JP2001203195A5 - - Google Patents

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Publication number
JP2001203195A5
JP2001203195A5 JP2000339066A JP2000339066A JP2001203195A5 JP 2001203195 A5 JP2001203195 A5 JP 2001203195A5 JP 2000339066 A JP2000339066 A JP 2000339066A JP 2000339066 A JP2000339066 A JP 2000339066A JP 2001203195 A5 JP2001203195 A5 JP 2001203195A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2000339066A
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Japanese (ja)
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JP2001203195A (ja
JP4868193B2 (ja
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Publication date
Priority claimed from US09/436,681 external-priority patent/US6259072B1/en
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Publication of JP2001203195A publication Critical patent/JP2001203195A/ja
Publication of JP2001203195A5 publication Critical patent/JP2001203195A5/ja
Application granted granted Critical
Publication of JP4868193B2 publication Critical patent/JP4868193B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2000339066A 1999-11-09 2000-11-07 プラズマ処理装置、温度制御装置及びその制御方法 Expired - Lifetime JP4868193B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US436681 1999-11-09
US09/436,681 US6259072B1 (en) 1999-11-09 1999-11-09 Zone controlled radiant heating system utilizing focused reflector

Publications (3)

Publication Number Publication Date
JP2001203195A JP2001203195A (ja) 2001-07-27
JP2001203195A5 true JP2001203195A5 (enExample) 2008-01-10
JP4868193B2 JP4868193B2 (ja) 2012-02-01

Family

ID=23733396

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000339066A Expired - Lifetime JP4868193B2 (ja) 1999-11-09 2000-11-07 プラズマ処理装置、温度制御装置及びその制御方法

Country Status (5)

Country Link
US (1) US6259072B1 (enExample)
EP (1) EP1100114A3 (enExample)
JP (1) JP4868193B2 (enExample)
KR (1) KR100674764B1 (enExample)
TW (1) TW472291B (enExample)

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US8548312B2 (en) * 2010-02-19 2013-10-01 Applied Materials, Inc. High efficiency high accuracy heater driver
US10504719B2 (en) 2012-04-25 2019-12-10 Applied Materials, Inc. Cooled reflective adapter plate for a deposition chamber
EP3100298B1 (en) 2014-01-27 2020-07-15 Veeco Instruments Inc. Wafer carrier having retention pockets with compound radii for chemical vapor deposition systems
US10067006B2 (en) 2014-06-19 2018-09-04 Elwha Llc Nanostructure sensors and sensing systems
KR101605717B1 (ko) 2014-07-16 2016-03-23 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
US10386821B2 (en) 2015-06-22 2019-08-20 Lam Research Corporation Systems and methods for calibrating scalar field contribution values for a limited number of sensors including a temperature value of an electrostatic chuck and estimating temperature distribution profiles based on calibrated values
US10763142B2 (en) 2015-06-22 2020-09-01 Lam Research Corporation System and method for determining field non-uniformities of a wafer processing chamber using a wafer processing parameter
US9779974B2 (en) 2015-06-22 2017-10-03 Lam Research Corporation System and method for reducing temperature transition in an electrostatic chuck
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WO2017059645A1 (zh) 2015-10-09 2017-04-13 北京北方微电子基地设备工艺研究中心有限责任公司 加热装置以及加热腔室
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JP6512089B2 (ja) 2015-12-15 2019-05-15 東京エレクトロン株式会社 基板処理装置及び基板処理装置の調整方法
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