JP2001219662A - Aluminum alloy substrate for printing plate - Google Patents

Aluminum alloy substrate for printing plate

Info

Publication number
JP2001219662A
JP2001219662A JP2000029608A JP2000029608A JP2001219662A JP 2001219662 A JP2001219662 A JP 2001219662A JP 2000029608 A JP2000029608 A JP 2000029608A JP 2000029608 A JP2000029608 A JP 2000029608A JP 2001219662 A JP2001219662 A JP 2001219662A
Authority
JP
Japan
Prior art keywords
aluminum alloy
uniformity
printing plate
less
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000029608A
Other languages
Japanese (ja)
Inventor
Hirotake Komine
浩毅 小峰
Mitsuo Ishida
光雄 石田
Keitaro Yamaguchi
恵太郎 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kodak Graphic Communications Japan Ltd
MA Aluminum Corp
Original Assignee
Mitsubishi Aluminum Co Ltd
Kodak Graphic Communications Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Aluminum Co Ltd, Kodak Graphic Communications Japan Ltd filed Critical Mitsubishi Aluminum Co Ltd
Priority to JP2000029608A priority Critical patent/JP2001219662A/en
Publication of JP2001219662A publication Critical patent/JP2001219662A/en
Pending legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To provide an aluminum alloy substrate for a printing plate such as a PS plate which is improved in respect to the uniformity of a roughened surface formed by electrolytic etching. SOLUTION: This aluminum alloy substrate for the PS plate has a composition of Fe 0.11-0.60%, Si 0.01-0.20%, Ni 0.005-0.075%, Zn 0.005-0.075% and Cu less than 0.05% by wt.% and of Al and unavoidable impurities the residues, and satisfies the relations of Zn(%)<=0.08-Ni(%) and Fe(%)>=0.1+Si(%), while crystallized-precipitated matters of 0.01<=d<=2 (μm: 2×10-6 m) exist in the matrix thereof by 1×103<=n<=3×105 (pcs./mm2) when the diameter corresponding to a circle of the crystallized-precipitated matters is denoted by (d) and the number of pieces thereof by (n).

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、平版印刷に用いる
PS版用等のアルミニウム合金支持体に関し、特に電解
エッチングによる粗面の均一性に優れるアルミニウム合
金支持体に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an aluminum alloy support for a PS plate or the like used for lithographic printing, and more particularly to an aluminum alloy support excellent in uniformity of a rough surface by electrolytic etching.

【0002】[0002]

【従来の技術】平版印刷は、アルミニウム合金からなる
支持体上にジアゾ化合物等の感光物を含有する感光層を
塗設し、PS版(Presensitized Plate)に画像露光、
現像等の製版処理を行って画像部を形成した平版印刷版
を印刷機の円筒状版胴に巻付け、非画像部に付着した湿
し水の存在のもとにインキを画像部に付着させてこのイ
ンキをゴム製ブランケットに転写、紙面に印刷するもの
である。
2. Description of the Related Art In lithographic printing, a photosensitive layer containing a photosensitive material such as a diazo compound is coated on a support made of an aluminum alloy, and a PS plate (Presensitized Plate) is exposed to an image.
A lithographic printing plate on which an image portion is formed by performing plate making processes such as development is wound around a cylindrical plate cylinder of a printing press, and ink is attached to the image portion in the presence of dampening water attached to the non-image portion. Lever ink is transferred to a rubber blanket and printed on paper.

【0003】PS版の支持体としては、電解エッチング
等による粗面化処理(砂目立て)、陽極酸化処理などの
表面処理を施したアルミニウム合金板が用いられてい
る。アルミニウム合金としては、当初、JIS1050
(純度99.5%以上の純Al)、JIS1100(A
l−0.05〜0.20%Cu合金)、JIS3003
(Al−0.05〜0.20%Cu−1.5%Mn合
金)が主に用いられてきた。
As a support for the PS plate, an aluminum alloy plate which has been subjected to a surface treatment such as surface roughening treatment (graining) by electrolytic etching or the like, or anodizing treatment is used. Initially, as an aluminum alloy, JIS1050
(Pure Al with a purity of 99.5% or more), JIS1100 (A
1-0.05-0.20% Cu alloy), JIS3003
(Al-0.05 to 0.20% Cu-1.5% Mn alloy) has been mainly used.

【0004】アルミニウム合金支持体には、 (1)電解エッチングによる粗面が均一であること。 (2)感光層の密着性が良好であること。 (3)印刷中に非画像部に汚れが生じないこと 等の種々の特性が要求される。しかし、JIS105
0、JIS1100、JIS3003そのものでは以上
の各要求を十分に満足させることができなかったため、
種々の改良が行われてきた。
[0004] The aluminum alloy support (1) has a uniform roughened surface by electrolytic etching. (2) Good adhesion of the photosensitive layer. (3) Various characteristics are required, such as that no stain is generated in the non-image area during printing. However, JIS105
0, JIS1100 and JIS3003 themselves could not sufficiently satisfy the above requirements,
Various improvements have been made.

【0005】例えば、特開昭58−221254号公報
には、Si0.02〜0.15%、Fe0.1〜1.0
%、Cu0.003%以下、残部Alおよび不可避的不
純物からなるオフセット印刷用素板が開示されている。
また、特開昭62−148295号公報には、Fe0.
05〜1.0%、Si0.2%以下、Cu0.05%以
下、残部Alおよび不可避的不純物からなり、金属組織
中に分布する単体Siが0.012%以下である平版印
刷用アルミニウム合金支持体が開示されている。
[0005] For example, Japanese Patent Application Laid-Open No. 58-221254 discloses that Si 0.02 to 0.15%, Fe 0.1 to 1.0%.
%, Cu 0.003% or less, and a blank for offset printing comprising the balance Al and inevitable impurities are disclosed.
Japanese Patent Application Laid-Open No. 62-148295 discloses Fe0.
Aluminum alloy support for lithographic printing, comprising 0.05 to 1.0%, Si 0.2% or less, Cu 0.05% or less, the balance being Al and unavoidable impurities, and 0.012% or less of simple Si distributed in the metal structure. The body is disclosed.

【0006】前記特開昭58−221254号は、Cu
含有量の増加に伴い耐食性が低下し、その影響で印刷中
に非画像部の汚れが増大するために、Cu含有量を0.
003%以下に規制することを提案している。また、特
開昭62−148295号によると、電解エッチングに
よるピットが均一な粗面が得られ、ストリーク(筋状ム
ラ)の発生がみられず、しかも印刷中に非画像部の汚れ
を抑制することができるという効果を有する。
Japanese Patent Application Laid-Open No. 58-221254 discloses Cu
Corrosion resistance decreases with an increase in the content, and due to this, stains in non-image areas increase during printing.
It is proposed to regulate it to 003% or less. Further, according to Japanese Patent Application Laid-Open No. 62-148295, a rough surface having uniform pits due to electrolytic etching is obtained, no streak (streak-like unevenness) is observed, and a stain on a non-image portion is suppressed during printing. It has the effect of being able to.

【0007】しかるに、印刷精度向上の要求に対して、
前記特開昭58−221254号、特開昭62−148
295号に記載の従来のアルミニウム合金支持体では十
分に対応することが困難となってきた。特に、電解エッ
チングによる粗面の均一性をより向上することが必要と
なってきている。しかも、コスト低減のために、短時間
の電解粗面化処理で均一性に優れた粗面を形成すること
の要望が強くなってきている。
[0007] However, in response to a demand for improved printing accuracy,
JP-A-58-221254 and JP-A-62-148.
No. 295, it has been difficult to sufficiently cope with the conventional aluminum alloy support. In particular, it has become necessary to further improve the uniformity of the rough surface by electrolytic etching. In addition, there has been an increasing demand for forming a rough surface having excellent uniformity by a short-time electrolytic surface roughening treatment for cost reduction.

【0008】この要望に対し、特開平9−184039
号には、重量%でFe:0.25〜0.6%、Si:
0.03〜0.15%、Ti:0.005〜0.05
%、Ni:0.005〜0.20%、残部Al及び不可
避的不純物からなる組成を有し、0.1≦Ni/Si≦
3.7を満たすことを特徴とする印刷版用アルミニウム
合金支持体が提案されている。
In response to this demand, Japanese Patent Application Laid-Open No. 9-184039
No .: Fe: 0.25 to 0.6% by weight, Si:
0.03 to 0.15%, Ti: 0.005 to 0.05
%, Ni: 0.005 to 0.20%, the balance being Al and unavoidable impurities, and 0.1 ≦ Ni / Si ≦
An aluminum alloy support for a printing plate characterized by satisfying 3.7 has been proposed.

【0009】特開平9−184039号の印刷版用アル
ミニウム合金板は、Niを添加することにより向上する
化学溶解性を、Siが有する化学溶解性の抑制性能によ
り抑制することによって、粗面均一性を向上させると共
に、電解処理前の無通電状態での電解液中浸漬によるピ
ットの発生を抑制することを可能としている。
In the aluminum alloy plate for a printing plate disclosed in Japanese Patent Application Laid-Open No. 9-184039, the chemical solubility, which is improved by adding Ni, is suppressed by the ability to suppress the chemical solubility of Si, so that the uniformity of the rough surface is improved. And the occurrence of pits due to immersion in an electrolytic solution in a non-energized state before the electrolytic treatment can be suppressed.

【0010】また、特開平9−272937号には、重
量%で、Fe:0.20〜0.6%、Si:0.03〜
0.15%、Ti:0.005〜0.05%、Ni:
0.005〜0.20%を含有し、更にCu及びZnか
らなる群から選択された1種又は2種以上で0.005
〜0.050%、更にIn,Sn及びPbからなる群か
ら選択された1種又は2種以上で0.001〜0.02
0%含有し、残部Al及び不可避的不純物からなる印刷
版用アルミニウム合金板が提案されている。
Japanese Patent Application Laid-Open No. 9-272937 discloses that, by weight%, Fe: 0.20 to 0.6%, Si: 0.03 to
0.15%, Ti: 0.005 to 0.05%, Ni:
0.005 to 0.20%, and 0.005 or more of one or more selected from the group consisting of Cu and Zn.
-0.050%, and 0.001 to 0.02 of one or more selected from the group consisting of In, Sn and Pb.
There has been proposed an aluminum alloy plate for a printing plate containing 0%, the balance being Al and unavoidable impurities.

【0011】特開平9−272937号の印刷版用アル
ミニウム合金板は、Cu及びZnの1種又は2種、並び
にIn,Sn及びPbの1種又は2種以上を添加し、ア
ルミニウムマトリクス中に固溶させることにより、アル
ミニウムマトリクスと金属間化合物との間の電位差を調
整し、電解粗面を均一化させようというものである。
The aluminum alloy plate for a printing plate disclosed in JP-A-9-272937 is prepared by adding one or more of Cu and Zn, and one or more of In, Sn and Pb, and solidifying in an aluminum matrix. By dissolving, the potential difference between the aluminum matrix and the intermetallic compound is adjusted to make the electrolytic rough surface uniform.

【0012】[0012]

【発明が解決しようとする課題】前記特開平9−184
039号及び前記特開平9−272937号の提案によ
り、粗面均一性は従来に比べ向上したが、より高い印刷
精度が要求されており、そこで本発明は、電解エッチン
グによる粗面の均一性をより向上した印刷版用アルミニ
ウム合金支持体の提供を課題とする。
SUMMARY OF THE INVENTION The above-mentioned Japanese Patent Application Laid-Open No. 9-184 is disclosed.
No. 039 and the proposal of Japanese Patent Application Laid-Open No. 9-272937, the roughness uniformity is improved as compared with the prior art, but higher printing accuracy is required. Therefore, the present invention is to improve the roughness uniformity by electrolytic etching. It is an object to provide a more improved aluminum alloy support for a printing plate.

【0013】[0013]

【課題を解決するための手段】本発明者は前記課題を解
決すべくPS版用アルミニウム合金支持体の電解エッチ
ングの均一性について検討を行ったところ、以下のこと
を知見するに至った。 (1)アルミニウムマトリクス中に晶出、又は析出する
Al−Fe系の金属間化合物が電解エッチング中にカソ
ード点として作用してその溶解性を支配している。 (2)Niを添加するとAl−Fe系の金属間化合物に
取り込まれ、Al−Fe−Ni系の金属間化合物とな
り、溶解均一性を向上させることができる。 (3)Znは、アルミニウムの表面に形成される自然酸
化皮膜を弱体させ、その結果粗面均一性を向上させる。
ただし、Znを過剰に添加すると、酸化皮膜を弱くさせ
る効果が大きくなりすぎ、電解エッチングした際の溶解
量が過剰となり逆に粗面均一性を悪化させる。
The present inventors have studied the uniformity of electrolytic etching of an aluminum alloy support for a PS plate in order to solve the above-mentioned problems, and have found the following. (1) Al-Fe-based intermetallic compounds that crystallize or precipitate in an aluminum matrix act as cathode points during electrolytic etching to control their solubility. (2) When Ni is added, it is taken into the Al-Fe-based intermetallic compound and becomes an Al-Fe-Ni-based intermetallic compound, whereby the uniformity of dissolution can be improved. (3) Zn weakens the natural oxide film formed on the surface of aluminum, thereby improving the uniformity of the rough surface.
However, when Zn is added excessively, the effect of weakening the oxide film becomes too large, and the amount of dissolution at the time of electrolytic etching becomes excessive, thereby deteriorating the uniformity of the rough surface.

【0014】(4)NiとZnの添加量を所定の関係と
することにより、電解エッチングによる粗面均一性を確
保することができる。 (5)Siは、Al−Fe−Si系の金属間化合物を形
成するが、このAl−Fe−Si系の金属間化合物の量
が過大となると電解エッチングにる粗面の均一性を阻害
する。したがって、Fe量との関係においてその含有量
を調整する必要がある。
(4) By setting the amounts of Ni and Zn to be in a predetermined relationship, uniformity of the rough surface by electrolytic etching can be ensured. (5) Si forms an Al-Fe-Si-based intermetallic compound. If the amount of the Al-Fe-Si-based intermetallic compound is excessive, the uniformity of the rough surface obtained by electrolytic etching is impaired. . Therefore, it is necessary to adjust the content in relation to the Fe content.

【0015】本発明の印刷版用アルミニウム合金支持体
は以上の知見に基づくものであり、重量%で、Fe:
0.11〜0.60%、Si:0.01〜0.20%、
Ni:0.005〜0.075%、Zn:0.005〜
0.075%、Cu0.05%未満、残部Al及び不可
避的不純物からなる組成を有し、Zn(%)≦0.08
−Ni(%)、Fe(%)≧0.1+Si(%)の関係
を満足するとともに、晶・析出物の円相当径をd、個数
をnとすると、0.01≦d≦2(μm:2×10
-6m)の晶・析出物が1×103≦n≦3×105(個/
mm2)存在することを特徴とする。
The aluminum alloy support for a printing plate of the present invention is based on the above-mentioned findings.
0.11 to 0.60%, Si: 0.01 to 0.20%,
Ni: 0.005 to 0.075%, Zn: 0.005 to
It has a composition of 0.075%, Cu less than 0.05%, balance Al and unavoidable impurities, and Zn (%) ≦ 0.08
−Ni (%), Fe (%) ≧ 0.1 + Si (%), assuming that the equivalent circle diameter of crystals and precipitates is d and the number is n, 0.01 ≦ d ≦ 2 (μm : 2 × 10
−6 m) of crystals / precipitates of 1 × 10 3 ≦ n ≦ 3 × 10 5 (pieces /
mm 2 ).

【0016】本発明における晶・析出物は、Al−Fe
系、Al−Fe−Ni系、Al−Fe−Si系の金属間
化合物を主体とするものである。
In the present invention, the crystals and precipitates are Al--Fe
, Al-Fe-Ni and Al-Fe-Si based intermetallic compounds.

【0017】[0017]

【発明の実施の形態】以下本発明の成分、その他限定理
由を説明する。 <Fe:0.11〜0.60%>Feは、Al−Fe系
金属間化合物を形成し、電解エッチングによる粗面均一
性を向上するとともに、耐疲労強度を向上する。しか
し、0.11%未満ではこの効果が不十分であり、また
0.60%を超えると金属間化合物の粗大化により電解
エッチングによる粗面の均一性を害する傾向にあるの
で、0.11〜0.60%の範囲とする。望ましいFe
の含有量は、0.2〜0.4%である。
BEST MODE FOR CARRYING OUT THE INVENTION The components of the present invention and other reasons for limitation will be described below. <Fe: 0.11 to 0.60%> Fe forms an Al-Fe-based intermetallic compound, improves the uniformity of the rough surface by electrolytic etching, and improves the fatigue resistance. However, if it is less than 0.11%, this effect is insufficient, and if it exceeds 0.60%, the intermetallic compound tends to be coarse, thereby impairing the uniformity of the rough surface by electrolytic etching. The range is 0.60%. Desirable Fe
Is 0.2 to 0.4%.

【0018】<Si:0.01 〜0.20%>Siは
Al−Fe−Si系の金属間化合物を形成し、熱間圧延
時の再結晶粒の微細化を促す。0.01%未満ではこの
効果が不足して粗大な結晶粒が生じてしまい、電解エッ
チングによる粗面の均一性を阻害したり、ストリークと
呼ばれる軽い未エッチング部を生じさせる。一方、0.
20%を超えると、Al−Fe−Si系の金属間化合物
が粗大化し、電解エッチングによる粗面の均一性を阻害
する。したがって、Siは0.01〜0.20%とし
た。望ましいSiの含有量は、0.04〜0.08%で
ある。
<Si: 0.01 to 0.20%> Si forms an Al-Fe-Si-based intermetallic compound and promotes the refining of recrystallized grains during hot rolling. If the content is less than 0.01%, this effect is insufficient, and coarse crystal grains are generated, thereby impairing the uniformity of the rough surface due to electrolytic etching and generating a light unetched portion called a streak. On the other hand, 0.
If it exceeds 20%, the Al-Fe-Si-based intermetallic compound becomes coarse, which impairs the uniformity of the rough surface by electrolytic etching. Therefore, Si is set to 0.01 to 0.20%. Desirable Si content is 0.04 to 0.08%.

【0019】ところで、Feとの関係においてSiが過
剰になるとAl−Fe−Si系金属間化合物の生成量が
増加して、電解エッチングによる粗面の均一性を阻害す
る。したがって、本発明では前述の通り、Fe(%)≧
0.1+Si(%)の関係を満足させることが望まし
い。
When Si becomes excessive in relation to Fe, the amount of Al—Fe—Si based intermetallic compound increases, which impairs the uniformity of the rough surface due to electrolytic etching. Therefore, in the present invention, as described above, Fe (%) ≧
It is desirable to satisfy the relationship of 0.1 + Si (%).

【0020】<Ni:0.005〜0.075%>Ni
はAl−Fe系金属間化合物に取り込まれてAl−Fe
−Ni系金属間化合物となり、溶解均一性を向上させる
効果を有する。しかし、0.005%未満ではこの効果
が不足して電解エッチングによる粗面均一性向上が十分
ではない。一方、0.075%を超えるとAl−Fe−
Ni系金属間化合物が粗大化して電解エッチングによる
粗面を不均一にしてしまう。したがって、本発明では
0.005〜0.075%の範囲とする。望ましいNi
の含有量は、0.01〜0.03%である。
<Ni: 0.005 to 0.075%> Ni
Is taken into the Al-Fe intermetallic compound and Al-Fe
-Becomes a Ni-based intermetallic compound and has the effect of improving dissolution uniformity. However, if it is less than 0.005%, this effect is insufficient, and the uniformity of the rough surface by the electrolytic etching is not sufficiently improved. On the other hand, if it exceeds 0.075%, Al—Fe—
The Ni-based intermetallic compound becomes coarse and the rough surface formed by electrolytic etching becomes non-uniform. Therefore, in the present invention, the content is in the range of 0.005 to 0.075%. Desirable Ni
Is 0.01 to 0.03%.

【0021】<Zn:0.005〜0.075%>Zn
は、前述の通り、アルミニウムの表面に形成される酸化
皮膜を弱体させ、その結果粗面均一性を向上させる。し
かし、0.005%未満ではこの効果が不十分であり、
一方、過剰に添加すると、酸化皮膜を弱くさせる効果が
大きくなりすぎるので0.075%以下とする。
<Zn: 0.005 to 0.075%> Zn
, As described above, weakens the oxide film formed on the surface of aluminum, thereby improving the uniformity of the rough surface. However, if less than 0.005%, this effect is insufficient,
On the other hand, if added excessively, the effect of weakening the oxide film becomes too large, so the content is made 0.075% or less.

【0022】ZnとNiは共に材料の溶解性を増大する
作用を有し、両者が過剰に添加されると材料の溶解性が
高くなり逆に粗面均一性を低下させる。本発明者の検討
によると、NiとZnの含有量をZn(%)≦0.08
−Ni(%)を満足させるように規制すれば、以上のよ
うな不都合が生じないことを知見した。
Both Zn and Ni have the effect of increasing the solubility of the material, and when both are added in excess, the solubility of the material is increased and conversely, the uniformity of the rough surface is reduced. According to the study of the present inventors, the contents of Ni and Zn are set to Zn (%) ≦ 0.08.
It has been found that the above-mentioned inconvenience does not occur if regulation is performed so as to satisfy -Ni (%).

【0023】<Cu:0.05%未満>Cuは微量な含
有で材料のエッチング性を不均一化させる。即ち、電解
エッチング後の粗面の均一性を阻害する元素である。特
に、NiとZnを含有するアルミニウム合金では不均一
化が大きい。従って、本発明では0.05%未満、好ま
しくは0.02%未満、さらに好ましくは0.005%
とする。エッチング性を最も良好とするための最も望ま
しいCuの含有量は、0.003%未満である。
<Cu: less than 0.05%> Cu makes the etching property of the material non-uniform when contained in a very small amount. That is, it is an element that inhibits the uniformity of the rough surface after electrolytic etching. In particular, non-uniformity is large in an aluminum alloy containing Ni and Zn. Therefore, in the present invention, less than 0.05%, preferably less than 0.02%, more preferably 0.005%
And The most desirable Cu content for the best etchability is less than 0.003%.

【0024】<その他不純物元素>本発明の印刷版用ア
ルミニウム合金支持体においては、以上の元素以外に不
可避不純物元素が含まれるが、以下の範囲であれば本発
明の目的を阻害しない。 Mg:0.02%以下 Ti:0.03%以下 V:0.01%以下 B:0.002%以下
<Other Impurity Elements> The aluminum alloy support for a printing plate of the present invention contains unavoidable impurity elements in addition to the above elements, but the object of the present invention is not impaired within the following ranges. Mg: 0.02% or less Ti: 0.03% or less V: 0.01% or less B: 0.002% or less

【0025】次に、本発明の印刷版用アルミニウム合金
支持体の晶・析出物について説明する。本発明者等の検
討によると、晶・析出物である金属間化合物の寸法及び
量が電解エッチングによる粗面の均一性に影響を与え
る。すなわち、円相当径dが0.01μm(0.01×
10-6m)未満の金属間化合物ではエッチングの起点と
ならないが、2μmを超えると均一性を阻害する。ま
た、金属間化合物が1×10 3個/mm2未満ではエッチ
ング起点となる金属間化合物の数が少ないために粗面均
一性がおとり、また、3×105個/mm2を超えると溶
解性が高くなりすぎて粗面均一性が低下する。
Next, the aluminum alloy for a printing plate of the present invention
The crystals / precipitates of the support will be described. Investigation by the present inventors
According to the discussion, the size and size of the intermetallic compound
Amount affects the uniformity of the rough surface by electrolytic etching.
You. That is, the circle equivalent diameter d is 0.01 μm (0.01 ×
10-6For intermetallic compounds less than m), the starting point of etching
However, if it exceeds 2 μm, the uniformity is impaired. Ma
In addition, 1 × 10 ThreePieces / mmTwoLess than etch
Surface roughness due to the small number of intermetallic compounds
One sex is a decoy, and 3 × 10FivePieces / mmTwoExceeds
The resolvability becomes too high and the uniformity of the rough surface is reduced.

【0026】晶・析出物の寸法、量は、鋳造条件(主に
冷却速度)、鋳造後に行われる均質化処理、熱間圧延条
件(主に圧延温度)に左右される。本発明では、本系ア
ルミニウム合金で通常行われている均質化処理を省略す
ることが効果的である。すなわち、均質化処理を行うと
晶・析出物がマトリクス内に均一に分散するという利点
がある反面、粗大化してしまう傾向にある。そこで、本
発明では晶・析出物の粗大化を防止して粗面の均一性向
上を図ることが有効である。
The size and amount of the crystals and precipitates depend on the casting conditions (mainly the cooling rate), the homogenization treatment performed after casting, and the hot rolling conditions (mainly the rolling temperature). In the present invention, it is effective to omit the homogenization treatment usually performed on the present aluminum alloy. That is, the homogenization treatment has the advantage that crystals and precipitates are uniformly dispersed in the matrix, but tends to be coarse. Therefore, in the present invention, it is effective to prevent coarsening of crystals and precipitates and improve the uniformity of the rough surface.

【0027】以下本発明の印刷板版用アルミニウム合金
支持体に有効な製造上検討について説明する。 <鋳造>鋳造は、本発明の平板印刷版用アルミニウム合
金支持体を製造する上で特に限定されるものではなく、
例えばDC鋳造法等従来公知の鋳造法を適用することが
できる。
A description will now be given of a study in terms of production which is effective for the aluminum alloy support for a printing plate of the present invention. <Casting> Casting is not particularly limited in producing the aluminum alloy support for a lithographic printing plate of the present invention,
For example, a conventionally known casting method such as a DC casting method can be applied.

【0028】<熱処理>一般的には、鋳造により得られ
た鋳塊に450〜600℃の温度範囲における均質化熱
処理を施す。この均質化熱処理によりFeの一部が固溶
するとともに、Al−Fe系金属間化合物が均一微細に
分散する。ただし、上述の通り本発明においては必ずし
も必須の工程ではない。
<Heat Treatment> Generally, the ingot obtained by casting is subjected to a homogenization heat treatment in a temperature range of 450 to 600 ° C. This homogenization heat treatment causes a part of Fe to form a solid solution and the Al-Fe intermetallic compound to be uniformly and finely dispersed. However, as described above, it is not an essential step in the present invention.

【0029】均質化処理を行う場合でも、晶・析出物の
円相当径をd、個数をnとすると、0.01≦d≦2
(2μm:2×10-6m)の晶・析出物が1×103
n≦3×105(個/mm2)となるように、温度、保持
時間を制御することが望ましい。均質化熱処理後、一旦
鋳塊を冷却した後に次工程である熱間圧延のための均熱
処理を行うこともできるが、均質化熱処理から直に熱間
圧延を行うこともできる。
Even when the homogenization treatment is performed, 0.01 ≦ d ≦ 2, where d is the equivalent circle diameter of the crystal / precipitate and n is the number thereof.
(2 μm: 2 × 10 −6 m) crystals and precipitates are 1 × 10 3
It is desirable to control the temperature and the holding time so that n ≦ 3 × 10 5 (pieces / mm 2 ). After the homogenization heat treatment, the ingot can be cooled once and then subjected to the soaking treatment for the next step of hot rolling. Alternatively, the hot rolling can be performed directly from the homogenization heat treatment.

【0030】<熱間圧延>均質化熱処理を経た後に熱間
圧延を行う。熱間圧延は300〜600℃の温度範囲で
行うのが適当である。600℃を超えると再結晶粒が粗
大化して、粗面化処理によりストリークが発生しやすく
なる。
<Hot rolling> After the homogenizing heat treatment, hot rolling is performed. Hot rolling is suitably performed in a temperature range of 300 to 600 ° C. If the temperature exceeds 600 ° C., the recrystallized grains become coarse, and streaks tend to occur due to the surface roughening treatment.

【0031】<冷間圧延>熱間圧延後、冷間圧延を行
う。この冷間圧延によりAl−Fe系の金属間化合物が
分散して結晶組織が均一微細となる。この効果を得るた
めには、50%、望ましくは70%以上の減面率とする
ことが必要である。
<Cold Rolling> After hot rolling, cold rolling is performed. This cold rolling disperses the Al-Fe intermetallic compound and makes the crystal structure uniform and fine. In order to obtain this effect, it is necessary to reduce the area by 50%, preferably 70% or more.

【0032】<焼鈍>冷間圧延後に、適度な強度及び伸
びを板材に付与することを主目的として焼鈍を行う。焼
鈍は300〜600℃の温度範囲で行う。300℃未満
では目的を達成することができず、600℃を超えると
表面の酸化が著しくなり好ましくないからである。望ま
しい焼鈍温度は350〜500℃である。焼鈍は連続焼
鈍炉、バッチ式焼鈍炉の何れであっても構わない。
<Annealing> After cold rolling, annealing is performed mainly for imparting appropriate strength and elongation to the sheet material. Annealing is performed in a temperature range of 300 to 600 ° C. If the temperature is lower than 300 ° C., the object cannot be achieved. If the temperature is higher than 600 ° C., oxidation of the surface becomes remarkable, which is not preferable. Desirable annealing temperature is 350-500 ° C. Annealing may be performed in any of a continuous annealing furnace and a batch annealing furnace.

【0033】<仕上げ冷間圧延>焼鈍後、再度冷間圧延
を行う。この冷間圧延は、印刷版用アルミニウム合金支
持体に要求される硬さに調整、仕上げすることを目的と
する。PS版用等の印刷版用アルミニウム合金支持体に
要求される硬さはH16であるので、これに適合するよう
に圧下率を調整する。
<Finish Cold Rolling> After annealing, cold rolling is performed again. The purpose of this cold rolling is to adjust and finish the hardness required for the aluminum alloy support for a printing plate. Since the hardness required for the printing plate aluminum alloy support for PS plate or the like is the H 16, to adjust the rolling reduction to accommodate this.

【0034】<表面処理>仕上げ冷間圧延終了後、塩
酸、硝酸等の電解液中に浸漬して電解エッチングによる
粗面化処理を行う。粗面化処理は、画像部においては感
光層との密着性、非画像部においては親水性及び保水性
を向上させるために施される。粗面化処理を行った後
に、陽極酸化処理を行って表面の耐摩耗性、親水性を向
上させることもできる。
<Surface Treatment> After the finish cold rolling is completed, the surface is immersed in an electrolytic solution such as hydrochloric acid or nitric acid to perform a surface roughening treatment by electrolytic etching. The surface roughening treatment is performed to improve the adhesion to the photosensitive layer in the image area and to improve the hydrophilicity and water retention in the non-image area. After performing the surface roughening treatment, the surface may be subjected to an anodic oxidation treatment to improve the wear resistance and hydrophilicity of the surface.

【0035】[0035]

【実施例】以下本発明を実施例に基づき説明する。 <実施例1>表1に示す組成(wt.%)の合金スラブをD
C鋳造法により得た。鋳造速度は30mm/min、ス
ラブ厚は200mmである。このスラブを510℃に加
熱した後に熱間圧延し、焼鈍及び冷間圧延を施すことに
より0.3mm厚の板状の供試材を得た。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to embodiments. <Example 1> An alloy slab having a composition (wt.
Obtained by C casting method. The casting speed is 30 mm / min and the slab thickness is 200 mm. The slab was heated to 510 ° C., then hot-rolled, and subjected to annealing and cold rolling to obtain a 0.3 mm-thick plate-shaped test material.

【0036】[0036]

【表1】 [Table 1]

【0037】得られた供試材を、50℃、10%水酸化
ナトリウム水溶液中に30秒間浸漬、脱脂後、25℃、
10%硝酸中に30秒間浸漬するデスマット処理を施し
た。ついでこの供試材を25℃、2%塩酸中に浸漬し、
60Hz、50A/dm2の正弦波で交流電解エッチン
グし、次いで50℃、10%水酸化ナトリウム水溶液中
に6秒間浸漬、25℃、10%硝酸中に30秒間浸漬す
るデスマット処理を順次施した後、乾燥した。乾燥後、
粗面を走査型電子顕微鏡(SEM)により500倍で
0.0252mm2を写真撮影をしてピットの均一性評
価を行った。評価は、円相当径が5μm(5×10
-6m)を超えるピットの合計面積が評価面積の5%未満
のものに○、5%以上のものを×とした。また、目視に
より50×100mm2のエッチング面を観察し、未エ
ッチング部分が観察されたものを×、観察されないもの
を○とした。
The obtained test material was immersed in a 10% aqueous sodium hydroxide solution at 50 ° C. for 30 seconds, degreased, and then baked at 25 ° C.
Desmut treatment was performed by dipping in 10% nitric acid for 30 seconds. Next, this test material was immersed in 2% hydrochloric acid at 25 ° C.
AC electrolytic etching was performed with a sine wave of 60 Hz and 50 A / dm2, followed by a desmutting process of immersing in a 50% aqueous solution of 10% sodium hydroxide for 6 seconds and then immersing in 25% of 10% nitric acid for 30 seconds. Dried. After drying,
The rough surface was photographed with a scanning electron microscope (SEM) at a magnification of 500 × 0.0252 mm 2 to evaluate the pit uniformity. In the evaluation, the circle equivalent diameter was 5 μm (5 × 10
The total area of the pits exceeding −6 m) was less than 5% of the evaluation area, and ピ ッ ト was obtained when the total area was 5% or more. Further, the etched surface of 50 × 100 mm 2 was visually observed, and the case where an unetched portion was observed was evaluated as x, and the case where it was not observed was evaluated as ○.

【0038】結果を表1に併せて示すが、本願発明によ
る実施例No.1〜No.3は、ピット均一性に優れ、
また、未エッチング部分が観察されず、電解エッチング
による粗面均一性が優れることがわかる。
The results are shown in Table 1, and the results are shown in Example No. 1 according to the present invention. 1 to No. 3 has excellent pit uniformity,
In addition, no unetched portion was observed, indicating that the rough surface uniformity by electrolytic etching was excellent.

【0039】比較例No.4は、Zn含有量が本発明範
囲を超えているため、溶解性が増大しすぎてピット均一
性が阻害されている。
Comparative Example No. In No. 4, since the Zn content exceeds the range of the present invention, the solubility is excessively increased, and the pit uniformity is hindered.

【0040】比較例No.5は、Zn含有量が本発明範
囲に達していないためにアルミニウム表面の酸化皮膜を
弱体させる効果が不十分となり、ピット均一性が劣り、
加えて未エッチング部分が観察された。
Comparative Example No. 5, the effect of weakening the oxide film on the aluminum surface was insufficient because the Zn content did not reach the range of the present invention, and the pit uniformity was poor.
In addition, unetched portions were observed.

【0041】比較例No.6は、Si含有量が本発明範
囲を超えているとともに、Zn含有量が本発明範囲に達
していないためピット均一性が劣り、加えて未エッチン
グ部分が観察された。
Comparative Example No. In No. 6, since the Si content exceeded the range of the present invention and the Zn content did not reach the range of the present invention, the pit uniformity was poor, and in addition, an unetched portion was observed.

【0042】比較例No.7は、Si含有量が本発明範
囲を越えているとともに、Feとの関係においてはFe
(%)≧0.1+Si(%)の関係を満たさないため、
ピット均一性が劣る。
Comparative Example No. No. 7 shows that the Si content is beyond the range of the present invention, and in relation to Fe,
(%) ≧ 0.1 + Si (%)
Poor pit uniformity.

【0043】比較例No.8は、組成的には本発明範囲
に包含されるが、0.01≦d≦2(μm:2×10-6
m)の晶・析出物の存在が1×103≦n≦3×10
5(個/mm2)の範囲を超えているため、未エッチング
部が観察された。
Comparative Example No. 8 is within the scope of the present invention in terms of composition, but 0.01 ≦ d ≦ 2 (μm: 2 × 10 −6)
m) is 1 × 10 3 ≦ n ≦ 3 × 10
Since it exceeded the range of 5 (pieces / mm 2 ), an unetched portion was observed.

【0044】比較例No.9は、Cu含有量が本発明の
範囲を超えているために、ピットの均一性が劣り、加え
て未エッチング部分が観察された。
Comparative Example No. In No. 9, since the Cu content exceeded the range of the present invention, the uniformity of pits was poor, and in addition, unetched portions were observed.

【0045】[0045]

【発明の効果】以上説明のように、本発明は、重量%
で、Fe:0.11〜0.60%、Si:0.01〜
0.20%、Ni:0.005〜0.075%、Zn:
0.005〜0.075%、Cu0.005%未満、残
部Al及び不可避的不純物からなる組成を有し、Zn
(%)≦0.08−Ni(%)、Fe(%)≧0.1+
Si(%)の関係を満たすとともに、晶・析出物の円相
当径をd、個数をnとすると、0.01≦d≦2(μ
m:2×10-6m)の晶・析出物が1×103≦n≦3
×105(個/mm2)存在することを特徴とする印刷版
用アルミニウム合金支持体としたので、電解エッチング
による粗面を従来の支持体より均一に形成することがで
きる。
As described above, according to the present invention, the weight%
And Fe: 0.11 to 0.60%, Si: 0.01 to
0.20%, Ni: 0.005 to 0.075%, Zn:
It has a composition of 0.005 to 0.075%, less than 0.005% of Cu, and the balance of Al and unavoidable impurities.
(%) ≦ 0.08−Ni (%), Fe (%) ≧ 0.1 +
Assuming that the relationship of Si (%) is satisfied, the equivalent circle diameter of crystals and precipitates is d, and the number is n, 0.01 ≦ d ≦ 2 (μ
m: 2 × 10 −6 m) 1 × 10 3 ≦ n ≦ 3
Since the aluminum alloy support for a printing plate is characterized by the presence of × 10 5 (pieces / mm 2 ), a roughened surface by electrolytic etching can be formed more uniformly than a conventional support.

フロントページの続き (72)発明者 石田 光雄 群馬県邑楽郡千代田町大字昭和1番地 コ ダックポリクロームグラフィックス株式会 社群馬工場内 (72)発明者 山口 恵太郎 静岡県裾野市平松85番地 三菱アルミニウ ム株式会社技術開発センター内 Fターム(参考) 2H114 AA04 AA14 BA10 DA04 DA64 EA02 GA08 GA09 Continued on the front page (72) Inventor Mitsuo Ishida 1st section of Showa, Chiyoda-cho, Yuraku-gun, Gunma Prefecture Inside the Gunma Plant of Kodak Polychrome Graphics Co., Ltd. (72) Inventor Keitaro Yamaguchi 85-85 Hiramatsu, Susono City, Shizuoka Prefecture Mitsubishi Aluminum F-term in the Technology Development Center Co., Ltd. (reference) 2H114 AA04 AA14 BA10 DA04 DA64 EA02 GA08 GA09

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 重量%で、Fe:0.11〜0.60
%、Si:0.01〜0.20%、Ni:0.005〜
0.075%、Zn:0.005〜0.075%、Cu
0.05%未満、残部Al及び不可避的不純物からなる
組成を有し、Zn(%)≦0.08−Ni(%)、Fe
(%)≧0.1+Si(%)の関係を満たすとともに、
晶・析出物の円相当径をd、個数をnとすると、0.0
1≦d≦2(μm:2×10-6m)の晶・析出物がその
マトリックス中に1×103≦n≦3×105(個/mm
2)存在することを特徴とする印刷版用アルミニウム合
金支持体。
1. Fe: 0.11 to 0.60% by weight
%, Si: 0.01 to 0.20%, Ni: 0.005 to
0.075%, Zn: 0.005 to 0.075%, Cu
It has a composition of less than 0.05%, the balance being Al and unavoidable impurities, Zn (%) ≦ 0.08-Ni (%), Fe
(%) ≧ 0.1 + Si (%)
If the equivalent circle diameter of crystals and precipitates is d and the number is n, 0.0
Crystals and precipitates of 1 ≦ d ≦ 2 (μm: 2 × 10 −6 m) are contained in the matrix at 1 × 10 3 ≦ n ≦ 3 × 10 5 (pieces / mm)
2 ) An aluminum alloy support for a printing plate, characterized by being present.
【請求項2】 晶・析出物は、Al−Fe系、Al−F
e−Ni系、Al−Fe−Si系の金属間化合物の1種
または2種以上を主体とするものである請求項1記載の
印刷版用アルミニウム合金支持体。
2. Crystals and precipitates are Al-Fe, Al-F
The aluminum alloy support for a printing plate according to claim 1, wherein the aluminum alloy support is mainly composed of one or more of e-Ni-based and Al-Fe-Si-based intermetallic compounds.
JP2000029608A 2000-02-07 2000-02-07 Aluminum alloy substrate for printing plate Pending JP2001219662A (en)

Priority Applications (1)

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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
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Publications (1)

Publication Number Publication Date
JP2001219662A true JP2001219662A (en) 2001-08-14

Family

ID=18554842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000029608A Pending JP2001219662A (en) 2000-02-07 2000-02-07 Aluminum alloy substrate for printing plate

Country Status (1)

Country Link
JP (1) JP2001219662A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012149289A (en) * 2011-01-18 2012-08-09 Mitsubishi Alum Co Ltd Aluminum foil for printed circuit
JP2014122407A (en) * 2012-12-21 2014-07-03 Mitsubishi Alum Co Ltd Aluminum alloy plate for printing plate and production method thereof
JP2014122408A (en) * 2012-12-21 2014-07-03 Mitsubishi Alum Co Ltd Aluminum alloy plate for printing plate and production method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09143603A (en) * 1995-09-20 1997-06-03 Kobe Steel Ltd Aluminum alloy plate for printing plate and its production
JPH09272937A (en) * 1996-04-08 1997-10-21 Kobe Steel Ltd Aluminum alloy plate for printing plate and its production
JPH11115333A (en) * 1997-10-17 1999-04-27 Kobe Steel Ltd Aluminum alloy plate for printing plate and manufacture thereof
JPH11151870A (en) * 1997-11-21 1999-06-08 Konica Corp Aluminum alloy sheet for lithographic printing block

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09143603A (en) * 1995-09-20 1997-06-03 Kobe Steel Ltd Aluminum alloy plate for printing plate and its production
JPH09272937A (en) * 1996-04-08 1997-10-21 Kobe Steel Ltd Aluminum alloy plate for printing plate and its production
JPH11115333A (en) * 1997-10-17 1999-04-27 Kobe Steel Ltd Aluminum alloy plate for printing plate and manufacture thereof
JPH11151870A (en) * 1997-11-21 1999-06-08 Konica Corp Aluminum alloy sheet for lithographic printing block

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012149289A (en) * 2011-01-18 2012-08-09 Mitsubishi Alum Co Ltd Aluminum foil for printed circuit
JP2014122407A (en) * 2012-12-21 2014-07-03 Mitsubishi Alum Co Ltd Aluminum alloy plate for printing plate and production method thereof
JP2014122408A (en) * 2012-12-21 2014-07-03 Mitsubishi Alum Co Ltd Aluminum alloy plate for printing plate and production method thereof

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