５】図２におけるＬＥＤユニットのＢ−Ｂ線の断面概略図である。
【図６】図２におけるＬＥＤユニットのＣ−Ｃ線の断面概略図である。
【図７】駆動基板およびインナーフレームの位置関係を示す概略図である。
【図８】駆動基板の概略図である。
【図９】インナーフレームの概略図である。
【符号の説明】
１・・・ＬＥＤユニット本体部
２・・・通信コネクタ
１１・・・アウターフレーム
１１ａ・・・ＬＥＤユニット固定ビス挿入部
１２・・・前カバー
１３・・・ＬＥＤ
１４・・・前カバー固定ビス
１５・・・ＬＥＤユニット固定ビス
１６・・・背面板
１７・・・駆動基板
１７ａ・・・第１の開口部
１７ｂ・・・第２の開口部
１７ｃ・・・通気孔
１８・・・インナーフレーム
１８ｂ・・・挿入部
１８ｃ・・・インナーフレーム開口部
１８ｄ・・・凹部
１９・・・充填材[0001]
[Industrial applications]
The present invention relates to a display device that can prevent water from entering from all directions.
[0002]
[Prior art]
Nowadays, LED displays using light emitting diodes (LEDs) are installed in various places as large display devices with low power consumption, light weight, and reduced thickness. In particular, along with the development of LEDs capable of emitting ultra-high luminance with RGB (red, green, blue) exceeding 1000 mcd, it has been attracting attention as a large display capable of full-color and multi-color display even outdoors.
[0003]
In such an LED display, LEDs each capable of emitting RGB light are arranged close to each other and used as one pixel by color mixture. Each LED can be lighted for a desired time and brightness by a driving IC or the like, and a desired color display can be performed by a color mixture of each LED. The LED display is configured by combining LED units in which a plurality of LEDs are arranged in a housing made of resin or the like. Each LED unit can be fixed to a mounting frame provided on the wall surface of the building. A large LED display can be configured by electrically connecting each LED unit with a communication connector.
[0004]
A conventional LED unit is configured to be mounted in a housing together with an LED substrate in which a plurality of LEDs are disposed in the housing and an IC substrate in which an internal circuit such as a driving IC is disposed. The IC board is attached to the back surface of the LED board in the housing, and the inner wall of the housing and the LED board are covered with a filler made of silicon rubber or the like to protect each LED and the IC board from intrusion of rainwater or the like. Was. Moreover, the communication connector was taken out from the back side of the housing of the LED unit from the IC substrate and connected to each LED unit.
[0005]
[Problems to be Solved by the Invention]
However, the conventional LED unit only has a waterproof structure from the display surface side. Therefore, it is necessary to secure the waterproof property on the back side by an attachment frame or the like. Further, the connection connector needs to be connected on the back surface of the LED unit, and a large space is required for the LED unit installation work.
[0006]
Therefore, an object of the present invention is to provide a display device that can prevent water from entering from all directions.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, the display device of the present invention is a display device in which a plurality of light emitting elements are arranged in a housing, and a driving substrate on which a driving circuit for driving the light emitting elements is arranged is provided on the housing. A space is formed between the inner wall and the back surface of the inner wall, and the drive substrate is covered with a filler from the back surface of the inner wall of the housing.
[0008]
The display device of the present invention further includes an inner frame formed in a lattice shape, and the filler is filled so that the surface of the filler reaches at least the inner frame.
[0009]
In the display device of the present invention, the inner frame is attached on the driving substrate, and the inner frame further has a recess on the driving substrate side.
[0010]
The display device of the present invention further includes a back plate and an outer frame, and the back plate is attached to the outer frame so as not to contact a wall surface to be fixed.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
(Embodiment)
FIG. 1 shows a front view of an LED unit in which a plurality of LEDs are arranged as a display device in which a plurality of light emitting elements are arranged in a housing according to the present invention. The LED unit includes an LED unit main body 1 and a communication connector 2. The communication connector 2 is a waterproof connector. The LED unit displays an image by controlling lighting of the LEDs arranged for each pixel. 1 in FIG. 1 indicates one pixel, and here, an example of an LED unit including 8 × 8 (8 rows and 8 columns) pixels is shown.
[0012]
An enlarged perspective view of the AA portion shown in FIG. 1 is shown in FIG. The LED 13 is disposed in the outer frame 11, and a front cover 12 is attached to the display surface side of the outer frame 11 by a front cover fixing screw 14. The front cover 12 has a louver that prevents external light from entering the periphery of the LED, and the louver is provided with a portion having no louver between pixels. As a result, it is possible to prevent the boundary between the LED units from being visually recognized on the displayed screen. The front cover 12 is preferably made of resin. This is because the inside of the housing is reduced from being heated by outside light such as sunlight. The LED unit main body 1 is fixed to a wall surface or the like by an LED unit fixing screw 15.
[0013]
For example, a bullet-type LED shown in FIG. 3 is used as the LED 13. The LED 13 has an LED chip 13c disposed on one of the lead portions 13b, and is connected to the other of the lead portion 13b from the LED chip 13c by a wire 13d. The LED chip 13c is sealed in a lens portion 13a made of epoxy resin, urea resin, or the like. In FIG. 3, F indicates a joint portion between the surface of the lens portion 13a and the lead portion 13b.
[0014]
FIG. 4 is an enlarged front view of the AA portion shown in FIG. Here, an example is shown in which one pixel is composed of two red LEDs, one green LED, and one blue LED. The LED unit fixing screw 15 fixes the LED unit by being inserted into the LED unit fixing screw insertion portion 11a which is a part of the outer frame 11.
[0015]
FIG. 5 is a schematic cross-sectional view taken along line BB shown in FIG. A back plate 16 is disposed on the back surface of the outer frame 11 to constitute a housing. The back plate 16 is formed of a material or shape having a high heat dissipation property, for example, a shape having heat radiation fins, so as to dissipate heat generated from the drive substrate 17 or the like. Further, the back plate 16 is attached to the outer frame 11 so as not to come into contact with a wall surface or the like to be fixed. Thereby, the ventilation property of the back side of the LED unit is ensured, and heat radiation can be performed efficiently. In particular, it is preferable that the outside of the LED back surface is not closed by the outer frame 11 and the wall surface.
[0016]
In the outer frame 11, a drive substrate 17 on which an LED and an IC that is an LED drive circuit are disposed is attached with a space formed between the drive substrate 17 and the back plate 16. The drive substrate 17 has a first opening 17a. The first openings 17a are preferably formed in the vicinity of the pixels, and are formed in the same number as the number of pixels 10 in the LED unit. Further, an inner frame 18 is attached on the drive substrate 17. A front cover 12 is attached on the inner frame 18. The casing is filled with a filler 19 made of silicon rubber or the like for waterproofing the LEDs 13 and the drive board 17 so that the drive board 17 is covered from the back of the inner wall of the casing. The filler 19 is filled from the back plate 16 so that the surface of the filler 19 reaches at least the joint portion F of the lead portion 13b of the LED 13 and the lens portion 13a.
[0017]
FIG. 6 is a schematic cross-sectional view taken along the line CC shown in FIG. The LED unit fixing screw insertion portion 11 a is formed in a protruding shape integrally with the outer frame 11. The LED unit fixing screw 15 includes a fixing portion 15a, a shaft portion 15b, and a screw portion 15c. The minimum inner diameter of the LED unit fixing screw insertion portion 11a is formed to be slightly smaller than the maximum outer diameter of the screw portion 15c, thereby preventing the LED unit fixing screw 15 from falling off. The outer diameter of the LED unit fixing screw insertion portion 11a is formed larger than the fixing portion 15a of the LED unit fixing screw 15, and the front cover 12 can be removed without removing the LED unit from the wall surface or the like. Further, the communication connector 2 is configured to be removable from the drive board 17 to the display surface side of the LED unit. By removing the front cover, the connection operation of the communication connector 2 can be performed from the display surface side. The front cover 12 is preferably divided into a plurality of regions including an LED display surface portion and a communication connector storage portion.
[0018]
FIG. 7 shows a schematic diagram of the drive board 17 and the inner frame 18 on which the LEDs 13 are disposed as viewed from the display surface side. On the drive substrate 17, first openings 17 a having the same number as the number of pixels in the LED unit are formed in the vicinity of the pixels. Further, the position of the first opening 17a is changed for each column or row corresponding to the pixel. Here, an example is shown in which the positions of the first openings 17a are alternately formed above and below each pixel 10 for each column.
[0019]
The drive substrate 17 is formed with a second opening 17b into which the LED unit fixing screw insertion portion 11a is inserted. Similarly, the inner frame 18 has an insertion portion 18b into which the LED unit fixing screw insertion portion 11a is inserted. Further, the drive substrate 17 has a vent hole 17 c for extracting air from the space formed between the drive substrate 17 and the back plate 16 when the filler 19 is filled. Thereby, it is possible to prevent bubbles from remaining in the filler 19 filled in the space formed between the drive substrate 17 and the back plate 16. The inner frame 18 has an inner frame opening 18c for smoothly filling the filler 19 in a recess 18d formed on the lower surface of the frame.
[0020]
FIG. 8 is a schematic view of the drive substrate 17 showing the arrangement of the first opening 17a, the second opening 17b, and the air holes 17c. FIG. 9a shows a schematic front view of the inner frame 18, and FIG. 9b shows a schematic side view of a section DD. The inner frame 18 is formed with a recess 18 d so that the filler 19 can sufficiently diffuse on the display surface side of the drive substrate 17. The inner frame opening 18c is formed in the recess 18d. The inner frame 18 is formed in a lattice shape so as to divide the region filled with the filler 19 in the housing 11 in order to prevent deterioration of the filler 19 such as cracking.
(Example)
Examples of the present invention will be described below. For example, a drive substrate 17 in which an LED and an IC as an LED drive circuit are arranged in a housing to which a back plate 16 made of metal such as aluminum or stainless steel is attached is a space between the drive substrate 17 and the back plate 16. To be attached. On the drive board 17, the inner frame 18 with the recess 18d facing the drive board 17 is attached. Next, a filler 19 such as an epoxy resin is filled from the first opening 17a using a filling needle. The filler 19 is filled from the back plate 16 so as to be at least above the joint portion F between the lead portion 13b of the LED 13 and the lens portion 13a, that is, the surface of the filler 19 reaches the joint portion F. However, here, the display surface direction is upward from the rear surface of the housing. Furthermore, the surface of the filler 19 is preferably formed below the LED chip 13c disposed on the LED 13. The filling material 19 is filled in a state where the communication connector 2 is connected to the drive substrate 17. The communication connector 2 is taken out from the side surface or the display surface side of the housing outer frame 11. The filler 19 is preferably colored black or the like. Then, the front cover 12 is attached by a front cover fixing screw 14.
[0021]
A plurality of LED units configured in this way are attached to a wall surface, for example, and a large display can be configured by being connected to each other by the communication connector 2. The LED unit of the present invention can prevent intrusion of rainwater or the like not only from the display surface side but also from all directions. Thereby, a display can be installed in any place. Therefore, for example, it is not necessary to install a mounting frame having a waterproof structure on the back side of the LED unit in advance on the wall surface of the building. Furthermore, it can be used in water, and a display can be installed in a pool, a fountain, or the like.
[0022]
【The invention's effect】
As described above, according to the present invention, it is possible to provide an LED display device that can prevent water from entering from all directions.
[Brief description of the drawings]
FIG. 1 is a front view of an LED unit according to the present invention.
FIG. 2 is an enlarged perspective view of an AA portion of the LED unit in FIG.
FIG. 3 is an example of an LED used in the present invention.
4 is an enlarged front view of an AA portion of the LED unit in FIG. 1. FIG.
5 is a schematic sectional view taken along line BB of the LED unit in FIG. 2. FIG.
6 is a schematic sectional view taken along line CC of the LED unit in FIG. 2;
FIG. 7 is a schematic diagram showing a positional relationship between a drive substrate and an inner frame.
FIG. 8 is a schematic view of a drive substrate.
FIG. 9 is a schematic view of an inner frame.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... LED unit main-body part 2 ... Communication connector 11 ... Outer frame 11a ... LED unit fixing screw insertion part 12 ... Front cover 13 ... LED
14 ... Front cover fixing screw 15 ... LED unit fixing screw 16 ... Back plate 17 ... Drive board 17a ... First opening 17b ... Second opening 17c ... Vent 18 ... Inner frame 18b ... Insert 18c ... Inner frame opening 18d ... Recess 19 ... Filler

Claims (3)

筐体内に複数の発光素子が配置された表示装置において、
前記発光素子を駆動する駆動回路が配置された駆動基板が、前記筐体の内壁の背面との間に空間を形成して取り付けられており、
前記筐体の内壁の背面から前記駆動基板が充填材によって覆われ、
前記表示装置は、格子状に形成されたインナーフレームを有し、
前記充填材は、該充填材の表面が少なくとも前記インナーフレームに達するように充填される、表示装置。In a display device in which a plurality of light emitting elements are arranged in a housing,
A drive board on which a drive circuit for driving the light emitting element is disposed is attached to form a space between the rear surface of the inner wall of the housing,
The drive substrate is covered with a filler from the back of the inner wall of the housing,
The display device has an inner frame formed in a lattice shape,
The display device, wherein the filler is filled so that a surface of the filler reaches at least the inner frame. 前記インナーフレームは、前記駆動基板上に取り付けられ、
さらに、前記インナーフレームは、前記駆動基板側に凹部を有する、請求項１に記載の表示装置。The inner frame is mounted on the driving substrate;
Furthermore, the said inner frame is a display apparatus of Claim 1 which has a recessed part in the said drive substrate side. 筐体内に複数の発光素子が配置された表示装置において、
前記発光素子を駆動する駆動回路が配置された駆動基板が、前記筐体の内壁の背面との間に空間を形成して取り付けられており、
前記筐体の内壁の背面から前記駆動基板が充填材によって覆われ、
前記表示装置は、背面板およびアウターフレームを有し、
前記背面板は、固定されるべき壁面等と接触しないように前記アウターフレームに取り付けられる、表示装置。In a display device in which a plurality of light emitting elements are arranged in a housing,
A drive board on which a drive circuit for driving the light emitting element is disposed is attached to form a space between the rear surface of the inner wall of the housing,
The drive substrate is covered with a filler from the back of the inner wall of the housing,
The display device has a back plate and an outer frame,
The display device, wherein the back plate is attached to the outer frame so as not to contact a wall surface to be fixed.
JP2000108074A 2000-04-10 2000-04-10 Display device Expired - Fee Related JP3640158B2 (en)

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JP2005165041A (en) * 2003-12-03 2005-06-23 Eteitsuku:Kk Display device
JP2005275178A (en) * 2004-03-25 2005-10-06 Koha Co Ltd Outdoor display unit
JP2009198631A (en) * 2008-02-20 2009-09-03 Panasonic Corp Display
JP5803430B2 (en) * 2011-08-26 2015-11-04 日亜化学工業株式会社 LED light emitting device
JP5584668B2 (en) * 2011-09-28 2014-09-03 富士通フロンテック株式会社 LED unit manufacturing method
JP6091189B2 (en) * 2012-11-29 2017-03-08 三菱電機株式会社 Display device
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