JP2001176997A - Package for housing semiconductor element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate a problem that an electrical insulation failure or short circuits are ready to appear between adjacent outer lead terminals and between adjacent pads for connection. SOLUTION: A package for housing a semiconductor element comprises a ceramic base 1 which constitutes a container for housing a semiconductor element 4, and a plurality of outer lead terminals 2 brazed in a plurality of rows so that they may project from the lower surface of the base 1. The outer lead terminals 2 on both sides in each row are formed with, in a part just below the lower surface of the base 1, a projecting part 2a projecting in one direction. Due to this structure, the intervals between the outer lead terminals 2 and between the pads 5a for connection in the brazed part can be enlarged, hardly causing a bad electrical insulation or short circuits between the terminals and between the pads.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device housing package for housing a semiconductor device.

[0002]

2. Description of the Related Art Conventionally, a dual-in-line type semiconductor element housing package has been known as a semiconductor element housing package for housing a semiconductor element such as a semiconductor integrated circuit element.

FIG. 7 is a cross-sectional view of such a conventional dual-inline type semiconductor element housing package, and FIG. 8 is a side view thereof.

As shown in FIGS. 7 and 8, a conventional dual-inline type semiconductor element housing package is made of a ceramic such as an aluminum oxide sintered body, and has a recess 31a for housing a semiconductor element 34 on the upper surface. And a plurality of metallized wiring conductors 35 extending from the inside of the concave portion 31a to side surfaces facing each other at predetermined intervals.
A substantially square plate-shaped ceramic base body 31 provided with
A plurality of external lead terminals 32 protruding from the lower surface of the ceramic substrate 31 are brazed side by side at predetermined intervals to portions led out on the opposite side surfaces of the ceramic substrate 31 with the metallized wiring conductor 35, and the upper surface of the ceramic substrate 31 And a lid 33 attached so as to cover the recess 31a.
A semiconductor element 34 is accommodated and fixed in 31a, and each electrode of the semiconductor element 34 is electrically connected to a metallized wiring conductor 35 via a bonding wire 36. Thereafter, a lid 33 is placed on the upper surface of the ceramic base 31. The semiconductor device 34 is attached via a sealing material such as brazing material, solder, resin, glass, or the like, and the semiconductor element 34 is hermetically contained in a container including the ceramic base 31 and the lid 33, thereby forming a semiconductor device as a product. . Then, the semiconductor device is mounted on the external electric circuit board by inserting each external lead terminal 32 into a lead terminal insertion hole provided in the external electric circuit board (not shown).

In this conventional package for housing a semiconductor element, the portion of the metallized wiring conductor 35 led out to the opposite side surface of the ceramic base 31 is an external lead terminal.
Bonding pads 35a for brazing the soldering pads 32 are formed, and the upper ends of the external lead terminals 32 are brazed to the bonding pads 35a via a brazing material 37 such as silver-copper brazing. The lead terminals 32 are brazed on the opposing side surfaces of the ceramic base 31 at predetermined intervals so as to project from the lower surface of the ceramic base 31. Also,
In this conventional package for accommodating a semiconductor element, the upper end portion of each external lead terminal 32 to be brazed is a wide portion 32a formed to be wide to a predetermined height below the ceramic base 31, so that the semiconductor After accommodating the element 34 and forming a semiconductor device, when the external lead terminals 32 are inserted into the lead terminal insertion holes of the external electric circuit board and mounted, the lower end of the wide portion 32a of each external lead terminal 32 is indicated by a broken line. A predetermined mounting gap is formed between the lower surface of the ceramic base 31 and the upper surface A of the external electric circuit board in contact with the upper surface A of the external electric circuit board. Such a mounting gap,
The flow of air for cooling the semiconductor device can be introduced between the ceramic base 31 and the external electric circuit board, and the semiconductor device can be easily attached to and detached from the external electric circuit board.

[0006]

However, in such a dual-in-line type semiconductor element housing package, the repetition interval of the external lead terminals 32 in each row has been increased, for example, in accordance with recent demands for miniaturization of semiconductor devices. 1.27
mm or less. According to the conventional semiconductor device housing package, since the upper end portion of each external lead terminal 32 to be brazed is formed wide, the repetition interval of the external lead terminals 32 is, for example, 1.27 mm.
When the distance is smaller than the following, the adjacent distance between the external lead terminals 32 and the adjacent distance between the bonding pads 35a are extremely narrow, and electrical insulation failure and short circuit between the adjacent external lead terminals 32 are likely to occur. There was a problem that.

The present invention has been made in view of the above-mentioned conventional problems, and an object of the present invention is to provide a method without causing electrical insulation failure or short circuit between adjacent external lead terminals.
An object of the present invention is to provide a small package for housing a semiconductor element capable of securing a predetermined mounting gap.

[0008]

According to the present invention, there is provided a package for accommodating a semiconductor element, wherein a plurality of external lead terminals protrude from a lower surface of the ceramic substrate constituting a container for accommodating a semiconductor element. In a semiconductor element storage package formed by brazing in a plurality of rows, a projection protruding in one direction is provided at a portion protruding from the lower surface of the external lead terminal at both ends of each row. It is a feature.

According to the semiconductor device housing package of the present invention, the external lead terminals brazed to the ceramic base are unidirectionally connected to the external lead terminals at both ends of each row and projecting from the lower surface of the ceramic base. Since the width of the external lead terminal at the upper end to be brazed and the width of the bonding pad to which the upper end is brazed are narrow, the external lead at the upper end is provided. The distance between adjacent terminals and the distance between adjacent bonding pads can be increased, and a predetermined mounting gap can be ensured by the projection.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a sectional view showing an example of an embodiment of a package for accommodating a semiconductor element according to the present invention, wherein 1 is a ceramic base, 2 is an external lead terminal, and 3 is a lid. These form a semiconductor element housing package for housing the semiconductor element 4. FIG. 2 is a side view of the semiconductor device housing package shown in FIG.

The ceramic substrate 1 is made of a ceramic material such as a sintered body of aluminum oxide, a sintered body of aluminum nitride, a sintered body of mullite, a sintered body of silicon carbide, a sintered body of silicon nitride, and glass-ceramics. Recess 1a for accommodating the semiconductor element 4 on the upper surface thereof.
The semiconductor element 4 is housed and fixed in the recess 1a via an adhesive such as brazing material, resin, glass or the like.

The ceramic substrate 1 is provided with a plurality of metallized wiring conductors 5 extending from the inside of the concave portion 1a to the opposing side surfaces of the ceramic substrate 1 at predetermined intervals. The metallized wiring conductor 5 is made of metal powder of metal such as tungsten, molybdenum, copper, silver, etc., and functions as a conductive path for electrically connecting each electrode of the semiconductor element 4 mounted in the recess 1 a to the external lead terminal 2. . A portion led out from the metallized wiring conductor 5 to the opposite side surface of the ceramic base 1 forms a bonding pad 5a for bonding the external lead terminal 2, and the bonding pad 5a has a plurality of bonding pads 5a. The external lead terminals 2 are brazed at predetermined intervals in two rows via a brazing material 7 such as silver-copper brazing material, and each electrode of the semiconductor element 4 housed in the recess 1a is provided inside the recess 1a. Are electrically connected via the bonding wires 6.

The ceramic substrate 1 is formed by subjecting a plurality of ceramic green sheets to appropriate punching and printing and applying a metal paste to be the metallized wiring conductor 5 in a predetermined pattern. The sheet is laminated on top and bottom and cut to an appropriate size to obtain a green ceramic molded body serving as the ceramic substrate 1. Thereafter, the green ceramic molded body is manufactured by firing at a temperature of about 1600 ° C. in a reducing atmosphere. Is done.

The external lead terminal 2 brazed to the bonding pad 5a of the metallized wiring conductor 5 has a thickness of 0.1 to 0.3 mm and a width of 0.1 to 0.3 mm made of a metal such as an iron-nickel alloy or an iron-nickel-cobalt alloy. 0.1-1mm, length 2
It has a rod shape of about 15 mm, the lower end of which is a ceramic base 1
Are joined at a repetition interval of 0.4 to 1.27 mm so as to protrude from the lower surface.

The external lead terminal 2 functions as a connection terminal for electrically connecting each electrode of the semiconductor element 4 housed in the recess 1a to an external electric circuit, and a lower end protruding from the lower surface of the ceramic base 1. Each electrode of the semiconductor element 4 is electrically connected to the external electric circuit by inserting the part into the lead terminal insertion hole provided on the external electric circuit board.

The external lead terminals 2 at both ends of each row of the external lead terminals 2 have protruding portions 2a protruding from the lower surface of the ceramic base 1 by about 0.2 to 1 mm outside the respective rows. Are formed. When the external lead terminal 2 is inserted into the lead terminal insertion hole of the external electric circuit board after the semiconductor element 4 is accommodated in the package and the semiconductor device 4 is formed into a semiconductor device, the protruding portion 2 a The upper surface A of the electric circuit board is brought into contact with the upper surface A of the ceramic substrate 1 to form a predetermined gap between the ceramic substrate 1 and the upper surface A of the external electric circuit board. The semiconductor device can be efficiently cooled by introducing a flow of air for cooling between the lower surface and the upper surface A of the external electric circuit board, and the semiconductor device can be easily attached to and detached from the external electric circuit board. It becomes something.

In the present invention, since the protruding portions 2a are formed at the portions of the external lead terminals 2 projecting from the lower surface of the ceramic base 1 of the external lead terminals 2 at both ends of each row. The width of the upper end of the external lead terminal 2 to be brazed and the width of the bonding pad 5a are narrow, and the distance between the adjacent external lead terminals 2 and the distance between the bonding pads 5a at the upper end are wide. It can be.

In the case where the protruding portion 2a is formed so as to protrude outside the respective rows of the external lead terminals 2 at the external lead terminals 2 at both ends of each row, the protruding portion 2a is formed. Even in the formed portion, the adjacent space between the external lead terminals 2 is not narrowed by the protruding portion 2a. Therefore, according to the package for housing a semiconductor element of the present invention, the risk of electrical insulation failure, short circuit, or the like occurring between adjacent external lead terminals 2 can be extremely reduced.

Depending on the specifications of the package for accommodating the semiconductor element, the protruding portions 2a of the external lead terminals 2 at both ends of each row may protrude inside each row, or the lower surface of the ceramic base 1 may be formed. It may be formed so as to stand out in the inside direction or the outside direction.

The external lead terminal 2 is formed into a predetermined shape by punching or etching a plate material such as an iron-nickel alloy, and the external lead terminal 2 and the bonding pad 5a are joined together. The upper end of the lead terminal 2 is brought into contact with the bonding pad 5a with a brazing material 7, such as silver-copper brazing, sandwiched therebetween, and these are heated to a temperature equal to or higher than the melting point of the brazing material 7, thereby forming a bonding pad. 5a
And the upper end of the external lead terminal 2 is brazed. At the time of such brazing, the brazing material 7 is fixed to the upper end portion of the external lead terminal 2 to a predetermined thickness in advance by a plating method, a crimping method, a spot welding method, or the like in order to facilitate the arrangement. It is preferable to keep it. Further, it is preferable that the lower ends of the external lead terminals 2 in each row are integrally connected to each other by a tie bar (not shown) until they are brazed to the bonding pads 5a. By connecting the external lead terminals 2 with tie bars for each row, it becomes easy to hold each external lead terminal 2 at a constant interval and to accurately braze to each bonding pad 5a. Then, such a tie bar may be cut and removed after the semiconductor element 4 is housed in the package to form a semiconductor device.

Thus, according to the package for accommodating a semiconductor element of the present invention, the spacing between the external lead terminals 2 in each row and the spacing between the bonding pads 5a in the brazing portion are wide, and the electrical connection therebetween is large. It is possible to provide a small-sized semiconductor element housing package that does not easily cause insulation failure or short circuit and can secure a predetermined mounting gap.

The present invention is not limited to the above-described embodiment, and various changes can be made without departing from the gist of the present invention. For example, as shown in a sectional view in FIG. 3 and a side view in FIG. 4, a bonding pad 15a is provided on the lower surface of a ceramic base 11 constituting a container for housing the semiconductor element 14, and the bonding pad 15
The present invention may be applied to a semiconductor element storage package formed by brazing external lead terminals 12 to a. FIG.
As shown in a sectional view in FIG. 6 and a side view in FIG.
The present invention is applied to a semiconductor device housing package in which bonding pads 25a are provided on the upper surface of a ceramic base 21 constituting a container for housing the semiconductor substrate 21 and external lead terminals 22 are brazed to the bonding pads 25a. You may.

[0024]

According to the package for housing a semiconductor element of the present invention, of the external lead terminals brazed to the ceramic base, the external lead terminals at both ends of each row protrude from the lower surface of the ceramic base. Since the protruding portion that protrudes in one direction is provided, the width of the upper end portion of the external lead terminal to be brazed and the width of the bonding pad to which the upper end portion is brazed are reduced, and The distance between adjacent external lead terminals and the distance between adjacent bonding pads can be widened, so that electrical insulation failure and short circuit between external lead terminals are unlikely to occur, It is possible to provide a semiconductor element housing package capable of securing a predetermined mounting gap.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating an example of an embodiment of a semiconductor element storage package according to the present invention.

FIG. 2 is a side view of the semiconductor element housing package shown in FIG. 1;

FIG. 3 is a cross-sectional view illustrating another embodiment of the semiconductor device storage package of the present invention.

FIG. 4 is a side view of the semiconductor element storage package shown in FIG. 3;

FIG. 5 is a cross-sectional view showing another embodiment of the semiconductor element storage package of the present invention.

FIG. 6 is a side view of the semiconductor device housing package shown in FIG. 5;

FIG. 7 is a cross-sectional view of a conventional semiconductor element storage package.

FIG. 8 is a side view of the package for housing a semiconductor element shown in FIG. 7;

[Explanation of symbols]

 1, 11, 21 ····· Ceramic substrate 2 · 12, 22 ····· External lead terminals 2a, 12a, 22a ··· Protruding parts 4, 14, 24 ···· Semiconductor elements 5a, 15a , 25a ... Connection pad

Claims (1)

[Claims] 1. A semiconductor device housing comprising a plurality of external lead terminals arranged in a plurality of rows and brazed on a ceramic base constituting a container for housing a semiconductor element so as to project from a lower surface of the ceramic base. A package protruding from the lower surface of the external lead terminal at both ends of each row, wherein a protruding portion protruding in one direction is provided.