JP2001212756A - Cassette changing mechanism in polishing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve problems in a conventional changing method such as application of a collision shock applied to a semiconductor wafer because of a change carried out apart from a casing, a change of an atmosphere inside the casing and penetration of dust and the like because of a large opening part, and a load a worker working in a strained posture for changing. SOLUTION: The cassette changing mechanism is provided with a base, the casing, a delivery side transferring means feeding and transferring a semiconductor wafer housed in a delivery side cassette, a polishing means, and a storage side transferring means housing and transferring the semiconductor wafer to a storage side cassette. In this mechanism, a sliding means sliding the delivery side transferring means including the delivery side cassette and the storage side transferring means including the storage side cassette from the delivery side transfer position or the storage side transfer position to the vicinity of the side wall of the casing is also provided, while an openable window changing between the delivery side cassette and the storage side cassette is arranged on the side wall of the casing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing machine, such as a polishing machine or a lapping machine, for automatically performing ultra-high precision polishing on a semiconductor wafer. This facilitates replacement of a cassette, in which semiconductor wafers after polishing are stored, with a polishing apparatus.

[0002]

2. Description of the Related Art Semiconductor wafers of this type according to the present invention are frequently used in electronic equipment such as computers, so-called OA equipment, integrated circuits such as mobile equipment, and the development thereof is progressing day by day. There has been a demand for further ultra-thinness due to miniaturization, further diameter enlargement from the viewpoint of productivity, and further ultra-high precision flatness and mirror processing accuracy from the viewpoint of yield.

In general, a semiconductor wafer is sliced from a cylindrical silicon crystal to a predetermined thickness, and is subjected to a grinding process to further reduce the sliced semiconductor wafer to a desired thickness.

[0004] Usually, grinding is performed by rough grinding, finish grinding, and the like using a cup wheel diamond grindstone attached to the lower end of the spindle shaft of the grinding machine. With the flatness and mirror finish of the conventional method, simply grinding with a cup wheel diamond grindstone as in the past would cause damage to the semiconductor wafer due to grinding, making it impossible to apply the ultra-high precision flatness and mirror finish required today. And require further polishing after the grinding.

Further, a cassette for accommodating a semiconductor wafer having an increased diameter is also large in size, and a semiconductor wafer which is extremely thin and processed with ultra-high precision is delicate. Even a slight shock could cause damage, and further, the opening for replacing the cassette had a large opening because a person leaned out of the body and replaced.

[0006]

However, the semiconductor wafer required recently has been reduced to about 2 mm in thickness but 1 m in thickness.
m, ultra-thin to 12 inches to 16 inches instead of 6 to 8 inches in diameter, flattening of uniform quality and ultra-high accuracy, mirror surface It is the finishing of processing, and if it is replaced at a position away from the side wall of the casing like the replacement of the conventional cassette, it is a work to be performed manually, and it may hit the peripheral equipment and shock the semiconductor wafer. Furthermore, since the opening is large, the atmosphere inside the casing changes every time the door is opened and closed, which causes dust and the like in the air to enter, and in addition, when the replacement is performed in an unreasonable posture. Workers were burdened.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems.
As a result of intensive studies, these problems have been solved, and a base, a casing that covers the sides and above the base, and a semiconductor housed in a sending-side cassette provided on the base in the casing. A sending-side transfer means for sending and transferring a wafer for each item, a polishing means for automatically polishing the semiconductor wafer transferred by the sending-side transfer means, and a semiconductor wafer polished by the polishing means for each item. A polishing apparatus comprising: a storage-side transfer unit configured to store and transfer to a storage-side cassette;
Sliding means for sliding the delivery-side transfer means including the delivery-side cassette and the storage-side transfer means including the storage-side cassette from the delivery-side transfer position or the storage-side transfer position to a position near the side wall of the casing, respectively; The opening and closing windows for replacing the cassette on the delivery side and the cassette on the storage side are provided on the side wall of the housing.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide and provide a cassette replacing mechanism for easily replacing a sending-side cassette and a storing-side cassette in a polishing machine such as a polishing machine or a lapping machine. is there.

[0009]

According to the present invention, there is provided a cassette replacement mechanism in a polishing apparatus for a semiconductor wafer, which is capable of sliding a delivery side transfer means including a delivery side cassette and a storage side transfer means including a storage side cassette to a position near a side wall of a casing. Providing means,
By providing a replacement opening / closing window on the side wall of the casing,
The cassette can be easily replaced from outside of the casing by a human without being forced to reduce the shock applied to the semiconductor wafer.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A cassette replacement mechanism in a polishing apparatus according to the present invention which has achieved the above object will be described below with reference to the drawings of the embodiments.

FIG. 1 is a schematic plan view for explaining an embodiment of a cassette replacing mechanism in a polishing apparatus according to the present invention.

The present invention relates to a polishing apparatus such as a polishing machine or a lapping machine for automatically performing ultra-high precision polishing on a semiconductor wafer. More specifically, the present invention relates to a polishing apparatus before or after polishing. Semiconductor wafer W
Is stored in the cassette 3a. The base 1, a casing 2 that covers the side and the upper side of the base 1, and a base 1 in the casing 2.
Sending-side transfer means 3 for sending out and transferring the semiconductor wafers W stored in the sending-side cassette 3a arranged in the unit.
A polishing means 4 for fully automatically polishing the semiconductor wafer W transferred by the sending-side transfer means 3; and a semiconductor wafer W polished by the polishing means 4 in the storage side cassette 5a for each product. In the polishing apparatus provided with the storage-side transfer means 5 for storing and transferring, the delivery-side transfer means 3 including the delivery-side cassette 3a and the storage-side transfer means 5 including the storage-side cassette 5a are provided at the delivery-side transfer position or the storage-side transfer. A sliding means 6 for sliding from the position to a position near the side wall 2a of the casing 2 is provided, and an opening / closing window 7 for replacing the sending-side cassette 3a and the storage-side cassette 5a is provided on the side wall 2a of the casing 2. Things.

That is, the present invention provides a fully automatic polishing apparatus for polishing machines, lapping machines, etc., which can sufficiently cope with ultra-thin and large-diameter semiconductor wafers W, ultra-high precision flatness, and mirror finishing. The base 1 is for arranging each mechanism to be described later of the polishing apparatus, has a generally rectangular shape, and has a side wall 2a standing upright from the outer periphery of the base 1. The casing 2 is covered with a roof 2b to which the upper side of the side wall 2a is connected. The inside of the casing 2 is a clean room with constant temperature and humidity and no dust.

The delivery-side transfer means 3 can be moved up and down by a drive source motor (not shown) disposed laterally and a transmission mechanism such as a bar screw, a gear, or a belt mechanically connected to the motor. , A sending-side cassette mounting table provided on the upper surface of the sending-side elevator mechanism, and a large number of semiconductor wafers W to be mounted on the sending-side cassette mounting table before polishing, which will be described later. It includes a delivery-side cassette 3a that houses therein, and a delivery-side transfer robot 3b that includes a cylinder or the like that is provided with a gripping mechanism at the tip of each semiconductor wafer W of the delivery-side cassette 3a and that advances and retreats with air or oil. It is a thing.

Next, the delivery-side cassette 3a is a box-shaped one mounted on the delivery-side cassette mounting table, and internally has a plurality of horizontally formed shelves formed of a plurality of crosspieces. The semiconductor wafers W before polishing are stored in individual units on the upper side, and the plurality of semiconductor wafers W before polishing stored in the sending-side cassette 3a are transferred individually by sending-side transfer means 3 described later. When it becomes empty, it is replaced with the next sending-side cassette 3a.

Next, the delivery-side elevator mechanism provided below the delivery-side cassette mounting table on which the delivery-side cassette 3a is placed is moved up and down, and the delivery-side transfer robot 3b is advanced, retracted, swiveled, pivoted, inverted, and vacuum-adsorbed. It is gripped by a gripping mechanism such as a suction cup and a holding means, and is transferred to a polishing processing means 4 described later for each piece.

The polishing means 4 comprises a column 4a which is erected from the base 1 so as to be able to rotate and stop.
A plurality of spindle shafts 5b rotatably and vertically movable, and heads 4c at the lower ends of the spindle shafts 4b for attaching the semiconductor wafers W by vacuum suction or water bonding, respectively. is there.

Next, a polishing table (not shown) erected on the base 1 at an appropriate position below the spindle shaft 4b.
The semiconductor wafer W attached to the head 4c is moved between the rotating polishing plate 4d by the rotation stop of the column 4a and the downward rotation of the spindle shaft 4b. It is sandwiched and polished.

In the drawings of the embodiment, the semiconductor wafer W after polishing is transferred to the head 4 by the cleaning transfer robot 8.
c, and is transferred to the cleaning unit 9 for cleaning, and further transferred to the cleaning unit 9 by the cleaning transfer robot 8.
Is temporarily placed on the temporary placement table 10 after being cleaned.

The polishing means 4 of the cassette replacing mechanism according to the present invention is not limited to the embodiment shown in the figure, but may be a variety of types of polishing processing for various purposes in which the number of spindles 4b and the number of polishing plates 4d are different. Means 4 is included, but encompasses all.

Next, the storage-side transfer means 5 includes a storage-side transfer robot 5b and a storage-side elevator mechanism similar to the delivery-side transfer robot 3b, the delivery-side elevator mechanism, and the delivery-side cassette mounting table of the delivery-side transfer means 3. , And a storage-side cassette mounting table.

That is, the storage-side transfer robot 5b holds the semiconductor wafer W temporarily polished after being tentatively placed on the temporary mounting table 10 by a holding mechanism such as vacuum suction, suction cup, and holding means of the storage-side transfer robot 5b. The storage side cassette 5 described later mounted on the storage side cassette mounting table by moving forward / backward, turning, pivoting, reversing by air or oil, and raising / lowering the storage side elevator mechanism (not shown).
It is housed between the crosspieces a.

The storage-side elevator mechanism can be moved up and down by a drive source motor (not shown) disposed laterally and a transmission mechanism such as a rod screw, a gear, and a belt mechanically connected to the motor. On the upper surface of the storage-side elevator mechanism, a storage-side cassette mounting table for mounting the storage-side cassette 5a is provided.

Further, the storage side cassette 5a for storing the polished semiconductor wafer W is the same as the above-mentioned delivery side cassette 3a.
A plurality of shelves are provided inside, and the polished semiconductor wafer W is stored on each shelf for each single product.

The cassette replacement mechanism in the polishing apparatus of the present invention includes a delivery-side transfer means 3 including the delivery-side cassette 3a and a storage-side transfer means 5 including a storage-side cassette 5a.
And sliding means 6 slidable to the vicinity of the side wall 2a of the casing 2 respectively.

Next, the sliding means 6 is the sending-side transport means 3,
Further, a slide table 6a is provided below the storage-side transfer means 5, and a groove is provided between the slide table 6a and the base 1, and the slide 6a is slid by a ridge 6b which can be inserted into the groove and slidable. However, the rail 6
b, and a roll or the like that slides on the rail 6b may be provided.

Further, each replacement opening / closing window 7 provided on the side wall 2a of the casing 2 may be formed slightly larger than the sending cassette 3a and the storage cassette 5a, and the replacement opening / closing window 7 provided on the side wall 2a. Are transported to the vicinity of the respective cassettes 3a. The casing 2 in the vicinity of 5a is provided with a replacement opening / closing window 7, and the empty sending-out cassette 3a and the full storage cassette 5a are sequentially replaced manually by the replacement opening / closing window 7. Things.

[0028]

According to the present invention, according to the above-described structure, when the sending-out cassette or the storing-side cassette for sending or storing the semiconductor wafer before and after the polishing is replaced, the replacement cassette provided on the side wall of the casing is used. It is moving near the opening window,
The replacement opening / closing window can be opened to replace an empty or full cassette, shocking delicate semiconductor wafers can be drastically reduced, and further, the casing can be reduced because the replacement opening / closing window can be made smaller. This is an epoch-making invention that can prevent changes in the internal environment, and can also prevent contact of other members and adhesion of dust and the like to the polished surface and maintain ultra-high accuracy.

[Brief description of the drawings]

FIG. 1 is a schematic plan view for explaining an embodiment of a cassette replacing mechanism in a polishing apparatus according to the present invention.

[Explanation of symbols]

 W Semiconductor wafer 1 Base 2 Casing 3 Delivery side transfer means 3a Delivery side cassette 3b Delivery side transfer robot 4 Polishing means 4a Column 4b Spindle shaft 4c Head 4d Polishing plate 5 Storage side transfer means 5a Storage side cassette 5b Storage side transfer robot Reference Signs List 6 sliding means 6a sliding table 6b ridge or rail 7 replacement opening / closing window 8 cleaning transfer robot 9 cleaning unit 10 temporary table

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 3C034 AA20 BB84 DD10 DD20 3C058 AB03 CB03 CB04 DA17 5F031 CA02 DA01 FA01 FA03 FA07 FA11 FA12 FA15 FA21 GA08 GA10 GA12 GA43 GA47 GA60 HA12 HA13 HA46 HA48 HA58 HA59 MA13 MA22 NA02

Claims (1)

[Claims] 1. A base, a casing for covering the side and upper side of the base, and a semiconductor wafer stored in a sending-side cassette disposed on the base in the casing, for transferring and transferring the semiconductor wafers individually. Sending-side transfer means, polishing means for fully automatically polishing the semiconductor wafer transferred by the sending-side transfer means, and storing and transferring the semiconductor wafer polished by the polishing means to the storage-side cassette for each product And a storage-side transfer means including the delivery-side cassette, and a storage-side transfer means including the storage-side cassette being moved from the delivery-side transfer position or the storage-side transfer position to the side wall of the casing, respectively. A polishing means, wherein a sliding means for sliding to a nearby position is provided, and an opening / closing window for switching between a sending-side cassette and a storage-side cassette is provided on a side wall of the casing. Tsu door replacement mechanism.