JP2001222920A - Heat sealed tape and flat cable using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat sealed tape having a good contact with a conductor, property for embedding the conductor, flame resistance, heart resistance, connector adaptability, durability, blocking resistance, and machining, and a flat cable using the same. SOLUTION: A heat sealed tape consists of a film-like base material, anchor cost layer, and heat sealed layer, each laminated in sequence. The heat sealed layer consists of a coating made of at least resin compound containing a filler component containing a flame retardant as the main component and a resin component containing polyester resin as the main component. The resin component containing the polyester resin as the main component consists of at least 5 to 35 wt.% of polyester resin having a glass transition point of -50 to 10 deg.C, 5 to 35 wt.% of polyester resin having a glass transition point of 20 to 45 deg.C, and 0.5 to 5 wt.% of polyester resin having a glass transition point of 70 to 120 deg.C, as the main components.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat-sealable tape and a flat cable using the same, and more particularly, to excellent adhesion to a conductor, particularly to low-temperature adhesion. , Excellent embedding property to fill the conductor, and
The present invention relates to a heat-sealing tape excellent in flame retardancy, heat resistance, durability, blocking resistance, workability and the like, and a flat cable using the same.

[0002]

2. Description of the Related Art Conventionally, flat cables are widely used in various products such as computers, liquid crystal display devices, mobile phones, printers, automobiles, home appliances, copiers and others. In general, these flat cables are constituted by sequentially laminating a film-like base material, an anchor coat layer, and a heat seal layer to form a heat seal tape. Further, the heat seal layers are overlapped with the surfaces thereof facing each other, and a large number of conductors are sandwiched between the layers. Specifically, as the above flat cable, for example, a polyvinyl chloride resin film as a heat seal layer is formed on one surface of a film-like base material such as a biaxially stretched polyester film by a dry lamination method or the like. Laminated using flatbed cable for heating
A heat-sealable tape is produced.
The layers are stacked with the surfaces of a polyvinyl chloride resin film as a heat seal layer facing each other, and a large number of conductors are sandwiched between the layers, and then heated and pressed by a heating roll or the like. There is known a flat cable made of polyvinyl chloride produced by melting a polyvinyl chloride resin film, embedding a large number of conductors in the polyvinyl chloride resin film, and heat-welding the polyvinyl chloride resin films to each other. Have been. Alternatively, a heat seal layer made of a resin composition containing a saturated polyester resin and a flame retardant on a surface of a film-like base material such as a biaxially stretched polyester film via a thermosetting adhesion promoter layer. To form a heat-sealable tape, and then the heat-sealable tape is formed.
The heat seal layers are superposed on each other with the heat seal layers facing each other, and a large number of conductors are sandwiched between the layers. There is known a flat cable made of a polyester resin manufactured by melting a sealing layer and embedding a large number of conductors in the heat sealing layer and thermally bonding the heat sealing layers to each other.

[0003]

However, in the above-mentioned flat cable made of polyvinyl chloride, it is widely used because of its excellent flame retardancy and the like, but the polyvinyl chloride as a heat seal layer is used. The vinyl resin film is
Poor close adhesion to conductors, especially in high temperature environments
There is a problem that a gap is generated between the polyvinyl chloride resin film and the conductor, or delamination is caused by the pressure of the gap. Further, the above-mentioned flat cable made of polyvinyl chloride is poor in flexibility, for example, there is a problem that the conductor is cut in a short time in a bending test, a sliding test, and the like. Since the film is used, it can be a cause of environmental destruction in disposal after use. In addition, the polyester resin flat case described above is used.
In the case of bull, since the film-like substrate is composed of a biaxially stretched polyester film or the like, and the heat seal layer is composed of a polyester resin component or the like, it lacks flame retardancy,
For that purpose, a large amount of a flame retardant must be added to the resin composition constituting the heat seal layer, and the flame retardancy must be expected. Thus, the heat seal layer made of the resin composition prepared by adding a large amount of a flame retardant as described above has a remarkably reduced close adhesion to a conductor, and further has a flat case when heated. There is a problem that the conductor protrudes from the end of the cable. Further, in the above-mentioned polyester resin flat cable, the anti-blocking performance and heat-sealing property are improved.
In order to achieve compatibility with the sealing performance, it is necessary to form a heat seal layer using a polyester resin component having a high glass transition point. However, in the above specifications, the adhesion between the film-shaped substrate and the heat seal layer is significantly reduced in a high-temperature and high-humidity environment, and accordingly, a high heat seal strength can be obtained. There is a problem that there is no.

[0004] Generally, in flat cables,
The close adhesion between the seal layer and the conductor is an important factor for the phenomenon that the conductor breaks in the flat cable when the flat cable is bent or slid. For example,
When the tight adhesion between the heat seal layer and the conductor is low, the conductor is easily broken. The close adhesion between the heat seal layer and the conductor is good when a polyester resin component having a low glass transition point is used as the polyester resin component constituting the heat seal layer. When a heat seal layer is formed using a polyester resin component having a low glass transition point, the heat seal layer lacks thermal durability. There is a problem that the cable protrudes from the end of the flat cable. Furthermore,
When the heat-sealing tape constituting the heat-sealing layer is formed by using a polyester resin component having a low glass transition point, the film-like base material and the heat-sealing layer are used. There is also a problem that a blocking phenomenon occurs due to the close adhesion of
There is a problem that a contact failure or the like of the connector is caused.
In order to solve this phenomenon, if a heat seal layer is formed using a polyester resin component having a high glass transition point or a filler component such as silica, a certain effect can be obtained for preventing the conductor from projecting. As can be expected, there is a problem in that the close adhesion between the heat seal layer and the conductor is reduced, and furthermore, the embedding property with the conductor is deteriorated. Therefore, it is necessary to form a heat seal layer by preparing a resin composition by balancing the polyester resin component having a low glass transition point and the polyester resin component having a high glass transition point. However, attempts have been made to solve the problem with heat seal temperature, pressure, time and the like.

In the flat cable, the close adhesion between the heat seal layer and the conductor is determined by the heat seal of the polyester resin component or the like in the resin composition constituting the heat seal layer. This is largely attributable to the compounding ratio of the hydrophilic component and the filler component such as a flame retardant. For example, heather
In the resin composition constituting the shell layer, when the mixing ratio of the filler component is increased, the protrusion of the conductor tends to be suppressed, but the close adhesion between the heat seal layer and the conductor is reduced, and furthermore, In addition, there is a problem in that the embedding of the conductor becomes poor at the time of processing, and voids are generated around the conductor. Therefore,
In the resin composition constituting the towel layer, the compounding ratio of the heat-sealing component such as a polyester-based resin component and the filler component such as a flame retardant is adjusted within an extremely narrow range.
It manufactures a resin composition. Therefore, the present invention is a close adhesion with a conductor, particularly, excellent in its low-temperature tight adhesion, further excellent in embedding the conductor is embedded, and,
An object of the present invention is to provide a heat-sealing tape excellent in flame retardancy, heat resistance, durability, blocking resistance, workability and the like, and a flat cable using the same.

[0006]

As a result of various studies to solve the above problems, the present inventor has found that a polyester resin component constituting a heat seal layer has a glass transition point of 20 ° C. By adding a polyester resin component at a temperature of up to 45 ° C., heat resistance, blocking resistance and the like are improved, and attention is paid to a phenomenon that a filler component such as silica which inhibits embedding property can be reduced. , A film-shaped base material, an anchor coat layer, and a heat seal layer which are sequentially laminated. Further, the heat seal layer is at least difficult to form. It comprises a coating of a resin composition containing 70 to 30% by weight of a filler component containing a flame retardant as a main component and 30 to 70% by weight of a resin component containing a polyester resin as a main component. The main component A resin component, at least, a polyester resin component having a glass transition point of -50 ° C. to 10 ° C. 5
5 to 35% by weight of a polyester resin component having a glass transition point of 20 to 45 ° C and a glass transition point of 70 to 35% by weight.
A heat-sealable tape is prepared by preparing a resin component containing 0.5 to 5% by weight of a polyester resin component at a temperature of from 120 ° C to 120 ° C, and then forming the heat-sealable tape. Tape
The heat seal layers are superposed with their surfaces facing each other, and a plurality of conductors are sandwiched between the layers.
A heat and pressure is applied to the heat seal layer to melt the heat seal layer, embed a large number of conductors in the heat seal layer, and heat bond the heat seal layers to each other to produce a flat cable. As a result, it has excellent adhesion to conductors, has excellent embedding properties for embedding conductors, and has flame retardancy, heat resistance, small deformation of the connector-connector resistance-suitability,
The present invention has been completed by finding that a heat-sealing tape excellent in durability, blocking resistance, workability and the like and a flat cable using the same can be manufactured.

That is, the present invention relates to a tape having a structure in which a film-like base material, an anchor coat layer, and a heat seal layer are sequentially laminated. -A filler layer containing at least a flame retardant as a main component-
A coating of a resin composition comprising 70 to 30% by weight of a component and 30 to 70% by weight of a resin component containing a polyester resin as a main component; At least a polyester resin component having a glass transition point of −50 ° C. to 10 ° C.
5% to 35% by weight of a polyester resin component having a glass transition point of 20 ° C to 45 ° C and a glass transition point of 70 ° C to 1%.
Characterized in that it comprises a resin component whose main component is 0.5 to 5% by weight of a polyester resin component at 20 ° C.
The present invention relates to a sealable tape and a flat cable using the tape. Furthermore, in the present invention, heat-sealing is performed by adding 1 to 10% by weight of a polyester polymer plasticizer having an average molecular weight of 2500 to 10000 to 100% by weight of the resin component in the above resin composition. Regarding the close adhesion between the layer and the conductor, it has extremely stable close adhesion over a long period of time and also has a remarkably improved processability to provide excellent embedding of the conductor. Has the advantage that no voids or the like are generated.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in more detail below with reference to the drawings. First, a heat-sealing tape according to the present invention and a flat cable using the same will be described with reference to the accompanying drawings by way of examples of 12 examples. FIG. 1 shows a heat-sealing tape according to the present invention. FIG. 2 is a schematic cross-sectional view showing a layer structure of an example of a tape having a structure;
FIG. 2 is a schematic sectional view showing the layer structure of an example of the flat cable according to the present invention.

First, a heat-sealing tape according to the present invention is provided.
An example of a pump is given below.
As shown in FIG. 1, the sealable tape A has a structure in which a film-like base material 1, an anchor coat layer 2, and a heat seal layer 3 are sequentially laminated. And
A resin composition wherein the heat seal layer 3 contains at least 70 to 30% by weight of a filler component mainly containing a flame retardant and 30 to 70% by weight of a resin component mainly containing a polyester resin. Further, a resin component mainly composed of the above-mentioned polyester-based resin is further composed of at least 5 to 35% by weight of a polyester-based resin component having a glass transition point of −50 ° C. to 10 ° C. and a glass transition point of 20 ° C ~
A resin composition mainly composed of 5 to 35% by weight of a polyester resin component at 45 ° C and 0.5 to 5% by weight of a polyester resin component having a glass transition point of 70 to 120 ° C. It has a basic structure. The above exemplification shows an example of the heat-sealable tape according to the present invention, and it is needless to say that the present invention is not limited thereby.

Next, in the present invention, an example of the flat cable according to the present invention manufactured using the heat-sealing tape according to the present invention will be described. -Bull B corresponds to FIG.
In the case where the heat-sealable tape A shown in FIG. 1 is used, as shown in FIG. 2, the heat-sealable tapes A and A shown in FIG. Heat seal layer 3 (3
a) and 3 (3a) are superimposed on each other, and a plurality of conductors 4
.. Are sandwiched, and then heated and pressed using, for example, a heating roll or a heating plate or the like to form a heat seal layer 3 (3).
a) 3 (3a) is melted, and the conductors 4, 4,... of the plurality of metals and the like are closely adhered to the heat seal layer and embedded in the heat seal layer. Further, the flat cable B according to the present invention is manufactured by melting the heat seal layers 3 (3a) and 3 (3a) to each other and firmly bonding them. Note that, in FIG. 2 described above, reference numerals such as 1 and 2 in the figure have the same meanings as in FIG. 1 described above. The above example shows one example of the flat cable according to the present invention manufactured using the heat-sealable tape according to the present invention, and the present invention is limited thereby. Needless to say, it is not a thing.

Next, in the present invention, the material constituting the heat-sealable tape, the flat cable and the like according to the present invention, the manufacturing method, and the like will be described. First, the heat-seal according to the present invention will be described. As a film-like substrate constituting a flexible tape, a flat cable, etc., it has excellent mechanical strength, dimensional stability, etc., and also has heat resistance, flexibility, chemical resistance, solvent resistance,
A resin film or sheet having high flexibility and insulating properties can be used, for example, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polytetramethylene terephthalate. Polyester resins such as polyester resins, polyethylene, polypropylene, ethylene-propylene copolymer, etc.
Polyamide resins such as nylon 12, nylon 66 and nylon 6, polyimide resins such as polyimide, polyamide imide and polyetherimide, and fluorine-containing resins such as polytetrafluoroethylene, polytrifluoroethylene, polyvinylidene fluoride and polyvinyl fluoride , Polye
Films or sheets of various resins such as tersulfone, polyether ketone, polyphenylene sulfide, polyarylate, polyester ether, wholly aromatic polyamide, polyaramid, polycarbonate and others can be used. . Thus, the films of these resins may be unstretched, or films stretched uniaxially or biaxially, or the like, and the thickness thereof may be
It is preferably about 5 μm to 200 μm, and more preferably about 10 μm to 100 μm. In the above, if it is less than 5 μm, it is not preferable because it becomes difficult to form an anchor coat layer, a heat seal layer, etc. on the surface, and if it exceeds 200 μm, it is not practical. This is undesirable because it is not a target. If necessary, the surface of the various resin films or sheets may be, for example, corona treated, plasma treated, ozone treated,
It is possible to arbitrarily perform other preprocessing and the like.

Next, the anchor coat layer constituting the heat-sealable tape, flat cable and the like according to the present invention will be described. It is provided to improve the adhesion between the film-shaped base material and the heat seal layer, suppress delamination thereof, further increase the heat bonding processing speed, and improve the heat resistant adhesiveness. is there. Thus, in the present invention, examples of the anchor coat layer include, for example, a polyfunctional compound having an isocyanate group, a block isocyanate group and / or a carbodiimide group; Glass transition point is 20 to 120 ° C., preferably 30
It is possible to use a coating with an anchor coating agent containing a polyester resin and a polyurethane resin at a temperature of about 100 ° C. and the like. In the above-mentioned anchor coating agent, the mixing ratio of the polyester resin and the polyurethane resin is such that the ratio of polyester resin / polyurethane resin (weight ratio) = 0.7 / 0.3 to 0.3 / 0. The range of the 7-position is preferred. In the above mixing ratio, there is an advantage that a heat-shrinking action of a heat seal layer formed thereon can be prevented when heated. If the amount of the polyester-based resin exceeds 0.7 in the above-mentioned polyester-based resin compounding ratio, the adhesive strength of the anchor coat layer to the film-like base material is weakened.
If it is less than 3, the protrusion of the conductor due to shrinkage of the heat seal layer is undesirably large. Further, in the above, as the addition amount of the polyfunctional compound,
The equivalent is preferably 1 to 20 times equivalent to the reactive group of the resin component. In the above anchor coating agent, the solid content is preferably in the range of about 2 to 60% by weight. In the present invention, examples of the anchor coat layer include a polyethyleneimine compound, an organic titanium compound, a polyolefin compound, a polybutadiene compound, an isocyanate compound, a polyester urethane compound, and a polyether compound. An anchor coat layer made of an anchor coat agent or the like containing a urethane compound or the like as a main component of the vehicle can also be used.

In the present invention, the method for forming the anchor coat layer includes the above-described anchor coat.
A coating agent is applied to the surface of the film-like base material, for example, roll coat, bar coat, die coat, flow coat, etc.
Coat, reverse coat, gravure roll coat, kiss coat, knife coat, dip coat, spray coat
And other coating methods. Thereafter, the coating film is dried to remove the solvent, diluent, etc., and, if necessary, subjected to an aging treatment or the like. An anchor coat layer consisting of a coating with a coating agent can be formed. In the present invention, the anchor
The thickness of the coat layer is, for example, 0.05 to 10 μm.
And preferably about 0.1 to 5 μm. In the above, when the thickness is less than 0.05 μm, it is not preferable because the conductor protrudes, and when it exceeds 10 μm, it exceeds the practical range, and in some cases, there is a problem in flame retardancy. Not something.

In the above, the glass transition point constituting the anchor coat layer is 20 to 120 ° C., preferably 30 to 120 ° C.
As the polyester resin at 100 ° C., for example, a thermoplastic polyester resin formed by polycondensation of one or more aromatic saturated dicarboxylic acids such as terephthalic acid and one or more saturated divalent alcohols Resins can be used. In the above, as the aromatic saturated dicarboxylic acid, for example, terephthalic acid, isophthalic acid, phthalic acid, diphenyl ether-4, 4-dicarboxylic acid, 2,6-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, Alternatively, derivatives or modified products of these acids, etc. can be used. Also,
In the above, examples of the saturated divalent alcohol include ethylene glycol, propylene glycol, trimethylene glycol, tetramethylene glycol, diethylene glycol, polyethylene glycol, polypropylene glycol, and polytetraol. Aliphatic glycols such as methylene glycol, hexamethylene glycol, dodecamethylene glycol, neopentyl glycol, and alicyclic glycols such as cyclohexanedimethanol, 2.2-bis ( 4'-
(.beta.-hydroxyethoxyphenyl) propane, naphthalenediol, bisphenol A, bisphenol S, other aromatic diols and the like can be used. In the present invention, for example, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, aliphatic saturated dicarboxylic acid such as dodecanoic acid, and the like are added. It can also be modified by copolycondensation. Thus, in the present invention, a polyester resin having a glass transition point of 20 to 120 ° C., preferably 30 to 100 ° C. is prepared by using the above materials, preparing them, and performing polycondensation or denaturation. Is manufactured and used.

Further, in the above, as the polyurethane resin constituting the anchor coat layer, for example, a polyurethane resin obtained by reacting a polyfunctional isocyanate with a hydroxyl group-containing compound can be used. . Specifically, for example, tolylene diisocyanate,
Aromatic polyisocyanates such as diphenylmethane diisocyanate and polymethylene polyphenylene polyisocyanate, or hexamethylene diisocyanate;
By reacting a polyfunctional isocyanate such as an aliphatic polyisocyanate such as xylylene diisocyanate with a hydroxyl group-containing compound such as polyether polyol, polyester polyol, polyacrylate polyol, or the like. The obtained one-pack or two-pack curable polyurethane resin can be used.

Further, in the above, as the polyfunctional compound having an isocyanate group, a block isocyanate group and / or a carbodiimide group constituting the anchor coat layer, for example, tolylene diisocyanate 4.
4'-diphenylmethane diisocyanate, xylene diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate and their burettes, adducts such as trimethylolpropane, isocyanate Isocyanates such as trimers, etc., and isocyanates converted into alcohols or phenols (ethanol,
Blocks blocked with isopropanol, n-butanol, phenyl, nitrophenyl, etc., lactams (ε-caprolactam, etc.), active methylene compounds (diethyl malonate, methyl acetoacetate, ethyl acetoacetate, acetylacetone) Isocyanate and the like can be used. Further, in the present invention, examples of the polyfunctional compound include, for example, polytoluenecarbodiimide, poly-4.4-diphenylmethanecarbodiimide, polyisophoronecarbodiimide, and polyhexane synthesized from the above-mentioned isocyanates. Carbodiimide-based cross-linking agents such as carbodiimide and derivatives thereof can be used. The above polyfunctional compound preferably has 2 to 6 isocyanate groups, block isocyanate groups and / or carbodiimide groups in the molecule. In the present invention, it is preferable that the polyfunctional compound is used after being dissolved or dispersed in a solvent. As the above-mentioned solvent, it cannot be specified because it differs depending on the reactivity of the functional group of the polyfunctional compound,
For example, water, methanol, ethanol, propyl alcohol, isopropyl alcohol, tetrahydrofuran,
Dimethylformamide, n-methylpyrrolidone, methyl ethyl ketone, acetone, methyl isobutyl ketone, ethyl acetate, propyl acetate, toluene, xylene, cyclohexane, methylcyclohexane, hexane, etc. can be used alone or in combination. In some cases, the reaction rate of the polyfunctional compound can be adjusted by adding alcohols. For example, by blocking the isocyanate group with lower alcohols or phenols, the isocyanate group can be stabilized, or the titanium chelates can be stabilized by isopropyl alcohol. In such a case, since the polyfunctional compound can be handled as a one-part solution,
It is effective for adding to the agent. The amount of the polyfunctional compound to be added is in the range of 0.05 to 10 parts by weight, preferably 0.1 to 10 parts by weight, per 100 parts by weight of the polyester resin.
Preferably it is in the range of 5 parts by weight.

Next, in the present invention, a heat seal layer constituting a heat seal tape, a flat cable and the like according to the present invention will be described. A conductor such as a metal can be sandwiched between the layers, and can be softened and melted by heating and pressing by a heating roll or a heating plate or the like, and can be strongly heat-sealed to each other; and In addition, it is necessary to have excellent adhesiveness to the conductor and to have an excellent embedding property for embedding the conductor therein, and to have a performance of preventing the occurrence of a gap or the like between the conductor and the conductor. Furthermore, in all environments where flat cables are used, excellent performance in flexibility, bendability, sliding properties, heat resistance, flame retardancy, durability, blocking resistance, workability, and other properties. It is necessary to have
In the present invention, an example of the above-mentioned heat seal layer is shown below. For example, at least 70 to 30% by weight of a filler component containing a flame retardant as a main component and a polyester resin as a main component. 30-70% by weight of resin component
And a resin component containing the above polyester-based resin as a main component, at least 5 to 35% by weight of a polyester-based resin component having a glass transition point of −50 ° C. to 10 ° C. Glass transition point is 20 ℃ ～ 4
Coating with a resin composition prepared as a resin component containing 5 to 35% by weight of a polyester resin component at 5C and 0.5 to 5% by weight of a polyester resin component having a glass transition point of 70 to 120C. Can be used. In addition,
In the above resin composition, for example, 100% by weight of a resin component
Can be prepared by adding 1 to 10% by weight of a polyester polymer plasticizer having an average molecular weight of 2500 to 10000. Further, in the above resin composition,
It can be prepared by adding 0.05 to 5% by weight of a polyfunctional compound having an isocyanate group, a block isocyanate group and / or a carbodiimide group to 100% by weight of the resin component. . In the above resin composition, the solid content is not in the range of about 5 to 75% by weight. Therefore, if the solid content is less than the above range, it is difficult to increase the coating amount due to the viscosity relationship, so that it is preferable. Not
Further, when the amount exceeds the above range, the filler in the resin composition
This is undesirable because the dispersion of the components is significantly reduced.

Next, in the present invention, as a method of forming a heat seal layer, the above-mentioned resin composition is used on the above-mentioned anchor coat layer, and this is used, for example. , Roll coat, bar coat, die coat, flow
Coat, reverse coat, gravure roll coat, kiss coat, knife coat, dip coat, spray coat
Coating by a coating method or another coating method. Thereafter, the coating film is dried to remove a solvent, a diluent, and the like, and further, if necessary, subjected to an aging treatment and the like. A heat seal layer composed of a film of the resin composition of (1) can be formed. In the present invention, heat-sealing
The thickness of the metal layer is, for example, about 5 to 200 μm, preferably about 10 to 100 μm. In the above, if it is less than 5 μm, there is difficulty in tight adhesion with a conductor, and further, there is a problem in flame retardancy, which is not preferable.
On the other hand, if the thickness exceeds 200 μm, a large amount of energy is required to evaporate the solvent and the like during drying, and this is not preferable because it is not practical.

In the above, as the polyester resin constituting the heat seal layer, the above-mentioned thermoplastic polyester resin constituting the anchor coat layer can be similarly used. Thus, in the present invention, an example of a resin component containing the above-mentioned polyester resin as a main component is exemplified. For example, at least a polyester resin component having a glass transition point of −50 ° C. to 10 ° C.
5% to 35% by weight of a polyester resin component having a glass transition point of 20 ° C to 45 ° C and a glass transition point of 70 ° C to 1%.
A resin component containing 0.5 to 5% by weight of a polyester-based resin component at 20 ° C. as a main component can be used. In the present invention, a polyester resin component having a glass transition point of −50 ° C. to 10 ° C., a glass transition point of 20 ° C. to 45 ° C., or a polyester resin component constituting the heat seal layer, or , A glass transition point of 70 ° C to 120 ° C
The polyester resin component at a temperature of, for example, one or more aromatic saturated dicarboxylic acids such as terephthalic acid and isophthalic acid or aliphatic dicarboxylic acids such as adipic acid, and one or more saturated divalent alcohols The above and further, using other acid components and the like, they are prepared and subjected to polycondensation or denaturation to have a glass transition point of −50 ° C.
Polyester resin of -10 ° C, glass transition point is 20 ° C
A polyester resin having a glass transition point of 70 to 120 ° C. or the like is produced, and a resin composition containing a resin component containing the polyester resin as a main component is prepared and used. . In the present invention,
As the above-mentioned polyester resin, for example, in addition to the polyester resin alone, for example, a modified resin such as polyester urethane can be used. In the present invention, since an environment in which a flat cable is used is generally about -50 ° C to 10 ° C, the glass transition point (Tg) is determined as a polyester resin component. It is preferable to use a polyester resin component having a temperature of -50 ° C to 10 ° C. When a large amount of the polyester resin component having a glass transition point (Tg) of -50 ° C to 10 ° C is used, Since it becomes too soft at normal temperature, the range of about 5 to 35% by weight is determined as the optimum usage. Further, in the present invention, when the flat cable is used in an environment having a high temperature, the glass transition point of the polyester resin component is set to 20 ° C. to 45 ° C. in order to adapt to the environment.
And a polyester resin component at 70 ° C to 120 ° C. In the present invention, the glass transition point is 2
The addition amount of the polyester resin component at 0 ° C. to 45 ° C. is preferably in the range of 5% by weight to 35% by weight.
If it is less than 5% by weight, it is difficult to prepare it to exhibit properties such as heat resistance and embedding property, and if it exceeds 35% by weight, the adhesiveness is lowered, which is not desirable. In the present invention, the glass transition point is 7
If a large amount of a polyester resin component having a high temperature of 0 ° C. to 120 ° C. is used in a large amount, the tight adhesion of the heat seal layer to the conductor is significantly reduced. , And its optimum use amount is 0.5 to 5% by weight.

Next, in the above, as the filler component constituting the heat seal layer, first, as the flame retardant,
Aluminum hydroxide, magnesium hydroxide, antimony oxide, red phosphorus, zinc borate, zirconium-based flame retardant, tin-based flame retardant, tetrabromobisphenol A (TBA) -bis (2-hydroxyl ether) (melting point , Mp, 113
° C), tetrabromobisphenol A (TBA) -bis (allyl ether) (melting point, mp, 115 ° C), pentabromobenzyl acrylate (melting point, mp, 122
° C), tetrabromobutane (melting point, mp, 116 ° C),
Tetrabromobisphenol A (TBA) -carbonate
Trioligomer (melting point, mp, 165 ° C), tetrabromobisphenol A (melting point, mp, 179 ° C), 2.2-
Bis (4-hydroxy-3.5-dibromophenyl)
(Melting point, mp, 179 ° C), hexabromocyclodecane (melting point, mp, 183 ° C), hexabromocyclododecane (melting point, mp, 185 ° C), pentabromobenzyl acrylate polymer (melting point, mp, 205 ° C) ), Polydibromophenylene ether (melting point, mp, 210 ° C.),
Bis (2.4.6-dribromophenoxy) ethane (melting point, mp, 223 ° C), pentabromophenol (melting point, mp, 223 ° C), tetrabromoxylene (melting point,
mp, 254 ° C), tetrabromobromophthalic anhydride (melting point, mp, 274 ° C), tetrabromobisphenol (melting point, mp, 282 ° C), pentabromotoluene (melting point, mp, 286 ° C) ), Decabromodiphenyl oxide (melting point, mp, 300 ° C.), hexabromobenzene (melting point, mp, 315 ° C.), ethylenebispentabromodiphenyl (melting point, mp, 345 ° C.), per-chlorocyclopentadecane (melting point, mp , 350 ° C), ethylenebistetrabromophthalimide (melting point, mp, 450
° C), brominated phthalimide (melting point, mp, 445 ° C), other halogen-based flame retardants, trimethyl phosphate,
Triethyl phosphate, tributyl phosphate, trioctyl phosphate, octyl diphenyl phosphate, tricresyl phosphate, cresyl phosphate
, Triphenyl phosphate, tris (chloroethyl) phosphate, tris (2-chloropropyl) phosphate, tris (2.3-dichloropropyl) phosphate, tris (2.3-dibromopropyl) Phosphate, tris (2.3-dibromochloropropyl) phosphate, bis (2.3-dibromopropyl), 2.3
Phosphoric acid-based flame retardants such as dichloropropyl phosphate, bis (chloropropyl) monooctyl phosphate, and the like; further, guanidine phosphate and its derivatives, guanylurea phosphate and its derivatives, and sulfamic acid One or two or more flame retardants such as and their derivatives and others can be used. In the above, when a halogen-based flame retardant is used, the melting point, mp, 300 ° C.
Among those at 450 ° C., melting point, mp, 170 ° C.-250
The use of a mixture at a temperature of ° C. improves the embedding property.

Further, in the present invention, other fillers may be used.
As the component, for example, polyamide waxes, silica fine particles, talc, calcium carbonate, organic pigments, inorganic pigments such as titanium oxide, carbon, waxes, and the like can be used. In the present invention, the content of the filler component constituting the heat seal layer is 70 to 3
Preferably, it is used within the range of 0% by weight.
If it exceeds 70% by weight, it is not preferable because the heat sealing layers and the tight adhesion of the conductor and the like become insufficient, and if it is less than 30% by weight, the protrusion of the conductor becomes large. This is not preferable because of the problem that the heat seal layer itself is insufficient in flame retardancy.

Further, in the present invention, it is particularly preferable to use a polyester plasticizer as the polyester polymer plasticizer having an average molecular weight of 2,500 to 10,000 which constitutes the heat seal layer. Include dicarboxylic acids such as adipic acid, azelaic acid, sebacic acid, and phthalic acid, and ethylene glycol and diethylene glycol;
Propylene glycol, dipropylene glycol,
1.3-butylene glycol, neopentyl glyco-
Di- or trivalent alcohols such as
And a polyester plasticizer which is liquid at room temperature and comprises a combination of a monobasic acid and a monobasic acid.
About 500 to 10000 can be used. In the above, when the average molecular weight is less than 2500, the adhesive has a certain effect on the tight adhesion and the like,
There is a problem in the transferability and extractability of the plasticizer, and further, there is a problem in the long-term durability stability (change over time) of the flat cable, which is not preferable. If it exceeds, the original properties as a plasticizer are lost, which is not preferable. In the present invention, the amount of the plasticizer is 0.1 to 100 parts by weight of the aforementioned polyester resin component.
Preferably, it is in the range of 10 parts by weight.
In the above, if the amount is less than 0.1 part by weight,
In addition, there is a problem in the durability of the conductor in the flat cable, such as the poor adhesion of the metal layer to the conductor, the burial property, etc., and the conductor is easily broken due to, for example, bending or sliding. Therefore, it is not preferable, and 10
If the weight of the flat cable is exceeded, the degree of protrusion of the conductor from the end of the flat cable during heat exposure increases, and the flat cable
This is not preferable because connecting the bulls causes troubles such as poor contact.

Next, in the present invention, as a plasticizer constituting the heat seal layer, in addition to the above-mentioned polyester plasticizer, for example, an epoxy fatty acid ester having a molecular weight of 400 to 3000, a molecular weight of 1000 to 1000, Epoxy plasticizers such as 5000 epoxidized oils and fats, and phthalic acid esters such as dioctyl phthalate, dibutyl phthalate, diphenyl phthalate and dicyclohexyl phthalate;
Aliphatic-basic acid esters such as butyl oleate, glycerin monooleate, n-hexyl adipate, di-2-ethylhexyl adipate, diethylhexyl azelate, dibutyl sebacate, and 2-sebacate
Aliphatic dibasic acid esters such as ethylhexyl, diethyl glycol dibenzoate, triethylene glycol
Divalent alcohol esters such as rudi 2-ethyl butyrate, oxyesters such as butyl acetyl ricinoleate, butylene glycol bis (butyl phthalate), and tributyl acetyl citrate; tributyl phosphate; -Phosphate esters such as ethylhexyl, triphenyl phosphate and tricresyl phosphate, and one or more other phosphoric acid esters can be used. In the present invention, the above-mentioned plasticizer can be used in combination with the above-mentioned polyester-based plasticizer. The amount of the plasticizer added is within a range of 50% by weight or less based on the polyester-based plasticizer. Can be used. In the present invention, by forming a heat seal layer using the above plasticizer,
The heat-sealing layer and the conductor are not closely adhered to each other.
This is effective for the adhesive effect at the time of sealing and for alleviating the distortion of the heat-sealing tape, and further improves the embedding property of the conductor into the heat-sealing layer.

Next, in the present invention, as the polyfunctional compound having an isocyanate group, a block isocyanate group and / or a carbodiimide group which constitutes a heat seal layer, the above-mentioned anchor co- Isocyanate group and block isocyanate described as a material constituting the
One or two or more polyfunctional compounds having a thiol group and / or a carbodiimide group can be used in the same manner.

Next, in the present invention, a method for producing the flat cable according to the present invention using the heat-sealing tape according to the present invention will be described. , According to the present invention described above.
A sealable tape is superimposed with its heatsyl layer facing each other, and a conductor such as a metal is interposed between the layers. Then, a heating roll or a heating plate is used. Heat and heat the heat-sealable tape, conductor, etc.
The seal layer is softened and melted so that the heat seal layer and the conductor are closely adhered, the conductor is embedded in the heat seal layer, and the heat seal layer itself is self-adhered to each other. To prevent the occurrence of voids and the like between the conductor and the heat-sealable tape and the flat case formed by bonding the conductor to the conductor.
Bull can be manufactured.

[0026]

Now, the present invention will be described in further detail with reference to specific examples. Example 1 (1). Preparation of Anchor Coating Agent for Forming Anchor Coat Layer Polyester resin having a glass transition point of 40 ° C. and a polyol-based urethane resin (solids weight ratio 1: 1, hydroxyl value = 10 m)
gKOH / g) in methyl ethyl ketone / toluene = 1 /
Solution A was prepared by dissolving in a mixed solvent consisting of Tolylene diisocyanate and hexamethylene diisocyanate
Was dissolved in a mixed solvent consisting of methyl ethyl ketone / toluene = 1/1 to prepare solution B. Next, the solution A and the solution B prepared above were mixed immediately before coating on a film-like substrate to prepare an anchor coating agent (OH group / NCO
Group = 1/3 molar ratio). (2). Preparation of Heat-Seal Layer-Forming Resin Composition As the resin components, 20% by weight of a polyester resin having a glass transition point of 5 ° C. and a polyester resin 2 having a glass transition point of 35 ° C.
0% by weight, 4% by weight of a polyester resin having a glass transition point of 75 ° C., and 8% by weight of aluminum hydroxide, 30% by weight of a brominated flame retardant and 10% by weight of antimony trioxide as flame retardant components. Further, 7% by weight of titanium oxide and 1% by weight of silica were used as other filler components, and they were mixed with methyl ethyl ketone / toluene = 1/1.
A resin composition was prepared by dissolving and dispersing in a mixed solvent consisting of No. 1. (3). Production of heat-sealable tape A biaxially stretched polyethylene terephthalate film having a thickness of 25 μm was used. First, the anchor prepared above was applied to the surface of the biaxially stretched polyethylene terephthalate film.
The coating agent is applied by a gravure roll coating method to form a film having a thickness of 0.1 mm.
8 g / m ² (dry state), and then
After drying, an anchor coat layer was formed. Next, on the anchor coat layer formed above, the resin composition prepared above was applied by a die coater to a film thickness of 30.0 g / m ² (dry state). Then, it is dried to form a heat-sealing layer, and the heat-sealing tea according to the present invention is formed.
Manufactured. (4). Production of Flat Cable Using the heat-sealable tape produced above,
Two pieces of heatshi, 60cm wide and 100cm long
The heat-sealable tapes are overlapped so that the surfaces of the heat-sealing layers face each other, and then the width × thickness = 0.8 between the layers.
A plurality of conductors each having a size of 50 mm × 50 μm are sandwiched at equal intervals, and then the conductors are heated to 150 ° C.
A flat cable according to the present invention was manufactured by passing the material between the rubber roll and the rubber roll at a speed of 3 m / min and heating and pressing.

Examples 2 to 5 and Comparative Example 1 As the film-like base material and the anchor coating agent, the same ones as shown in the above-mentioned Example 1 were used in the same manner. The heat seal according to the present invention was used in the same manner as in Example 1 except that the materials shown in Table 1 below were used in the amounts (% by weight) indicated by the numerical values shown in the table. A conductive tape, a flat cable, and a heat-sealing tape and a flat cable as a comparative example were produced.

[0028] In Table 1 above, Tg means a glass transition point,
PES means a polyester resin. Also,
In Table 1 above, a polyester-based plasticizer is used as a plasticizer, and a bromine-based flame retardant having a melting point (mp) of 345 ° C. is used as a brominated flame-retardant (1). As 2), a brominated flame retardant having a melting point (mp) of 183 ° C. was used.

EXPERIMENTAL EXAMPLES The heat-sealable tapes and flat cables produced in Examples 1 to 5 and Comparative Examples 1 and 2 were tested and evaluated for the following items. (1). T-shaped peel strength test between heat seal layer / heat seal layer This test is to bond the surfaces of the heat seal layer of the heat seal tape to each other with a heat sealer. After (temperature 170 ° C, pressure 3K
g / cm ² , time 3 seconds) and T-peel strength (g / width 10 mm) was measured and evaluated by a tensile test. (2). Test of T-peel strength between heat seal layer and conductor This test was conducted by heat sealing the surface of the heat seal layer of a heat seal tape and a copper foil having a thickness of 100 μm. Using-
Sealing was performed at 70 ° C. under a load of 3 kg for 3 seconds, and T-peel strength (g / width 10 mm) was measured and evaluated by a tensile test. (3). Embedding test This is a flat cable cut with a cutter parallel to the width direction, and the cross section is observed with an optical microscope.
An evaluation was made by checking whether there were bubbles or the like around the conductor and there was a portion where the conductor was not sufficiently embedded. In addition, ◎ means completely buried state, ○ means a level where the part not buried around the conductor is 50 μm or less,
X means a state in which a portion of 50 μm that is not embedded exists around the conductor. (4). Blocking test A heat-sealable tape was cut into a size of 5 cm × 20 cm, sandwiched between two 25 μm polyethylene terephthalate films (PET), and a heat-sealable tape was placed thereon. -Place 5kg of the same size as
After standing for 4 hours, the peeling force between the heat seal face and the PET face was evaluated by measuring the T-shaped peel strength (g / width 10 mm) using a tensile tester. (5). Connector suitability test This is a 50μm thick, heat-sealable tape on a tape.
Place a 1-mm-wide conductor, and use a heat sealer to
At 3 ° C. with a load of 3 kg for 3 seconds. On top of this, two weights of 5 kg used in the above-mentioned blocking test (4) were placed and left at 70 ° C. for 24 hours. And measured before and after standing. ◎: No change ：: Some conductors are buried in the seal as compared to before leaving undisturbed ×: Indicates that the conductor is buried in the seal as compared to before leaving. The above measurement results are shown in Table 2 below.

(Table 2) In Table 2 above, HS means a heat seal layer.

As is clear from the results shown in Table 2 above, those of Examples 1 to 5 were excellent in tight adhesion, connector suitability, and also excellent in embedding. On the other hand, the one of Comparative Example 1 is inferior in tight adhesion,
Moreover, the embedding property was also poor. In the case of Comparative Example 2, the tight adhesion was good, but the connector-
Suitability and embedding properties were inferior.

[0032]

As is apparent from the above description, the present invention provides a film-like base material, an anchor coat layer, and a heat sink.
A tape having a structure in which a seal layer is sequentially laminated; and a heat seal layer comprising at least 70 to 30% by weight of a filler component containing a flame retardant as a main component and a polyester resin. A film of a resin composition containing 30 to 70% by weight of a resin component containing a resin as a main component.
A resin component containing the above polyester resin as a main component,
At least 5 to 35% by weight of a polyester resin component having a glass transition point of -50 ° C to 10 ° C and a glass transition point of 20%
A resin component comprising 5-35% by weight of a polyester-based resin component at a temperature of from 45 ° C. to 45 ° C. and 0.5 to 5% by weight of a polyester-based resin component having a glass transition point of 70 ° C. to 120 ° C. A heat-sealable tape is produced, and the heat-sealable tape is superimposed on the heat-seal layer with the surfaces thereof facing each other. After sandwiching the conductor, heat and press it with a heating roll, etc.
The heat sealing layer is melted to embed a large number of conductors in the heat seal layer, and the heat seal layers are thermally bonded to each other to produce a flat cable. Its low-temperature tight adhesion, specifically, has a very good tight adhesion with a conductor in a range of -20 ° C to 80 ° C which is considered as an actual use temperature, and further, has excellent embedding property for embedding a conductor, In addition, a heat-sealable tape excellent in flame retardancy, heat resistance, durability, blocking resistance, workability and the like and a flat cable using the same can be manufactured. .

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view showing a layer configuration of an example of a heat-sealing tape according to the present invention.

FIG. 2 is a schematic cross-sectional view showing a layer configuration of an example of a flat cable according to the present invention.

[Explanation of symbols]

 Reference Signs List A heat-sealable tape B flat cable 1 film-like substrate 2 anchor coat layer 3 heat-seal layer 3a coating 4 conductor

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Takaki Miyaji 1-1-1, Ichigaya-Kagacho, Shinjuku-ku, Tokyo Inside Dai Nippon Printing Co., Ltd. (72) Inventor Yaichiro Hori 1-1-1, Ichigaga-cho, Shinjuku-ku, Tokyo No. 1 Dai Nippon Printing Co., Ltd. (72) Inventor Kazuhiro Yamada 1-1-1, Ichigaya-Kagacho, Shinjuku-ku, Tokyo F-term in Dai Nippon Printing Co., Ltd. (Reference) 4F100 AA29H AK41A AK41B AK41C AK41H AK42A AK46A AK47A AK49A AK51B AK57A AL05B AL05C AT00A BA03 BA07 BA10A BA10C CA04 CA04C CA08 CA08C CC00B EH46B EJ38 GB46 GB90 JA05J01J05J01J01 J03B01

Claims (6)

[Claims] 1. A tape having a structure in which a film-like base material, an anchor coat layer, and a heat seal layer are laminated in this order. At least 70 to 30% by weight of a filler component containing a flame retardant as a main component and 30 to 30% by weight of a resin component containing a polyester resin as a main component.
And 70% by weight of the resin composition, and further, the resin component containing the polyester-based resin as a main component has a glass transition point of at least -50 ° C to 10 ° C.
5 to 35% by weight of a polyester resin component having a glass transition point of 20 to 45 ° C.
A heat-sealable tape comprising a resin component having a main component of 0.5 to 5% by weight of a polyester resin component having a glass transition point of 70 to 125 ° C. 2. The film base material is made of a polyethylene terephthalate film, a polyethylene naphthalate film, a polybutylene terephthalate film, a polyamide film, a polyphenylene sulfide film, a polyaramid film, or a polyimide film. The heat-sealable tape according to claim 1, wherein 3. An anchor coat layer comprising a polyfunctional compound having an isocyanate group, a block isocyanate group and / or a carbodiimide group and a glass transition point of 20 or more.
3. The heat-sealable tape according to claim 1, comprising a coating of an anchor coating agent containing a polyester resin and a polyurethane resin at a temperature of up to 120 DEG C. 4. The resin composition according to claim 1, wherein the resin composition contains 1 to 10% by weight of a polyester polymer plasticizer having an average molecular weight of 2,500 to 10,000 based on 100% by weight of the resin component. Heat-sealable tape. 5. A resin composition comprising 0.05 to 5% by weight of a polyfunctional compound having an isocyanate group, a block isocyanate group and / or a carbodiimide group based on 100% by weight of a resin component. A heat-sealable tape according to any one of claims 1 to 4, wherein the heat-sealable tape is characterized in that: 6. A tape having a structure in which a film-like base material, an anchor coat layer, and a heat seal layer are sequentially laminated, and the heat seal layer further comprises: At least 70 to 30% by weight of a filler component containing a flame retardant as a main component and 30 to 30% by weight of a resin component containing a polyester resin as a main component.
And 70% by weight of the resin composition, and further, the resin component containing the polyester-based resin as a main component has a glass transition point of at least -50 ° C to 10 ° C.
5 to 35% by weight of a polyester resin component having a glass transition point of 20 to 45 ° C.
A heat-sealable tape characterized by comprising a resin component comprising, as main components, 0.5% to 5% by weight of a polyester resin component having a glass transition point of 70 ° C. to 125 ° C. , With the heat seal layers facing each other and
Further, a flat cable characterized in that a conductor is sandwiched between the layers.