JP2001284297A - 研磨装置、研磨方法および半導体装置の製造方法 - Google Patents

研磨装置、研磨方法および半導体装置の製造方法

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Publication number
JP2001284297A
JP2001284297A JP2000101337A JP2000101337A JP2001284297A JP 2001284297 A JP2001284297 A JP 2001284297A JP 2000101337 A JP2000101337 A JP 2000101337A JP 2000101337 A JP2000101337 A JP 2000101337A JP 2001284297 A JP2001284297 A JP 2001284297A
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JP
Japan
Prior art keywords
complex
film
polishing
temperature
metal film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000101337A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001284297A5 (https=
Inventor
Shuzo Sato
修三 佐藤
Suguru Otorii
英 大鳥居
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2000101337A priority Critical patent/JP2001284297A/ja
Publication of JP2001284297A publication Critical patent/JP2001284297A/ja
Publication of JP2001284297A5 publication Critical patent/JP2001284297A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2000101337A 2000-03-31 2000-03-31 研磨装置、研磨方法および半導体装置の製造方法 Pending JP2001284297A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000101337A JP2001284297A (ja) 2000-03-31 2000-03-31 研磨装置、研磨方法および半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000101337A JP2001284297A (ja) 2000-03-31 2000-03-31 研磨装置、研磨方法および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2001284297A true JP2001284297A (ja) 2001-10-12
JP2001284297A5 JP2001284297A5 (https=) 2007-01-18

Family

ID=18615405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000101337A Pending JP2001284297A (ja) 2000-03-31 2000-03-31 研磨装置、研磨方法および半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP2001284297A (https=)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004004611A (ja) * 2002-03-20 2004-01-08 Seiko Epson Corp 配線基板、電子装置、電気光学装置、並びに電子機器
JP2004004610A (ja) * 2002-03-20 2004-01-08 Seiko Epson Corp 配線基板、電子装置、電気光学装置、並びに電子機器
JP2004327561A (ja) * 2003-04-22 2004-11-18 Ebara Corp 基板処理方法及び基板処理装置
US7148508B2 (en) 2002-03-20 2006-12-12 Seiko Epson Corporation Wiring substrate, electronic device, electro-optical device, and electronic apparatus
WO2010073943A1 (ja) * 2008-12-22 2010-07-01 三菱重工業株式会社 内歯車研削盤
JP2015160276A (ja) * 2014-02-27 2015-09-07 国立大学法人長岡技術科学大学 ポリシング加工方法
KR20160043962A (ko) * 2013-07-19 2016-04-22 국립대학법인 나고야공업대학 금속제 연마 패드 및 그 제조 방법
JP2016119406A (ja) * 2014-12-22 2016-06-30 株式会社荏原製作所 基板処理装置
JP2021146428A (ja) * 2020-03-17 2021-09-27 株式会社東京精密 研削装置

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004004611A (ja) * 2002-03-20 2004-01-08 Seiko Epson Corp 配線基板、電子装置、電気光学装置、並びに電子機器
JP2004004610A (ja) * 2002-03-20 2004-01-08 Seiko Epson Corp 配線基板、電子装置、電気光学装置、並びに電子機器
US7148508B2 (en) 2002-03-20 2006-12-12 Seiko Epson Corporation Wiring substrate, electronic device, electro-optical device, and electronic apparatus
US7529102B2 (en) 2002-03-20 2009-05-05 Seiko Epson Corporation Wiring substrate, electronic device, electro-optical device, and electronic apparatus
US7696519B2 (en) 2002-03-20 2010-04-13 Seiko Epson Corporation Wiring substrate, electronic device, electro-optical device, and electronic apparatus
JP2004327561A (ja) * 2003-04-22 2004-11-18 Ebara Corp 基板処理方法及び基板処理装置
US8758093B2 (en) 2008-12-22 2014-06-24 Mitsubishi Heavy Industries, Ltd. Internal gear grinding machine
JP2010142928A (ja) * 2008-12-22 2010-07-01 Mitsubishi Heavy Ind Ltd 内歯車研削盤
WO2010073943A1 (ja) * 2008-12-22 2010-07-01 三菱重工業株式会社 内歯車研削盤
KR20160043962A (ko) * 2013-07-19 2016-04-22 국립대학법인 나고야공업대학 금속제 연마 패드 및 그 제조 방법
JPWO2015008572A1 (ja) * 2013-07-19 2017-03-02 国立大学法人 名古屋工業大学 金属製研磨パッドおよびその製造方法
KR102127547B1 (ko) 2013-07-19 2020-06-26 국립대학법인 나고야공업대학 금속제 연마 패드 및 그 제조 방법
JP2015160276A (ja) * 2014-02-27 2015-09-07 国立大学法人長岡技術科学大学 ポリシング加工方法
JP2016119406A (ja) * 2014-12-22 2016-06-30 株式会社荏原製作所 基板処理装置
JP2021146428A (ja) * 2020-03-17 2021-09-27 株式会社東京精密 研削装置
JP7507576B2 (ja) 2020-03-17 2024-06-28 株式会社東京精密 研削装置

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