JP2007279480A - Liquid crystal display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid crystal display device capable of obtaining a linear light source which is easy to handle in consideration of heat radiation of a light emitting diode as a liquid crystal display device which uses the light emitting diode as a light source. <P>SOLUTION: The light emitting diode 150 is arranged on a metal substrate 161, which is formed in a case shape to effectively radiate heat of the light emitting diode 150 which is put in the case and generates the heat. A plate type light source section 130 is formed by charging a resin material 175 in the internal space of the metal case. Thus, the plate type light source section 130 is formed by charging the resin material 175 to improve reliability during handling in a manufacturing stage etc. Further, the resin material 157 is charged to improve heat radiation effect. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a light source of a non-self-luminous display device, and more particularly to a liquid crystal display device having a backlight using a light emitting element as a light source.

  In recent years, liquid crystal display devices are frequently used as display devices. In particular, a liquid crystal display device is used as a display unit of a portable device because it is thin, lightweight, and saves power.

  However, since the liquid crystal display device is not a self-luminous type, it requires illumination means. 2. Description of the Related Art A planar lighting device called a backlight is widely used as a lighting device generally used in a liquid crystal display device. Conventionally, a cold cathode discharge tube has been used as a light emitting element (also referred to as a light source) of a backlight, but in recent years, a light emitting diode (hereinafter referred to as an LED) has also been used as a light emitting element in a portable device.

  A liquid crystal display device using an LED as a light source has been proposed, for example, in Patent Document 1 below. Moreover, the technique regarding the heat dissipation of LED is described in the following patent document 2.

JP-A 64-88426 JP 2002-162626 A

  However, when using a large number of LEDs as a backlight to increase the brightness, there is a problem that the operating temperature rises and the luminous efficiency decreases. Therefore, an attempt is made to use a metal plate or the like in consideration of heat dissipation. However, since it is difficult to form a heat radiating member on the light emitting surface of the LED, the structure is limited in consideration of heat radiation and light emission. Moreover, the handling at the time of manufacture becomes inconvenient and the subject that it becomes a structure with low reliability arises.

  Accordingly, the present invention has been made based on such circumstances, and the object thereof is a manufacturing process in consideration of the heat dissipation of the backlight in a liquid crystal display device having a backlight having a structure in consideration of heat dissipation. It is an object of the present invention to provide a liquid crystal display device including a light source unit that is easy to handle and has high reliability.

  In order to achieve such an object, a liquid crystal display device according to the present invention includes a liquid crystal display panel configured by sandwiching a liquid crystal layer between a pair of transparent substrates having electrodes for forming pixels on the inner surface, and the liquid crystal display. The panel includes a backlight for illuminating the back with illumination light, and the backlight includes a plurality of light emitting elements, a circuit board on which the plurality of light emitting elements are arranged, and a metal case for housing the circuit board, The circuit board in the metal case is integrally formed by filling a resin material.

  Another liquid crystal display device according to the present invention includes a liquid crystal display panel configured by sandwiching a liquid crystal layer between a pair of transparent substrates having pixels for forming electrodes on the inner surface, and illumination light on the back surface of the liquid crystal display panel. The planar light source device includes a plurality of light emitting diodes arranged in a line, a circuit board that electrically connects the plurality of light emitting diodes, and a side surface that houses the circuit board. And a case having a bottom surface, and a resin material is filled between the plurality of light emitting diodes and the side surface inside the case, and is integrally formed.

  Still another liquid crystal display device according to the present invention includes a liquid crystal display panel configured by sandwiching a liquid crystal layer between a pair of transparent substrates having pixels for forming electrodes on the inner surface, and illumination light on the back surface of the liquid crystal display panel. And a control unit for controlling the liquid crystal display panel, the backlight comprising a light guide plate and a plate-like light source unit formed along one side of the light guide plate The plate-like light source unit has a light exit surface, a bottom surface facing the light exit surface, and a side surface formed around the bottom surface. The bottom surface has a metal surface and the metal surface. A plurality of light emitting diodes electrically connected to the wirings, and openings formed on the side surfaces or the bottom surface; the light emitting diodes and the control unit; Connecting wiring to electrically connect Are arranged in the mouth, on the insulating layer is characterized in that the resin layer is formed.

  According to the present invention, in a liquid crystal display device using a light emitting element as a light source, an extremely excellent effect is obtained that a liquid crystal display device including a light source unit that is easy to handle and has high reliability can be realized in the manufacturing process. It is done.

  Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings of the examples.

  FIG. 1 is a plan view of an essential part showing the overall configuration of an embodiment of a liquid crystal display device according to the present invention. In FIG. 1, the liquid crystal display device 100 includes a liquid crystal display panel 1, a backlight 110, and a control circuit 80. The liquid crystal display panel 1 is formed by sealing a liquid crystal layer between glass substrates having electrodes for forming pixels. The liquid crystal display panel 1 is supplied with signals and a power supply voltage necessary for display on the liquid crystal display panel 1 from the control circuit 80. The control circuit 80 is mounted on the flexible substrate 70, and a control signal is supplied to the liquid crystal display panel 1 through the wiring 71 and its terminal 75.

  The backlight 110 includes a light guide plate 120, a light source 130, and a storage case 180. The backlight 110 is provided for the purpose of irradiating the liquid crystal display panel 1 with light. The liquid crystal display panel 1 performs display by controlling the amount of transmission or reflection of light emitted from the backlight 110. Note that the backlight 110 is provided so as to be overlapped on the back side or the front side of the liquid crystal display panel 1 with respect to the observer. However, in order to facilitate understanding, the backlight 110 is displayed side by side with the liquid crystal display panel 1. Details of the configuration of the backlight 110 will be described later.

  A pixel electrode 12 is provided in the pixel portion 8 of the liquid crystal display panel 1. Although the liquid crystal display panel 1 includes a large number of pixel portions 8 in a matrix, only one pixel portion 8 is shown in FIG. The pixel portions 8 arranged in a matrix form a display region 9, and each pixel portion 8 plays a role of a pixel of a display image and displays an image in the display region 9.

  In FIG. 1, gate signal lines (also referred to as scanning signal lines) 21 extending in the X direction and juxtaposed in the Y direction, and drain signal lines extending in the Y direction and juxtaposed in the X direction (in FIG. 1). The pixel portion 8 is formed in a region surrounded by the gate signal line 21 and the drain signal line 22.

  A switching element 10 is provided in the pixel portion 8. A control signal is supplied from the gate signal line 21 to control on / off of the switching element 10. When the switching element 10 is turned on, the video signal transmitted through the drain signal line 22 is supplied to the pixel electrode 12.

  The drain signal line 22 is connected to the drive circuit 5, and a video signal is output from the drive circuit 5. The gate signal line 21 is connected to the drive circuit 6, and a control signal is output from the drive circuit 6. Note that the gate signal line 21 and the drain signal line 22 and the drive circuit 5 and the drive circuit 6 are formed on the same TFT substrate 2.

  Next, FIG. 2 is a diagram showing a schematic configuration of the LED 150 which is a light emitting element, FIG. 2 (a) is a cross-sectional view, FIG. 2 (b) is a plan view seen from the light emitting surface side, and FIG. These are the top views seen from the back side. The LED 150 has a structure in which an LED chip 151 as a light emitting unit is mounted on a chip substrate 157. The LED chip 151 has a pn junction, and light having a specific wavelength is emitted when a voltage is applied to the pn junction. A p-electrode (anode) 158 is provided in the p-type semiconductor layer forming the pn junction, and an n-electrode (cathode) 159 is provided in the n-type semiconductor layer.

  A wire 152 is connected to each p electrode 158 and n electrode 159. The wire 152 electrically connects the chip terminal 153 provided to connect the LED 150 to the outside, and the p-electrode 158 and the n-electrode 159.

  A fluorescent light emitting unit 156 may be provided on the emission surface side of the LED chip 151. The fluorescent light emitting unit 156 has a function of converting the wavelength of light emitted from the LED chip 151. The reference numeral 157 reflects the light traveling in the lateral direction on the cone-shaped reflecting surface to the emitting surface side. Reference numeral 166 denotes a mark indicating the position of the cathode (or anode).

  The chip terminal 153 is connected to an external wiring or the like on the back surface of the chip substrate 157, but extends from the back surface of the chip substrate 157 through the side surface to the emission surface side to form a chip mounting portion 154. When the chip terminal 153 and the chip mounting part 154 are formed of a metal having high light reflectance, the chip mounting part 154 can be used as a light reflecting surface. Further, if the chip terminal 153 and the chip mounting portion 154 are formed of a metal having a high thermal conductivity (or a conductive member), the heat generated in the LED chip 151 can be dissipated to the back side of the chip substrate 157. is there.

  Next, a substrate on which the LED chip 151 is mounted will be described with reference to FIG. FIG. 3A is a schematic cross-sectional view showing a state where the LED chip 151 is mounted on the metal substrate 161, and FIG. 3B is a schematic front view of a portion where the LED chip 151 is mounted. In FIG. 3, the mounting substrate 160 is formed by applying an insulating layer 163 to a metal substrate 161 and forming a wiring 163 with a conductive layer such as a copper foil on the insulating layer 163. By using the base material of the mounting substrate 160 as a metal, it is possible to effectively dissipate the heat transmitted to the back side of the chip substrate 157. In order to increase the efficiency of heat dissipation, it is desirable that the insulating layer 163 be thin enough to avoid problems such as short circuit and leakage. In this embodiment, an insulating layer having a thickness of about 0.12 mm and a thermal conductivity of about 6.5 W / m · K was used.

  A connection pad 165 is formed at the end of the wiring and is electrically connected to the chip terminal 153 of the LED chip 151. A surface insulating layer 164 is applied to the surface of the mounting substrate 160 to prevent the wiring from being short-circuited with other components on the surface side of the mounting substrate 160 and to maintain insulation between the pads 165. Note that the surface insulating layer 164 is removed from the surface of the pad 165 for electrical connection with the chip terminal 153. A solder paste or the like is printed and applied to a portion of the pad 165 from which the surface insulating layer 164 has been removed, and the LED chip 151 is mounted on the mounting substrate 160 by a reflow process or the like.

  A member having a low affinity for solder is selected for the surface insulating layer 164 for the reason of using the solder reflow process. However, since the surface insulating layer 164 is formed on the surface of the mounting substrate 160, an achromatic one is preferable. In particular, in consideration of light utilization efficiency, a white color with a lot of reflected light or a white color is desirable. Titanium oxide or the like is suitable as a material having a high reflectance. Reference numeral 167 denotes a mark indicating the position of the cathode (or anode). A color different from the color used for the surface insulating layer 164 is used in order to improve visibility.

  4A and 4B are schematic views showing a state in which the LEDs 150 are linearly mounted on the mounting substrate 160. FIG. 4A is a plan view, FIG. 4B is a cross-sectional view, and FIG. It is a perspective view which shows a mode that the connection wiring 173 was connected.

  In FIG. 4, six LEDs 150 are arranged on the mounting substrate 160 so as to be a linear light source. The LED chip 151 has a certain voltage difference between pn junctions due to the characteristics as a diode. The voltage difference between the pn junctions varies depending on the manufacturing process. For this purpose, an optimum voltage is adjusted so as to be applied to the pn junction. However, when n LED chips 151 are connected in parallel, n adjustment circuits are required, and the manufacturing cost increases for adjustment. The problem arises.

  In FIG. 4, three LEDs 150 are connected in series, and the voltage is adjusted for every three LEDs. When 12V for in-vehicle use is used as the power supply voltage and the potential difference generated in each LED chip 151 is about 4V, it is efficient to connect three in series. That is, it is efficient if the relationship between the power supply voltage V, the potential difference Vd generated in the average LED chip 151, and the number n is V> = n × Vd.

  When the potential difference generated in each LED chip 151 is about 3V and the power supply voltage is 12V, it is efficient to connect four in series. Further, when adjustment is performed by inserting a resistor between the last LED chip 151 of n LED chips 151 connected in series and the ground potential, two wires are required for each series connection. In this embodiment, there are four wires, and external connection terminals 171 are formed in each wire. As shown in FIG. 4C, the external connection wiring 173 is connected to the external connection terminal 171. A connector 172 is provided at the end of the external connection wiring 173 and is connected to the control circuit 80 shown in FIG.

  FIG. 5 is a perspective view for explaining a structure in which the metal substrate 161 is formed in a box shape. FIG. 5A shows a structure in which a frame-shaped side surface 169 is formed in the periphery of the metal substrate 161. The side surface 169 is formed so as to surround the metal substrate 161, and has a shape of a container having an emission port through which light from the LED 150 is emitted upward.

  FIG. 5B shows a case in which the insulating layer 162, the wiring 163, the surface insulating layer 164, and the like shown in FIGS. 3 and 4C are formed in a container in which the metal substrate 161 is formed in a box shape. A mounting substrate 160 on which the LED 150 is mounted is accommodated. An external connection wiring 173 is drawn out from the upper end of the side surface 169 to the mounting substrate 160.

  FIG. 5C shows a structure in which a resin material 175 is filled inside a container formed by the metal substrate 161. The resin material 175 is filled so as to embed other portions while leaving the upper surface of the LED 150. When the metal substrate 161 is formed in a box shape and the container is filled with the resin material 175 as shown in FIG. 5C, the mounting substrate 160 can be handled as one plate-like light source. Hereinafter, the structure in which the resin material 175 is filled (coated) on the mounting substrate 160 is also referred to as a plate-like light source unit 130.

  When the resin material 175 having a higher thermal conductivity than air is used, the heat dissipation effect is improved. When the thermal conductivity of air is about 0.0261 W / m · K, the standard of the thermal conductivity of the resin is about 0.16 W / m · K for silicone resin, about 0.3 W / m · K for epoxy resin, The acrylic resin is about 0.21 W / m · K, and the polycarbonate resin is about 0.23 W / m · K.

  The external connection wiring 173 is fixed by the resin material 175 and is easy to handle. However, since the external connection wiring 173 is pulled out from the upper end of the side surface 169, the thickness of the plate-like light source unit 130 is increased by the thickness of the external connection wiring 173. Cause problems. Further, there is a problem that a gap is generated by the external connection wiring 172 between the emission surface of the plate-like light source unit 130 and the light guide plate 120.

  Next, a structure in which the plate-like light source unit 130 is filled with the resin material 175 will be described with reference to FIG. FIG. 6A is a plan view of the plate-like light source unit 130 as viewed from above. The inside of the container surrounded by the side surface 169 is filled with a resin material 175. This resin material 175 covers the other portions except for the upper surface of the LED 150. FIG. 6B is a cross-sectional view. The resin material 175 is filled between the LEDs 150, and is filled to the same height as the thickness of the LEDs 150 so that the upper surface of the LEDs 150 is exposed to the outside.

  If the heights of the upper end of the side surface 169 and the upper surface of the LED 150 are made uniform, the light exit surface including the surface of the resin material 175 can be made flat. However, the height of the side surface 169 may be increased to some extent so that an air layer is formed between the light guide plate 120 and the upper surface of the LED 150, and the upper end of the side surface 169 may be brought into contact with the light guide plate 120.

  In FIG. 6C, the metal substrate 161 is surrounded by a frame-shaped side surface 169. It is also possible to omit the step of processing the metal substrate 161 from a flat state into a box shape. In FIG. 6D, the frame-shaped side surface is removed after the resin material 175 is filled. This simplifies processing and facilitates drawing of the external connection wiring 173. In addition, when light leaks from the side surface, it is possible to form a light shielding portion on the side surface by performing a process such as painting the side surface.

  FIG. 7 is a diagram illustrating a lead-out structure for taking out the external connection wiring 173 to the outside. As shown in the plan view of FIG. 7A, a notch (opening) 176 is provided in the longitudinal end surface of the side surface 169, and the external connection wiring 173 is inserted into the notch 176 and drawn out to the outside.

  As shown in a perspective view in FIG. 7B, the notch 176 is provided on the extension line of the external connection terminal 171 with a width equivalent to the wire diameter of the external connection wiring 173. By setting the notch 176 to have a width equal to the wire diameter of the external connection wiring 173, it is possible to prevent the so-called protrusion of the resin material 175 to the outside through the gap of the notch 176.

  7C, when the external connection wiring 173 is pulled out from the notch 176 of the side surface 169, the external connection wiring 173 does not overlap the upper end portion of the side surface 169, and the plate-like light source unit 130 The increase in thickness is suppressed. When light leaks from the notch 176, a light shielding member can be formed on the resin material 175 in the vicinity of the notch 176 or can be colored.

  FIG. 8A is a principal cross-sectional view illustrating a structure in which a reflective layer 174 is formed on the upper surface of the resin material 175. When the plate-like light source unit 130 is disposed close to the light guide plate 120, the light reflected by the light guide plate 120 is reflected by the reflective layer 174 and is emitted toward the light guide plate 120 again. The reflective layer 174 is preferably an achromatic color, but can be colored when the luminance is corrected for a specific color. Further, by forming the reflective layer 174 with a material having high reflectance and thermal conductivity such as titanium oxide, it is possible to improve the heat dissipation effect.

  FIG. 8B is a cross-sectional view of a main part for explaining a structure in which a cone-shaped reflection surface 155 is removed and a member that scatters light is mixed into the resin material 175. Of the light emitted from the fluorescent light emitting unit 156, the light incident on the resin material 175 is scattered and partially emitted to the light guide plate 120 side. As described above, the surface insulating layer 164 having high reflectivity is provided on the upper surface of the metal substrate 161, and the light reflected by the surface insulating layer 164 is emitted to the light guide plate 120 side. The surface insulating layer 164 is also preferably an achromatic color, but coloring is also effective when correcting the luminance for a specific color.

  FIG. 9 is a development view illustrating the structure of the backlight 110 that houses the plate-like light source unit 130 and the light guide plate 120. The upper storage case 181 and the lower storage case 182 sandwich and hold the plate-like light source unit 130 and the light guide plate 120. A concave portion 184 is provided on a side surface of the upper storage case 181, and a convex portion 185 is provided on a side surface of the lower storage case 182. The convex portion 185 is fitted into the concave portion 184, whereby the upper storage case 181. And the lower storage case 182 are fixed, and the plate-like light source unit 130 and the light guide plate 120 are held therein.

  A window 183 is opened in the upper storage case 181 so that light emitted from the light guide plate 120 is applied to the liquid crystal display panel. The upper storage case 181 and the lower storage case 182 have a notch (opening) 186 through which the external connection wiring 173 passes.

  FIG. 10 is a diagram for explaining the positional relationship between the plate-like light source unit 130 and the light guide plate 120 stored in the lower storage case 182, and FIG. 10A is a plate shape stored in the lower storage case 182. 2 is a schematic plan view showing a light source unit 130 and a light guide plate 120. FIG. A pressing member 188 is provided between the side surface of the lower storage case 182 and the plate-like light source unit 130, and the plate-like light source unit 130 is held so that the light exit surface is in close contact with the side surface of the light guide plate 120. . This is to prevent light from leaking from the gap between the plate-like light source unit 130 and the light guide plate 120. Reference numeral 178 denotes a light shielding member made of, for example, a colored tape, and the light shielding member 178 is attached to prevent light leakage from between the plate-like light source unit 130 and the light guide plate 120.

  FIG. 10B is a schematic cross-sectional view showing a surface in which the side surface (light incident surface) of the light guide plate 120 is in contact with the light exit surface of the plate light source unit 130. In the plate-like light source unit 130, the light exit surface and the light incident surface of the light guide plate 120 have substantially the same thickness, so that light is prevented from leaking from the gap. Similarly to FIG. 10A, a light shielding member 178 is provided at a location where light leaks. The light shielding member 178 may be formed of a colored tape, may be formed on the plate-like light source unit 130 by printing / coating, or may be formed by coloring the resin 175 or the reflective layer 174.

  Further, as shown in FIG. 10A, a pressing member 188 is provided between the plate-like light source unit 130 and the lower storage case 182, and the plate-like light source unit 130 has a light output surface as a side surface of the light guide plate 120. At the same time, the pressing member 188 creates a gap 189 between the side wall of the lower storage case 182 and the plate-like light source unit 130. Air can be convected by the gap 189, and the heat radiation efficiency of the plate-like light source unit 130 is improved.

  FIG. 11 is a plan view illustrating a structure in which the inner surface of the lower storage case 182, the back surface of the plate-like light source unit 130, and the side surface of the light guide plate 120 are held in contact with each other. The inner side surface of the lower storage case 182 defines the positions of the plate-like light source unit 130 and the light guide plate 120. However, in the structure shown in FIG. 11, when the thermal conductivity of the lower storage case 182 is low, there arises a problem that the heat radiation efficiency of the plate-like light source unit 130 is lowered. For this purpose, a heat conductive member 179 having a high thermal conductivity is provided on the side wall of the lower storage case 182 in contact with the back surface of the plate-like light source unit 130.

  FIG. 12 is a developed view of the backlight 110 for explaining a structure in which the plate-like light source unit 130 and the light guide plate 120 are held in contact with the inner surface of the lower storage case 182. The heat conducting member 179 is formed to overlap the upper storage case 181 as well as the lower storage case 182. In FIG. 12, a window is opened at the position of the heat conducting member 179 to improve heat dissipation efficiency by air convection. Further, even if the heat conducting member 179 is provided at the position of the window, it is naturally possible to improve the heat radiation efficiency.

  FIG. 13 is a development view of the liquid crystal display device according to the present invention in which the liquid crystal display panel 1 is mounted on the backlight 110. The liquid crystal display panel 1 is mounted on the window 183 side from which the light from the backlight 110 is emitted. An optical sheet 121 is provided between the liquid crystal display panel 1 and the backlight 110 as necessary. A control circuit 80 is connected to the liquid crystal display panel 1 via a flexible substrate 70.

  14A and 14B are schematic views for explaining a structure in which the liquid crystal display panel 1 is mounted on the backlight 110. FIG. 14A is a cross-sectional view, and FIG. 14B is a plan view seen from the side. As shown in FIG. 14A, the light output surface of the plate-like light source unit 130 and the light incident surface of the light guide plate 120 are in close contact with each other. The flexible substrate 70 is bent and extends to the back surface of the backlight 110, and a control circuit 80 is provided on the back surface of the backlight 110.

  Further, as shown in FIG. 14B, a notch 186 is provided on the side surface of the backlight 110, and the external connection wiring 173 is drawn out from the notch 186 and connected to the control circuit 80. Thus, the position of the notch 186 is provided so as to be close to the position where the control circuit 80 is disposed.

  FIG. 15 is a development view illustrating a planar light source unit in which the plate-shaped light source unit 130 is formed in a planar shape. As shown in FIG. 15A, the plurality of LEDs 150 are arranged in a matrix to form a planar light source. Also, as shown in FIG. 15B, a flexible wiring 177 is provided on the back surface to supply a voltage to the LED 150. Connection between the flexible substrate 177 and the LED 150 is performed through a notch (opening) 176 provided on the back surface of the metal substrate 161. A connector 172 is provided at the end of the flexible substrate 177 and can be connected to the control circuit 80 or the like.

It is a block diagram which shows schematic structure of the liquid crystal display device which is embodiment of this invention. It is the schematic which shows the light emitting diode of the liquid crystal display device which is embodiment of this invention. It is the schematic which shows the state which mounted the light emitting diode of the liquid crystal display device which is embodiment of this invention on the metal substrate. It is the schematic which shows the plate-shaped light source part of the liquid crystal display device which is embodiment of this invention. It is the schematic which shows the plate-shaped light source part of the liquid crystal display device which is embodiment of this invention. It is the schematic which shows the plate-shaped light source part of the liquid crystal display device which is embodiment of this invention. It is the schematic which shows the plate-shaped light source part of the liquid crystal display device which is embodiment of this invention. It is a schematic sectional drawing which shows the state which mounted the light emitting diode of the liquid crystal display device which is embodiment of this invention on the metal substrate. It is a general | schematic expanded view which shows the backlight of the liquid crystal display device which is embodiment of this invention. It is the schematic which shows the backlight of the liquid crystal display device which is embodiment of this invention. It is the schematic which shows the backlight of the liquid crystal display device which is embodiment of this invention. It is a general | schematic expanded view which shows the backlight of the liquid crystal display device which is embodiment of this invention. 1 is a schematic development view showing a state in which a liquid crystal panel is mounted on a backlight of a liquid crystal display device according to an embodiment of the present invention. It is the schematic which shows the state which mounts a liquid crystal panel in the backlight of the liquid crystal display device which is embodiment of this invention. It is a general | schematic expanded view which shows the planar light source part of the liquid crystal display device which is embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Liquid crystal display panel, 2 ... TFT substrate, 5 ... Drive circuit, 6 ... Drive circuit, 8 ... Pixel part, 9 ... Display area, 10 ... Switching element, 12... Pixel electrode, 13... Retention capacitor portion, 21... Gate wiring (scanning signal line), 22... Video signal line, 70. -Terminal, 80 ... Control circuit, 110 ... Back light, 120 ... Light guide plate, 121 ... Optical sheet, 130 ... Plate light source unit, 150 ... LED, 151 ... LED chip, 152... Wire, 153... Chip terminal, 154... Chip mounting portion, 155... Cone-shaped reflection surface, 156. ..P electrode, 159... N electrode, 160 .. mounting substrate, 161 ..Metal substrate, 162 ... insulating layer, 163 ... wiring, 164 ... surface insulating layer, 165 ... pad, 166 ... mark, 167 ... mark, 168 ... external terminal 169 ... side surface, 171 ... external connection terminal, 172 ... connector, 173 ... external connection wiring, 174 ... reflective resin material, 175 ... resin material, 176 ... notch 177 ... Back FPC, 178 ... Shading member, 179 ... Heat conduction part, 180 ... Back light, 181 ... Upper storage case, 182 ... Lower storage case, 183 ... Window, 184 ... concave portion, 185 ... convex portion, 186 ... case notch, 187 ... plate-like light source holding portion, 188 ... pressing portion, 189 ... gap.

Claims (3)

A liquid crystal display panel configured by sandwiching a liquid crystal layer between a pair of transparent substrates having electrodes for pixel formation on the inner surface;
A backlight for illuminating the back of the liquid crystal display panel with illumination light;
With
The backlight includes a plurality of light emitting elements, a circuit board on which the plurality of light emitting elements are arranged, and a metal case that houses the circuit board, and a resin material is filled on the circuit board inside the metal case. And a liquid crystal display device which is integrally formed. A liquid crystal display panel configured by sandwiching a liquid crystal layer between a pair of transparent substrates having electrodes for pixel formation on the inner surface;
A planar light source device for illuminating the liquid crystal display panel with illumination light on the back;
With
The planar light source device includes a plurality of light emitting diodes arranged in a line, a circuit board that electrically connects the plurality of light emitting diodes, and a case having a side surface and a bottom surface that accommodates the circuit board. The liquid crystal display device is characterized in that a resin material is filled between the plurality of light emitting diodes and the side surface inside the case. A liquid crystal display panel configured by sandwiching a liquid crystal layer between a pair of transparent substrates having electrodes for pixel formation on the inner surface;
A backlight for illuminating the back of the liquid crystal display panel with illumination light;
A control unit for controlling the liquid crystal display panel;
A liquid crystal display device comprising:
The backlight includes a light guide plate and a plate-like light source unit formed along one side of the light guide plate,
The plate-like light source unit has a light emitting surface, a bottom surface facing the light emitting surface, and a side surface formed around the bottom surface,
The bottom surface has a metal surface, an insulating layer covering the metal surface, and a wiring provided on the insulating layer,
A plurality of light emitting diodes are electrically connected to the wiring,
An opening is formed in the side or bottom surface,
Connection wiring for electrically connecting the plurality of light emitting diodes and the control unit is disposed in the opening,
A liquid crystal display device, wherein a resin layer is formed on the insulating layer.

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