JP2001277292A - 構造物およびその製造方法、ならびに筐体装置、携帯型端末装置 - Google Patents

構造物およびその製造方法、ならびに筐体装置、携帯型端末装置

Info

Publication number
JP2001277292A
JP2001277292A JP2000090239A JP2000090239A JP2001277292A JP 2001277292 A JP2001277292 A JP 2001277292A JP 2000090239 A JP2000090239 A JP 2000090239A JP 2000090239 A JP2000090239 A JP 2000090239A JP 2001277292 A JP2001277292 A JP 2001277292A
Authority
JP
Japan
Prior art keywords
molding material
molding
mold
injecting
filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000090239A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001277292A5 (enExample
Inventor
Atsushi Morimoto
淳 森本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2000090239A priority Critical patent/JP2001277292A/ja
Publication of JP2001277292A publication Critical patent/JP2001277292A/ja
Publication of JP2001277292A5 publication Critical patent/JP2001277292A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Pivots And Pivotal Connections (AREA)
  • Casings For Electric Apparatus (AREA)
JP2000090239A 2000-03-29 2000-03-29 構造物およびその製造方法、ならびに筐体装置、携帯型端末装置 Pending JP2001277292A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000090239A JP2001277292A (ja) 2000-03-29 2000-03-29 構造物およびその製造方法、ならびに筐体装置、携帯型端末装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000090239A JP2001277292A (ja) 2000-03-29 2000-03-29 構造物およびその製造方法、ならびに筐体装置、携帯型端末装置

Publications (2)

Publication Number Publication Date
JP2001277292A true JP2001277292A (ja) 2001-10-09
JP2001277292A5 JP2001277292A5 (enExample) 2007-04-05

Family

ID=18605871

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000090239A Pending JP2001277292A (ja) 2000-03-29 2000-03-29 構造物およびその製造方法、ならびに筐体装置、携帯型端末装置

Country Status (1)

Country Link
JP (1) JP2001277292A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010012770A (ja) * 2008-06-02 2010-01-21 Panasonic Electric Works Co Ltd 樹脂成形品及びその製造方法
JP2012040791A (ja) * 2010-08-20 2012-03-01 Toshiba Corp 電子機器、コネクタ、および筐体の製造方法
JP2016533043A (ja) * 2013-10-10 2016-10-20 インテル・コーポレーション 小型フォームファクタデバイスにおいて構造的な剛性を向上させ、サイズを縮小させ、安全性を向上させ、熱性能及び高速充電を向上させるための材料の使用
JP2024155719A (ja) * 2023-04-21 2024-10-31 チャン キム、ビョン アルミニウムプロファイル射出接合方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010012770A (ja) * 2008-06-02 2010-01-21 Panasonic Electric Works Co Ltd 樹脂成形品及びその製造方法
JP2012040791A (ja) * 2010-08-20 2012-03-01 Toshiba Corp 電子機器、コネクタ、および筐体の製造方法
JP2016533043A (ja) * 2013-10-10 2016-10-20 インテル・コーポレーション 小型フォームファクタデバイスにおいて構造的な剛性を向上させ、サイズを縮小させ、安全性を向上させ、熱性能及び高速充電を向上させるための材料の使用
US10305529B2 (en) 2013-10-10 2019-05-28 Intel Corporation Using materials to increase structural rigidity, decrease size, improve safety, enhance thermal performance and speed charging in small form factor devices
JP2024155719A (ja) * 2023-04-21 2024-10-31 チャン キム、ビョン アルミニウムプロファイル射出接合方法
JP7770046B2 (ja) 2023-04-21 2025-11-14 チャン キム、ビョン アルミニウムプロファイル射出接合方法

Similar Documents

Publication Publication Date Title
CN111477115B (zh) 柔性显示屏组件及终端设备
CN1328935C (zh) 具有注射成型的外壁的电子设备外壳
US8995125B2 (en) Electronic device housing and assembly method
JPWO2001062468A1 (ja) Ｆｒｐ成形品およびその製造方法
JP3419388B2 (ja) 操作キーを備えた電子機器およびその製造方法
US9176540B2 (en) Electronic device having audio output unit
CN102039262B (zh) 一种灌胶的电子口令牌及灌胶工艺方法
CN207115276U (zh) 电子设备及其后盖组件
JP2001277292A (ja) 構造物およびその製造方法、ならびに筐体装置、携帯型端末装置
CN101596771B (zh) 电子机器机箱的制造方法及电子机器机箱
TW200902282A (en) In-mold decoration injection molding case and method thereof
WO2014103655A1 (ja) サンドイッチ成形品の製造方法、射出成形機及びサンドイッチ成形品
US20090123760A1 (en) Article made of biodegradable resin and method of making the same
TWI657185B (zh) 嵌入模製鉸鏈
JP2014168848A (ja) 射出成形方法及び射出成形機
JP2001058332A (ja) 薄肉成形品の成形方法
CN115623395B (zh) 一种扬声器及电子设备
JP2009267313A (ja) 電子機器用筐体および電子機器用筐体の製造方法
US20070056965A1 (en) Portable computer and method of forming rear cover thereof
TWI227187B (en) Method for fabricating molded resinous part with metal distributed in surface thereof
CN101108528B (zh) 塑料注塑成型用模具
JP2003071884A (ja) 表面にシボを有するｆｒｐ成形品とその製造方法
JP3112717B2 (ja) 射出成形用金型
CN114161656B (zh) 具有电磁屏蔽功能的夹芯注塑制品制造方法、产品、应用
CN118305979B (zh) 一种连接器胶芯的注塑模具及注塑工艺

Legal Events

Date Code Title Description
RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20050414

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20050606

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070221

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070221

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090430

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090508

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20090911