JP2001215696A - Photosensitive resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of ensuring both high film-leaving property and enhanced sensitivity in practical use. SOLUTION: In the photosensitive resin composition containing an alkali- soluble resin and a quinonediazido-containing photosensitive agent, the photosensitive agent is contained by a smaller amount than the amount of a conventional photosensitive agent, that is, 1-20 pts.wt. based on 100 pts.wt. resin in the composition and the velocity of dissolution of the composition in 2.38 wt.% aqueous tetramethylammonium hydroxide solution is adjusted to <= 5,000 Å/min. This velocity can be attained by adding (a) an alkali-insoluble polyacrylic ester, polymethacrylic ester or polystyrene derivative, (b) a copolymer obtained from at least two monomers selected from acrylic esters, methacrylic esters and styrene derivatives, (c) a copolymer of the monomers and an organic acid such as a polyacrylic acid or (d) a mixture of the alkali-insoluble polymer and an organic acid polymer by 1-10 pts.wt. based on 100 pts.wt. alkali-soluble resin in the composition, e.g. novolak resin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a photosensitive resin composition, and more particularly to a photosensitive resin composition suitable for producing semiconductor devices, flat panel displays (FPD), and the like.

[0002]

2. Description of the Related Art Semiconductor integrated circuits such as LS1 and FPDs
2. Description of the Related Art In a wide range of fields, such as the manufacture of display surfaces and the manufacture of circuit boards such as thermal heads, photolithography techniques have been conventionally used to form or process fine elements. In the photolithography technology, a positive or negative photosensitive resin composition is used to form a resist pattern. Among these photosensitive resin compositions, a composition containing an alkali-soluble resin and a quinonediazide compound as a photosensitive agent is widely used as a positive photosensitive resin composition. This composition is referred to as, for example, "Novolak resin / quinonediazide compound" in JP-B-54-23570 (U.S. Pat. No. 3,666,473) and JP-B-56-30.
No. 850 (U.S. Pat. No. 4,115,128), JP-A-55-73045, and JP-A-61-2.
Various compositions, such as Japanese Patent No. 05933, describe various compositions. Compositions containing these novolak resins and quinonediazide compounds have been studied and developed from both sides of novolak resins and photosensitive agents. From the viewpoint of novolak resin, of course, development of a new resin,
By improving the properties of conventionally known resins, a photosensitive resin composition having excellent properties has been obtained. For example, JP-A-60-140235 and JP-A-1-105243 disclose that a novolak resin has a specific molecular weight distribution,
JP-A-0-97347, JP-A-60-189739 and JP-A-2590342 provide a photosensitive resin composition having excellent properties by using a novolak resin from which low molecular weight components have been separated and removed. Techniques are disclosed. Further, as a negative photosensitive resin composition, a composition in which a novolak resin is combined with an alkoxymethylated melamine as a crosslinking agent and a halogenated triazine as an acid generator (Japanese Patent Application Laid-Open No. 5-303196) is known.

However, the degree of integration of an integrated circuit of a semiconductor device is increasing year by year, and a pattern processing with a line width of submicron or less is required in the manufacture of a semiconductor device and the like, and the conventional technology cannot sufficiently cope with it. Is coming. In the production of a display surface such as a liquid crystal display (LCD), a mother glass is required to have a large size and high definition. In applications where such fine processing is required, not only resolution but also good pattern reproducibility is required, and from the viewpoint of manufacturing cost,
Improvements in throughput (yield per unit time) during production and cost reduction of the photosensitive resin composition are required.
For this reason, high sensitivity and low cost of the photosensitive resin composition have become important issues.

Generally, in order to increase the sensitivity of a photosensitive resin composition, a resin having a low molecular weight is used, or the amount of a photosensitive agent added is reduced. However, according to such a method, the heat resistance of the resist decreases, the etching resistance decreases in the manufacturing process of a semiconductor device or the like, the developability deteriorates, and scum (residual development) occurs,
Problems such as a decrease in the remaining film ratio occur. Heretofore, a technique using a mixed resin in which the molecular weight range of a plurality of novolak resin mixtures derived from a specific phenol compound is specified (Japanese Patent Application Laid-Open No. Hei 7-271024), the molecular weight using a novolak resin derived from a specific phenol compound range,
A technique in which the degree of dispersion is specified and the composition further contains a polyhydroxy compound having a phenolic hydroxyl group (JP-A-8-18)
No. 4,963), and a technique using a photosensitive component in which a naphthoquinonediazidosulfonic acid ester of trihydroxybenzophenone and trihydroxybenzophenone are mixed at a certain ratio (Japanese Patent Laid-Open No. 8-82926). However, none of the above requirements has been sufficiently satisfied, and thus a photosensitive resin composition that can satisfy these requirements, that is, a photosensitive composition having high sensitivity, good developability, and excellent residual film properties There is a need for a conductive resin composition. Also, in order to reduce the cost of the photosensitive resin composition, it is desired to reduce the amount of the photosensitive agent having a high unit price. However, when the amount of the photosensitive agent is reduced, the above-described problem occurs. .

[0005]

SUMMARY OF THE INVENTION In view of the above-mentioned circumstances, the present invention provides a photosensitive resin composition containing a smaller amount of a photosensitive substance than before, and still having a high residual film property and high sensitivity. It is practically possible to balance
It is another object of the present invention to provide a photosensitive resin composition capable of forming a good pattern.

[0006]

Means for Solving the Problems As a result of intensive studies and studies, the present inventors have found that the amount of the photosensitive agent in the photosensitive resin composition containing the alkali-soluble resin and the photosensitive agent containing a quinonediazide group can be reduced. It was found that the above-mentioned object can be achieved by a photosensitive resin composition in which the dissolution rate of the obtained photosensitive resin composition in an alkali developer is less than or equal to a certain value, which is less than the usual addition amount of the present invention. This has led to the invention.

That is, the present invention provides the following (1) to
(5). (1) In a photosensitive resin composition containing an alkali-soluble resin and a photosensitive agent containing a quinonediazide group, the amount of the photosensitive agent containing a quinonediazide group is 1 to 20 parts by weight based on 100 parts by weight of the resin component in the photosensitive resin composition. And the dissolution rate of the photosensitive resin composition in a 2.38% by weight aqueous solution of tetramethylammonium hydroxide is 5000 ° /
Minutes or less. (2) In the photosensitive resin composition of the above (1), the resin component in the photosensitive resin composition is a mixture of a novolak resin and at least one selected from a polyacrylate, a polymethacrylate and a polystyrene derivative. A photosensitive resin composition comprising: (3) In the photosensitive resin composition of the above (1), the resin components in the photosensitive resin composition are a novolak resin and at least two monomers selected from acrylates, methacrylates and styrene derivatives. A photosensitive resin composition comprising a mixture with a copolymer obtained from the above.

(4) In the photosensitive resin composition of the above (1), the resin component in the photosensitive resin composition is a novolak resin and at least one selected from polyacrylates, polymethacrylates and polystyrene derivatives. And a polymer of an organic acid monomer having a carboxyl group or a carboxylic anhydride group. (5) In the photosensitive resin composition of the above (1), the resin components in the photosensitive resin composition are a novolak resin, at least one monomer selected from acrylates, methacrylates, and styrene derivatives, and A photosensitive resin composition comprising a mixture with a copolymer obtained from an organic acid monomer having a carboxyl group or a carboxylic anhydride group.

Regarding sensitivity, these photosensitive resin compositions have a 5 μm line and space of 1:
The minimum exposure energy amount resolved to 1 is 80 mJ / cm
^{A value of 2} or less is considered practically useful.

Hereinafter, the present invention will be described in more detail. In the present invention, the amount of the sensitizer containing a quinonediazide group is less than the amount conventionally used for 100 parts by weight of the resin component in the photosensitive resin composition.
2.3 to 20 parts by weight of the photosensitive resin composition.
It is necessary that the dissolution rate in an 8% by weight aqueous solution of tetramethylammonium hydroxide be 5000 ° C./min or less. One of the means for this is to include an alkali-insoluble resin together with an alkali-soluble resin. It turned out to be. As a combination of these alkali-soluble resin and alkali-insoluble resin, the alkali-soluble resin is a novolak resin, and the alkali-insoluble resin is at least one resin selected from polyacrylates, polymethacrylates and polystyrene derivatives, or A combination that is a copolymer obtained from at least two kinds of monomers selected from acrylates, methacrylates, and styrene derivatives is preferable. Further, in place of these alkali-insoluble resins, a copolymer obtained from at least one of the monomers constituting the alkali-insoluble resin and an organic acid monomer such as acrylic acid or methacrylic acid is used. It has been found that by using an alkali-soluble resin such as acrylic acid in combination, it is possible to obtain characteristics excellent in residual film properties and excellent in developability as in the case of using an alkali-insoluble resin.

This is because, in the case of a conventional photosensitive resin composition using only a novolak resin which is an alkali-soluble resin as a resin component in the photosensitive resin composition, the dissolution rate of the photosensitive resin composition in an alkali developing solution is as follows. , Depends largely on the weight average molecular weight of the novolak resin and the amount of the photosensitizer added, and if these are adjusted to increase the sensitivity, as described above, the development property and the residual film property are reduced. However, copolymers obtained from at least two monomers selected from polyacrylates, polymethacrylates, polystyrene derivatives or acrylates, methacrylates, and styrene derivatives that are insoluble in an alkali developer. When combined with a novolak resin, the resin that is insoluble in the alkaline developer becomes It works as a dissolution inhibitor for the luka developer, which is presumed to be because even if the amount of the sensitizer added to the novolak resin is reduced, the high residual film property is maintained and the sensitivity can be increased by using a small amount of the sensitizer. You. When a copolymer obtained by using an organic acid monomer in place of the alkali-insoluble resin is used or when an organic acid polymer such as polyacrylic acid is used in combination with the alkali-insoluble resin, the alkali When the insoluble part shows a dissolution inhibiting effect and the alkali-soluble part is developed,
This is presumably because the solubility of the exposed region in the developing solution was improved, and the balance between the effect of suppressing the dissolution of the photosensitive resin composition and the improvement in the solubility was achieved.

In the present invention, the dissolution rate of the photosensitive resin composition in a 2.38% by weight aqueous solution of tetramethylammonium hydroxide is calculated as follows. (Calculation of dissolution rate) The photosensitive resin composition is spin-coated on a silicon wafer and baked on a hot plate at 100 ° C. for 90 seconds to form a resist film having a thickness of about 1.5 μm. At this time, the thickness d ₁ ( ₁ ) of the photoresist was measured, and a test was performed on the resist film using a Nikon FX-604F stepper so that various line widths in which the line and space width became 1: 1 were obtained. After exposing the pattern 2.38
23 wt% aqueous tetramethylammonium hydroxide solution
Develop at 60 ° C. for 60 seconds. After development, the resist thickness d
₂ Measure (Å) and determine the difference in film thickness (d ₁ -d ₂ ) before and after development as the dissolution rate (Å / min).

The alkali-soluble resin used in the photosensitive resin composition of the present invention is a conventionally known alkali-soluble resin used in a photosensitive resin composition containing an alkali-soluble resin and a sensitizer containing a quinonediazide group. Any one may be used as long as it is not particularly limited. As the alkali-soluble resin, a novolak resin is preferable. The novolak resin which can be preferably used in the present invention can be obtained by polycondensing various phenols alone or a mixture of plural kinds thereof with an aldehyde acid such as formalin.

The phenols constituting the novolak resin include, for example, phenol, p-cresol, m-cresol, o-cresol, 2,3-dimethylphenol, 2,4-dimethylphenol, 2,5-dimethylphenol, 2,6-dimethylphenol, 3,4-dimethylphenol, 3,5-dimethylphenol, 2,
3,4-trimethylphenol, 2,3,5-trimethylphenol, 3,4,5-trimethylphenol,
2,4,5-trimethylphenol, methylenebisphenol, methylenebis-p-cresol, resorcin, catechol, 2-methylresorcin, 4-methylresorcin, o-chlorophenol, m-chlorophenol, p
-Chlorophenol, 2,3-dichlorophenol, m
-Methoxyphenol, p-methoxyphenol, p-
Butoxyphenol, o-ethylphenol, m-ethylphenol, p-ethylphenol, 2,3-diethylphenol, 2,5-diethylphenol, p-isopropylphenol, α-naphthol, β-naphthol, and the like. Can be used alone or as a mixture of a plurality.

Examples of the aldehyde include formalin, paraformaldehyde, acetaldehyde, benzaldehyde, hydroxybenzaldehyde, chloroacetaldehyde and the like, and these can be used alone or as a mixture of a plurality of them. The preferred weight average molecular weight of the novolak resin used in the photosensitive resin composition of the present invention is 2,000 to 50,000, more preferably 3,000, in terms of polystyrene.
~ 40,000, more preferably 4,000 ~ 30,
000.

On the other hand, examples of polyacrylic acid esters, polymethacrylic acid esters, polystyrene derivatives or polymers of organic acid monomers which can be preferably used together with an alkali-soluble resin such as a phenol resin include the following. . Polyacrylate: polymethyl acrylate, polyethyl acrylate, poly n-butyl acrylate,
Polybenzyl acrylate, poly 2-chloroethyl acrylate, polymethyl-α-chloroacrylate, polyphenyl α-bromoacrylate, etc. Polymethacrylates: polymethyl methacrylate, polyethyl methacrylate, poly n-propyl methacrylate, poly n-butyl methacrylate, Poly n-
Hexyl methacrylate, polyisopropyl methacrylate, polyisobutyl methacrylate, poly t-butyl methacrylate, polycyclohexyl methacrylate,
Polybenzyl methacrylate, polyphenyl methacrylate, poly 1-phenylethyl methacrylate, poly 2
-Phenylethyl methacrylate, polyfurfuryl methacrylate, polydiphenylmethyl methacrylate, polypentachlorophenyl methacrylate, polynaphthyl methacrylate, etc. Polystyrene derivatives: poly p-fluorostyrene, poly o, p-difluorostyrene, poly p-isopropylstyrene, polystyrene, poly Polymers of organic acid monomers such as o-chlorostyrene: polyacrylic acid, polymethacrylic acid, polyitaconic acid, polymaleic anhydride, poly-2
-Acryloyl hydrogen phthalate, poly-2-
Acryloyloxypropyl hydrogen phthalate etc.

Further, a copolymer obtained from at least two kinds of monomers selected from acrylic acid esters, methacrylic acid esters, and styrene derivatives, or having at least one of these monomers and a carboxyl group or a carboxylic anhydride group Examples of the monomer component of the copolymer obtained from the organic acid monomer include polyacrylates, polymethacrylates, polystyrene derivatives, and monomers constituting the organic acid polymer, which are specifically exemplified above. Preferred are mentioned. The preferred weight average molecular weight of these polymers or copolymers is 2,0 in terms of polystyrene.
00 to 80,000, more preferably 5,000 to 4
000, more preferably 7,000 to 15,000.
0.

Further, a copolymer obtained from at least two kinds of monomers selected from these polyacrylic esters, polymethacrylic esters, polystyrene derivatives or acrylic esters, methacrylic esters, and styrene derivatives, or these monomers May be used alone or in combination of two or more. The copolymer obtained from at least one of the above and an organic acid monomer having a carboxyl group or a carboxylic anhydride group may be used. When the organic acid monomer is used as a copolymer component of the copolymer, the amount of the organic acid monomer used is 0.1 to 100 parts by weight of the other monomer components.
10.0 parts by weight is preferred, and more preferably 0.5 to 3.0 parts by weight. When the polymer of the organic acid monomer is used in combination with the alkali-insoluble resin, the ratio of the organic acid polymer to the alkali-insoluble resin is 0.1 to 10% based on 100 parts by weight of the alkali-insoluble resin. 0
Parts by weight are preferred, and more preferably 0.5 to 3.0 parts by weight. The ratio of the amount of these polymers or copolymers (total amount when used in combination) to the novolak resin is usually 1: 100 to 10:10 by weight.
0, preferably 2: 100 to 5: 100.

As the sensitizer containing a quinonediazide group used in the photosensitive resin composition of the present invention, any of conventionally known sensitizers containing a quinonediazide group can be used, and naphthoquinonediazidesulfonic acid chloride and A compound obtained by reacting a quinonediazidesulfonic acid halide such as benzoquinonediazidesulfonic acid chloride with a low molecular weight compound or a high molecular weight compound having a functional group capable of condensation reaction with the acid halide is preferable. Here, examples of the functional group capable of condensing with an acid halide include a hydroxyl group and an amino group, and a hydroxyl group is particularly preferable. Examples of the low molecular weight compound containing a hydroxyl group include hydroquinone, resorcin, 2,4-dihydroxybenzophenone, 2,3,4-trihydroxybenzophenone, 2,4,6-trihydroxybenzophenone, and 2,4,4′-trihydroxy. Benzophenone,
2,3,4,4′-tetrahydroxybenzophenone,
2,2 ', 4,4'-tetrahydroxybenzophenone, 2,2', 3,4,6'-pentahydroxybenzophenone, etc., and as the high molecular compound containing a hydroxyl group, novolak resin, polyhydroxystyrene, etc. Is raised. In the present invention, the photosensitive agent containing a quinonediazide group is used as a resin component in the photosensitive resin composition.
It is used in an amount of 1 to 20 parts by weight based on parts by weight.

Examples of the solvent for dissolving the alkali-soluble resin, alkali-insoluble resin and photosensitizer of the present invention include ethylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether, ethylene glycol monomethyl ether acetate, and ethylene glycol. Ethylene glycol monoalkyl ether acetates such as monoethyl ether acetate; propylene glycol monoalkyl ethers such as propylene glycol monomethyl ether and propylene glycol monoethyl ether; propylene glycol monoalkyl such as propylene glycol monomethyl ether acetate and propylene glycol monoethyl ether acetate Alkyl ether acetates, methyl lactate, lactate Lactates Le, toluene, aromatic hydrocarbons such as xylene, methyl ethyl ketone, 2
-Ketones such as heptanone and cyclohexanone, N, N
Amides such as -dimethylacetamide and N-methylpyrrolidone; lactones such as γ-butyrolactone; These solvents can be used alone or in combination of two or more.

The photosensitive resin composition of the present invention may optionally contain a dye, an adhesion aid, a surfactant and the like. Examples of the dye include methyl violet, crystal violet, and malachite green.Examples of the adhesion aid include alkyl imidazoline, butyric acid, alkyl acid, polyhydroxystyrene, polyvinyl methyl ether, t-butyl novolak, epoxy silane, and epoxy silane. Examples of surfactants include polymers, silanes, and the like. Examples of surfactants include nonionic surfactants such as polyglycols and derivatives thereof, ie, polypropylene glycol or polyoxyethylene lauryl ether, and fluorine-containing surfactants such as Florard (trade name). , Sumitomo 3M), Megafac (trade name, manufactured by Dainippon Ink and Chemicals, Inc.), Sulfuron (trade name, manufactured by Asahi Glass Co., Ltd.), or an organic siloxane surfactant such as KP341 (trade name, Shin-Etsu Chemical Co., Ltd.) Made).

[0022]

EXAMPLES The present invention will be described below with reference to examples, but embodiments of the present invention are not limited to these examples.

Example 1 A mixture of a novolak resin having a weight average molecular weight of 15,000 in terms of polystyrene and a polymethyl methacrylate (PMMA) having a weight average molecular weight of 10,000 in a mixing ratio of 100: 3. 100 parts by weight and 20 parts by weight of an esterified product of 2,3,4,4′-tetrahydroxybenzophenone and 1,2-naphthoquinonediazide-5-sulfonyl chloride are dissolved in propylene glycol monomethyl ether acetate, and In order to prevent radial wrinkles formed on the resist film during coating, so-called striation, 300 ppm of a fluorine-based surfactant, Florard-472 (manufactured by Sumitomo 3M) was further added, and the mixture was stirred. Filter with a filter to prepare the photosensitive resin composition of the present invention did. This composition was spin-coated on a 4-inch silicon wafer and baked on a hot plate at 100 ° C. for 90 seconds to obtain a 1.5 μm-thick resist film. The resist film was exposed to a test pattern having various line widths of 1: 1 line and space width by a Nikon g-line stepper (FX-604F), and 2.38% by weight of tetramethyl hydroxide. Development was carried out with an aqueous ammonium solution at 23 ° C. for 60 seconds. After the development, the film thickness was measured, and the dissolution rate was calculated. Also, 5 μm line and space is 1: 1.
Observation was performed with the exposure energy amount resolved as a sensitivity, and the results in Table 1 were obtained.

Examples 2 to 5, Comparative Examples 1 to 5 The same procedures as in Example 1 were carried out except that the mixing ratio of the novolak resin and PMMA and the amount of the photosensitive substance added were as shown in Table 1, and the results in Table 1 were obtained. I got

[0025]

[Table 1]

Examples 6 to 10 Instead of PMMA, poly (methyl methacrylate-co-polymer having a weight average molecular weight of about 10,000 in terms of polystyrene was used.
-Styrene) [P (MMA-St)] was used in the same manner as in Examples 1 to 5, and the results in Table 2 were obtained.

Comparative Examples 6 to 9 The same procedures as in Example 6 were carried out except that the mixing ratio of the novolak resin and P (MMA-St) and the amount of the photosensitive substance were as shown in Table 2, and the results in Table 2 were obtained. Obtained.

[0028]

[Table 2]

The composition shown in Comparative Example 5 in Table 1 is a conventional standard composition, and the practical sensitivity can be used without any problem up to about 倍 of this.
From the above Tables 1 and 2, by using the photosensitive resin composition of the present invention, it is possible to achieve high sensitivity and / or low cost by reducing the use of the photosensitive material while maintaining high residual film properties. You can see what you can do. In addition, no scum was observed in any of the resist patterns obtained in the respective examples, and the resist pattern had a good shape.

Example 11 A novolak resin having a weight-average molecular weight of 6,000 in terms of polystyrene and a monomer ratio (weight fraction) of methyl methacrylate: n-butyl methacrylate: acrylic acid = 50: 50: 1 100 parts by weight of a mixture having a mixing ratio of 100: 3 with an acrylic copolymer having an average molecular weight of 13,000 in terms of polystyrene, 2, 3, 4, 4 '
Example 1 was repeated except that 19 parts by weight of an ester of tetrahydroxybenzophenone and 1,2-naphthoquinonediazido-5-sulfonyl chloride were used. The alkali dissolution rate of the photosensitive resin composition is 570 °
/ Min, and the sensitivity was 25 mJ / cm ² . Further, no scum was observed in the obtained resist pattern, and the shape of the resist pattern was good.

Example 12 The acrylic copolymer was composed of a monomer ratio (weight fraction) of methyl methacrylate: n-butyl methacrylate: acrylic acid = 70: 30: 1, and had a weight average molecular weight of 13 in terms of polystyrene. Example 11 was repeated except that 2,000 acrylic copolymers were used. The alkali dissolution rate of the photosensitive resin composition was 590 ° / min, and the sensitivity was 20 mJ / cm ² . Further, no scum was observed in the obtained resist pattern, and the shape of the resist pattern was good.

Example 13 The acrylic polymer was composed of a monomer ratio (weight fraction) of methyl methacrylate: n-butyl methacrylate = 70: 30, and had a weight average molecular weight of 1 in terms of polystyrene.
Example 11 was carried out in the same manner as in Example 11, except that 3,000 acrylic copolymers were used. The alkali dissolution rate of the photosensitive resin composition was 550 ° / min, and the sensitivity was 22 mJ.
/ Cm ² . Further, no scum was observed in the obtained resist pattern, and the shape of the resist pattern was good. The results of Examples 11 to 13 are summarized in Table 3 below.

[0033]

[Table 3]

[0034]

As described above, the photosensitive resin composition of the present invention can achieve high sensitivity while maintaining high residual film properties, and the photosensitive resin composition of the present invention ,
Furthermore, it has excellent properties such as good developability and good pattern shape. As described above, the present invention can provide a photosensitive resin composition which can be used even if the amount of the photosensitive agent used is reduced.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H025 AA01 AA04 AA10 AB16 AC01 AD03 BE01 CB10 CB14 CB16 CB29 CB42 CB43 CB52 4J002 BC021 BC022 BC031 BC081 BC111 BG012 BG041 BG042 BG051 BG052 BG061 CB061 BG061 BG081 BG061 BG081 GP03

Claims (5)

[Claims] 1. A photosensitive resin composition comprising an alkali-soluble resin and a sensitizer containing a quinonediazide group,
The amount of the quinonediazide group-containing photosensitive agent is 1 to 20 parts by weight based on 100 parts by weight of the resin component in the photosensitive resin composition, and the photosensitive resin composition is dissolved in 2.38% by weight aqueous solution of tetramethylammonium hydroxide. Speed 500
A photosensitive resin composition characterized by being at most 0 ° / min. 2. A resin composition according to claim 1, wherein the resin component in the photosensitive resin composition comprises a mixture of a novolak resin and at least one selected from polyacrylates, polymethacrylates and polystyrene derivatives. The photosensitive resin composition as described in the above. 3. The resin component in the photosensitive resin composition is a mixture of a novolak resin and a copolymer obtained from at least two monomers selected from acrylates, methacrylates and styrene derivatives. The photosensitive resin composition according to claim 1, wherein: 4. The resin component in the photosensitive resin composition is a novolak resin, at least one selected from polyacrylates, polymethacrylates and polystyrene derivatives, and an organic compound having a carboxyl group or a carboxylic anhydride group. The photosensitive resin composition according to claim 1, comprising a mixture with a polymer of an acid monomer. 5. The resin component in the photosensitive resin composition has a novolak resin, at least one monomer selected from an acrylate, a methacrylate and a styrene derivative, and a carboxyl group or a carboxylic anhydride group. The photosensitive resin composition according to claim 1, comprising a mixture with a copolymer obtained from an organic acid monomer.