JP2001274193A - 半導体装置およびその製造方法 - Google Patents

半導体装置およびその製造方法

Info

Publication number
JP2001274193A
JP2001274193A JP2000085844A JP2000085844A JP2001274193A JP 2001274193 A JP2001274193 A JP 2001274193A JP 2000085844 A JP2000085844 A JP 2000085844A JP 2000085844 A JP2000085844 A JP 2000085844A JP 2001274193 A JP2001274193 A JP 2001274193A
Authority
JP
Japan
Prior art keywords
semiconductor device
film
electrode
substrate
anisotropic conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000085844A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001274193A5 (https=
Inventor
Kazuhiko Torii
和彦 鳥居
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP2000085844A priority Critical patent/JP2001274193A/ja
Publication of JP2001274193A publication Critical patent/JP2001274193A/ja
Publication of JP2001274193A5 publication Critical patent/JP2001274193A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
JP2000085844A 2000-03-27 2000-03-27 半導体装置およびその製造方法 Pending JP2001274193A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000085844A JP2001274193A (ja) 2000-03-27 2000-03-27 半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000085844A JP2001274193A (ja) 2000-03-27 2000-03-27 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2001274193A true JP2001274193A (ja) 2001-10-05
JP2001274193A5 JP2001274193A5 (https=) 2007-02-22

Family

ID=18602103

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000085844A Pending JP2001274193A (ja) 2000-03-27 2000-03-27 半導体装置およびその製造方法

Country Status (1)

Country Link
JP (1) JP2001274193A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008172022A (ja) * 2007-01-11 2008-07-24 Seiko Epson Corp 半導体装置及び電子デバイス、並びに、電子デバイスの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008172022A (ja) * 2007-01-11 2008-07-24 Seiko Epson Corp 半導体装置及び電子デバイス、並びに、電子デバイスの製造方法

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