JP2000114690A - Manufacture of substrate material for printed circuit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method by which such a substrate material for printed circuit can be manufactured that can secure good electrical continuity and, when used, its thermal expansion can be controlled so as to prevent the peeling of a conductive layer from the material and an insulating material from a wire. SOLUTION: In a method for manufacturing substrate material for printed circuit, a substrate material for printed circuit is manufactured in such a way that, after a composite material 12 composed of a plastic and ceramic is sprayed upon a conductive wire 11, a bar-like body 15 having a prescribed cross-sectional dimension is manufactured by passing the wire 11 through a die 14 and bar-like members are obtained by cutting the bar-like body 15 into pieces. Then, a plurality of bar-like members is bundled and integrally molded by pressurizing the members and the molded body is sliced into pieces across the wire 11. Alternatively, a monolithic body having a plurality of through holes having prescribed cross-sectional shapes is obtained by extruding the composite material composed of the plastic and ceramic and, after inserting wires into the through holes and integrally molding the monolithic body by pressurizing the body, the molded body is sliced into pieces across the wires.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a printed circuit board material.

[0002]

2. Description of the Related Art A printed circuit board has a slot for an integrated circuit and a group of connection terminals for various electronic components formed on one side, and a conductive path connecting the components printed on the other side. Conventionally, it has been used in large quantities as an element member of electronic equipment. FIG. 6 is a perspective view showing an example of a printed circuit board, which is formed by plating a conductive metal 2 on a plate made of an insulating material such as epoxy resin or glass so as to conduct between the surfaces. On both sides of the plate material 1,
A photo-process layer 3 which is a conductive layer having a predetermined conductor pattern (circuit) formed thereon is laminated, and further, a connection terminal group and a conductive path 4 are formed outside the photo-process layer 3 by printing or the like. Is configured.

Conventionally, for a substrate material 1 used for such a printed circuit board, conventionally, for example, after a plate-like body made of an insulating material such as epoxy resin or glass is manufactured, a through hole for conduction is formed at a predetermined position by drilling. Then, the through hole is covered with a conductive metal such as copper by plating or the like, and the through hole is sealed with a sealing material.

[0004] However, when drilling a plate-like body, there is a possibility that machining chips will be generated along with the processing and a product defect will occur. In addition, there is a high possibility that cracks will occur at the edge of the substrate material, and electrical There is a problem of causing poor conduction. Further, in drilling, the ratio of the length (thickness of the substrate) / hole diameter of the through hole that can be processed is limited to about 5, for example, in the case of a 1 mm thick substrate, the lower limit is about 0.2 mm in diameter. . However, in order to increase the density of the printed circuit board, it is preferable to use a smaller hole diameter, which is difficult with drilling.

In addition, an electric wire such as Ni or Co is inserted into the frame body, an insulating material such as an epoxy resin is melted and poured, and after being cured, the cut is made at a plane perpendicular to the metal wire. (Japanese Patent Laid-Open No. 49-49)
-8759). However, since this circuit board uses an epoxy resin or the like, there is a problem that when the resin is cured, the volume shrinks by about 2 to 3%, and the dimensional accuracy such as the pitch of the through holes is impaired. In high-density printed circuit boards, dimensional accuracy is extremely important, which has been a major drawback. Furthermore, this circuit board does not consider any difference in thermal expansion with the conductive layer (photo-process layer) laminated on one side or both sides, so it may be affected by impact or temperature difference during use.
The substrate material and the conductive layer may be separated. In addition, there is a possibility that the insulating material and the metal wire may peel off.

[0006]

Accordingly, the present invention provides
The present invention has been made in view of the above-described conventional problems, and has as its object to ensure good electrical continuity and prevent the substrate material and the conductive layer, and the insulating material and the metal wire (wire) from peeling during use. Another object of the present invention is to provide a method for manufacturing a printed circuit board material capable of controlling the thermal expansion property. Another object of the present invention is to provide a method for manufacturing a printed circuit board material capable of manufacturing a printed circuit board material having a higher density and a higher dimensional accuracy. is there. It is a further object of the present invention to provide a method for manufacturing a printed circuit board material capable of easily three-dimensionally forming wires at a fine pitch.

[0007]

That is, according to the present invention, after a composite material made of plastic and ceramic is sprayed on a conductive wire, a rod-shaped body having a cross section of a predetermined dimension is formed by passing through a die. Producing, then cutting the rod-shaped body into a rod-shaped member, bundling a plurality of rod-shaped members, integrally forming them by pressing, and slicing so as to cross the wire; Is provided. According to the present invention, a monolith body having a plurality of through-holes having a predetermined cross-sectional shape is obtained by extruding a composite material composed of plastic and ceramic, and then a wire is inserted into the through-holes, and then pressed and integrally formed. And slicing the wire so as to cross the wire.

In the present invention, the content of the ceramic in the composite material is preferably 40% by volume or more and 90% by volume or less, because volume shrinkage during curing can be further reduced. In addition, when the composite material is made of glass fiber or glass beads cut to a predetermined length and an epoxy resin, it is desirable because the substrate material has no anisotropy in thermal expansion and can provide a predetermined strength. . Furthermore, it is preferable that the surface of the wire is coated with a coupling agent, since the compatibility between the wire and the composite material becomes good.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION The method of manufacturing a printed circuit board material according to the present invention is roughly classified into two types.
That is, a method in which a composite material is sprayed on a wire, a rod is formed by passing through a die, the rod is cut, and a plurality of rods are bundled together as a rod to form a single body (first method). ) And a method of extruding a composite material to obtain a monolith having a plurality of through holes, inserting a wire into the through holes, and pressing to integrally mold (second method).

In the first method, first, a fluidized state of a composite material made of plastic and ceramic is sprayed onto a conductive wire, and a rod-shaped object having a composite material having a predetermined thickness adhered to the outer periphery of the wire is formed. obtain. Next, this rod is passed through a die to produce a rod having a cross section of a predetermined dimension. Next, this rod-shaped body is cut into a rod-shaped member,
A plurality of rod-shaped members are bundled, pressed and integrally molded to obtain a monolith body. Then, a desired printed circuit board material is manufactured by slicing the monolith body so as to cross the wire.

In the second method, first, a monolith body having a plurality of through-holes having a predetermined cross-sectional shape is obtained by extruding a composite material composed of plastic and ceramic.
Next, a conductive wire is inserted into the plurality of through holes, pressed and integrally formed, and then sliced so as to cross the wire, thereby producing a desired printed circuit board material.

In the present invention, by employing the above-described manufacturing method, it is possible to obtain a substrate material on which conductive wires (metal wires) are arranged at a constant pitch with high dimensional accuracy. Since this board material can be used as a standard board for printed circuits, it can be applied to various circuits and applications,
Very preferred. In addition, since this substrate material is made of a composite material composed of plastic and ceramic, the material has good moldability, excellent insulation, low thermal expansion, and excellent wear resistance. By changing the type and blending ratio of the ceramic and ceramic, the thermal expansion can be controlled,
Thermal expansion with the conductive layer disposed on one side or both sides can be matched, and the possibility of peeling or the like is extremely small.

Hereinafter, an example of a method for manufacturing a printed circuit board material according to the present invention will be described with reference to the drawings. First, the first method will be described. As shown in FIG. 1, a conductive wire 11 is pulled from a wire bobbin 10 and
By spraying a fluidized composite material 12 made of plastic and ceramic on the wire 11
Rod 1 having composite material 12 of predetermined thickness adhered to the outer periphery of
Get 3. And the rod-shaped object 1 to which the composite material 12 is attached
By passing 3 as it is through the die 14, for example,
A rod 15 having a cross section of 1.27 mm □ is obtained. Next, after solidifying the composite material 12 adhered to the rod 15, the composite material 12 is cut to a predetermined length to produce a number of rod members 16 as shown in FIG. 2.

Next, a predetermined number of the bar-like members 16 thus obtained are bundled, and the monolith body 17 is obtained by pressing the jig 18 from the outer periphery and integrally forming the same.
Then, the monolith body 17 is sliced so as to cross the wire 11 using a wire saw, a band saw, or the like, thereby manufacturing a printed circuit board material. According to the first method, the steps of attaching the composite material 12 to the wire 11, forming the rod-shaped body 15 having a predetermined cross section through the die 14, and then solidifying and cutting the composite material 12 can be performed continuously. A printed circuit board material on which wires are arranged efficiently and efficiently and wires are arranged with high dimensional accuracy can be manufactured.

Next, the second method will be described. FIG.
As shown in FIG. 3, first, a composite material composed of plastic and ceramic is extruded from a nozzle having a plurality of cross-sectional shapes 20 shown in FIG. The honeycomb body 21 having the through holes 22 is obtained. On the other hand, as for the conductive wire, a wire that has been processed linearly and coated with a coupling agent is used. As shown in FIG. 3, the conductive wire 23 is inserted into the plurality of through holes 22 of the honeycomb body 21, and then, The monolith structure 24 is obtained by pressing and integrally molding. Then, the monolith structure 24 is sliced so as to cross the wire 23 using a wire saw, a band saw, or the like, thereby manufacturing a printed circuit board material.
According to the second method, a through-hole having a predetermined pitch can be accurately formed by extrusion, so that a wire can be accurately inserted and arranged therein, and a printed circuit board material on which the wire is arranged with high dimensional accuracy. Can be manufactured.

As described above, according to the manufacturing method of the present invention, the wires can be arranged at a predetermined interval and with high dimensional accuracy, so that the wires can be arranged at a narrower pitch (high density), for example, 1.27 mm or less. Substrate materials arranged at a narrow pitch can be obtained, and the occurrence of crosstalk that tends to occur with the narrow pitch can be prevented as much as possible.

FIG. 5 shows an example of a printed circuit board material manufactured by the manufacturing method of the present invention. In FIG. 5, a substrate material 30 is composed of a plastic and a ceramic, and a wire 32 is attached to a composite material 31 formed in a flat plate shape.
Are arranged at a predetermined pitch. Then, the ends of the wires 32 are exposed on both sides of the composite material 31 and the substrate material 30
Can be electrically connected between the two surfaces of the substrate. For example, as shown in FIG. 6, the substrate material 30 having such a configuration is provided on both sides with a conductive layer (photo process layer) 3 on which a predetermined circuit is formed and a connection terminal group 4.
Construct a printed circuit board.

Hereinafter, constituent materials of the substrate material manufactured by the present invention will be described. The composite material constituting the substrate material is made of plastic and ceramic, and is formed by dispersing ceramic particles, ceramic fibers, and the like in a matrix made of plastic. The blending amount of both is
It is appropriately selected according to the properties and purpose such as insulation properties, low thermal expansion properties, and abrasion resistance. However, containing 40% by volume or more and 90% by volume or less of ceramic particles, ceramic fibers, etc. It is preferable in view of the reduced volumetric shrinkage during curing. In the composite material of the present invention,
The volume shrinkage at the time of curing can be 1% or less, and further 0.5% or less, which is extremely advantageous for improving the dimensional accuracy of the wire in the substrate material.

By using such a compounding amount, the composite material can be effectively provided with low thermal expansion property, abrasion resistance and the like. If the content of ceramic particles, ceramic fibers, and the like exceeds 90% by volume, the content of plastic becomes too small, and the fluidity during molding may be lost. As ceramics, alumina,
In addition to zirconia and silicon nitride, glass such as silica glass is included. Ceramic is compounded as particles or fibers. Further, a thermosetting resin is preferable as the plastic, and a phenol resin,
Epoxy resins, urea resins, and the like can be used, and these resins may be used in combination of two or more.

In the composite material of the present invention, a chip obtained by cutting glass fiber into a predetermined length as a ceramic or a material obtained by mixing glass beads with a plastic such as an epoxy resin has no anisotropy in thermal expansion and has an insulating property. It is preferable because it has excellent properties such as low thermal expansion, abrasion resistance and strength.

The material of the wires arranged at a predetermined pitch in the composite material is not particularly limited as long as it is a metal having conductivity, and usually, copper, copper alloy, aluminum, and aluminum alloy are used. It is preferable to be composed of any one kind of metal. In view of wear resistance, flexibility, oxidation resistance, strength and the like, it is more preferable that the wire is made of beryllium copper.

In the present invention, particularly in the second method, it is preferable to coat the wire with a coupling agent as described above. When the coupling agent is coated in this manner, the bonding strength between the composite material and the wire is improved, and peeling is effectively prevented during use. Here, conventionally known coupling agents can be used. For example, vinyl, epoxy, methacryloxy, amino, chloropropyl, mercapto and the like are effective as silane coupling agents. Also, based on these, water,
A primer dissolved in an organic solvent or the like is also effective. In addition, a titanium-based coupling agent and an aluminum-based coupling agent can also be mentioned as effective ones.

[0023]

As described above, according to the manufacturing method of the present invention, wires can be efficiently arranged at a fine pitch with good workability. A plate material can be obtained. Since this substrate material can be used as a standard substrate of a printed circuit, it can be applied to various circuits and applications.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing an example of a method for manufacturing a printed circuit board material according to the present invention.

FIG. 2 is an explanatory view showing an example of a method of integrally forming a monolith body.

FIG. 3 is an explanatory view showing another example of a method for manufacturing a printed circuit board material according to the present invention.

FIG. 4 is an explanatory diagram showing a cross-sectional shape of a nozzle.

FIG. 5 is a perspective view showing an example of a printed circuit board material obtained by the present invention.

FIG. 6 is a perspective view illustrating an example of a printed circuit board.

[Explanation of symbols]

1 ... substrate material, 2 ... conductive metal, 3 ... photoprocess layer,
4 ... connection terminal group, 10 ... wire bobbin, 11 ... wire,
12 ... composite material, 13 ... rod-like material, 14 ... die, 15 ...
Rod-shaped body, 16: rod-shaped member, 17: monolithic body, 18: jig, 20: cross-sectional shape of nozzle, 21: honeycomb body, 22
... through-hole, 23 ... wire, 24 ... monolith structure, 30
... board material, 31 ... composite material, 32 ... wire.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Tomio Suzuki 2-56 Suda-cho, Mizuho-ku, Nagoya, Aichi Prefecture Inside Nihon Insulators Co., Ltd. (72) Inventor Tadashi Odagiri 2-56, Suda-cho, Mizuho-ku, Nagoya Aichi, Japan No. Japan Insulators Co., Ltd.

Claims (5)

[Claims] After a composite material made of plastic and ceramic is sprayed on a conductive wire, a rod having a cross section of a predetermined dimension is produced by passing through a die, and then the rod is cut into a rod. A method for manufacturing a printed circuit board material, comprising: forming a member, bundling a plurality of rod-shaped members, pressing and integrally forming the members, and slicing the wires so as to cross the wires. 2. A composite material comprising a plastic and a ceramic is extruded to obtain a monolith having a plurality of through-holes having a predetermined cross-sectional shape. Then, a wire is inserted into the through-hole and pressed to be integrally formed. A method for producing a printed circuit board material, comprising slicing so as to cross a substrate. 3. The method according to claim 1, wherein the content of the ceramic in the composite material is 40% by volume or more and 90% by volume or less. 4. The printed circuit board according to claim 1, wherein the composite material comprises glass fibers or glass beads cut to a predetermined length and an epoxy resin. Method. 5. The method according to claim 1, wherein the surface of the wire is coated with a coupling agent.