JP2008053069A - Light-emitting diode - Google Patents

Light-emitting diode Download PDF

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JP2008053069A
JP2008053069A JP2006228544A JP2006228544A JP2008053069A JP 2008053069 A JP2008053069 A JP 2008053069A JP 2006228544 A JP2006228544 A JP 2006228544A JP 2006228544 A JP2006228544 A JP 2006228544A JP 2008053069 A JP2008053069 A JP 2008053069A
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emitting diode
light
light emitting
guide plate
resin
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JP4753431B2 (en
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Kimihiko Sudo
公彦 須藤
Daisuke Nakahara
大輔 仲原
Norio Nakazato
典生 中里
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Hitachi Lighting Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting diode module in which a light guide plate for color mixture having a recessed part for housing a light-emitting diode element and a light diffusion sheet arranged on a surface opposed to the recessed part and a sub-mount substrate mounting the light-emitting diode element are sealed by resin, and which is improved in reliability as a light source by suppressing color unevenness caused by interface separation between the sealed resin and the light guide plate for color mixture. <P>SOLUTION: The light-emitting diode element uses a transparent soft resin as a sealing resin and a fine space is provided between the sealing resin and the light guide plate for color mixture. Furthermore, the recessed part of the light guide plate for color mixture is made a hemisphere. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、複数個の発光ダイオード素子を用いた発光ダイオードモジュールの構造及び該発光ダイオードを用いたエッジライト方式のバックライトに関するものである。   The present invention relates to a structure of a light emitting diode module using a plurality of light emitting diode elements and an edge light type backlight using the light emitting diodes.

携帯電話や携帯情報端末機等に使用される小型の液晶パネル用バックライトの光源には、一般に低出力タイプの発光ダイオード素子が用いられている。一方、テレビやパソコン等、大きな画面が必要となる液晶表示装置には、高い光出力が得られる冷陰極管が使用されている。ところが近年、１Ｗ程度の電力を投入することが可能な高出力タイプの発光ダイオード素子の実用化に伴い、これらを用いた大型液晶表示装置での利用が可能な発光ダイオードを光源としたバックライトモジュールの開発が活発化している。   As a light source for a backlight for a small liquid crystal panel used in a mobile phone, a portable information terminal, or the like, a low output type light emitting diode element is generally used. On the other hand, in a liquid crystal display device that requires a large screen, such as a television or a personal computer, a cold cathode tube capable of obtaining a high light output is used. However, in recent years, with the practical application of high-power type light-emitting diode elements capable of supplying about 1 W of power, a backlight module using a light-emitting diode that can be used in a large-sized liquid crystal display device using these as a light source. Development is active.

従来の冷陰極管を使用したエッジライト方式の面状照明装置の断面図を図１に示す。このような面状照明装置は、光を透過する材料から成る矩形状の導光板（以下、主導光板）の側面に、線状光源である冷陰極管が対向配置された構造から成る。冷陰極管から出射した白色光は、主導光板の側面から入射し、内部で反射を繰り返しながら主導光板の光出射面から面状に取り出される。ここで、主導光板に用いられる部材は、たとえば高い光の透過性を有するアクリルやポリカーボネート等の硬質性の樹脂が用いられる。   FIG. 1 shows a cross-sectional view of an edge light type planar illumination device using a conventional cold cathode tube. Such a planar illumination device has a structure in which a cold cathode tube, which is a linear light source, is disposed opposite to a side surface of a rectangular light guide plate (hereinafter, a main light guide plate) made of a material that transmits light. White light emitted from the cold-cathode tube enters from the side surface of the main light guide plate, and is extracted in a planar shape from the light output surface of the main light plate while being repeatedly reflected inside. Here, as a member used for the main light plate, for example, a hard resin such as acrylic or polycarbonate having high light transmittance is used.

これに対して、バックライトモジュールの光源として発光ダイオードを用いた場合、色再現範囲の向上や水銀レス化等を実現できるため、液晶表示装置を高機能化することが可能となる。   On the other hand, when a light emitting diode is used as the light source of the backlight module, the color reproduction range can be improved and mercury-free operation can be realized, so that the liquid crystal display device can be enhanced.

発光ダイオード素子は点光源であることから、線状光源が必要とされるエッジライト方式のバックライトモジュールに適用するためには、図２に示したような、レフを備えたベース基板上に１個から４個程度の発光ダイオード素子を実装し、該発光ダイオード素子を保護するとともに、光取出し効率を高めるために樹脂を用いて封止した発光ダイオードパッケージを、図３に示したように、長尺の配線基板の長手方向に沿って複数個実装し、主導光板の側面に対向する面に配置する。   Since the light emitting diode element is a point light source, in order to be applied to an edge-light type backlight module that requires a linear light source, the light emitting diode element is formed on a base substrate having a reflex as shown in FIG. As shown in FIG. 3, a light emitting diode package in which about 4 to 4 light emitting diode elements are mounted, the light emitting diode elements are protected and sealed with a resin to increase the light extraction efficiency is long. A plurality of wiring boards are mounted along the longitudinal direction of the wiring board, and are arranged on a surface facing the side surface of the main light guide plate.

ここで、白色光源に発光ダイオードを用いることの利点である色再現範囲を向上させるためには、赤色，緑色，青色の三色の発光ダイオード素子を用い、これらを混色して白色化する方法が最も有効である。そこで一般に、各色の発光ダイオード素子を各々パッケージングした発光ダイオードを用いて、長尺の配線基板の長手方向に沿って複数個配置する構成が用いられる（例えば参考文献１）。また、赤色，青色，緑色の三色の発光ダイオード素子を一組としてサブマウント基板上に搭載した後、樹脂を用いて封止した発光ダイオードパッケージが用いられることもある（例えば、特許文献２）。   Here, in order to improve the color reproduction range, which is an advantage of using a light emitting diode as a white light source, there is a method in which light emitting diode elements of three colors of red, green, and blue are mixed and whitened by mixing them. Most effective. Therefore, in general, a configuration is used in which a plurality of light emitting diode elements of each color are packaged and arranged in the longitudinal direction of a long wiring board (for example, Reference 1). In addition, a light emitting diode package may be used in which light emitting diode elements of three colors of red, blue, and green are mounted as a set on a submount substrate and then sealed with a resin (for example, Patent Document 2). .

このような発光ダイオードパッケージから出射する光は、指向性を有するため、主導光板側面の光入射面において輝度ムラが生じやすい。そこで、輝度ムラを低減させるため、例えば、主導光板側面の光入射面に形成した凹部内に発光ダイオードパッケージを配置する構造が用いられる。（例えば特許文献３，特許文献４）
特開２００５−１９６９８９号公報 特開平８−１１６４０１号公報 特開２００３−１２３５２５号公報 特開２００６−１９１０４号公報 Since the light emitted from such a light emitting diode package has directivity, luminance unevenness tends to occur on the light incident surface on the side of the main light guide plate. Therefore, in order to reduce luminance unevenness, for example, a structure is used in which the light emitting diode package is disposed in a recess formed in the light incident surface on the side of the main light guide plate. (For example, Patent Document 3 and Patent Document 4)
JP 2005-196989 A JP-A-8-116401 JP 2003-123525 A JP 2006-19104 A

エッジライト方式のバックライト光源には、小型化と高輝度化が求められている。また、主導光板の端面に入射する白色光は、色ムラや輝度ムラが均一であることが望ましい。   Edge light type backlight light sources are required to be small in size and high in luminance. Further, it is desirable that the white light incident on the end face of the main light plate has uniform color unevenness and brightness unevenness.

通常、発光ダイオードを光源としたバックライトは、発光ダイオードパッケージを長尺状の銅やアルミ等の金属材料を基材とした金属配線基板上に複数個配置する。しかしながら、このような、発光ダイオードパッケージを直列に配置した方式のバックライトは光利用効率が低いため、テレビやパソコン等、携帯電話等に比べて、より大きな画面が必要となる液晶表示装置に適用する場合、必要とされる画面輝度が得られなく、また、小型化を諮るために主導光板端面の入射面の近傍に発光ダイオードパッケージを配置する必要があるため、隣り合う発光ダイオードパッケージによって生じる輝度ムラが問題となっていた。   Usually, in a backlight using a light emitting diode as a light source, a plurality of light emitting diode packages are arranged on a metal wiring substrate having a long metal material such as copper or aluminum as a base material. However, such a backlight with a light emitting diode package arranged in series has low light utilization efficiency, so it can be applied to liquid crystal display devices that require a larger screen than TVs, personal computers, mobile phones, etc. In this case, the required screen brightness cannot be obtained, and the light emitting diode package needs to be arranged in the vicinity of the incident surface of the end face of the main light plate in order to reduce the size. Unevenness was a problem.

そこでこれらの課題を解決するため、主導光板端面の面積と同じ光出射面を備えた長尺形状の導光板（以下、混色用導光板）を用いて、該混色用導光板に発光ダイオード素子を収納するための凹部（以下、封止空間）を一つあるいは複数個形成し、該凹部に発光ダイオード素子を搭載したサブマウント基板を配置した後に、透明性軟質樹脂を用いて封止し、主導光板と混色用導光板の間に光拡散シートを配置した方式を用いることにより、色ムラ、輝度ムラが少ない白色光が得られ、光利用効率にも優れるために小型で高輝度なバックライト光源を得ることができる。また、主導光板の側面に凹部等を形成する必要がないことから、冷陰極管からの置き換えが容易に行える。   Therefore, in order to solve these problems, a long light guide plate (hereinafter referred to as a color mixture light guide plate) having the same light exit surface as the area of the end face of the main light guide plate is used, and a light emitting diode element is provided on the color mixture light guide plate. One or a plurality of recesses (hereinafter referred to as sealing spaces) for storage are formed, a submount substrate on which a light emitting diode element is mounted is disposed in the recesses, and then sealed with a transparent soft resin. By using a method in which a light diffusion sheet is placed between the light plate and the color mixing light guide plate, white light with little color unevenness and brightness unevenness can be obtained, and a small and high-brightness backlight light source can be obtained because of excellent light utilization efficiency. Obtainable. Further, since it is not necessary to form a recess or the like on the side surface of the main light guide plate, the replacement from the cold cathode tube can be easily performed.

しかしながら、このような方式のバックライト光源の場合、発光ダイオード素子を直列に配列するための長尺状の金属配線基板と、アクリルやポリカーボネート等の樹脂材料から成る長尺状の混色用導光板との熱膨張率の差により、発光ダイオード素子を封止した透明性軟質樹脂が、混色用導光板の凹部の界面から剥離するという問題があった。   However, in the case of such a backlight light source, a long metal wiring board for arranging light emitting diode elements in series, and a long light-mixing light guide plate made of a resin material such as acrylic or polycarbonate, Due to the difference in coefficient of thermal expansion, there was a problem that the transparent soft resin encapsulating the light emitting diode element was peeled off from the interface of the concave portion of the color mixing light guide plate.

このような界面剥離は混色用導光板の凹部内おいて局所的に生じるため、発光ダイオード素子から出射した光の混色性を低下させ、混色用導光板の光出射面での色ムラが大きくなるとともに、光源としての信頼性が低下する問題があった。   Such interfacial peeling locally occurs in the recesses of the color mixing light guide plate, so that the color mixing property of the light emitted from the light emitting diode element is reduced and the color unevenness on the light emitting surface of the color mixing light guide plate is increased. At the same time, there is a problem that reliability as a light source is lowered.

そこで本発明は、上記課題に鑑みて、発光ダイオード素子を収納するための封止空間を設けた混色用導光板と、該封止空間内に発光ダイオード素子を搭載したサブマウント基板を透明性軟質樹脂により封止した発光ダイオードモジュールにおいて、封止樹脂の界面剥離により生じる色ムラを抑え、光源としての信頼性を高めた発光ダイオードモジュールを提供することを目的とする。   Accordingly, in view of the above problems, the present invention provides a color mixing light guide plate provided with a sealing space for housing a light emitting diode element, and a submount substrate on which the light emitting diode element is mounted in the sealing space. An object of the present invention is to provide a light-emitting diode module which is improved in reliability as a light source by suppressing color unevenness caused by interface peeling of the sealing resin in a light-emitting diode module sealed with resin.

本発明は上記課題を解決するために、発光ダイオード素子をゲル状の透明性の軟質封止樹脂を用い、あらかじめ主導光板の発光ダイオード素子収納用の凹部と同じ形状に成形した後に主導光板を搭載し、更に、混色用導光板の発光ダイオード素子を収納する凹部を半球体としたことを特徴としている。   In order to solve the above problems, the present invention uses a gel-like transparent soft sealing resin to preliminarily mold the light emitting diode element into the concave shape for accommodating the light emitting diode element of the main light plate, and then mount the main light plate. Further, the concave portion for accommodating the light emitting diode element of the color mixing light guide plate is a hemisphere.

本発明により構成された発光ダイオードモジュールによれば、あらかじめ、封止樹脂を混色用導光板の発光ダイオード素子を収納する凹部の形状と同形状に成形し、その後に混色用導光板を搭載するため、封止樹脂と混色用導光板の間は微少空間が形成され、透明性軟質性樹脂の界面は平滑な状態を保つことができる。そのため、透明性軟質樹脂の局所的な剥離によって生じる色ムラや信頼性低下を解決できるとともに、凹部の形状を半球体とすることにより、透明性軟質樹脂と混色用導光板の間に微少な空間が存在していても、光利用効率の低下を抑えることができる。また、封止用樹脂に透明性軟質樹脂を用いることにより、長尺の金属配線基板と混色用導光板の熱膨張の差によって封止樹脂に加わる応力を緩和することが可能となり、封止樹脂の金属配線基板からの剥離を抑制することができる。   According to the light emitting diode module configured according to the present invention, the sealing resin is formed in advance in the same shape as the shape of the concave portion for housing the light emitting diode element of the color mixing light guide plate, and then the color mixing light guide plate is mounted. A minute space is formed between the sealing resin and the color mixing light guide plate, and the interface of the transparent soft resin can be kept smooth. Therefore, it is possible to solve the color unevenness and reliability degradation caused by local peeling of the transparent soft resin, and by making the shape of the concave portion a hemisphere, there is a small space between the transparent soft resin and the color mixing light guide plate. Even if it exists, a decrease in light utilization efficiency can be suppressed. In addition, by using a transparent soft resin as the sealing resin, it becomes possible to relieve stress applied to the sealing resin due to the difference in thermal expansion between the long metal wiring board and the color mixing light guide plate. The peeling from the metal wiring board can be suppressed.

従って、発光ダイオード素子から出射した光を低下させることなく、混色用導光板の出射面において均一な白色光が得られるとともに、信頼性の高い発光ダイオードモジュールを提供することができる。   Therefore, uniform white light can be obtained on the emission surface of the color mixing light guide plate without reducing the light emitted from the light emitting diode element, and a highly reliable light emitting diode module can be provided.

以下、本発明に係わる発光ダイオードモジュールの実施例について説明する。   Examples of light emitting diode modules according to the present invention will be described below.

図４に、請求項１に記載の発光ダイオードモジュールを用いたバックライトモジュールの模式図を示す。該バックライトモジュールは、主導光板と発光ダイオードモジュールから成る。発光ダイオードモジュールの混色用導光板の出射面から出た白色光は、光拡散シートを通して主導光板に入射させ、バックライトモジュール全体を面発光させる。   FIG. 4 is a schematic view of a backlight module using the light emitting diode module according to claim 1. The backlight module includes a main light plate and a light emitting diode module. White light emitted from the emission surface of the light-mixing light guide plate of the light emitting diode module is incident on the main light plate through the light diffusion sheet to cause the entire backlight module to emit light.

図５に発光ダイオードモジュールの平面図を、図６に図５のＡ−Ａ′の断面図を示す。   FIG. 5 is a plan view of the light emitting diode module, and FIG. 6 is a cross-sectional view taken along line AA ′ of FIG.

該発光ダイオードモジュールは、混色用導光板，光拡散シート，発光ダイオード素子，サブマウント基板，封止樹脂と金属配線基板から成り、混色用導光板には、発光ダイオード素子及びサブマウントを収納するための封止空間（以下、封止空間）が長辺方向に沿って複数個設けられている。また、図６に示したように、封止空間の一方の面は、樹脂を注入するための開口部が設けられている。   The light emitting diode module is composed of a color mixing light guide plate, a light diffusion sheet, a light emitting diode element, a submount substrate, a sealing resin and a metal wiring substrate, and the light mixing diode light guide plate accommodates the light emitting diode element and the submount. A plurality of sealing spaces (hereinafter referred to as sealing spaces) are provided along the long side direction. Moreover, as shown in FIG. 6, the opening part for inject | pouring resin is provided in one surface of sealing space.

本実施例ではサブマウント基板として、発光ダイオード素子を駆動させた際に発生する熱を効果的に放熱するため、熱伝導率が高く電気絶縁材料である窒化アルミを用いた。該窒化アルミを用いたサブマウント基板の片方の表面上に、メッキや蒸着等により銅や金等の金属製の配線層をフォトリソグラフィ技術によりパターニングする。ここで、サブマウント基板として、シリコン等の熱伝導率の高い部材を用いることもでき、このような導電性を有した部材を用いる場合は、別途、配線層と配線基板用基材の間に熱酸化膜や窒化シリコン膜等の絶縁層を設けることによりサブマウント基板として使用することができる。   In this embodiment, aluminum nitride, which has a high thermal conductivity and is an electrically insulating material, is used as the submount substrate in order to effectively dissipate heat generated when the light emitting diode element is driven. A wiring layer made of a metal such as copper or gold is patterned by photolithography on one surface of the submount substrate using the aluminum nitride by plating or vapor deposition. Here, a member having high thermal conductivity such as silicon can also be used as the submount substrate. When such a conductive member is used, it is separately provided between the wiring layer and the substrate for the wiring substrate. By providing an insulating layer such as a thermal oxide film or a silicon nitride film, it can be used as a submount substrate.

サブマウント基板上に形成した発光ダイオード素子を搭載するための配線領域に、発光波長の異なる二種類以上の発光ダイオード素子をはんだや導電性ペーストを用いて接続した後、ボンディングワイヤにより発光ダイオード素子とサブマウントのリード端子間を電気的に接続する。本実施例１では白色光を得るために、赤色、青色、緑色の発光ダイオード素子をサブマウント上に実装した。   After connecting two or more types of light emitting diode elements with different emission wavelengths to the wiring region for mounting the light emitting diode elements formed on the submount substrate using solder or conductive paste, Connect the lead terminals of the submount electrically. In Example 1, red, blue, and green light emitting diode elements were mounted on the submount in order to obtain white light.

また、本実施例１では、発光ダイオード素子の下面と上面にそれぞれアノード電極、カソード電極が形成された素子を用いたが、発光ダイオード素子の上面に両電極が形成された素子や、フリップチップ接続により搭載する発光ダイオード素子等も用いることができる。   In the first embodiment, an element in which an anode electrode and a cathode electrode are formed on the lower surface and the upper surface of the light emitting diode element, respectively, is used. The light emitting diode element etc. which are mounted can also be used.

以上のように発光ダイオード素子を搭載したサブマウント基板を、長尺状の金属配線基板上に導電性ペーストを用いて複数個接続し、サブマウント基板と金属配線基板をボンディングワイヤにより電気的に接続する。   As described above, a plurality of submount substrates mounted with light-emitting diode elements are connected on a long metal wiring substrate using a conductive paste, and the submount substrate and the metal wiring substrate are electrically connected by bonding wires. To do.

リード端子間をボンディングワイヤで全て接続した組立て状態で、混色用導光板の封止空間と同形状の封止空間を備えた金型を、金属配線基板の発光ダイオード素子搭載した面に配置し、透明性軟質樹脂を封止空間内に注入した後に、真空容器中で脱泡処理を行い、恒温槽等を用いて加熱硬化する。   In an assembled state in which all the lead terminals are connected with bonding wires, a mold having a sealing space having the same shape as the sealing space of the light guide plate for color mixing is placed on the surface of the metal wiring board on which the light emitting diode element is mounted, After injecting the transparent soft resin into the sealed space, a defoaming process is performed in a vacuum container, and the resin is heated and cured using a thermostatic chamber or the like.

ここで、透明性軟質樹脂は、ゲルやゴム等のエポキシ樹脂やアクリル樹脂よりも柔らかい材料を用いるのが望ましく、本実施例１ではシリコーンゲルを用いた。   Here, as the transparent soft resin, it is desirable to use a material softer than an epoxy resin such as gel or rubber, or an acrylic resin. In Example 1, silicone gel was used.

これは、封止樹脂の材料として硬質樹脂（例えばエポキシ樹脂）を用いた場合、混色用導光板と金属配線基板の熱膨張係数差によって生じる、長辺方向の応力を緩和できずに、封止樹脂が金属配線基板から剥離するとともに、ボンディングワイヤの切断を引き起こす。そこで、封止樹脂の材料として軟質樹脂を用いることにより、混色用導光板と金属配線基板の熱膨張係数の差によって発生する内部応力は軟質樹脂によって緩和されるため、封止樹脂の金属配線基板からの剥離及びボンディングワイヤの断線を防止することができる。   This is because when a hard resin (for example, epoxy resin) is used as the material of the sealing resin, the stress in the long side direction caused by the difference in thermal expansion coefficient between the color mixing light guide plate and the metal wiring board cannot be relaxed, and sealing is performed. The resin peels from the metal wiring board and causes the bonding wire to be cut. Therefore, by using a soft resin as the sealing resin material, the internal stress generated by the difference in thermal expansion coefficient between the color mixing light guide plate and the metal wiring board is alleviated by the soft resin. Can be prevented from peeling off and the bonding wire from being disconnected.

透明性軟質樹脂を加熱硬化させた後に恒温槽から取り出し、自然冷却させた後に金型を金属配線基板から取り外し、代わりに混色用導光板を搭載する。   After the transparent soft resin is heated and cured, it is taken out from the thermostatic chamber and naturally cooled, and then the mold is removed from the metal wiring board, and a light guide plate for color mixing is mounted instead.

これにより、透明性硬質樹脂による混色導光板の封止空間と透明性軟質樹脂と間の界面には微小な隙間が生じる。そのため、以上の工程によって作製した発光ダイオードモジュールは、図７の発光ダイオードモジュールの詳細断面図において示したように、封止樹脂と混色用導光板の界面が接着していないため、課題となっていた封止樹脂の局所的な剥離を解決することが可能となり、常に平滑な面を保つことができる。   Thereby, a minute gap is generated at the interface between the sealing space of the color mixing light guide plate made of the transparent hard resin and the transparent soft resin. Therefore, the light emitting diode module manufactured by the above process is a problem because the interface between the sealing resin and the color mixing light guide plate is not bonded as shown in the detailed cross-sectional view of the light emitting diode module in FIG. Therefore, it is possible to solve local peeling of the sealing resin, and a smooth surface can always be maintained.

ここで本実施例では、該封止空間の形状を半球体とした。通常、発光ダイオード素子から出射する光は、全方向に放射状に広がっていく。そのため、封止空間の形状を半球体とすることにより、発光ダイオード素子からの光は封止樹脂と混色用導光板の界面で真っ直ぐに入射するため、封止樹脂から出射した光は該界面において乱反射することなく、混色用導光板へ入射するために光は減少しない。   Here, in this embodiment, the shape of the sealed space is a hemisphere. Usually, the light emitted from the light emitting diode element spreads radially in all directions. Therefore, by making the shape of the sealing space hemispherical, light from the light emitting diode element enters straight at the interface between the sealing resin and the color mixing light guide plate. The light does not decrease because it enters the light guide plate for color mixture without irregular reflection.

これが例えば矩形上の封止空間とした場合、発光ダイオード素子から出射した光は、封止樹脂から混色用導光板の界面において、臨界角以上の角度で混色用導光板に到達した光は全反射されるため、混色用導光板内に入射する光は減少してしまう。   When this is a rectangular sealing space, for example, light emitted from the light emitting diode element is totally reflected at the interface of the color mixing light guide plate from the sealing resin at an angle greater than the critical angle. Therefore, the light incident on the color mixing light guide plate is reduced.

最後に、混色用導光板に形成したリフレクタ−部等の外周部に、粘着テープなどの一般的な接着手段を用いて反射シートを接続し、混色用導光板の光出射面に光拡散シートを配置する。これにより、発光ダイオード素子からの出射光を繰り返し反射させ、混色用導光板内での混色効果及び光利用効率を高めることができる。ここで、主導光板と混色用導光板の材質は、透明性に優れたアクリル樹脂やポリカーボネート樹脂を用いて形成するのが望ましく、本実施例１では可視光領域での光透過性に優れたアクリル樹脂を用いた。また、混色用導光板の光出射面にプリズム形状やシボ形状を加工して光拡散機能を付与することによって、光拡散シートの代わりにすることが可能である。   Finally, a reflective sheet is connected to the outer periphery of the reflector portion formed on the color mixing light guide plate using a general adhesive means such as adhesive tape, and a light diffusion sheet is attached to the light exit surface of the color mixing light guide plate. Deploy. Thereby, the emitted light from a light emitting diode element can be repeatedly reflected, and the color mixing effect and light utilization efficiency in the color mixing light guide plate can be enhanced. Here, it is desirable that the main light plate and the color mixing light guide plate are made of acrylic resin or polycarbonate resin having excellent transparency. In the first embodiment, acrylic having excellent light transmittance in the visible light region. Resin was used. Moreover, it is possible to replace the light diffusion sheet by processing a prism shape or a textured shape on the light exit surface of the color mixing light guide plate to give a light diffusion function.

このように形成した発光ダイオードモジュールにおいて、封止樹脂と混色用導光板に存在する微少な空間による光利用効率への影響について確認するため、全光束測定を行った。この結果、混色用導光板を搭載してから樹脂封止を行った場合、つまり封止樹脂が混色用導光板の封止空間内に接着されている従来の構造における全光束値と比べて、本実施例の全光束は同等の値が得られ、本発明の有効性を確認した。   In the light emitting diode module thus formed, total luminous flux measurement was performed in order to confirm the influence on the light utilization efficiency by the minute space existing in the sealing resin and the color mixing light guide plate. As a result, when resin sealing is performed after mounting the color mixing light guide plate, that is, compared to the total luminous flux value in the conventional structure in which the sealing resin is bonded in the sealing space of the color mixing light guide plate, Equivalent values were obtained for the total luminous flux in this example, confirming the effectiveness of the present invention.

図８に請求項２に記載の発光ダイオードモジュールの平面図を、図９に図８のＡ−Ａ′で示した断面図を示す。   FIG. 8 is a plan view of the light emitting diode module according to claim 2, and FIG. 9 is a cross-sectional view taken along line AA ′ of FIG. 8.

実施例１においては、混色用導光板に各サブマウントに対応した封止空間を設けたが、バックライト光源の更なる高輝度化を実現するためには、発光ダイオード素子の単位面積あたりの搭載数を増やす必要がある。その場合、実施例１で述べたサブマウント別に対応した封止空間領域を確保することが困難となる。そこで、図８及び図９に示したように、各サブマウントに対応する封止空間を一体として樹脂封止することによって、単位面積あたりの発光ダイオード素子数を増やすことが可能となる。   In the first embodiment, the color mixing light guide plate is provided with a sealing space corresponding to each submount. However, in order to achieve higher luminance of the backlight light source, the light emitting diode element is mounted per unit area. It is necessary to increase the number. In that case, it becomes difficult to secure a sealed space region corresponding to each submount described in the first embodiment. Therefore, as shown in FIGS. 8 and 9, it is possible to increase the number of light emitting diode elements per unit area by integrally sealing the sealing spaces corresponding to the submounts.

本実施例２における封止用の樹脂材料としては、実施例１と同様にシリコーンゲル等の透明性軟質樹脂を用いることが望ましい。本実施例２の構造の場合、封止樹脂は長辺方向に長い構造となる。封止樹脂は金属配線基板上に接着しているため、封止樹脂と金属配線基板との熱膨張係数差によって、封止樹脂の長手方向へ応力が加わることになる。そこで、封止用の樹脂を軟質樹脂とすることによって、長手方向へ加わる応力を緩和し、ボンディングワイヤの断線を防止することができる。   As the resin material for sealing in the second embodiment, it is desirable to use a transparent soft resin such as silicone gel as in the first embodiment. In the case of the structure of the second embodiment, the sealing resin has a structure that is long in the long side direction. Since the sealing resin is bonded onto the metal wiring board, stress is applied in the longitudinal direction of the sealing resin due to a difference in thermal expansion coefficient between the sealing resin and the metal wiring board. Therefore, by using a soft resin as the sealing resin, stress applied in the longitudinal direction can be relaxed and disconnection of the bonding wire can be prevented.

その他の発光ダイオードモジュールの構造及び形成方法については、実施例１と同様であり、このような構造とすることにより、発光ダイオードの高輝度化が実現できる。   Other light emitting diode module structures and formation methods are the same as those in the first embodiment, and by using such a structure, it is possible to achieve high luminance of the light emitting diode.

以上、本発明を用いることにより、色ムラが少なく光利用効率の高いバックライト用の発光ダイオードモジュールを実現できる。   As described above, by using the present invention, a light emitting diode module for a backlight with little color unevenness and high light utilization efficiency can be realized.

従来の冷陰極管を用いたエッジライト方式バックライトの断面図。Sectional drawing of the edge light system backlight using the conventional cold cathode tube. 従来の発光ダイオードパッケージの断面図。Sectional drawing of the conventional light emitting diode package. 従来の発光ダイオードパッケージを用いたエッジライト方式バックライトの模式図。The schematic diagram of the edge light system backlight using the conventional light emitting diode package. 本実施例１の発光ダイオードモジュールを用いたエッジライト方式バックライトの模式図。FIG. 3 is a schematic diagram of an edge light type backlight using the light emitting diode module according to the first embodiment. 本実施例１の発光ダイオードモジュールの平面図。FIG. 3 is a plan view of the light emitting diode module according to the first embodiment. 図５で示したＡ−Ａ′の断面図。Sectional drawing of AA 'shown in FIG. 図６で示した領域Ｂの拡大図。The enlarged view of the area | region B shown in FIG. 本実施例２の発光ダイオードモジュールの平面図。The top view of the light emitting diode module of the present Example 2. FIG. 図８で示したＣ−Ｃ′の断面図。Sectional drawing of CC 'shown in FIG.

符号の説明Explanation of symbols

１…主導光板、２…側面反射シート、３…裏面反射シート、４…光拡散シート、５…第１集光板、６…第２集光板、７…冷陰極蛍光管、８…反射板、９…透明性樹脂、１０…金属レフ板、１１…配線層、１２…ベース基板、１３…長尺配線基板、１４…発光ダイオードパッケージ、１５…金属配線基板、１６…混色用導光板、１７…光拡散シート、１８…発光ダイオード素子、１９…混色用導光板レフ、２０…透明性軟質樹脂、２１…サブマウント基板、２２…封止空間、２３…ボンディングワイヤ。   DESCRIPTION OF SYMBOLS 1 ... Leading light plate, 2 ... Side surface reflection sheet, 3 ... Back surface reflection sheet, 4 ... Light diffusion sheet, 5 ... 1st light collecting plate, 6 ... 2nd light collecting plate, 7 ... Cold cathode fluorescent tube, 8 ... Reflecting plate, 9 DESCRIPTION OF SYMBOLS ... Transparent resin, 10 ... Metal reflex board, 11 ... Wiring layer, 12 ... Base board, 13 ... Long wiring board, 14 ... Light emitting diode package, 15 ... Metal wiring board, 16 ... Light guide plate for color mixing, 17 ... Light Diffusion sheet, 18 ... light-emitting diode element, 19 ... light guide plate reflex for color mixing, 20 ... transparent soft resin, 21 ... submount substrate, 22 ... sealing space, 23 ... bonding wire.

Claims (7)

発光ダイオード素子を搭載したサブマウント基板を、長辺方向に沿って複数配置した長尺状の金属配線基板と、該サブマウント基板を個別に収納するための凹部を形成し、該凹部を形成した面と対向する面に光拡散シートを配置した透明性硬質樹脂から成る長尺状の混色用導光板と、該凹部内を透明性軟質樹脂で封止して成る発光ダイオードモジュールにおいて、発光ダイオード素子を封止する透明性軟質樹脂と混色用導光板に形成した凹部の間に微少な空間を設けたことを特徴とする発光ダイオードモジュール。   A long metal wiring board in which a plurality of submount substrates on which light-emitting diode elements are mounted is arranged along the long side direction and a recess for individually storing the submount substrate are formed, and the recess is formed. A light emitting diode element comprising: a light guide plate for color mixing made of a transparent hard resin having a light diffusing sheet disposed on a surface facing the surface; and a light emitting diode module in which the concave portion is sealed with a transparent soft resin. A light emitting diode module, characterized in that a minute space is provided between a transparent soft resin that seals and a recess formed in a light guide plate for color mixing. 請求項１に記載の発光ダイオードモジュールにおいて、長尺状の配線基板の長辺方向に沿って発光ダイオード素子を搭載したサブマウント基板を複数配置し、これら複数配置したサブマウント基板を導光板に形成した長辺方向に長い凹部内に収納し、透明性軟質樹脂で封止して成ることを特徴とする発光ダイオードモジュール。   2. The light emitting diode module according to claim 1, wherein a plurality of submount substrates on which light emitting diode elements are mounted are arranged along the long side direction of the elongated wiring substrate, and the plurality of arranged submount substrates are formed on the light guide plate. A light-emitting diode module which is housed in a concave portion long in the long side direction and sealed with a transparent soft resin. 請求項１から請求項２の何れかに記載の発光ダイオードモジュールにおいて、導光板に設けた発光ダイオード素子を収容する凹部及び軟質樹脂の形状が、半球体であることを特徴とする発光ダイオードモジュール。   3. The light emitting diode module according to claim 1, wherein the concave portion for accommodating the light emitting diode element provided on the light guide plate and the shape of the soft resin are hemispheres. 4. 請求項１から請求項３の何れかに記載の発光ダイオードモジュールにおいて、サブマウント基板上に発光波長の異なる二種類以上の発光ダイオード素子を搭載したことを特徴とする発光ダイオードモジュール。   4. The light emitting diode module according to claim 1, wherein two or more types of light emitting diode elements having different emission wavelengths are mounted on the submount substrate. 請求項１に記載の発光ダイオードモジュールにおいて、発光ダイオード素子を封止する樹脂材料がゲルあるいはゴムであることを特徴とする発光ダイオードモジュール。   2. The light emitting diode module according to claim 1, wherein the resin material for sealing the light emitting diode element is gel or rubber. 請求項１に記載の発光ダイオードモジュールにおいて、発光ダイオード素子とサブマウント基板を収容する凹部を形成した混色用導光板の材料がアクリル樹脂あるいはポリカーボネート樹脂であることを特徴とする発光ダイオードモジュール。   2. The light emitting diode module according to claim 1, wherein a material of the color mixing light guide plate in which a concave portion for accommodating the light emitting diode element and the submount substrate is formed is an acrylic resin or a polycarbonate resin. 発光ダイオードを光源としたエッジライト方式のバックライトにおいて、請求項１から請求項６の何れかに記載の発光ダイオードモジュールの光出射面を、矩形状の導光板の端面に対向して配置したことを特徴とするエッジライト方式のバックライトモジュール。
In an edge light type backlight using a light emitting diode as a light source, the light emitting surface of the light emitting diode module according to any one of claims 1 to 6 is disposed to face an end surface of a rectangular light guide plate. This is an edge light type backlight module.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010066618A (en) * 2008-09-12 2010-03-25 Hitachi Ltd Backlight device and liquid crystal display and video display device using the same
WO2011030856A1 (en) * 2009-09-11 2011-03-17 株式会社オプトデザイン Surface illumination method using point light source, linear light source device, and surface illumination device using linear light source device
WO2013035909A1 (en) * 2011-09-09 2013-03-14 Lg Innotek Co., Ltd. Back light unit within resin layer for light-guide and lcd using the same
WO2014015547A1 (en) * 2012-07-26 2014-01-30 深圳市华星光电技术有限公司 Backlight module and display device
WO2014171492A1 (en) * 2013-04-19 2014-10-23 シャープ株式会社 Production method for light emitting devices and production method for illumination device
CN104279528A (en) * 2013-07-02 2015-01-14 Lg伊诺特有限公司 Lighting device and flat panel display having the lighting device
US9136445B2 (en) 2010-01-14 2015-09-15 Lg Innotek Co., Ltd. Light emitting device chip, light emitting device package
JP2016012573A (en) * 2009-08-04 2016-01-21 スリーエム イノベイティブ プロパティズ カンパニー Solid state light with optical guide and integrated thermal guide
JP2018116234A (en) * 2017-01-20 2018-07-26 株式会社エンプラス Luminous flux control member, light-emitting device, surface light source device, and display device
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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0382762U (en) * 1989-12-15 1991-08-22
JPH10247412A (en) * 1997-03-03 1998-09-14 Omron Corp Surface light source device
JPH1153919A (en) * 1997-08-04 1999-02-26 Sanken Electric Co Ltd Semiconductor planar light source
JP2000268619A (en) * 1999-03-15 2000-09-29 Omron Corp Surface light source
JP2001035228A (en) * 1999-07-22 2001-02-09 Seiko Epson Corp Surface light source unit, and display device and electronic apparatus equipped with the same
JP2002217459A (en) * 2001-01-16 2002-08-02 Stanley Electric Co Ltd Light-emitting diode, and backlight device of liquid crystal display using the light-emitting diode as light source
JP2002350846A (en) * 2001-05-22 2002-12-04 Yazaki Corp Led back light
JP2003234008A (en) * 2002-02-06 2003-08-22 Nichia Chem Ind Ltd Surface light emitting device
JP2005353506A (en) * 2004-06-14 2005-12-22 Omron Corp Surface light source apparatus
JP2006019141A (en) * 2004-07-01 2006-01-19 Nec Lcd Technologies Ltd Backlight and liquid crystal display equipped with that backlight
JP2006156039A (en) * 2004-11-26 2006-06-15 Nec Lcd Technologies Ltd Flat light source device and liquid crystal display device using the same

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0382762U (en) * 1989-12-15 1991-08-22
JPH10247412A (en) * 1997-03-03 1998-09-14 Omron Corp Surface light source device
JPH1153919A (en) * 1997-08-04 1999-02-26 Sanken Electric Co Ltd Semiconductor planar light source
JP2000268619A (en) * 1999-03-15 2000-09-29 Omron Corp Surface light source
JP2001035228A (en) * 1999-07-22 2001-02-09 Seiko Epson Corp Surface light source unit, and display device and electronic apparatus equipped with the same
JP2002217459A (en) * 2001-01-16 2002-08-02 Stanley Electric Co Ltd Light-emitting diode, and backlight device of liquid crystal display using the light-emitting diode as light source
JP2002350846A (en) * 2001-05-22 2002-12-04 Yazaki Corp Led back light
JP2003234008A (en) * 2002-02-06 2003-08-22 Nichia Chem Ind Ltd Surface light emitting device
JP2005353506A (en) * 2004-06-14 2005-12-22 Omron Corp Surface light source apparatus
JP2006019141A (en) * 2004-07-01 2006-01-19 Nec Lcd Technologies Ltd Backlight and liquid crystal display equipped with that backlight
JP2006156039A (en) * 2004-11-26 2006-06-15 Nec Lcd Technologies Ltd Flat light source device and liquid crystal display device using the same

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010066618A (en) * 2008-09-12 2010-03-25 Hitachi Ltd Backlight device and liquid crystal display and video display device using the same
JP2016012573A (en) * 2009-08-04 2016-01-21 スリーエム イノベイティブ プロパティズ カンパニー Solid state light with optical guide and integrated thermal guide
US8690380B2 (en) 2009-09-11 2014-04-08 Opto Design, Inc. Surface illumination method using point light source, linear light source device, and surface illumination device using linear light source device
CN102483199A (en) * 2009-09-11 2012-05-30 Opto设计股份有限公司 Surface illumination method using point light source, linear light source device, and surface illumination device using linear light source device
WO2011030856A1 (en) * 2009-09-11 2011-03-17 株式会社オプトデザイン Surface illumination method using point light source, linear light source device, and surface illumination device using linear light source device
US9136445B2 (en) 2010-01-14 2015-09-15 Lg Innotek Co., Ltd. Light emitting device chip, light emitting device package
US9678382B2 (en) 2011-09-09 2017-06-13 Lg Innotek Co., Ltd. Light unit and a LCD liquid crystal display comprising the light unit
WO2013035909A1 (en) * 2011-09-09 2013-03-14 Lg Innotek Co., Ltd. Back light unit within resin layer for light-guide and lcd using the same
USRE48690E1 (en) 2011-09-09 2021-08-17 Lg Innotek Co., Ltd. Light unit and a LCD liquid crystal display comprising the light unit
WO2014015547A1 (en) * 2012-07-26 2014-01-30 深圳市华星光电技术有限公司 Backlight module and display device
WO2014171492A1 (en) * 2013-04-19 2014-10-23 シャープ株式会社 Production method for light emitting devices and production method for illumination device
CN104279528A (en) * 2013-07-02 2015-01-14 Lg伊诺特有限公司 Lighting device and flat panel display having the lighting device
US9726810B2 (en) 2013-07-02 2017-08-08 Lg Innotek Co., Ltd. Lighting device and flat panel display having the lighting device
CN104279528B (en) * 2013-07-02 2017-12-08 Lg伊诺特有限公司 Lighting device and the flat-panel monitor with the lighting device
EP2821693A3 (en) * 2013-07-02 2015-04-01 LG Innotek Co., Ltd. Lighting device and flat panel display having the lighting device
JP2018116234A (en) * 2017-01-20 2018-07-26 株式会社エンプラス Luminous flux control member, light-emitting device, surface light source device, and display device
CN110364514A (en) * 2018-03-26 2019-10-22 日亚化学工业株式会社 Light emitting module
JP2020035738A (en) * 2018-08-28 2020-03-05 隆達電子股▲ふん▼有限公司 Light emitting device and backlight module
CN110867507A (en) * 2018-08-28 2020-03-06 隆达电子股份有限公司 Light emitting device and backlight module
CN110867507B (en) * 2018-08-28 2021-10-08 隆达电子股份有限公司 Light emitting device and backlight module

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