JP2000077821A - Manufacture of board material for printed circuit, framework using method thereof and wire aligning and mounting equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a board material for printed circuit, which secures an excellent electric continuity, can control the thermal expansion property so that the board material and the conducting layer and the insulating material and a metal wire are not separated in use and has an excellent high deisity and the dimensional accuracy. SOLUTION: Facing both side-wall parts 22 and a box-type frame main body 10 whose upper part is opened are used. A wire holding member 11 having the wire containing groove at the specified pitch is provided at the upper surface. Thereafter, a wire 14 is bridged in the tensile state in the wire containing groove of both side wall parts 22. Then, the wire holding member 11 is overlapped on the wire holding part 11 sequentially, and both side wall parts 22 are formed, and the metal mold is constituted. At the same time, a wire 14 is provided between both side wall parts 22. Thereafter, the composite material comprising plastic and ceramic is flowed into the die. After the composite material is hardened, the wire holding member 11 is removed, and the hardened composite material is obtained. This hardening composite material is sliced so as to cross the wire 14. This is the manufacturing method of the substrate material for the printed circuit.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed circuit board material, a mold used for the method, and a wire aligning / wiring method.
The present invention relates to a stacking device.

[0002]

2. Description of the Related Art A printed circuit board has a slot for an integrated circuit and a group of connection terminals for various electronic components formed on one side, and a conductive path connecting the components printed on the other side. Conventionally, it has been used in large quantities as an element member of electronic equipment. FIG. 7 is a perspective view showing an example of a printed circuit board, which is formed by plating a conductive metal 2 on a plate made of an insulating material such as epoxy resin or glass so as to conduct between the surfaces. On both sides of the plate material 1,
A photo-process layer 3 which is a conductive layer having a predetermined conductor pattern (circuit) formed thereon is laminated, and further, a connection terminal group and a conductive path 4 are formed outside the photo-process layer 3 by printing or the like. Is configured.

Conventionally, for a substrate material 1 used for such a printed circuit board, conventionally, for example, after a plate-like body made of an insulating material such as epoxy resin or glass is manufactured, a through hole for conduction is formed at a predetermined position by drilling. Then, the through hole is covered with a conductive metal such as copper by plating or the like, and the through hole is sealed with a sealing material.

[0004] However, when drilling a plate-like body, there is a risk that machining chips will be generated along with the processing and a product defect will occur. In addition, in plating, there is a high possibility that cracks will occur at the edge of the substrate material. There is a problem of causing poor conduction. Further, in drilling, the ratio of the length (thickness of the substrate) / hole diameter of the through hole that can be processed is limited to about 5, for example, in the case of a 1 mm thick substrate, the lower limit is about 0.2 mm in diameter. . However, in order to increase the density of the printed circuit board, it is preferable to use a smaller hole diameter, which is difficult with drilling.

In addition, an electric wire such as Ni or Co is inserted into the frame body, an insulating material such as an epoxy resin is melted and poured, and after being cured, the cut is made at a plane perpendicular to the metal wire. (Japanese Patent Laid-Open No. 49-49)
-8759). However, since this circuit board uses an epoxy resin or the like, there is a problem that when the resin is cured, the volume shrinks by about 2 to 3%, and the dimensional accuracy such as the pitch of the through holes is impaired. In high-density printed circuit boards, dimensional accuracy is extremely important, which has been a major drawback. Furthermore, this circuit board does not consider any difference in thermal expansion with the conductive layer (photo-process layer) laminated on one side or both sides, so it may be affected by impact or temperature difference during use.
The substrate material and the conductive layer may be separated. In addition, there is a possibility that the insulating material and the metal wire may peel off.

[0006]

Accordingly, the present invention provides
In view of the above-mentioned conventional problems, the purpose is to ensure good electrical continuity, and to ensure that thermal expansion does not occur between the substrate material and the conductive layer, and between the insulating material and the metal wire during use. An object of the present invention is to provide a method for manufacturing a printed circuit board material capable of controlling the properties. Another object of the present invention is to provide a printed circuit board material that can be manufactured with higher workability and higher dimensional accuracy with higher workability and higher density. It is to provide a manufacturing method of.
It is a further object of the present invention to provide a formwork and a wire aligning / stacking device that can be suitably used in the above-described manufacturing method.

[0007]

That is, according to the present invention, a box-shaped form body having opposite side walls and an open upper portion is used, and the open side walls have a predetermined pitch on the upper surface. After installing the wire holding member having the wire holding groove, the wire is stretched over the wire holding groove on both side walls in a tension state, and then the wire holding members are sequentially stacked on the wire holding member to form the side walls. After forming and constructing a mold and stretching a wire between both side walls, a composite material made of plastic and ceramic is poured into the mold, and after the composite material is cured, the wire holding member is removed. Removing to obtain a cured composite, this cured composite,
There is provided a method for manufacturing a printed circuit board material, which is characterized by slicing across a wire.

In the present invention, the content of the ceramic in the composite material is preferably 40% by volume or more and 90% by volume or less, because volume shrinkage during curing can be further reduced. In addition, when the composite material is made of glass fiber or glass beads cut to a predetermined length and an epoxy resin, it is desirable because the substrate material has no anisotropy in thermal expansion and can provide a predetermined strength. .

Further, according to the present invention, a box-shaped form main body having opposed side walls and an upper portion opened, and the open side walls have a wire accommodating groove having a predetermined pitch on an upper surface. Both side walls configured by stacking wire holding members,
A mold is provided, comprising: further,
ADVANTAGE OF THE INVENTION According to this invention, the wire which can arrange | position two or more rows of wire which consists of the winding shaft comprised with the several hanging bar which has a wire positioning groove, and the wire feeding device which synchronizes with rotation of this winding shaft A wire aligning / stacking device is provided, comprising: an aligning device; the above-described mold; and an elevating device for vertically moving the mold.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION An outline of a method for manufacturing a printed circuit board material according to the present invention is as follows. In the present invention, a box-shaped form main body having opposing side walls and an open upper portion is used.
Then, a wire holding member having a wire accommodating groove having a predetermined pitch on the upper surface is installed on the open side walls of the form body, and the wire is stretched over the wire accommodating grooves of the both side walls in a tensioned state. Next, a die is constructed by sequentially stacking the wire holding members on the wire holding members to form both side walls, and a wire is stretched between the both side walls at a predetermined pitch. Next, a composite material made of plastic and ceramic is poured into the metal mold in which the wires are stretched, and after the composite material is cured, the mold holding the wire holding member is removed to obtain a cured composite material. Then, the cured composite material is sliced so as to cross the wires to produce a desired printed circuit board material.

[0011] As described above, in the production method of the present invention,
As a mold, a box-shaped mold main body having opposing side walls and an upper part opened and a wire holding member having a wire accommodating groove having a predetermined pitch on the upper surface are stacked on the opened side walls. Use the one consisting of both side walls. Furthermore, in order to precisely wrap a large number of wires in a tension state between both side walls of the formwork, the present invention provides a winding shaft including a plurality of hanging rods having wire positioning grooves, A wire aligning device capable of aligning two or more rows of wires, comprising a wire feeding device synchronized with rotation, a wire aligning / stacking device including the above-described mold, and an elevating device for vertically moving the mold up and down. Preferably, an apparatus is used.

By adopting such a manufacturing method, a mold and a wire aligning / stacking device, so-called mold dispersion can be easily performed, so that workability is excellent and wires (metal wires) are formed at a constant pitch. A substrate material arranged with high dimensional accuracy can be obtained. Since this substrate material can be used as a standard substrate of a printed circuit, it can be applied to various circuits and uses, and is very preferable. In addition, since this substrate material is made of a composite material composed of plastic and ceramic, the material has good moldability, excellent insulation, low thermal expansion, and excellent wear resistance. By changing the type and the mixing ratio of the ceramic and the ceramic, the thermal expansion property can be controlled, the thermal expansion with the conductive layer disposed on one side or both sides can be matched, and the possibility of peeling or the like is extremely small.

Hereinafter, an example of a method for manufacturing a printed circuit board material according to the present invention will be described with reference to FIGS. First, as shown in FIG. 3, a box-shaped form main body 10 having opposing side walls and an open upper portion is prepared. At the same time, a predetermined number of wire holding members 11 for forming the side walls are prepared. The wire holding member 11 has, on its upper surface, a wire accommodating groove 12 having a fine pitch of, for example, 1.27 mm or less, and the thickness of the wire holding member 11 is also extremely thin, for example, of 1.27 mm or less. It is. After the wire holding members 11 are installed one by one on the open side walls of the form body 10, as shown in FIG.
A predetermined number of wires 14 are inserted into the wire receiving grooves 12 of the wire holding member 11 by the stacking device 13, and a holding jig 15 is inserted.
Then, the wire 14 is fixed to the wire holding member 11 by the auxiliary wedge 16.

As shown in FIG. 1, the wire aligning / stacking device 13 includes a winding shaft 20 having two rods 19 having wire positioning grooves engraved at a predetermined pitch,
A wire aligning device 21 capable of aligning two rows of upper and lower wires comprising a wire feeding device 17 as a wire bobbin synchronized with the rotation of 0;
An elevating device (not shown) for elevating the form body 10 up and down is provided. In the wire aligning / stacking device 13 having such a configuration, the wire 14 wound on the wire bobbin 17 is driven by the motor 18 and has a predetermined tensile force along the groove formed in the rod 19 of the winding shaft 20. It is to be stretched. Since the positioning of the groove of the rod-like body 19 is appropriately performed, one wire bobbin 1
With one wire 14 from 7, the wires can be stretched at a predetermined pitch.

As described above, the wire aligning / stacking device 1
The lower wire 14 of the upper and lower two rows is held by the holding jig 15 and the auxiliary wedge 16 using the wire holding member 11.
At the same time, the wire 14 is bent and cut at the fixed portion. Next, after lowering the form body 10 by the lifting device, the winding shaft 20 is rotated by 180 degrees to fix the upper wire 14 to the wire holding member 11, and at the same time, the wire 14 is bent and cut at the fixed portion. In this manner, the wire holding members 11 are sequentially stacked on the wire holding members 11, and the wires 14 are arranged by the wire aligning / stacking device 13.
The mold 2 is fixed to the wire holding member 11 and cut repeatedly to form the side walls 22 of the mold body 10 so that the mold 2
3, and the wires 14 are stretched between the side walls 22 at a predetermined pitch.

FIG. 4 is a schematic configuration diagram showing another embodiment of the wire aligning / stacking device. In this embodiment, a wire aligning / stacking device 40 includes a winding shaft 42 having four hanging rods 41 in which wire positioning grooves are engraved at a predetermined pitch, and a wire synchronized with the rotation of the winding shaft 42. A wire aligning device 44 for aligning four rows of wires composed of a feeding device 43, a formwork body 45,
An elevating device 46 for elevating the form body 45 up and down.
It is provided with. According to the wire aligning / stacking device 40 shown in the embodiment of FIG. 4, a predetermined number of wires can be inserted into the wire receiving groove of the wire holding member by rotating the winding shaft 42 by 90 degrees, Extremely efficient.

As described above, the composite material 24 made of plastic and ceramic is melted and poured into the metal mold 23 on which the wire 14 is stretched. At this time, FIG.
As shown in (b), it is preferable to adopt a so-called vacuum casting method in which a lid 28 is put on the upper part of the mold 23 and the pressure is reduced from the upper part while the composite material 24 is poured from the lower part of the mold 23. Next, after the composite material 24 is cured, a mold dismounting operation for removing the wire holding members 11 forming the both side walls 22 of the mold body 10 is performed. The present invention has a great feature in this point, and by using the mold having the above-described configuration, mold dispersion can be easily performed, and a cured composite material can be easily obtained with good workability. That is, as shown in FIG. 5, a composite block 25 in which the wires 14 are arranged at a predetermined pitch is manufactured.

In FIG. 5, the composite block 25 is
Conductive wires 14 are arranged at a predetermined pitch on a composite material 24 made of plastic and ceramic. The wire 14 is disposed so as to extend linearly from one surface 26 of the composite block body 25 to another surface 27 facing the one surface 26, and the wires 14 protrude from the one surface 26 and the other surface 27. It is formed in the state where it is.

After producing the composite block 25 as described above, the composite block 25 is printed by slicing (cutting) with a band saw, a wire saw, or the like on the surfaces A1, A2,... A circuit board material can be manufactured. According to the above-described method of the present invention, since the wires 14 can be arranged at a predetermined interval and with high dimensional accuracy, the wires 14 are arranged at a narrower pitch (high density), for example, a narrow pitch of 1.27 mm or less. A substrate material can be obtained, and the occurrence of crosstalk, which tends to occur with a narrow pitch, can be prevented as much as possible.

A surface heater is attached to the inside of the mold body 10 of the present invention in order to maintain the composite material 24 at a predetermined temperature. Wire accommodation groove 1 of wire holding member 11
The shape of No. 2 is not particularly limited, but usually a V-shaped or U-shaped cross section is used. The depth of the groove 12 is set so that the wire 14 to be accommodated is at the same height as the upper surface of the wire holding member 11, or
It is preferable that the wire 14 is formed to be slightly higher than the upper surface of the wire 1 because the wire 14 can be tightly fixed and stretched. The wire housing groove 12 is usually formed by grinding, but the wire housing groove 1 is formed by extrusion.
It is suitable and suitable for mass production to produce the wire holding member 11 having 2. As the material forming the form body and the wire holding member, if a material having a thermal expansion coefficient larger than the coefficient of thermal expansion of the wire is used, the form body, the wire and the composite material are poured from the time of casting to the time of curing. Each of the holding member and the wire thermally expands, but at that time, the form body and the wire holding member expand more greatly,
It is desirable that a tensile force is applied to the wire so that the tension is more appropriate. Specifically, aluminum, an aluminum alloy, and the like can be given.

FIG. 6 shows an example of a printed circuit board material manufactured by the manufacturing method of the present invention. In FIG. 6, a substrate material 30 is composed of a plastic and a ceramic, and a wire 32 is attached to a composite material 31 formed in a flat plate shape.
Are arranged at a predetermined pitch. Then, the ends of the wires 32 are exposed on both sides of the composite material 31 and the substrate material 30
Can be electrically connected between the two surfaces of the substrate. For example, as shown in FIG. 7, the substrate material 10 having such a configuration is provided with a conductive layer (photo process layer) 3 on which a predetermined circuit is formed and a connection terminal group 4 on both surfaces thereof.
Construct a printed circuit board.

Hereinafter, constituent materials of the substrate material manufactured by the present invention will be described. The composite material constituting the substrate material is made of plastic and ceramic, and is formed by dispersing ceramic particles, ceramic fibers, and the like in a matrix made of plastic. The blending amount of both is
It is appropriately selected according to the properties and purpose such as insulation properties, low thermal expansion properties, and abrasion resistance. However, containing 40% by volume or more and 90% by volume or less of ceramic particles, ceramic fibers, etc. It is preferable in view of the reduced volumetric shrinkage during curing. In the composite material of the present invention,
The volume shrinkage at the time of curing can be 1% or less, and further 0.5% or less, which is extremely advantageous for improving the dimensional accuracy of the wire in the substrate material.

By using such a blending amount, it is possible to effectively impart low thermal expansion property, abrasion resistance, and the like to the composite material. If the content of ceramic particles, ceramic fibers, and the like exceeds 90% by volume, the content of plastic becomes too small, and the fluidity during molding may be lost. As ceramics, alumina,
In addition to zirconia and silicon nitride, glass such as silica glass is included. Ceramic is compounded as particles or fibers. Further, as the plastic, any of a thermoplastic resin and a thermosetting resin can be used. As the thermoplastic resin, for example, various resins such as vinyl chloride, polyethylene, polypropylene, polycarbonate, liquid crystal polymer, polyamide, and polyimide can be used, and two or more of these resins may be used in combination. On the other hand, as the thermosetting resin, a phenol resin, an epoxy resin, a urea resin, or the like can be used,
Further, two or more of these resins may be used in combination.

In the composite material of the present invention, a chip obtained by cutting a glass fiber into a predetermined length as a ceramic or a material obtained by mixing glass beads with a plastic such as an epoxy resin has no anisotropy in thermal expansion and has an insulating property. It is preferable because it has excellent properties such as low thermal expansion, abrasion resistance and strength.

The material of the wires arranged at a predetermined pitch in the composite material is not particularly limited as long as it is a metal having conductivity, but is usually copper, copper alloy, aluminum, and aluminum alloy. It is preferable to be composed of any one kind of metal. In view of wear resistance, flexibility, oxidation resistance, strength and the like, it is more preferable that the wire is made of beryllium copper.

[0026]

As described above, according to the manufacturing method of the present invention, it is possible to easily perform mold dispersion.
It is possible to obtain a substrate material which is excellent in workability and in which wires are arranged at a constant pitch with high dimensional accuracy. Since this substrate material can be used as a standard substrate of a printed circuit, it can be applied to various circuits and applications. Further, by using the mold and the wire aligning / stacking device of the present invention, the above-described manufacturing method can be more appropriately performed.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of a method for manufacturing a printed circuit board material according to the present invention.

2A is a plan view of FIG. 1, and FIG. 2B is an explanatory view showing a method of introducing a composite material into a mold.

FIG. 3 is a perspective view showing an example of each member of a mold used in the present invention.

FIG. 4 is a schematic configuration diagram showing another embodiment of the wire aligning / stacking device according to the present invention.

FIG. 5 is a partial perspective view showing an example of a composite block manufactured by the present invention.

FIG. 6 is a perspective view showing an example of a printed circuit board material obtained by the present invention.

FIG. 7 is a perspective view showing an example of a printed circuit board.

[Explanation of symbols]

1 ... substrate material, 2 ... conductive metal, 3 ... photoprocess layer,
DESCRIPTION OF SYMBOLS 4 ... Connection terminal group, 10 ... Form body, 11 ... Wire holding member, 12 ... Wire accommodation groove, 13 ... Wire alignment / stacking device, 14 ... Wire, 15 ... Holding jig, 16 ... Auxiliary wedge, 17 ... Wire bobbin , 18 ... Motor, 19 ... Rod, 20 ... Wound shaft, 21 ... Wire alignment device, 22 ... Both side walls, 23 ... Mold, 24 ... Composite material, 25 ... Composite block, 26 ... One of composite block Surface, 27: Other surface facing one surface, A1, A2: Surface perpendicular to the wire, 28:
Lid, 30: substrate material, 31: composite material, 32: wire, 4
0: wire aligning / stacking device, 41: hanging bar, 42: winding shaft, 43: wire feeding device, 44: wire aligning device, 45: formwork body, 46: lifting device.

Claims (5)

[Claims] 1. A box-shaped form body having opposed side walls and an open upper portion, and a wire holding member having a wire accommodating groove having a predetermined pitch on an upper surface is installed on each of the opened side walls. Thereafter, the wire is stretched over the wire accommodating grooves in both side walls in a tension state, and then the wire holding members are sequentially stacked on the wire holding members to form both side walls, thereby constructing a mold and forming both sides. After stretching the wire in between,
After pouring a composite material composed of plastic and ceramic into the mold and curing the composite material, the wire holding member is removed to obtain a cured composite material, and the cured composite material is sliced across the wire. A method for manufacturing a printed circuit board material. 2. The method according to claim 1, wherein the content of the ceramic in the composite material is 40% by volume or more and 90% by volume or less. 3. The method according to claim 1, wherein the composite material comprises glass fiber or glass beads cut to a predetermined length and an epoxy resin. 4. A box-shaped form body having opposite side walls and an upper part opened, and a wire holding member having a wire accommodating groove at a predetermined pitch on the upper surface is stacked on the opened side walls. A formwork comprising: both side walls configured. 5. A wire aligning device capable of aligning two or more rows of wires, comprising: a winding shaft including a plurality of hanging rods having wire positioning grooves; and a wire feeding device synchronized with rotation of the winding shaft. A wire aligning / stacking device comprising: a device; a mold according to claim 4; and a lifting device for vertically moving the mold up and down.