JP2001284839A - High frequency device - Google Patents

High frequency device

Info

Publication number
JP2001284839A
JP2001284839A JP2000091774A JP2000091774A JP2001284839A JP 2001284839 A JP2001284839 A JP 2001284839A JP 2000091774 A JP2000091774 A JP 2000091774A JP 2000091774 A JP2000091774 A JP 2000091774A JP 2001284839 A JP2001284839 A JP 2001284839A
Authority
JP
Japan
Prior art keywords
housing
lid
frequency device
casing
dielectric substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000091774A
Other languages
Japanese (ja)
Inventor
Hiroaki Nishimura
弘昭 西村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hirose Electric Co Ltd
Original Assignee
Hirose Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hirose Electric Co Ltd filed Critical Hirose Electric Co Ltd
Priority to JP2000091774A priority Critical patent/JP2001284839A/en
Publication of JP2001284839A publication Critical patent/JP2001284839A/en
Pending legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To provide a high frequency device capable of reducing the weight, simplifying the manufacturing, and reducing the costs. SOLUTION: In this high frequency device to be used in a high frequency band, a case body is constituted of an inside part 23 and an outside part 22, and the inside part is constituted of a conductor, and the outside part is constituted of materials whose relative density is smaller than that of the inner side part so that the case body can be made light.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、高周波帯域で用い
られる高周波デバイスに関するものである。
The present invention relates to a high-frequency device used in a high-frequency band.

【0002】[0002]

【従来の技術】近年の情報化技術の発達により、方向性
結合器、電力分配器、フィルタ等の高周波デバイスが各
種分野で用いられるようになってきている。
2. Description of the Related Art With the development of information technology in recent years, high-frequency devices such as directional couplers, power dividers, and filters have been used in various fields.

【0003】従来の高周波デバイスの1例として、図4
及び図5は方向性結合器を示している。方向性結合器1
は、筐体2と、該筐体2内に設けられる第1誘電体基板
3及び第2誘電体基板4と、前記筐体2の蓋5と、前記
筐体2の端面に互いに対向するように接続される各1対
の第1同軸接続部6,7と、前記筐体2の一方の側面に
並列に接続される第2同軸接続部8,9とを備え、トリ
プレート構造を成している。
FIG. 4 shows an example of a conventional high-frequency device.
5 shows a directional coupler. Directional coupler 1
Is arranged so as to face the housing 2, the first dielectric substrate 3 and the second dielectric substrate 4 provided in the housing 2, the lid 5 of the housing 2, and the end surface of the housing 2. And a pair of first coaxial connecting portions 6 and 7 connected to each other, and second coaxial connecting portions 8 and 9 connected in parallel to one side surface of the housing 2 to form a triplate structure. ing.

【0004】前記筐体2は金属製で、直方体に凹部10
を形成させた形状を成し、前記第1及び第2同軸接続部
6,7,8,9を支持可能な肉厚を有し、通常、切削加
工又はダイキャストにより製造される。前記第1誘電体
基板3の上面には銅箔製の主線路11及び副線路12が
設けられ、前記主線路11は前記第1同軸接続部6,7
間を接続し、前記副線路12は記第2同軸接続部8,9
間を接続するように形成されている。前記蓋5は金属製
で、薄板に凸部13を形成させた形状を成し、通常、切
削加工により製造される。該凸部13は前記凹部10に
嵌合可能であり、該凹部10に嵌合した状態で前記凸部
13が前記第2誘電体基板4に当接するように前記凸部
13の突出長は調整されている。
The housing 2 is made of metal and has a rectangular parallelepiped recess 10.
Is formed, and has a thickness capable of supporting the first and second coaxial connection portions 6, 7, 8, 9 and is usually manufactured by cutting or die casting. A main line 11 and a sub line 12 made of copper foil are provided on the upper surface of the first dielectric substrate 3, and the main line 11 is connected to the first coaxial connection portions 6, 7.
And the sub-line 12 is connected to the second coaxial connection portions 8 and 9.
It is formed so as to connect between them. The lid 5 is made of metal, has a shape in which a convex portion 13 is formed on a thin plate, and is usually manufactured by cutting. The protrusion 13 can be fitted into the recess 10, and the protrusion length of the protrusion 13 is adjusted so that the protrusion 13 comes into contact with the second dielectric substrate 4 in a state fitted into the recess 10. Have been.

【0005】前記方向性結合器1を組立てるには、前記
第1同軸接続部6,7及び前記第2同軸接続部8,9を
それぞれ前記筐体2に接続し、前記主線路11及び副線
路12を上向きにした姿勢で第1誘電体基板3を前記凹
部10内に平置きし、前記第2誘電体基板4を前記第1
誘電体基板3上に重合する。その後、前記凸部13を前
記凹部10に嵌合し、前記蓋5を所要数(図5では8
本)のビス14により前記筐体2に接合する。前記凸部
13は前記第2誘電体基板4に当接し、前記第1誘電体
基板3及び第2誘電体基板4は前記筐体2と前記蓋5に
より挟持された状態となる。
To assemble the directional coupler 1, the first coaxial connection portions 6 and 7 and the second coaxial connection portions 8 and 9 are connected to the housing 2, respectively, and the main line 11 and the sub line The first dielectric substrate 3 is placed flat in the concave portion 10 with the 12 facing upward, and the second dielectric substrate 4 is
It polymerizes on the dielectric substrate 3. Thereafter, the convex portion 13 is fitted into the concave portion 10 and the required number of the lids 5 (8 in FIG. 5).
It is joined to the housing 2 by screws 14 of the present embodiment. The protrusion 13 abuts on the second dielectric substrate 4, and the first dielectric substrate 3 and the second dielectric substrate 4 are sandwiched between the housing 2 and the lid 5.

【0006】[0006]

【発明が解決しようとする課題】ところが、上記した従
来の高周波デバイスでは、グランド及びシールド性能の
確保のため筐体を金属製とする必要があり、さらに、同
軸接続部を支持可能なように筐体の厚みを十分に確保す
る必要があった。そのため、筐体の軽量化が図り難いと
いった問題があった。
However, in the above-mentioned conventional high-frequency device, the housing must be made of metal in order to secure the grounding and shielding performance, and the housing must be made so as to support the coaxial connection. It was necessary to ensure sufficient body thickness. Therefore, there is a problem that it is difficult to reduce the weight of the housing.

【0007】また、筐体及び蓋は切削加工又はダイキャ
ストにより製造されるので、製造に手間が掛かり、製造
コストの低減が困難であった。
Further, since the casing and the lid are manufactured by cutting or die-casting, the manufacturing is troublesome, and it has been difficult to reduce the manufacturing cost.

【0008】さらに、前記方向性結合器の場合には、そ
の本来の機能を果たすために蓋を筐体に取付けた状態で
蓋の凸部を第2誘電体基板に当接させると共に前記蓋と
前記筐体間に隙間が生じないように蓋を筐体に密着させ
る必要があった。そのため、筐体及び蓋の加工は極めて
高い精度で行う必要があり、非常に手間が掛かってい
た。
Further, in the case of the directional coupler, in order to fulfill its original function, the convex portion of the lid is brought into contact with the second dielectric substrate with the lid attached to the housing, and the lid is connected to the second dielectric substrate. The lid has to be closely attached to the housing so that no gap is formed between the housings. For this reason, processing of the housing and the lid needs to be performed with extremely high precision, which is very troublesome.

【0009】さらにまた、上記したような筐体及び蓋の
加工の困難さのため、製品の不良率の低減やグランド及
びシールド性能の向上が図り難いといった問題があっ
た。
Further, there is a problem that it is difficult to reduce the defective rate of the product and to improve the grounding and shielding performance due to the difficulty in processing the casing and the lid as described above.

【0010】本発明は上記課題を解決すべくなされたも
のであり、軽量化、製造の簡略化、及びコストの低減化
を図ることのできる高周波デバイスを提供するものであ
る。
SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and it is an object of the present invention to provide a high-frequency device capable of reducing the weight, simplifying the production, and reducing the cost.

【0011】[0011]

【課題を解決するための手段】本発明は、高周波帯域で
用いられる高周波デバイスであって、筐体が内側部分と
外側部分とから成り、前記内側部分が導体であり、前記
外側部分は前記内側部分より比重の小さい材料製である
ことを特徴とするものである。
The present invention relates to a high-frequency device used in a high-frequency band, wherein a housing comprises an inner portion and an outer portion, the inner portion is a conductor, and the outer portion is the inner portion. It is characterized by being made of a material having a smaller specific gravity than the portion.

【0012】好適な態様としては、樹脂製の前記外側筐
体と、該外側筐体に嵌合可能な金属製の前記内側筐体
と、前記内側筐体内に設けられる回路素子と、前記内側
筐体を密閉可能な金属製の蓋とを備え、前記内側筐体と
前記蓋により前記回路素子をシールド可能に構成されて
いる。
In a preferred embodiment, the outer casing made of resin, the inner casing made of metal fittable to the outer casing, a circuit element provided in the inner casing, and the inner casing are provided. A metal lid capable of sealing the body is provided, and the circuit element is configured to be shielded by the inner housing and the lid.

【0013】好ましくは、前記回路素子に接続される金
属製の接続部が前記外側筐体に支持され、前記接続部が
前記内側筐体に接触可能に形成されており、また、前記
内側筐体がプレス加工により製造可能な板材製であり、
さらに、前記蓋が2重に設けられ、該各蓋の間に空気層
が形成されており、さらにまた、前記外側筐体及び蓋の
外面をめっき処理したものである。
[0013] Preferably, a metal connecting portion connected to the circuit element is supported by the outer casing, and the connecting portion is formed so as to be able to contact the inner casing. Is made of a plate material that can be manufactured by pressing,
Further, the lid is provided in two layers, an air layer is formed between the lids, and the outer surfaces of the outer casing and the lid are plated.

【0014】このような構成において、前記接続部が固
定された状態の前記外側筐体に内側筐体を嵌合し、該内
側筐体内に回路素子を配設し、蓋を前記内側筐体に気密
に接合する。
In such a configuration, an inner housing is fitted to the outer housing in a state where the connection portion is fixed, a circuit element is disposed in the inner housing, and a lid is attached to the inner housing. Join airtight.

【0015】[0015]

【発明の実施の形態】以下図面を参照しつつ、本発明の
実施の形態を説明する。
Embodiments of the present invention will be described below with reference to the drawings.

【0016】図1から図3は高周波デバイスの1つであ
る方向性結合器を示している。方向性結合器21は、外
側筐体22と、該外側筐体22に嵌合可能な内側筐体2
3と、該内側筐体23内に設けられる第1誘電体基板2
4、第2誘電体基板25及び内蓋26と、外蓋27と、
前記外側筐体22に接続される各一対の第1同軸接続部
28,29及び第2同軸接続部30,31とを備え、ト
リプレート構造を成している。
FIGS. 1 to 3 show a directional coupler which is one of high-frequency devices. The directional coupler 21 includes an outer housing 22 and an inner housing 2 that can be fitted to the outer housing 22.
3 and a first dielectric substrate 2 provided in the inner casing 23.
4, the second dielectric substrate 25 and the inner lid 26, the outer lid 27,
A pair of first coaxial connection portions 28 and 29 and second coaxial connection portions 30 and 31 connected to the outer casing 22 are provided to form a triplate structure.

【0017】前記外側筐体22は前記内側筐体23より
比重の小さい材料製、例えば、合成樹脂製であり、上方
が開放された箱状を成し、前記第1同軸接続部28,2
9及び第2同軸接続部30,31を支持可能な肉厚を有
している。前記外側筐体22が軽量である分、前記方向
性結合器21自体の軽量化を図ることができる。また、
前記外側筐体22の両端部にはそれぞれ第1外孔32,
33が穿設され、該第1外孔32,33は互いに対向し
ている。また、前記外側筐体22の一方の側面の両端側
にはそれぞれ第2外孔34,35が穿設されている。な
お、前記外側筐体22は、前記第1及び第2外孔32,
33,34,35の取付部のみ金属製とし、前記第1及
び第2同軸接続部28,29,30,31の取付強度を
上げる構造としてもよい。
The outer casing 22 is made of a material having a specific gravity smaller than that of the inner casing 23, for example, a synthetic resin, has a box shape with an open upper part, and has the first coaxial connecting portions 28,2.
9 and the second coaxial connecting portions 30 and 31 are thick enough to be supported. Since the outer casing 22 is lightweight, the weight of the directional coupler 21 itself can be reduced. Also,
A first outer hole 32 is provided at each end of the outer casing 22,
The first outer holes 32 and 33 are opposed to each other. In addition, second outer holes 34 and 35 are formed at both ends of one side surface of the outer casing 22, respectively. The outer casing 22 is provided with the first and second outer holes 32,
Only the attachment portions 33, 34, and 35 may be made of metal, and the first and second coaxial connection portions 28, 29, 30, and 31 may be structured to increase the attachment strength.

【0018】前記内側筐体23は導体の金属製であり、
前記外側筐体22に嵌合可能な嵌合部36と該嵌合部3
6の上端部に形成された外鍔部37とから構成されてい
る。好ましくは、前記内側筐体23は金属板をプレス加
工することにより製造される。したがって、前記内側筐
体23の製造は容易であり、製造コストの削減が可能と
なる。また、前記嵌合部36には前記第1外孔32,3
3に対応してそれぞれ第1内孔38,39が穿設される
と共に前記第2外孔34,35に対応して第2内孔4
0,41が穿設されている。
The inner casing 23 is made of a conductive metal,
A fitting portion 36 capable of fitting to the outer casing 22 and the fitting portion 3
6 and an outer flange 37 formed at the upper end. Preferably, the inner casing 23 is manufactured by pressing a metal plate. Therefore, the manufacture of the inner housing 23 is easy, and the manufacturing cost can be reduced. The fitting portion 36 has the first outer holes 32 and 3.
3, first inner holes 38 and 39 are formed, and second inner holes 4 corresponding to the second outer holes 34 and 35, respectively.
0, 41 are drilled.

【0019】前記第1誘電体基板24の上面には銅箔製
の主線路42と副線路43が形成され、前記主線路42
は直線状を成し、前記第1同軸接続部28,29間を接
続し、前記副線路43はコの字状に形成され、前記第2
同軸接続部30,31間を接続するようになっている。
また、前記内蓋26及び外蓋27は共に金属製で薄板状
を成し、前記内蓋26は前記嵌合部36に嵌入可能な平
面形状を成し、前記外蓋27は前記外鍔部37に重合可
能な平面形状を成している。したがって、前記内蓋26
及び外蓋27の製造時には手間の掛かる切削加工又はダ
イキャストを行う必要がなく、製造が容易であるので、
製造コストの削減が可能となる。
On the upper surface of the first dielectric substrate 24, a main line 42 and a sub line 43 made of copper foil are formed.
Forms a straight line, connects the first coaxial connecting portions 28 and 29, the sub-line 43 is formed in a U-shape, and the second
The coaxial connection parts 30 and 31 are connected.
The inner lid 26 and the outer lid 27 are both made of metal and have a thin plate shape, the inner lid 26 has a planar shape capable of being fitted into the fitting portion 36, and the outer lid 27 has the outer flange portion. 37 has a planar shape that can be polymerized. Therefore, the inner lid 26
Since it is not necessary to perform a complicated cutting process or die casting when manufacturing the outer lid 27 and the manufacturing is easy,
Manufacturing costs can be reduced.

【0020】図3により、前記方向性結合器21の組立
て手順を説明する。
The procedure for assembling the directional coupler 21 will be described with reference to FIG.

【0021】前記外側筐体22に前記内側筐体23の嵌
合部36を嵌合し、前記主線路42及び副線路43を上
向きにした姿勢で第1誘電体基板24を前記嵌合部36
内に平置きする。前記第1同軸接続部28,29をそれ
ぞれ前記第1外孔32,33及び第1内孔38,39に
気密に接続し、前記第2同軸接続部30,31をそれぞ
れ前記第2外孔34,35及び第2内孔40,41に気
密に接続する。前記外側筐体22は十分な厚み及び強度
を備えているので、前記第1同軸接続部28,29及び
第2同軸接続部30,31は前記外側筐体22に堅固に
支持され、また、前記第1同軸接続部28,29及び前
記第2同軸接続部30,31は前記内側筐体23と接触
する。したがって、前記第1同軸接続部28,29、第
2同軸接続部30,31を介して前記内側筐体23等の
グランドをとることが可能となる。
The fitting portion 36 of the inner casing 23 is fitted to the outer casing 22, and the first dielectric substrate 24 is placed in the posture in which the main line 42 and the sub-line 43 face upward.
Place flat inside. The first coaxial connecting portions 28 and 29 are airtightly connected to the first outer holes 32 and 33 and the first inner holes 38 and 39, respectively, and the second coaxial connecting portions 30 and 31 are respectively connected to the second outer holes 34. , 35 and the second inner holes 40, 41 in an airtight manner. Since the outer casing 22 has a sufficient thickness and strength, the first coaxial connecting parts 28 and 29 and the second coaxial connecting parts 30 and 31 are firmly supported by the outer casing 22 and The first coaxial connection portions 28 and 29 and the second coaxial connection portions 30 and 31 are in contact with the inner housing 23. Therefore, it is possible to take the ground of the inner casing 23 and the like via the first coaxial connection portions 28 and 29 and the second coaxial connection portions 30 and 31.

【0022】その後、前記第1誘電体基板24上に前記
第2誘電体基板25を重合し、前記内側筐体23内に前
記内蓋26を水平姿勢で嵌入し、前記第2誘電体基板2
5上に前記内蓋26を重合する。前記内蓋26は所要数
のビス(図示せず)により前記内側筐体23の底面に固
定され、前記第1誘電体基板24及び第2誘電体基板2
5は前記内蓋26と前記内側筐体23の底面により挟持
されることでトリプレート構造をとる。
Thereafter, the second dielectric substrate 25 is superimposed on the first dielectric substrate 24, and the inner lid 26 is fitted in the inner casing 23 in a horizontal posture.
The inner lid 26 is polymerized on the upper surface 5. The inner lid 26 is fixed to the bottom surface of the inner housing 23 by a required number of screws (not shown), and the first dielectric substrate 24 and the second dielectric substrate 2 are fixed.
5 has a tri-plate structure by being sandwiched between the inner lid 26 and the bottom surface of the inner casing 23.

【0023】さらに、前記外蓋27を前記外鍔部37上
に重合し、所要数(図2では8本)のビス44により前
記外鍔部37及び前記外側筐体22に気密に接合する
と、前記第1誘電体基板24及び第2誘電体基板25は
前記外蓋27によりさらにシールドされた状態となる。
したがって、前記第1誘電体基板24及び第2誘電体基
板25は前記内蓋26及び外蓋27により2重にシール
ドされるため、シールド性能は著しく向上する。また、
前記内蓋26と前記外蓋27が共に薄板状であり、両者
の間に空気層45が形成されるので、その分、軽量化を
図ることが可能となる。
Further, when the outer lid 27 is superimposed on the outer flange portion 37 and is air-tightly joined to the outer flange portion 37 and the outer housing 22 by a required number (eight in FIG. 2) of screws 44, The first dielectric substrate 24 and the second dielectric substrate 25 are further shielded by the outer lid 27.
Therefore, the first dielectric substrate 24 and the second dielectric substrate 25 are doubly shielded by the inner lid 26 and the outer lid 27, so that the shielding performance is significantly improved. Also,
Since the inner lid 26 and the outer lid 27 are both thin plate-shaped, and the air layer 45 is formed between them, the weight can be reduced accordingly.

【0024】なお、上記実施の形態においては、方向性
結合器について説明したが、本発明は避雷器、減衰器、
電力分配器及びフィルタ等の他の高周波デバイスについ
ても実施可能である。
Although the directional coupler has been described in the above embodiment, the present invention provides a lightning arrester, an attenuator,
Other high frequency devices, such as power dividers and filters, can be implemented.

【0025】また、前記第2誘電体基板25と前記内蓋
26を一体化してもよい。この場合には、部品点数が減
少し、組立て作業のより一層の簡略化が図れる。
Further, the second dielectric substrate 25 and the inner lid 26 may be integrated. In this case, the number of parts is reduced, and the assembling work can be further simplified.

【0026】さらに、前記外側筐体22と前記外蓋27
の外面に樹脂メッキ等のメッキ処理を施してもよく、こ
の場合には、より優れたシールド性を得ることができ
る。
Further, the outer casing 22 and the outer lid 27
May be subjected to plating treatment such as resin plating, and in this case, more excellent shielding properties can be obtained.

【0027】[0027]

【発明の効果】上記した本発明によれば、筐体が内側部
分と外側部分とから成り、外側筐体は内側筐体より比重
の小さい材料でできているので、筐体の軽量化を図るこ
とができる。
According to the present invention described above, the casing is composed of an inner part and an outer part, and the outer casing is made of a material having a lower specific gravity than the inner casing, so that the weight of the casing is reduced. be able to.

【0028】また、前記内側筐体、蓋及び接続部がそれ
ぞれ金属製で、前記蓋が前記内側筐体を密閉し、前記接
続部が前記内側筐体に接触可能となっているので、グラ
ンド及びシールド性能を向上させることができる。
Further, since the inner housing, the lid and the connecting portion are each made of metal, the lid seals the inner housing, and the connecting portion can come into contact with the inner housing. Shield performance can be improved.

【0029】さらに、前記内側筐体がプレス加工可能な
板材製である場合には、手間の掛かる切削加工やダイキ
ャストを行なう必要がないので、製造が簡略化され、製
造コストの低減が可能となる。
Further, when the inner casing is made of a press-processable plate material, it is not necessary to perform laborious cutting and die casting, so that the production is simplified and the production cost can be reduced. Become.

【0030】さらにまた、前記蓋を2重に設け、該各蓋
の間に空気層を形成した場合には、より一層の軽量化が
図れると共にシールド性能がより一層向上する等種々の
優れた効果が得られる。
Further, when the lids are provided in two layers and an air layer is formed between the lids, various excellent effects such as further reduction in weight and further improvement in shielding performance can be achieved. Is obtained.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施の形態を示す側面図及び部分断面
図である。
FIG. 1 is a side view and a partial sectional view showing an embodiment of the present invention.

【図2】本発明の実施の形態を示す平面図及び部分断面
図である。
FIG. 2 is a plan view and a partial cross-sectional view illustrating an embodiment of the present invention.

【図3】本発明の実施の形態を示す分解斜視図である。FIG. 3 is an exploded perspective view showing the embodiment of the present invention.

【図4】従来例を示す側面図及び部分断面図である。FIG. 4 is a side view and a partial cross-sectional view showing a conventional example.

【図5】従来例を示す平面図及び部分断面図である。FIG. 5 is a plan view and a partial cross-sectional view showing a conventional example.

【符号の説明】[Explanation of symbols]

22 外側筐体 23 内側筐体 24 第1誘電体基板 25 第2誘電体基板 27 外蓋 28 第1同軸接続部 29 第1同軸接続部 30 第2同軸接続部 31 第2同軸接続部 Reference Signs List 22 outer housing 23 inner housing 24 first dielectric substrate 25 second dielectric substrate 27 outer lid 28 first coaxial connection unit 29 first coaxial connection unit 30 second coaxial connection unit 31 second coaxial connection unit

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 高周波帯域で用いられる高周波デバイス
であって、 筐体が内側部分と外側部分とから成り、前記内側部分が
導体であり、前記外側部分は前記内側部分より比重の小
さい材料製であることを特徴とする高周波デバイス。
1. A high-frequency device used in a high-frequency band, wherein a housing includes an inner portion and an outer portion, the inner portion is a conductor, and the outer portion is made of a material having a lower specific gravity than the inner portion. A high-frequency device, comprising:
【請求項2】 樹脂製の前記外側筐体と、 該外側筐体に嵌合可能な金属製の前記内側筐体と、 前記内側筐体内に設けられる回路素子と、 前記内側筐体を密閉可能な金属製の蓋とを備え、 前記内側筐体と前記蓋により前記回路素子をシールド可
能に構成されている請求項1に記載の高周波デバイス。
2. The outer casing made of resin, the inner casing made of metal fittable to the outer casing, a circuit element provided in the inner casing, and the inner casing can be hermetically sealed. The high-frequency device according to claim 1, further comprising: a metal cover, wherein the circuit element is configured to be shielded by the inner housing and the cover.
【請求項3】 前記回路素子に接続される金属製の接続
部が前記外側筐体に支持され、前記接続部が前記内側筐
体に接触可能に形成されている請求項2に記載の高周波
デバイス。
3. The high-frequency device according to claim 2, wherein a metal connecting portion connected to the circuit element is supported by the outer housing, and the connecting portion is formed so as to be able to contact the inner housing. .
【請求項4】 前記内側筐体がプレス加工により製造可
能な板材製である請求項1から請求項3のいずれか1の
請求項に記載の高周波デバイス。
4. The high-frequency device according to claim 1, wherein the inner housing is made of a plate material that can be manufactured by press working.
【請求項5】 前記蓋が2重に設けられ、該各蓋の間に
空気層が形成されている請求項2から請求項4のいずれ
か1の請求項に記載の高周波デバイス。
5. The high-frequency device according to claim 2, wherein said lids are provided in two layers, and an air layer is formed between said lids.
【請求項6】 前記外側筐体及び蓋の外面をめっき処理
した請求項1から請求項5のいずれか1の請求項に記載
の高周波デバイス。
6. The high-frequency device according to claim 1, wherein the outer surfaces of the outer casing and the lid are plated.
JP2000091774A 2000-03-29 2000-03-29 High frequency device Pending JP2001284839A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000091774A JP2001284839A (en) 2000-03-29 2000-03-29 High frequency device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000091774A JP2001284839A (en) 2000-03-29 2000-03-29 High frequency device

Publications (1)

Publication Number Publication Date
JP2001284839A true JP2001284839A (en) 2001-10-12

Family

ID=18607200

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000091774A Pending JP2001284839A (en) 2000-03-29 2000-03-29 High frequency device

Country Status (1)

Country Link
JP (1) JP2001284839A (en)

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