JP2001154215A - Conductive film and its producing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a conductive film having good conducting performance which can be produced in an easy process. SOLUTION: The conductive film 10 consists of a supporting body 12 and a conductive layer 14 formed by applying a coating liquid containing a metal acetylide on the supporting body 12 and heat treating. The surface electric resistance of the conductive layer 14 is <=500 Ω/unit (square). The metal element included in the metal acetylide is preferably a metal element selected from a group of metal elements of silver, gold, copper, aluminum, nickel and palladium.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a conductive film,
More specifically, the present invention relates to a flexible wiring board (PWB), a flexible copper-clad laminate (FC
L), a conductive filter that can be used as an electromagnetic wave shield (EMI) filter and a method for manufacturing the same.

[0002]

2. Description of the Related Art In general, a conductive film is formed by forming a conductive thin film on a flexible polymer film, has flexibility and light weight, and can be easily reduced in size and thickness. It is. In recent years, there is a strong demand for miniaturization and weight reduction of consumer devices such as display devices and communication devices, and the use of conductive films as electronic components of various consumer devices is expanding. For example, flexible copper-clad laminates in which a copper conductor is bonded on a polymer film are used in various ways as printed wiring boards for small electronic devices. In addition, a conductive film having a mesh pattern made of metal is used as a member of an electromagnetic wave shield filter.

[0003] The flexible copper-clad laminate (FCL) includes a three-layer FCL having an adhesive layer for bonding a copper conductor and a substrate film, and a two-layer FCL without an adhesive layer. For application to circuit boards that require heat resistance or ultra-thin applications, a two-layer FCL that does not require an adhesive is advantageous. Conventionally, as a method for manufacturing a two-layer FCL, a method of forming a conductor layer on a polymer film by using a sputtering method is known. However, the sputtering method has a problem that the adhesion between the conductor layer and the polymer film support is not sufficient, and the performance reliability is low. Further, there is a problem that the production process is complicated and the production cost is increased.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide a conductive film having good conductive performance, which can be manufactured by a simple process. . Another object of the present invention is to provide a method for stably producing a conductive film having good conductive performance by a simple process and at low cost.

[0005]

Means for solving the above problems are as follows. <1> A conductive material having a support and a conductive layer obtained by applying a coating solution containing metal acetylide on the support and subjecting the coating to heat treatment, wherein the conductive layer has a surface electric resistance of 500 Ω / □ or less. Film. <2> The metal element contained in the metal acetylide is silver,
The conductive film according to <1>, which is any metal element selected from the group consisting of gold, copper, aluminum, nickel, and palladium. <3> The conductive film according to <1> or <2>, wherein the support has a short-term heat-resistant temperature of 150 ° C or higher. <4> The conductive film according to any one of <1> to <3>, having a plating layer formed on the conductive layer by using the conductive layer as a plating nucleus. <5> The conductive film according to any one of <1> to <4>, wherein the conductive layer contains an alloy.

<6> A first step of applying a coating solution containing at least a metal acetylide on a support and subjecting it to a heat treatment to form a conductive layer, and forming the conductive layer formed of palladium, tin, And a second step of treating by contacting at least an acidic solution containing ions of any metal element selected from the group consisting of silver and metal elements. <7> After the second step, the method includes a third step of forming a plating layer on the conductive layer using the conductive layer as a plating nucleus.
6> The method for producing a conductive film according to <1>.

[0007]

FIG. 1 is a schematic cross-sectional view of a first embodiment of the conductive film of the present invention. Conductive film 1
No. 0 has a support 12 made of a polymer film and a conductive layer 14 thereon. The conductive layer 14 has a surface 1
4a has an electric resistance of 500Ω / □ or less, preferably 200Ω / □.
Ω / □ or less. Since the conductive layer 14 is formed by applying a coating solution containing metal acetylide and performing heat treatment, the conductive layer 14 has high adhesion to the support 12 and high conductivity. Further, since the coating liquid containing metal acetylide is excellent in coating aptitude, the productivity is good.

Hereinafter, a method for manufacturing the conductive film 10 will be described. First, a coating solution containing metal acetylide is prepared. The coating solution containing metal acetylide is prepared by dispersing and / or dissolving a monomer having a carbon-carbon triple bond and a metal compound having a metal element in a predetermined solvent (hereinafter referred to as “coating solution”), or Can be prepared by dispersing and / or dissolving in a predetermined solvent (hereinafter, referred to as “coating solution”). In the coating solution, carbon-
When a monomer having a carbon bond reacts with a metal element, a part or all of the monomer is changed to a metal acetylide. In the coating liquid, the monomer having a carbon-carbon triple bond is preferably a compound represented by the following general formula (1).

[0009]

Embedded image

In the general formula (1), A represents a polyoxyether group, a polyaminoether group, or a polythioether group, and R ¹ represents a hydrogen element, a carboxyl group or a salt thereof, an alkyl group, a cycloalkyl group, an alkenyl group. , An alkynyl group, an aryl group, an aralkyl group, or a heterocyclic group, L represents a chemical bond connecting a carbon-carbon triple bond and A, or a (k + m) -valent group, and k and n each represent 1 or more. And m represents an integer of 0 or more.

In the general formula (1), A is further substituted with a hydroxyl group, an amino group, a mercapto group, a sulfino group or a salt thereof, a sulfo group or a salt thereof, a carboxyl group or a salt thereof, or a polymerizable group. May be. Examples of the polymerizable group include a glycidyl group, a vinyl group, an isocyanate group, and the like.

In the general formula (1), R ¹ represents a hydrogen element, a carboxyl group or a salt thereof, an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, an aryl group, an aralkyl group, or a heterocyclic group. In the general formula (1), the alkyl group represented by R ¹ is preferably an alkyl group having 1 to 10 carbon atoms, and the alkyl group may be linear or branched. As the cycloalkyl group represented by R ^1, preferably a cycloalkyl group having a carbon number of 5-6. The alkenyl group represented by R ¹ includes
An alkenyl group having 2 to 10 carbon atoms is preferable, and the alkenyl group may be linear or branched. The alkynyl group represented by R ¹ is preferably an alkynyl group having 2 to 10 carbon atoms, and the alkynyl group may be linear or branched. The aryl group represented by R ¹ is preferably an aryl group having 6 to 10 carbon atoms. The aralkyl group represented by R ¹ is preferably an aralkyl group having 7 to 10 carbon atoms. The heterocyclic group represented by R ^1, a nitrogen atom, a sulfur atom or an oxygen atom, etc., a heterocyclic group preferably comprises a 5-6 membered ring. The alkyl group, cycloalkyl group, alkenyl group, alkynyl group, aryl group, aralkyl group, and heterocyclic group represented by R ¹ may be substituted, and examples of the substituent include a hydroxyl group, an acetyl group, an epoxy group, and a carboxyl group. And sulfonic acid groups.

In the general formula (1), L is a chemical bond connecting A to a carbon-carbon triple bond, or (k +
m) represents a valent group. For example, L represents an optionally substituted alkylene group, aryl group, aralkylene group, vinylene group, cycloalkylene group, glutaroyl group, phthaloyl group, hydrazo group, ureylene group, thio group, carbonyl group, oxy group, imino Group, sulfinyl group, sulfonyl group, thiocarbonyl group, oxalyl group, azo group and the like. Further, it may be a group obtained by combining any two or more of the above groups. In addition, L may be further substituted with various substituents, and examples of the substituent include those exemplified as the substituent of A.

In the general formula (1), k and l
Represents an integer of 1 or more. k is preferably an integer of 1 to 4, and 1 is preferably an integer of 1 to 2. In the general formula (1), m represents an integer of 0 or more, and among them, an integer of 1 to 3 is preferable.

Specific examples (1) to (16) of the compound represented by the general formula (1) are shown below.

[0016]

Embedded image

[0017]

Embedded image

As the monomer having a carbon-carbon triple bond, specific example (1) is preferred.

The metal element contained in the coating solution is preferably any one element selected from Group 8 and Group 1B elements of the periodic table. Examples of group 8 elements of the periodic table include nickel, ruthenium, rhodium, palladium,
Platinum and the like are mentioned, and as the group 1B element, copper, silver and gold are mentioned. Among them, the metal element is preferably silver, gold, copper, aluminum, nickel, or palladium, and more preferably silver or copper. The elements may be used alone or in combination of two or more. The metal element is preferably used for preparing the coating solution in the form of a metal salt and a metal complex. Examples of the metal salt include silver nitrate, silver acetate, silver tetrafluoroboronate, palladium chloride, cuprous chloride, and platinum chloride. Examples of the metal complex include di-μ-chlorobis (η
-2-methylallyl) dipalladium (II) complex, tetrakis (triphenylphosphine) palladium complex, di-
μ-chlorotetracarbonyldirhodium (I) complex,
Examples thereof include 1,4,7,10,13-pentaoxycyclododecane / sodium tetrachlorovanadinite and dicyclopentadiene-gold (I) chloride. The coating liquid may contain a metal salt and / or a metal complex of the metal element.

The metal acetylide used in the coating solution is preferably a compound represented by the following general formula (2).

[0021]

Embedded image

In the general formula (2), A represents a polyoxyether group, a polyaminoether group, or a polythioether group, R ² represents a metal element, and L connects a carbon-carbon triple bond to A. Chemical bond or (k + m)
And k and n each represent an integer of 1 or more;
m represents an integer of 0 or more. In the general formula (2), A,
L, k, n, and m have the same meanings as those in Formula (1), and preferred examples are also the same.

In the general formula (2), R ² represents a metal element. Examples of the metal element represented by R ² include group 1A (alkali element) excluding hydrogen, group 1B (copper group), group 2A (alkaline earth element), group 2B (zinc group), group 3B excluding boron,
Examples thereof include elements belonging to Groups 4B, 8 (iron group and platinum group) excluding carbon and silicon, 3A group, 4A group, 5A group, 6A group, and 7A group, and antimony, bismuth, and polonium. Among them, R ² is silver, gold, copper, aluminum,
It is preferably a nickel or palladium atom, more preferably a silver or copper atom. The coating liquid may contain a metal element as in the case of the coating liquid.

As a specific example of the compound represented by the general formula (2), in the compounds (1) to (16) shown in the specific examples of the general formula (1), the group corresponding to R ¹ may be a metal. Compounds substituted with elements are listed. Among them, the compounds in which the terminal hydrogen atom of the acetylene group in the specific example (1) is substituted with a metal element, particularly a silver element, are preferable.

The above general formulas (1) and (2)
Wherein the bond between R ¹ and R ² and the acetylene group is σ
It may be a bond or a π bond.

Pure water or an organic solvent can be used as the solvent used for preparing the coating solution. In particular, metal acetylide contained in the coating solution,
Since it has high dispersibility and / or solubility in pure water, a coating solution can be prepared using pure water as a solvent, which is preferable because environmental safety in a production process is improved. Examples of the organic solvent include methanol, ethanol, alcohols such as isopropyl alcohol, acetone, ketones such as methyl ethyl ketone, chloroform, halogen compounds such as methylene chloride, esters such as ethyl acetate, dimethylacetamide, dimethylformamide, N
Examples include amides such as -methyl-2-pyrrolidone, nitriles such as acetonitrile, ethers such as diethyl ether and ethyl methyl ether, and acetates such as methoxyethyl acetate and methoxypropyl acetate.

In the coating solution, the metal acetylide is preferably dissolved or dispersed in a solvent with a dispersed particle diameter of 0.1 μm or less, since the conductive layer 14 can be formed with a uniform thickness. During the preparation of the coating liquid, the metal element contained in the coating liquid and the monomer react with each other to generate metal acetylide, and the generated metal acetylide is dissolved or dispersed in a solvent having a dispersed particle diameter in the above range. Preferably.

For the purpose of improving the dispersibility and / or solubility of the monomers and the like in the above-mentioned and coating solutions, a surfactant may be contained in each of the coating solutions. Examples of the surfactant include a fluorine-based, ammonium salt-based, sulfonate-based, and ethylene oxide-based surfactant. In addition, a binder resin, a plasticizer, a thickener and the like may be contained in each of the above-mentioned and the coating liquid.

The prepared coating solution is applied to the surface of a support 12 made of a polymer film, and then heated.
At the time of heating, metal acetylide (in a coating solution, metal acetylide generated in the coating solution) is polymerized to form the conductive layer 14 and a part of the organic components contained in the conductive layer 14 is decomposed. As a result, the conductive layer 14 and the support 12 made of a polymer film adhere to each other with an extremely high adhesion force, and the ratio of the metal component contained in the conductive layer 14 increases. Is shown. In particular, in the present embodiment, the polymer film is used as the support 12. However, since the metal acetylide (the metal acetylide formed in the coating solution in the coating solution) has low-temperature decomposability, the heat resistance temperature of the polymer film is low. By heating in the range, the conductive layer 14 having high conductivity can be formed. The heating temperature is
It is preferably from 150 ° C to 300 ° C, and from 170 ° C to 2 ° C.
More preferably, it is 00 ° C. Furthermore, the heating time is 3
The time is preferably from 0 seconds to 5 minutes, more preferably from 10 seconds to 3 minutes.

Since the support 12 needs to withstand heat treatment when the conductive layer 14 is formed, the short-term heat resistance of the polymer film used for the support 12 is preferably 150 ° C. or higher. For example, a polymer film composed of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polyimide (PI), and polyetheretherketone (PEEK) is preferable. In addition, the short-term heat-resistant temperature means a glass transition temperature (Tg) for an amorphous polymer and Tm-50 ° C. (Tm is a melting point ° C.) for a crystalline polymer.

Next, the formed conductive layer 14 is brought into contact at least with an acidic solution containing an ion of any metal element selected from the group consisting of palladium, tin, and silver, and is immersed, for example. To process. By this treatment, the metal element ions contained in the acidic solution are ionically precipitated on the surface of the conductive layer 14 and are alloyed with the metal in the conductive layer 14. As a result, the surface electric resistance of the conductive layer 14 becomes 500Ω / □ or less, preferably 200Ω / □ or less. The acidic solution containing a metal element ion can be prepared by dissolving a metal salt in the acidic solution. Examples of the metal salt used include palladium chloride, tin chloride, silver bromide and the like.

Among them, it is preferable to use an acidic solution containing palladium ions. In particular, when the conductive layer 14 is formed from silver metal acetylide, the migration between the conductive layer circuits can be reduced by forming an alloy of silver and palladium.

After the treatment with the acidic solution, the surface of the conductive layer 14 is preferably washed with pure water or the like. Also, after washing,
It is preferable to dry at room temperature to 150 ° C.

After the treatment with the acidic solution, the amount of the metal element contained in the conductive layer 14 is preferably 0.2 g / m ² or more, since the surface electric resistance can be reduced. It is more preferably at least m ² .

The thickness of the conductive layer 14 is 0.05 μm or more and 1
μm or less, preferably 0.1 μm or more and 0.5 μm
m is more preferable. The layer thickness of the conductive layer 14 is
By adjusting the amount of application of the coating liquid, a preferable range can be obtained. Further, when a transparent film is used as the support 12 and the conductive layer 14 is made light-transmissive, for example, it can be used for a member requiring light transparency such as an electromagnetic wave shielding film. By forming the conductive layer 14 using a coating liquid (a coating liquid to which metal salt particles are not separately added), the conductive layer 14 can be made light-transmitting.

In the present embodiment, for the purpose of further improving the adhesion between the support 12 and the conductive layer 14,
An undercoat layer may be provided between the support 12 and the conductive layer 14. As a material of the undercoat layer, an epoxy resin, an acrylic resin, a phenol resin, and a polyester resin are preferable. Further, in the present embodiment, the conductive layer 14 is formed only on one surface of the support 12, but the present invention is not limited to this, and the conductive layer 14 may be formed on both surfaces of the support 12 depending on the application.

It is not necessary to perform each step of the manufacturing method in a vacuum chamber or the like, so that the steps are simpler and the production cost of the conductive film can be reduced as compared with the manufacturing step by sputtering. Further, since no adhesive is used, it can be used as a member requiring heat resistance, for example, a member of a circuit board or the like.

FIG. 2 is a schematic sectional view of a second embodiment of the conductive film of the present invention. The conductive film 20
On the conductive layer 14 of the conductive film 10, there is provided a plating layer 16 formed by using the conductive layer 14 as a plating nucleus. Since the surface electrical resistance of the surface 14a of the conductive layer 14 is 500Ω / □ or less, it can function as a plating nucleus, and the plating layer can be easily formed on the conductive layer 14.

The electrolytic plating can be performed according to a usual method. As the metal contained in the plating bath, nickel, aluminum, copper, silver, gold, and palladium are preferable. When the conductive film of the present embodiment is applied to a flexible copper-clad laminate or an electromagnetic wave shielding filter, it is preferable to use a copper plating bath as a plating bath. Examples of the copper plating bath include a copper sulfate bath and a copper pyrophosphate bath. Further, as a silver plating bath, a silver potassium cyanide bath is generally used. The pH of the plating bath is 8-9, and the temperature of the plating bath during the plating process is 50 ° C-70.
Preferably it is maintained at ° C. Further, at the time of plating, it is preferable to carry out the current density at 30 to 80 A / dm ² . The thickness of the plating layer 16 can be appropriately set according to the current value during plating and the plating time.

The above step does not need to be performed in a vacuum chamber or the like.
Compared with the manufacturing process by sputtering, the process is simple and the production cost of the conductive film can be reduced. Also, since no adhesive is used,
It can be used as a member requiring heat resistance, for example, a member of a circuit board or the like.

FIG. 3 is a schematic sectional view of a third embodiment of the conductive film of the present invention. The conductive film 30
The conductive layer 14 and the plating layer 16 of the conductive film 20 have a conductive layer 14 ′ and a plating layer 16 ′, respectively, which are patterned. For example, when this embodiment is applied to a flexible copper-clad laminate, the patterned conductive layer 14 'and plated layer 16' constitute a fine circuit. Further, for example, when the present embodiment is applied to an electromagnetic wave shield filter, the patterned conductive layer 14 ′
The plating layer 16 'forms a mesh pattern for shielding electromagnetic waves.

The conductive layer 14 'and the plating layer 16'
May be formed by forming the conductive film 20 of the second embodiment, that is, after forming the plating layer 16, by patterning the conductive layer 14 and the plating layer 16 at the same time. After the formation of the conductive film 20 of the above-described embodiment, the conductive layer 14 may be subjected to a patterning process to form the plating layer 16 'using the patterned conductive layer 14' as a plating nucleus.

FIG. 4 shows an example in which the conductive layer 14 and the plating layer 16 are simultaneously patterned after forming the conductive film 20 of the second embodiment. A conductive film 20 is prepared (FIG. 4A), and a photosensitive layer 22 containing a photoresist material is formed on the plating layer 16 by a lamination process (FIG. 4B). Next, light is irradiated from above the photosensitive layer 22 through the photomask 24 (FIG. 4).
(C)). The light irradiation cures the light-irradiated portion of the photosensitive layer 22 and reduces the solubility in the developer. Thereafter, when the photosensitive layer 22 is developed with an alkaline developer or the like, only the non-light-irradiated portions of the photosensitive layer 22 are removed (FIG. 4D). 14 and the plating layer 16 are removed (FIG. 4).
(E)). Next, the conductive film 30 is obtained by washing with an organic solvent such as acetone, methanol and methyl ethyl ketone to remove the remaining photosensitive layer 22.
(F)). In addition, light irradiation does not use a photomask,
Light may be irradiated in a pattern by a laser.

FIG. 5 shows that after forming the conductive film 10 of the first embodiment, the conductive layer 14 is patterned to form a conductive layer 14 ', and the conductive layer 14' is 'Is shown. A conductive film 10 is prepared (FIG. 5A), and a photosensitive layer 22 containing a photoresist material is formed on the conductive layer 14 by a lamination process (FIG. 5B). Next, from above the photosensitive layer 22,
Light is irradiated through the photomask 24 (FIG. 5).
(C)). The light irradiation cures the light-irradiated portion of the photosensitive layer 22 and reduces the solubility in the developer. Thereafter, when development is performed with an alkaline developer or the like, only the non-light-irradiated portions of the photosensitive layer 22 are removed (FIG. 5D). Further, an etching process is performed with a cupric chloride aqueous solution or the like to remove the conductive layer 14 in a region not protected by the photosensitive layer 22 (FIG. 5E). Next, by washing with an organic solvent such as acetone, methanol, and methyl ethyl ketone to remove the remaining photosensitive layer 22, a patterned conductive layer 14 'can be formed on the support 12 (FIG. 5).
(F)). Further, by performing plating using the conductive layer 14 'as a plating nucleus by the method described in the second embodiment, a conductive film 30 is obtained (FIG. 5G).
Note that the light irradiation may be performed in a pattern by a laser without using a photomask.

The conductive film 3 thus formed
0 indicates that the adhesion between the conductive layer 14 'and the plating layer 16' is good and has high performance reliability. The process does not need to be performed in a vacuum chamber or the like, and the process is simpler and the production cost can be reduced as compared with a manufacturing process by sputtering.

The conductive film 30 thus produced
Can be used as a two-layer type copper-clad laminate. Further, formation of the conductive layer 14, formation of the plating layer 16, and patterning (formation of the conductive layer 14 'and the plating layer 16'), or formation of the conductive layer 14, formation of the conductive layer 14 'by patterning, and formation of the plating layer 16 By repeating the step of forming ', a flexible printed circuit board having fine and dense circuits can be obtained. When used as a flexible printed circuit board, the conductive layers 14, 1
If desired, a coating layer having water resistance, heat resistance, insulation, and the like may be formed on 4 ′.

The conductive layer 14 'and the plating layer 16'
Can be used for a magnetic shield filter having a fine mesh pattern.
The magnetic shield filter using the conductive film 30 is manufactured by, for example, forming an adhesive layer on the plating layer 16 ′ and bonding the adhesive layer to a surface of an acrylic plate or the like serving as a filter substrate. Can be. The magnetic shield filter using the conductive film 30 has good magnetic shield performance and high performance reliability.

[0048]

EXAMPLES Hereinafter, the effects of the present invention will be clarified by examples, but the present invention is not limited by the following examples. Note that “parts” indicates “parts by weight”. <Preparation of Undercoat Layer Coating Solution> An undercoat layer coating solution having the following composition was prepared. Epoxy resin 5 parts (Yuika Shell Epoxy Co., Ltd., "Epicoat 1001B80") Imidazole hardener 0.02 parts (Yuka Shell Epoxy Co., Ltd., "Epicure BMI-12") methyl ethyl ketone 100 parts

<Preparation of Coating Solution for Conductive Layer> Preparation of Coating Solution a for Conductive Layer A coating solution a for conductive layer having the following composition was prepared. The coating solution was used after being filtered through a filter having a pore size of 0.5 μmφ. Conductive agent 20 parts (compound represented by the following structural formula 1) Surfactant 0.1 part (Nonionic fluorine-based surfactant) Pure water 80 parts

Preparation of Conductive Layer Coating Solution b A conductive layer coating solution b having the following composition was prepared. The coating solution was used after being filtered through a filter having a pore size of 0.5 μmφ. Conductive agent 13.1 parts (compound represented by the following structural formula 1) Silver nitrate solution (1N) 45.9 parts Surfactant 0.1 part (Nonionic fluorine-based surfactant) Methanol 41 parts

[0051]

Embedded image

Example 1 A polyimide resin (50 μm thick)
m, short-term heat-resistant temperature 420 ° C.) The undercoat layer coating solution was applied on a film by a bar coater so that the dry film thickness was 0.25 μm. Next, heat treatment was performed at 150 ° C. for 1 hour to form an undercoat layer. The conductive layer coating liquid a was applied on the undercoat layer using a bar coater such that the dry film thickness became 0.5 μm. Next, heat treatment was performed at 185 ° C. for 5 minutes to form a conductive layer. Next, the formed conductive layer is immersed in a 1N hydrochloric acid solution of palladium chloride, washed with water, and
Dry at 100 ° C. for hours.

Thereafter, the surface electric resistance and the transmittance of the conductive layer were measured. Surface electric resistance is JIS standard C-64
81. The light transmittance was measured using a spectrophotometer. The measurement results are shown in Table 1 below.

Next, after performing a surface treatment with a dilute hydrochloric acid aqueous solution, a copper plating layer having a thickness of about 10 μm is formed on the conductive layer using the conductive layer as a plating nucleus and a copper sulfate aqueous solution as a plating bath. A copper clad laminate (FCL) was produced.

Example 2 An FCL was prepared in the same manner as in Example 1, except that the conductive layer coating liquid b was used instead of the conductive layer coating liquid a. During the process of manufacturing the FCL, the surface electric resistance and the transmittance of the conductive layer were measured in the same manner as in Example 1. The measurement results are shown in Table 1 below.

[0056]

[Table 1]

Comparative Example 1 As a sample for a comparative example, a two-layer type FCL of "Metaroyal" manufactured by Toyo Metallizing Co., Ltd. was used. This FCL is composed of an electroless copper plating layer on a polyimide resin film (50 μm thick).
Further, a copper plating layer was formed thereon. [Comparative Example 2] As a sample for Comparative Example, a three-layer type FCL of "Nikaflex" manufactured by Nikkan Kogyo was used.
This FCL is a polyimide resin film (thickness 50μ).
m), an adhesive layer made of an acrylic resin adhesive, and further thereon a rolled copper layer.

Regarding the prepared FCLs of Examples 1 and 2,
With respect to the commercially available FCLs of Comparative Examples 1 and 2, peel strength and occurrence of pinholes were examined. The peel strength was measured according to JIS C-6471. Regarding the pinholes, the number of pinholes generated within an area of 10 cm × 10 cm was counted using a transmission microscope. The evaluation results are shown in Table 2 below.

Next, for the prepared FCLs of Examples 1 and 2 and the commercially available FCLs of Comparative Examples 1 and 2, the conductive film DFR manufactured by Fuji Photo Film Co., Ltd. (“HL-
020 ") was laminated on the plating layer using a laminator. Next, an opposing comb-shaped negative pattern (S / L = 5)
(0 μm / 50 μm) to expose the DFR at 50 mJ. Thereafter, the film was developed with an aqueous solution of Na ₂ CO ₃ (1% concentration), and further etched with a solution of cupric chloride for 50 seconds. Further, the remaining DFR was removed with acetone.
Next, a layer containing a solder resist (manufactured by Du Pont) is formed by screen printing on the patterned copper plating layer and on the exposed undercoat layer (thickness: about 20 μm), and at 150 ° C. Heat treatment was performed for one hour to produce printed circuit boards each having a micropatterned comb-shaped circuit.

A DC voltage of 5 was applied to each of the produced printed circuit boards.
V was applied and the insulation resistance between the wirings was measured. further,
A DC voltage of 5 V was continuously applied, and the durability of the insulation resistance between the wirings was examined at a temperature of 100 ° C., a humidity of 90% RH, and a load of 1.3 kg / cm ² . Table 2 below shows the evaluation results.
Respectively.

[0061]

[Table 2]

[0062]

According to the present invention, it is possible to provide a conductive film having good conductive performance, which can be manufactured by a simple process. Further, according to the present invention, it is possible to provide a method for stably producing a conductive film having good conductive performance by a simple process and at low cost.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view schematically illustrating a layer configuration of a conductive film according to a first embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view schematically illustrating a layer configuration of a conductive film according to a second embodiment of the present invention.

FIG. 3 is a schematic cross-sectional view schematically illustrating a layer configuration of a conductive film according to a third embodiment of the present invention.

FIG. 4 is a diagram schematically illustrating an example of a manufacturing process of a conductive film according to a third embodiment of the present invention.

FIG. 5 is a view schematically showing another example of the process of manufacturing the conductive film according to the third embodiment of the present invention.

[Explanation of symbols]

 10 20 30 conductive film 12 support 14 14 'conductive layer 16 16' plating layer 22 photosensitive layer 24 mask

Continued on the front page F-term (reference) 2H092 GA50 GA51 GA64 HA18 MA10 MA11 NA28 4F100 AB10B AB10H AB16B AB16H AB17B AB17H AB24B AB24H AB31B AB40B AB40H AH02B AH02H AH08B AH08H AK49A AT00A BA02E EBJE 431 JL02 YY00A YY00B 4K022 AA13 AA18 AA32 AA41 BA01 BA02 BA03 BA08 BA14 BA18 CA15 CA17 CA19 CA20 CA21 DA06 DB01 5G307 GA06 GB01 GC01 GC02 5G435 AA17 HH02 HH12 KK07

Claims (7)

[Claims] 1. A support comprising: a support; and a conductive layer obtained by applying a coating solution containing metal acetylide on the support and subjecting the coating to heat treatment, wherein the conductive layer has a surface electric resistance of 500 Ω / □ or less. Certain conductive films. 2. The method according to claim 1, wherein the metal element contained in the metal acetylide is
The conductive film according to claim 1, wherein the conductive film is any metal element selected from a metal element group consisting of silver, gold, copper, aluminum, nickel, and palladium. 3. The conductive film according to claim 1, wherein the support has a short-term heat-resistant temperature of 150 ° C. or higher. 4. The conductive film according to claim 1, further comprising a plating layer formed on the conductive layer by using the conductive layer as a plating nucleus. 5. The conductive film according to claim 1, wherein the conductive layer contains an alloy. 6. A first step of applying a coating solution containing at least a metal acetylide onto a support and subjecting it to a heat treatment to form a conductive layer, and forming the conductive layer with palladium, tin, and A second step of treating by contacting at least with an acidic solution containing ions of any metal element selected from the group consisting of silver metal elements. 7. The method for producing a conductive film according to claim 6, further comprising a third step of forming a plating layer on the conductive layer using the conductive layer as a plating nucleus after the second step.