JP2001210748A - Semiconductor element, method of checking mounted state and connected state of semiconductor elements and electronic apparatus using semiconductor elements - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor element having no electric influence on semiconductor devices in the semiconductor element when the connected state or mounted state of the semiconductor element to a substrate is inspected by input/output of electric energies to the terminals of the semiconductor element. SOLUTION: Connection terminals 10a, 10b; 20a, 20b, disposed at the corners of a semiconductor element 1 are electrically connected to the semiconductor element inside by inner connecting means 11, 21, and the connection terminals 10a, 10b; 20a, 20b are electrically insulated from semiconductor devices of the semiconductor element 1 or an electric circuit 30 composed of semiconductor devices.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device having a plurality of external connection means for making an electrical connection to an external circuit, and a method for judging whether or not a semiconductor element is mounted on a substrate on which the semiconductor device is mounted. The present invention relates to a determination method for performing, a determination method for determining whether or not a connection state between a connection unit of a semiconductor element and a wiring unit of a substrate is good, and an electronic apparatus using the semiconductor element.

[0002]

2. Description of the Related Art In a semiconductor device mounted on a substrate,
In recent years, a large number of semiconductor elements having a connection terminal with an external circuit on the bottom surface of the semiconductor element for reducing the mounting area have been found. As a specific example, there is a semiconductor component housed in a ball grid array (BGA) type package in which hemispherical connection terminals are provided in a square ring on the bottom surface of the semiconductor component.

[0003] Further, as a method of determining the connection state of the connection means of the semiconductor element and the wiring means of the substrate on the board on which the semiconductor element is mounted, and the quality of the mounting state, a method of electrically connecting to the connection means of the semiconductor element is used. Measurement of the impedance between the wiring means of the board and the wiring means connected to the ground of the circuit provided on the board, and the mounting state is determined based on whether or not the measured impedance value is within an appropriate value range. And the quality of the connection between the connecting means of the semiconductor element and the wiring means of the substrate is determined.

Further, electronic devices using semiconductor components such as ROM, RAM, and CPU contained in a ball grid array (BGA) type package, for example, mobile phones have been put to practical use.

[0005]

However, the connection means of the semiconductor element is electrically connected to the internal circuit of the semiconductor element or is electrically insulated from the internal circuit of the semiconductor element and other connection means. Therefore, an electric signal input to one connection means cannot be output from another connection means without having an electric influence on an internal circuit of the semiconductor element.

Further, the above-mentioned conventional method for determining the mounting state of the connection means of the semiconductor element and the wiring means of the substrate on the board on which the semiconductor element is mounted and the quality of the connection state are described on the board on which the semiconductor element is mounted. In a method of providing an inspection land for confirming connection with a semiconductor element to an arbitrary connection terminal of the semiconductor element, and determining a pass / fail by measuring an electric property of a potential or impedance between the land and the ground, At the time of inspection, it is necessary to apply electric energy, for example, a DC potential, to any connection terminal of the semiconductor element, which damages the internal circuit of the semiconductor element, and as a result, the reliability of the semiconductor element is reduced by this inspection. There was a problem that it was lowered.

Also, electronic devices using semiconductor components such as ROMs, RAMs, and CPUs housed in a ball grid array (BGA) type package are subjected to an impact by dropping the electronic devices or the like, and the substrate is damaged. If it bends, the largest stress will be applied to the connection terminals located at the corners of the ball grid array (BGA) type package, and connection failures will occur from the connection terminals at the corners in order from the connection terminals, and the electronic device will not operate at all. There is a problem that it may not be performed.

SUMMARY OF THE INVENTION The present invention solves the above-described problems, and provides a semiconductor device which does not have a decrease in reliability by inspecting the connection state and the quality of the mounting state. If the method of judging the pass and fail of solder peeling of the connection terminal at the corner of the semiconductor element,
It is an object of the present invention to provide a semiconductor device operable in a connection failure occurrence state.

[0009]

In order to solve the above-mentioned problems, a semiconductor device according to the present invention comprises a plurality of external connection means for making an electrical connection with an external circuit, and at least one set of two or more external connection means. There are internal connection means for electrically connecting the external connection means inside the semiconductor element, and electric circuit means electrically connected to external connection means other than the external connection means electrically connected by the internal connection means. The external connection means electrically connected by the internal connection means,
The electric circuit means is electrically insulated from the electric circuit means.

With this configuration, it is possible to provide a semiconductor device that does not have a decrease in reliability due to inspection of the connection state and the mounting state.

Further, according to the present invention, there is provided a method for judging a mounted state of a semiconductor device, comprising: a plurality of external connection means for making an electrical connection to an external circuit; and at least one set of the two or more external connection means. Internal connection means for electrically connecting inside the element, and electric circuit means electrically connected to external connection means other than the external connection means electrically connected by the internal connection means; Wherein the external connection means electrically connected by the means is electrically insulated from the electric circuit means, and the external connection means electrically connected by the internal connection means Electrically connected to each other, each is electrically insulated, in a substrate provided with a plurality of wiring means that can be electrically connected from the outside, the semiconductor element is mounted on the substrate, the substrate Inspection of the presence or absence of electrical continuity between each of the wiring means is performed. When the electrical continuity is present, the mounting state of the semiconductor element is determined to be good, and when the electrical continuity is absent, the mounting state is determined to be defective. It is something to do.

With this configuration, it is possible to provide a method of determining the mounting state without lowering the reliability of the semiconductor element when determining the quality of the mounting state.

Further, in the method for determining the connection state of a semiconductor element according to the present invention, the mounted semiconductor element includes a plurality of external connection means for making an electrical connection to an external circuit, and at least one set of two or more external connection means. Internal connection means for electrically connecting the external connection means inside the semiconductor element, and electric circuit means electrically connected to external connection means other than the external connection means electrically connected by the internal connection means. Wherein the external connection means electrically connected by the internal connection means is electrically insulated from the electric circuit means. The semiconductor element provided with a plurality of wiring means electrically connected to each of the external connection means which are electrically connected, each of which is electrically insulated, and which can be electrically connected from the outside, is mounted and connected. The substrate is inspected for the presence or absence of electrical continuity between the respective wiring means provided on the substrate, and when there is electrical continuity, the connection state between the connection means of the semiconductor element and the wiring means of the substrate is good. And when there is no electrical continuity, it is determined that the connection between the connection means of the semiconductor element and the wiring means of the substrate is defective.

With this configuration, it is possible to provide a method of determining the connection state without lowering the reliability of the semiconductor element when determining the quality of the connection state.

Further, the electronic device of the present invention has at least one
An electronic device having a substrate mounted with a semiconductor element having a plurality of external connection means in a square ring on two bottom portions,
The semiconductor element includes a plurality of external connection means for making an electrical connection with an external circuit, and four of the external connection means arranged in each of the corners among the external connection means arranged in a square ring. The substrate has two internal connection means for electrically connecting two inside each other, and the substrate has a detection means for detecting an input voltage and an external connection connected by the internal connection means of all the semiconductor elements. At least one first wiring means for electrically connecting the connection means in series;
Second wiring means for connecting one of the serially connected external connection means to the ground of a circuit on the substrate; and third wiring means for connecting the other of the serially connected external connection means to the detection means. A pull-up means for applying a potential via a resistor connected to the third wiring means; and a control means for controlling the entire apparatus in accordance with the potential detected by the detection means; When the potential detected in step (1) is not at the ground level, the operation of the entire device is controlled so as to change to the control state when the connection failure of the semiconductor element occurs.

With this configuration, it is possible to provide a semiconductor device that can operate as a connection failure when a connection terminal at a corner of a semiconductor element has been peeled off by solder.

The electronic device of the present invention has at least one
An electronic device having a substrate mounted with a semiconductor element having a plurality of external connection means in a square ring on two bottom portions,
The semiconductor element includes a plurality of external connection means for making an electrical connection with an external circuit, and four of the external connection means arranged in each of the corners among the external connection means arranged in a square ring. The substrate has two internal connection means for electrically connecting two inside each other, and the substrate has a detection means for detecting an input voltage and an external connection connected by the internal connection means of all the semiconductor elements. At least one first wiring means for electrically connecting the connection means in series;
A second wiring means for connecting one of the serially connected external connection means to a power supply of a circuit on a substrate; and a third wiring means for connecting the other of the serially connected external connection means to the detection means.
Wiring means, pull-down means connected to ground via a resistor connected to the third wiring means, and control means for controlling the entire apparatus according to the potential detected by the detection means, When the potential detected by the detection means is not at the power supply level, the operation of the entire device is controlled to be changed to a control state at the time of occurrence of a connection failure of the semiconductor element.

With this configuration, it is possible to provide an electronic device that can operate as a connection failure occurrence state when solder peeling of a connection terminal at a corner portion of a semiconductor element occurs.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS According to a first aspect of the present invention, a plurality of external connection means for making an electrical connection to an external circuit and at least one set of two or more external connection means are provided by a semiconductor. An internal connection means for electrically connecting inside the element, and an electric circuit means electrically connected to external connection means other than the external connection means electrically connected by the internal connection means; The external connection means electrically connected to the electric circuit means is electrically insulated from the electric circuit means of the semiconductor element without applying electric energy to the electric circuit means of the semiconductor element. The electric energy can be supplied to one of the external connection means connected to the external connection means, and the electric energy can be output from the external connection means electrically connected to the other internal connection means. It is having an effect.

According to a second aspect of the present invention, in the first aspect of the present invention, the external connection in which the physical distance between the two external connection means is the largest among all the external connection means of the semiconductor element. Means or at least one of the external connection means in the vicinity thereof is electrically connected to another external connection means by an internal connection means, and between the external connection means electrically connected by the internal connection means. When inspecting the mounting state shift due to the electrical continuity of the connected wiring means on the substrate side, when the semiconductor element is mounted so as to rotate from a proper position, the external connection means of the semiconductor element and Since the displacement of the connection land portion of the wiring means of the board corresponding thereto appears greatly, it is possible to determine whether the component displacement is below the allowable value only by inspecting the portion. To.

According to a third aspect of the present invention, in accordance with the first aspect of the present invention, there is provided a semiconductor device having a plurality of external connection means in a rectangular shape on a bottom surface, wherein the semiconductor device is arranged in a rectangular shape. In the external connection means, at least one external connection means disposed on the outer periphery and at or near a corner portion is electrically connected to another external connection means by an internal connection means, and the semiconductor element is used. The dropped device causes an operation failure due to the peeling of the solder between the connection part of the semiconductor element and the board due to an impact such as dropping, and the connection between the external connection means of the semiconductor element and the corresponding wiring means of the board to identify the location. When inspecting the condition, the outer periphery and the corners or the corners of the external connection means arranged in a square ring where the solder is most likely to be peeled off by the impact of a drop or the like on the semiconductor element. Checking the status by electrical conduction of the external connection means and interconnection means of the substrate corresponding to that of the semiconductor elements arranged in the vicinity is possible, such an action identified capable of efficiently failure location.

According to a fourth aspect of the present invention, a plurality of external connection means for making an electrical connection with an external circuit,
An internal connection means for electrically connecting at least one set of two or more external connection means inside the semiconductor element, and an external connection means other than the external connection means electrically connected by the internal connection means. External connection means having electrical circuit means, and electrically connected by internal connection means,
A semiconductor element characterized by being electrically insulated from the electric circuit means, and electrically connected to each of the external connection means electrically connected by the internal connection means, each being electrically insulated and On a substrate provided with a plurality of wiring means that can be electrically connected from, a semiconductor element is mounted on the substrate,
The presence or absence of electrical continuity between the respective wiring means provided on the substrate is inspected, and when the electrical continuity is present, the mounting state of the semiconductor element is good, and when there is no electrical continuity, the mounting state is defective. The determination is performed, and has the effect that the quality of the mounted state can be determined without applying electric energy to the internal circuit means of the semiconductor element.

According to a fifth aspect of the present invention, in the semiconductor device to be mounted, a plurality of external connection means for making an electrical connection with an external circuit and at least one set of two or more external connection means are provided. Internal connection means for electrically connecting the means inside the semiconductor element, and electric circuit means electrically connected to external connection means other than the external connection means electrically connected by the internal connection means; The external connection means electrically connected by the means is a semiconductor element characterized by being electrically insulated from the electric circuit means, and for each external connection means electrically connected by the internal connection means. A semiconductor element provided with a plurality of wiring means which are electrically connected and electrically insulated from each other and which can be electrically connected from the outside is mounted on and connected to each other between the respective wiring means provided on the substrate. of The presence or absence of gas conduction is inspected. When the electric conduction is present, the connection state between the connection means of the semiconductor element and the wiring means of the substrate is good, and when the electric conduction is not present, the connection means of the semiconductor element and the wiring means of the substrate Is determined to be defective, and has the effect of making it possible to determine the quality of the connection state without applying electric energy to the internal circuit means of the semiconductor element.

Further, it is possible to provide a method of determining the connection state without lowering the reliability of the semiconductor element when determining the quality of the connection state.

According to a sixth aspect of the present invention, there is provided an electronic apparatus having a substrate on which at least one bottom surface is provided with a semiconductor element having a plurality of external connection means in a rectangular ring shape, Is a semiconductor device comprising a plurality of external connection means for making an electrical connection with an external circuit, and two external connection means arranged at each corner of the external connection means arranged in a square ring. The substrate has two internal connection means for electrically connecting inside, and the substrate electrically connects in series the detection means for detecting the input voltage and the external connection means connected by the internal connection means of all the semiconductor elements. At least one first wiring means, one of the external connection means connected in series, the second wiring means connecting one of the external connection means to the ground of the circuit on the substrate, and the other of the external connection means connected in series. For detection means A third wiring means, a pull-up means for applying a potential via a resistor connected to the third wiring means, and a control means for controlling the entire apparatus according to the potential detected by the detection means. When the potential detected by the detecting means is not at the ground level, the operation of the entire device is controlled to be changed to the control state at the time of occurrence of a connection failure of the semiconductor element, and the connection of the corner part of the semiconductor element is controlled. When the solder is peeled off from the terminal, the terminal operates as a connection failure occurrence state.

According to a seventh aspect of the present invention, there is provided an electronic apparatus having a substrate on which a semiconductor element having a plurality of external connection means in a rectangular ring is mounted on at least one bottom surface, Is a semiconductor device comprising a plurality of external connection means for making an electrical connection with an external circuit, and two external connection means arranged at each corner of the external connection means arranged in a square ring. The substrate has two internal connection means for electrically connecting inside, and the substrate electrically connects in series the detection means for detecting the input voltage and the external connection means connected by the internal connection means of all the semiconductor elements. At least one first wiring means, one of the external connection means connected in series, a second wiring means for connecting one of the external connection means to the power supply of the circuit on the substrate, and the other of the external connection means connected in series. Connect to detection means A third wiring means, a pull-down means connected to the ground via a resistor connected to the third wiring means, and a control means for controlling the entire apparatus in accordance with the potential detected by the detection means. When the potential detected by the detecting means is not at the power supply level, the operation of the entire device is controlled to be changed to a control state at the time of occurrence of a connection failure of the semiconductor element, and a connection terminal at a corner portion of the semiconductor element is provided. Has the effect of operating as a connection failure occurrence state when solder peeling occurs.

(First Embodiment) FIG. 1 is a plan view of a semiconductor device according to a first embodiment of the present invention. In FIG. 1, reference numeral 1 denotes a semiconductor element of the present invention,
It has connection terminals as external connection means arranged in a square ring for connection to a total of 80 external circuits with 12 sides and 10 inner circumferences. 10a, 10b, 20a, and 20b are connection terminals arranged at each corner of the connection terminals arranged in a square ring of the semiconductor element 1. Reference numeral 11 denotes an internal connection means for connecting the connection terminals 10a and 10b inside the semiconductor element 1. Similarly, reference numeral 21 denotes internal connection means for connecting the connection terminals 20a and 20b inside the semiconductor element 1. Reference numeral 30 denotes an electric circuit which determines the electric operation of the semiconductor element 1, which is constituted by a semiconductor device or an electric circuit using the semiconductor device, and includes 10a, 10b, 20a, and 20b among connection terminals which are external connection means.
Are electrically connected to other connection terminals.

Next, the operation of the semiconductor device configured as described above will be described. Connection terminal 1 of semiconductor element 1
When electric energy, for example, a DC potential, is applied to Oa, the electric energy is output from the connection terminal 10b through the internal connection means 11. Similarly, the semiconductor element 1
When electrical energy, for example, a DC potential, is applied to the connection terminal 20a, the electrical energy is output from the connection terminal 20b through the internal connection means 21. At this time, the connection terminals 10a, 10b, 20a, 20b and the internal connection means 11, 21 are electrically separated from the electric circuit 30 of the semiconductor element 1, and the connection terminals 10a,
The electric energy added from 0a does not affect the electric circuit 30.

FIG. 2 is a bottom view of the semiconductor device according to the first embodiment of the present invention, and FIG. 3 is a side view of the semiconductor device according to the first embodiment of the present invention. As shown in FIGS. 2 and 3, the semiconductor element 1 is a square ring-shaped external connection means for connecting to a total of 80 external circuits of 12 outer sides and 10 inner sides on the bottom surface of the component. Connection terminals 10a, 10b, 20 having certain connection terminals and connected to internal connection means
Reference numerals a and 20b are arranged at respective corners of the connection terminals arranged in a square ring of the semiconductor element 1.

As shown in FIG. 2, in a semiconductor component housed in a ball grid array (BGA) type package in which hemispherical connection terminals are provided in a square ring on the bottom surface of the semiconductor component as shown in FIG. Is arranged on a substrate provided with connection terminals for external connection, and a circuit land on the wafer and a wiring land connected to the connection terminal of the substrate are connected by wires. However, the internal connection means in the present embodiment is either a method of directly connecting the connection terminal of each corner of the semiconductor element with a wiring pattern on a substrate on which a wafer is mounted, or a method of connecting a connection terminal of each corner of the semiconductor element. The lands are connected by wires.

(Embodiment 2) FIG. 4 is a schematic configuration diagram of an inspection apparatus for judging a mounting state and a connection state of a semiconductor device according to Embodiment 2 of the present invention. Hereinafter, the operation will be described with reference to FIG.

In FIG. 4, reference numeral 1 denotes a semiconductor element having a terminal for external connection provided on the bottom surface, and has an external connection terminal on the bottom surface of the component. Reference numerals 10a, 10b, 20a, and 20b denote external connection terminals provided on the bottom surface of the semiconductor element 1 for use in the inspection of the present invention. Reference numeral 200 denotes a printed circuit board on which the semiconductor element 1 is mounted, and has a wiring pattern of each circuit including a wiring pattern for connection corresponding to an external connection terminal provided on the bottom surface of the semiconductor element 1. 210
a, 210b, 220a, 220b are printed circuit boards 20
Of the wiring patterns connected to the external connection terminals of the semiconductor element 1 provided on the semiconductor chip 1, the connection terminals 10a, 10b, and 2 are used for the inspection of the semiconductor element described in the first embodiment.
0a, 20b are wiring patterns for inspection,
It has lands for connecting to the connection terminals 10a, 10b, 20a, and 20b, and lands that allow external electrical connection at the time of inspection after mounting the semiconductor element 1. Three
Reference numeral 00 denotes an inspection device for inspecting DC conduction. 30
1a and 301b are input units of the inspection device 300. When the input portions 301a and 301b of the inspection device 300 are brought into contact with the object to be inspected, if the portion connected between the input portions 301a and 301b conducts DC, the inspection device 300
Indicates that a portion connected between the input units 301a and 301b is DC-conductive.

Although the semiconductor element 1 is shown with the number of connection terminals changed for simplicity, it has the same configuration as the semiconductor element of the first embodiment, and the connection elements arranged in a square ring on the bottom surface of the component are shown. Of the terminals, the connection terminals 10a, 10b, 20a, and 20b disposed at the corners are electrically connected to each other by the internal connection means inside the semiconductor element 1 in which the connection terminals 10a and 10b and the connection terminals 20a and 20b are both connected. And connection terminals 10a, 10b, 20a,
20b is electrically separated from the electric circuit inside the semiconductor element 1.

Next, a method of performing an inspection using the inspection apparatus 300 after the semiconductor element 1 is mounted on the printed circuit board 200 will be described. When performing inspection after mounting the semiconductor element 1 on the printed circuit board 200, the input unit 301 of the inspection apparatus 300
a and 301b are sequentially connected to the wiring pattern 210a, and the other is connected to the inspection land portion of the inspection wiring pattern 210b, and a continuity test is performed. Similarly, one of the input units 301a and 301b of the inspection apparatus 300 is connected to the wiring pattern 220a.
Then, the other is connected to the inspection land portion of the inspection wiring pattern 220b, and a continuity test is performed. 210a and 210b,
When DC conduction occurs between 220a and 220b, it is determined that semiconductor element 100 has been correctly mounted and connected to printed circuit board 200.

As shown in the above embodiment, the connection terminals for inspection are inspected from among the connection terminals arranged in a square ring, at the outer peripheral corners where the physical distance connecting the connection terminals is the largest. If the semiconductor device is mounted vertically, horizontally, or rotationally displaced by selecting the terminal for inspection, the connection terminal at each corner for inspection is most affected by the deviation, so the terminal Inspection makes it possible to easily determine whether or not the deviation of the mounting state is equal to or less than an appropriate value. In addition, even when the solder connecting the semiconductor element to the substrate is peeled off due to a drop of the device or the like, and a connection failure occurs, the connection terminals for inspection are arranged at each corner of the outer periphery of the connection terminals arranged in a square ring. By selecting the connection terminal as the inspection terminal, the corresponding terminal becomes the part that receives the largest stress due to the bending of the board that occurs when the equipment falls, and the connection failure due to the peeling of the solder is likely to occur. By confirming the connection state of the terminals, it is easy to identify the place where the solder has peeled off.

(Embodiment 3) FIG. 5 is a circuit diagram of an inspection apparatus for judging a mounting state and a connection state of a semiconductor device according to Embodiment 3 of the present invention. Hereinafter, the operation will be described with reference to FIG.

In FIG. 5, reference numeral 500 denotes a control unit for controlling the entire apparatus. 501, 502, 5 of the control unit 500
Reference numerals 03 and 504 denote terminals for testing the semiconductor element described in the first embodiment.
3 and 504 are connected inside the component. An input port 509 of the control unit 500 detects whether the potential of the input signal is Hi, that is, the power supply voltage level or Low, that is, the ground level. Reference numeral 600 denotes a memory in which a program for determining an operation of the apparatus is stored. Reference numerals 601, 602, 603, and 604 of the memory 600 are terminals for testing the semiconductor device described in the first embodiment, and 601, 602, 603, and 604 are connected inside the component. 700 is a pull-up resistor,
One is connected to a power supply and the other is a terminal 501 of the control unit 500.
And the input port 509. Reference numeral 800 denotes a display unit, which performs display according to control from the control unit 500.
Note that, as shown in FIG.
0, the display unit 800 is connected to each other,
Although it is connected to a ground or the like, a detailed description is omitted.

FIG. 6 is a flowchart showing a flow of processing in the inspection device for determining the mounting state and the connection state of the semiconductor device according to the third embodiment of the present invention.

The operation of the circuit shown in FIG. 5 will be described below with reference to the flowchart shown in FIG.

The inspection terminals of the control unit 500 and the memory 600 include terminals 504 and 603, and terminals 602 and 60.
4. The terminal 502 and the terminal 601 are respectively connected by external wiring. The terminal 504 is connected to the ground, and the terminal 501 is connected to the pull-up resistor 700 and the input port 509 by external wiring. Due to the above connection, a low level (ground level) is input to the normal input port 509. Control unit 500
Determines that the input port 509 is in the normal state when the input port 509 is at the low level, shifts from step a to step b, and controls the entire apparatus in accordance with the normal state program stored in the memory 600. Do.

Terminals 501, 502, 503, 504, 6
01, 602, 603, and 604, and external wiring is cut, that is, when the soldering part of the component is peeled off and the connection between the terminal of the component and the wiring pattern of the board becomes defective, the input is performed. The signal input to port 509 is Hi, that is, the power supply voltage level. Control unit 5
When the input port 509 becomes Hi (power supply voltage level), it is determined that a connection failure has occurred in the connection between the terminal of the component and the wiring pattern on the board.
Then, control of an abnormal state is started, and control of the entire apparatus is performed according to a program for an abnormal state stored in the memory 600. In the example of the control of the abnormal state, as shown in step d, the control unit 500 displays the abnormal state, that is, the occurrence of the connection failure of the component on the display unit 800, and notifies the user of the occurrence of the connection failure of the component. I do.

Terminals 501, 502, 503, 504, 6
As described in the second embodiment, the desirable arrangement of the components 01, 602, 603, and 604 is as follows. In the components housed in the BGA package, the terminals for inspection are selected from the connection terminals arranged in a square ring. By selecting the connection terminal at each corner of the outer periphery as a terminal for inspection,
This is the part that receives the greatest stress due to the deflection of the board that occurs when the equipment falls, and the connection failure due to the peeling of the solder is likely to occur, so that the abnormal state can be detected more effectively.

In the above embodiment, the terminal 503 is connected to the ground, the terminal 501 is connected to the pull-up resistor connected to the power supply terminal, and when Hi is input to the input port, an abnormal state is determined. As described above, a method is also possible in which the terminal 503 is connected to a power supply and the terminal 503 is connected to a pull-down resistor connected to the ground, and when a Low is input to the input port is determined as an abnormal state.

The operation when the semiconductor device described in the first embodiment is used for a mobile phone will be described. In recent years, mobile phones have been reduced in size, and semiconductor components housed in a BGA package, such as a control CPU, ROM, and RAM, are often used. Mobile phones are often dropped because they are carried around.
Many failures due to solder peeling of BGA package components have occurred. In order to improve the reliability of the mobile phone, the manufacturer has proposed a CPU, ROM, R
The failure attributable to solder peeling of the components of the BGA package is reduced by, for example, changing the terminals at the corners of the components of the BGA package such as AM to non-connect terminals that do not affect the operation of the components. However, when the device repeatedly drops and the solder peeling failure occurs beyond the non-connect terminal, the mobile phone cannot operate at all, the board is repaired by replacing the board, and the telephone directory registered by the user is used. It is difficult to transfer such information to a mobile phone after repair. On the other hand, when the present invention is applied to a mobile phone, a CPU in which solder peeling of the mobile phone is likely to occur.
When a failure occurs in a terminal of a corner portion of a BGA package component such as a ROM, a RAM, or the like, a message notifying the occurrence of the failure is output to the display unit to notify the user. When the user requests a repair here, when the repair is performed by replacing the board, the failed board is replaced by the CPU or RO.
Since the operation of M, RAM, etc. is possible, it is possible to read the information such as the telephone directory from the old board and write it on the replacement board, and to obtain the repaired product without losing the information such as the telephone directory. Becomes possible.

[0045]

As described above, according to the present invention, in a semiconductor device, at least one set of two external connection terminals is configured to be electrically conductive, and these external connection terminals are
By being configured to be electrically insulated from the semiconductor device inside the semiconductor element and the electric circuit using the semiconductor device, the electric energy is not applied to the semiconductor device inside the semiconductor element and the electric circuit using the semiconductor device. It is possible to input and output electrical energy from an external connection terminal that is electrically insulated from the semiconductor device inside the semiconductor element or an electric circuit using the semiconductor device. This has the effect of improving the safety of the element.

Further, an external connection terminal electrically insulated from the semiconductor device inside the semiconductor element and an electric circuit using the semiconductor device and connected to each other is connected to two external connection terminals among all the external connection terminals of the semiconductor element. By arranging the connection terminals at the location where the physical distance is the largest, the external connection terminals which are electrically insulated from the semiconductor device inside the semiconductor element and the electric circuit using the semiconductor device and connected to each other are mounted. By inspecting whether it is connected to the land at the predetermined position on the board, it is possible to inspect the mounting state by judging whether the corresponding part is mounted at the correct position, and the workability of the inspection of the mounting state Is improved.

Further, in the case of a semiconductor device having a rectangular ring-shaped external connection terminal on the bottom surface of the component, an external device electrically insulated from the semiconductor device inside the semiconductor device and an electric circuit using the semiconductor device and connected to each other. By arranging the connection terminals at the corners, if a failure such as dropping or the like causes the semiconductor element to be solder-peeled on the board on which the semiconductor component is mounted, there is a great risk of solder peeling at the corner part. By inspecting whether the external connection terminal, which is electrically insulated from the internal semiconductor device and the electric circuit using the semiconductor device and connected to each other, is connected to the land at the predetermined position on the board, By judging whether or not solder peeling has occurred, it is possible to inspect for solder peeling, improving the workability of the inspection. It has the effect of.

In the semiconductor device, at least one set of two external connection terminals is configured to be electrically conductive, and these external connection terminals are connected to a semiconductor device inside the semiconductor device or an electric circuit using the semiconductor device. On a substrate on which a semiconductor element configured to be electrically insulated is mounted, a semiconductor device inside the semiconductor element provided on the substrate side and an electric circuit using the semiconductor device are electrically insulated and connected to each other. The electrical continuity test between the lands connected to the external connection terminals is used to determine whether or not the semiconductor element is correctly mounted, so that there is no danger of causing electrical damage to the semiconductor element during the test. This has the effect that highly reliable mounting inspection becomes possible.

In the semiconductor device, at least one set of two external connection terminals is configured to be electrically conductive, and these external connection terminals are connected to a semiconductor device inside the semiconductor device or an electric circuit using the semiconductor device. On a substrate on which a semiconductor element configured to be electrically insulated is mounted, a semiconductor device inside the semiconductor element provided on the substrate side and an electric circuit using the semiconductor device are electrically insulated and connected to each other. The electrical continuity test between the lands connected to the external connection terminals may determine whether or not the soldered portion of the semiconductor element is normal, which may cause electrical damage to the semiconductor element during the test. There is an effect that a highly reliable connection inspection without any defect can be performed.

In the semiconductor device, at least one set of two external connection terminals provided at a corner portion is configured to be electrically conductive, and these external connection terminals are
In a semiconductor device including a substrate on which a semiconductor element configured to be electrically insulated from a semiconductor device inside the semiconductor element or an electric circuit using the semiconductor device is mounted, the inside of the semiconductor element provided on the substrate side When the external connection terminal electrically insulated from the semiconductor device or the electric circuit using the semiconductor device and the external connection terminal connected to each other has a connection failure with the land of the substrate, the semiconductor device is brought into a control state at the time of the connection failure. By performing the control, it is possible to notify the user of the occurrence of the connection failure before the entire device causes a fatal operation failure due to the connection failure, and the repair workability is improved.

[Brief description of the drawings]

FIG. 1 is a plan view of a semiconductor device according to a first embodiment of the present invention;

FIG. 2 is a bottom view of the semiconductor device according to the first embodiment of the present invention;

FIG. 3 is a side view of the semiconductor device according to the first embodiment of the present invention;

FIG. 4 is a schematic configuration diagram of an inspection device that determines a mounting state and a connection state of a semiconductor element according to a second embodiment of the present invention;

FIG. 5 is a circuit diagram of an inspection device that determines a mounting state and a connection state of a semiconductor element according to a third embodiment of the present invention;

FIG. 6 is a flowchart showing a flow of processing in an inspection device for determining a mounting state and a connection state of a semiconductor element according to a third embodiment of the present invention;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor element 10a Connection terminal 10b Connection terminal 11 Internal connection means 20a Connection terminal 20b Connection terminal 21 Internal connection means 30 Electric circuit 200 Printed circuit board 210a Inspection wiring pattern 210b Inspection wiring pattern 220a Inspection wiring pattern 220b Inspection wiring pattern 300 Inspection device 301a Input unit 301b Input unit 500 Control unit 501 terminal 502 terminal 503 terminal 504 terminal 509 Input port 600 Memory 601 terminal 602 terminal 603 terminal 604 terminal 700 Pull-up resistor 800 Display unit

Claims (7)

[Claims] A plurality of external connection means for making an electrical connection with an external circuit; an internal connection means for electrically connecting at least one set of two or more external connection means inside a semiconductor element; The external connection means electrically connected to the external connection means other than the external connection means electrically connected by the internal connection means, the external connection means electrically connected by the internal connection means A semiconductor element which is electrically insulated from the electric circuit means. 2. Among all the external connection means of the semiconductor element, at least one of the external connection means having the largest physical distance between two external connection means or the external connection means in the vicinity thereof is connected to the internal connection means. 2. The semiconductor device according to claim 1, wherein the semiconductor device is electrically connected to another external connection device by a connection device. 3. A semiconductor device having a plurality of external connection means in a square ring shape on a bottom surface, wherein the external connection means arranged in a square ring shape has an outer periphery and a corner portion or a vicinity thereof. 2. The semiconductor device according to claim 1, wherein said at least one external connection means is electrically connected to another external connection means by said internal connection means. 4. A plurality of external connection means for making an electrical connection with an external circuit; an internal connection means for electrically connecting at least one set of two or more external connection means inside the semiconductor element; The external connection means electrically connected to the external connection means other than the external connection means electrically connected by the internal connection means, the external connection means electrically connected by the internal connection means A semiconductor element characterized by being electrically insulated from the electric circuit means, and electrically connected to each of the external connection means electrically connected by the internal connection means, each of which is electrically connected. On a substrate provided with a plurality of wiring means that are insulated and electrically connectable from the outside, the semiconductor element is mounted on the substrate, and the presence or absence of electrical conduction between the respective wiring means provided on the substrate is detected. And method of determining the mounted state of the semiconductor element characterized in that electrical conduction is good mounting state of the semiconductor element when the organic electrical continuity is determined that the mounted state when no is defective. 5. A semiconductor device to be mounted, comprising: a plurality of external connection means for making an electrical connection with an external circuit; and at least one set of two or more external connection means electrically connected inside the semiconductor element. Internal connection means for connecting, having an electric circuit means electrically connected to external connection means other than the external connection means electrically connected by the internal connection means,
The external connection means electrically connected by the internal connection means is a semiconductor element characterized by being electrically insulated from the electric circuit means, and is electrically connected by the internal connection means. Wherein the semiconductor element provided with a plurality of wiring means electrically connected to each of the external connection means, each of which is electrically insulated, and which can be electrically connected from the outside, is mounted and connected, Inspection of the presence or absence of electrical continuity between each wiring means provided in,
When there is electrical conduction, the connection between the connection means of the semiconductor element and the wiring means on the substrate is good, and when there is no electrical conduction, the connection between the connection means of the semiconductor element and the wiring means on the substrate is good. A connection state of a semiconductor element, which is determined to be defective. 6. A semiconductor device having a substrate on which a semiconductor element having a plurality of external connection means in a rectangular ring is mounted on at least one bottom surface, wherein said semiconductor element is electrically connected to an external circuit. A plurality of external connection means for performing
The substrate has two internal connection means for electrically connecting two of the four external connection means disposed at each corner portion of the external connection means arranged in a square ring inside the semiconductor element by two. Detecting means for detecting an input voltage, at least one first wiring means for electrically connecting external connection means connected by internal connection means of all the semiconductor elements in series, and A second wiring means for connecting one of the connected external connection means to the ground of the circuit on the substrate; a third wiring means for connecting the other of the serially connected external connection means to the detection means; A pull-up unit for applying a potential via a resistor connected to the third wiring unit; and a control unit for controlling the entire apparatus in accordance with the potential detected by the detection unit. Taden Electronic equipment but which is characterized by controlling so as to change the operation of the entire apparatus when not in ground level in the control state at the time of connection failure of the semiconductor device. 7. A semiconductor device having a substrate on which a semiconductor element having a plurality of external connection means in a rectangular ring is mounted on at least one bottom surface, wherein the semiconductor element is electrically connected to an external circuit. A plurality of external connection means for performing
The substrate has two internal connection means for electrically connecting two of the four external connection means disposed at each corner portion of the external connection means arranged in a square ring inside the semiconductor element by two. Detecting means for detecting an input voltage, at least one first wiring means for electrically connecting external connection means connected by internal connection means of all the semiconductor elements in series, and A second wiring means for connecting one of the connected external connection means to the power supply of the circuit on the substrate; a third wiring means for connecting the other of the external connection means connected in series to the detection means; Third
A pull-down means connected to the ground via a resistor connected to the wiring means; and a control means for controlling the entire apparatus in accordance with the potential detected by the detection means, wherein the potential detected by the detection means is provided. An electronic apparatus characterized in that when the power supply is not at the power supply level, the operation of the entire device is controlled to change to a control state when a connection failure of the semiconductor element occurs.