KR20020069818A - An ultra-slim type led module and an electric signboard using the same - Google Patents

Abstract

PURPOSE: A wafer thin LED(light emitting diode) module and a wafer thin electronic display board using the LED module are provided to achieve effective waterproof and vibration-proof properties without a separate cooling device, and to increase a downward visual angle of the LED module. CONSTITUTION: The wafer thin LED module comprises a lattice plate(513) formed with a plurality of compartments having an opening; a shade member(518), which extends along a line defined by the compartments to be formed at the side of the opening, a plurality of shade members being provided per each line to reduce a distance of the front side thereof; and a circuit board(510) onto which a plurality of LED lamps are mounted so that at least one lamp is located per each compartment.

Description

Ultra-thin LED module and ultra-thin LED board using same {AN ULTRA-SLIM TYPE LED MODULE AND AN ELECTRIC SIGNBOARD USING THE SAME}

The present invention relates to an ultra-thin light emitting diode module (LED module) and an ultra-thin electronic board using the same. More particularly, the rear of the light emitting diode (hereinafter referred to as LED) module is sealed with a heat sink made of metal, and each LED module is small. It is related to an ultra-thin LED module and an ultra-thin LED board using the same power supply, and each LED pixel is equipped with a plurality of shading plates with a short front length to reduce the thickness while being effectively dustproof, waterproof and heat-resistant. .

In general, the light emitting diode display board has the relative advantage of low power consumption among various display devices used to provide image information, and furthermore, it is possible to realize high quality image quality according to the development of LED manufacturing technology. It is widely used.

Such a conventional LED sign is briefly described with reference to the drawings of FIGS. 1 to 3C as follows.

As shown in FIG. 1, the conventional LED display board provides image information through the display unit 100 mounted on the front of the main frame 101, and the display unit 100 includes a plurality of LED sectors arranged in series. Consists of 110.

2A to 2C are a plan view, a front schematic view and a side view showing the configuration of the LED sector 110 of the conventional LED display panel, respectively, and the conventional LED sector 110 is shown as an internal through hole 111, as shown. A case 112 formed therein; A plurality of LED modules 120 continuously attached to the front of the case 112; Mounted inside the case 112, and consists of a power supply (113) for supplying current to each of the LED module (120).

Here, each of the LED module 120 is mounted to the case frame 112 in a state spaced apart from each other by a predetermined interval in consideration of the thermal expansion effect.

3A to 3C are a plan view, a front view, and a side view, respectively, illustrating the configuration of the LED module 120 of the conventional LED display panel. The conventional LED module 120 has a plastic frame (as shown). 121); The circuit board 123 is attached to the front surface of the frame 121 and includes a plurality of LED pixels 122 arranged in series.

Here, a plurality of sunshade 124 extending in the horizontal direction is attached to the upper side of each row formed by the plurality of LED pixels 122.

The conventional LED display board configured as described above is operated by a DC power supply provided by the power supply 113, and the LED pixels 122 each emit light of various colors by the control system of the display board. Image information is delivered.

However, the conventional LED signboard as described above has a structure in which the rear part of the LED module 120 is opened to dissipate heat generated during its operation, so that dust and moisture are introduced from the outside, thereby causing malfunction or damage to the device. There is a problem that is caused.

In order to solve this problem, the rear part of the LED module 120 is in a semi-closed state, and an electric light plate having a structure for cooling the LED module 120 by installing a separate cooling device such as a cooling fan is also used. Since the device is mounted, there is a problem that the energy consumption is increased, the thickness of the device is increased, and the perfect sealed state is not maintained.

In addition, since the frame 121 of the LED module 120 is made of a plastic material, it is difficult to attach a power supply to the LED module. Conventionally, in order to solve this problem, the power supply 113 is mounted on the case 112 of the LED sector 110 to supply current to the plurality of LED modules 120. In this case, a large power supply 113 is used. ), Which causes a problem that the thickness of the LED sector 110 becomes thick.

In addition, since the LED module 120 is installed to be spaced apart from each other at a predetermined interval, when the power is off (off) a vertical line due to the gap is observed not aesthetically good, the front length of the awning plate 124 is long This causes a problem that the downward viewing angle is reduced and the thickness of the device becomes thick.

Accordingly, the present invention has been made to solve the above problems, the rear portion is sealed with a heat sink of a metal material, the heat sink is in contact with the heat generating portion, dustproof, waterproof and heat dissipation, while making the thickness thinner An object of the present invention is to provide an ultra-thin LED module and an ultra-thin electronic board using the same.

In addition, another object of the present invention is to provide an ultra-thin LED module and an ultra-thin electronic board using the same, by which a small-capacity power supply can be mounted in each LED module to reduce the thickness of the case of the LED sector.

In addition, the present invention is to provide an ultra-thin LED module and an ultra-thin electronic board using the same by mounting a plurality of sunshade for each LED pixel to reduce the front length of each sunshade, to increase the downward visible angle and to thin thickness. There is another purpose.

1 is a front view showing a conventional LED sign.

Fig. 2A is a plan view of an LED sector constituting a conventional LED sign.

Fig. 2B is a front view of Fig. 2A.

Figure 2C is a side view of Figure 2A.

3A is a plan view of an LED module forming a conventional LED sector.

3B is a front view of FIG. 3A.

Figure 3c is a side view of Figure 3a.

Figure 4a is a plan view showing one embodiment configuration of an ultra-thin LED module according to the present invention.

4B is a front view of FIG. 4A.

4C is a side view of FIG. 4A.

5 is an exploded perspective view of an ultra-thin LED module according to the present invention.

6 is a side view of an LED sector consisting of an ultra-thin LED module according to the present invention.

* Explanation of symbols for main parts of the drawings

510: circuit board 511: LED lamp

512: LED pixel 513: grid

514: heat sink 515: inner packing

516: external packing 517: compartment

518: sun plate 519: heat conductive member

520: Power Supply

In order to achieve the above object, the present invention is a grid plate having a plurality of compartments having an opening on one side; A sunshade that extends along a row of compartments of the lattice plate and is formed at an opening side, and a plurality of sunshade plates are provided for each row to reduce the front length thereof; And a plurality of LED lamps mounted on one surface thereof, and a circuit board mounted on the grid board such that at least one LED lamp is positioned in each compartment of the grid board, and an ultra-thin LED module using the same.

The above objects, features and advantages will become more apparent from the following detailed description taken in conjunction with the accompanying drawings. Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings of FIG. 4A.

Figures 4a to 4c is a plan view, front view and side view showing an embodiment configuration of an ultra-thin LED module according to the present invention, Figure 5 is an exploded perspective view thereof.

Ultra-thin LED module of the present embodiment, as shown, a circuit board 510 with a plurality of LEDs 511 are arranged in a uniform distribution; A lattice board 513 mounted on a front surface of the circuit board 510 and having a plurality of compartments 517 arranged in a uniform distribution such that the LEDs 511 form a plurality of LED pixels 512; A heat sink 514 made of aluminum mounted on a rear surface of the circuit board 510; An inner packing 515 inserted between the circuit board 510 and an outer circumference of the heat sink 514 to seal the inside thereof; It is largely composed of an outer packing (516) attached to surround the outer peripheral portion of the heat sink (514).

Here, the sunshade plate 518 is formed at the upper end and the center of each of the compartments 517 of the grating plate 513 to protrude forward to block sunlight, and spaced apart at predetermined intervals in the horizontal direction. .

In addition, the heat generated during operation is attached between the circuit board 510 and the heat sink 514 so as to be in contact with the heat generating unit and the inner wall surface of the heat sink 514 such as the operation element installed on the circuit board 510 at the same time. The heat conducting member 519 for transmitting the heat sink 514 is provided.

In addition, the outer wall surface of the heat sink 514 is provided with a power supply 520 for supplying a DC current, the power supply 520 may be formed integrally with the heat sink 514, it may be formed detachably It may be.

On the other hand, in the above description of the present embodiment has been described that the two solar panel 518 is formed for each LED pixel 512, the heat conductive member 519 is formed separately from the heat sink 514, the present invention The present invention is not limited thereto, and two or more awning plates 518 may be formed for each LED pixel 512, or the heat conductive member 519 may be integrally formed on the heat sink 514. It will be apparent to those of ordinary skill in the art.

Looking at the detailed function and operation of each component of the present embodiment configured as described above are as follows.

6 is a side view of an LED sector made by an LED module according to the present invention.

As shown, the LED module 500 of the present invention configured as described above is mounted on the front of the case 601 to be spaced apart from each other at predetermined intervals in consideration of thermal expansion to form the LED sector 600, the LED sector ( 600 is integrated to form an LED sign (not shown).

At this time, since a small capacity power supply 520 is provided at the rear of each LED module 500, the width of the internal space of the case 601 can be reduced, thereby reducing the thickness of the LED display board.

The operation of the LED module according to the present invention is made by the DC power provided by the power supply 520, the LED pixels 512 described above by the predetermined system by emitting light of various colors by the control system of the electronic board Image information is delivered.

Heat generated by the operation of each LED pixel 512 and a control unit (not shown) is discharged to the outside by the heat sink 514 without a separate cooling device such as a cooling fan, and a rear portion of the circuit board 511. Is sealed by the heat dissipation plate 514, so that the operation part on the circuit board is protected from foreign substances such as dust and moisture.

In addition, since the awning plate 518 is spaced apart by a predetermined interval in the horizontal direction, the vertical line appearing on the signboard is not easily seen by the gap between each LED module while the signboard is turned off.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and changes are possible in the art without departing from the technical spirit of the present invention. It will be apparent to those of ordinary knowledge.

The present invention as described above, by mounting a sealed heat sink for heat dissipation during the operation of the LED module, there is no need for a separate cooling device to reduce the thickness while the dustproof, waterproof and heat dissipation of the LED module effectively made It has an effect.

In addition, the present invention has a small power supply for each LED module, it is possible to reduce the thickness of the LED display board, and by providing two or more short-length shade panels for each LED pixel, reducing the thickness of the LED module at the same time downward There is an effect that can increase the viewing angle.

In addition, the present invention has the effect that the vertical lines appearing on the display board by the gap between the LED module while the gap is formed in the solar panel is turned off, the effect is not good.

Claims (9)

A grating plate having a plurality of compartments having openings at one side thereof; A shading means extending along a row formed by the compartment of the grating plate and formed at the opening side, and having a plurality of rows for each row so as to reduce the front length thereof; And A circuit board is mounted on the grid board such that a plurality of LED lamps is mounted on one surface thereof, and at least one LED lamp is positioned in each compartment of the grid board. Ultra-thin LED module comprising a. The method of claim 1, Heat dissipation means mounted on a rear portion of the circuit board to seal the inside thereof, and for dissipating heat generated during operation of the circuit board to the outside; Heat transfer means for transferring heat generated during operation of the circuit board to the heat radiating means by contacting the heat generating portion of the circuit board and the inner wall surface of the heat radiating means, respectively. Ultra-thin LED module further comprising. The method of claim 2, Ultra-thin LED module, characterized in that the heat transfer means is integrally formed on the inner wall surface of the heat dissipation means. The method according to claim 2 or 3, Inserted into the coupling portion of the circuit board and the heat sink, the ultra-thin LED module further comprises an inner packing for sealing the inside. The method of claim 4, wherein The ultra-thin LED module is attached to surround the outer circumference of the heat dissipation means, further comprising an outer packing to perform a dust and waterproof function. The method of claim 2, Ultra-thin LED module, characterized in that the heat dissipation means is made of aluminum. A grating plate having a plurality of compartments having openings at one side thereof; A shading means extending along a row formed by the compartment of the grating plate and formed at the opening side, and having a plurality of rows for each row so as to reduce the front length thereof; A circuit board having a plurality of LED lamps mounted on one surface thereof, the circuit board mounted on the grid such that at least one LED lamp is positioned in each compartment of the grid; Heat dissipation means mounted on a rear portion of the circuit board to seal the inside thereof, and for dissipating heat generated during operation of the circuit board to the outside; And Heat transfer means for transferring heat generated during operation of the circuit board to the heat radiating means by contacting the heat generating portion of the circuit board and the inner wall surface of the heat radiating means, respectively. An ultra-thin LED electronic board is made by integrating an ultra-thin LED module, including a power supply for providing a direct current to the operating element of the circuit board for each LED module. The method of claim 7, wherein Ultra-thin LED electronic board, characterized in that the power supply is formed integrally with the heat sink. The method according to claim 7 or 8, Ultra-thin LED signboard, characterized in that the groove is formed in the awning plate uniformly spaced so that the vertical lines appearing on the signboard by the gap between the LED modules do not appear well.