JP2001203222A5 - - Google Patents

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Publication number
JP2001203222A5
JP2001203222A5 JP2000379426A JP2000379426A JP2001203222A5 JP 2001203222 A5 JP2001203222 A5 JP 2001203222A5 JP 2000379426 A JP2000379426 A JP 2000379426A JP 2000379426 A JP2000379426 A JP 2000379426A JP 2001203222 A5 JP2001203222 A5 JP 2001203222A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000379426A
Other languages
Japanese (ja)
Other versions
JP2001203222A (ja
Filing date
Publication date
Priority claimed from EP19990811159 external-priority patent/EP1109207A1/de
Application filed filed Critical
Publication of JP2001203222A publication Critical patent/JP2001203222A/ja
Publication of JP2001203222A5 publication Critical patent/JP2001203222A5/ja
Pending legal-status Critical Current

Links

JP2000379426A 1999-12-14 2000-12-13 湾曲した回路基板を水平に引きよせるとともに押しつける吸引装置を備えたダイボンダおよび/またはワイヤボンダ Pending JP2001203222A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP99811159.5 1999-12-14
EP19990811159 EP1109207A1 (de) 1999-12-14 1999-12-14 Ansaugvorrichtung zum Niederhalten eines Substrates

Publications (2)

Publication Number Publication Date
JP2001203222A JP2001203222A (ja) 2001-07-27
JP2001203222A5 true JP2001203222A5 (enExample) 2008-01-10

Family

ID=8243188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000379426A Pending JP2001203222A (ja) 1999-12-14 2000-12-13 湾曲した回路基板を水平に引きよせるとともに押しつける吸引装置を備えたダイボンダおよび/またはワイヤボンダ

Country Status (2)

Country Link
EP (1) EP1109207A1 (enExample)
JP (1) JP2001203222A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2825661B1 (fr) * 2001-06-06 2006-11-24 Bourgogne Grasset Dispositif de pose pour jeton et installations de tampographie incorporant de tels dispositifs
US10541223B2 (en) * 2017-05-05 2020-01-21 Kulicke And Soffa Industries, Inc. Methods of operating a wire bonding machine to improve clamping of a substrate, and wire bonding machines
TWI632982B (zh) * 2017-07-03 2018-08-21 陽程科技股份有限公司 Plate retaining device
CN111633589A (zh) * 2020-06-16 2020-09-08 南京沃天科技有限公司 一种传感器芯片夹持固定结构
CN112045750A (zh) * 2020-08-25 2020-12-08 湖南亚太实业有限公司 一种吸塑件机械切割固定装置
CN115415675A (zh) * 2022-08-20 2022-12-02 北京力达塑料制造有限公司 一种用于安全帽加工的自动激光印刻系统

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2527124A1 (fr) * 1982-05-18 1983-11-25 Gerber Scient Products Inc Porte-piece a depression
NL8701603A (nl) * 1987-07-08 1989-02-01 Philips & Du Pont Optical Vacuuminrichting voor het vastzuigen van werkstukken.
EP0456426B1 (en) * 1990-05-07 2004-09-15 Canon Kabushiki Kaisha Vacuum type wafer holder
DE4024642A1 (de) * 1990-08-03 1992-02-06 Ibm Schleuderteller fuer substrate
USH1373H (en) * 1992-04-06 1994-11-01 American Telephone And Telegraph Company Wafer handling apparatus and method
JPH07193399A (ja) * 1993-12-27 1995-07-28 Hitachi Electron Eng Co Ltd 配線基板の湾曲防止クランプ機構
JP3348756B2 (ja) * 1995-06-13 2002-11-20 山形カシオ株式会社 基板位置決め用吸着ピンユニット
JPH1117397A (ja) * 1997-06-23 1999-01-22 Matsushita Electric Ind Co Ltd ワークの下受装置

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