JP2001230076A - Inspection method and device for organic el element barrier rib - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inspection method and inspection device for barrier ribs of organic EL display device that can inspect for defect at the point of forming barrier ribs and can inspect in a short time. SOLUTION: An in-process element 2b which has made a barrier rib 25 is sampled from the manufacturing line, and a conductive layer 26 is formed on the in-process element 2b, and the short circuit between the conductive layers 26 which are partitioned by the barrier rib 25 is inspected. Thus the defect of the barrier rib 25 can be inspected without forming an organic EL layer 23 and the rear side electrode 24. Further, by connecting a conduction tester 18 in each conductive layer 26, the inspection of short circuit can be made at a time and in a short time.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of inspecting a partition for an organic EL (electroluminescence) element. More specifically, the present invention relates to a method for inspecting a partition of an organic EL element in which a plurality of organic EL films are partitioned by the partition, and at the time of forming the partition, the quality of formation of the partition is easily inspected in a short time. The present invention relates to a method of inspecting a partition for an organic EL element which can be performed.

[0002]

2. Description of the Related Art An organic EL element used in a dot matrix type or a segment type organic EL display device has a plurality of display units, and the organic EL element is divided for each display unit.
With a membrane. There are various configurations in which the organic EL film is divided for each display unit. One of them is a configuration in which the organic EL film is partitioned by partition walls (for example, JP-A-8-315981).

In an organic EL device using this partition, an organic EL film is formed by vapor deposition after forming a partition on a substrate.
As shown in FIG. 13, a substrate-side electrode 22,
An organic EL laminated film including an organic EL film 23 and a back side electrode 24 is formed, and an organic
The L film 23a and the back side electrode 24a are formed. Normal,
These films have a height difference due to the partition walls 25, and are separated from each other and do not contact with each other. However, as shown in FIG.
The defective element 2 in which normal display cannot be performed due to contact between the upper electrodes and the rear electrodes 24 on the partition walls 25 may be produced.

[0004] In order to find such a defective element at the time of manufacturing an organic EL element, the partition 25 is formed by forming a partition 25 as shown in FIG.
Checking the shape has been performed. Also, organic EL
An inspection method for performing a light emission test of the organic EL element 2 on which the film 23 and the back electrode 24 are formed is also performed.

[0005]

However, an inspection method using an SEM or the like is time-consuming and troublesome, and has a limited number of observable parts, and is therefore unsuitable as an inspection method for mass production. In addition, a method using a light emission test can easily find a defective element, but these steps are wasted because a process of forming the organic EL film 23 and the back electrode 24 is included in the middle. Furthermore, in the case of continued failure, a large number of defective elements are generated in each step from the step of forming the partition wall to the inspection step at the time when the defective element is found during normal mass production.

The present invention has been made to solve the above-mentioned problems. An organic EL display device capable of inspecting the quality of a partition when a partition is formed on a substrate and performing the inspection itself in a short time. It is an object of the present invention to provide an inspection method and an inspection device for a partition wall.

[0007]

According to a first aspect of the present invention, there is provided a method of inspecting a partition for an organic EL element, comprising: a substrate on which an electrode and a partition are formed; A method for inspecting a partition in an organic EL element in which a side electrode is formed, wherein a conductive film is formed on the element during the manufacturing, and whether or not there is conduction between adjacent conductive films separated by the partition or The quality of the partition is determined based on the degree.

The above-mentioned “organic EL display device” is provided on a substrate,
A plurality of organic ELs separated by substrate-side electrodes and partition walls
The organic EL device includes a film and a rear electrode that are sequentially stacked. The “substrate” may be any material that can form an organic EL film, and may be arbitrarily selected. Also, there is no particular limitation on whether the material is transparent.

The “organic EL film” is a portion that emits light by recombining holes and electrons supplied from the substrate side electrode and the back side electrode. The organic EL film includes a light emitting layer including at least an organic fluorescent substance. In addition, at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer can be provided in addition to the light emitting layer. Further, various known materials can be used as a material constituting each layer. As a method of forming each of these layers, a method such as a vacuum evaporation method, a spin coating method, a casting method, a sputtering method, and an LB method can be exemplified.

The light emitting layer constituting the organic EL film can be formed of a benzothiazole-based or benzimidazole-based fluorescent whitening agent, a metal chelated oxinoid compound, a metal complex such as a styrylbenzene-based compound, or the like. Further, the hole transport layer can be formed of a triphenylamine derivative or the like, and the electron transport layer can be formed of an aluminum quinolium complex or the like. Further, the hole injection layer can be formed of a copper phthalocyanine complex or the like, and the electron injection layer can be formed of an alkali metal fluoride or oxide.

The “substrate-side electrode” and the “back-side electrode” can also be formed of various materials. When transparency is required for the substrate side electrode and / or the back side electrode, a simple metal such as Au, Ni, etc., and ITO
(Indium Tin Oxide), metal compounds such as CuI, SnO ₂ , and ZnO can be used. Among them, it is particularly preferable to use ITO from the viewpoints of productivity, stable conductivity and the like. When the electrode does not require transparency, in addition to the above materials, it can be formed of metal such as Al, Au, Ag, Mg, Cu, an alloy such as Mg-Ag, or a mixture of Mg and Ag. .

The above “conductive film” can be formed by any physical vapor deposition method such as vacuum vapor deposition, ion plating, and sputtering. However, a metal thin film (including an alloy thin film) is formed by vacuum vapor deposition or the like. Preferably. The materials of the conductive film are Al, Au, Ag, Mg, and Cu.
And alloys and mixtures thereof. It is more desirable that the conductive film material be capable of being deposited at a low temperature.

The present inspection method can be used for an organic EL element of any drive type such as a segment type and a matrix type. However, a plurality of the substrate side electrodes and the rear side electrodes are arranged so as to cross each other. It can be suitably used for the provided dot matrix type element.

Further, as shown in the second invention, the substrate-side electrodes are band-shaped and are arranged in parallel on the substrate, and the partition walls are band-shaped and are arranged in parallel with each other so as to be orthogonal to the substrate-side electrodes. The conductive film is disposed in a strip shape and is arranged in parallel between the partition walls, and a probe pin of a continuity test device for testing continuity between the conductive films may be connected to the terminals of the back electrodes. it can.

Further, as shown in the third invention, the substrate-side electrodes are strip-shaped and are arranged in parallel on the substrate, and the partition walls are arranged in parallel so that the strip-shaped portions are orthogonal to the substrate-side electrodes. The conductive film has a meandering shape in which its ends are connected to each other, and the conductive film has a set of comb-teeth shapes in which teeth are arranged in parallel between the partition walls so as to mesh with each other. A probe pin of a continuity test device for testing continuity between the films can be connected to the conductive film.

The above-mentioned “Forming a conductive film on the element during fabrication”
Refers to, for example, as shown in FIG.
The partition wall 25 formed thereon, the substrate 21 and the substrate-side electrode 2
2 shows that the conductive film 26 is formed on the upper surface of the second exposed layer.

The fourth aspect of the present invention is directed to an apparatus for inspecting a partition for an organic EL element, comprising a vapor deposition apparatus for forming a conductive film on an element during fabrication provided with a substrate on which a substrate-side electrode and a partition are formed, and the partition. A continuity test device for testing continuity between adjacent conductive films, wherein the continuity test device includes at least one set of probe pins respectively connected between the adjacent conductive films separated by the partition, And a continuity tester connected to each of the probe pins.

The vapor deposition device and the continuity test device may be independent of each other or may be integrated. Further, as shown in the fifth invention, the probe pin may be arranged in the vacuum chamber and connected to each of the conductive films.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an inspection method of a barrier for an organic EL device according to the present invention will be described with reference to FIGS. Example 1 In the method of inspecting a partition for an organic EL element of Example 1, a conductive film is formed on an organic EL element during fabrication in which a partition is manufactured in the same manner as the rear electrode, and the conductive layer is partitioned by the partition. This is a method for inspecting short circuits between films.

(1) Configuration of Inspection Apparatus FIG. 1 shows an inspection apparatus 1a used in the present inspection method. As shown in FIG. 1, the inspection apparatus 1a includes a vacuum chamber 11, a fixing member 12, a crucible 13, a heater 14, a pattern mask 1
5, a peripheral mask 16, a probe pin 17, and a continuity tester 18. Further, the vacuum chamber 11, the fixing member 12, the crucible 13, the heater 14, the pattern mask 15, and the peripheral mask 16 correspond to an “evaporation apparatus”. Further, the probe pin 17 and the continuity tester 18 correspond to a “continuity test device”.

The vacuum chamber 11 is connected to a vacuum pump or the like (not shown), and can form an atmosphere necessary for vacuum deposition. Further, the size of the vacuum chamber 11 is a size that can accommodate the element 2b being manufactured, which is one organic EL element. This is for reducing the volume of the vacuum chamber 11 and shortening the time until the completion of the pressure reduction. The fixing member 12 is provided in the vacuum chamber 11, and fixes the element 2 b to be inspected at a position where vacuum deposition can be performed on the element 2 b to be inspected.
Is fixed so as to contact the probe pin 17.

The crucible 13 is for introducing and evaporating the vapor deposition material of the conductive film 26, and the organic EL of the substrate 21.
It is disposed in the vacuum chamber 11 so as to face the surface on which the film 23 is formed. Further, the distance between the crucible 13 and the substrate 21 is substantially the same as the distance when a normal organic EL film, a back side electrode, and the like are formed. The heater 14 is for heating the crucible 13 and evaporating the evaporation material in the crucible 13, and is provided around the crucible 13. The pattern mask 15 is a mask for forming a rectangular pattern of the conductive film 26 as shown in FIG. 3, and is provided so as to be in close contact with the surface on which the organic EL film 23 is formed. The peripheral mask 16 is provided so as to cover the peripheral edge of the substrate 21 and the peripheral edge of the substrate 21 so that the conductive film is not deposited on the probe pins 17.

Further, the probe pin 17 is connected to each of FIGS.
As shown in the figure, the same number of conductive films 26 that need to be inspected are provided, and the back electrode terminals 241 (in order of P ₁ , Q ₁ , P ₂ , Q ₂ , P ₃ ,
Q _3, ..., Etc.) are arranged so as to be in contact with each other.
To conduct. Further, the probe pin 17 is connected to the continuity tester 18.
It is connected to the. The continuity tester 18 is provided outside the vacuum chamber, and has a conductive film 26 partitioned by a partition 25.
The presence or absence or degree of conduction of the conductive film 26 is displayed by measuring the resistance between them.

(2) Inspection Method An inspection method of the organic EL element partition using the inspection apparatus 1a will be described. (a) The element 2b under fabrication for which the main inspection is performed is an element under fabrication for the organic EL element 2a which has been subjected to the steps up to the step of manufacturing the partition wall, and was arbitrarily extracted from the production line. That is, as shown in FIG. 2, the substrate-side electrode 2 is formed on the substrate 21 by ITO or the like.
2 is an in-process element 2b that has been subjected to the substrate-side electrode forming step of forming the second electrode 2 and the partition wall forming step performed by an arbitrary method.
The device 2b is put into the vacuum chamber 11 during the fabrication, and
After being placed on the pattern mask 15 in the
0 ^{- 2} Torr) vacuo extent.

(B) Crucible 1 containing conductive film material (Al)
3, the conductive film material in the crucible 13 is evaporated, and a conductive film 26 is formed on the element 2b by vapor deposition. Note that the conductive film to be manufactured only needs to be able to perform a conduction test, and thus does not require strict control (for example, use of a film thickness sensor or the like) as much as the back side electrode. For this reason, slight film thickness and unevenness do not pose a problem.

FIG. 3 is a schematic view of the device 2b during fabrication in which the conductive film 26 is formed. As shown in FIG.
b includes a substrate 21, a substrate-side electrode 22, a partition 25, and a conductive film 26. The conductive film 26 has the same shape as the rear electrode 24 as shown in FIGS. 3 and 13, and is formed on the substrate 21, the substrate electrode 22, and the partition 25, respectively. For this reason, similarly to the case where the organic EL film 23 is formed on the element 2b during the fabrication, in the case of the defective element 2c in which a defective portion B such as a defect has occurred in the partition, as shown in FIG. The conductive film 26 adjacent to the partition wall 25 on the substrate-side electrode 22 and the conductive film 26 on the partition wall 25 are electrically connected to each other.

(C) The heating of the heater 14 is stopped, and the probe pins 17 are connected to check the continuity of each conductive film partitioned by the partition 25. As shown in FIGS. 1 and 4, the connection portion is a back electrode terminal 241 (P ₁ , Q ₁ , P ₂ , Q ₂ , P ₃ , Q ₃ ...) For connection to the back electrode 24.
Are connected to the probe pins. Then, the resistance between the conductive films 26 is measured by the continuity tester 18. At this time, if there is a large continuity, a short circuit has occurred, and it is understood that the inspected element 2b during fabrication is defective.

The resistance between the conductive films 26 is high when there is no defect due to manufacturing defects. However, in the case of a matrix type organic EL element, as shown in FIG. May be connected by the electrode 22,
Although the resistance value of the substrate-side electrode 22 composed of O or the like is not negligibly small as compared with the resistance value due to the short-circuit of the conductive film 26, the current flows through the substrate-side electrode 22,
The resistance may be low. In this case, in order to determine a short circuit between the conductive films 26, it is necessary to determine whether or not the resistance value is smaller than the resistance value of the substrate-side electrode 22. In order to measure a minute resistance value with high accuracy, a four-terminal method is used. Perform a resistance measurement.

(3) Effect of the Inspection Method Such an inspection method of the partition wall for the organic EL element is performed by the partition 25
By extracting the element 2b being manufactured from the manufacturing line, forming a conductive film 26 on the element 2b being manufactured, and inspecting the short circuit between the conductive films 26 partitioned by the partition walls 25, the organic EL film 23 and the back side are manufactured. The defect of the partition 25 can be inspected without forming the electrode 24. The continuity tester 1 is located at the position of the rear electrode terminal 241 shown in FIGS.
By connecting the eight probe pins 17 to the respective conductive films 26, a short-circuit inspection can be performed at once, and the inspection can be performed in a short time. Furthermore, since the inspection device 1a includes the probe pin 17 for the continuity test in the vacuum chamber 11, it is easy to bring the probe pin 17 into contact with the conductive film 26 after the deposition of the conductive film 26. Further, by conducting a conduction test under reduced pressure even after the formation of the conductive film 26, the formed conductive film 26 can be prevented from being deteriorated by oxidation or the like, and an accurate inspection can be performed.

For this reason, the partition 25 can be inspected at the end of the partition forming step, and can be performed in a short time.
Inspection is performed before completion through the process of forming the L film 23 and the back-side electrode 24, thereby preventing the production of many defective elements.

[Embodiment 2] In the method of inspecting a partition for an organic EL element of the present embodiment 2, an in-production element 2e which is an in-production organic EL element in which a partition having a shape which can be easily inspected is manufactured. This is a method in which a conductive film having a probe pin connection site is formed, and a short circuit between the conductive films separated by partition walls is inspected. As shown in FIG. 7, the element 2 e during manufacture has a meandering partition wall 25, the ends of which are connected by an inspection partition 251.

(1) Configuration of Inspection Apparatus FIG. 6 shows an inspection apparatus 1b used in the present inspection method. The inspection device 1b has the same structure as that of the first embodiment, and as shown in FIG. 6, a vacuum chamber 11, a fixing member 12, a crucible 13, a heater 14, a pattern mask 15, a peripheral mask 16, a probe pin 17, And a tester 18. Further, the vacuum chamber 11, the fixing member 12, the crucible 13, the heater 14, the pattern mask 15, and the peripheral mask 16 correspond to an “evaporation apparatus”. Further, the probe pin 17 and the continuity tester 18 correspond to a “continuity test device”. Further, unlike the first embodiment, only one set (two places) of the probe pins 17 of the inspection device 1b of the second embodiment is provided. As shown in FIG. 8 and FIG. 9, these probe pins 17
, The back-side electrode terminals 241 (P, P, P...
Q, Q, Q,...). Thereby, the continuity tester 18 is electrically connected to the conductive film 26.

(2) Inspection Method A method of inspecting a partition for an organic EL element using the inspection apparatus 1b will be described. (a) The element 2e during the production to be subjected to the main inspection was the element 2e during the production for the organic EL element 2d which had undergone the steps up to the step of producing the partition walls, and was arbitrarily extracted from the production line. That is, as shown in FIG. 7, the element 2e during the production performed the substrate-side electrode forming step of forming the substrate-side electrode 22 on the substrate 21 by ITO or the like and the partition wall forming step performed by an arbitrary method. is there. In addition, the shape of the partition wall of the element 2e during the fabrication is different from the partition shape of the first embodiment, and includes a part to be a main inspection partition portion 251 that connects the ends of the partition wall in the first embodiment alternately. The element 2e during the production was put in the vacuum chamber 11 and placed on the pattern mask 15 in the vacuum chamber 11, and then 1.3 Pa
(10 ^{- 2} Torr) vacuo extent.

(B) Crucible 1 containing conductive film material (Al)
3, the conductive film material in the crucible 13 is evaporated, and a conductive film 26 is formed on the element 2e by vapor deposition. Conductive film 2
FIG. 8 is a schematic view of the element 2e during fabrication in which 6 is formed.
As shown in FIG. 8, the element 2 e during manufacture includes a substrate 21, a substrate-side electrode 22, a partition 25, and a conductive film 26.
8, the conductive film 26 is formed on the substrate 21, the substrate-side electrode 22, and the partition 25, respectively.
In addition to the portions having the same pattern shape as the back side electrode 24, a probe pin connection pattern for connecting every other pattern aligned in parallel is provided.

(C) The heating of the heater 14 is stopped, and the probe pins 17 are connected to check the continuity of each conductive film partitioned by the partition 25. As the connection portion, an arbitrary back side electrode terminal 241 (P, Q) for connecting to the back side electrode 24 is used as shown in FIGS. Then, the resistance between the conductive films 26 is measured by the continuity tester 18. At this time, as illustrated by the defective element 2f in FIG. 10, if the partition is not formed normally and there is continuity, a short circuit has occurred, and it is understood that the inspected element 2b during manufacture is defective.

The resistance between the conductive films 26 may have a low resistance value due to the substrate-side electrode 22 and the back-side electrode terminal 241 as in the first embodiment. For this reason, it is necessary to determine whether or not a short-circuit occurs by determining whether or not the resistance is less than the resistance value of the substrate-side electrode 22 and the back-side electrode terminal 241. Perform the measurement.

(3) Effects of the Inspection Method Such an inspection method of the partition for an organic EL element is performed by the partition 25
By extracting the element 2b during fabrication from which the organic EL film 23 was formed, a conductive film 26 was formed on the element 2e during fabrication, and a short circuit between the conductive films 26 partitioned by the partition walls 25 was inspected. The defect of the partition 25 can be inspected without forming the electrode 24. In addition, as shown in FIGS. 6 and 9, by connecting the continuity tester 18 to each conductive film 26, a short-circuit inspection can be performed at once, and the inspection can be performed in a short time.

Further, the inspection partition 25 is provided on the element 2e during the fabrication.
1 and a probe pin connection pattern for connecting every other pattern arranged in parallel, so that only one set of probe pins 17 to be connected is required.
The number of the probe pins 17 can be reduced as compared with the above, and the positional accuracy of the probe pins 17 does not need to be delicate even when the terminal interval is as narrow as 100 to 500 μm. In addition, this inspection method uses the two conductive films 26.
Are formed on the element 2e during fabrication so that they do not normally contact each other.
1 and the organic EL film 23 and the back electrode 2
4 to form an organic EL element 2d,
As shown in FIG. 11, it does not interfere with another part and does not cause any inconvenience as a product.

Therefore, the partition 25 can be inspected at the end of the partition forming step, and can be performed in a short time.
Inspection is performed before completion through the process of forming the L film 23 and the back side electrode, thereby preventing the production of many defective elements.

The present invention is not limited to the above-described embodiment, but may be variously modified within the scope of the present invention according to the purpose and application. That is, in this embodiment, the film formation and the inspection are performed by preparing the inspection apparatus separated from the production line, but the invention is not limited thereto, and the formation and the inspection of the conductive film may be performed in the production line. In addition, in the inspection apparatus of the embodiment, the probe pins are provided in the vacuum chamber. However, it is also possible to perform the test by taking out the element under manufacture in which the conductive film is separately formed from the vacuum chamber and connecting to the probe pins. .

Further, in order to increase the detection accuracy, an insulating layer 27 may be formed below the conductive film 26 as shown in FIG. The insulating layer 27 may be formed by vapor deposition of SiO ₂ , TiO ₃ or the like. By providing such an insulating layer 27, conduction by the substrate-side electrode can be prevented, and a short circuit due to a defect of a partition wall can be purely inspected, so that a detection capability for a minute defect of a diaphragm is improved. . When the insulating layer 27 is formed, it is necessary to change the pattern mask 15 so that the back electrode terminal 241 and the conductive film 26 are not insulated. In addition, if it is confirmed that the formation of the diaphragm is completely the same quality or that there is no negligible difference even if there is a difference, a partition is formed on an insulating substrate having no substrate side electrode for this inspection. After being formed in the production line, the main inspection can be performed. Also in this case, since it is not affected by the substrate-side electrode, it is possible to perform a pure inspection of the shortening due to the defect of the partition wall.
The ability to detect minute defects in the partition walls is improved.

Further, a plurality of organic E
When the L element is obtained, the inspection can be performed by appropriately cutting out the element under manufacture at an arbitrary part without inspecting all the elements under fabrication using the present inspection method. As described above, by reducing the size of the inspection target, the present inspection apparatus can be downsized, the time required for decompression can be reduced, and a quick inspection can be performed.

[0043]

According to the method and apparatus for inspecting a partition for an organic EL element of the present invention, it is possible to inspect the partition for defects without forming an organic EL thin film and a back side electrode. Thereby, the defect of the partition can be found at an early stage. Further, according to the method for inspecting a partition for an organic EL element of the first invention, an inspection can be performed without modifying the partition of the organic EL element. Further, according to the method for inspecting a partition for an organic EL element of the third invention, the number of globe pins can be reduced and the inspection apparatus can be simplified. Further, according to the inspection apparatus for a partition for an organic EL element of the fifth invention, an accurate inspection can be performed by disposing the probe pins in the vacuum chamber.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a configuration of an inspection apparatus according to a first embodiment.

FIGS. 2A and 2B are a plan view and a cross-sectional view for explaining a device during fabrication of Example 1. FIGS.

FIGS. 3A and 3B are a plan view and a cross-sectional view illustrating a state in which a conductive film is formed on a device during fabrication in Example 1. FIGS.

FIG. 4 is a schematic diagram for explaining connection between a conductive film and a continuity tester of Example 1.

FIGS. 5A and 5B are a plan view and a cross-sectional view illustrating a state in which a conductive film is formed on the defective element of Example 1. FIGS.

FIG. 6 is a cross-sectional view for explaining a configuration of the inspection device according to the second embodiment.

FIGS. 7A and 7B are a plan view and a cross-sectional view for explaining a device during fabrication of Example 2. FIGS.

8A is a plan view and FIG. 8B is a cross-sectional view for explaining a state in which a conductive film is formed on a device during fabrication in Example 2. FIG.

FIG. 9 is a schematic diagram for explaining connection between a conductive film and a continuity tester in Example 2.

FIGS. 10A and 10B are a plan view and a cross-sectional view illustrating a state in which a conductive film is formed on a defective element according to the second embodiment.

FIGS. 11A and 11B are a plan view and a cross-sectional view for explaining an organic EL element according to Example 2. FIGS.

FIGS. 12A and 12B are a plan view and a cross-sectional view illustrating a state in which an insulating film and a conductive film are formed on an element during fabrication. FIGS.

13A is a plan view for explaining an organic EL element, FIG.
(B) is a sectional view.

14A is a plan view for explaining a defective element, and FIG.
(b) It is sectional drawing.

[Explanation of symbols]

1a, 1b; inspection apparatus, 11; vacuum chamber, 12; fixing member, 13; crucible, 14; heater, 15; pattern mask, 16; peripheral mask, 17; probe pin, 18; 2d; organic EL element, 2b, 2
e; device under fabrication, 2c, 2f; defective device, 21;
22; substrate-side electrode, 23; organic EL film, 24; back-side electrode, 241; back-side electrode terminal, 25; partition, 251; inspection partition, 26; conductive film, 27; insulating film, B; , P, P ₁ , P ₂ , P ₃ ..., Q, Q ₁ , Q ₂ , Q ₃ .

Claims (5)

[Claims] 1. A method for inspecting a partition in an organic EL device in which an organic EL film and a back side electrode are formed on a substrate of a device under fabrication including a substrate on which a substrate-side electrode and a partition are formed. Forming a conductive film on the element during the fabrication, and judging the quality of the partition based on the presence or absence or degree of conduction between adjacent conductive films separated by the partition. Inspection method. 2. The substrate-side electrode has a band shape and is arranged in parallel on the substrate. The partition has a band shape and is arranged in parallel so as to be orthogonal to the substrate-side electrode. 2. The organic EL element partition according to claim 1, wherein a probe pin of a continuity test device for testing continuity between the conductive films is connected to a terminal of each of the rear electrodes, the strip having a band shape and being arranged in parallel between the partition walls. Inspection method. 3. The substrate-side electrode has a band shape and is arranged in parallel on the substrate, and the partition wall is arranged in parallel so that a band-shaped portion is orthogonal to the substrate-side electrode, and has an end portion thereof. The conductive film has a meandering shape connected to each other, and the conductive film has a set of comb teeth in which teeth are arranged in parallel between the partition walls so as to mesh with each other. 2. The method according to claim 1, wherein a probe pin of a test device is connected to the conductive film. 4. A vapor deposition apparatus for forming a conductive film on a device under manufacture provided with a substrate on which a substrate-side electrode and a partition wall are formed, and a continuity test for testing a continuity between adjacent conductive films separated by the partition wall. A test device, wherein the continuity test device includes at least one set of probe pins connected between the adjacent conductive films separated by the partition, and the continuity tester connected to each probe pin. An inspection device for a partition for an organic EL element, comprising: 5. The organic EL device partition wall inspection apparatus according to claim 4, wherein the probe pins are provided in the vacuum chamber and connected to the conductive films.