JP2001243878A - Method of producing barrier rib for plasma display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a simple method for producing highly strong barrier rib for a plasma display panel. SOLUTION: A photosensitive resin composition layer is formed on a substrate, exposure is applied thereto via a predetermined pattern mask and non- exposed portions are removed by development to form a resin pattern. A barrier rib material powder having a surface layer coated with a thermosetting resin is filled between the resin patterns. The barrier rib material powder coated with the thermosetting resin is heated to be fused and hardened, and then calcinated, after the resin patterns are removed, to produce the barrier rib for the plasma display panel.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a barrier rib of a plasma display panel (hereinafter abbreviated as PDP) used as a display device for character information and video information in a computer terminal, a wall-mounted television, and a ticket vending machine. About.

[0002]

2. Description of the Related Art A PDP has a barrier and a fluorescent material inside two insulating plates (hereinafter abbreviated as a glass plate) of a front plate on which a transparent electrode is formed and a rear plate on which a data electrode and an insulating film are formed. Consists of a formed structure. The barrier forms a cell structure that maintains a certain space between the transparent electrode group and the data electrode group that are orthogonal to each other, and is filled with a rare gas such as Ne or Xe, and the intersection of the transparent electrode and the data electrode is applied. Pixels that discharge and emit light from the phosphor by the voltage are formed to display an image. The barrier has a function of preventing erroneous discharge between cells and obtaining a constant discharge section by its height, width, and pattern gap. As a method of manufacturing the above-mentioned barrier, a photolithographic method using a photosensitive material widely used for forming an IC circuit board and the like is vigorously studied because a large-sized, fine-walled panel barrier can be formed with high precision. Have been.

[0003] For example, in Japanese Patent Application Laid-Open No. 05-234514, a photosensitive resin composition film is laminated on a substrate, exposed through a predetermined pattern mask, and then a non-exposed portion is removed by development to remove the resin pattern. A method of forming a barrier material between the resin pattern and the resin pattern by a screen printing method, and after drying, forming a barrier by peeling and removing the resin pattern with an alkaline peeling solution, is proposed. It has been described.

[0004]

However, in the additive method, when a barrier material is buried between resin patterns, the barrier material adheres to the upper portion of the pattern, and it is necessary to polish and remove the barrier material on the upper portion of the pattern as a pre-step of peeling. Thus, the present invention has been made in view of this problem.

[0005]

According to the present invention, a resin pattern is formed by forming a photosensitive resin composition layer on a substrate, exposing it through a predetermined pattern mask, and removing an unexposed portion by development. The surface layer between the resin pattern and the resin pattern is coated with a thermosetting resin to fill the barrier material powder, and then heated to fuse and cure the barrier material powder coated with the thermosetting resin, and then cured. Removing the resin pattern,
The present invention relates to a method for manufacturing a barrier of a plasma display panel to be fired (hereinafter, referred to as a first invention). Further, the present invention relates to a method for manufacturing a barrier of a plasma display panel in which the thermosetting resin is a phenolic resin in the first invention (hereinafter referred to as a second invention). The present invention also relates to a method for manufacturing a barrier of a plasma display panel using a thermosetting resin as an epoxy resin in the first invention (hereinafter referred to as a third invention). The first invention is to provide a simple method for manufacturing a barrier of a plasma display panel. The second and third inventions provide a method for manufacturing a barrier of a plasma display panel simply and with good shape.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION The barrier manufacturing method of the present invention comprises forming a photosensitive resin composition layer on a substrate, exposing the same through a predetermined pattern mask, and then removing the unexposed portion by developing. A pattern is formed, a barrier material powder having a surface layer coated with a thermosetting resin is filled between the resin patterns, and then heated and fired.

[0007] The substrate used in the present invention is not particularly limited, and examples thereof include a ceramic plate, a plastic plate, and a glass plate. On this substrate, an insulating layer, an electrode, a protective layer and the like may be provided. As a method of forming the photosensitive resin composition layer on the substrate, a method in which the photosensitive resin composition is directly applied on the substrate and dried if necessary, and the photosensitive film is formed by a laminator using a photosensitive film. There is a method of providing a resin layer by transferring it on a substrate, and the like.
From the viewpoint of environmental hygiene and the ability to increase the thickness (height) of the resin pattern, the latter method using a photosensitive film is preferred. Examples of the method for applying the photosensitive resin composition include a spin coating method, a Meyer bar coating method, a spray coating method, a knife coating method, and a roll coating method.

The photosensitive film has a support film and a photosensitive resin layer. For example, a photosensitive resin composition is coated on a support film such as a polyethylene terephthalate film and dried if necessary to form a photosensitive resin. It is manufactured by forming a composition layer. Usually, since the photosensitive resin composition layer is uncured, flexible and tacky,
A protective film such as a polyethylene film is stuck on this layer to prevent external damage and adhesion of foreign matter. The thickness of the photosensitive resin composition layer is not particularly limited,
The thickness is preferably 15 μm or more from the viewpoint of easily increasing the thickness of the resin pattern to be formed, and the upper limit is usually 250 μm.

The photosensitive resin composition is not particularly limited and known ones can be used. Negative photosensitive resin compositions, positive photosensitive resin compositions and the like can be used. It is more preferable to use the composition in terms of easy handling. As the negative photosensitive resin composition, for example, (a) an ethylenically unsaturated compound, (b) a carboxyl group-containing film-imparting polymer and (c) a photopolymerization initiator are contained as essential components. ,
Photopolymerizable compositions containing (d) a dye or pigment, (e) other additives, and (f) an organic solvent.

The photosensitive resin composition layer formed on the substrate using the above-described photosensitive resin composition is exposed in a pattern by, for example, irradiating active light through a negative mask having a predetermined pattern. After heating, the photosensitive resin composition layer is selectively removed by development to form a plurality of resin patterns on the substrate.

The developing method is not particularly limited, and includes wet development, dry development and the like. In the case of wet development, a developer corresponding to the photosensitive resin composition is used. Examples of the developer include a weakly alkaline diluted aqueous solution such as sodium carbonate and potassium carbonate.
Examples include an immersion method and a spray method. Further, the resin pattern formed on the substrate after the development may be heated and / or exposed for the purpose of improving strength, solvent resistance and the like.

Next, the barrier material powder coated with the thermosetting resin will be described. The barrier material powder is composed of an inorganic powder and a thermosetting resin. As the inorganic powder, the low melting point glass _{PbO · B 2 O 3, PbO} · B 2 O 3 · Si
O ₂ , ZnO · B ₂ O ₃ · SiO _2, etc., and alumina, titanium oxide, zinc oxide, barium oxide, potassium oxide, calcium oxide, aluminum oxide, zirconium oxide, cadmium oxide, chromium oxide, manganese oxide, copper oxide, A metal oxide such as bismuth oxide can be used. In addition, as the thermosetting resin, an acrylic resin, a polyester resin, an epoxy resin, a phenol resin, or the like is used, and an epoxy resin and a phenol resin are particularly preferable.

Next, a method of coating the inorganic powder with a thermosetting resin will be described. Known methods can be used for coating, for example,
A method in which a thermosetting resin is dissolved in a solvent that does not react with the thermosetting resin, the inorganic powder is mixed, dried, sprayed, and dried, and the inorganic powder is dissolved in a solvent that does not react with the thermosetting resin. A method of mixing, drying and pulverizing may be used.

Examples of the organic solvent used for producing the barrier material powder include toluene, acetone, methyl ethyl ketone, methyl isobutyl ketone, methyl cellosolve, ethyl cellosolve, γ-butyl lactone, N-methyl pyrrolidone, dimethyl formamide, and tetramethyl sulfone. ,
Diethylene glycol dimethyl ether, diethylene glycol monobutyl ether, chloroform, methylene chloride, methyl alcohol, ethyl alcohol, tetralin, n-butylbenzene, p-cymene, methylnaphthalene, cyclohexylbenzene, diethylbenzene, pentylbenzene, dipentylbenzene, p-methane, bicyclohexyl, Dipentene, decalin, solvesso, turpentine oil and the like. These are used alone or in combination of two or more. Among these organic solvents, those having a high boiling point (170 to 280 ° C.) and non-polar ones are
The coating has good leveling properties and does not erode into the resin pattern used in the additive method. In addition, a plasticizer, a dispersant, and the like may be added to the barrier material powder as needed. The inorganic powder may be coated alone on the thermosetting resin, or several particles may be combined to form one particle.

As a method of filling the barrier material powder between the resin patterns, the barrier material powder is uniformly deposited on the substrate, micro-vibration is applied to the substrate, and the barrier material powder on the resin pattern is cut off. Removal method.

A method for removing the resin pattern will be described. The resin pattern can be removed by various methods. For example, when the removal of the resin pattern is performed using a stripping solution, the stripping solution to be used includes a 1 to 10% by weight aqueous solution of sodium hydroxide or potassium hydroxide. . When the concentration is less than 1% by weight, the effect of peeling is small, so that the peeling time tends to take too long. When the concentration exceeds 10% by weight, the barrier material tends to be attacked. The temperature of the stripping solution is not particularly limited, and conditions for suitably stripping the resin pattern may be appropriately set. As the stripping method, any of the immersion method and the spray method is suitable, and the two methods are used in combination. You may.

After the removal of the resin pattern, organic materials are removed from the barrier material remaining on the substrate, and the barrier material is fired for the purpose of improving strength, gas impermeability and the like. The firing temperature and time are usually 350 to 580 ° C. for 1 to 20 hours.
The thickness (height) of the barrier on the substrate thus manufactured
Is usually 50 to 250 μm, and the width is 20 to 150 μm for a stripe type or lattice type barrier.

[0018]

The present invention will be specifically described below with reference to examples. Example 1 Methyl methacrylate / ethyl acrylate / methacrylic acid copolymer (weight ratio 53/30/17, weight average molecular weight 1)
137 g (55 g solid content) of 41% by weight of methylcellosolve / toluene (weight ratio of 8: 2) of 40,000), 34 g of bisphenol A polyoxyethylene dimethacrylate,
11 g of γ-chloro-β-hydroxypropyl-β-methacryloyloxyethyl-o-phthalate, a stabilizer (A
W-500, manufactured by Kawaguchi Chemical Co., Ltd.) 0.1 g, tribromomethylphenylsulfone 1.2 g, silicone leveling agent (SH-193, manufactured by Toray Silicon Co., Ltd.)
0.04 g, 1,7-bis (9-acridinyl) heptane 0.2 g, benzyl methyl ketal 3 g, leuco crystal violet 1.0 g, malachite green 0.1 g
A photosensitive resin composition solution containing 0.05 g, toluene 7 g, methyl ethyl ketone 13 g, and methanol 3 g was mixed with 20 μm.
It was uniformly coated on a m-thick polyethylene terephthalate film and dried with a hot air convection dryer at 110 ° C. for about 10 minutes to obtain a photosensitive film. The thickness of the photosensitive resin layer after drying was 50 μm.

Next, the obtained photosensitive film was stuck on a glass plate previously heated to 100 ° C. at 130 ° C. using a laminator, and the polyethylene terephthalate film was peeled off to expose the photosensitive resin composition layer. The photosensitive film was similarly stuck on the exposed photosensitive resin composition layer, and the polyethylene terephthalate film was peeled off to expose the photosensitive resin composition layer. further,
The same operation was performed once again, and 150 μm
A thick photosensitive resin composition layer was formed.

Thereafter, a predetermined negative mask (line / space = 300) is formed on the polyethylene terephthalate film.
[mu] m / 100 [mu] m) was placed on, using a collimated beam exposure apparatus exposure 70 mJ / cm ² (ultraviolet dominant wavelength from the top of the negative mask: and exposing the photosensitive resin composition layer at 365 nm). Further, the unexposed portion of the photosensitive resin composition layer was developed with a 1% by weight aqueous solution of sodium carbonate using a developing machine to obtain a resin pattern on a glass plate. Next, the resin pattern was irradiated with 3000 mJ / cm ² using an ultraviolet irradiator, and then heat-treated at 160 ° C. for 60 minutes using a dryer. Next, the materials shown in Table 1 were put into an automatic mortar ANM1000 manufactured by Nitto Kagaku Corporation and kneaded for 15 minutes to obtain a powdery barrier material powder.

[0021]

[Table 1]

The above-mentioned barrier material powder was accumulated between the resin patterns on a substrate having the resin patterns formed thereon using a 500-mesh sieve. Next, the barrier material on the resin pattern was removed using a rubber squeegee. After that, 160
Heated at ° C for 30 minutes.

Further, it was immersed in a 5% by weight aqueous solution of sodium hydroxide maintained at 45 ° C. for about 10 minutes, and immediately
The resin pattern was peeled off by immersion in warm water maintained at a temperature of ° C.
Then, it was washed with water and dried at 80 ° C. for 30 minutes to obtain a barrier before firing. The dimensions of the barrier before firing are as follows:
m, the width of the bottom surface was 115 μm, and the height was 150 μm. Finally, it was fired in air using a muffle furnace to obtain a barrier. The firing rate is 3 ° C from room temperature to 380 ° C.
/ Minute, and maintained at 380 ° C. for 30 minutes, and further increased to 550 ° C. at a rate of 5 ° C./minute.
After holding at 30 ° C. for 30 minutes, the mixture was naturally cooled to room temperature. The barrier after firing was good, maintaining the above shape before firing, and the dimensions shrank due to decomposition and removal of the resin. The barrier dimensions after firing were such that the top width was 65 μm and the bottom width was 110 μm.
m and height were 120 μm.

[0024]

According to the method of manufacturing a barrier for a plasma display panel of the present invention, a high-strength barrier can be easily obtained.

 ────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yoshiyuki Horibe 4-3-1, Higashicho, Hitachi City, Ibaraki Prefecture F-term in Hitachi Chemical Co., Ltd. Yamazaki Office (reference) JA20 KA15 KA16 KB11 MA23

Claims (3)

[Claims] 1. A photosensitive resin composition layer is formed on a substrate, exposed through a predetermined pattern mask, and unexposed portions are removed by development to form a resin pattern. Is filled with a barrier material powder having a surface layer coated with a thermosetting resin, and then heated to fuse and cure the barrier material powder coated with the thermosetting resin. Then, the resin pattern is removed and baked. A method for manufacturing a barrier for a plasma display panel, comprising: 2. The method according to claim 1, wherein the thermosetting resin is a phenolic resin. 3. The method according to claim 1, wherein the thermosetting resin is an epoxy resin.