TWI267699B - Photo-sensitive compositions - Google Patents

Abstract

The invention relates a photo-sensitive composition made from a photo-resist comprising a resin composition and a photo-sensitive material, wherein said resin compositions comprising a mixture consisting of at least 2 resins having at least 0.03 of the refraction difference, or using an alkali-soluble resin as a resin component of the resin compositions, and the resin additives consisting a resin mixture of acrylic polymers, methacrylic polymer and styrenic polymers, which having a function of inhibiting the solubility of photo-sensitive compositions. The photo-sensitive compositions are preferably having a velocity fro solving in 2.38 by weight of hydroxyl tetra-methyl ammonium being less than 5000 Å/min. By using the said resin compositions, it can obtain a photo-sensitive composition be satisfied with two characteristics of high sensitivity as well as high residue-film property while using a reduced amount of quinonediazide photo-reagents.

Description

1267699 Δ7 Α7 Β7 V. INSTRUCTIONS (1) (Please read the note on the back and fill out this page.) The present invention relates to a photosensitive composition containing a resin composition and a photosensitive material. More specifically, it is related. In a wide range of semiconductor integrated circuit circuits such as LSIs, manufacturing of FPDs, and manufacturing of circuit boards such as thermal needles, photolithography has been used since ancient times for forming or microfabricating fine elements. In the photolithography technique, a positive or negative photosensitive composition containing a resin component and a photosensitive material is used in order to form a photoresist pattern. Among these photosensitive compositions, a composition containing an alkali-soluble resin and a quinone diazo compound as a photosensitive material is widely used as a positive photosensitive composition. The composition is, for example, "_ aldehyde varnish resin / awake azo compound J is disclosed in Japanese Patent Publication No. Sho 54-23570 (U.S. Patent No. 3,666,47, No. 3), Japanese Patent No. Hei 56-30850 (U.S. Patent No. 4,115,128) Various materials are disclosed in many documents, such as the specification, JP-A-55-73045, and JP-A-61-205933. The Ministry of Economic Affairs, the Intellectual Property Office, and the Consumer Cooperatives, print these phenolic varnishes, wax and enamel. The composition of the nitrogen compound has been researched and developed from the novolac resin and the photosensitive material on both sides. Of course, in the case of the novolak resin, a new resin has been developed, but excellent properties can be obtained by improving the physical properties of the conventional resin. For example, Japanese Laid-Open Patent Publication No. Hei 60-97347, No. JP-A No. Hei. Japanese Patent Publication No. 2590342 discloses that a photosensitive composition having excellent characteristics is provided by using a novolac resin which separately removes a low molecular weight component. In addition, the negative photosensitive composition such as the combination of phenolic clear paper scale is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) A7 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 1267699 B7_ V. Invention Description (2) a lacquer resin, an alkoxymethylated melamine as a crosslinking agent, a halogenated triazine as an oxygen generating agent, etc. (Japanese Patent Laid-Open Publication No. Hei 5-303196), etc. Until now, photosensitive compositions having various compositions have been developed. The properties of these photosensitive compositions can be improved, and as a result, most of the photosensitive compositions can be put into practical use. However, the semiconductor element has an increased degree of bulk, requiring half-micron underarm line width in manufacturing. In the case of the above-mentioned conventional technique, the above-mentioned conventional technique cannot be sufficiently used. In addition, the multilayer glass is enlarged in the production of a display surface such as an LCD. With the increase in size of the multi-layered glass substrate, a conventional photosensitive composition is used. When it is used as a photoresist material, there is a problem of squatting. In other words, for example, there is a problem of sensitivity of the photoresist accompanying the increase in size of the multi-layer glass. This is due to the increase in size of the substrate. Since the number of times of pattern exposure of the exposure apparatus is increased, the throughput at the time of manufacture (receiving per unit time) is lowered when the conventional photosensitive composition is used. Therefore, in order to increase the throughput, the photoresist is required to be more highly sensitive. In order to increase the sensitivity of the photoresist, the use of a low molecular weight resin, the addition of a photosensitive substance, the addition of a substance having an increased alkali dissolution rate, and the use of a high sensitivity photosensitive material are used. However, in such methods, By using a low molecular weight resin and reducing the amount of the photosensitive material, the coating property can be improved and the line width uniformity of the photoresist pattern can be improved, but the heat resistance of the photoresist is lowered, and the semiconductor device is manufactured. In the process, the etching resistance is lowered, or the developability is deteriorated to cause problems such as scum (developing scum) or a decrease in the residual film ratio. For example, when the amount of the photosensitive material used is less than the conventionally used amount, 20 parts by weight of the weight is 100 parts by weight, and when the novolac resin is used as the resin, the residual film property is extremely poor, -4-ben. The paper scale applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (please read the notes on the back and fill out this page)

1267699 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed A7 B7_ 5, invention description (3) and does not function as a photoresist. Therefore, the amount of the photosensitive material used is about 25 parts by weight based on 100 parts by weight. In order to solve this problem, there is proposed a technique of using a novolac resin derived from a specific phenolic compound on K as a novolak resin, and a specific molecular weight range thereof (Japanese Unexamined Patent Application Publication No. Hei No. Hei 7-27 No. 024) A novolac resin derived from a compound as a novolak resin, and a polyhydroxy compound having a phenolic hydroxyl group, which is specific to the dispersibility of the resin, is disclosed in Japanese Patent Application Laid-Open No. Hei No. Hei 8-184963. A technique of a photosensitive component of a naphthoquinone diazo sulfonate of a benzamidine and a trihydroxy benzoquinone (Japanese Unexamined Patent Publication No. Hei No. 8-82926). Further, when a conventional photosensitive composition is applied by using a large-sized glass substrate, there is a problem that the in-plane uniformity of the pattern line width cannot be sufficiently obtained due to the increase in the coating spot and the unevenness of the photoresist film. In order to improve the coatability of the photosensitive composition, the type or amount of the surfactant and the added surfactant added to the photosensitive composition have been reviewed until now. In addition, when a solvent for improving the coating property is used, a solvent having an evaporation rate is used (JP-A No. 10,866, 637), and a mixed solvent containing a solvent selected from the group consisting of propylene glycol and dipropylene glycol (JP-A-10-86638) ). However, even with various proposals such as this, it is not possible to sufficiently improve problems such as improvement in sensitivity, residual film property, resolution, reproducibility of patterns, throughput during production, coating properties, and engineering correlation. Therefore, it is strongly desired to fully satisfy the high sensitivity, high residual film property, high resolution, good pattern reproducibility, improved throughput during manufacturing, good coating properties, and low-performance contrast. Adult. In addition, in order to make the photosensitive paper scale applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (please read the notes on the back and then fill out this page) # !_-------Book -- ------- 1267699 A7

Printed by the Consumers' Cooperatives of the Intellectual Property Office of the Ministry of Economic Affairs. V. Inventions (5) and the twilight composition of the photoresist pattern with excellent linewidth uniformity and low engineering relevance. As a result of further intensive studies, the present inventors have found that it is possible to improve the photosensitive composition containing a resin and a photosensitive material by using at least two resins having different tortuosity differences of 0.03 M as the wax. The effect of the photosensitive material, and the use amount of the light-emitting substance can be reduced, and the resin having the function of the dissolution inhibitor is further contained in the photosensitive composition containing the alkali-soluble wax and the roller-azo sensitizer When the amount of the photosensitive material added is reduced, the amount of the residual film is not lowered and a good photoresist pattern can be formed, and the present invention has been completed. In other words, the first invention is a photosensitive composition comprising a photosensitive composition composed of a resin composition and a photosensitive material, characterized in that the resin composition is different from the twist ratio of the two types of enamel. The resin is formed, and the difference in the tortuosity of these resins is at least 0,03. Further, the second invention relates to a calendering composition which is a photosensitive composition containing a resin composition and a photosensitive material, characterized in that the resin composition is at least composed of (a) an alkali-soluble resin. A resin component and (b) a dendritic additive made of a resin having a function of dissolving an inhibitor, and the photosensitive material is a U) photo-sensitive substance having a quinone nitrogen group. The invention is illustrated in detail below. In the first invention, the photosensitive composition is such that at least one set of mutually different tortuosity difference (??) is 0.03K. At this time, depending on the kind or the number of resins to be used, there is no particular limitation in the present invention. The paper scales used in the resin compositions of these photosensitive compositions are different according to the Chinese National Standard (CNS) A4 specification (210 X 297 mm). — — — — — — — — — — II 111 II—II 1 (Please read the notes on the back and fill out this page) 1267699 A7 __B7__ V. INSTRUCTIONS (6) One of the resins, that is, the resin component, the alkali-soluble wax is preferred. When an alkali-soluble resin is used as the resin component of the resin composition, the resin composition of the present invention is characterized in that (a) a resin component composed of an alkali-soluble resin and (b) a resin having a resin composition with the resin component have a tortuosity 夔树脂3K is made of a resin additive made of resin. Further, in the first invention, a novolac resin is used as the alkali-soluble tree. In the resin composition used in the photosensitive composition of the first invention, at least one of the cells having a tortuosity difference (Δη) of 〇·〇3 or more can be used to improve the effect of the photosensitive material, and as a result, the photosensitive property can be reduced. In addition, the amount of the substance to be used can be increased by the high sensitivity of the photosensitive composition, and the photosensitive composition can be used as a resin component, for example, using a bismuth azo sensitizer. In the case of a photosensitive material, when the amount of the photosensitive material added is less than conventionally, it depends on the resin used as the resin additive, and the residual film property of the photosensitive composition is lowered. At this time, when the resin additive has a function as a dissolution inhibitor for the photosensitive composition, the residual film property may be lowered. In this case, when only a novolac resin having an alkali-soluble resin is used as a conventional photosensitive composition of a resin component in a photosensitive composition, a photosensitive sister-to-base is used (please read the back of the back sheet and fill out this page) « 0 emMm «ϋ ϋ 1 §1 11 ϋ-,· ϋ i^i 1_ _1 ϋ i^i I . The Ministry of Economic Affairs, the Intellectual Property Bureau, the staff consumption cooperative, the amount of printing, so that the low-plant tree hangs less paint, less grading, etc. Sexual addition of this film of fatty aldehydes to make the level of residual phenols by the amount of weight, for the weight of the nature of the quality, such as with the physical lipids of the lipid film tree with the tree light residual paint as a high-definition It can be used to hold the aldehyde load, that is, the memory of the phenol, which can be -8, and the quality of the product is still suppressed, and when the solution is slow, the light is dissolved, such as the amount of dissolved fat. With the addition of paint and the addition of clear liquid, and the aldehyde is like the high phenol, it is suitable for the Chinese National Standard (CNS) A4 specification (210 X 297 mm) A7 1267699 B7__ According to the photosensitive material of the invention (7), the sensitivity can be improved, the residual film property can be prevented from being lowered, and high sensitivity can be achieved. • I ^1 ϋ 1 ϋ ϋ I .1. ϋ ϋ ϋ ϋ I . ϋ ϋ I ϋ I (please read the phonetic on the back first? Then fill out this page) So use the second resin additive with dissolution inhibitor function In the invention, since the sensitivity is increased by reducing the amount of the photosensitive material added by K, the resin of the resin additive does not need to use a resin having a tortuosity of at least 〇·〇3Μ. Further, when the difference between the tortuosity of the resin additive and the tortuosity of the resin component is at least 0.03 M, the sensitivity of the photosensitive material can be improved, and the addition amount of the photosensitive material can be preferably reduced. result. Therefore, in the second invention, it is preferable that the resin tortuosity of the resin additive and the tortuosity difference K of the bismuth-soluble resin are at least 0.03 M. Further, in the present invention, the "tree meal having a function of a dissolution inhibitor" refers to a dissolution rate of a photosensitive composition film of an unexposed portion to a developing liquid when simultaneously added to a resin of a resin component in a photosensitive composition. A resin that is more inhibited than when it is not added. When the resin having the function of dissolving and suppressing agent is added to the photosensitive composition, the dissolution rate of the photosensitive composition after the addition of yttrium to 2.38 g of the aqueous solution of tetramethylammonium hydroxide is 5000 Å/min. Preferably. Further, each of the resins used in the photosensitive composition of the present invention must be soluble in the same solvent even if it has poor solubility. In addition, the use of two kinds of resins with different tortuosity rates can improve the effect of photosensitive substances in photosensitive compositions, although it is not very clear. The following. Moreover, the invention is not limited by these. In other words, in the present invention, a photosensitive composition containing two kinds of resins having different tortuosity on the enamel is coated, and a photoresist film is formed. The inventors confirmed -9 - the paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 1267699

V. INSTRUCTIONS (8) (Please read the precautions on the back and fill out this page.) Even if you make two kinds of solutions with different tortuosity on the top of the tree, dissolve the solution in the solvent to form a film. The non-uniform structure makes it cause light scattering by light irradiation. The regulation can also be confirmed by irradiating the tree with the laser light. For example, when the laser light is irradiated to each of the single constituent solutions of the furfural varnish resin or the polymethacrylic acid, the laser light has no light scattering, but the polymethyl methacrylate is different from the nodule of the novolak resin. When the laser light was irradiated with the resin solution of the furfural varnish resin, it was confirmed that light scattering occurred from the incident portion. In the solvent, two kinds of solutions of the ruthenium which have different tortuosity are dissolved, and the film is formed by coating to have a fine heterogeneous structure, because the solubility of each resin to the solvent is poor. In other words, after the coating of the resin solution, the solvent evaporates from the coating film during baking, and at this time, the wax having a small solubility is crystallized into a solid, and then the tree having a large solubility is crystallized, and the capsule is finely formed. Uniformly constructed to cause light scattering phenomena. The Ministry of Economic Affairs, the Intellectual Property Office, and the Employees' Cooperatives Co., Ltd. printed the film formed by the photosensitive composition of the two types of resin on the K-deficient rate, and used the above-mentioned factors to scatter the light in the thin The inch phenomenon and the light of the incident light film are repeatedly scattered, and the light path length is much longer and the utilization efficiency of the light is further improved than when the light is incident on the film formed using the photosensitive composition having no light scattering phenomenon. The photosensitive composition of the present invention causes the incident light to be light-scattering effect by the light scattering effect by causing loss of the photosensitive tree smear film by reflection of the illuminating light and the effect of utilizing the illuminating light. The propagation distance length M makes the utilization effect of the irradiation light extremely high, and the effect on the photosensitive material is greatly improved, and the sensitivity is improved. -10- This paper scale applies to China National Standard (CNS) A4 specification (210 X 297 mm) Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 1267699 A7 _B7 _ V. Invention description (9) More details in the following The resin component, the resin additive, and other components of the photosensitive composition of the present invention will be described. (Resin component) The resin component of the resin component of the resin composition of the photosensitive resin component of the present invention can be used as a resin component in a conventional photosensitive composition. The resin component used in the conventional photosensitive resin composition is preferably a resin component of the present invention. The alkali-soluble resin to be used in the photosensitive composition of the present invention is not particularly limited as long as it is a bismuth-soluble resin used in a conventional photosensitive composition, and a novolac resin is preferred. The preferred novolak resin of the present invention can be obtained by subjecting various phenols, or a plurality of such mixtures, to polycondensation by at least one aldehyde such as formalin. Examples of the benzoquinone used in the production of the novolak resin include phenol, p-cresol, m-cresol, o-cresol, 2,3-dimethylphenol, 2,4-dimethylphenol, 2,5-dimethylphenol, 2,6-dimethylphenol, 3,4-dimethylphenol, 3,5-dimethylphenol, 3,4,5-trimethylbenzene, 2, 4,5-trimethylphenol, methylene bisphenol, methylenebis-p-cresol, resorcinol, catechol, 2-methyl stilbene, 4-methyl stupid Phenol, o-chlorophenol, m-chlorophenol, p-chlorophenol, 2,3-dichlorophenol, m-methoxyphenol, p-methoxyphenol, o-methoxyphenol, p-butoxy Phenol, o-ethylphenol, m-ethylphenol, p-ethylphenol, 2,3-diethylphenol, 2,5-diethylphenol, p-isopropylphenol alpha-cabinol,泠-萦phenol, etc., these can be mixed alone or in two kinds of -11-11- This paper scale is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) (Please read the notes on the back and fill out this page. )

Ministry of Economic Affairs, Intellectual Property Office, Staff Consumer Cooperatives, Printing 1267699 A7 ^_B7___ 13 V. Inventions (), at least one monomer selected from the above acrylate, methacrylate or styrene derivatives and at least one selected The monomer of the monomer of the above organic acid monomer is obtained by copolymerization of a monomer by a general method. The acrylic copolymer in the copolymer is a monomer selected from the group consisting of a top acrylate and a methacrylate, and at least one organic acid monomer 2k7 copolymer selected from the above organic acid monomers, and two kinds thereof. a copolymer selected from the group consisting of the above acrylate and methacrylate monomers and at least one organic acid monomer selected from the group consisting of the above organic acid monomers, and further, at least one selected from the group consisting of methyl methacrylate and More preferably, the methacrylate other than methyl acrylate is copolymerized with at least one selected from the group consisting of acrylic acid and methacrylic acid. Further, at least one copolymer selected from the group consisting of a monomer of an acrylate, a methacrylate, a styrene derivative, and an organic acid monomer having a carboxyl group or a carboxylic anhydride group, a polyacrylate resin, a polymethyl group When the acid value of the acrylate bar resin or the polystyrene resin is from 1 to 80 mg K0H/g, a photosensitive composition having good coatability can be obtained. By using a resin having an acid value of 1 to SOmgKOH/g as a resin additive, the engineering correlation of the photoresist pattern is small and excellent line width uniformity can be obtained. The acid value of the polyacrylate resin, the polymethacrylate resin or the polystyrene resin is preferably 2 to 30 gK0H/g. When the organic acid monomer is used as the copolymerization component of the copolymer, the amount of the organic acid monomer used is preferably from 0.10 to 10.0 parts by weight, more preferably from 0.5 to 3.0, based on 100 parts by weight of the other monomer component. In addition, the copolymer containing the decanoic acid component is applied to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) by the above-mentioned copolymerization -15- paper scale (please read the precautions on the back side and fill in the form) page)

Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 1267699 A7 __B7___ 15 V. Invention description () The tortuosity is 1. 50~1. 60: Polyhexyl methacrylate, polymethyl methacrylate, polymethyl Phenyl acrylate, polyphenyl phenyl methacrylate, poly(2-phenylethyl methacrylate), poly(methyl methacrylate), poly(benzyl acrylate), 2-chloroethyl acrylate, polyphenylene Vinyl carrate, polyvinyl phenyl acetate, polyvinyl acetate polyvinyl acetate, polyacrylonitrile, poly-methyl methacrylonitrile, polymethyl ex-chlorinated acrylate, poly-p-fluorostyrene, poly-ortho, p-Difluorostyrene, poly-p-isopropylstyrene, polystyrene, polyphenylene methyl methacrylate, and the like. The tortuosity is greater than 1.6. Polystyrene phenyl α-bromo ester, polymethacrylic acid # brewed, polyethylene phthalimide benzoic acid imide, poly-o-chlorostyrene, polychloromethacrylic acid pentachloro alum, and the like. These resins are used as a resin additive together with a novolac resin, and are used for the manufacture of polymethyl methacrylate, polyethyl methacrylate, poly-n-propyl methacrylate, poly-n-butyl methacrylate, polymethyl N-hexyl acrylate, polyisopropyl methacrylate, polybutyl isobutyl methacrylate, polybutyl methacrylate 3-butyl ester, poly(diphenyl methacrylate), polypentachlorophenyl methacrylate, etc. A copolymer obtained by using a polymer of a methacrylate ruthenium polymer, a polystyrene-based styrene derivative, or at least one monomer used in the polymer as a copolymerization component is more preferable. Further, the ratio of the resin additive to the resin component differs depending on the resin of the resin component to be used and the resin type of the resin additive, and therefore it is generally difficult to specify a preferable range, for example, alkali soluble -17 - This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) (please read the note on the back and fill out this page) ί ϋ ϋ «ϋ n 11 ·ϋ 一 I ϋ mM — n emmf \ Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed 1267699 ' A7 —---一 - ~ "~一*~ ' V. Invention description () polyitaconic acid, polymaleic anhydride, poly-2-propene fluorenyl A copolymer prepared by using a hydroquinone ester, a poly-2-propenyloxypropyl hydrobenzoate, and a monomer used in the polymers as a monomer component. Further, in the photosensitive composition of the photosensitive composition of the present invention, the peak value of the peak value of 7.2 to 5·6ρρκ of the light propylene resin solution of the bismuth resin composition is 117, and the peak integral value of 1.3, 1.3 to 〇.95 ppm. For Β, the value of Β/Α is preferably from 0.01 to 0.13. In the present invention, the peak integration value of the photosensitive material of the 1 HMR spectrum of the resin composition of the present invention is A, Μ and the peak integration value of 1.3 to 0.95 ppm is 自, The peak value of the peaks A and B of each spectral range was determined by the HMR spectrum of the resin composition measured by the method described below, and X = B/A was calculated using this value. In other words, the alkali-soluble resin is first dissolved in propylene glycol ether ethyl acetate. The solution is applied to the substrate by a spin coating method to form a film. The H MR spectrometry sample was prepared by dissolving the film in heavy acetone, and the sample was subjected to 1 H-NMR spectrum measurement, and the peak integral value of 7, 2 to 5.6 Ppm was calculated from the obtained chart, and the C was removed. The peak integral value of 1.3 to 0.95 ppm of B was calculated from the solvent of the second fermentation monomethyl ether acetate, and the value X of B/A was calculated. (Photosensitive material) As the photosensitive material used for the photosensitive material of the present invention, a photosensitive material composed of a conventional resin component and a photosensitive material can be used as the photosensitive material. The alkali-soluble resin is used as the resin group in the photosensitive material of the present invention. -19- The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (please read the back note and fill out this page)

Ministry of Economic Affairs Intellectual Property Office Staff Consumer Cooperative Printed 1267699 A7 __B7___ 20 V. Inventive Note () The base shown, R8 is H, Ci~C4 alkyl, Ci~C4 alkoxy or cyclohexyl, m and η Each of 0, 1 or 2, a, b, c, d, e, f, g and h are integers satisfying 0 or 1 to 5 of a + bS5, c + dS5, e + fS5, g + hS5, I system is 0, 1 or 2) a low molecular compound having a phenolic hydroxyl group as shown in the above general formula (I), and is usually used as a dissolution promoter in the photosensitive composition of the present invention to adjust the dissolution rate of the photosensitive composition. Or used to improve the sensitivity or adjust the sensitivity of the photosensitive composition. a low molecular compound having a phenolic hydroxyl group as shown in the above general formula (I), for example, o-toluene, m-toluene, p-toluene, 2,4-resorcinol, 2.5-resorcinol, 2,6 - resorcinol, bisphenol & 6, 6, (:, 0, £, ? and G, 4, 4', 4"-methine phenol, 2,6-bis[(2-hydroxy-5) -methylphenyl)methyl]-4-methylphenol, 4,4'-[1-[4-[1-(4-hydroxyphenyl)-1-methylethyl]phenyl] Bisphenol, 4,4,4"-ethylidene phenol, 4-[bis(4-hydroxyphenyl)methyl]-2-ethoxyphenol, 4,4~[(2-hydroxybenzene) Methylene] bis[2,3-dimethylphenol], 4,4'-[(3-hydroxyphenyl)methylene]bis[2,6-dimethylphenol], 4,4 [U-hydroxyphenyl)phenylene]bis[2,6-dimethylphenol], 2,2'-[(2-hydroxyphenyl)methylene]bis[3,5-dimethyl Phenol], 2,2f-[(4-hydroxyphenyl)methylene]bis[3,5-dimethylphenol], 4,4'-[(3·4-dihydroxyphenyl)methylene Bis[2,3,6-trimethylphenol], 4-[bis(3-cyclohexyl-4-hydroxy-6-methylphenyl)methyl]-1,2-benzenediol, 4.6- Bis[(3,5-dimethyl-4-hydroxyphenyl)methyl]-1,2,3- Phenol, 4,4f-[(2-hydroxyphenyl)methylene]bis[3-methylphenol], 4,4, -22- This paper scale applies to China National Standard (CNS) A4 specification (210 X 297 mm) -^1 ϋ 1 1 ·ϋ 1 ϋ ϋ-i I 1_§ _1_1 mMM& 0 —emm —ϋ I ·1- ϋ 11 11-,· a-^i mmmmt mmm§ ϋ emmg ϋ i · — I _ words (please read the notes on the back and then fill out this page) Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed 1267699 A7 __B7___ 21 V. Invention description () 4"-(3_methyl-1-propene Alkyl-3-alkenylene) phenol, 4,4,4", 4 "-(1,4-phenylene secondary methyl)nonylphenol, 2,4,6' ginseng" (3, 5-dimethyl-4-hydroxyphenyl)methyl"-1,3-benzenediol, 2,4,6-para"(3,5-dimethyl-2-hydroxyphenyl)methyl" -1,3-Benzenediol, 4,4'-[1-[4-[1-[4-hydroxy-3,5-bis[(hydroxy-3-methylphenyl)methyl]phenyl] 1-methylethyl]phenyl]ethenyl]bis[2,6-bis(hydroxy-3-methylphenyl)methyl]phenol. The low molecular weight compound having a phenolic hydroxyl group is usually 1 to 20 parts by weight, preferably 3 to 15 parts by weight, per part by weight of the novolak resin. Further, the photosensitive composition of the present invention may be blended with a dye, an adhesion aid, a surfactant, or the like as needed. The dyes are, for example, methyl violet, crystal violet, malachite green, etc., and the binder ribs are, for example, alkyl imidazolines, butyric acid, alkanoic acids, polyhydroxystyrenes, polyvinyl methyl ethers, tert-butylphenols, rings. Oxidane, epoxy polymer, decane, etc., surfactants such as nonionic surfactants, such as polyalcohols and derivatives thereof, ie, polypropylene glycol or polyethylene oxide lauryl ether, fluorine-containing interfacial activity Agents such as Froyton (transliteration) (trade name, Sumitomo 3M), Mekkafak (trade name, manufactured by Dainippon Ink Chemical Industry Co., Ltd.), Shrunf (transliteration) (trade name, Asahi Glass) Co., Ltd.) or an organopolyoxane surfactant, such as KP341 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.). (Solvent) A solvent which dissolves the resin component of the resin composition contained in the photosensitive composition of the present invention, a resin additive, a photosensitive material, and other additives, and the like, for example, ethylene glycol monomethyl ether or ethylene glycol monoethyl ether Etc. Ethanol -23- This paper scale applies to China National Standard (CNS) A4 specification (210 X 297 mm) (please read the notes on the back and fill out this page)

1267699 Α7 Β7 V. Description of invention (A) Ethylene glycol monoalkyl ether acetates such as alkyl ethers, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether, propylene glycol single a propylene glycol monoalkyl ether acetate such as propylene glycol monoalkyl ether, propylene glycol monomethyl ether acetate or propylene glycol monoethyl ether acetate, lactic acid such as methyl lactate or ethyl lactate, toluene, xylene, etc. Groups of ketones such as carbon argon, methyl ketone, 2-glyoxime, cyclohexanone, phthalamides such as H,N-dimethylvinylamine, N-methylpyrrolidone, and 7-butyrolactone Esters. These solvents may be used alone or in combination of two or more. Further, in the present invention, the dissolution rate of the photosensitive composition in an aqueous solution of 2.38 parts by weight of tetramethylammonium hydroxide is calculated by the following measurement. (Measurement and Calculation Method of Dissolution Rate of Photosensitive Composition) A solvent solution of a resin of a photosensitive composition or a resin additive is spin-coated on a tantalum wafer, and baked at 10 ° C under a hot plate. After 0 seconds, a photoresist film of about 1.5 μm thick was formed. The film thickness di (re) of the photoresist at this time was measured, and a test of various line widths of a line width and a space width of 1:1 on the photoresist film by the K-line splitting exposure device (FX-60 4F) After the pattern was exposed, M2, 38% by weight aqueous solution of tetramethylammonium hydroxide was developed at 23 ° C for 60 seconds. After the development, the film thickness d 2 ( λ ) of the photoresist was measured again, and the film thickness difference (di ) before and after the Μ image was taken as the dissolution rate (λ / min) of the photosensitive composition. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a resin composition using a novolak resin: acrylic polymer = 1 〇〇: 1 混合 mixed resin film as a sample for the determination of bismuth - This paper scale applies to Chinese national standards (CNS) Α4 size (210X 297 mm) (Please read the note on the back and fill out this page), 1Τ

Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 1267699 A7 ___B7___ 23 V. Description of invention () 1 H-NMR spectrum. Fig. 2 is a photoresist film formed by using a photosensitive film made of a resin composition composed of a novolak resin: acrylic polymer = 1 〇〇: 10 as a resin composition as a sample. 1 H-NMR spectrum of the composition. BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in more detail in the following Examples, Comparative Examples, and Synthesis Examples, but the form of the present invention is not limited by the examples. Further, the descriptions of "molecular weight" or "weight average molecular weight" in the following examples are all polystyrene-equivalent weight average molecular weight unless otherwise specified. (Synthesis Example) Synthesis Example 1 900 g of propylene glycol monomethyl ether acetate, 189 g of methyl methacrylate, and 81 g of methacrylic acid were placed in a four-necked flask equipped with a stirrer, a cooling tube, a thermometer, and a nitrogen introduction tube. 3-butyl ester, 30 g of acrylic acid, 6 g of azobisdimethylvaleronitrile, 4.5 g of azobismethylbutyronitrile, and blowing nitrogen gas and heating K, and polymerizing at 853⁄4 for 8 hours to obtain a weight average molecular weight of 15,000. Acrylic acid copolymer having an acid value of 80 mg KOH/g. Synthesis Example 2 In a 2000 ml four-necked flask equipped with a stirrer, a cooling tube, a thermometer, and a nitrogen introduction tube, 900 g of propylene glycol monomethyl ether acetate, 207.9 g of methyl methacrylate, and 89. lg of methacrylic acid were added. Butyl ester, 3 g of acrylic acid, 6 g of azobisdimethylvaleronitrile, 4.5 g of azobismethylbutyronitrile, and blowing nitrogen gas to raise the temperature, and polymerizing at 853⁄4 for 8 hours to obtain a weight of -25- The paper scale applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (please read the notes on the back and fill out this page)

Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 1267699 A7 __B7___ V. Invention description () Acrylic acid copolymer with a molecular weight of 13,000 and an acid value of 8 mg K0H/g. Synthesis Example 3 900 g of propylene glycol monomethyl ether acetate, 207.9 g of methyl methacrylate, and 89. g of n-butyl methacrylate were placed in a 2000 ml four-necked flask equipped with a stirrer, a cooling tube, a thermometer, and a nitrogen introduction tube. 3 g of acrylic acid, 6 g of azobisdimethylvaleronitrile, 4.5 g of azobismethylbutyronitrile, and blowing nitrogen gas to raise the temperature, and polymerizing at 85 Torr for 8 hours to obtain a weight average molecular weight of 13,000 and an acid value. 8 mg K0H / g of acrylic copolymer. Synthesis Example 4 900 g of propylene glycol monomethyl ether acetate, 207.9 g of methyl methacrylate, and 89.11 g of cyclohexyl methacrylate were placed in a four-necked flask equipped with a stirrer, a cooling tube, a thermometer, and a nitrogen introduction tube at 2000 π1. 30 g of acrylic acid, 6 g of azobisdimethylvaleronitrile, 4.5 g of azobismethylbutyronitrile, and blowing nitrogen gas and heating, and polymerizing at 85 Torr for 8 hours to obtain a weight average molecular weight of 12,000 and an acid value of 80 mg K0H/ g of acrylic copolymer. Synthesis Example 5 900 g of propylene glycol monomethyl ether acetate, 210 g of methyl methacrylate, and 90 g of 3-butyl methacrylate were placed in a 2000 ml four-necked flask equipped with a stirrer, a cooling tube, a thermometer, and a nitrogen introduction tube. 0.3 g of acrylic acid, 6 g of azobisdimethylvaleronitrile, 4.5 g of azobismethylbutyronitrile, and blowing nitrogen gas to raise the temperature, and polymerizing at 85 TC for 8 hours to obtain a weight average molecular weight of 13,000 and an acid value. LmgKOH/g of acrylic acid copolymer. Synthesis Example 6 In 2000rol, there is a mixer, cooling tube, thermometer, and nitrogen gas. -26- This paper scale is applicable to China National Standard (CNS) A4 specification (210 X 297 mm). (Please read the back note and fill out this page. )

1267699 A7 B7 2 5 V. INSTRUCTIONS () In a four-necked flask, put 900 g of propylene glycol methyl ether acetate, 21 g of methyl methacrylate, 9 flg of dibutyl methacrylate, and 6 g of azo. Dimethyl valeronitrile, 4.5 g azobismethylbutyronitrile, and nitrogen gas was blown and warmed, and polymerized at 85.0 for 8 hours to obtain acrylic acid having a weight average molecular weight of 13,000 and an acid value of 0.3 mgKOH/g. Copolymer. (Examples and Comparative Examples) Example 1 To 100 parts by weight of a novolak resin (15% by weight of 436 n ffl, 15 parts by weight of 2, 3, 4, 4'-tetrahydroxy 2 as a photosensitive substance was added. The difference between the esterification ratio of the esterified product and the novolac resin reacted with 1,2 -lai-diazo-5-sulfochloride and the novolac resin is 5 parts by weight or more and the difference is 〇·〇3 or more. Polymethyl methacrylate (PMMA, 436 nm tortuosity 1.48) of a resin having a dissolution inhibitor function, and dissolved in propylene glycol monomethyl ether acetate to prevent spin coating from being applied to the photoresist film It has a radial fold, that is, a vein pattern. It is also added with 300PP® Fluoride Barrier Surfactant, Fluoride-472 (manufactured by Sumitomo 3M Co., Ltd.), and then filtered with a filter of 0·2#βι厚The photosensitive composition of the present invention is prepared, and the composition is spin-coated on a silicon wafer at 4 ° C, and baked at 1 ° C for 90 seconds on a hot plate to obtain a thickness of 1.5 Å. Photoresist film. GGA company's g-line exposure stepper on the photoresist film (DSW64fl (〇, line and space width 1:1 various line width sample diagram) The film was exposed to 2.20% by weight aqueous solution of hydrochlorotetramethylammonium and under 6 hrs for 6 Gsec. After the development, the film thickness was measured, and the residual film ratio was measured by the following formula: Residual film rate = [(film thickness before development - Film thickness after development) / film thickness before development] X 100 Moreover, it is observed that the line of 5 >uni and the width of 1:1 are the resolution and exposure energy. Lack of tiredness a _ This paper scale applies to China National Standard (CNS) A4 specification (210 X 297 mm) (Please read the notes on the back and fill out this page) Order --------, · Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed 1267699 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed Α7 Β7 ζπ ^ 2 6 1. Invention description () Real _ Example 2, 3, Comparative Example 1 except for 100 parts by weight of novolak resin The amount of PMMA added was as shown in Table 1, and was carried out in the same manner as in Example 1. The results of Table 1 were obtained. Example 4 Addition of 10 parts by weight of polymethyl methacrylate to 100 parts by weight of the novolak resin The ester (PnBMA, 436nff, tortuosity 1.47) was used in the same manner as in Example 1 except that PMMA was used. The results of Table 1 were obtained. Example 5 The results of Table 1 were obtained in the same manner as in Example 1 except that 5 parts by weight of PMMA and PnBMA were added in place of PMMA in each 100 parts by weight of the novolak resin. Example 6 In addition to 100 parts by weight of phenolic aldehyde The varnish resin was added in the same manner as in Example 1 except that 10 parts by weight of poly(methacrylic acid-co-n-butyl methacrylate (P(MMA-nBMA), a tortuous ratio of 436 nm of 1.48) was added instead of PMMA. The results of Table 1 are obtained. Example 7 Except that 10 parts by weight of poly(methacrylic acid-co-styrene) (P(MMA-St), a tortuous ratio of 436 nm of 1.52) was added to 100 parts by weight of the novolak resin in place of PMMA, and Examples 1 is carried out in the same manner, and the results of Table 1 are obtained. Example 8 In addition to 10 parts by weight of 100 parts by weight of novolac resin, 10 parts by weight of polystyrylmethacrylate (PDPMMA, 436 nro tortuosity 1.59) was added -2 8 - This paper scale applies to Chinese National Standard (CNS) A4 size (210 X 297 mm) (Please read the note on the back and fill out this page)

1267699 A7 _____B7 27 V. Inventive Note () The results of Table 1 were obtained in the same manner as in Example 1 except that PMMA was used. Example 9 The same procedure as in Example 1 was carried out except that 10 parts by weight of polypentachlorophenyl methacrylate (PPCPMA, a tortuous ratio of 436 nm) was added to 100 parts by weight of the novolac resin, and the same procedure as in Example 1 was carried out. The results of Table 1. Comparative Example 1 The results of Table 1 were obtained in the same manner as in Example 1 except that PMMA was not used. (Please read the notes on the back and fill out this page) 参--------Book _| Ministry of Economic Affairs Intellectual Property Bureau Employees Consumption Cooperative Print -29- This paper scale applies to China National Standard (CNS) A4 specifications (210 X 297 mm) 1267699 A7 B7 28 V. Description of invention (1) Table 1 Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed resin additive added to novolac resin Addition of resin additive to 100 parts by weight of novolak resin Amount (parts by weight) Residual film rate (3⁄4) Sensitivity (ittJ/cm 2 ) Example 1 PMMA 5 100 30 Example 2 PMMA 10 100 25 Example 3 PMMA 15 100 35 Example 4 PnBHA 10 100 26 Example 5 PHHA /PnBMA 5/5 100 25 Example 6 P(MMA-nBHA) 10 100 25 Example 7 P(MMA-St) 10 100 21 Example 8 PDPMMA 10 100 29 Example 9 PPCPMA 10 100 30 Comparative Example 1 - 0 100 50 a 30- (Please read the notes on the back and fill out this page)

This paper scale is applicable to China National Standard (CNS) A4 specification (210 X 297 mm). 1267699 A7 ___B7_ 2 9 V. Inventive Note () Moreover, the photoresist samples obtained by Examples 1 to 9 have no scum. And the pattern is good. Example 1 The photosensitive composition prepared in Example 1 was spin-coated on a glass substrate, and baked at 1000 ° C for 90 seconds on a hot plate to obtain a 1·2 #ιο厚. The photoresist film of the photoresist film was measured by the UV-visible spectrophotometer (Cary4E) manufactured by Barry (Corporation) Co., Ltd., and the g-line exposure stepper (DSW6400) of the GCA company was used. After the energy of J/c®2 is exposed, the visible spectrum of the ultraviolet light is measured, and the absorbance of the photosensitive material is determined from the change of the absorbance before and after the exposure of the g-line wavelength of 4 3 6 11 . The results obtained are shown in Table 2. Degree of decomposition = [(absorbance before exposure - absorbance after exposure) / absorbance before exposure] X 1 〇〇 Example 1 1 , 1 2, Comparative Example 2 Except for the novolak resin, the amount of PMM A added is as follows Except as shown in Fig. 2, the results of Table 2 were obtained in the same manner as in Example 10. Table 2 (Please read the notes on the back and fill out this page) Order --------- Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed PMMA Addition for 100 Heavy Dong Novolac Resin (Weight Parts) Decomposition rate of the luminescent substance (X © 43611 ·) Example 10 5 48 Example 11 10 51 Example 12 15 46 Comparative Example 2 0 39 -si- This paper scale applies to the Chinese National Standard (CNS) A4 specification ( 210 X 297 mm) 1267699 Ministry of Economic Affairs Intellectual Property Office Staff Consumer Cooperative Printed A7 B7___ 30 V. Inventive Note () As can be seen from the above Examples 1 to 12 and Comparative Examples 1 to 2, at least two tortuosity rates are used. A resin having a resin composition of 0.03 Å as a resin composition used for the photosensitive composition can provide a photosensitive composition excellent in developability and residual film properties. Further, it is understood that the improvement in sensitivity is a cause of an increase in the decomposition rate of the photosensitive material, that is, an effect of the action of the photosensitive material. Example 13 15 parts by weight of 2,3,4,4'-tetrahydroxydiphenyl- and 1,2-nonanol diazo-5 were added to 100 parts by weight of a novolak resin having a weight average molecular weight of 15,000. - an esterified product of a sulfochloride, and 4.0 parts by weight of a 3-butyl polymethylglycolate having a weight average molecular weight of 18,000, and dissolved in propylene glycol monomethyl ether acetate to prevent spin coating On the photoresist film, it can be radially folded, that is, veined. Add 300pp® fluorine surfactant, Fluoride-472 (manufactured by Sumitomo 3Μ Co., Ltd.) and stir it. The photoreceptor composition of the present invention was prepared by filtration through a filter of 2 w ίο. The sensitivity and coatability of the composition were measured as follows. The results are shown in Table 3. (Sensitivity) This photosensitive composition was spin-coated on a 4 Å wafer, and baked on a hot plate at 100 1 Torr for 90 seconds to obtain a 1.5 Å/1 Å thick photoresist film. On the photoresist film, Ricoh's g-line exposure stepper (FX-604), line width and space width of 1:1 various line width sample patterns were exposed, M2.38 wt% aqueous solution of tetrahydroammonium hydroxide, 233⁄4 The next image is 60 seconds. Observe the line of Κ5μιπ and the resolution of 1:1 and the exposure energy as the twist. (Coating property) -32- This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) (please read the notes on the back and fill in this page) * Order -------- 1267699 Α7 Β7 31 5. Inventive Note () The photosensitive composition is spin-coated on a glass substrate (360 nmX 465mffl) with a chrome film, and baked at 0 0 t; on a hot plate for 90 seconds. Thereafter, a 1.5^11 thick photoresist film was obtained. Then, the in-plane 600-point film thickness measurement was performed, and the maximum in-plane film thickness difference (7) and standard deviation (δ) were measured, and the coating property (film thickness uniformity) was confirmed. Example 1 4 The esterified product of the 2,3,4,4^tetrahydroxydiphenylene surface and the 1,2-naphthalene diazo-5-sulfochloride was 20 parts by weight. Example 13 The photosensitive composition was prepared in the same manner. The sensitivity and coatability of the photosensitive composition were carried out in the same manner as in Example 13. The results are shown in Table 3. Comparative Example 3 Except that the esterified product of 2,3,4,41-tetrahydroxydibenzoate and 1,2-naphthoquinonediazo-5-sulfochloride was 25 parts by weight, and Examples 13 The photosensitive composition is prepared in the same manner. The sensitivity and coatability of the photosensitive composition were carried out in the same manner as in Example 13. The results are shown in Table 3. Table 3 (Please read the notes on the back and fill out this page) ------——Ministry of Intellectual Property Intelligence Bureau Employees Consumption Cooperative Printing Sensitivity (mJ/cin 2) Coating 7 (A) δ ( A) Example 13 40 355 50 Example U 80 490 80 Comparative Example 3 80 620 100 -33- This paper scale applies to China National Standard (CNS) A4 specification (210 X 297 mm) Ministry of Economic Affairs Intellectual Property Bureau Staff Consumption Cooperative Printed clothing 1267699 A7 __B7___ 32 V. DESCRIPTION OF THE INVENTION () The residual film ratios of the photosensitive compositions of the above Examples 13 and 14 and Comparative Example 3 were 94.0, 99.0, and 93·5 Κ. As a result of the results of Examples 13 and 14 and Comparative Example 3, it is understood that the photosensitive composition of the present invention can achieve not only high enthalpy and high residual film ratio but also photosensitive composition by reducing the amount of the photosensitive material. The coating property is extremely excellent. Example 15 A mixture of 100 parts by weight of a mixture of a novolak resin having a weight average molecular weight of 6,000 and a weight average molecular weight of 10, a polybutyl methacrylate 3-butyl ester (PtBMA) M100:3. And 19 parts by weight of an esterified product of 2,3,4,4*-tetrahydroxydiphenyl- and 1,2-anthracene diazo-5-sulfonyl chloride dissolved in propylene glycol monomethyl ether In the acid ester, in order to prevent the radial wrinkles, that is, the veins, which are applied to the resist film by spin coating, a 300 Ρριπ fluorine-based interfacial activity, Fluoride-472 (manufactured by Sumitomo 3M Co., Ltd.) is added and given to K. After stirring, the mixture was filtered through a 0.2 μm filter to prepare a photosensitive composition of the present invention. The sensitivity and coatability of the photosensitive composition were measured in the same manner as in Example 13. Further, in the present embodiment, when a photoresist film was formed for measuring sensitivity, the sensitivity of the photoresist film baked at each baking temperature of 95C, 1003⁄4, and 1053⁄4 was determined. The results are shown in Tables 4 and 5. Example 16 The results of Tables 4 and 5 were obtained in the same manner as in Example 15 except that a novolak resin having a weight average molecular weight of 1,500 was used. -34- This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) (please read the notes on the back and fill out this page)

1267699 A7 B7 3 3 V. Description of invention () Table 4 Novolac resin: PtBMA (weight ratio) The molecular weight of the novolak resin The sensitivity of the photosensitive substance (BlJ/Cffl 2 ) 95t: ιοου 105^ △ S (105-95 Example 15 100:3 6,000 19 18*5 21.2 23.4 4.9 Real_Example 16 100:3 15,000 19 26.3 30.3 34.0 7·7 Table 5 Sensitivity (mJ/ciB2) Coating property 7 (A) δ (A) Implementation Example 15 350 350 60·0 Example 16 570 570 111.0 (Please read the note on the back and fill in this page) 0, Printed by the Ministry of Economic Affairs, Intellectual Property Office, and the Consumer Cooperative, and the resist patterns obtained in Examples 15 and 16. There is no scum, and the shape of the photoresist pattern is good. As can be seen from Tables 4 and 5 above, the difference in the coating property and the baking condition are different (the difference between the temperature at the baking temperature of 1053⁄4 and the sensitivity at the baking temperature of 95tJ), that is, the photoresist pattern depending on the engineering conditions. Line width uniformity · The molecular weight of the novolac resin is small, and the smaller the AS, the smaller the size of the exposure, the dimensional change of the photoresist pattern that is caused by the temperature difference caused by the temperature distribution in the same substrate. Small, that is, excellent line width uniformity. -35-

Order ---------ΓJ This paper scale applies to China National Standard (CNS) A4 specification (210 X 297 mm) 1267699 A7 __B7___ 34 V. Invention description () Example 17 to 100 parts by weight a mixture of a novolac resin having a weight average molecular weight of 15,000 and a mixing ratio of a weight average molecular weight of 10, polymethyl methacrylate (PMMA) K100:3, and 20 parts by weight of 2, 3, 4, 4 The esterified product of '-tetrahydroxybenzophenone and 1,2-naphthalene diazo-5-sulfochloride is dissolved in propylene glycol monomethyl ether acetate to prevent spin coating. Radiation wrinkles, that is, veins on the photoresist film, in which 300 ppm of fluorine strip surfactant, Fluoride-472 (manufactured by Sumitomo 3M Co., Ltd.) was added and stirred, Μ0.2^ιη The photosensitive composition of the present invention was prepared by filtration through a reactor. The dissolution rate of the composition was calculated based on the above-mentioned "method of measuring the solubility of the photosensitive composition". Further, the sensitivity measurement method described in Example 13 was carried out to observe the sensitivity of the photosensitive composition, and the results of Table 6 were obtained. Examples 18 to 21 and Comparative Examples 4 to 6 The results of Table 6 were obtained in the same manner as in Example 17 except that the mixing ratio of the novolak resin and the enamel and the amount of the photosensitive material added were as shown in Table 6. . --------------------Book --------- (Please read the notes on the back and then fill out this page) Ministry of Economic Affairs Intellectual Property Bureau staff consumption The size of the paper printed by the cooperative is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm). 1267699 A7 B7 V. Description of invention (35) Table 6 Novolac resin: PMMA (weight ratio) to 100 parts by weight of bismuth soluble resin The amount of addition of photosensitive substance (parts by weight) dissolved β catch (A/min) sensitivity (ffiJ/CHI 2 ) Example 17 100:3 20 120 35 Example 18 100:3 15 2100 25 Example 19 100 :3 10 3710 24 Example 20 100:5 5 120 50 Example 21 100:5 1 1500 60 Comparative Example 4 100:5 0.5 2400 180 Comparative Example 5 100:0 1 33000 No pattern can be formed Comparative Example 6 100:0 15 22800 could not form patterns Examples 22 to 26, Comparative Example 7 except that poly(methyl methacrylate-co-stupyl ethylene) [P(MMA-St)] and P (MMA) having a weight average molecular weight of about 1 Å were used. The mixing ratio of the novolak resin of -St) and the amount of the photosensitive material added were as shown in Table 7, and the results of Table 7 were obtained. -37- ϋ 1 mmmmt ϋ ϋ·- ammmt ϋ I 1 t mmmmi 0 l tmt n 1- In 11 n , ·ϋ ·ϋ ββϋ n emmmg ϋ· etj I --J series (please read the notes on the back first) Fill in this page again) Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed This paper scale applies Chinese National Standard (CNS) A4 specification (210 X 297 mm) 1267699 Α7 Β7 V. Invention Description () Table 7 Novolak Resin: PMMA (Weight ratio) The amount (parts by weight) of the photosensitive material added to 100 parts by weight of the alkali-soluble resin is dissolved. Solution speed (A/fflin) sensitivity (inJ/cm 2) Example 22 100:3 20 110 32 Example 23 100:3 15 1900 23 Example 24 100:3 10 3350 22 Example 25 100:5 5 110 45 Example 26 100:5 1 1350 53 Comparative Example 7 100:5 0.5 2100 90 (Please read the back note first and then fill in the page) ♦ From the above Tables 6 and 7, the photosensitive composition is 2.38 wt% KOH. In the case of tetramethylammonium, the dissolution rate is 50 00/min or less, and the amount of the photosensitive material used is 1 part by weight on 100 parts by weight of the resin composition, and a practical sensitivity can be obtained while maintaining high residual film properties. Further, the photoresist patterns obtained in Examples 17 to 26 were free from scumming, and the shape of the photoresist pattern was good. -3 8 ~ 订——————•• MW. Printed by the Intellectual Property Office of the Ministry of Economic Affairs. This paper scale applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 1267699 A7 B7

37 A V. Inventive Note (1) The copolymer of 3,0 0 0 0 was carried out in the same manner as in Example 27 as an acrylic acid strip copolymer. The hydrazine composition has a hydrazine dissolution rate of 55 〇i/min and a divergence of 22 mJ/cifl2. Moreover, the resulting resist pattern has no scum and a good shape of the resist pattern. The results of Examples 27 to 29 are shown in Table 8 below. Table 8 (Please read the notes on the back and fill out this page). i!i Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperatives Printed Novolac Resin: Acrylic Bar Copolymer (Weight Ratio) For 100 parts by weight of alkali-soluble resin Addition amount (parts by weight) of photosensitive substance Solubility rate (A/»in) 臧 degree (mJ/cBi2) Example 27 100:3 19 570 25 Example 28 100:3 19 590 20 Example 29 100:3 19 550 22 A 39-a paper scale applicable to China National Standard (CNS) A4 specification (210 X 297 mm) 1267699 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed A7 B7 V. Invention Description (#) Example 30 100 parts by weight of a mixture of a phenol novolak resin having a weight average molecular weight of 6,000 and a polymer Μ 100:3 as described in Synthesis Example 1 (weight ratio), 19 parts by weight of 2,3,4,4f-tetrahydroxy An esterified product of benzophenone and 1,2-naphthyl ester diazo-5-sulfonyl chloride dissolved in propylene glycol monomethyl ether acetate to prevent photoresist film during spin coating It can be radially broken, that is, vein-like effect, and 300pphi fluorine-based surfactant is added. Fluoro Luolai De -472 (manufactured by Sumitomo 3M Co., Ltd.) and I [mu] After stirring, Μ 0.2win the filter medium to prepare a photosensitive composition of the present invention. The composition sensitivity and residual film rate were measured. Further, the measurement of the sensitivity was carried out by K in the same manner as in Example 13. The results are shown in Table 9. Example 3 1 The results of Table 9 were obtained in the same manner as in Example 30 except that the polymer described in Synthesis Example 2 was used instead of the polymer described in Synthesis Example 1. Example 32 The results of Table 9 were obtained in the same manner as in Example 30 except that the polymer described in Synthesis Example 5 was used instead of the polymer described in Synthesis Example 1. Example 33 A mixture of 100 parts by weight of a novolac resin having a weight average molecular weight of 6,000 and a polymer ratio of 100:3 of Synthesis Example 2 (weight ratio), 4 parts by weight of 2, 3, 4 was used. The same procedure as in Example 30 was carried out except that the esterified product of 4 to tetra-butylbenzophenone and 1,2-naphthyl ester diazo-5-sulfochloride was reacted. The results of Table 9 are available. Example 34 - The paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (please read the notes on the back and fill out this page) 0 一Γ 【_ ϋ ϋ 1 a·— ϋ-i 1 - ^ I _1 I 1 n ϋ ϋ·ρ · 1267699 Ministry of Economic Affairs Intellectual Property Office Staff Consumer Cooperatives Printed A7 B7 V. Description of Invention (θ) The polymer described in Synthesis Example 3 was used instead of the synthesis example 1 The results of Table 9 were obtained in the same manner as in Example 30 except for the polymer. Example 35 The results of Table 9 were obtained in the same manner as in Example 30 except that the polymer described in Synthesis Example 4 was used instead of the polymer described in Synthesis Example 1. Example 36 The results of Table 9 were obtained in the same manner as in Example 30 except that the polymer described in Synthesis Example 6 was used instead of the polymer described in Synthesis Example 1. Comparative Example 8 The results of Table 9 were obtained in the same manner as in Example 30 except that the polymer described in Synthesis Example 1 was not used. Comparative Example 9 In addition to 100 parts by weight of a novolac resin having a weight average molecular weight of 6,000, 2,3,4,4'-tetrahydroxybenzophenone and 1,2-nonyl ester diazo-5-sulfo group The results of Table 9 were obtained in the same manner as in Example 33 except that the amount of the esterified product of the chloride was 4 parts by weight and the polymer described in Synthesis Example 2 was not used. Comparative Example 1 0 2,3,4,4'-tetrahydroxybenzophenone and 1,2-naphthyl-diazo group for 100 parts by weight of a weight average molecular weight of 10, a novolac resin The result of Table 9 was obtained in the same manner as in Example 30 except that the amount of the esterified product of the 5-sulfonyl chloride was 25 parts by weight and the polymer described in Synthesis Example 1 was not used. -4/ - This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) (please read the notes on the back and fill out this page) ·--------Book---- ----1267699 A7 B7 4 0 V. Inventive Note () shed aim mm Add amount (phr* ” Sensitivity (mJ /cm2, (3⁄4) 鄕 Synthetic score * Mw Age (mgKOH/g) Addition amount (phr * * ) mm leg, 15,000 80 300/103 19 16.8 96·0 30 tBuMA, Μ mm ΜΜΑ, 13,000 8 Same as above 19 17·6 97*0 31 tBuHA, Μ mm chaos 13,000 1 Same as 19 18·4 98.2 32 tBuMA, Μ 13,000 8 Ibid 4 5·3 97.0 33 tBuHA, Μ mm chaos 13,000 8 Ibid 19 19.4 97.5 34 r^uMA, AA mm 瞧, 12,000 8 Ibid 19 17.8 97.3 35 cHHA, M mm m9 13,000 0.3 Ibid 19 22.0 98.8 36 tBuMA, tmm a - 0 19 mmm mm no change into mm face 99 - - a 0 4 no move into m no move into mm t 10 - - - 0 25 35.0 97.0 16 MMA: methyl methacrylate, tBuMA: A 3-butyl acrylate, AA: acrylic acid, cHMA: cyclohexyl methacrylate, nBuMA: A The amount of n-butyl acrylate photosensitive composition for 100 parts by weight of resin - 42 - This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) (please read the precautions on the back) Fill in this page) • T, n -ϋ n Βϋ ϋ .ϋ ·ϋ ·1\ I Βϋ ϋ ϋ I n σ IG Economic Intelligence Intellectual Property Bureau Employees Consumption Cooperative Print A7 1267699 _B7_ V. Invention Description 4 () Moreover, The photoresist samples obtained in Examples 30 to 3 6 were free from scumming, and the line width uniformity of the photoresist circle and the shape of the photoresist pattern were good. Further, as shown in Table 3, if the yttrium acrylate copolymer When the acid value is more than 1 to 80»gK0H/g, for example, when the amount of the photosensitive material added is 19 parts by weight, the degree is somewhat lowered, and the acid value of the acrylic copolymer is 1 to 80 nmgK0H/g. When the amount of addition is small, since the photosensitive composition having excellent sensitivity and residual film ratio is obtained, the acid value of the acrylic strip copolymer is preferably from 1 to 80 mg K0H/g, and further, when the acrylic copolymer is not used, The film rate is too poor to form a pattern. Example 37 A resin composition in which a novolak resin having a weight average molecular weight of 10,0 0 and a polybutyl methacrylate having a weight average molecular weight of 13,000 were mixed at a mixing ratio (by weight) of 100:3 was measured. iH-NMR spectrum of heavy acetone solution ^ From the obtained graph, calculate the peak integral value B of the range of the peak value A- of the range of 7.2 to 5.6 PPI0 and the peak of the solvent of the solvent peak of propylene glycol indole methyl ether acetate from 1.3 to 0.95 ppm. When the value of B/A is taken X, X is 0.42. In addition, the photoresist film obtained by using the photosensitive composition prepared by the sputum is used as a sample for measurement, and the same X value can be obtained by the resin composition when the NMR spectrum is measured. As a result, β (reduction of photosensitive synthon), 100 parts by weight of the upper resin composition, and 18 parts by weight of 2,3,4,4 '-tetrahydroxydiphenyl- and 1,2-naphthyl ester The esterified product of the nitrogen-5-sulfo vapor is dissolved in propylene glycol monomethyl ether acetate to prevent radial breakage, ie, veining, on the photoresist film during spin coating. 43- This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) ------------- - (Please read the note on the back -* page) t Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed 1267699 A7 B7_______ 42 V. Inventive Note () Add 300i>pro fluoride strip surfactant, Fluoride-472 (manufactured by Sumitomo 3M Co., Ltd.) and stir The photosensitive composition of the present invention was prepared by filtration through a K0.2jt/ii filter. The sensitivity, residual film ratio, and coatability of the obtained photosensitive composition were measured. Further, the measurement of the sensitivity and the coating property was carried out in the same manner as in Example 1. The results are shown in Table 10. Example 38 The same procedure as in Example 37 was carried out except that poly(methyl methacrylate-co-methacrylic acid n-butyl styrene) [70:30] was used instead of poly(n-butyl methacrylate) having a weight average molecular weight of 13,000. The results of Table 10 are available. Example 39 The same as Example 37 except that poly(methacrylic acid methyl #-co-methacrylic acid n-butyl brewing) [70:29:1] was substituted for n-butyl polymethacrylate using a weight average molecular weight of 13,000. The results of Table 10 can be obtained. Example 40 The same procedure as in Example 37 was carried out except that a mixture of polymethyl methacrylate having a weight average molecular weight of 13,000 and n-butyl methacrylate (70:30) was used instead of polybutyl methacrylate. The results of Table 1 are obtained. Comparative Example 11 The peak integrated value Α of the range of 7.2 to 5·6 ρρβ and the range of 1.3 to 0.95 时 were measured when the weight average molecular weight was 1 〇, and the 1 H-HMR spectrum of the bismuth oxime solution of the phenol novolak resin was measured. The peak value of the peak Β / Α value X is 0 〇 so that 100 parts by weight of novolac resin, and 23 parts by weight of 2,3,4,4 four-44- this paper scale is applicable to China National Standard (CNS) A4 specification ( 210 X 297 public "" (Please read the note on the back? Then fill out this page) .. Order-----'-· Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed 1267699 Α7 Β7 Λ ? OBJECTS OF THE INVENTION () The esterified product of hydroxydiphenyl ketone and 1,2-naphthyl ester diazo-5-sulfochloride is dissolved in propylene glycol monomethyl ether acetate, and is the same as in Example 37. The evaluation of the degree of twist, residual film rate, and coatability was carried out. The results of Table 10 were obtained. Comparative Example 12 In addition to 2, 3, 4, 4 L tetrahydroxybenzonitrile and 1,2_#_diazo- 5 The result of Table 10 was obtained in the same manner as in Comparative Example 11 except that the esterified product of the sulfochloride was 18 parts by weight. Table 10 (Please read the back of the note first) (Refill this page) X=B/A 戚 degree (biJ/cii 2 ) Residual film rate (8) Coating property 7 (A) δ (A) Example 37 0.042 27 96 360 50 Example 38 0.042 25 96 350 47 Example 39 0.042 23 96 350 47 Example 40 0.042 25 96 350 52 Comparative Example 11 0 40 85 620 100 Comparative Example 12 0 Cannot form pattern 0 - 1 Τ-----一--- Ministry of Economic Affairs Intellectual Property Office staff Consumer Cooperative Printing Clothing Example 41 In addition to the mixing ratio of the novolak resin and the polybutyl methacrylate used in Example 37, the weight ratio is 1 0 0 : 1 0 , and 2 , 3 , 4 , 4 ' - 4 The sensitivity and residual film ratio were evaluated in the same manner as in Example 37 except that the esterified product of the hydroxydiphenylmethyl group and the 1,2-# ester diazo-5-sulfochloride was 12 parts by weight. The result of Table 11. -45- The paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) 1267699 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing clothing A7 B7 4 4 V. Invention description () Example 42 In place of poly(methyl methacrylate-co-butyl n-butyl methacrylate) [70:30], except for the weight average molecular weight of 13,000 Butyl acrylate, the same manner as in Example 41, to give the results in Table 11 it may be. Example 43 except that poly(methyl methacrylate-co-n-butyl methacrylate-co-acrylic acid) [70:29:1] was substituted for n-butyl polymethacrylate using a weight average molecular weight of 13,000, Example 41 was carried out in the same manner, and the results of Table 11 were obtained. Comparative Example 1 3 The results of Table 11 were obtained in the same manner as in Example 41 except that n-butyl methacrylate was not used. Table 11 X=B/A Sensitivity (inJ/cm 2 ) Residual Film Rate 00 Example 41 0.12 80 100 Example 42 0.12 70 100 Example 43 0.12 60 100 Example 44 0.12 70 100 Comparative Example 13 0 Pattern 0 could not be formed -46- This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) (please read the notes on the back and fill out this page)

1267699 Ministry of Economic Affairs Intellectual Property Office Staff Consumer Cooperative Printed Clothing A7 B7 4 5 V. Inventive Note () Example 45 In addition to the mixing ratio of novolak resin and polybutyl methacrylate used in Example 37, weight ratio 100 : 0.25, and the esterified product of 2,3,4,4f-tetrahydroxybenzophenone and 1,2-# ester diazo-5-sulfochloride is 23 parts by weight, and examples The sensitivity and residual film rate were evaluated in the same manner in 37, and the results of Table 12 were obtained. Example 46 The same procedure as in Example 45 was carried out except that poly(methyl methacrylate-co-n-butyl methacrylate) [70:30] was used instead of poly(n-butyl methacrylate) having a weight average molecular weight of 13,000. The results of Table 12 are available. Example 47 The same as Example 45 except that poly(methylammonium methacrylate-n-butyl-butyl methacrylate) [70:29:1] was substituted for n-butyl polymethacrylate using a weight average molecular weight of 13,000. The results of Table 12 are obtained. Table 12 X=B/A Sensitivity (inJ/cm 2 ) Residual film rate (%) Example 45 0.012 40 92 Example 46 0.012 40 92 Example 47 0.012 40 92 -47- This paper scale applies to the Chinese National Standard (CNS) )A4 size (210 X 297 mm) (Please read the notes on the back and fill out this page)

1267699 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed Β7 Β7 46 5, invention description () It can be seen from Table 12 that even by adding a small amount of mixed resin, the sensitivity and residual film rate can be improved, and the possibility of sensitivity is improved. . In addition, Fig. 1 and Fig. 2 show a sample of a novolak resin: acrylic polymer = 100: 10 mixed resin film sample Μ 1 H-ΝΜϋ spectrum measurement, and a composition obtained by using the mixed resin as a resin composition The photoresist sample was measured by H 1 H-NMR spectroscopy. As shown in the graphs of the figures, a graph obtained by mixing the resin film samples and a different component contained in the graph system sample obtained from the photoresist film sample showed a slight spectral difference, 7.2 to 5.6 f > p The peak integral value of the ® range has almost no difference from the B/A value X of the peak integral value B in the range of 1.3 to 0.95 pp® except for the solvent of propylene glycol monomethyl ether acetate. This is because the resin composition used for the graph shown in the drawing is not particularly limited, and the resin compositions of the respective examples are the same. The embodiment 37 is specifically described for this purpose, but in the resin composition of the other examples, the X values obtained by the resin film sample and the photoresist film sample of each example were substantially the same value. Example 48 20 parts by weight of 2,3,4,4'-tetrahydroxybenzophenone and 1,2-decyl diazo-5 were added to 100 parts by weight of a novolak resin having a weight average molecular weight of 7,000. - an esterified product of sulfo-chloride and 3.0 parts by weight of polystyrene (PSt) having a weight average molecular weight of 14,000, and dissolved in propylene glycol monomethyl ether acetate to prevent photoresist during spin coating The film can be radially collapsed, that is, vein-like, and a 300 ρρπι fluorocarbon surfactant, fluridine-472 (manufactured by Sumitomo 3M Co., Ltd.) is added and stirred, and the filter of M 0.2W® is filtered. Modulation of the photosensitive composition of the present invention ~ 4 8 - The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (please read the notes on the back and fill out this page) Order----' --- 1267699 Ministry of Economic Affairs Intellectual Property Office Staff Consumer Cooperatives Printed A7 B7 48 V. Inventive Note () Except that polystyrene having a weight average molecular weight of 14,000 is not used, the same as in Example 48, Table 13 can be obtained. result. Example 52 The results of Table 13 were obtained in the same manner as in Example 48 except that polymethyl methacrylate (PMMA) having a weight average molecular weight of 10,000 was used instead of polystyrene (PSt) having a weight average molecular weight of 14,000. . Table 13 Residual film ratio of resin in combination with novolac resin (8) Sensitivity (nJ/cffl 2 ) Example 48 PSt 98.5 23.9 Example 49 PSt 99.0 28.9 Example 50 PSt/HMA 99.3 32.0 Example 51 Pst (addition of phenolic carboxyl group Low molecular compound) 98.2 21.0 Comparative Example 14 - 52.0 (cannot form a drawing) - Example 52 ΡΗΜΑ 98.0 35.0 -50- This paper scale applies to China National Standard (CNS) A4 specification (210 X 297 mm) (please Read the notes on the back and fill out this page)

1267699 Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperatives Printed A7 B7 4 9 V. Inventions () Example 5 3 Except 2,3,4,4~tetrahydroxydiphenylene and 1,2-naphthyl ester diazo The results of Table 14 were obtained in the same manner as in Example 48 except that the esterified product of the 5-sulfonyl chloride was 25 parts by weight. Comparative Example 1 5 The results of Table 14 were obtained in the same manner as in Example 53 except that polystyrene (PSt) having a weight average molecular weight of 14,000 was not used. Table 14 Residual film ratio (%) of resin in combination with novolak wax (itsJ/cm 2 ) Example 53 PSt 100.0 32.0 Comparative Example 15 - 92.0 32·0 Example 54 except for adding 100 parts by weight of novolak resin 30 parts by weight of the esterified product of 2,3,4,4^tetrahydroxybenzophenone and 1,2-naphthyl ester diazo-5-sulfochloride were carried out in the same manner as in Example 48. , can get the results of Table 15. Comparative Example 1 6 The results of Table 15 were obtained in the same manner as in Example 54 except that polystyrene (PSt) having a weight average molecular weight of 14,000 was not used. This paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (please read the back. Note the following)

1267699 A7 B7 R 〇五、发明说明() Table 15 Residual film ratio of resin in combination with novolak resin (3⁄4) Sensitivity (iaJ/cm 2 ) Example 54 PSt 100.0 26·0 Comparative Example 16 Fine 92.0 25.0 Example 55 10 parts by weight of 2,3,4,4'-tetrahydroxybenzhydryl and 1,2-naphthyl ester diazo-5-, added to 100 parts by weight of the weight average molecular weight of 10,000 novolac resin The results of Table 16 were obtained in the same manner as in Example 48 except that the sulfochloride and 4.0 parts by weight of polystyrene (PSt) having a weight average molecular weight of 14,000 were used. Comparative Example 1 7 The results of Table 16 were obtained in the same manner as in Example 55 except that polystyrene (PSt) having a weight average molecular weight of 14,000 was not used. Table 16 (Please read the notes on the back and fill out this page) Lin-------^——1_4 Residual resin rate of resin combined with novolac resin printed by the Intellectual Property Bureau of the Ministry of Economic Affairs (3⁄4) Sensitivity (mJ/cm 2 ) Example 55 FSt 98.5 27.0 Comparative Example 17 - Unable to form a pattern - -52 - This paper scale applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 1267699 Ministry of Economic Affairs Intellectual Property Office staff Consumer Cooperatives Printed Α7 Β7

5 I V. INSTRUCTIONS () The photoresist patterns obtained in Examples 48 to 55 have no scum, the line width of the photoresist pattern is uniform, and the shape of the photoresist pattern is good. Therefore, as is apparent from the above Tables 13 to 16, when a styrene resin is used as the resin additive, a photosensitive composition excellent in both residual film ratio and sensitivity can be obtained. Further, when PMMA is used as the resin to be used in combination with the novolac resin, not only the residual film ratio and the sensitivity but also a photosensitive resin composition having high sensitivity can be obtained as shown in Table 13. This is a difference in the tortuosity between the PMt used in the PMMA and the benzene invention and the furfural varnish resin, whereby the sensitivity of the photosensitive resin composition can be improved, and the photosensitive resin is poor in the difference between the novolac resin and the PSt. The sensitivity improvement of the composition is an appropriate tortuosity difference, whereby K improves the utilization efficiency of the photosensitive material. Further, as is clear from Table 15, when a styrene resin is used as the resin additive, the photosensitive resin composition of the present invention can maintain high sensitivity and high residual film, that is, low engineering correlation, even when a large amount of photosensitive material is added. Advantageous Effects of Invention The first invention of the present invention is a resin of a resin composition used for a photosensitive composition, and the effect of the photosensitive material is improved by using at least one set of resin enthalpy having a tortuosity difference (Δη) of 0.03 Å. Thereby, the amount of the photosensitive material used in the photosensitive composition can be reduced, and the throughput can be improved by the high sensitivity of the photosensitive composition. Further, according to the second aspect of the present invention, the photosensitive composition comprising an alkali-soluble resin and a sensitized azo group-containing photosensitive material can contain a resin having a function as a de-inhibitor as a wax additive, thereby reducing The amount of the photosensitive material used is high, and the sensitivity of the photosensitive material is improved, and the photosensitive group excellent in residual film properties can be obtained. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ( Please read the notes on the back and fill out this page. Order---------- Line and A8 B8 C8 D8 1267699 6. Apply for patents. Further, according to the present invention, a photosensitive composition having high resolution, good developing property, and excellent pattern formation property can be obtained, and the coating property of the photosensitive composition and the line width uniformity of the photoresist pattern can be obtained. Excellent photosensitive composition with low engineering relevance. According to the present invention, it is possible to obtain a photosensitive composition excellent in various properties such as high sensitivity, developability, residual film property, coating property, and line width uniformity of a resist pattern, and it is possible to reduce the amount of the photosensitive material used. Further, in the present invention, by improving the throughput and reducing the amount of the photosensitive material by the high sensitivity, it is possible to greatly reduce the cost when manufacturing a semiconductor integrated circuit or a circuit board for manufacturing a PPD or a thermal needle. Industrial Applicability As described above, the photosensitive composition of the present invention is suitably used for a semiconductor integrated circuit such as LSI or a photoresist material for manufacturing an FPD or a circuit board such as a thermal needle. (Please read the notes on the back and fill out this page) --Line · Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing -54- This paper scale applies China National Standard (CNS) A4 specification (210 X 297 mm)

Claims (1)

1267699 m.2n, the scope of application for patent: No. 89120783, the sensitized winter month 9 ^ The case (amended on October 21, 2005) $ Patent scope: 1 · *~ A photosensitive composition containing a resin composition And a photosensitive material 'characterized by a resin composition comprising two or more kinds of resins; wherein the resin composition further comprises (a) an alkali-soluble novolac lacquer resin, and (b) a resin additive, wherein the resin additive comprises Polyacrylate, polymethacrylate, polystyrene derivative, polyvinyl benzoate, polyvinyl phenyl acetate, polyvinyl acetate, polyvinyl chloroacetate, polypropylene 膪At least one selected from the group consisting of poly-α-methacryl and tetradecyl imine, and two or more of self-acrylate, formazan acrylate, styrene derivative, vinylbenzene Formate, vinyl phenyl acetate, ethylene acetate, ethylene chloroacetate, propylene oxime, alpha-methyl propylene hydride, fluorene-vinyl quinone imine, hydrazine-vinyl imidazole, Ν -vinylcarbazole, 2-ethylene a copolymer of a selected group of monomers consisting of quinoline, vinylcyclohexane, vinylnaphthalene, vinylpyridine, fluorene-vinylpyrrolidone; more specifically, when a styrene monomer repeating unit is used When the resin having a content of less than 50% by mole of the repeating unit in the resin is used as the resin additive, the polystyrene-equivalent weight average molecular weight of the resin is from 7,0 to 20,000, and relative to 100 parts by weight. The content of the resin additive is 1 to 20 parts by weight based on the alkali-soluble resin; and when the styrene monomer is used in a repeating unit content of not less than 1267699, the resin in the patent range is repeated in units of 50 mol%. In the case of the resin additive, the polystyrene-equivalent weight average molecular weight of the resin is 3,000 to 25,000, and the content of the resin additive is 0.5 to 5 parts by weight based on 100 parts by weight of the alkali-soluble resin; The dissolution rate of the composition of the aqueous solution of 3.8 wt% tetramethylammonium hydroxide was 5000 A/min or less. 2. The photosensitive composition of claim 1, wherein the polyacrylate of the resin additive is from polymethyl acrylate, polyethyl acrylate, poly-n-propyl acrylate, poly-n-butyl acrylate, poly-n-hexyl acrylate. , polyisopropyl acrylate, polybutyl acrylate, polybutyl acrylate 3 - butyl ester, polyhexyl hexyl acrylate, polymethyl acrylate, 2-chloroethyl acrylate, poly-α-chloro acrylate, poly One of the group consisting of phenyl α-bromoacrylate; and the polymethacrylate of the resin additive is self-polymethyl methacrylate, polyethyl methacrylate, poly-n-propyl methacrylate, poly N-butyl methacrylate, poly-n-hexyl methacrylate, polyisopropyl methacrylate, polybutyl isobutyl methacrylate, polybutyl methacrylate 3-butyl ester, polycyclohexyl methacrylate, polymethyl Benzoyl acrylate, polyphenyl methacrylate, polyphenylene methacrylate, polyphenyl 2-ethyl methacrylate, polymethyl methacrylate, polyphenyl methacrylate Methyl ester, polymethacrylic acid One of the group consisting of chlorophenyl ester and poly(methyl methacrylate); and suitable for acrylate, methacrylate, used to prepare the above-mentioned acrylate, methacrylic acid 1267699. A monomer of a polystyrene, polymethacrylate styrene derivative. A photosensitive composition comprising a resin composition and a photosensitive material, wherein the resin composition comprises at least (a) an alkali-soluble novolac lacquer resin; and (b) a resin additive, wherein the resin additive comprises From polyacrylate, polymethacrylate, polystyrene derivative, polyvinyl benzoate, polyvinyl phenyl acetate, polyvinyl acetate, polyvinyl chloroacetate, poly At least one member selected from the group consisting of acrylonitrile, poly-α-methacryl oxime, and polyvinyl ruthenium, and two or more kinds from acrylate, methacrylate, styrene derivative, vinyl Benzoate, vinyl phenyl acetate, vinyl acetate, vinyl chloroacetate, propylene oxime, alpha-methacrylonitrile, oxime-vinyl quinone, oxime-vinylimidazole a copolymer of a selected group of monomers consisting of fluorene-vinylcarbazole, 2-vinylquinoline, vinylcyclohexane, vinylnaphthalene, vinylpyridine, fluorene-vinylpyrrolidone; c) a photosensitive substance, which is a kind of An azo-based photosensitive material; wherein when a styrene monomer having a repeating unit content of less than 50% by mole of the repeating unit in the resin is used as the resin additive, the polystyrene-equivalent weight average molecular weight of the resin It is 7,000 to 20,000, and the content of the resin additive is 1 to 20 parts by weight based on 1 part by weight of the alkali-soluble resin; and when the styrene monomer is used, the repeating unit content is not less than the resin. The resin of 50% by mole of the repeating unit is 1267699. 6. When the resin additive is applied in the patent range, the polystyrene-equivalent weight average molecular weight of the resin is 3,000 to 25,000, and the weight is relative to 1 699. The content of the resin additive is 0.5 to 5 parts by weight, and the dissolution rate of the photosensitive composition is 2.38 wt% aqueous solution of tetramethylammonium hydroxide, and the dissolution rate is 5000 Å/min or less; And wherein when the styrene monomer repeat unit content is less than 50 mol% of the repeating unit in the resin, In the case of the resin additive, the photosensitive material is contained in an amount of from 1 to 20 parts by weight per 100 parts by weight of the alkali-soluble resin in the photosensitive composition, and that the repeating unit content is not less than the resin when the styrene monomer is used. The resin of the medium repeating unit is 50 mol% of the resin as the resin additive, and the content of the photosensitive material is 10 to 30 parts by weight relative to 100 parts by weight of the alkali-soluble resin in the photosensitive composition. · For example, please call the photosensitive composition of the third item of the patent range. Among them, the polyacrylate of the resin additive is from polymethyl acrylate, polyethyl acrylate poly-n-propyl acrylate, poly-n-butyl acrylate, ? Poly. hexyl acrylate polyisopropyl acrylate, polybutyl acrylate polybutyl acrylate 3-butyl ester, polycyclohexyl acrylate, polybenzyl acrylate polyacrylic acid 2-chloroethyl ester, poly-α-chloro methacrylate One of the group consisting of poly- ί 2 - phenyl bromoacrylate; and the polymethacrylate of the resin additive is polymethyl methacrylate, polyethyl methacrylate poly-n-methacrylate , poly-n-butyl methacrylate poly-n-hexyl methacrylate, poly-methyl methacrylate polymethyl 1267699 6. Patent application range of isobutyl acrylate, polybutyl methacrylate , polycyclohexyl methacrylate, polybenzyl methacrylate, polyphenyl methacrylate, polyphenyl phenyl methacrylate, poly(2-phenylethyl methacrylate), polymethacrylic acid Selected from the group consisting of furan methyl ester, poly(diphenylmethyl methacrylate), polypentachlorophenyl methacrylate and polymethyl methacrylate One member. 5. The photosensitive composition according to claim 1 or 3, wherein the resin additive is a copolymer of at least two monomers selected from the group consisting of acrylates, methacrylate styrene derivatives, or at least one of a copolymer obtained by reacting a monomer with an organic acid monomer having a carboxyl group or a carboxylic anhydride group; the acid value thereof is 1 to 80 mgKOH/g; and when the organic acid monomer is used in the copolymer as a copolymerizable component The amount of the organic acid monomer to be used is 0.1 to 10.0 parts by weight based on 100 parts by weight of the other monomer components. 6 · The photosensitive composition of claim 3, wherein the W-NMR spectrum of the heavy hydrogen acetone solution of the resin composition is 7 · 2 to 5 . 6 ppm peak integral 値 is A, at 1.3 to 0.95 ppm When the peak product is divided into f B , the 値X of B/A is 0.01 to 0.13. 7. The photosensitive composition of the phenolic enamel resin having a polystyrene-equivalent weight average molecular weight of 3,000 15,000 ° as claimed in claim 1 or 3 of the patent specification. a compound in which a repeating unit content of a styrene monomer is less than -5 to 50 1267699 in a repeating unit of a resin, and a resin having a molar percentage of the patented range is used as the resin additive, and the photosensitive composition is compared with 100 parts by weight. The content of the photosensitive material is 1 to 18 parts by weight based on the alkali-soluble resin. , for example, the photosensitive composition of claim 1 or 3, which further comprises a low molecular compound having a phenolic hydroxyl group or a group represented by the following general formula (I); , (〇H)e , (1) (wherein R!, R2, R3, R4, R5, and R7 are each an independent group, a hospital base, a hospitaloxy group, a cyclohexyl group, or a group represented by the following formula: : (〇H)g (Rs)h fCi% ;^8 is the base of Η, (^~(^'s oxy or cyclohexyl, m and η are each 〇, 1 or 2, a, b, c , d, e, f, g, and h are integers of 0 or 1 to 5 satisfying a + bS5, c + d$5, e + f$5, g + h$5, and i is 0, 1, or 2).