JP2000068623A - Manufacture of board material for printed circuit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to manufacture a board material for a printed circuit, which is characterized by that a favorable electrical continuity of the board material with a printed circuit is ensured and at the time of using the board material, the thermal expansion of the board material can be controlled so that the board material is not separated from a conductive layer and an insulating material is not separated from metal wires and moreover, a printed circuit board can be brought into the state of higher density by the use of the board material and the board material is excellent in dimensional accuracy. SOLUTION: This method of manufacturing a board material for a printed circuit is method wherein a flat plate-shaped frame body 10 having wire housing grooves of a prescribed pitch on the upper surfaces of both side parts thereof is used, wires 12 are spanned across the grooves 11 formed in this frame body 10 in a state that the wires 12 are pulled and flat plate-shaped frame bodies 10 are stacked in order on this frame body 10, whereby a metal mold of a structured, wherein the wires 12 are disposed in tension between both sidewall parts thereof, is formed and thereafter, a composite material consisting of a plastic and a ceramic is flowed in this metal mold and after the composite material is cured, the wires 12 disposed in tension are sliced in such a way as to cross the wires 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a printed circuit board material.

[0002]

2. Description of the Related Art A printed circuit board has a slot for an integrated circuit and a group of connection terminals for various electronic components formed on one side, and a conductive path connecting the components printed on the other side. Conventionally, it has been used in large quantities as an element member of electronic equipment. FIG. 12 is a perspective view showing an example of a printed circuit board, which is formed by plating a conductive metal 2 on a plate made of an insulating material such as epoxy resin or glass so as to conduct between the surfaces. A photoprocess layer 3 as a conductive layer having a predetermined conductor pattern (circuit) formed thereon is laminated on both surfaces of the plate material 1, and a connection terminal group and a conductive path 4 are formed outside the photoprocess layer 3 by printing or the like. Thus, a printed circuit board is configured.

Conventionally, for a substrate material 1 used for such a printed circuit board, conventionally, for example, after a plate-like body made of an insulating material such as epoxy resin or glass is manufactured, a through hole for conduction is formed at a predetermined position by drilling. Then, the through hole is covered with a conductive metal such as copper by plating or the like, and the through hole is sealed with a sealing material.

[0004] However, when drilling a plate-like body, there is a risk that machining chips will be generated along with the processing and a product defect will occur. In addition, in plating, there is a high possibility that cracks will occur at the edge of the substrate material. There is a problem of causing poor conduction. Further, in drilling, the ratio of the length (thickness of the substrate) / hole diameter of the through hole that can be processed is limited to about 5, for example, in the case of a 1 mm thick substrate, the lower limit is about 0.2 mm in diameter. . However, in order to increase the density of the printed circuit board, it is preferable to use a smaller hole diameter, which is difficult with drilling.

In addition, an electric wire such as Ni or Co is inserted into the frame body, an insulating material such as an epoxy resin is melted and poured, and after being cured, the cut is made at a plane perpendicular to the metal wire. (Japanese Patent Laid-Open No. 49-49)
-8759). However, since this circuit board uses an epoxy resin or the like, there is a problem that when the resin is cured, the volume shrinks by about 2 to 3%, and the dimensional accuracy such as the pitch of the through holes is impaired. In high-density printed circuit boards, dimensional accuracy is extremely important, which has been a major drawback. Furthermore, this circuit board does not consider any difference in thermal expansion with the conductive layer (photo-process layer) laminated on one side or both sides, so it may be affected by impact or temperature difference during use.
The substrate material and the conductive layer may be separated. In addition, there is a possibility that the insulating material and the metal wire may peel off.

[0006]

Accordingly, the present invention provides
In view of the above-mentioned conventional problems, the purpose is to ensure good electrical continuity, and to ensure that thermal expansion does not occur between the substrate material and the conductive layer, and between the insulating material and the metal wire during use. An object of the present invention is to provide a method for manufacturing a printed circuit board material capable of controlling the properties. Another object of the present invention is to provide a method for manufacturing a printed circuit board material capable of manufacturing a printed circuit board material having a higher density and a higher dimensional accuracy. is there.

[0007]

Means for Solving the Problems According to the present invention, a flat frame having a wire accommodating groove having a predetermined pitch on the upper surface on both sides is used, and a wire is pulled into the wire accommodating groove of the flat frame. In a state in which the wire is stretched over the flat frame and the flat frame is sequentially stacked on the flat frame to form a mold in which a wire is stretched between both side walls, plastic and ceramic are formed in the mold. Pour the composite material
After the composite material is cured, a method for manufacturing a printed circuit board material is provided, which is sliced across the stretched wire.

According to the present invention, a flat frame having a wire accommodating groove with a predetermined pitch on the upper surface of both side portions is used,
After a wire is stretched around the wire accommodating groove of the flat frame member, a composite material made of plastic and ceramic is poured into the flat frame member, and the composite material is cured to produce a flat cast member. After that, the flat casting members are integrated by stacking, and then sliced so as to cross the stretched wires, thereby providing a method of manufacturing a printed circuit board material.

Further, according to the present invention, after a conductive wire is stretched in a mold at a predetermined pitch, the mold is inclined to narrow the wire pitch, and then the mold is formed. A method for manufacturing a printed circuit board material is provided, in which a composite material made of plastic and ceramic is poured into the inside, the composite material is cured, and then sliced so as to cross the stretched wire.

In the present invention, the content of the ceramic in the composite material is preferably 40% by volume or more and 90% by volume or less, because volume shrinkage during curing can be further reduced. In addition, when the composite material is made of glass fiber or glass beads cut to a predetermined length and an epoxy resin, it is desirable because the substrate material has no anisotropy in thermal expansion and can provide a predetermined strength. .

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION The method for manufacturing a printed circuit board material according to the present invention can be roughly classified into three types. In other words, when the composite material is poured after the mold is constructed by stacking the plate-shaped frames with the wires stretched in the tension state (the first method), the flat frame with the wires stretched in the tension state is On the other hand, a composite material is poured and cured to produce a flat cast member, and when stacking the flat cast members (second method), after the wires are stretched, the mold is inclined to narrow the wire pitch. This is the case where the composite material is poured after the above (third method).

First, in both the first method and the second method, a flat frame having a wire accommodating groove having a predetermined pitch on the upper surface of both sides is used. Then, the wire is stretched over the wire accommodating groove of the flat frame in a tensioned state. In the first method, next, a flat frame having the same configuration is sequentially stacked on the flat frame on which the wire is stretched in a tension state, so that the wire is provided at a predetermined pitch between both side walls. Build a stretched mold. Next, a composite material composed of plastic and ceramic is usually melted and fluidized and poured into the mold in which the wire is stretched, and after the composite material is cured, the cured composite material is traversed through the wire. As described above, the desired printed circuit board material is usually manufactured by slicing at right angles to the wire.

In the second method, a composite material made of plastic and ceramic is poured into a flat frame in which the wire is stretched and stretched, and the composite material is cured to produce a flat cast member. Then, the flat cast members are integrated by stacking, and then sliced so as to cross the stretched wires, thereby producing a desired printed circuit board material.

By employing such a manufacturing method, it is possible to obtain a substrate material on which wires (metal wires) are arranged at a constant pitch and with high dimensional accuracy. Since this substrate material can be used as a standard substrate of a printed circuit, it can be applied to various circuits and uses, and is very preferable. In addition, since this substrate material is made of a composite material composed of plastic and ceramic, it has good moldability, and has properties such as excellent insulation, low thermal expansion, and abrasion resistance.
By changing the type and the mixing ratio of the plastic and the ceramic, the thermal expansion property can be controlled, the thermal expansion with the conductive layer disposed on one side or both sides can be matched, and the possibility of peeling or the like is extremely small. When the first method and the second method are compared, the first method has better wire dimensional accuracy, but the second method does not form a cavity because the casting is easy.

In addition, if a method of narrowing the wire pitch by inclining the mold after the wire is stretched as in the third method is adopted, an appropriate wire pitch can be realized, and as a result, the wire has a dimensional accuracy. A well-arranged substrate material can be obtained, which is extremely preferable.

Hereinafter, an example of a method for manufacturing a printed circuit board material according to the present invention will be described with reference to FIGS. First,
As shown in FIGS. 1 and 2, a predetermined number of flat frame bodies 10 having wire accommodation grooves 11 of a predetermined pitch on the upper surface of both side portions are prepared. The flat frame body 10 has, for example, 1.2
It has a wire accommodating groove 11 having a fine pitch of 7 mm or less, and the thickness of the flat frame member 10 is, for example, 1.27.
mm or less. This flat frame 10
The wire 12 is stretched over the wire accommodating groove 11 in a tension state.

The wire 12 is laid over the flat frame 10 by using a normal wire bobbin 13 as shown in FIG. 4A, or as shown in FIGS. 4B and 4C. Is wound again from each wire bobbin 13 to an alignment bobbin 14 having a pitch of, for example, 1.27 mm.
Can also be used. As shown in FIG. 1, the wire 12 is stretched from the wire bobbin 13 or the alignment bobbin 14 to the wire accommodating groove 11 of the flat frame 10 through a slit 15 having a pitch of, for example, 1.27 mm. . After the wire 12 is stretched around the wire receiving groove 11 in a tension state, the wire 12 is fixed to the wire receiving groove 11 by welding, such as laser welding or resistance welding, or as shown in FIG. As a result, the wire 12 is pressed and fixed to the wire housing groove 11.

FIG. 5 shows another example of the wire stretching method. FIG. 5 shows an example of a wire stretching method in a case where a normal wire bobbin is used as it is, and one end of a wire 12 wound around a wire bobbin 13 is fixed to a fixing portion 16. In addition, 17 is a holding part. On the upper surface of the flat frame member 10, the wire 12 is pulled for each one of the slits 15 by using the burrs 18, and
Multiply by 9. On the other hand, on the opposite side of the stopper 19, the wire 12 is accommodated in the wire accommodating groove 11 of the flat frame 10, and is fixed by welding as described above, or as shown in FIG.
Press and fix like As the stopper 19, a projection (with a spring that can be moved in and out) attached to the flat frame 10, and a projection 19 attached to the flat frame 10 as shown in FIG. Those configured so as to be possible (they can be restored to the original state even if they fall down) are preferably used.

As described above, after the wire 12 is stretched around the wire accommodating groove 11 of the flat frame member 10 in a tensioned state, the wire 12 is placed in the mold as in the first method or the second method. A composite material filled and cured can be obtained. First, the first method will be described. In the first method, the plate-shaped frames 10 around which the wires 12 are stretched in a tension state are stacked to construct a mold 21 in which the wires 12 are stretched between both side walls 22 as shown in FIG. . Then, a composite material 23 made of plastic and ceramic is poured into the mold 21. In this case,
It is preferable to adopt a vacuum casting method. Note that it is preferable to arrange the wires so as to be arranged in the vertical direction, since the bending of the wires is small. Next, after the composite material 23 is cured, the flat frame body 10 is removed to produce a composite block body 25 in which the wires 12 are arranged at a predetermined pitch as shown in FIG.

Next, the second method will be described. In the second method, the composite material 23 is poured into the flat frame 10 around which the wire 12 is stretched in a tension state. Also in this case, the vacuum casting method is preferable. Next, the composite material 23
Is cured to produce a plate-shaped casting member 24, and by stacking the plate-shaped casting member 24, as shown in FIG.
A mold 21 is housed in which a composite material 23 is accommodated and the wire 12 is stretched between both side walls 22. Thereafter, by removing the flat frame 10, a composite block 25 in which the wires 12 are arranged at a predetermined pitch as shown in FIG. 7 is manufactured.

In the case of a method in which the wire is stretched and then the mold is inclined to narrow the wire pitch as in the third method, as shown in FIG.
9, and then the link 50 is contracted as shown in FIG.
Can be narrowed. After the predetermined wire pitch is obtained, the composite material 23 is poured into the mold, and the composite block body 25 is manufactured in the same manner as described above.

In FIG. 7, the composite block 25 is
Conductive wires 12 are arranged at a predetermined pitch on a composite material 23 made of plastic and ceramic. The wire 12 is disposed so as to extend linearly from one surface 26 of the composite block body 25 to another surface 27 facing the one surface 26, and the wires 12 protrude from the one surface 26 and the other surface 27. It is formed in the state where it is.

After the composite block 25 as described above is manufactured, the composite block 25 is printed by slicing (cutting) with a band saw, a wire saw, or the like on surfaces A1, A2,... A circuit board material can be manufactured. According to the above-described method of the present invention, the wires 12 can be arranged at predetermined intervals and with high dimensional accuracy. Therefore, the wires 12 are arranged at a narrower pitch (high density), for example, a narrow pitch of 1.27 mm or less. A substrate material can be obtained, and the occurrence of crosstalk, which tends to occur with a narrow pitch, can be prevented as much as possible.

As shown in FIG. 3, the frame members 30 on both sides of the frame body 10 having the wire accommodating groove 11 are made of a high-strength material such as an Fe alloy, as shown in FIG. When the other frame member 31 has a coefficient of thermal expansion larger than that of the wire, a flat frame member forming a mold from the time of casting the composite material to the time of curing is used. Each of the wires and the wires thermally expands. At this time, since the metal mold expands more, a tensile force is applied to the wires and the tensioning condition is more appropriate, which is desirable. Specifically, aluminum, an aluminum alloy, and the like can be given.

FIG. 11 shows an example of a printed circuit board material manufactured by the manufacturing method of the present invention. In FIG. 11, a substrate material 40 is composed of a plastic and a ceramic, and a wire 4 is attached to a composite material 41 formed in a flat plate shape.
2 are arranged at a predetermined pitch. And the wire 42
Are exposed on both sides of the composite material 41, and the substrate material 4
0 can be electrically conducted between both surfaces. For example, as shown in FIG. 12, the substrate material 40 having such a configuration is provided with a conductive layer (photo process layer) 3 on which a predetermined circuit is formed and a connection terminal group 4 on both surfaces thereof. Construct a printed circuit board.

Hereinafter, constituent materials of the substrate material manufactured by the present invention will be described. The composite material constituting the substrate material is made of plastic and ceramic, and is formed by dispersing ceramic particles, ceramic fibers, and the like in a matrix made of plastic. The blending amount of both is
It is appropriately selected according to the properties and purpose such as insulation properties, low thermal expansion properties, and abrasion resistance. However, containing 40% by volume or more and 90% by volume or less of ceramic particles, ceramic fibers, etc. It is preferable in view of the reduced volumetric shrinkage during curing. In the composite material of the present invention,
The volume shrinkage at the time of curing can be 1% or less, and further 0.5% or less, which is extremely advantageous for improving the dimensional accuracy of the wire in the substrate material.

By using such an amount, the composite material can be effectively provided with low thermal expansion properties, abrasion resistance, and the like. If the content of ceramic particles, ceramic fibers, and the like exceeds 90% by volume, the content of plastic becomes too small, and the fluidity during molding may be lost. As ceramics, alumina,
In addition to zirconia and silicon nitride, glass such as silica glass is included. Ceramic is compounded as particles or fibers. Further, a thermosetting resin is preferable as the plastic, and a phenol resin,
Epoxy resins, urea resins, and the like can be used, and these resins may be used in combination of two or more.

In the composite material of the present invention, a chip obtained by cutting a glass fiber into a predetermined length as a ceramic or a material obtained by mixing glass beads with a plastic such as an epoxy resin has no anisotropy in thermal expansion and has an insulating property. It is preferable because it has excellent properties such as low thermal expansion, abrasion resistance and strength.

The material of the wires disposed at a predetermined pitch in the composite material is not particularly limited as long as it is a metal having conductivity, and usually, copper, copper alloy, aluminum, and aluminum alloy are used. It is preferable to be composed of any one kind of metal. In view of wear resistance, flexibility, oxidation resistance, strength and the like, it is more preferable that the wire is made of beryllium copper.

[0030]

As described above, according to the manufacturing method of the present invention, it is possible to obtain a substrate material on which wires are arranged at a constant pitch and with high dimensional accuracy. Since this substrate material can be used as a standard substrate of a printed circuit, it can be applied to various circuits and applications.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing an example of a method of stretching a wire in a method of manufacturing a printed circuit board material according to the present invention.

FIG. 2 is an explanatory sectional view showing an example of a method for fixing a wire.

FIG. 3 is a plan view showing an example of a flat frame used in the present invention.

4 shows an example of a wire bobbin, (a) is a normal wire bobbin, (b) is an alignment bobbin, and (c) is an enlarged view of (b).

FIG. 5 is an explanatory view showing another example of a method of extending a wire in the method of manufacturing a printed circuit board material according to the present invention.

FIG. 6 is a perspective view showing an example of a mold constructed according to the present invention.

FIG. 7 is a partial perspective view showing one example of a composite block manufactured by the present invention.

FIG. 8 is an explanatory diagram showing a state where a wire is hooked on a link.

FIG. 9 is an explanatory diagram showing a state in which a link is contracted.

FIG. 10 is an explanatory view showing a structure of a stopper provided on the flat frame member.

FIG. 11 is a perspective view showing an example of a printed circuit board material obtained by the present invention.

FIG. 12 is a perspective view illustrating an example of a printed circuit board.

[Explanation of symbols]

1 ... substrate material, 2 ... conductive metal, 3 ... photoprocess layer,
4 ... connection terminal group, 10 ... flat frame member, 11 ... wire accommodation groove, 12 ... wire, 13 ... wire bobbin, 14 ... aligned bobbin, 15 ... slit, 16 ... fixed portion, 17 ... holding portion, 18 ... 19: Stop, 20: Jig, 21
... Mold, 22 ... Both side walls, 23 ... Composite material, 25 ... Composite block, 50 ... Link, 51 ... Link intersection, 52
... wire.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Satoru Kawai 2-56, Suda-cho, Mizuho-ku, Nagoya-shi, Aichi Japan Inside Nihon Insulators Co., Ltd. (72) Tadashi Odagiri 2-56, Suda-cho, Mizuho-ku, Nagoya-shi, Aichi No. Japan Insulators Co., Ltd.

Claims (5)

[Claims] 1. A flat frame having a wire accommodating groove of a predetermined pitch on the upper surface of both sides is used, and a wire is stretched over the wire accommodating groove of the flat frame in a tension state. After forming a mold in which wires were stretched between both side walls by stacking flat frame members on the top, a composite material made of plastic and ceramic was poured into the mold, and the composite material was cured. A method for manufacturing a printed circuit board material, comprising: slicing the stretched wire so as to cross the wire. 2. A flat frame having a wire accommodating groove of a predetermined pitch on the upper surface of both side portions, and a wire is stretched over the wire accommodating groove of the flat frame in a tension state. Then, a composite material made of plastic and ceramic is poured, and the composite material is cured to produce a flat cast member. Then, the flat cast members are integrated by stacking, and then the stretched wire is traversed. A method for producing a printed circuit board material, characterized by slicing. 3. After a conductive wire is stretched in a mold at a predetermined pitch, the mold is inclined to narrow the pitch of the wire, and then the plastic and ceramic are placed in the mold. A method for producing a printed circuit board material, comprising: pouring a composite material into the composite material; curing the composite material; and slicing the stretched wire across the wire. 4. The method for producing a printed circuit board material according to claim 1, wherein the content of the ceramic in the composite material is 40% by volume or more and 90% by volume or less. 5. The production of a printed circuit board material according to claim 1, wherein the composite material is composed of glass fibers or glass beads cut to a predetermined length and an epoxy resin. Method.