TW434089B - Polishing apparatus - Google Patents

Abstract

A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a plurality of turntables having respective polishing surfaces, a plurality of top rings for holding workpieces and pressing the workpieces against the polishing surfaces to polish the workpieces. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces, and a pusher for transferring the workpieces between the rotary transporter and the top rings.

Description

A7

V. Description of the Invention (1) [Background of the Invention] [Field of the Invention] The present invention relates to a grinding device for grinding a workpiece such as a semiconductor wafer to a flat mirror surface, and particularly to a rotary type for supplying a workpiece. Grinding device of conveying device. [Description of previous technology] In the semiconductor device manufacturing process, the semiconductor wafer is polished to a flat mirror surface in the semiconductor crystal moon process, and the hafnium layer formed on the semiconductor device is polished to a flat mirror surface in the semiconductor device process. . In semiconductor wafer manufacturing processes and semiconductor device manufacturing processes, these grinding procedures are performed by the grinding apparatus * called chemical mechanical polishing apparatus. Traditionally, such a polishing apparatus has been designed as a dedicated polishing apparatus having only a single function for polishing semiconductor wafers. The semiconductor wafers that have been ground by the grinding device are transported to the next cleaning procedure using a movable water tank. The wafers are immersed in water in the water tank to prevent the wafers from drying out during transfer. However, ‘separating the grinding and cleaning procedures will result in reduced cleanliness of the clean room’ and the polished semiconductor wafers need to be transported by an operator or a manual transfer device. Furthermore, 'a large assembly space is required to accommodate two devices including a grinding device and a cleaning device', wherein the cleaning device is used to perform subsequent cleaning procedures. In order to make the grinding process clean and reduce the assembly space of the device, a grinding device has been developed. The device can perform the grinding process and the cleaning process at the same time, and the semiconductor crystal moon can be introduced into it in a dry state and the already polished state in a dry state. And clean semiconductor wafers removed from dry in and dry out (please read the precautions on the back before filling out this page)-printed by the Ministry of Economic Affairs Intellectual Property 4 employee consumer cooperative printed on paper standards applicable to China National Standards (CNS ) A4 size (21 × 297 mm) 1 311 250 434089 2 A7 V. Description of the invention (2) (Dry-In and Dry-Out) device. On the other hand, 'the polishing device having only a single function for polishing semiconductor wafers is improved to maintain the cleanliness of the clean room, and the processing capacity of the polishing device and cleaning device used in the cleaning process after polishing is increased so that the grinding The number of times the grinding device was used and the number of cleaning devices used in the program. Therefore, it is possible to reduce the assembly space of the conventional special-purpose polishing device that has a single function for polishing semiconductor wafers to be equal to or less than the space required for a dry-in, dry-out type polishing device. However, in the "special polishing device having a single function for polishing semiconductor wafers", the semiconductor wafer that has been polished by the polishing device is still transferred by an operator or a manually operated transfer device. If the transfer device is automatic, it is difficult to handle the semiconductor wafers because the semiconductor wafers are stored in a removable water tank. Therefore, in the conventional special-purpose grinding apparatus, its conveying device will cause problems. Moreover, the processing capacity of the drying-in-drying-out grinding device per unit time and unit installation area is lower than that of the traditional special-purpose grinding device, requiring a larger assembly space, and the running cost of the device is higher. [Summary of the Invention] Therefore, an object of the present invention is to provide a polishing apparatus which can be used as a dry-in and dry-out polishing apparatus' and has a high unit time and unit installation area when processing workpieces such as semiconductor wafers. Processing capacity. In order to achieve the above object, according to a first concept of the present invention, a grinding device is provided, including: a plurality of turntables each having a grinding surface: _! For holding a workpiece and pressing the workpiece against the grinding surface so as to grind a plurality of workpieces. Scale applicable

--------- k ---- / installation — f Please read the back of the page first; i will fill in this page before ordering.) Order. Line ", A7

Μ -------- 1 --------- line (please read the precautions on the back before filling this page) 3 311250 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 434089 A7 --- ----- B7 V. Description of the invention (4) In the preferred example, 'each dedicated dresser is provided on each turntable. In the preferred embodiment, the section of the' rotary conveying device 'includes There are a loading table for holding a workpiece to be ground and a discharging table for holding a ground workpiece. In a preferred embodiment, a propeller is provided below or above the rotary conveyor. The above and other objects, features, and advantages of the present invention will become more apparent by making the following description with reference to the drawings for describing the preferred specific examples of the present invention. [Brief description of the diagram] Fig. 1 is a plan view showing the arrangement of components of the grinding device of the first specific example of the present invention; Fig. 2 is a front view showing the relationship between the top ring and the turntable; Fig. 3 is a rotary type The detailed structure plane ran of the conveying device type a. Fig. 4 is a front view showing the detailed structure of the rotating conveying device type a; Fig. 5 is a plan view showing the detailed structure of the rotating conveying device type b; Front view of the detailed structure of the rotary conveyor type b; Figure 7 is a plan view showing the detailed structure of a linear movable platform; " Please read the precautions on the back before filling this page) * i Install! Order--! -Line L. This paper scale applies Chinese National Standard (CNS) A4 specifications < 210 X 297 public love) 4 311250 A7 B7 V. Description of the invention (5) Figure 8 shows a detailed structure front view of the form of a linearly movable platform Figure 9 is a plan view showing the relationship between the top ring, the rotary conveyor, the propeller and the transfer robot; Figures 10A to 10D are vertical sectional views showing the operation mode of the propeller; Figure 11 is a view showing the present invention The plan view of the example of the correction device of the polishing device shown in FIG. 1 is shown in FIG. 12. FIG. 12 is a flowchart showing the polishing of the semiconductor wafer by the polishing device shown in FIGS. 1 and π; Flow chart for grinding semiconductor wafers with the grinding device shown in Figs. 1 and π; Fig. 14 shows a flowchart for grinding semiconductor wafers with the grinding device shown in Figs. 1 and π; Flow chart for grinding semiconductor wafers by the grinding device shown in Figures 1 and 11; printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs • Figure 16 shows the grinding of semiconductor wafers by the grinding device shown in Figures 1 and 11 Of Flow chart; Figure 17 is a plan view showing the arrangement of various components of the grinding device of the second specific example of the present invention; Figure 18 is a front view showing the relationship between the top ring, the turntable and the propeller. Illustration of the operation of a rotary conveying device according to another aspect of the present invention. · This paper size is in accordance with China National Standard (CNS) A4 (210x297 mm) 311250 A7.

4340 8 9 V. Description of the invention (6) Figure 20 shows the operation of a rotary conveyer according to another specific example of the present invention; 'Figure 21 shows a rotary device according to another specific example of the present invention Operation description circle; 'FIG. 22 is an operation explanation diagram of a rotary conveying device according to another specific example of the present invention;' FIG. 23 is an operation explanation diagram of a rotary conveying device according to another specific example of the present invention Figure; 'Figure 24 is a diagram illustrating the operation of a rotary conveyor according to another embodiment of the present invention; Figure 25 is a diagram illustrating the operation of a rotary conveyor according to another embodiment of the present invention; Fig. 26 is a diagram illustrating the operation of a rotating device according to another embodiment of the present invention; Fig. 27 is a diagram illustrating the operation of a rotary conveying device according to another embodiment of the present invention; Invented another Xia Jia plus + & &, operating instructions of the rotary transmission device; Figure 29 shows the operation of the rotary transmission device with a cross-section according to the present invention; Figure 30 is a diagram illustrating the operation of a rotary conveying device according to another specific example of the present invention; Figure 31 is a diagram illustrating the operation of a rotary conveying device according to another specific example of the present invention. * This paper size is applicable to China Standard (CNS) A4 specifications (21〇X 297 ^ ¾- 311250;,, install -------- "order --------- line-i 1 * (Jing Xian read the back of the ' Note: Please fill in this page again) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 6 A7 V. Description of the Invention (7) Figure 32 shows the operation instruction circle of the rotating device according to another specific example of the invention; $ it 33 The figure is a diagram showing the operation of a rotating gas and device according to another embodiment of the present invention; and ^^ 34 is a diagram showing the operation of a rotating gas and device according to another embodiment of the present invention. Detailed description of the examples] The grinding device of a specific example of the present invention is described below with reference to the accompanying drawings. FIG. 1 is a plan view showing the configuration of each of the grinding devices of the first specific example of the present invention. As shown in FIG. Grinding device includes Two rotatable loading-unloading platforms 1 for a plurality of semiconductor wafer cassettes 40. A transfer robot 2 with two robot arms is placed so that the transfer robot 2 can be extended and located at each loading-unloading platform 1 The positions of the upper wafer cassettes 40. ° • The transfer robot 2 has two robot arms arranged in a vertically spaced position. The upper robot arm is only used to process clean and dry semiconductor wafers, and the lower one The robot arm on the side is only used for processing semiconductor wafers that are moist and wet. The two cleaning devices 3 are placed on both sides of the transfer robot 2 for cleaning and drying the polished semiconductor wafers. Place the cleaning device at a place that can be reached by the robot arm of the transfer robot 2. The two reversing devices 4 and 5 for reversing the semiconductor wafer are placed on the reciprocating heart 2c and the loading_unloading platform along the conveyor ^ 2! Symmetric and reachable by the robot arm of the transfer robot 2. #Device 4 has a locking mechanism for clamping semiconductor wafers, and is suitable for China⑵㈣97 € 7 installation line 311250

S 4340 8 9 A7 B7 V. Description of the invention (8) The inversion mechanism for inverting semiconductor wafers, and only processing clean and dry semiconductor wafers. In addition to the latching mechanism and the reversing mechanism, the reversing device 5 also has a washing mechanism for cleaning semiconductor wafers and processes only semiconductor wafers that are moist and humid. The arrangement of the transfer robot 6 having two robot arms makes the transfer robot 6 and the transfer robot 2 symmetrical to the center 4e of the semiconductor wafer held by the reversing device 4 and the center of the semiconductor wafer held by the reversing device 5. 5e cable! ^. The transfer robot 6 is placed at a position where the robot arms of the transfer robot 6 can extend and reverse the devices 4 and 5 and the rotary transfer device platform 19. The two robot arms of the transfer robot 6 are arranged in a vertically separated positional relationship. The upper robot arm is only used to process clean and dry semiconductor wafers, while the lower robot arm is used to handle dirty and wet semiconductors. Wafer β Two cleaning devices 7 for cleaning and drying the ground semiconductor wafer are placed on both sides of the transfer robot 6. The cleaning procedure performed by each cleaning device 7 is different from the cleaning procedure performed by the cleaning device 3. The cleaning device 7 is placed where it can be reached by the robot arm of the transfer robot 6. Two transfer robots 8 having single-robot arms are placed on opposite sides of the reversing devices 4, and 5 corresponding to the cleaning device 7. The transfer robot 8 is placed at a position where the robot arm of the transfer robot 8 can reach the cleaning device 7 and the rotary transfer device platform 19. The grinding device has a housing 300 for housing various devices and components therein. The housing 30 forms a closed structure. The interior of the casing 30 is divided into a plurality of compartments or chambers (including the grinding chamber and the cleaning chamber). Cleaning to 3 0A is extended from the position of the two transfer robots 8 (cns) A4 _ 311250.

^ 'Install -------- Order ------ f Please read the notes on the back before filling in this page) -Xiang Guang --------- -III. A7 V. Invention Explanation (9) Extending to the position of the loading-unloading platform 1 β There is a partition wall 31 in the cleaning room 30a adjacent to the transfer robot 8, and the grinding room 30b is located in the cleaning room 30A corresponding to the partition wall In the grinding room 30b, there are two turntables 9 and 10 and two top rings 12. One of the top rings 12 holds the semiconductor wafer and presses the semiconductor wafer toward the turntable 9 while the other top ring 2 holds the semiconductor wafer and presses the semiconductor wafer toward the turntable 10. Figure 2 is a front view showing the relationship between the top ring 12 and the turntable 9 or 10. As shown in Fig. 2, the top ring 12 is supported by a rotatable shaft 32 suspended from the top ring arm u. The top ring arm is supported by a rotation shaft 33 which can be placed at an oblique angle, and thus the top ring 12 can extend to the turntable 9 or i0. Each top ring Η can use a cylinder provided in the top ring arm U to press the semiconductor wafer toward the turntable 9 or 10 at a desired pressure. A polishing liquid supply nozzle 13 for supplying polishing liquid to the center portion of the turntable 9 or 10 is provided, respectively. A dresser 14 for dressing the turntable 9 or ⑺ is provided at each adjacent turntable 9 or 10, respectively. Attach a polishing pad (abrasive cloth) or a polishing plate (fixed abrasive) to the top surface of the turntable 9 or 10. 13. Next, a description will be given of a thruster unit for transferring a semiconductor wafer between the transfer robot 8 and the top ring 12 as a transfer device. The thruster ^ 'is placed in the central part surrounded by two turntables 9, 10 and three transfer robots 6 and 8. The propulsion unit is of three types including two rotary conveying units and a linearly movable unit. Next, the three types of thruster units are described. will

1) Rotary Conveyor Type A. Figures 3 and 4 show the detailed results of Rotary Conveyor Type VIII. "Lang scale is applicable to Chinese National Standards < CNS) A4 Regulations; χ Norwegian G. € 0, 311 250 4340 8 9 A7 B7 V. Description of the invention (10) Plan view 'The 3rd figure is a plan view showing the rotary conveyor type A and the 4th figure is the front view of the eighth rotary conveyor device. As shown in Figures 3 and 4 There are two thrusters along the swing track of the top ring 12. Each of the thrusters 17 constitutes a special transfer mechanism for transferring semiconductive wafers into and out of the top ring η. Each of the thrusters 17 has a lift The propeller 17 can be vertically moved between a transfer position for transferring the semiconductor wafer to the ㈣U and a supply position for supplying the semiconductor wafer to the propeller 17. The propeller 17 is provided between the propeller 17 and the clean room 30A. The rotary transfer device 19 'is a transmission mechanism (refer to FIGS. Μ and 4) for transferring semiconductor wafers between the transfer robot 6 of the propeller 17 and the transfer robot 8. The rotary transfer device 19 can be rotated horizontally, And includes a guide And four stages 1516 for placing semiconductor wafers. The two stages 15 and 16 are placed at equal angular intervals on a circle with a specific radius from the rotation center of the rotary transfer port 19. The two stages 15 are used as The loading platform on which the semiconductor wafer to be ground is placed ', and the two platforms M are used as the loading platform on which the semiconductor wafer has been ground. The platform " and "may not be called a loading platform and a blanking platform. As shown in the first figure, the rotation of the rotary conveying device 19 can be centered on the conveying robot 6, the conveying robot 8, and the top ring 12 to reach the individual 19. And] position 6. In this specific example, the rotary conveying device 9 is rotated to 0 9 and 10, and the top ring 12 is arranged so that the distance between the rotary conveying device 19 ::: shaft and the rotating shafts of the turntables 9 and 10 are equal. Furthermore, the rotary transmission device 19 between the rotation axis of the transmission device 19 and the rotation axis ^ of the top ring 12 is located in the Zhonggu solid specification (21¾ ^ 10 311250 A7 A7 printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. (1) In the grinding chamber 30B. The cover 21 has an opening through which the semiconductor wafer can be carried in and out of the rotary conveying device 19, and a shutter 18 is provided at the opening. The semiconductor wafer enters and leaves the cover 21 The robot conveying path is provided with a cleaning nozzle 43 for supplying a cleaning liquid for cleaning the semiconductor wafer to the semiconductor wafer. A human cleaning nozzle 42 is provided above or adjacent to the propeller 17 for supplying the cleaning liquid after grinding. Go to the top ring 12 for cleaning. When the top J-cloth 12 is not performing the grinding process, the cleaning nozzle 42 for cleaning the top ring 12 can be used to prevent the top ring 12 from drying.

2) Rotary Conveyor Type B Figures 5 and 6 show the detailed structure of the rotary conveyer type b, and Figure 5 shows the plan view of the rotary conveyer type b and Figure 6 shows the rotary conveyer Front view of Type B. As shown in FIG. 1 'a rotary conveying device 19 is provided between the top ring 12 and the clean room 30A, and it constitutes a transmission mechanism for transferring semiconductor wafers between the top ring 12 and the transfer robot 6 and the transfer robot 8. . The rotary conveyor 19 can rotate 360 degrees horizontally and has a guide mechanism. The rotary transfer device 19 has four thrusters 15, 16 which constitute a wafer transfer mechanism for transferring semiconductor wafers into and out of the top ring '12. These four thrusters 15, 16 are mounted on the rotary conveyor 19 'so that they can rotate together with the rotary conveyor 19. The two propulsion machines 15 and two propulsion machines 16 are placed at equal angular intervals on the circumference of a specific radius from the center of rotation of the rotary conveyor 19. The two pushers 15 are used as loading advancers for placing semiconductor wafers to be ground, and the two pushers 16 are used as unloading advancers for ground semiconductor wafers. The propellers 15 and 16 may not be referred to as the charging propeller and the unloading propulsion respectively. -------- ^ --------- ^ (Please read the precautions on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) 11 311250: 434089

It has a lifting mechanism so that the propellers 15 and 16 can be transferred to the top ring 12 and are used to provide 15! Vertically move between 6 supply positions. For example, the propellers 15 and 16 are used to transfer semiconductor wafers. The rotation h of the rotary transfer device 19 shown in the figure is placed on the transfer I robot 6, the transfer robot 8 and the top ring 12 can be extended to each The thruster 15 and the position cover 21, the shutter 18, the cleaning nozzle for cleaning the semiconductor wafer, and the cleaning nozzle for cleaning the top ring have the same structure as that of the type A, and therefore descriptions thereof are omitted. 3) Linearly movable platform type: Figures 7 and 8 show the detailed structure diagram of the linearly movable platform type, of which Figure 7 shows the plan view of the linearly movable platform type and Figure 8 shows the linearly movable platform type Front view of the platform type. As shown by the first and eighth circles, two propulsion machines 17 are provided on the swing trajectory of the β landing ring 12 respectively. Each of the thrusters 17 constitutes a dedicated wafer transfer mechanism for transferring semiconductor wafers into and out of the top ring 12. Each thruster 17 has a raising mechanism so that the thruster 17 can move vertically between a transfer position for transferring semiconductor wafers into and out of the top ring 12 and a supply position for supplying semiconductor wafers into and out of the thruster 17. Between the thruster 17 and the clean room 30A, two transmission mechanisms 25 for transferring the semiconductor crystal bow between the thrust motor 17 and the transfer robot 6 and the transfer robot 8 are provided. The other transmission mechanism 25 provided on the turntable f is provided on the turntable i0t. The two transmission mechanisms 25 > each have a platform 15 and a platform 16. The platforms 15 and 16 are respectively located on the pusher 17 and can move linearly on their horizontal planes, respectively. Platform 15 This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 public love) 311250 A7 V. Description of the invention (13 is a loading platform for transporting semiconductor wafers to the top ring 12, while platform 16 is used The unloading platform for receiving semiconductor wafers from the top ring 12. The two transmission mechanisms can be linearly moved in and out of the top ring 12's transmission position and used for the transmission of the transfer robot 8 on the same line as the propeller 17 and the transmission robot 6 located in the center. Between positions. The transmission mechanism 25 has two linear tracks 26 placed at different heights. Each track 26 is used to support a platform 15 or 16 that can slide along the track. The two platforms of each transmission mechanism 25 and 5 16 is arranged so that it does not interfere with each other in the vertical direction and can move independently in the horizontal direction. Using a ball screw mechanism and a motor (not shown), the platforms 15 and 16 can slide along the guideway 26. With this configuration, when this When the two platforms I and 16 move, the positions of the two platforms 15 and 16 on the plane can be replaced with each other. The moving mechanism of the transmission mechanism 25 includes a positioning mechanism. When the platform 15 and the semiconductor wafer are placed, 16 moves to a position where the wafer can be transferred to the top ring, the propeller 17 located below each top ring 12 pushes the semiconductor wafer upward to each top ring 12. Conversely, when the platform 1516 on which the semiconductor wafer is not placed moves to the same Position, the propeller 17 receives the semiconductor wafer from each top ring and moves down to place the semiconductor wafer on the platforms 15 and M-. 'The transmission mechanism 25 is located inside the grinding chamber. It is used to define the grinding chamber 30B The partition wall has an opening for conveying the semiconductor wafer in and out of the transmission mechanism 25, and a shutter 18 is provided at the opening. A cleaning liquid supply for cleaning the semiconductor wafer is provided along a conveyance path of the robot in the semiconductor wafer in and out of the grinding chamber 30B. Cleaning nozzles for semiconductor wafers. Cleaning nozzles are provided above or adjacent to the propeller ^ for supplying cleaning liquid to the top paper ^ degree of standard compliance (CNS) A4 specifications (21〇χ 297) after grinding. 13 Order line 311250 4340 8 9 Printed by the consumer cooperative 14 B7 V. Description of the invention (14) Ring 12. When the top ring 12 is not performing the grinding process, the cleaning nozzle for cleaning the top ring 12 can be used The topless ring 12 is dried. Thereafter, the operation of the polishing apparatus having the above-mentioned structure will be described. The semiconductor wafer to be polished is stored in the wafer cassette 40, and the wafer cassette 40 is placed on the loading and unloading platform 1. In After inputting all the processing conditions of the grinding device, the 'grinding device starts automatic operation. In this grinding device, certain grinding procedures can be performed, and in the following description, when the number of semiconductor wafers counted from the uppermost position of the wafer cassette is When the number is odd, the odd semiconductor wafers are polished one by one on the turntable 9. Furthermore, when the number of semiconductor crystals counted from the uppermost position of the wafer cassette is even, the even semiconductor wafers are polished one by one on the turntable 10. . Hereinafter, the grinding procedure will be explained. In this example, regarding the thruster unit, the rotary conveyor type A will be mainly described, and the rotary conveyor type B will be described in parentheses. Furthermore, regarding the linearly movable platform type propeller, the rotary motion of the rotary conveying device 19 is replaced by the linear motion of the platform, and other movements are the same as those of the rotary conveying device types A and B. 1. Adjust the angular position of the loading-unloading platform 1 and rotate the crystal moon box 40 to face the direction in which the transfer robot 2 can transport semiconductor wafers in and out of the wafer box 40. 2. The angular position and height position of the transfer robot 2 are adjusted, and the semiconductor wafers in the wafer cassette are fixed by the robot arm of the transfer robot 2 in the second case, and the semiconductor wafer is taken out from the wafer cassette 40. In this case, the transfer robot 2 uses a robot arm for processing clean semiconductor wafers. _When the transfer robot 2 grasps the semiconductor wafer, it adjusts the size of the paper again to apply the Chinese standard (CNS) A4 specification (21Q χ Norwegian public -------- 311250 I —, —li: binding- -------- Line "C Please read the notes on the back of the page before filling in this page) A7 V. Description of the invention (15) Send the angular position and height position of the robot 2 'and transport the semiconductor wafer to the reverse装置 4。 Device 4. Day shot 4. The reversing device 4 clamps the semiconductor wafer transferred by the transfer robot 2, and after confirming that the semiconductor wafer is normally clamped, the semiconductor wafer is rotated 180 degrees so that the polishing surface thereof faces downward. 5. After confirming that the reversing device 4 has rotated normally 180 degrees, adjust the angular position and height position of the transfer robot 6. Thereafter, the chuck of the reversing device 4 is opened and the robot arm of the transfer robot 6 receives the semiconductor wafer from the reversing device 4. In this case, the transfer robot 6 uses a robot arm for processing clean semiconductor wafers. 6 'Adjust the angular position and height position of the transfer robot 6 again, and after confirming that the semiconductor wafer is not placed on the platform 15 (thruster 15) of the rotary transfer device 19, open the shutter 18 and transfer the semiconductor wafer to the platform 15 (Propeller 15) Line 7. After confirming that the semiconductor wafer is transferred to the platform 15 (Propeller 15), 'close the shutter 18 and rotate the rotary transfer device 19 by 90 or 270 degrees to make the platform 15 (propulsion Machine 5) moves to a position where the wafer can be transferred to the top-ring 12. 8. After confirming that the platform 15 (the propeller 15) has moved to a position where the top ring 12 can reach the platform 15, raise the propeller 17 to receive the semiconductor wafer from the platform 5 and raise it again to clamp the top Ring 12 (raise the propeller 15 to clamp the top ring 12). Thereafter, 'the platform on which the semiconductor wafer pusher 17 is placed is raised again, so that the rear surface of the semiconductor wafer contacts the top ring_12 crystal moon supporting surface' and at the same time, under the vacuum state, the top ring] 2 pieces of size 4¾ Miscellaneous (CNS) A4 size coffee x as public love) 311250 434089 B7 V. Description of the invention (16) 撺 Semiconductor wafer β 9. After confirming that the top ring 12 has supported the semiconductor wafer normally under vacuum, the machine will be propelled 17 down. After confirming that the propeller 17 has descended, the rotary conveyor 19 is rotated 90 degrees or 270 degrees in a direction opposite to the rotation direction. At this time, the unloading platform 16 (propeller 16) is placed at a position where the wafer is transferred from the top ring 12. Furthermore, at the same time, the rotary conveying device 丨 9 is rotated, the rotation shaft 33 for supporting the arm of the top ring 丨 is rotated, and the top ring 12 is moved to the grinding position on the turntable 9. 10. After confirming that the top ring 12 has moved to the grinding position, rotate the turntable 9 and the top ring 12 in the same direction with a predetermined degree of uncertainty, and supply a predetermined type and amount of polishing liquid from the polishing liquid supply nozzle 13 to the turntable. 9. Then "lower the top ring] 2" and after confirming that the top ring 12 has reached the turntable 9, the semiconductor wafer is pressed against the turntable 9 by the top ring 12 under a predetermined pressure, and the semiconductor wafer is ground for a predetermined time. The predetermined degree of obsession, type, quantity, pressure, time, etc. are all input in advance. When the semiconductor wafer is ground, the next semiconductor wafer to be ground is transferred in the same manner as described above, and the next semiconductor wafer is transferred to the loading platform 15 (propeller Η). (Ii) After the polishing of the semiconductor wafer is completed, the supply of the polishing liquid from the polishing liquid supply nozzle 13 is stopped, and the semiconductor wafer is grasped by the top ring 12 under vacuum. After confirming that the top ring 12 has grasped the semiconductor wafer in a vacuum condition, rotate the rotation shaft 33 for supporting the top ring arm u so that the top ring 12 can be moved so that the top ring 12 protrudes from the outer side of the turntable 9 half The position of each axis length "_ 12 'In the top ring 12 has been protruded from the outer side of the turntable 9 around half of the paper size compliant standard (CNS) weaving frame ⑽χ 29 _ ·: ·-·: equipment- ------- Order ----- t, f Please read the notes on the back before filling out this page} --- ·· n I nn, 16 311250 A7

Installation III Order 4340 8 9 A7 V. Description of the invention (18) After reaching the position that can be reached by the transfer robot 8, open the shutter 18 and adjust the angular position and height position of the transfer robot 8 so as to get from the platform 10 (propeller 16) Receiving a semiconductor wafer. 17. After the transfer robot 8 has received the semiconductor wafer from the platform 16 (thruster 16), 'close the shutter 18 and adjust the angular position and w-degree position of the transfer robot 8 to transfer the semiconductor wafer to the cleaning device 7, and at the same time 'The semiconductor wafer is held by the cleaning device 7.

18. After confirming that the cleaning device 7 has clamped the semiconductor wafer normally, a cleanup of the polished semiconductor wafer will be performed. D19. After the cleaning process of the cleaning device 7 is performed, the transfer robot 6 is moved to the transfer robot 6 to extend and clean the device. At the same time, the 'transfer robot 6 adjusts its angular position and height position and receives the semiconductor wafer β by a robot arm. In this situation, the transfer robot 6 is a robot arm that processes dirty semiconductor wafers. 20. Adjust the angular position and height position of the transfer robot 6 again, and transfer the semiconductor wafer to the reversing device 5, and simultaneously clamp the semiconductor wafer by the reversing device 5. 21. After it is determined that the semiconductor wafer is normally clamped by the reversing device 5, pure water is sprayed from a cleaning nozzle attached to the reversing device 5 to prevent the semiconductor wafer from drying. At the same time, the inverting device 5 is rotated 180 degrees so that the abrasive surface of the semiconductor wafer faces upward. 22. After confirming that the reversing device 5 has been rotated 80 degrees correctly, adjust the angular position and height position of the transfer robot 2 so as to receive the semiconductor wafer from the reversing device 5 with a mechanical arm, and at the same time, the reversing device 5 is turned on ^ The paper is full of Sir National Standards (CNS) A4—Specifications (210 χ 297 ^ ---- 311250 (please read the precautions on the back before filling in this page) ----- line. Printed by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 18 A7 B7 Printed by the Intellectual Property Cooperative of the Ministry of Economic Affairs. Printed by the Consumer Cooperative of the Ministry of Economic Affairs. 5. Description of the invention (19) Kai chuck mechanism. The transfer robot 2 uses a robot arm for processing dirty semiconductor wafers. 23. Adjust the angular position and height position of the transfer robot 2 and transport the semiconductor wafers to the cleaning device 3 'and at the same time, the semiconductor wafers are clamped by the cleaning device 3. 24. After confirming that the cleaning device 3 has correctly clamped the semiconductor wafer, perform a second cleaning of the polished semiconductor wafer. &Quot; 25. After completing the semiconductor wafer cleaning work performed by the cleaning device 3, 'adjust The angular position and height position of the robot 2 are used to receive the semiconductor wafer from the cleaning device 3 with a robot arm. In this situation, the 'transport robot 2 is a robot arm for processing dirty semiconductor wafers. 26. Adjust the conveyor Diffuser 2 Angular position and height position, and the semiconductor wafer is transferred to the wafer box 40, which is the original position of the ground semiconductor wafer before being ground. 27. Starting from the second semiconductor wafer 'starting from the top of the wafer box. The semiconductor wafers in even positions are transferred one by one in the same manner as described above-transferred to the turntable 10 for grinding, cleaning, and returning to the wafer cassette β, and then referring to Figures 9 and 10, the operation of the propeller unit of the rotary conveyor type A is explained. Figure 9 is a plan view showing the relationship between the top ring, the rotary conveyor, the propeller and the transfer robot, and figures 10A to 10D show the operation of the propeller. As shown in Figure 9, The semiconductor wafer 102 transferred to the top ring 12 is transferred by the transfer robot 6 from the direction indicated by the arrow 210 to the rotary transfer. (Please read the notes on the back before filling in this page)-> 6 _.-LINE. -III. This paper standard is applicable to the T family standard (CNSM4 specification coffee x 297 public) 19 311250 434089 A7 B7 V. Description of the invention ( 20) | Sending device] 9. The semiconductor wafer is placed on the shoulder of the pin οοί fixed to the rotary conveying device 19 by the robot arm 160. At this time, the wafer support area of the robot arm 160 and the pin 10 After contacting the semiconductor wafer i 02 at different positions around the outer side of the semiconductor wafer 102, the motor 200 is used to rotate the rotary conveyor 19 (refer to FIG. 4), and the semiconductor wafer 102 is moved to the top ring 12 Transfer position 215 and placed above the propeller "|. FIG. 10A shows a state where the semiconductor wafer 102 is placed on the rotary transfer device 19 and transferred to a position above the propeller 17. In Fig. 10a, the top ring 2 is placed on the rotary conveyor 19, and the propeller 17 is placed under the rotary conveyor 19. After the propeller 17 is lifted by the wind 105 Gao Yi pushes the semiconductor wafer 102 placed on the shoulder of the pin 101 upward, and transfers the semiconductor wafer 102 to the platform 10 of the thruster 17. At the same time, the position of the platform 106 contacting the semiconductor wafer 102 is different from the position of the pin iqi contacting the semiconductor wafer 102 'but the contact area between the platform 106 and the semiconductor wafer 102 and the robot arm 160 and the semiconductor wafer ι〇2 The location of contact is partially shared. FIG. 10B shows a state in which the cylinder 105 of the propeller 17 has been operated, and the semiconductor wafer 10 on the rotary conveying device 19 has been brought into contact with the platform 106 of the propeller 17. At this time, the center guide device 107 and the center guide device 108 of the propeller 17 are in contact with each other ', so that the platform and the platform 109 can be located at a fixed position. Figure 10C shows the operation of the air cylinder 105, pushing the semiconductor wafer 10 from the I rotary conveying device 19 upward, and the platform 109 contacting the top soil 12. The paper size is in accordance with the Chinese National Standard (CfJS) A4 specification (210 X 297 public love) ---------- 20 311250 A7 V. Description of the invention (21) One-step operation status "When the platform 106 receives the semiconductor wafer 102 from the rotary conveyor 19, the center guide The device 107 and the center guide device 108 are separated from each other, so the platform 106 can move freely in the horizontal direction. This center-aligning action can be performed by combining mutually perpendicular linear guides located in section A (refer to FIG. 10A). _ The guide device Ϊ10 of the platform 109 has a tapered surface, and when the top ring 12 contacts the guide device, the propeller I can be guided so that the top ring 12 is located in the guide device 110. That is, the thruster 17 has a function of adjusting the position of the thruster 17 in accordance with the top ring 12. In order to alleviate the impact caused by the contact between the platform 109 and the top ring 12, springs U1 and 112 are added, and an impact absorber 1 3 is added to adjust the contact position between the platform 109 and the top ring 12. Fig. 10D shows the state where the cylinder 114 is changed from the operating condition shown in Fig. 10c to the stage 10 on which the semiconductor wafer 102 is placed, and the semiconductor wafer 102 is in contact with the support surface of the top ring 12. Even in this case, the springs 111 and 112 have a function that the stage 106 will not push the semiconductor wafer 102 toward the top ring 12 when the pressure is greater than necessary. With the series of operations described above, the semiconductor wafer 102 on the rotary transfer device 19 can be transported to the top ring 12. In the example of transferring the semiconductor wafer 102 from the top ring 12 to the rotary conveyor 19, the thruster 17 is operated in the condition shown in FIG. 10c, and the semiconductor wafer 102 is moved from the top ring u in this condition. from. After the semiconductor wafer 102 is removed from the top ring 12, the thruster 17 operates in the order of FIG. 10B, FIG. 10A, which is a semiconductor wafer to which the Chinese National Standard (CNS) A4 specification is applied at this paper scale. X 297) 311 250 111 — 1 (Please read the precautions on the back before filling out this page) Order--Line-Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 21 4340 8 9 A7 _B7 ------- -------- V. Description of the invention (22) The sequence of operations supported by the top ring under vacuum is the opposite. In this method, a semiconductor wafer 102 supported by a top ring in a vacuum state is transported to a rotary transfer device 19. At this time, the semiconductor wafer 10 is placed on the pins 101 of the rotary transfer device 19. Thereafter, the rotary transfer device 19 is rotated to the wafer moving position by the motor 200, and then the semiconductor wafer ι2 is transferred by the robot arm 180 of the transfer robot 8 from the direction indicated by the arrow 211. Fig. 11 is a plan view showing a specific example modified by the polishing apparatus according to the present invention. In this specific example, two charging thrusters 15 'are placed along the diagonal of the rotary conveyor 19 and two discharging thrusters 16 are placed along the other diagonal of the rotary conveyor 19. Therefore, a total of four thrusters 15 and 16 are provided on the rotary conveyor 19. Figures 12 to 16 are flowcharts showing the polishing of a semiconductor wafer by the polishing apparatus shown in Figures 1 and 11. In more detail, FIGS. 12 to 16 show procedures for removing a semiconductor wafer from the cassette CS1, grinding, cleaning, and returning the wafer cassette CS1, and removing a semiconductor wafer from another cassette CS2, grinding, cleaning, and transferring the wafer. Procedure for returning to cassette CS2. In Figures 12 to 16, the cassette 40 is represented by CS1 and CS2, the transfer robots 2, 6, and 8 are represented by RBI, RB2, RB3, and RB4, and the cleaning devices 3 and 7 are represented by CL1-1, CL1-2, CL2-1 and CL2-2 are represented, while the reversing devices 4 and 5 are represented by T · ον1 and T. ov2, the turntables 9 and 10 are represented by TT1 and TT2, and the top ring 12 is According to TR1 and TR2, the loading platform (or thruster) of the rotary conveyor 19 is represented by the In-1L and In-2L tables. * (Please read the precautions on the back before filling out this page) Order-line · Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives The paper size applies to Chinese National Standard (CNS) A4 Regulations (210 X 297 mm) 22 311250 A7 B7 5. The description of the invention (23), and the unloading platform (or propeller) of the rotary conveying device 19 is represented by ίη_ 1UL and In-2UL. As shown in Figures 12 to 16, 'Semiconductor wafers are processed by the following path: wafer cassette (CS1) + transfer robot (RB1) + reversing device (T · 〇ν1) + transfer robot (RB2) today loading platform ( Or thruster) (In_1L) Jinding ring (TR1) + turntable (TT1) ~ ^ unloading platform (or thruster) (in_iuL) today transfer robot (RB3) + cleaning device (CL1-1) today transfer robot (RB2 ) + Reversing device (T · 0V2) + Transfer robot (RB1) + Cleaning device (LC2-1) Now transfer robot (RB1) > > Chip magazine (CS1). Ordering other semiconductor wafers will be processed by the following path: wafer hiding (CS2) ~ > transfer robot (rb 1) + reversing device (τ · ονι) today transfer robot (RB2) ~ &S; S material platform (or Thruster) (jn_2L) Jinding ring (TR2) ~ > Turntable (TT2) + unloading platform (or thruster) (jn_2UL); transfer robot (RB4) + cleaning device (CL1_2) _ > transfer robot (RB2) + Reversing device (T · ov2) + Transfer robot (RB1) Today cleaning device (LC2_2) + Transfer robot (RB1) · »Chip magazine (CS2). As shown in FIGS. 12 to 16, “of the four platforms of the rotary conveyor 19”, two of the platforms are used to supply the semiconductor wafer to be polished to the turntable 9 ′, and the remaining two platforms are used to supply the semiconductor wafer to be polished. The wafer provided to the turntable 10 ° is processed by the rotary transfer device 19, the transfer robot 6, the transfer robot 2, and the reversing devices 4, 5 as well as the wafer polished by the turntable. Fig. 17 is a plan view showing the arrangement of various elements of a polishing apparatus according to a second specific example of the present invention. As shown in Figure 17, according to the present invention, the paper is milled according to the present invention, and the standard is suitable for financial and family standards (Q x 2W). 311250 23 434089 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 ---- B7___ V. Description of the invention (24 ) The device includes two rotatable loading and unloading platforms for placing wafer cassettes 40 that contain a large number of semiconductor wafers. The unloading platform 1β places the transfer robot 2 with two robotic arms on the transfer robot 2 and can be placed separately. The position of the wafer cassette on its loading-unloading platform i. The transfer robot 2 has two robot arms, one of which is used only for processing clean semiconductor wafers, and the other is used only for processing dirty semiconductor wafers. Two cleaning devices 3 are placed on both sides of the transfer robot 2 for cleaning and drying the ground semiconductor wafer. The cleaning device 3 is placed where it can be accessed by the robot arm of the transfer robot 2. The two reversing devices 4 and 5 for receiving semiconductor wafers are placed symmetrically with the loading_unloading platform 丨 with the center axis 2c of the transfer robot 2 as the center axis and can be reached by the robot arm of the transfer robot 2. The reversing device 4 has a chuck mechanism for clamping a semiconductor wafer and a reversing mechanism for reversing the semiconductor wafer, and processes only a clean and dry semiconductor wafer. In addition to the chuck mechanism and the reversing mechanism, the reversing device 5 also has a washing mechanism for cleaning semiconductor wafers, and only processes discriminated semiconductor wafers. The arrangement of the transfer robot 6 with two mechanical arms enables the transfer robot 6 and the transfer robot 2 may be symmetrical to the connecting line L! Connecting the center 4c of the semiconductor wafer held by the reversing device 4 and the center 5c of the semiconductor wafer held by the reversing device 5. The transfer robot 6 is placed at a position where the robotic arms of the transfer robot 6 can extend and reverse the devices 4 and 5. The transfer robot 6 has two robotic arms, one of which is only used for processing clean semiconductor wafers, and the other is only used for processing semiconductor wafers 0: ---.---- Wide packaging ------ --Order --------- Line- '(Please read the precautions on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) 24 311250 A7 B7 V. Description of the invention (25) The two cleaning devices 7 for cleaning the polished semiconductor wafers are placed on both sides of the transfer robot 6. The cleaning procedure performed by each cleaning device 7 is different from the cleaning procedure performed by the cleaning device 3. The cleaning device 7 is placed where it can be reached by the robot arm of the transfer robot 6. The transfer robot 8 having a single robot arm is placed on the opposite side of the reversing devices 4 and 5 corresponding to the cleaning device 7. The transfer robot 8 is placed at a position where the robot arms of the transfer robot 8 can reach the cleaning device 7 respectively. Between these two transfer robots 8, a wafer station 20 having a washing mechanism is provided. In order to avoid splashing of washing water, a cover is provided so that the wafer station 20 is accommodated therein 'and has three shutters on its three sides β The Ministry of Economic Affairs Intellectual Property Bureau Employee Consumer Cooperative Printed Grinding Device The housing 30 in which the devices and components are housed. The casing 30 constitutes a closed structure. The interior of the housing 30 is divided into a plurality of compartments or chambers (including a grinding room and a clean room. The clean room 30a extends from the position of the two transfer robots 8 to the position of the loading_unloading platform 1. In cleaning From 30A to 30A, there is a partition pickling 31 at the adjacent transfer robot 8 while the grinding room 30B is located at the opposite side of the cleaning room 30A corresponding to the partition wall 31. In the grinding room 30B, there are two turntables 9 and 10. And two top rings 12 ', one of the top rings 12 holds the semiconductor wafer and presses the semiconductor wafer toward the turntable 9' and the other top ring ί; 2 holds the semiconductor wafer and presses the semiconductor wafer toward the turntable 10. In the grinding chamber 30B , Two rotary conveying devices 19 corresponding to the two top rings 12 are provided. Each of the rotary conveying devices 19 is provided with a loading propeller 15 for transferring semiconductor wafers to the top ring 12, and from the top ring] 2Semiconductor wafer to the unloading propeller 16. The loading propeller is suitable for the paper size of the standard CNS A4 (21G X 297 Kung Chu 1 --- 311250 25

V. Description of the invention (26) 15 and the unloading propulsion machine 16 are placed at equal angular intervals on the circumference of a specific radius from the rotation center of the rotary conveying device 19. The rotary conveying device 19 is provided with an assembly propeller 15 and an unloader propeller 16. That is, (please read the precautions on the back before filling out this page), and said that the propellers for the turntables 9 and 10 are prepared. 15 和 Unloading thruster 16. By rotating the guide platform for supporting each propeller, the loading propeller 15 and the unloading propeller 16 can be moved to the first position where the semiconductor wafer can be transferred into and out of the transfer robot 8, and the semiconductor wafer can be transferred into and out of the top. The second position of ring u. The charging propeller 15 is moved to the same position as the discharging propeller M, and at the same time, the discharging propeller 16 can be moved to the same position as the charging propeller 15. Therefore, the 'top ring u and the transfer robot 8 can simultaneously reach the charging propulsion machine and the discharging propulsion machine β, and further, the rotary conveying device 19 can be controlled independently. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Furthermore, the loading propeller 15 and the unloading propeller 16 have a lifting mechanism so that they can reach the top ring u and the transfer robot 8. The loading propeller 15 also has an automatic concentrating mechanism ', which is a mechanism that operates only when the loading propeller 15 is lifted up to reach the top ring 12 for transferring semiconductor wafers. In the area where the error of the women's clothing of the top ring is negligible, the loading propeller 15 is movable, and therefore the loading propeller 15 can transfer the semiconductor wafer to the top ring, and when the transfer robot 8 transfers the semiconductor wafer to When charging the propeller ^, the charging propeller I5 is at the lowest position and is fixed. The unloading propeller 16 has an automatic concentrating mechanism which operates only when the unloading propeller 16 is raised to reach the top ring 12 in order to receive a semiconductor wafer. In the area where the installation error of the top ring 12 is negligible, the unloading propeller 16 is movable, and therefore the unloading propeller 16 can be adjusted from the top ring to the standard year (CNSU4 specification (21 × 297 mm) Love) zti 311250 A7

27 311250 t Read the notes on the back and fill in this page

Install i I I 仃 line 4340 8 9 A7 B7 V. Description of the invention (28) On the loading-unloading platform. After all the processing conditions of the grinding device have been entered, the grinding device starts to operate automatically. In this polishing apparatus, some polishing procedures can be performed, and in the following description, if the number of semiconductor wafers from the uppermost position of the cassette is an odd number, the odd number of semiconductor wafers are polished one by one on the turntable 9. Furthermore, if the number of semiconductor wafers counted from the i-th position of the wafer E is an even number, the semiconductor wafers of this even number are polished on the turntable 10 one by one. Hereinafter, the grinding procedure will be explained. 1. Adjust the angular position of the loading-unloading platform i 'and rotate the wafer kun 40 so that it faces the transfer robot 2 to transport semiconductor wafers in and out of the wafer cassette. 2. Adjust the angular position and height position of the transfer robot 2, and hold the semiconductor wafer in the wafer cassette 40 by the robot arm of the transfer robot 2 under vacuum, and remove the semiconductor wafer from the wafer cassette 40. In this case, the transfer robot 2 uses a robot arm for processing clean semiconductor wafers. 3. When the transfer robot 2 grasps the semiconductor wafer, adjust the angular position and height position of the transfer robot 2 again, and transfer the semiconductor wafer to the reversing device 4. 4. The reversing device 4 clamps the semiconductor wafer transferred by the transfer robot 2 and, after confirming that the semiconductor wafer is normally clamped, rotates the semiconductor wafer 180 degrees so that the polishing surface faces downward. 5. After confirming that the reversing device 4 has rotated normally by 80 degrees, adjust the angular position and height position of the transfer robot 6. After that, the chuck of the reversing device I 4 is opened and the robot arm of the transfer robot 6 is moved from the reversing device 4 to the paper standard of China National Standards (CNS) A4⑽X 297 male & 28 311250 order A7 B7

5. Description of the invention (29) Receiving semiconductor wafers "In this situation, the transfer robot 6 is a robotic arm for processing clean semiconductor wafers. 6. Μ adjusts the position * height position of 11 people 6 and transfers the semiconductor wafer to wafer station 20. After confirming that the semiconductor wafer has been normally transferred to the wafer station 20, if the pusher 15 is in the first position and the semiconductor wafer is not placed on the loading pusher 15, the switch M is turned on and the semiconducting wafer is transferred to the loading Propulsion machine 15. 7. After confirming that the semiconductor wafer has been transferred to the loading advancer, turn the rotary transfer device 19 to move the loading advancement 胄 15 to the second position, and then transfer the wafer to the position of the top ring 12. 8. After confirming that the loading propeller 15 has been moved to the wafer transfer position, ′ push the shock propeller! 5 Raise to center around the outer side of the top ring 12. Thereafter, the platform on which the semiconductor wafer is placed is further raised up, and the rear surface of the semiconductor wafer is brought into contact with the wafer supporting surface of the top ring 12. At the same time, a shock absorber made of springs located at a lower position of the platform was operated to avoid damage to the semiconductor wafer. The charging propeller 15 is raised by a predetermined distance and stopped. Then, the semiconductor wafer is supported by the top ring 12 under a vacuum condition. Wisdom Wealth of the Ministry of Economic Affairs 4 Printed for employee consumer cooperatives 9. After confirming that the top ring 12 has normally supported the semiconductor wafer under vacuum, 'turn the rotation shaft 33 for supporting the top ring arm u, and move the top ring 12 to the turntable Grinding position on 9. 10. After confirming that the top ring 12 has been moved to the grinding position, rotate the turntable 9 that has been rotated at the planting speed at the predetermined speed and the top ring that has stopped in the same direction 'and move the predetermined type and amount of polishing liquid. It is supplied from the polishing I liquid supply nozzle 13 to the turntable 9. After that, the top ring 12 is lowered, i ^ paper size is suitable for financial standards x 297 public love)-29 311250 A7

4340 8 9 V. Description of the invention (30) After confirming that the top ring 12 has reached the turntable 9, use the top 12 to dust the semiconductor wafer toward the turn 9 'and grind the 4 conductor wafer under a predetermined pressure for a pre-time. The above predetermined speed, type, quantity, pressure, time, etc. are all entered in advance. After this grinding process, a further grinding process is carried out when different grinding fluids are supplied or when liquids containing no solid substances are supplied. 11. After the polishing of the semiconductor wafer is completed, the polishing liquid supply nozzle 13 stops supplying the polishing liquid, and the semiconductor wafer is grasped by the top ring 12 under a vacuum condition. Rotating the shaft 33 for swinging the arm of the top ring causes the top ring 12 to move to a position where the top ring 12 can protrude from the outer side of the turntable 9 by half the shaft length. 12. After confirming that the top ring 12 has been located in the above-mentioned second position, raise the unloading propeller 16 to clamp the top ring 12 and stop lifting the top ring 12. At this time, the stage on which the semiconductor wafer is placed in the unloading propeller 16 is set so as to maintain a certain interval between the semiconductor wafers held by the top ring 12. First, the top ring 12 turns off the vacuum, blows air or air, and pure water to remove the semiconductor wafer and transfers the semiconductor wafer to the unloading propeller 13. After confirming that the semiconductor wafer has been removed from the top ring 12, the lowering Unloading thruster 16. 14. Lowering the unloading propeller 16 'and after confirming that the semiconductor wafer has been placed on the unloading propeller 16, the rotary conveyor 19 is rotated to move the unloading propeller 6 to the first position. In this state, pure water is sprayed from the cleaning nozzle 0nsing ZZle) 42 to clean the top ring 12, and at the same time, a washing liquid is sprayed from the cleaning nozzle 43 to clean the semiconductor wafer. At this time, the semiconductor wafer to be polished has been transferred to the loading advancer 15 by the transfer robot 8. The scale of re-private paper is in accordance with China National Standard (CNS) A4 (21〇χ 297 311250. _ {in [J ί I .---------— It --- I 11 I f tjr-~ {Please read the notes on the back before filling out this page) Printed by the Consumers 'Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 30, ¢ .., ¢: Printed by the Consumers ’Cooperatives of the Intellectual Property of the Ministry of Economic Affairs Bureau A7 — B7 Five' Inventor (31), the charging propeller 15 is placed in the second position to supply pure water from the cleaning nozzle 44 to the semiconductor wafer to clean the pure water that has fallen thereon. Therefore, the grinding process is performed in the same manner as described above. 15. After completion, the top ring 12 and the semiconductor wafer are rinsing, opening the shutter 18 and the angle setting and height position of the transfer robot 8 so as to receive semiconductor wafers from the unloading propeller 16. After confirming that the loading propeller 15 has transferred the semiconductor wafer to the top ring 12, the rotary transfer device 19 is rotated to move the unloading propeller 16 to the second position. 16'After the transfer robot 8 receives the semiconductor wafer from the unloading thruster 6 ', the angular position and height position of the transfer robot S are adjusted to transfer the semiconductor wafer to the cleaning device 7', and here, the cleaning device 7 grips the semiconductor wafer. 17 'After confirming that the cleaning device 7 has properly held the semiconductor wafer, the secondary cleaning of the ground semiconductor wafer is ordered to clean both surfaces of the semiconductor wafer. 18. After performing the cleaning procedure of the cleaning device 7, the transfer robot .6 adjusts its angular position and height position and receives the semiconductor wafer by inserting a robotic arm into the cleaning device 7 from another opening. In this situation, the transfer robot 6 uses a robot arm that processes dirty semiconductor wafers. 19. Adjust the angular position and height position of the transfer robot 6 again, and transfer the semiconductor crystal moon to the reversing device 5'1 while holding the semiconductor wafer by the reversing device 5. 20. After confirming that the reversing device 5 has clamped the semiconductor wafer normally, purge pure water from the cleaning nozzle attached to the reversing device 5 to prevent the conductor from being installed. ---- Line (please read the precautions on the back before filling in this purchase) The paper standard weekly solid national standard (CNS) Al specifications ⑵G χ tear public love) 31 311 250 4340 8 9 Printed by h agency 311250 A7 B7 V. Description of the invention (32) Wafer drying. At the same time, the inverting device 5 is rotated 180 degrees so that the semiconductor wafer polishing surface faces upward. 21. After confirming that the reversing device 5 has been rotated 80 degrees correctly, adjust the angular position and height position of the transfer robot 2 to receive the semiconductor wafer from the reversing device 5 using a robot arm. At the same time, the reversing device 5 is turned on Collet mechanism. In this situation, the transfer robot 2 uses a robot arm for processing dirty semiconductor wafers. 22. Adjust the angular position and height position of the transfer robot 2 and transfer the semiconductor wafer to the cleaning device 3, and at the same time, the semiconductor wafer is clamped by the cleaning device 3. 23. After confirming that the cleaning device 3 has correctly gripped the semiconductor wafer, perform secondary cleaning of the polished semiconductor wafer. 24. After the semiconductor wafer cleaning work performed by the cleaning device 3 is completed ', adjust the angular position and height position of the transfer robot 2 so as to receive the semiconductor wafer from the cleaning device 3 with a robot arm. In this situation, the 'transfer robot 2 uses a robot arm for processing a clean semiconductor wafer. 25. Adjust the angular position and height position of the transfer robot 2 and transfer the semiconducting Zhao wafer to the wafer cassette 40. This is the original position of the polished semiconductor wafer before grinding. 26. Start from the second semiconductor wafer. The even-numbered semiconductor wafers counted from the uppermost layer of the cassette are transferred to the turntable 10 one by one in the same way as described above for grinding, cleaning and returning to the cassette. In this example, the moving direction of the top ring 12 and the moving direction of the turntable 9 In contrast β (CNS) A4 specification (21〇X 297 public love) ---- 32 IIJ 1'1 [IHIIIII II [III 1 (Please read the precautions on the back before filling this page) A7 A7 Ministry of Economic Affairs扃 Printed by the Consumer Consumers Co., Ltd. 5. Description of the invention (33 / In the above steps 1 to 26 and in the description of the first specific example, i · * " * »Τ * digital semiconducting chips are assigned to the turntable 9 The even-numbered semiconductor wafers are assigned to the turntable 10. However, software can be provided so that all semiconductor wafers in an entire cassette are assigned to the turntable 9 and the semiconductor wafers in the other cassette are assigned Assigned to the turntable 10. Furthermore, two or more wafers E may be assigned to them—the turntable, or the polishing device has a structure that can process semiconductor wafers one after another. Β Although the specific example shown in FIG. 18 is shown in FIG. The middle thruster is located on the rotary conveyor 19, but it can also be used in the same manner as the specific example shown in FIG. 4 to 'position the thruster below the rotary conveyor 19. Moreover, the rotary conveyor does not necessarily need to have a platform. And the rotary conveying device may have a shape in which the charging and unloading propellers are fixed on the rotating shaft. 'Figures 19 to 34 show the operation of the rotary conveying device according to another embodiment of the present invention. Illustrative diagrams. In Figures 19 to 34, the transfer robots 2, 6, and 8 are represented by Nos. 2, 3, and 4. The loading platform of the rotary conveyor 19 is the No. 1 ld platform and No. 2 The LD platform indicates' while the unloading platform of the rotary conveying device 19 is indicated by the No. 1 uld platform and the No. 2 ULD platform. 'Furthermore, the' top ring 12 is indicated by TR1 and TR2. The initial state shown in FIG. 19 Next, respectively Two loading platforms are placed at the locations TRi and TR2, and two unloading platforms are located adjacent to the robots No. 3 and No. 4, respectively. Each platform is configured as a loading platform for the first turntable, and The unloading platform of the first turntable and the loading platform for the second turntable are clockwise & Zhang Ruler Heart® (CNS) A4 Secret (2l0xlFi) along the rotation axis of the aforementioned rotary conveyor. ¥) ---—- 33 311250 — II ί Ϊ! I order ---- 1 --- «^, (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 434089 A7 _____B7__ 5. Description of the invention (34) Clock direction. Then, the operation of the rotary transfer device will be described with reference to Figs. 19 to 34. In step 1, 'the robot No. 2 is supported while holding the wafer 1 to be polished on the first turntable (TT1) as shown in FIG. 19'. In step 2, as shown in Fig. 20, the rotary conveyor is rotated 90 degrees clockwise from the direction shown in Fig. 19. Then the 'No. 2' robot transfers the wafer 1 to the No. 1 LD platform. In step 3, as shown in Fig. 21, the rotary conveyor returns to the state shown in Fig. 19. In step rope 4 ', as shown in Fig. 22, the thruster is raised to receive the wafer 1 from the platform and transfer it to TR1. Then, TR1 starts to grind wafer 1. The second robot holds the wafer 2 to be polished on the second turntable (TT2). In step 5, as shown in Fig. 23, the rotary conveyor is rotated 90 degrees counterclockwise from the direction shown in Fig. 22. Then, the second robot transfers the wafer 2 to the second LD platform. In step 6, as shown in FIG. 24, the rotary conveyance and conveying device returns to the state shown in FIG. 33 (= 19). Robot # 2 holds wafer 3 to be ground on the first turntable (TT1). In step 7, as shown in Fig. 25, the thruster is raised to receive wafer 2 from the platform and transfer it to TR2. Then, TR2 starts to grind the wafer 2 〇 In step 8 ′, as shown in FIG. 26, the rotary conveyor is rotated 90 ° clockwise from the direction shown in FIG. 25. Then, the No. 2 robot will be Ϊ-, --------------------------------------------------- (Please read the precautions on the back before filling in this page) This paper rule ffl Chinese National Standard (CNS) A4 specification (21〇X 297 public love) 34 311250 Ministry of Economic Affairs ^ -Printed by the employee consumer cooperative of the property bureau i-A7 B7 V. Description of the invention (35) Chip 3 transfer To LD platform 1. In step 9, as shown in Fig. 27, the rotary conveyor is rotated 180 degrees counterclockwise as shown in Fig. 26. Robot # 2 holds the wafer 4 to be ground on the second turntable (TT2). In step 10 ', as shown in FIG. 28, after the grinding at the first turntable (TT1) is performed, the thruster is raised to receive the polished wafer 1 from TR1 and transfer it to the ULD platform No. 1. The second robot transfers the wafer 4 to the second LD platform. In Step Han 11, 'as shown in FIG. 29', the rotary conveyor rotates 90 degrees clockwise from the state shown in FIG. 28. Then, the polished wafer is cleaned with pure water (deionized water) at this position 1 . Robot # 2 holds wafer 5 to be ground on the first turntable (TT1). In step 12 ', as shown in Figure 30, raise the thruster to receive wafer 3 from the platform and transfer it to TR1 »Then, TR1 begins to grind wafer 3» After cleaning, robot # 3 takes the polished from the ULD platform Wafer 1 (> In step 13, 'as shown in FIG. 31, the rotary conveyer rotates 90 degrees clockwise from the state shown in FIG. 30. Then, the robot No. 2 transfers the wafer 5 to No. 1 LD' Platform. In step 14, as shown in FIG. 32, after performing the grinding on the second turntable (TT 2), the two thrusters are 'lifted' to receive the polished wafer 2 from TR2 and transfer it to the ULD platform No. 2. In step 15, as shown in FIG. 33, the 'rotary transfer device is rotated 90 degrees clockwise from the state shown in FIG. 32. Then, the polished wafer 2 is cleaned with pure water (deionized water) at this position. The No. 2 robot is holding the -------------- Shang ...---------- line (Please read the precautions on the back before filling this page} This paper size applies Order the National Standard (CNS) A4 (210 X 297 mm) 35 311250 * '4340B9 A7 V. Description of the invention (36) The first turntable (TT1) Unpolished wafer 6. In step 16, raise the thruster to receive wafer 4 from the LD platform No. 2 and transfer it to TR2 1, then start grinding wafer 4. After cleaning, four No. 2 robot takes the polished wafer 2 from the ULD platform. As described above, according to the present invention, the time required to transfer an unground workpiece such as a semiconductor wafer to the top ring can be shortened, which greatly increases the number of workpieces that can be processed per unit time In addition, in the traditional grinding device, the production volume is increased by increasing the number of top rings and grinding the number of micro-workpieces at the same time. Therefore, the individual differences in the top ring caused by the addition of the top ring It cannot be ground uniformly. On the contrary, in the invention, by increasing the conveying speed of the workpiece, the throughput can be increased by reducing the number of top rings. Although the above has shown and described specific preferred embodiments of the present invention in detail, but It is obvious that various changes and amendments can be made without departing from the scope of the attached patent application. [Explanation of Symbols of Main Components] ------.------ ί Install i-* S (please first Read the note on the back Please fill in this page again) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 1 Loading-unloading platform 2 Conveying robot 3 Cleaning device 4 Reversing device 5 Reversing device 6 Conveying robot 7 Cleaning device 8 Conveying robot 9 Turntable 10 Turntable 11 Arm 12 Top ring 13 Nozzle 14 Finisher This paper size applies Chinese National Standard (CNS) A4 (210 X 297 Gongai 36 311250 A7 B7 V. 15 Description of the invention (37) Platform (Propulsion) 16 Platform ( Thruster) 17 Thruster 18 Switch 19 Rotary conveyor platform 21 Covering 25 Transmission mechanism 26 Steering 30 Case 30A Cleaning room 30B Grinding room 31 Partition wall 32 Rotatable shaft 33 Rotatable sleeve 40 Wafer cassette 42 Cleaning nozzle 43 Cleaning nozzle 44 Cleaning nozzle 101 Pin 102 Semiconductor wafer 105 Cylinder 106 Platform 107 Center guide 108 Center guide 109 Adjusting platform 110 Guide 111 Spring 112 Spring 113 Impact absorber 160 Robot 180 Robot 200 Motor I 1 I II- ------- Install -------- Order ------! (Please read the notes on the back before filling this page) .Ministry of Economic Affairs «-Printed by the Employees' Consumer Cooperatives of the Property Bureau This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 37 311250

Claims (1)

434089 AB B8 § ~ ----—- Applicable scope of patents i. A grinding device including: a plurality of turntables with grinding surfaces; {Please read the precautions on the back before filling this page) The ring is used to hold and press the workpiece against the aforementioned grinding surface to grind the workpiece: The rotary conveying device is located at a position where the top ring can reach and has a circle placed at a predetermined distance from the center of rotation of the rotary conveying device The rotary conveying device is used for holding the plurality of sections of the workpiece, and the propeller is used for conveying the workpiece between the rotary conveying device and the top ring. 2. The grinding device according to item i of the patent application, wherein each of the top rings can be moved at an angle along the rotation axis to the position of one of the aforementioned turntables and the position of the aforementioned rotary conveying device. --Line. 3. If the grinding device in the scope of the patent application, it also includes a special trimmer related to each of the aforementioned turntables. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 4. If the scope of patent application is the highest! The polishing device of the item, wherein the aforementioned section of the aforementioned rotary transfer device includes a loading platform for fixing a wafer to be polished and a discharging platform for holding a workpiece to be ground. 5. The grinding device according to item 1 of the patent application, wherein the aforementioned propeller is located below the aforementioned rotary conveyor. 6. The grinding device according to item 1 of the scope of patent application, wherein the aforementioned propeller is located above the aforementioned rotary conveying device. 7 * A grinding device, comprising: a plurality of turntables, each with a grinding surface; this paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 38 311250 6. Scope of patent application: A number of top rings are used to hold the workpiece and press the workpiece against the grinding surface to grind the workpiece; (please read the connotation on the back before filling this page). Corresponding to each of the aforementioned top rings and placed at positions reachable by the aforementioned top rings, and each having a plurality of areas for holding a workpiece placed on a circumference at a predetermined distance from the rotation center of the aforementioned rotary conveying device In the section, the aforementioned rotary conveying device can guide the aforementioned plurality of supports; and a thruster for transferring a workpiece between the aforementioned rotary conveying device and the aforementioned top ring. 8. The grinding device according to item 7 of the patent application, wherein each of the aforementioned top rings can be moved at an angle along the rotation axis to the position of one of the aforementioned turntables and the position of the aforementioned rotary conveying device. 9. If the grinding device in the scope of patent application No. 7 further includes a special shaper related to each of the aforementioned turntables. 10. The polishing device according to item 7 of the patent application scope, wherein the aforementioned section of the aforementioned rotary conveying device includes a loading level CI for holding the wafer to be polished and a blanking platform for supporting the workpiece to be ground. Printed by employees of the Intellectual Property Bureau of the Ministry of Economic Affairs on consumer cooperation 11. If the grinding device of the scope of patent application No. 7 is applied, the aforementioned propeller is located below the aforementioned rotary conveying device. 12. The grinding device according to item 7 of the patent application scope, wherein the aforementioned propeller is located above the aforementioned rotary conveying device. Π.—A kind of grinding device, comprising: a plurality of turntables each having a grinding surface; a plurality of top rings' which are used to hold a workpiece and press the workpiece toward the grinding; the paper size is applicable to the Chinese National Standard (CNS) A4 specification (21 〇X 297 public love 39 311250 434089 Grind the workpiece on the surface; and a rotary conveying device with a guide function for conveying the workpiece into and out of the top ring; month 1 wherein each of the top rings can be moved to the position of the turntable and the rotary conveying device position. 14 ′ As for the grinding device in the thirteenth of the scope of patent application, each of the top rings described above can be moved at an angle along a rotation axis between the position of the aforementioned turntable and the position of the aforementioned rotary conveying strike. 15. If the grinding device in the scope of application patent No. 13 includes a special shaper related to each of the aforementioned turntables. 16. The grinding device according to item 14 of the scope of patent application, wherein the distance between the rotation axis of the rotary conveying device i and the rotation axis of the top ring is equal.丨 7 'The grinding device according to item 13 of the patent application scope, wherein the rotary conveying device includes a first platform for transferring a workpiece to be ground on one of the plurality of turntables, and a conveyor for transferring the plurality of turntables. The second platform for grinding the workpiece on the other. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 18. If the grinding device of the scope of patent application is No. 17, the aforementioned first platform and the aforementioned second platform include a loading platform for fixing a workpiece to be ground and a stationary platform for fixing Unloading platform for grinding workpieces. 19. The grinding device of claim 17 in which the aforementioned rotary conveying device includes four platforms for supplying workpieces to the first turntable and the second turntable, and the aforementioned platform is configured for the loading of the first turntable. Loading platform, unloading platform for the first turntable, and loading flat paper size for the second turntable are applicable to China National Standard (CNS) A4 [Grid (210 X 297g g) " '" 40 311250 Scope of patent application The table and the discharge platform for the second turntable are arranged clockwise along the rotation axis of the aforementioned rotary conveying device. 20. A grinding device comprising: a turntable having a grinding surface; a top ring 'for holding the workpiece and pressing the workpiece against the grinding surface to grind the workpiece; * a robot for transferring the workpiece in the aforementioned grinding device; and linear The mobile platform is used to transfer the workpiece between the transfer position of the top ring and the transfer position of the robot; wherein the linearly movable platform is linearly moved between the two positions. 21. A grinding device comprising: a turntable having a grinding surface; a top ring for holding a workpiece and pressing the workpiece against the grinding surface to grind the workpiece; a conveying device for conveying between two positions in the aforementioned grinding device Workpiece; wherein the aforementioned conveying device includes at least two platforms for respectively holding the workpieces, and the at least two platforms are located at different heights, so the aforementioned platforms can move independently on individual horizontal planes. 22. If the grinding device of the scope of patent application 21, the propeller is located under the aforementioned conveying device. Α If the grinding equipment of the scope of patent application 21 of the aforementioned application, the above-mentioned conveying device includes the means for holding unground workpieces. Loading platform and used to hold the 3Ϊ1250 --- 1 --------- installation ------ 1 1 order --------- line (please read the note on the back first) Please fill in this page again) Printed by the Intellectual Property of the Ministry of Economic Affairs 4 Employees' Cooperatives This paper is printed in accordance with Chinese National Standard (CNS) A4 (2l0X 297 41 434089 A8 B.3 C3 m --------- --- if installed -------- order --------- line (please read the precautions on the back before filling this page) The paper size printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Applicable to China National Standard (CNS) A4 (210 X 297 mm) 42 311250