JP2001287070A5 - - Google Patents

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Publication number
JP2001287070A5
JP2001287070A5 JP2001091477A JP2001091477A JP2001287070A5 JP 2001287070 A5 JP2001287070 A5 JP 2001287070A5 JP 2001091477 A JP2001091477 A JP 2001091477A JP 2001091477 A JP2001091477 A JP 2001091477A JP 2001287070 A5 JP2001287070 A5 JP 2001287070A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001091477A
Other versions
JP2001287070A (ja
Filing date
Publication date
Priority claimed from US09/541,019 external-priority patent/US6574024B1/en
Application filed filed Critical
Publication of JP2001287070A publication Critical patent/JP2001287070A/ja
Publication of JP2001287070A5 publication Critical patent/JP2001287070A5/ja
Pending legal-status Critical Current

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JP2001091477A 2000-03-31 2001-03-27 マスク上へのビームのスキャニングによるレーザビームホモジナイゼーション Pending JP2001287070A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/541,019 US6574024B1 (en) 2000-03-31 2000-03-31 Laser beam homogenization by scanning a beam onto a mask
US09/541.019 2000-03-31

Publications (2)

Publication Number Publication Date
JP2001287070A JP2001287070A (ja) 2001-10-16
JP2001287070A5 true JP2001287070A5 (ja) 2005-12-15

Family

ID=24157868

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001091477A Pending JP2001287070A (ja) 2000-03-31 2001-03-27 マスク上へのビームのスキャニングによるレーザビームホモジナイゼーション

Country Status (2)

Country Link
US (1) US6574024B1 (ja)
JP (1) JP2001287070A (ja)

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US7361171B2 (en) 2003-05-20 2008-04-22 Raydiance, Inc. Man-portable optical ablation system
US7143769B2 (en) * 2003-08-11 2006-12-05 Richard Stoltz Controlling pulse energy of an optical amplifier by controlling pump diode current
US7367969B2 (en) * 2003-08-11 2008-05-06 Raydiance, Inc. Ablative material removal with a preset removal rate or volume or depth
US8173929B1 (en) 2003-08-11 2012-05-08 Raydiance, Inc. Methods and systems for trimming circuits
US20050065502A1 (en) * 2003-08-11 2005-03-24 Richard Stoltz Enabling or blocking the emission of an ablation beam based on color of target
US9022037B2 (en) 2003-08-11 2015-05-05 Raydiance, Inc. Laser ablation method and apparatus having a feedback loop and control unit
US20050038487A1 (en) * 2003-08-11 2005-02-17 Richard Stoltz Controlling pulse energy of an optical amplifier by controlling pump diode current
US7115514B2 (en) * 2003-10-02 2006-10-03 Raydiance, Inc. Semiconductor manufacturing using optical ablation
US8921733B2 (en) 2003-08-11 2014-12-30 Raydiance, Inc. Methods and systems for trimming circuits
US7413847B2 (en) * 2004-02-09 2008-08-19 Raydiance, Inc. Semiconductor-type processing for solid-state lasers
US7349452B2 (en) * 2004-12-13 2008-03-25 Raydiance, Inc. Bragg fibers in systems for the generation of high peak power light
US8135050B1 (en) 2005-07-19 2012-03-13 Raydiance, Inc. Automated polarization correction
US7245419B2 (en) * 2005-09-22 2007-07-17 Raydiance, Inc. Wavelength-stabilized pump diodes for pumping gain media in an ultrashort pulsed laser system
US7308171B2 (en) * 2005-11-16 2007-12-11 Raydiance, Inc. Method and apparatus for optical isolation in high power fiber-optic systems
WO2007062130A1 (en) * 2005-11-22 2007-05-31 J.P. Sercel Associates Inc. System and method for laser machining of three-dimensional structures
JP4020957B2 (ja) * 2005-12-19 2007-12-12 ヤマセ電気株式会社 異種材料との接合部を有する金属材料及びレーザーを用いてのその加工方法
US9130344B2 (en) 2006-01-23 2015-09-08 Raydiance, Inc. Automated laser tuning
US8189971B1 (en) 2006-01-23 2012-05-29 Raydiance, Inc. Dispersion compensation in a chirped pulse amplification system
US7444049B1 (en) 2006-01-23 2008-10-28 Raydiance, Inc. Pulse stretcher and compressor including a multi-pass Bragg grating
US8232687B2 (en) 2006-04-26 2012-07-31 Raydiance, Inc. Intelligent laser interlock system
US7822347B1 (en) 2006-03-28 2010-10-26 Raydiance, Inc. Active tuning of temporal dispersion in an ultrashort pulse laser system
US7903326B2 (en) 2007-11-30 2011-03-08 Radiance, Inc. Static phase mask for high-order spectral phase control in a hybrid chirped pulse amplifier system
US8125704B2 (en) 2008-08-18 2012-02-28 Raydiance, Inc. Systems and methods for controlling a pulsed laser by combining laser signals
US8498538B2 (en) 2008-11-14 2013-07-30 Raydiance, Inc. Compact monolithic dispersion compensator
JP2010201501A (ja) * 2009-03-06 2010-09-16 Sony Corp 光加工方法およびマスク
TWI383855B (zh) * 2009-12-01 2013-02-01 Ind Tech Res Inst 雷射掃描裝置及其方法
US20110147620A1 (en) * 2009-12-23 2011-06-23 Imra America, Inc. Laser patterning using a structured optical element and focused beam
TWI484334B (zh) * 2009-12-24 2015-05-11 Univ Nat Taiwan 非揮發記憶體的區域式管理方法
WO2012021748A1 (en) 2010-08-12 2012-02-16 Raydiance, Inc. Polymer tubing laser micromachining
US9120181B2 (en) 2010-09-16 2015-09-01 Coherent, Inc. Singulation of layered materials using selectively variable laser output
US10239160B2 (en) 2011-09-21 2019-03-26 Coherent, Inc. Systems and processes that singulate materials
DE102013008269C5 (de) 2013-05-15 2019-01-24 Precitec Optronik Gmbh Bearbeitungskopf für eine Laserbearbeitungsvorrichtung
JP6476706B2 (ja) * 2014-10-02 2019-03-06 大日本印刷株式会社 照明装置、光学モジュール及び投射装置
JP2016075858A (ja) * 2014-10-08 2016-05-12 大日本印刷株式会社 光走査装置、光学モジュール、照明装置および投射装置
CN108602161B (zh) * 2016-07-08 2020-06-26 华为技术有限公司 一种用于对壳体表面进行光处理的方法和装置
US10151917B2 (en) 2016-10-04 2018-12-11 Christie Digital Systems Usa, Inc. Device for homogenizing laser light using a rotating lens field
KR102130060B1 (ko) * 2017-10-11 2020-07-03 에이피에스홀딩스 주식회사 레이저 가공 방법
CN108544107B (zh) * 2018-04-26 2019-09-10 苏州福唐智能科技有限公司 一种可提高钻孔效率的激光钻孔装置及其钻孔方法
CN111399238B (zh) * 2020-04-27 2021-12-03 中国人民解放军国防科技大学 一种基于行星转的高能激光束近场强度匀化装置
CN117031765A (zh) * 2023-08-10 2023-11-10 北京伯仲汇智科技有限公司 一种激光加工的光束整形系统

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DE19513354A1 (de) 1994-04-14 1995-12-14 Zeiss Carl Materialbearbeitungseinrichtung
JPH09234579A (ja) 1996-02-28 1997-09-09 Semiconductor Energy Lab Co Ltd レーザー照射装置
US5965043A (en) * 1996-11-08 1999-10-12 W. L. Gore & Associates, Inc. Method for using ultrasonic treatment in combination with UV-lasers to enable plating of high aspect ratio micro-vias
US6040552A (en) 1997-01-30 2000-03-21 Jain; Kanti High-speed drilling system for micro-via pattern formation, and resulting structure

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