JP2001230522A - Method of manufacturing printed circuit board material and manufacturing device of wire structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method for making a printed circuit board into higher density and easily and economically manufacturing a printed circuit board material, which is superior in precision of size and to provide the manufacturing device of wire structure which can be used suitably for the method. SOLUTION: In the manufacturing method of a printed circuit board material, a forming die 20 where multiple pores are bored with a prescribed pitch is placed on a table 10, that is movable in the horizontal direction. Operation for permitting a wire supply means 11 to insert a metallic wire 13 into the pore of the forming die 20 and to cut it, moving the table 10 in the horizontal direction by a prescribed distance, inserting the metallic wire 13 into the other hole of the forming die 20 and cutting it, is repeated. The many metallic wires 13 are arranged in the forming die 20 by the prescribed pitch. A composite material constituted of plastic and ceramic is made to flow into the forming die 20, and the composite material is cured.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed circuit board material and an apparatus for manufacturing a wire structure used for manufacturing a printed circuit board material.

[0002]

2. Description of the Related Art A printed circuit board has a slot for an integrated circuit and a group of connection terminals for various electronic components formed on one side, and a conductive path connecting the components printed on the other side. Conventionally, it has been used in large quantities as an element member of electronic equipment. FIG. 9 is a perspective view showing an example of a printed circuit board, which is formed by plating a conductive metal 2 on a plate made of an insulating material such as epoxy resin or glass so as to conduct between the surfaces. On both sides of the plate material 1,
A photo-process layer 3 which is a conductive layer having a predetermined conductor pattern (circuit) formed thereon is laminated, and further, a connection terminal group and a conductive path 4 are formed outside the photo-process layer 3 by printing or the like. Is configured.

Conventionally, for a substrate material 1 used for such a printed circuit board, conventionally, for example, after a plate-like body made of an insulating material such as epoxy resin or glass is manufactured, a through hole for conduction is formed at a predetermined position by drilling. Then, the through hole is covered with a conductive metal such as copper by plating or the like, and the through hole is sealed with a sealing material.

[0004] However, when drilling a plate-like body, there is a risk that machining chips will be generated along with the processing and a product defect will occur. In addition, in plating, there is a high possibility that cracks will occur at the edge of the substrate material. There is a problem of causing poor conduction. Further, in drilling, the ratio of the length (thickness of the substrate) / hole diameter of the through hole that can be processed is limited to about 5, for example, in the case of a 1 mm thick substrate, the lower limit is about 0.2 mm in diameter. . However, in order to increase the density of the printed circuit board, it is preferable to use a smaller hole diameter, which is difficult with drilling.

In addition, an electric wire such as Ni or Co is inserted into the frame body, an insulating material such as an epoxy resin is melted and poured, and after being cured, the cut is made at a plane perpendicular to the metal wire. (Japanese Patent Laid-Open No. 49-49)
-8759). However, since this circuit board uses an epoxy resin or the like, there is a problem that when the resin is cured, the volume shrinks by about 2 to 3%, and the dimensional accuracy such as the pitch of the through holes is impaired. In high-density printed circuit boards, dimensional accuracy is extremely important, which has been a major drawback. Furthermore, since this circuit board does not consider any affinity with a conductive layer (photo-process layer) laminated on one or both sides, a difference in thermal expansion due to a thermal shock or a temperature difference during use causes the substrate material to be reduced. And the conductive layer may peel off. Further, there is a possibility that the insulating material and the metal wire may peel off due to a physical impact.

[0006]

Accordingly, the present invention provides
The present invention has been made in view of the above-described conventional problems, and its object is to provide a method for manufacturing a printed circuit board material having a higher density of a printed circuit board and excellent dimensional accuracy, and to be suitably used for the method. An object of the present invention is to provide an apparatus for manufacturing a wire structure. Another object of the present invention is to provide a method for manufacturing a printed circuit board material capable of easily and economically manufacturing a printed circuit board, and an apparatus for manufacturing a wire structure that can be preferably used for the method. To provide. Further, another object of the present invention is to
It is an object of the present invention to provide a method of manufacturing a printed circuit board material capable of ensuring good electrical continuity and controlling the thermal expansion property so that the board material and the conductive layer are not separated during use.

[0007]

That is, according to the present invention, a forming die having a large number of fine holes provided at a predetermined pitch is placed on a horizontally movable table, and the forming is performed by a wire supply means. Cutting after inserting the metal wire into the pores of the mold, then moving the table horizontally for a predetermined distance, repeating the operation of cutting after inserting the metal wire into the other pores of the mold. After arranging a large number of metal wires at a predetermined pitch in the molding die, a composite material made of plastic and ceramic is poured into the molding die, and the composite material is cured. A manufacturing method (first manufacturing method) is provided.

Further, according to the present invention, a mold having a large number of fine holes provided at a predetermined pitch and a thin film disposed on a molding surface is placed on a horizontally movable table, and a metal thin plate is formed. After the thin metal pin is pressed and sent out by the pin supply means to pierce the thin metal pin of the forming die with the thin metal pin, the table is moved horizontally by a predetermined distance to the other part of the thin film of the forming die. Repeat the operation of piercing the fine metal pin, after arranging a number of fine metal pins at a predetermined pitch in the mold,
A method for producing a printed circuit board material, characterized by pouring a composite material consisting of plastic and ceramic into the mold and curing the composite material (second production method).
Is provided.

In the present invention, the mold comprises a base,
A plate-shaped intermediate jig arranged on the base and a large number of through holes are arranged at a predetermined pitch, and arranged on the intermediate jig;
It is preferable that the intermediate jig comprises a plate-shaped upper jig in which a large number of through holes are arranged at predetermined positions at positions corresponding to the through holes.

In the present invention, the content of the ceramic in the composite material is preferably 40% by volume or more and 90% by volume or less, because volume shrinkage during curing can be further reduced. Further, when the composite material is made of glass fiber or silica glass cut to a predetermined length and an epoxy resin, it is desirable because the substrate material has no anisotropy in thermal expansion and can provide a predetermined strength. .

Further, according to the present invention, a wire supply means including a wire bobbin, a drive motor for extracting a metal wire from the wire bobbin at a predetermined length, and a pinch roller, and the metal wire is positioned at a predetermined position. A guide for accurate guidance, a base, a plate-shaped intermediate jig arranged on the base and a large number of through-holes arranged at a predetermined pitch, and arranged on the intermediate jig. A forming die comprising a plate-shaped upper jig in which a large number of through holes are arranged at a predetermined pitch at positions corresponding to the through holes of the intermediate jig, and a cutting means for cutting the metal wire And a table on which the mold is placed and which can be moved in the horizontal direction. A wire structure manufacturing apparatus (first manufacturing apparatus)
Is provided.

Further, according to the present invention, there is provided a fine metal pin supply means for pressing and sending a large number of fine metal pins one by one, and a guide for accurately guiding the fine metal pin to a predetermined position. A base, a plate-shaped intermediate jig disposed on the base and a large number of through holes are arranged at a predetermined pitch, and a plate-shaped intermediate jig disposed on the intermediate jig; A mold having a plate-shaped upper jig in which a large number of through holes are arranged at corresponding positions at a predetermined pitch, and forming a thin film between the intermediate jig and the upper jig; A manufacturing apparatus (second manufacturing apparatus) for a wire structure, comprising: a table on which a mold is placed, the table being movable in a horizontal direction. In the present invention, it is preferable to use a parts feeder as the thin metal pin supply means.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in more detail based on embodiments shown in the drawings, but the present invention is not limited to these embodiments. First, an example of a first manufacturing device of the wire structure manufacturing device according to the present invention will be described with reference to FIGS. FIG. 1 is a schematic front view showing one embodiment of a first manufacturing apparatus according to the present invention, FIG. 2 is a side view of the apparatus shown in FIG. 1, and FIG. 3 is a partially enlarged view of the apparatus shown in FIG.

In FIGS. 1 to 3, reference numeral 11 denotes a wire bobbin from which a metal wire 13 is drawn out via a step roller 12. Metal wire 13
Are drawn out at predetermined intervals by a drive motor 14 and a pinch roller 15. The drive motor 14 controls the amount of rotation and the number of rotations of the pinch roller 15 by rotating the timing belt 16 by a predetermined length, and adjusts the length of drawing of the metal wire 13 from the wire bobbin 11. As described above, the wire supply unit includes the wire bobbin 11, the drive motor 14, and the pinch roller 15. As shown in FIG. 2, by providing a plurality of wire supply means in parallel (five in FIG. 2), the metal wire 13 is inserted into the pores of the molding die 20 as described later. Can be inserted faster and more efficiently.

A metal wire 13 drawn out by a predetermined length
Is introduced into the guide 17. The guide 17 is
The metal wire 13 is provided for accurately guiding the metal wire 13 to a predetermined position of the molding die 20 described below, that is, a predetermined pore position. As shown in FIG. 3, the guide guide 17 includes three plate-like members 18a, 1 having through holes having different hole diameters.
8b and 18c. Guide Guide 1
The number of plate members constituting 7 is not limited to three, but may be two or four or more. Metal wire 1
The first plate-shaped member 18a located on the inlet side of No. 3 has a through-hole 19a having a diameter larger than the diameter of the metal wire 13, and the through-hole 19b of the intermediate second plate-shaped member 18b, The through hole 19c of the third plate-shaped member 18c located on the outlet side of the metal wire 13 is formed so as to have a gradually smaller hole diameter. The guide 17 is composed of three plate-like members 18a, 18b, 18c having through holes of different diameters.
, The metal wire 13 can be easily introduced into the through hole, and the metal wire 13 can be accurately guided to a predetermined position. Furthermore, since it can be manufactured by dividing into three pieces, it is easy to form a through hole, which is advantageous in cost. Specifically, for example, the diameter of the metal wire is φ0.1 mm, the hole diameter of the through hole 19a of the first plate member 18a is φ0.6 mm, and the through hole 19 of the second plate member 18b.
The hole diameter of b is φ0.3 mm and the hole diameter of the through hole 19c of the third plate-like member 18c is φ0.15 mm.

Next, the metal wire 13 is inserted into a predetermined through-hole of the molding die 20 via the guide 17. The mold 20 is placed on the table 10 which can be precisely moved by a predetermined distance in the horizontal direction. FIGS. 5 to 7 show an embodiment of the molding die. The molding die 20 includes a base 21, a plate-shaped intermediate jig 22, and a plate-shaped upper jig 23. The base 21 has no through-hole formed therein, and serves as a stopper for the metal wire 13 inserted into the mold 20. The intermediate jig 22 is arranged on the base 21, and a large number of through holes 22a are arranged at a predetermined pitch. The upper jig 23 is disposed on the intermediate jig 22,
A large number of through holes 23a are arranged at predetermined pitches at positions corresponding to the through holes 22a of the intermediate jig 22. The diameter of the through holes 22a and 23a is, for example, about 0.2 mm, which is slightly larger than the diameter of the metal wire 13, so that the metal wire 13 inserted into the through holes 22a and 23a does not rattle. , Can be arranged with high accuracy.

A cutter 25 is provided between the guide 17 and the mold 20, and the metal wire 1 inserted into the many through holes 22 a and 23 a of the mold 20.
Cut 3

Next, an example of a second manufacturing apparatus of the wire structure manufacturing apparatus according to the present invention will be described with reference to FIG. In FIG. 4, reference numeral 30 denotes a parts feeder serving as a thin metal pin supply means.
4. The pressurizing means 33 and the tube 32 are connected, and a large number of fine metal pins 31 are sent out one by one via a valve 34.
Pneumatic transportation is performed at a predetermined speed. The distal end of the tube 32 is introduced into the through hole 36 of the guide 35. The configuration of the guide 35 is the same as that of the guide 17 described above.
However, the number of plate members constituting the guide 35 is five.

Next, the thin metal pin 31 pierces the thin film 41 of the molding die 40 via the guide 35. Although not shown, as in the first manufacturing apparatus, the molding die 4
Numeral 0 is placed on a table that can be precisely moved by a predetermined distance in the horizontal direction, and at this time, the position of the table is moved so that the intermediate jig 42a is directly below the through hole 36. The basic configuration of the molding die 40 is substantially the same as that of the above-described molding die 20, except that the thin film 41 is disposed between the intermediate jig 42 and the upper jig 43. In addition, 44 is a base. The thin film 41 is usually made of paper, a resin film, or the like, and may be made of any material as long as the thin metal pin 31 that is pneumatically conveyed inside the tube 32 at a predetermined speed pierces and stands upright.

Next, a method for manufacturing a printed circuit board material according to the present invention will be described using these first and second wire structure manufacturing apparatuses. First, the first manufacturing method will be described. First, the mold 20 having the configuration shown in FIG. 5 is placed on the table 10 which can be precisely moved by a predetermined distance in the horizontal direction. Next, the metal wire 13 is moved by a predetermined length by a wire supply unit configured to include the wire bobbin 11, the drive motor 14, and the pinch roller 15,
After being inserted into the through holes 22 a and 23 a of the molding die 20, the metal wire 13 is cut by the cutter 25 between the molding die 20 and the guide 17.

Next, after the table 10 is moved in a horizontal direction by a predetermined distance (for a predetermined pitch), the metal wires 13 are inserted into the other through holes 22 a and 23 a in the same manner as described above. The operation of cutting with the cutter 25 is repeated, and a number of metal wires 13 are arranged in the molding die 20 at a predetermined pitch. The molding die 20 is, as described above,
Since it is composed of the base 21, the plate-shaped intermediate jig 22, and the plate-shaped upper jig 23, after the metal wires 13 are inserted into the many through holes 22a, 23a, as shown in FIG. ) (b)
As described above, the upper jig 23 is lifted upward by a predetermined distance to form a gap at a predetermined interval between the upper jig 23 and the intermediate jig 22. Next, as shown in FIG. 7, a wire structure having a large number of metal wires arranged at a predetermined pitch can be manufactured by fitting the frame member 24 around the outer periphery except for one end.

Next, in the gap 28 of the molding die 20,
After pouring a composite material composed of plastic and ceramic, and then curing the composite material, the intermediate jig 22, the upper jig 23, and the frame member 24 of the molding die 20 are removed, so that a large number of metal wires 13 have a predetermined pitch. Thus, a substrate material penetrating in the thickness direction of the composite material can be obtained. Then, the surface of the obtained substrate material is polished by a polishing means,
A desired printed circuit board material is manufactured by removing the metal wires protruding from the surface and smoothing the surface.

Next, a second manufacturing method will be described with reference to FIG. First, the mold 40 is placed on a table that can be precisely moved by a predetermined distance in the horizontal direction. This table has the same configuration as that shown in FIGS. Next, a large number of fine metal pins 31 are sent out one by one from the parts feeder 30 via the valve 34, and the pressing means 3
By 3, one metal thin pin 31 is pneumatically transported in the tube 32 at a predetermined speed. Then, the thin metal pin 31 transported by air is pierced into the thin film 41 of the molding die 40 through the through hole 36 of the guide 35.

Next, after moving the table in a horizontal direction for a predetermined distance (for a predetermined pitch), in the same manner as above,
The operation of piercing the thin metal pins 31 into another part of the thin film 41 of the molding die 40 is repeated, so that a large number of the fine metal pins 31 are juxtaposed in the molding die 40 at a predetermined pitch. This mold 4
No. 0 has substantially the same configuration as the molding die 20. After a large number of fine metal pins 31 are arranged side by side at a predetermined pitch in the molding die 40, the upper jig 43 is lifted upward by a predetermined distance, and A gap is formed at a predetermined interval between the jig 43 and the intermediate jig 42, and then, similarly to FIG. A wire structure provided with pins can be manufactured.

Next, a composite material 45 made of plastic and ceramic is poured into the cavity of the molding die 40, and then the composite material 45 is cured.
By removing the intermediate jig 42, the upper jig 43, the frame member, and the thin film 41, a substrate material in which a large number of fine metal pins penetrate at a predetermined pitch in the thickness direction of the composite material can be obtained. In the case of this manufacturing method, since the thin film 41 is disposed on the upper surface (molding surface) of the intermediate jig 42 in the molding die 40, when the composite material 45 is poured into the molding die, the intermediate jig 42 No composite material 45 enters the through hole 42a, and the hole diameter of the through hole 42a is, for example, φ0.
3 mm and the intermediate jig 22 in the molding die 20 shown in FIG.
Can be formed larger than the diameter of the through hole 22a. This facilitates production of the through hole 42a of the intermediate jig 42.

According to the above-described manufacturing method and apparatus of the present invention, metal wires or fine pins can be arranged at predetermined intervals and with high dimensional accuracy. For example, it is possible to obtain a substrate material arranged at a narrow pitch of 0.5 mm, for example, 1.1 mm or less. As described above, in the printed circuit board material obtained in the present invention, the diameter of the through hole or the diameter of the via hole is determined by the diameter of the metal wire or the fine pin. Therefore, the diameter is reduced as long as the processing of the metal wire or the fine pin is possible. And 0.2 mmφ or less, for example, 0.
It can be manufactured even with a diameter of 05 mm.

FIG. 8 shows an example of a printed circuit board material manufactured by the manufacturing method of the present invention. In FIG. 8, a substrate material 50 is made of plastic and ceramic, and a metal wire or fine pins 52 are arranged at a predetermined pitch on a composite material 51 formed in a flat plate shape. The ends of the metal wires or the fine pins 52 are exposed on both surfaces of the composite material 51 so that electrical conduction can be provided between both surfaces of the substrate material 50. For example, as shown in FIG. 9, the substrate material 50 having such a configuration has
Conductive layer (photo process layer) on which predetermined circuit is formed
3. A connection terminal group 4 is provided to form a printed circuit board.

Hereinafter, constituent materials of the substrate material manufactured by the present invention will be described. The composite material constituting the substrate material is made of plastic and ceramic, and is formed by dispersing ceramic particles, ceramic fibers, and the like in a matrix made of plastic. The blending amount of both is
It is appropriately selected according to properties and purposes such as insulation properties, low thermal expansion properties, abrasion resistance, strength, etc., but containing 40% by volume or more and 90% by volume or less of ceramic particles, ceramic fibers, etc. It is preferable in view of the properties and the reduction in volume shrinkage during curing. In the composite material of the present invention, the volume shrinkage at the time of curing can be 1% or less, and further 0.5% or less, which is extremely advantageous for improving the dimensional accuracy of the metal wire in the substrate material.

By using such a compounding amount, it is possible to effectively impart low thermal expansion property, abrasion resistance, and the like to the composite material. If the content of ceramic particles, ceramic fibers, and the like exceeds 90% by volume, the content of plastic becomes too small, and the fluidity during molding may be lost. As ceramics, alumina,
In addition to zirconia and silicon nitride, glass such as silica glass is included. Ceramic is compounded as particles or fibers. Further, as the plastic, any of a thermoplastic resin and a thermosetting resin can be used. As the thermoplastic resin, for example, various resins such as vinyl chloride, polyethylene, polypropylene, polycarbonate, liquid crystal polymer, polyamide, and polyimide can be used, and two or more of these resins may be used in combination. On the other hand, as the thermosetting resin, a phenol resin, an epoxy resin, a urea resin, or the like can be used,
Further, two or more of these resins may be used in combination.

In the composite material of the present invention, a chip obtained by cutting glass fiber into a predetermined length as a ceramic or a material obtained by mixing glass beads such as silica glass with a plastic such as an epoxy resin has anisotropy in thermal expansion. And is excellent in properties such as insulation, low thermal expansion, abrasion resistance, and strength.

Next, the material of the metal wire or the fine metal pin is not particularly limited as long as it is a conductive metal, and usually, any one of copper, copper alloy, aluminum, and aluminum alloy is used. Preferably, it is made of a kind of metal. In view of abrasion resistance, flexibility, oxidation resistance, strength, and the like, it is more preferable that the metal wire or the fine metal pin is made of beryllium copper.

It is desirable that the plastic and the ceramic be subjected to a coupling treatment, and that the composite material and the metal wire or the fine metal pin be joined by a coupling agent. As described above, when the coupling treatment is performed, the separation between the plastic and the ceramic does not occur, and the bonding strength between the composite material and the metal wire or the fine metal pin is improved, and the separation is effectively prevented during use. Here, conventionally known coupling agents can be used, and, for example, vinyl, epoxy, methacryloxy, amino, chloropropyl, mercapto and the like are effective as silane coupling agents. Further, based on these, a primer dissolved with water, an organic solvent or the like is also effective. In addition, a titanium-based coupling agent and an aluminum-based coupling agent can also be mentioned as effective ones. In addition, the surface of the metal wire or the fine metal pin can be made uneven to improve the bonding property with the composite material.

The printed circuit board material thus obtained can have any coefficient of thermal expansion in the range of about 10 to 30 ppm / ° C., and has an isotropic coefficient of thermal expansion. Thermal expansion coefficient: about 17 ppm /
° C), beryllium copper (coefficient of thermal expansion: about 18 ppm / ° C)
Since the thermal expansion is close to the thermal expansion of a metal, the reliability in the temperature history is extremely high in the thin film forming step, the solder dipping step, and the like. Here, that the coefficient of thermal expansion is isotropic means that the difference between the coefficient of thermal expansion in the thickness direction and the coefficient of thermal expansion in the plane direction of the substrate material is within 30% of the smaller coefficient of thermal expansion.

[0034]

As described above, according to the manufacturing method of the present invention, a printed circuit board material having high density and excellent dimensional accuracy can be manufactured more easily and economically. Further, according to the present invention, a printed circuit board material capable of ensuring good electrical continuity and controlling the thermal expansion property so that the substrate material and the conductive layer are not separated from each other during use is manufactured. can do. Further, according to the apparatus for manufacturing a wire structure according to the present invention, it is possible to efficiently manufacture a wire structure in which a large number of metal wires or fine metal pins are arranged at a narrower pitch.

[Brief description of the drawings]

FIG. 1 is a schematic front view showing one embodiment of a first manufacturing apparatus according to the present invention.

FIG. 2 is a side view of the device shown in FIG.

FIG. 3 is a partially enlarged view of the device shown in FIG.

FIG. 4 is a schematic explanatory view showing one embodiment of a second manufacturing apparatus according to the present invention.

5 (a) is a sectional view, and FIG. 5 (b) is a perspective view, showing one embodiment of a molding die used in the present invention.

6 shows a state in which an upper jig is lifted up in the mold of FIG. 5, (a) is a sectional view, and (b) is a perspective view.

FIG. 7 is a perspective view showing a molding die in which a frame material is fitted to an outer peripheral portion excluding one end.

FIG. 8 is a perspective view showing an example of a printed circuit board material obtained by the present invention.

FIG. 9 is a perspective view illustrating an example of a printed circuit board.

[Explanation of symbols]

1 ... substrate material, 2 ... conductive metal, 3 ... photoprocess layer,
DESCRIPTION OF SYMBOLS 4 ... Connection terminal group, 10 ... Table, 11 ... Wire bobbin, 12 ... Step roller, 13 ... Metal wire, 14 ... Drive motor, 15 ... Pinch roller, 16 ... Timing belt, 17 ... Guide guide, 18a ... First plate shape Member, 18b
... second plate member, 18c ... third plate member, 19a ... through hole of first plate member, 19b ... through hole of second plate member, 1
9c: through hole of the third plate member, 20: forming die, 21: base, 22: intermediate jig, 23: upper jig, 22a: through hole of intermediate jig, 23a: through hole of upper jig , 24 ... frame material, 25
... Cutter, 28 ... Gap, 30 ... Parts feeder, 3
1: fine metal pin, 32: tube, 33: pressing means, 3
4 Valve, 35 Guide guide, 36 Guide guide through hole, 40 Mold, 41 Thin film, 42 Intermediate jig, 4
2a: through hole of intermediate jig, 43: upper jig, 44: base,
45: Composite material, 50: Substrate material, 51: Composite material, 52
... Metal wire or fine metal pin.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Tetsuji Takagi 2-56, Suda-cho, Mizuho-ku, Nagoya-shi, Aichi Japan Inside Nihon Insulators Co., Ltd. (72) Inventor Akio Enomoto 2-56, Suda-cho, Mizuho-ku, Nagoya-shi, Aichi No. Japan Insulators Co., Ltd.

Claims (9)

[Claims] 1. A mold provided with a large number of pores at a predetermined pitch is placed on a horizontally movable table, and a metal wire is inserted into the pores of the mold by wire supply means. Cutting, then moving the table horizontally for a predetermined distance, inserting a metal wire into the other pores of the mold, and then cutting the wire repeatedly, to form a large number of metal pieces at a predetermined pitch in the mold. A method for manufacturing a printed circuit board material, comprising: arranging wires in parallel, pouring a composite material composed of plastic and ceramic into the mold, and curing the composite material. 2. A metal mold having a large number of pores provided at a predetermined pitch and a thin film disposed on a molding surface is placed on a horizontally movable table, and metal fine pins are supplied by a fine metal pin supply means. After the pins are pressed and sent out to pierce the thin metal pins of the molding tool with the thin metal pins, the table is moved horizontally by a predetermined distance to pierce the thin metal pins of the molding tool with the other portions. A plurality of fine metal pins arranged side by side at a predetermined pitch in the molding die, and then a composite material made of plastic and ceramic is poured into the molding die, and the composite material is cured. Manufacturing method of substrate material. 3. A plate-shaped intermediate jig having a base, a plurality of through holes disposed on the base at a predetermined pitch, and a plate-shaped intermediate jig disposed on the intermediate jig. 3. A plate-shaped upper jig in which a large number of through holes are arranged at a predetermined pitch at positions corresponding to the through holes of the intermediate jig.
A method for producing the printed circuit board material according to the above. 4. The method for manufacturing a printed circuit board material according to claim 2, wherein the thin metal pin supply means is a parts feeder. 5. The method for producing a printed circuit board material according to claim 1, wherein the content of the ceramic in the composite material is 40% by volume or more and 90% by volume or less. 6. The production of a printed circuit board material according to claim 1, wherein the composite material comprises glass fiber or silica glass cut to a predetermined length and an epoxy resin. Method. 7. A first wire supply means comprising a wire bobbin, a drive motor for extracting a metal wire from the wire bobbin at a predetermined length, and a pinch roller, and accurately guiding the metal wire to a predetermined position. A base guide, a base, a plate-shaped intermediate jig arranged on the base, and a large number of through-holes arranged at a predetermined pitch, and a plate-shaped intermediate jig arranged on the intermediate jig, A forming die including a plate-shaped upper jig in which a large number of through holes are arranged at a predetermined pitch at positions corresponding to the through holes of the jig, cutting means for cutting the metal wire, An apparatus for manufacturing a wire structure, comprising: a table on which a molding die is placed, the table being movable in a horizontal direction. 8. A thin metal pin supply means for pressing and sending a large number of thin metal pins one by one, a guide for accurately guiding the thin metal pin to a predetermined position, a base, and the base. A plate-shaped intermediate jig arranged on the table and having a large number of through holes arranged at a predetermined pitch; and a large number of through holes arranged on the intermediate jig and corresponding to the through holes of the intermediate jig. With a plate-shaped upper jig arranged at a predetermined pitch,
A wire structure, comprising: a mold having a thin film disposed between the intermediate jig and the upper jig; and a horizontally movable table on which the mold is placed. Manufacturing equipment. 9. The wire structure manufacturing apparatus according to claim 8, wherein the thin metal pin supply means is a parts feeder.