JP2001153909A - Board inspecting device, board manufacturing method, and board with bump - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a board inspecting device which inspects the electric resistance value, etc., of a wiring net on a printed wiring board such as a board with bumps, etc., with high precision and with general versatility, to provide a high-quality board product having a precise wiring net formed by using the inspecting device, and to provide a manufacturing method for the board. SOLUTION: In a resistance value inspecting device 1, a plurality of first terminal portions are arrayed and formed two-dimensionally on the rear of a board body 14, and solder bumps 6 are arrayed and formed two-dimensionally on the board surface as second terminal portions which correspond to the first terminal portions. A group of first measuring probes 13 is brought into contact with the group of first terminal portions. Besides, a second measuring probe 42 is brought into contact with a second terminal portion which correspond to a wiring net being an object of measurement selectively in such a way as to be attachable or detachable freely. It becomes possible to perform resistance measurement of the wiring net by a so-called four-terminal method, etc., on the basis of the level of voltage applied to the wiring net to be measured, causing measuring current to flow in the wiring net under that condition of contact. Accordingly, influence of contact resistance is excluded, and the specific electric resistance value of the wiring net can be grasped accurately, and consequently, a wiring net which is abnormal can be indentified precisely.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board such as a board with a pump, a board inspection method and apparatus for inspecting an electric resistance value and the like, and a board manufacturing method.

[0002]

2. Description of the Related Art On a printed circuit board, an electrical inspection is generally performed in which a constant voltage is applied between terminals of a wiring pattern, a conduction / insulation state is determined by a resistance value, and a disconnection / short circuit is inspected. . In such an inspection, a probe having needle-like contact pins is brought into close contact with the printed circuit board from above and below, and the resistance value of a wiring circuit between the probes is measured to determine whether a disconnection, a short circuit, or the like has occurred. Is determined. At this time, when normal electrical continuity is obtained, that is, when a normal resistance value is obtained, it can be determined that the circuit is in a normal state. Can be determined.

In the resistance value inspection, it is desired that the probe that comes into contact with the substrate be inspected at an accurate inspection position and in an accurate contact state (a state in which the probe comes into contact with the substrate with an appropriate range of load). In order to solve some of such demands, conventionally, a plurality of probes are arranged on jigs provided up and down corresponding to a substrate so that probes (contact pins) are located at inspection positions. It is provided perpendicular to the substrate. The contact pins are accommodated in a plurality of holes formed in the jig, and are urged toward the substrate by a conductive spring to maintain the contact state and prevent the pins from sinking.

However, in such a method, the pitch of the holes provided in the jig (or the interval between the probes) must be set to a certain interval or more due to its structure. Therefore, a jig or a plurality of probes may be in contact with a PGA or LGA pad having a wide pitch, but a contact having a narrow pitch such as a C4 pad cannot have a contact pin structurally. This method is extremely difficult. According to this example, a so-called two-terminal resistance measuring method has been proposed. However, in this method, since the contact resistance between the probe and the terminal is added, accurate measurement of the resistance value is difficult, and high accuracy It was not an inspection.

In particular, when it is desired to exclude a wiring having a slightly higher resistance value due to the influence of a via root or an incomplete disconnection as a defect, it is only necessary to determine whether or not the resistance is higher than a threshold value by a two-terminal method. Then I can't escape inspection. In this case, it is conceivable to cope with the problem by lowering the threshold level. However, the two-terminal method is susceptible to the state of contact resistance, and consequently the risk of determining a non-defective product as defective is increased. Further, when a specific resistance value is different for each wiring in a package substrate in which a large number of wirings are incorporated, such a measure is basically impossible.

[0006]

SUMMARY OF THE INVENTION An object of the present invention is to provide a board inspection apparatus for inspecting the electric resistance value of a wiring net on a printed wiring board such as a board with a pump with high accuracy and versatility. Another object of the present invention is to provide a high-quality substrate product having an accurate wiring net by using the inspection device, and a method of manufacturing the same.

[0007]

Means for Solving the Problems and Actions / Effects In order to solve the above-mentioned problems, the present invention provides a plurality of first terminals arranged two-dimensionally on one plate surface of a substrate body. A plurality of second terminal portions corresponding to the first terminal portion are formed and arranged two-dimensionally on the other plate surface, and the first terminal portion and the second terminal portion correspond to each other. Each other,
An inspection device for a substrate having a structure individually connected by a wiring net including a via, comprising a probe element for current flow and a probe element for voltage measurement, wherein the probe element is detachably attached to a first terminal portion. A first measurement probe that is in contact with the first measurement probe group, a plurality of first measurement probe group corresponding to the two-dimensional arrangement of the first terminal portion, having a probe element for current flow and a probe element for voltage measurement, In those probe elements, a second measurement probe that selectively and detachably abuts any of the plurality of second terminal portions, a first measurement probe group is brought into contact with the first terminal portion group, and The second measuring probe is brought into contact with the second terminal portion corresponding to the wiring net, and in this state, the measuring current is applied to the wiring net by the current applying probe element, and the voltage measuring probe element is Based on the applied voltage level to the wiring net measured by the above, the specific electric resistance information generation means for generating information reflecting the specific electric resistance of the wiring net, and the generated specific electric resistance information, By comparing with the reference information individually defined for each wiring net,
Inspection information generating means for generating inspection information on the quality of the wiring net.

[0008] One measurement probe group is brought into contact with the first terminal section group, and a second measurement probe is selectively and detachably brought into contact with the second terminal section corresponding to the wiring net to be measured. In that state, the specific electric resistance value information generating means supplies a measuring current to the wiring net by the current supplying probe element, and based on the voltage level applied to the wiring net measured by the voltage measuring probe element. Thus, information reflecting the specific electric resistance value of the wiring net can be generated.

This is based on the so-called four-terminal method (or the five-terminal method or the eight-terminal method in consideration of the shielding of the measurement wiring) and can eliminate the influence of the contact resistance, and can eliminate the specific electric resistance of the wiring net. The value can be accurately grasped, for example, by the absolute value level, and the wiring net in which an abnormality has occurred can be accurately identified. In addition, there is an advantage that a wiring net to be measured can be selected only by moving the second measurement probe. Then, by comparing the generated specific electric resistance value information with reference information individually determined for each wiring net, the test information generation unit can generate test information relating to the quality of the wiring net. As a result, even when the specific electric resistance value differs for each wiring net, the quality of each wiring net can be reliably inspected and identified by using the individual reference information.

The second measurement probe is relatively movable in the direction of the plate surface of the substrate body on the side where the second terminal portion is formed, in order to select a second terminal portion corresponding to the wiring net to be measured. And it can be provided so as to be able to approach and separate from the second terminal portion in the thickness direction.

With this configuration, the second measurement probe can be moved in the direction of the plate surface of the substrate body, and the measurement probe can be two-dimensionally moved to a position corresponding to the second terminal portion in the wiring net to be measured. . And since it is possible to approach / separate, the second measurement probe can be brought into contact with the selected second terminal portion, and it is possible to generate information reflecting the specific electric resistance value. Further, since the second terminal portion can be separated, the selected position of the second terminal portion can be changed.

A substrate supporting portion for detachably supporting the substrate substantially horizontally so that the first terminal portion side is on the lower side, and the first measurement probe group is provided on the lower surface side of the supported substrate, respectively. While contacting the first terminal portion, the second measurement probe is
The upper surface side of the substrate can selectively contact the second terminal portion.

[0013] In this case, the substrate can be attached and detached and exchanged with the inspection, and the substrate can be stably held because it is substantially horizontal. In addition, since the second measurement probe is provided on the upper surface side, devices and accessories attached to the second measurement probe can be installed on the upper part of the substrate, and installation and maintenance of those devices and accessories can be easily performed.

[0014] Further, after the measurement wiring group extending downward from the first measurement probe group is extended to a position deviated laterally from the substrate position, it is held in a state where the end is turned upward. Then, the auxiliary probe corresponding to the wiring net to be measured is brought into contact with the auxiliary terminal portion formed at the end portion, and the auxiliary probe, the corresponding measurement wiring and the first measurement probe are interposed. Thus, the resistance of the wiring net can be measured with the second measurement probe.

The measurement wiring group extending downward from the first measurement probe group is extended to a position deviated laterally from the substrate position, and the auxiliary terminal formed at the end of the measurement wiring group is oriented upward. Therefore, the equipment and accessories attached to the auxiliary probe that performs selection, contact, etc. at the auxiliary terminal can be installed at the upper position of the auxiliary terminal, so that measurement is easy and their installation and maintenance are easy. Become.

An auxiliary terminal holding plate for holding the auxiliary terminals from the respective measurement wires in a two-dimensional array corresponding to the first measurement probe group may be provided. In this case, since the auxiliary terminal portion is two-dimensionally arranged, the auxiliary terminal selection mechanism associated with the auxiliary probe to be brought into contact with the auxiliary terminal portion may be configured in accordance with the two-dimensional arrangement (ie, two-dimensional arrangement). Since the position of the auxiliary probe can be adjusted by a general-purpose mechanism capable of adjusting the position three-dimensionally, the configuration of the device can be further simplified.

Each of the measurement wires from the first measurement probe group includes a current-carrying wire and a voltage-measurement wire which are respectively connected to the current-carrying probe element and the voltage-measuring probe element of the corresponding first measurement probe. And one of the voltage measurement wiring and the current conduction wiring is connected to the auxiliary terminal portion, and the other is connected to the common connection. In this way, one of the wirings can be used as a common connection, and the circuit configuration can be simplified, and the wiring net to be measured can be selected by the other wiring. Can be achieved.

In the above configuration, the voltage measurement wiring may be connected to the auxiliary terminal portion, while the current supply wiring may be connected to the common measurement constant current power supply. In this case, of the plurality of first measurement probes, each end of the current supply wiring extending individually from the one arranged adjacent to each other is connected to a different connection point with respect to the common power supply wiring toward the measurement constant current power supply. Wiring segments that are adjacently connected and located between the adjacent connection points of the common power supply wiring are connected to different wiring nets when the second measurement probe and the auxiliary probe are erroneously connected to the wiring segment. The leakage current suppressing means for suppressing the leakage of the measuring current may be provided.

If the second measuring probe and the auxiliary probe are erroneously connected to different wiring nets, the measuring current leaks to the wiring segment by the leakage current suppressing means. Is reduced, and the probability of occurrence of an inspection error resulting from an incorrect connection can be reduced.

[0020] The leakage current suppressing means may include a resistance element having at least a resistance value larger than a reference resistance value determined as reference information. By doing so, the specific electrical resistance value information obtained when the wiring nets are connected to different wiring nets becomes reference information and information having an excessively large resistance value as compared with the information due to the fault of the wiring net. Incorrect connection can be determined.

In the first measuring probe, one of the current carrying probe element and the voltage measuring probe element is a first probe element and the other is a second probe element, and at least the first probe element is connected to the first terminal. The first probe element is provided so as to be able to advance and retreat in the contact direction, elastically deforms with the retraction of the first probe element due to the contact with the first terminal section, and is attached to the first terminal section by the elastic return force. A first elastic biasing member for biasing may be provided.

With this configuration, in a state where the first probe element is in contact with the first terminal portion, the first elastic urging member urges the first probe element in the contact direction to maintain a good electrical contact state. Becomes As a result, the contact resistance between the first probe element and the first terminal can be stabilized at a low value.

The second probe element is provided so as to be able to advance and retreat independently of the first probe element in the contact direction with the first terminal portion, and the first measurement probe and the first terminal portion are relatively approached in the contact direction. Accordingly, the contact state can be formed between the first probe element and the first probe element substantially simultaneously with or later than the first probe element. Also, a second elastic urging member that elastically deforms with the retraction of the second probe element due to contact with the first terminal part and urges the second probe element toward the first terminal part by its elastic return force. Can be provided.

By doing so, the first probe element and the second probe element can be independently biased to the first terminal portion, so that both probe elements (the first probe element and the second probe element) ) Is urged in the contact direction in a state of contact with the first terminal portion. Therefore, the contact state between both probe elements and the first terminal portion becomes good, and the contact resistance associated therewith can be stabilized at a low value.

The first measuring probe includes a cylindrical probe element and a pin-shaped probe element coaxially arranged inside the cylindrical probe element, one of the probe elements being the first probe element, The other can be a second probe element.

By doing so, when the first terminal is pin-shaped, such as a PGA (pin grid array) substrate, the pin as the first terminal is inserted into the opening of the cylindrical probe element. It can be inserted and positioned in the tube of the tubular probe element. Therefore, accurate positioning can be achieved even when some vibration or the like is involved.

A second coil spring disposed coaxially within the cylindrical probe element and for urging the pin-shaped probe element from the rear side; So that one of the first coil spring and the second coil spring functions as a first elastic urging member, and the other functions as a second elastic urging member. it can.

As described above, the cylindrical probe element and the pin-shaped probe element are urged by the first coil spring and the second coil spring, so that the contact state between both probe elements and the first terminal portion can be kept good. it can. Further, since the probe is urged by the coil spring, the probe has a cushioning property at the time of contact. Therefore, the impact generated on the substrate or the like is reduced, which helps to improve the quality. In addition, since the first coil spring is housed in the cylindrical probe element, it is compact and can easily cope with a thin probe.

The pin-shaped probe element may be a first probe element, and the tip of the pin-shaped probe element may be arranged to protrude by a predetermined amount from the tip edge of the cylindrical probe element as the second probe element. By doing so, the load can be concentrated on the tip of the pin when the pin-shaped probe element contacts, and the contact state of the pin-shaped probe element can be ensured.

On the other hand, when the pin-shaped probe element is used as the first probe element, the distal end surface of the cylindrical probe element, which is the second probe element, is formed as a tapered surface which is retracted at the center of the axial cross section. Can be configured to protrude in the axial direction from the inner edge position of the tapered surface.

By doing so, when the first terminal portion is a pin-shaped terminal, the distal end of the cylindrical probe element is tapered so as to be widely formed, so that the insertion of the pin becomes easy, and the positioning accuracy (the cylindrical shape) is improved. The accuracy of contact between the probe element and the protruding terminal is improved. In addition, since the tip position of the needle-shaped probe element protrudes in the axial direction from the inner edge position of the tapered surface, the contact between the inserted protruding terminal and the pin-shaped probe element located in the cylinder is ensured. Can be done. Further, since the leading edge of the pin-shaped terminal forms a linear contact form in the circumferential direction with the tapered surface with the cylindrical probe element, poor contact is less likely to occur.

[0032] The tip edge position of the pin-shaped probe element can be set so as to be retracted in the axial direction from the outer edge position of the tapered surface. By doing so, when targeting the first terminal portion to be a protruding terminal (for example, a pin), the protruding terminal is inserted into the cylinder, and after the positioning by the cylindrical probe, the pin-shaped probe element is Will be in contact. Therefore, at the time of contact, the first terminal portion and the first measurement probe can be reliably brought into contact once.

The second measuring probe is formed so that the tip side is sharp with the direction of contact with the second terminal portion being the tip side, and one is a probe element for conducting current and the other is a probe element for voltage measurement. And a pair of needle-like probe elements arranged in such a manner that they are inclined in directions opposite to each other with respect to the contact direction so that the arrangement interval becomes narrower toward the distal end side. Can be used. By doing so, the distance between the needle-shaped probes at the tip of the second measurement probe can be made a narrower width, so that the contact range (contact width) of the second measurement probe can be reduced, and the second probe has a minute second terminal portion. And
The contact is possible even when the second terminal portion interval is a narrow width.

Further, according to the present invention, a plurality of second terminal portions each formed of a solder bump are two-dimensionally arranged and formed on one plate surface of the substrate body, and each second terminal portion is formed on the other plate surface. A plurality of first terminal portions corresponding to the portion are arranged and formed two-dimensionally, and the corresponding ones of the second terminal portion and the first terminal portion are individually connected by a wiring net including a via. A substrate forming step of obtaining a substrate with a bump having a structure, and a second terminal portion made of a solder bump corresponding to a wiring net to be inspected using the substrate inspection apparatus, the solder bump having a predetermined depth. As the measurement hole is formed, the tip of the second measurement probe is brought into contact with the second measurement probe, and the second measurement probe is brought into contact with the second terminal corresponding to the wiring net, In that state, the second measurement probe and the second measurement probe An electric resistance information generating step of applying a measuring current to the wiring net via the measurement probe and generating information on an electric resistance value of the wiring net; and forming the wiring net based on the generated electric resistance information. A test information generating step of generating test information relating to pass / fail of the test, and a selecting step of selecting only substrates for which the generated test information satisfies predetermined conditions.

As described above, the electric resistance value information generated in the electric resistance value information generating step is compared with the reference information to generate the inspection information in the inspection information generating step, and the inspection information selects only a predetermined substrate. By including the sorting step, a discrimination between a good product and a defective product can be easily and accurately performed, thereby realizing a substrate manufacturing method capable of obtaining a high quality product.

Further, when the depth of the measurement hole is d1 and the height of the solder bump is H, the second measurement probe is connected to the solder bump so that d1 / H is in the range of 0.1 to 0.9. A substrate manufacturing method can be provided.

In the electric resistance value information generation step, when the ratio d1 / H of the hole depth to the solder bump height is smaller than this range when the second measurement probe is cut into the solder bump, sufficient contact is made. If the state cannot be maintained, the contact resistance may increase or become unstable. If the contact resistance is larger than this range, the load generated on the solder bumps will increase and the load on the substrate will increase (crushing of the solder bumps, wiring of the substrate wiring, etc.). It leads to disconnection etc.). Therefore, by making the second measurement probe cut into the solder bump so as to form a measurement hole in this range, the resistance value can be measured with high accuracy, and thus a substrate manufacturing method for providing a high quality bumped substrate Becomes

Assuming that the area of the hole opening of the measurement hole in plan view is S1, the ratio S1 / S0 to the bump bottom area S0.
May be a substrate manufacturing method in which the second measurement probe is cut into the solder bumps so that the value is 0.002 to 0.45.

When the ratio S1 / S0 is smaller than this range, a good contact state between the second measurement probe and the solder bump is not obtained, and the contact resistance increases or becomes unstable. Also,
If the ratio is larger than this range, not only the appearance is not good, but also the possibility of crushing of the solder bump or disconnection of the substrate wiring of the bump due to the measurement hole increases. Therefore, a good product can be provided while maintaining the inspection accuracy by employing a board manufacturing method in which the second measurement probe is cut into the solder bumps so that the ratio S1 / S0 is within this range.

The second measuring probe includes a pair of needle-shaped probe elements, each of which has a pointed end in the direction of contact with the solder bump and whose tip side is sharp, and the needle-shaped probe elements are directed toward the distal end. In such a way that the arrangement interval becomes narrower, those arranged in a state of being inclined in directions opposite to each other with respect to the contact direction are used, one is a probe element for current flow, and the other is a probe element for voltage measurement. And a distance between the tip of the current conducting probe element in the contact direction with the second terminal portion and the contact direction of the voltage measuring probe element with the second terminal portion is L, The ratio L / R to the bump diameter R is 0.2 to 0.2
The substrate manufacturing method may be 0.85.

The second measuring probe includes a pair of needle-like probe elements, each of which has a tip in the direction of contact with the solder bump and whose tip is formed sharply. Resistance value measurement (resistance value measurement in which the influence of contact resistance is extremely small) becomes possible. When the ratio L / R of the pair of needle-like probe elements serving as the terminals is smaller than this range, for example, when the tip end distance L is short, both probe elements (current-feeding probe element,
It is highly probable that insulation failure (continuity) of the voltage measurement probe element) will occur, and if it is larger than this range, one or both of the two probe elements may come off from the solder bump to be abutted. This is a high resistance value inspection. Therefore, by setting the ratio L / R within such a range, a specific electrical resistance information generation step or the like can be performed in a good contact state, and a substrate manufacturing method capable of manufacturing a high-quality product can be achieved.

In the above-mentioned substrate manufacturing method, the second measurement probe cuts into the surface layer of at least a part of the solder bumps so that the openings are formed on the surface of the solder bumps.
A pair of measurement holes is formed, and the ratio r / R to the diameter R of the solder bump is defined as r, where r is the distance between the holes defined as the geometric distance between the centers of gravity of the hole openings in plan view. The second measurement probe may be cut into the solder bump so as to be 0.2 to 0.85.

Ratio of distance between holes to solder bump diameter r /
If R is smaller than this range, it is difficult to completely insulate the current-carrying probe element and the voltage-measuring probe element (the two probe elements are likely to come into contact with each other due to vibration or the like). There is a high possibility that one terminal of the two-measurement probe will fall outside the solder bump. Therefore, by forming the measurement hole so as to have this range, the electrical resistance value information generation step and the like can be performed in a good contact state between the second measurement probe and the solder bump.

Due to the bite of the second measurement probe, a pair of measurement holes respectively opened on the surface of the solder bump are formed in the surface layer of at least a part of the solder bump.
When the depth of each of the pair of measurement holes is d2 and the height of the solder bump is H, the second measurement probe is cut into the solder bump such that d2 / H is 0.1 to 0.9. You can also.

For example, when two terminals are brought into contact with a solder bump by a four-terminal method or the like to measure the resistance value, the ratio of the depth of the pair of measurement holes to the height of the solder bump d2 / H
Is smaller than this range, a sufficient abutting state cannot be maintained at both abutting terminals, and there is a possibility that contact resistance increases or becomes unstable. On the other hand, if it is larger than this range, the load generated on the solder bumps increases and the load on the substrate increases (leading to crushing of the solder bumps, disconnection of the substrate wiring, etc.). Therefore, by forming the measurement holes in this range, the electrical resistance information generation step (for example, a resistance value inspection step by a four-terminal method or the like) can be performed in a favorable state on the substrate with bumps. In the process, the shape change of the solder bump can be made very small and quality can be maintained

Each of the pair of measurement holes has a substantially V-shaped vertical cross-sectional shape in which the axial cross-sectional area is reduced toward the bottom, and is inclined in the depth direction so as to approach each other at the V-shaped bottom side. A method of manufacturing a substrate formed by using the method described above.

At the bottom of the measurement hole, a substantially V-shaped axial cross-sectional shape having a reduced axial cross-sectional area is formed. The influence of the measurement hole can be reduced, which leads to protection of wiring and the like. In addition, by being formed so as to be inclined in the depth direction so as to approach each other at the V-shaped bottom side, the hole interval can be narrowed and can be kept in an appropriate range. Therefore, the quality of the solder bumps can be maintained while reliably performing the resistance value inspection and the like in the electrical resistance value information generation step.

In the above substrate manufacturing method, the ratio S2 / S0 to the bump bottom area S0 is 0.002 to 0.4, where S2 is the total area of the pair of measurement holes as viewed in plan.
5 so that the second measuring probe can be cut into the solder bump.

If the ratio S2 / S0 is smaller than this range, for example, in the four-terminal method or the like, good contact between the two terminals and the solder bumps is not obtained (the two terminals have good contact with the solder bumps). A sufficient contact area for conduction to the contact cannot be secured), or the contact resistance increases or becomes unstable. Also,
If the ratio is larger than this range, not only the appearance is not good, but also the possibility of crushing of the solder bump or disconnection of the substrate wiring of the bump due to the measurement hole increases. Therefore, by making the second measurement probe bite into the solder bump so as to take this range in the electric resistance value information generation step, the inspection can be performed reliably and a high-quality bumped substrate can be provided.

Further, according to the present invention, the continuity inspection probe is used as a second measurement probe, and the second measurement hole is formed and the probe is cut into contact with the solder bump so that the electrical resistance information at that time can be obtained. A first inspection information generating step of generating first inspection information relating to a conduction state of a corresponding wiring net based on the first inspection information, and a first selection of selecting only a board for which the generated first inspection information satisfies a predetermined condition as a non-defective product Step and a pair of needle-like probe elements are used as second measurement probes for the substrate selected as non-defective in the first selection step, and a pair of solder bumps are formed on the surface of the solder bump. While forming the first measurement hole,
These probes are cut into contact with each other, and in that state, one needle probe is used as a current carrying probe element and a current for measurement is applied to the wiring net, while the other needle probe is used as a voltage measuring probe element. Means for measuring the voltage level applied to the wiring net and generating information reflecting the specific electric resistance value of the wiring net; and generating the specific electric resistance value information for the wiring net. A second inspection information generating step regarding the quality of the wiring net by comparing with reference information individually determined for each of the wiring nets, and a second step of selecting only a substrate for which the generated second inspection information satisfies a predetermined condition. And a sorting step.

As described above, by having the first inspection information generation step and the second inspection information generation step, it is possible to synergistically prevent omission of defective products, and to remove defective products with extremely high accuracy. . Also, a first inspection information generating step of generating first inspection information relating to the conduction state (for example, a continuity inspection step as a step of inspecting whether or not the wiring net is conductive)
And a second inspection information generating step (for example, a resistance value inspection as a step of measuring a resistance value unique to each wiring net) which is a separate step for removing defective products in each step independently. As a result, it is possible to reduce duplicate inspection of defective products. For example, it is only necessary to remove defective products detected in the continuity inspection process in the first screening process and perform the resistance testing process and the second screening process only on the remaining products, thereby shortening the testing time in the resistance testing process. You can do it.

In the second inspection information generation step, the second measurement probe can be brought into contact with the surface of the solder bump other than the second measurement hole. When the second measurement probe is brought into contact with the second measurement hole portion by the first inspection information generation step (for example, when one probe element of the second measurement probe is inserted into the second measurement hole), Since the contact surface is not flat, the second measurement probe is contacted at an angle, resulting in an unstable contact state. Therefore, when the contact is made on the flat bump surface on which the second measurement hole is not formed, a stable contact is maintained and a good contact state is obtained, and the second inspection information generation step enables highly accurate resistance value measurement. .

Further, according to the present invention, a plurality of second terminal portions each formed of a solder bump are two-dimensionally arranged and formed on one plate surface of the substrate body, and each second terminal portion is formed on the other plate surface. Are arranged and formed two-dimensionally, and the corresponding ones of the first terminal portion and the second terminal portion are individually connected by a wiring net including a via. A substrate having a bumped structure, wherein a measurement hole having a predetermined depth is formed in a surface layer of at least a part of the solder bump, the measurement hole being opened on a surface of the solder bump. .

As described above, by setting the measurement hole formed in the solder bump to a predetermined depth, the measurement hole serves as an index for confirming whether or not the unique electrical information generation step has been normally performed on the solder bump. For example, after the formation of the measurement hole, the surface of the bump is inspected (for example, using an inspection method disclosed in Japanese Patent No. 2881146), and if the measurement hole is not formed, it is determined that the measurement is abnormal, and the inspection is performed again or the product is removed. In addition, it is also possible to detect a defect in the inspection state (it is found that there is a cause that causes an inspection abnormality in any of the inspection-related elements such as an inspection apparatus, a board, and an inspection environment). Do). If the formed measurement hole is not formed at a predetermined depth, it may be determined that the measurement hole is abnormal.

In the above-mentioned substrate with bumps, the depth of the measurement hole is set to d.
1. When the height of the bump from the substrate surface is H, d
1 / H may be adjusted in the range of 0.1 to 0.9. Ratio of hole depth to solder bump height d1 /
If H is smaller than this range, a sufficient contact state cannot be maintained, and the contact resistance may increase or become unstable. (Which leads to crushing of solder bumps, disconnection of substrate wiring, etc.). Therefore, when a measurement hole in this range is formed, it indicates that the inspection was performed in a good inspection state, and when not, it indicates an abnormality of the inspection state. Can be done.

Assuming that the area of the opening of the measurement hole in plan view is S1, the ratio S1 / S0 to the bump bottom area S0.
May be formed in the range of 0.002 to 0.45.

When the ratio S1 / S0 is smaller than this range, a good contact state between the second measurement probe and the solder bump is not obtained, and the contact resistance increases or becomes unstable. Also,
If the ratio is larger than this range, not only the appearance is not good, but also the possibility of crushing of the solder bump or disconnection of the substrate wiring of the bump due to the measurement hole increases. Accordingly, if the ratio S / S0 is within this range, it indicates that a good inspection has been performed, and the quality of the inspection can be determined based on the measurement holes.

Further, in the above-mentioned substrate with bumps, the measurement holes may be formed as a pair of measurement holes which are respectively opened on the surface of the solder bump. in this way,
By using a substrate with bumps in which a pair of measurement holes are formed, when using a resistance measurement method such as a four-terminal method in which two terminals are brought into contact with solder bumps, the two terminals are satisfactorily used. It can be determined whether or not the contact has been made. For example, when a pair of measurement holes are not formed in the bump to be formed at the time of completion of the resistance value measurement, it can be confirmed that the resistance value measurement was in an abnormal state, and the bump is subjected to the resistance value measurement inspection. It turns out to be insufficient. Therefore, re-inspection or product removal can be performed as an abnormal measurement, and a defect in the inspection state can be detected (in addition to any element related to inspection, such as an inspection apparatus, a board, or an inspection environment). It turns out that there is a cause that causes an abnormal test).

Further, each depth d of the pair of measurement holes
2. When the height of the solder bump is H, d2 / H can be adjusted in the range of 0.1 to 0.9. 4
When the resistance value is measured by bringing two terminals into contact with the solder bumps by a terminal method or the like, and when the ratio d2 / H of the depth of the pair of measurement holes to the solder bump height is smaller than this range, There is a possibility that a sufficient contact state cannot be maintained at both terminals to be contacted, and the contact resistance increases or becomes unstable.
On the other hand, if it is larger than this range, the load generated on the solder bumps increases and the load on the substrate increases (leading to crushing of the solder bumps, disconnection of the substrate wiring, etc.). Therefore, by forming the measurement holes in this range, it is possible to prove that the resistance value measurement (four-terminal method or the like) has been performed with high accuracy on the substrate with bumps (a mark to be proved is formed on the solder bumps). Can be useful for quality control.

The total area of the opening portions of the pair of measurement holes in plan view is defined as S2, and the bump bottom area S0 is defined as S2.
The substrate with bumps may be formed so that the ratio S2 / S0 to 0.002 to 0.45. If the ratio S2 / S0 is smaller than this range, good contact between the two terminals and the solder bumps will not be obtained in, for example, the four-terminal method (the two terminals have good conduction with the solder bumps). The contact resistance increases or becomes unstable. When the ratio is larger than this range, not only is the appearance not good, but also the possibility of crushing of the solder bumps or disconnection of the substrate wiring of the bumps due to the measurement holes increases. Therefore, a measurement hole in this range proves that a good inspection condition was performed,
By using a solder bump having such a measurement hole, it contributes to quality control.

Further, the measurement hole includes a first measurement hole as a pair of measurement holes, a second measurement hole different from the first measurement hole,
Can be included. In this way, by forming a pair of measurement holes and a second measurement hole different therefrom, separate inspection steps (for example, an inspection step of a conduction state of a wiring net, and a specific resistance of the wiring net) are performed. This is a proof that the value inspection process was performed on the solder bumps. Therefore, on the other hand, if the formation of the measurement hole is insufficient, it can be determined that the solder bump has not normally passed the inspection process, and the first measurement hole and the second measurement hole are used as indicators for the determination. Value.

The substrate with bumps can be formed so that the second measurement hole is a single hole having a hole opening area and a depth larger than that of the first measurement hole. By forming with such a difference, the first measurement hole and the second measurement hole can be clearly distinguished after the inspection, and the contact state of each process can be grasped.

The sum of the respective areas of the first measurement hole and the second measurement hole opening in plan view is defined as S3, and the ratio S3 / S0 to the bump bottom area S0 is 0.002 to 0.002.
A bumped substrate may be formed so as to be 0.45. If the ratio S3 / S0 is smaller than this range,
This indicates that abnormal contact has occurred in at least one of the steps of forming the first measurement hole or the second measurement hole, and the measurement hole can detect an abnormality in the inspection. When the ratio is larger than this range, not only is the appearance not good, but also the possibility of crushing of the solder bumps or disconnection of the substrate wiring of the bumps due to the measurement holes increases. Therefore, the measurement hole having this range proves that a good inspection state has been performed, and the inspection can be confirmed by the solder bump having such a measurement hole.

The ratio r / R to the diameter R of the solder bump is defined as 0.2 to 0, where r is the distance between holes defined as the geometric distance between the centers of gravity of the openings of the first measurement holes in plan view. .85 may be formed.

Ratio of distance between holes to solder bump diameter r /
If R is smaller than this range, it is difficult to completely insulate the current-carrying probe element and the voltage-measuring probe element (the two probe elements are likely to come into contact with each other due to vibration or the like). There is a high possibility that one terminal of the two-measurement probe will fall outside the solder bump. Therefore, the measurement hole having this range proves that a good inspection state has been performed, and the inspection can be confirmed by the solder bump having such a measurement hole.

Each of the pair of measuring holes has a substantially V-shaped vertical cross-sectional shape in which the axial cross-sectional area is reduced toward the bottom, and is inclined in the depth direction so as to approach each other at the V-shaped bottom side. A substrate with bumps can be formed as if formed.

At the bottom of the measurement hole, by forming a substantially V-shaped axial cross-sectional shape in which the axial cross-sectional area is reduced, at the bottom of the hole, the damage of the solder bump becomes small, and the connection to the substrate wiring is reduced. The influence of the measurement hole can be reduced, which leads to protection of wiring and the like. In addition, by being formed so as to be inclined in the depth direction so as to approach each other at the V-shaped bottom side, the hole interval can be narrowed and can be kept in an appropriate range. Therefore, the measurement hole thus formed proves that a good inspection state has been performed, and the inspection can be confirmed by the solder bump having such a measurement hole.

[0068]

Embodiments of the present invention will be described below with reference to embodiments shown in the drawings. Resistance value inspection device 1
(Hereinafter simply referred to as the inspection apparatus 1) includes a plurality of first terminals on one plate surface (in FIG. 1, the back surface of the substrate) of a substrate body 14 (hereinafter, also simply referred to as a substrate 14) as a resistance test object. Parts are two-dimensionally arranged and formed, and solder bumps 6 as second terminal parts corresponding to the first terminal parts are two-dimensionally arranged and formed on the other plate surface (the substrate surface in FIG. 1). Being provided. The first terminal portions and the solder bumps 6 as the second terminal portions have a structure in which the corresponding portions are individually connected by a wiring net including a via formed in the substrate. The plurality of first terminal portions include, for example, lands in a land grid array (hereinafter, also simply referred to as LGA), and pins in a pin grid array (hereinafter, also simply PGA).

Examples of the configuration of the substrate body 14 to be inspected include those shown in FIGS. 22 and 23. FIG. 22 shows a plan view, and FIG. 23 shows a cross-sectional structure, which will be described below. The substrate 14 is, for example, about 25 mm square and about 1 mm thick, and has the following structure. That is, a core material 80 made of a heat-resistant resin plate (for example, a bismaleimide-triazine resin plate) or a fiber-reinforced resin plate (for example, a glass fiber-reinforced epoxy resin).
Core wiring pattern layer 7 in a predetermined pattern on both surfaces of
3, 74 are respectively formed. These core wiring pattern layers 73 and 74 are formed so as to cover most of the surface of the core material 80, and are used as power supply layers or ground layers. On the other hand, a through-hole 78 formed by a drill or the like is formed in the core member 80, and a through-hole 7 conductor 76 for conducting the core wiring pattern layers 73 and 74 to each other is formed on the inner wall surface. The through hole 78 is filled with a resin filling material such as epoxy resin.

On the upper layers of the core wiring pattern layers 73 and 74, first build-up layers are respectively formed by a resin such as a photosensitive epoxy resin. Further, first wiring pattern layers 70 and 71 are formed on the surface thereof by Cu plating. The core wiring pattern layer 7
3, 74 and the first wiring pattern layers 70, 71 are connected to each other by via conductors. Similarly, a second resin buildup layer is formed on the first wiring pattern by a resin such as a photosensitive epoxy resin. Further, second wiring pattern layers 82 and 84 are formed on the surfaces thereof by Cu plating. These first wiring pattern layers 70 and 71 and second wiring pattern layer 8
Both layers 2 and 84 are connected to each other by via conductors. Each surface of the core wiring pattern, the first wiring pattern layers 70 and 71, and the second wiring pattern layers 82 and 84 is subjected to a surface roughening treatment (for example, a chemical treatment) in order to increase the adhesion strength to the upper resin layer. That is based on).

Further, on the second resin build-up layer, a large number of underlying conductive pads 90 that are electrically connected to the second wiring pattern layers 82 and 84 are provided. The base conductive pads 90 are arranged in a square shape at substantially the center of the substrate 14 by electroless Ni-P plating and Au plating, and form a chip mounting portion together with the solder bumps 6 formed thereon. The solder bump 6 has a diameter of 133 μm and a height of 33 μm. The second wiring pattern layer 84 is used as a land as an external connection terminal. As described above, in the package board in which a large number of wirings are incorporated, a wiring net is formed with a specific resistance value for each wiring (for example, wiring inside the board from the solder bump 6 to the corresponding land). Therefore, the inspection apparatus 1 inspects whether or not the wiring net is formed normally.

The device 1 has a probe (a first measurement probe, a second measurement probe, a second measurement probe, Measurement probe).
Then, the position is adjusted by a position adjusting unit described later,
Position adjustment means that can be set at a specific position on the substrate 14 (any of the solder bumps 6 on the substrate 14) is provided on one side (the upper surface side in FIG. 1). One of the plurality of solder bumps 6 as the second terminal portions formed on the upper surface of the substrate and connected to the wiring net is selected by the position adjusting means, and the selected solder bump 6 and the second measurement probe 42 Will be contacted.

On the other side (the lower side of the substrate 14 in FIG. 1), a first measuring probe 10 which can be brought into contact with a first terminal portion (eg, land, pin, etc.) provided on the substrate 14 is provided. A plurality is arranged. Each first measurement probe 1
Reference numeral 0 denotes a first terminal portion (for example, a land, a pin, or the like) formed on one side of the substrate (the first measurement probe 10 side). Has formed. Then, a part or all of the first measurement probe 10 in the first measurement probe group 13 and the corresponding first terminal portion are brought into contact by the approach / contact means described later, and the first terminal is located at the contact position. Conduction between the in-substrate wiring having the portion at the end and the first measurement probe 10 becomes possible.

In a state where the first measuring probe 10 and a part or all of the first terminal part are in contact with each other, the position of the second terminal part (corresponding to the corresponding solder bump) corresponding to the part or all of the contact position 6) is brought into contact with the second measurement probe 42 and the second measurement probe 42 and the corresponding wiring in the substrate are electrically connected to each other via the first measurement probe 10, and the two probes are connected to each other. It becomes electrically conductive, and a resistance value test can be performed as a second test information generation step.

Further, the second measuring probe 42 and the first measuring probe 10 sandwich the substrate 14 serving as the resistance measurement object as one of the plus terminal and the minus terminal and the other terminal in the four-terminal resistance measurement method. It is arranged in. Each of the upper and lower probes has a source terminal as a current carrying probe element and a sense terminal as a voltage measuring probe element. The two probes are insulated from each other by being subjected to insulation treatment by coating with an insulator or the like. The source terminal and the sense terminal provided on each of the upper and lower probes have a current carrying wire 21 and a voltage measuring wire 2 respectively.
A circuit configuration is adopted in which conductors as 2 are connected at the top and bottom, respectively, and four-terminal resistance measurement and the like can be performed. In this circuit configuration, the source terminals provided on the upper and lower sides are connected to a constant current power supply for measurement 48 (see FIG. 14) provided inside the measuring device 26 via current supply wiring, and the sense terminal is connected to a voltage measurement terminal. It is connected to a voltage measuring device 50 (FIG. 14) in the measuring device 26 via a wire to perform resistance measurement such as four-terminal resistance measurement.

When the first measurement probe 10 is moved by the approach / contact means described later and comes into contact with the substrate, the first measurement probe 10 corresponds to the land 9 as the first terminal as shown in FIG. Land 9
Will come into contact with. And at the start of contact,
The tip of the first sense terminal 10b is pressed at the land 9 position by the substrate 14, and moves into the first source terminal 10a against the urging force of the urging means described later. When depressed a predetermined distance, the tip position of the first sense terminal 10b reaches the opening end of the first source terminal 10a, at which point the first source terminal 10a comes into contact with the land 9.
That is, the land 9 as the first terminal on the substrate 14
Are simultaneously and individually brought into contact with two probes (first source terminal 10a, first sense terminal 10b) which are each given an urging force in the contact direction by the urging means and are electrically insulated from each other. Conduction becomes possible. The internal configuration of the first measurement probe 10 that provides such an operation will be described below.

FIG. 4 is an enlarged view of an example of the first measurement probe 10, and FIG. 5A is a sectional view thereof.
The first measurement probe 10 of FIG. 4 has a first sense terminal 10b as a pin-like probe element having a conductive tip protruding in a needle shape, and is formed in a cylindrical shape, and is slidably fitted to the first sense terminal 10b. A first source terminal 10a is provided as a cylindrical probe element having combined conductivity. And
The first sense terminal 10b and the first source terminal 10a are electrically insulated from each other by applying an insulating treatment such as coating with an insulator at a contact portion with each other. The first sense terminal 10b is provided with a second coil spring 17 as a second elastic biasing member having conductivity as biasing means capable of biasing in the substrate direction. A first coil spring 16 as a first elastic urging member having conductivity is provided as urging means capable of urging in the direction of the substrate. The first sense terminal 10b is conductively connected to the second coil spring 17, and the second coil spring 17 is conductively connected to the terminal 18 that is electrically insulated from the conductive base 28. . Accordingly, the first sense terminal 10b and the voltage measurement wiring 22 can be conducted, and the elements (the second elastic biasing member 17, the terminal 18, and the like) that are conductively connected to the first sense terminal 10b are the voltage measurement wiring 22. To form a part of.

At the lower end of the first source terminal 10a, a first coil spring 16 as a first elastic urging member having conductivity as urging means is connected in a conductive manner. The other end is conductively connected to a conductive base 28 formed of a conductive material (eg, copper or the like). Therefore, the first source terminal can also conduct with the current-carrying wiring 21 via the base 28. Further, the first coil spring 16 and the second coil spring 17 are electrically insulated (the insulating treatment may be performed by coating with an insulator or the like). Elements (the first elastic biasing member 16 and the base 28) that are conductively connected to the first source terminal 10 a are the current-carrying wires 21.
Is an element constituting a part of.

Then, the first measurement probe 10 is
5a, the tip of the first sense terminal 10b and the tip of the first source terminal 10a are connected to both probes in a state of contact. Elastic biasing member (first and second coil springs 1)
6, 17) are pressed independently of each other by a predetermined distance against the urging force. When measuring the resistance value, both probes are connected to the first terminal portion (for example, FIG.
In the state of contact with the land 9) in (b), they are urged independently in the contact direction. In addition, the first source terminal 10a and the second sense terminal 10b constitute a probe main body at a tip portion (tip of the needle portion in the first sense terminal 10b and an open end in the first source terminal 10a) in contact with the first terminal portion. The conductive material (eg, copper or the like) is exposed, and the first terminal portion and both terminals can be electrically connected at the time of contact. In addition, in each of the terminals, conduction can be made independently to each wiring from a contact portion with the first terminal portion as a base point, but in the meantime, both terminals and their accompanying elements (coil spring Etc.) are electrically insulated.

As shown in FIG. 2, a plurality of first measurement probes 10 in contact with each first terminal portion of the substrate 14 are connected to a voltage measurement wiring 22 electrically connected to the first sense terminal 10b for each probe. You. The conductive base 28 of each probe, which is electrically connected to the first source terminal 10a, has a common connection that is electrically connected to all the first source terminals 10a, and the current connection wiring 21 is connected to the common connection. It will be. The voltage measurement wiring 22 connected to each terminal 18 is connected to a plurality of lower auxiliary terminals 33 provided on the lower surface side of the auxiliary terminal holding plate 25 provided at another position on the substrate 14 as shown in FIG. It is connected. The position where the voltage measuring wiring 22 is connected to the lower auxiliary terminal 33 is provided corresponding to the position where the voltage is conducted on the substrate 14. That is, the same arrangement as the arrangement of the first terminal portion of the substrate 14,
Alternatively, it is deployed on the auxiliary terminal holding plate 25 in an arrangement related to the arrangement configuration. In this embodiment,
The arrangement is the same.

Referring to FIG. 3, a description will be given of a method of attaching the substrate 14 as the resistance measurement object. The substrate 14 is positioned on the work mounting table 34 by being mounted on a concave portion formed so that the substrate 14 is fitted at a predetermined position of the work mounting table 34 by a work mounting mechanism (not shown). Then, the work mounting table 34 is placed by the work mounting mechanism mechanism on the jig 36 in which the concave portion is formed so that the work mounting table 34 can be fitted. A hole 41 is formed in the work mounting table 34 corresponding to each probe position of the first measurement probe group 13 fixed on the jig 36. When the work mounting table 34 is mounted on the jig 36, the holes 41 are formed. First measurement probes 10 corresponding to 41 are inserted.

Each of the inserted probes has a projecting length from the base 28 to the tip of each probe formed longer than the length of the hole. The group 13 penetrates the hole 41, and the tip (the tip of the needle-like portion of the first sense terminal 10b in FIG. 4) contacts the first terminal portion (land 9) formed on the substrate 14. In the work mounting mechanism, there is provided an urging means for urging the work mounting table 34 and the substrate 14 in the direction of the jig 36. The air between the work setting table 34 and the jig 36 is supplied to the suction hole 3 formed in the jig 36.
8, and a vacuuming device for sucking through an air inlet 40 formed in the base portion 28 is provided. The work setting table 34 and the substrate 14 are sucked by the vacuuming device, and an urging force is applied to the jig 36 and the first measurement probe group 13. As described above, the work mounting table 34 is urged in the direction of the jig 36, so that the first terminal portion (land 9) comes into contact with the tip of the first measurement probe 10. By pressing the tip, the first sense terminal 10 is turned on as shown in FIG.
b, the first source terminal 10a is urged by the elastic urging member in the direction of the first terminal portion (land 9) to come into contact with the first terminal portion (land 9).

The shape of the first measurement probe may be as shown in FIG. FIG. 6 shows the substrate 1
4 shows a pin grid array (hereinafter, also simply referred to as PGA) in which the pins 12 protrude from the lower surface, and the first measurement probe 10 has a form in which the pins 12 are inserted into the recesses at the tip and positioned. As shown in FIG.
The first sense terminal 10b is slidably fitted with the first source terminal 10a, and both terminals 10a and 10b are independently movable up and down in the holder 11. First source terminal 1
Reference numeral 0a is formed in a cylindrical shape, and has a tapered surface which is retracted on the center side of the axial cross section at the distal end surface. The tip end of the first sense terminal 10b is formed sharp, and the tip end is located near the opening end of the first source terminal 10a.

As shown in FIG. 9, the first sense terminal 1
Although the upper ends of both probes may be aligned so that the tip of the first source terminal 10a is located at the upper end of the first source terminal 10a, the tip of the first source terminal 10a is slightly closer to the test object than the tip of the first sense terminal 10b. The position may be close to the position. That is, the tip end position of the sense terminal 10b as the pin-shaped probe element can be set to be retracted in the axial direction from the outer edge position of the tapered surface of the first source terminal as the cylindrical probe element. In this way, after the pin 12 as the first terminal portion is inserted into the recess of the first source terminal 10a and the lateral displacement is restrained, the first sense terminal 10b
Since the tapered surface of the first probe abuts against the outer edge of the distal end surface of the pin 12, the contact area can be increased, the displacement of the pin can be prevented, and the positioning accuracy of the first measurement probe 10 with respect to the pin can be improved. Further, the tip of the first sense terminal 10b as the pin-shaped probe element may be arranged so as to protrude by a predetermined amount from the tip of the first source terminal 10a as the tubular probe element. By doing so, the load can be concentrated on the tip of the pin when the pin-shaped probe element contacts, and the contact state of the pin-shaped probe element can be ensured.

FIGS. 10 and 11 show the internal structure of the first measuring probe 10 having the shape shown in FIG. Similar to the internal configuration shown in FIGS. 4 and 5, the first source terminal 10a is conductively connected at one end of a conductive first coil spring 16 as a first elastic biasing member. A base 28 as a common connection having conductivity is connected to the other end of the coil spring 16.
Further, as shown in FIG. 11, the first source terminal 10a
The second coil spring 1 having conductivity as a second elastic urging member is also provided on the first sense terminal 10b slidably fitted with the first sense terminal 10b.
7 is connected, and the other end of the second coil spring 17 is connected to a terminal 18 electrically connected to the voltage measurement wiring 22. Accordingly, the first sense terminal 10b can conduct with the voltage measurement wiring 22. As shown in FIG. 11, when the pin 12 comes into contact with the first measurement probe 10 and the first source terminal 10a and the first sense terminal 10b are pressed down by a predetermined amount, the first and second coil springs 16 , 17 urge each terminal 10a, 10b in the direction of the pin 12, and in this urged state, the contact state between the pin 12 and the first measurement probe 10 is maintained. By such contact, good conduction between the pin 12 as the first terminal portion and the first measurement probe 10 becomes possible, and the contact resistance is stabilized at a low value.

FIG. 8 shows an example of a method of attaching the substrate 14 having such pins 12 (see FIG. 6). As in the case of FIG. 3, the substrate 14 is placed at a predetermined position on the work mounting table 34 by a work mounting mechanism (not shown) in a recess formed so that the substrate 14 is fitted to the work mounting table 34. In the jig 36 in which the recess is formed so that the work mounting table 34 can be fitted, the work mounting table 34 is placed by the work mounting mechanism mechanism. The work mounting table 34 includes a probe 1 fixed to a jig 36, a position of each probe of the first measurement probe group 13, and a pin 1 protruding from the substrate 14.
Holes 41 are formed corresponding to the positions 2, and before the jig 36 is installed, as shown in FIG. 8, the pins 12 are installed with the pins 12 inserted into the corresponding holes 41. When the work mounting table 34 is placed on the jig 36, the holes 4
The first measurement probe 10 corresponding to each of the first measurement probes 1 is inserted, and the first measurement probe 10 and the pin 12 come into contact with each other as described above (see FIGS. 10 and 11). In addition, the installation of the work mounting table 34 and the substrate 14 on the jig 36
Similar to the installation in FIG. 3, an urging force in the direction of the jig 36 is applied to the work mounting table 34 and the substrate 14 by urging means such as a vacuuming device.

Further, by arranging the first measurement probe group in a matrix, it becomes highly versatile and can be shared by substrates having a fixed external terminal matrix (pin interval in FIG. 6). Here, the substrate having a fixed external terminal matrix means a substrate in which the external terminals provided on the substrate exist only on the lattice points based on a predetermined matrix. Note that the predetermined matrix is a matrix in which the existing positions (inspection positions by the probes) of the probes formed by the probe groups are grid points. In the case of a plurality of types of substrates in which external terminals are located at lattice points in the same matrix but the external terminal existence positions are slightly different, for example, a substrate 14 having a pin arrangement shown in FIG. Although the reference pin arrangement is the same as shown in FIG.

As described above, since the first probe group 13 is constituted by the matrix serving as the reference, the first terminals arranged on the lattice points of the matrix can be covered.
Even in the case where the first terminal portion is not arranged at a part of the lattice point, if the arranged first terminal portion is on the matrix, the first measuring probe group 13 is provided at the first terminal portion.
Can be shared. As another example, as long as they have the same matrix configuration, even if the arrangement position of the pins 12 is different from that shown in FIG. 6 or 7A as shown in FIG. The group 13 can be shared. Therefore, it becomes highly versatile, which helps to reduce inspection costs and manufacturing costs. Here, the matrix may be a rectangular or square array having a predetermined number of rows and columns, but is not limited to this. By configuring the first measurement probe group covering the first terminal portion on various substrates having different first terminal portion positions, it becomes a first measurement probe group that can be shared by those substrates, and has versatility. Can be.

Next, the second measurement probe 4 in the inspection device
2 and an example of a method of adjusting the position of the auxiliary measurement probe 27 will be described. FIG. 12 shows a block diagram of the device configuration. The inspection apparatus includes a CPU 101 for controlling input / output signals, a ROM 102 for storing an inspection program and the like, and a RAM 103 for storing inspection data and the like.
And an input device 104 such as a mouse and a keyboard for inputting settings and the like, a display for outputting test results and the like, an output device 105 such as a printer, and an external storage device 106 for storing test results and the like. . In addition, the measuring device 26 that enables the resistance measurement in the inspection device 1, the A / D converter 111 that digitizes the measurement data from the measuring device 26, and the position adjustment unit 112 that enables the position adjustment of the second measurement probe 42. And a work mounting mechanism 115 for mounting a substrate as a work on a jig.

When the inspection is started, an instruction is issued according to the inspection program stored in the ROM 102 and the CPU 1
01 sends a work setting signal to the work mounting mechanism 115, the work is set on the work holding plate 34, and the work holding plate 34 is urged by the above-described urging means such as a vacuum device.
Is urged toward the jig 36. Then, the position adjusting means 112 is driven in response to a signal from the CPU 101. At this time, X, Y,
The drive motors 44, 45, 46 in each direction that can be moved in the positive and negative Z directions are driven to predetermined positions. At this time, an image of the workpiece before the start of the inspection set on the jig 36 is captured by an imaging device such as a CCD camera, and the acquired image and the registered image (registered in advance by CAD data or the like, the reference shape of the substrate, The position is corrected by comparing the image with an image having information such as reference center coordinates. The X drive motor 44 and the Y drive motor 45 are moved in a predetermined direction with reference to the center position coordinates in which the position correction is considered.

As shown in FIG. 13, the second measuring probe 42 can be moved in the positive and negative directions of XYZ by its driving motor, and the X driving motor 44 and the Y driving motor 45
After being moved in a plane corresponding to the inspection position on the plane of the substrate 14 by the
Approach and move away from 4.

The inspection position where the second measurement probe 42 moved by the position adjusting means comes into contact is the position where the second terminal portion exists on the upper surface of the substrate, and the wiring within the substrate (wiring The position at which electrical connection with the first measurement probe 10 provided at the lower part is enabled by the net is specified. The second measuring probe 42 is moved to the designated position by the position adjusting means. Further, the designated inspection position may be randomly selected from a plurality of second terminal portions (for example, a plurality of solder bumps 6) existing on the substrate 14, or may be a predetermined inspection position (a predetermined inspection position). The solder bump 6) may be measured. Also, in the auxiliary measurement probe 27, an auxiliary terminal position corresponding to the measurement wiring net of the auxiliary terminal holding plate 25 is selected by the same position adjustment method, and the auxiliary measurement probe 27 comes into contact with the auxiliary measurement probe. Thus, the second measurement probe 42 and the auxiliary measurement probe 27 select the terminal corresponding to the measurement wiring net, and the resistance value generated in the wiring net is measured by the measuring device 26 (FIG. 1).

Next, the substrate 14, the second measurement probe 42,
The circuit configuration of the first measurement probe 10, the inspection device 26, the auxiliary terminal holding plate 25, and the like will be described. FIG. 14 schematically shows a circuit configuration of the inspection apparatus shown in FIG. In FIG. 14, the land 9 as the first terminal portion is
Are provided to form a first terminal section group. And
A first measurement probe 10 is in contact with the first terminal portion and is made conductive.
Are connected in common by the current supply wiring 21. The current supply line 21 is connected to one terminal of a constant current power supply 48 for measurement, and the other terminal is connected to the current supply line 2.
1 is connected, and the second measurement probe 4
2 is connected to the second source terminal 42a as a current passing probe element. By being wired in this manner, a constant current is applied to the substrate internal wiring 7 as the resistance measurement section.

Then, the voltage can be measured at the position selected by the second measuring probe 42 (the rightmost solder bump 8 in FIG. 14) among the plurality of solder bumps 6 as the second measuring terminals. , Voltage measuring probe elements (first sense terminal 10b, second sense terminal 42
b) is the first and second terminal portions (lands 9, solder bumps 6)
Contact each other. Note that the voltage measurement wiring 22 from the first sense terminal 10b is connected to the voltage measurement device 50 via the auxiliary terminals 32 and 33 and the connection between them, the auxiliary probe 27 and the like, and further from the second sense terminal 42b. Are connected to the voltage measuring device 50 in the same manner. In this way, a current-carrying circuit such as the current-carrying wiring 21 and a voltage-measuring circuit such as the voltage-measuring wiring 22 are configured to measure four terminals of the board internal wiring 7 (wiring net) as a resistance measurement unit. It becomes possible to measure the resistance by the method.

In the present inspection apparatus, the position of the second measuring probe 42 and the position of the auxiliary probe 27 are adjusted by the position adjusting means, and they are brought into contact with the corresponding terminals. However, as shown in FIG. 15, when an incorrect connection is made (FIG. 15 shows an example in which the auxiliary probe 27 is supposed to be correctly connected to the terminal of A1 but incorrectly connected to B1). The resistance to be measured is not only the resistance value between the first and second measurement probes 10 and 42 to be measured (A1 portion in FIG. 15), but also an unnecessary resistance element (when a current flows through the probe-to-probe wiring indicated by the arrow 60a). Segment 43 of
, The contact resistance between the terminal and the probe when a current flows through the portion of the arrow 60b). In this case, the resistance of the segment 43 and the contact resistance of the land 9 at the position B1 with the probe 10 are unstable and occupy most of the entire resistance value. In such a case, is it due to a defect of the wiring 7 inside the board at the resistance measurement position (position A1 in FIG. 15) or is the connection information incorrect (the position where the second measurement probe 42 and the auxiliary probe 27 correspond to each other)? Is it difficult to judge from measured values? Thus, the circuit configuration as shown in FIG. 16 can be adopted, and the problem can be solved by the leakage current suppressing means. This is described below.

As shown in FIG. 16, in the common connection connected to the first measurement probe 10, in the segment 43 serving as the inter-probe wiring, the segment 43
3 is provided with a resistor 46 as a leakage current suppressing means for suppressing leakage of the measuring current to 3. The resistor 46 has a value sufficiently larger than the reference information of the resistance value of the internal wiring 7 of the substrate (it is sufficiently larger than a contact resistance generated between the probe and the terminal). Then, as shown in FIG. 16, the second measurement probe 4 is connected to different wiring nets.
2 and the auxiliary measurement probe 27 are erroneously connected, the leakage of the measuring current to the wiring segment 46 (the leakage of the current in the direction of the arrow 60a) is suppressed by the resistor 46 serving as the leakage current suppressing means. The measured resistance will be much larger than the reference information (ie, the majority of the measured resistance will be due to resistor 46). Note that the leakage current suppression means may be performed using an element such as a diode or diac without using a resistor.

FIG. 17 shows the shape of the second measurement probe 42. The second measurement probe 42 is formed such that the tip side is the contact side with the solder bump 6 (downward in FIG. 17) and the tip side is sharp, and one of the second measurement probes 42 is a second source terminal 42a as a current passing probe element. The other is a second sense terminal 42 as a voltage measuring probe element.
As b, the second measurement probe 42 is used as a pair of needle probe elements. The needle-like probe elements are arranged closer to the distal end side (the needle-like probe elements may be arranged such that the arrangement interval becomes narrower toward the distal end side).

The second source terminal 42a and the second sense terminal 42b as needle-like probe elements are movable in a direction of approaching / separating from the second terminal portion, and biasing means for biasing in the movable direction. An elastic member 49 (for example, a coil spring) is provided. Then, the second measuring probe 42 contacted with the solder bump 6 by the above-described position adjusting means.
Terminals (second source terminal 42a, second sense terminal 42
In (b), the contact state is maintained while being urged in the contact direction with the solder bump 6. The second source terminal 42a and the second sense terminal 42b are insulated from each other by coating with an insulator at locations other than the contact position with the solder bump 6 (near the tip of the needle-shaped portion). By arranging the distal ends close to each other, the source terminal and the sense terminal can both come into contact with each other even if the terminal interval of the second terminal portion (for example, solder bump 6) and the terminal area are small, A four-terminal resistance measurement method or the like can be performed.

Further, the tip of the second source terminal 42a as a current passing probe element in the contact direction with the second terminal portion, and the sense terminal 4 as a voltage measuring probe element.
Let L be the distance in the contact direction with the second terminal portion of 2b,
Ratio L / R to diameter R of solder bump (see FIG. 18 etc.)
Is in the range of 0.2 to 0.85.

By using the second measurement probe 42 and making it bite into the solder bumps 6 to perform a resistance value inspection, the bottom of the first measurement holes 53 and 53 as shown in FIG. , A substantially V-shaped axial cross-sectional shape is formed. At the bottom of the hole, the damage of the solder bump becomes small, and the influence of the measurement hole on the substrate wiring can be reduced, which leads to protection of the wiring and the like. Further, by being formed so as to be inclined in the depth direction so as to approach each other at the V-shaped bottom side, the hole interval can be made narrower and can be kept in an appropriate range. Since the first measurement holes 53 formed in this manner prove that a good inspection state has been performed, the formation of such measurement holes in the solder bump 6 allows the resistance value after the inspection to be performed. Confirmation of inspection becomes easy.

The shape of the solder bump 6 will be further described with reference to FIG. 53, 5
3 is formed, and the distance between holes defined as the geometric distance between the centers of gravity of the hole openings in a plan view (see FIG. 18B) of the pair of first measurement holes 53 (FIG. 18B). In this case, r) is formed in the range of 23 to 96 μm, and the hole depth (d2 in FIG. 18A) is formed in the range of 3 to 30 μm.

Each of the measurement holes has a ratio r / R to the diameter R of the solder bump of 0.2 to 0.2, where r is the distance between holes defined as the geometric distance between the centers of gravity of the hole openings in plan view.
0.85, and the ratio d2 / h to the height h of the solder bumps is 0.1 to 0.9, where d2 is the hole depth. When the ratio r / R is smaller than this range, complete insulation between the probes (insulation between the second source terminal 42a and the second sense terminal 42b) becomes difficult. Is more likely to come off the solder bump 6. Also,
If the hole depth is smaller than this range, a sufficient contact state cannot be maintained and the contact resistance may increase or become unstable. If the hole depth is larger than this range, the load generated on the solder bump 6 may be large. This increases the load on the substrate (causing crushing of the solder bumps 6, disconnection of the substrate wiring, etc.). Accordingly, the second inspection information generation step is a step of making the second measurement probe 42 bite into the solder bump 6 so as to form a pair of first measurement holes 53 and 53 having this range. A method for manufacturing a substrate with bumps that can be performed at a high price and that can provide a high-quality product. By forming the substrate with bumps having the first measurement holes 53 having such a range, it is easy to judge the quality of the resistance value inspection. It can be used as a mark to prove the quality.)

In a plan view as shown in FIG. 18B, the ratio S2 / S0 to the bottom area S0 of the solder bump 6 is defined as S2, where S2 is the total area of the openings of the first measurement holes 53. It can be set to 0.002 to 0.45. (Note that the area of the hole opening can be the area of the hole partitioned by the outer edge of the opening in a plan view. In other words, it can be said that the area of the bump surface lost by the measurement hole.) The ratio is smaller than this range. In this case, a good contact state between the second measurement probe 42 and the solder bump 6 is not obtained, and the contact resistance increases or becomes unstable. When the ratio is larger than this range, not only the appearance is not good, but also the possibility of crushing of the solder bumps 6 and disconnection of the substrate wiring increases. It is desirable to adopt a manufacturing method in which the second measurement probe 42 is cut into the solder bumps 6 so that the ratio S2 / S0 is in this range to form a substrate with bumps. Further, since the first measurement holes 53 are formed in the substrate with bumps, it is easy to determine whether the resistance value inspection is good or not even after the inspection (the first measurement holes 53, 53).
53 can be used as a mark proving the quality of the resistance value inspection).

FIG. 19 shows another example of the shape of the solder bump 6. A plurality of second terminal portions each composed of solder bumps 6 are two-dimensionally arranged and arranged on one plate surface of the substrate 14.
A plurality of first terminal portions (lands, pins, etc.) corresponding to each second terminal portion are two-dimensionally arranged and formed on the other plate surface, and the first terminal portion and the second terminal are formed. It has a structure in which parts corresponding to each other are individually connected by a wiring net including vias. Then, in order to determine whether or not the wiring net formed on the substrate 14 is conductive, a predetermined resistance value is set as a threshold value and a conduction as a first inspection information generating step of determining whether or not the resistance is higher than the threshold value. An inspection is performed. In this inspection, a wiring net having a resistance value equal to or higher than the threshold value is determined to be insulated, and a wiring net having a resistance value equal to or lower than the threshold value is determined to be conductive. In such a continuity test, the wiring net is subjected to resistance measurement (two-terminal method or the like) by bringing the first and second terminal portions into contact with the continuity test probes 55a and 55b as shown in FIG. The second measurement hole 54 is formed at the time of the contact.

When the depth of the second measurement hole 54 is d1 and the height of the solder bump 6 is H, d1 / H is 0.1 to 0.1.
It is adjusted in the range of 0.9. Further, assuming that the area of the opening of the measurement hole in plan view is S1, the ratio S1 / S0 to the bump bottom area S0 is 0.002 to 0.45.
A condition may be added so that If the ratio d1 / H of the depth d1 to the height H of the solder bump 6 is smaller than this range, a sufficient contact state between the continuity inspection probe 55a and the solder bump 6 cannot be obtained, and the conduction becomes insufficient. This causes an inspection error. When the ratio S1 / S0 is smaller than this range, the terminals (continuity inspection probes 55a and 55b) for conducting the continuity inspection and the solder bumps 6 are not in a good contact state, and the contact resistance is increased or unstable. Becomes Further, when the ratio is larger than this range, not only the appearance is not good, but also the possibility of crushing of the solder bumps 6 and disconnection of the substrate wiring increases. Therefore, the ratio d
In the manufacturing method, a step of cutting the continuity test probe 55a into the solder bump 6 and performing a continuity test so as to satisfy one or both of the range at 1 / H and the range at the ratio S1 / S0 is provided in the manufacturing method. With high precision and provide high quality products. Further, since the second measurement hole 54 is formed in the substrate with bumps, it is easy to determine whether the resistance value inspection is good or not even after the inspection (the second measurement hole 54 is a mark for proving the continuity inspection. Can be used as).

The first inspection information generation step for performing such a continuity inspection or the like can be performed before the second inspection information generation step including the resistance value inspection step shown in FIG. 1 and the like.
Since the continuity test is mainly a method for checking whether each wiring net is in a continuity state or an insulation state, if a defect is found in this inspection process, it is desirable to remove the board from the product line at that time . However, even in the case of a board determined to be non-defective in such a continuity test (a board that has passed the continuity test), there is a case where the resistance value of the wiring net is out of an allowable range set individually, so that the continuity test is performed. In a later separate step, a resistance value test is performed as a second test information generation step using a resistance measuring method and apparatus as shown in FIG. In this way, by having the first inspection information generation step and the second inspection information generation step, it is possible to synergistically prevent the leakage of defective products,
It is possible to remove extremely defective defective products. Further, a first inspection information generating step of generating first inspection information relating to the conduction state (for example, a continuity inspection step of inspecting whether or not the wiring net is conductive) and a second inspection information generating step of determining whether the wiring net is good (for example, The resistance value inspection process for calculating the resistance value of the wiring net) is a separate process, and it is possible to independently remove defective products in each process.
Duplicate inspection of defective products can be reduced. Then, the defective products detected in the continuity inspection process are removed in the first screening process, and only the remaining products need to be subjected to the resistance testing process and the second screening process. You can do it.

In the continuity test, all the solder bumps 6 present on the substrate 14 are inspected (all the inspections are performed), and in the subsequent resistance value inspection, a part of the solder bumps 6 is inspected at random or at random. You may do so.
In this way, sufficient inspection accuracy can be maintained while shortening the inspection time, and a high-quality product can be manufactured in a short time.

In FIG. 20, the second measurement hole 5 in the first inspection information generation step (continuity inspection by a two-terminal measurement method or the like) is shown.
4 and a solder bump 6 in which a pair of first measurement holes 53 are formed together in a second inspection information generation step (resistance value inspection by a four-terminal resistance measurement method or the like). The pair of first measurement holes 53 is in the range described above (r / R is 0.2 to
0.85 and d2 / h is in the range of 0.1 to 0.9), and the second measurement hole 54 is also in the above-described range (d1 / h).
H is in the range of 0.1 to 0.9). Further, the total area S3 of the holes with respect to the bump area S0 (the pair of first measurement holes 53, 53 opening area and second measurement hole 54).
Ratio S3 / S0 is 0.00
Each hole is formed to have a value of 2 to 0.45.
In this case, the second measurement hole 54 is the first measurement hole 5
The bumped substrate may be formed such that the area and the depth of the hole opening are larger than the holes 3 and 53 in a single hole. By forming such a difference, the first measurement holes 53, 53 and the second measurement hole 54 can be clearly distinguished after the inspection is completed, and the contact state of each step can be grasped (for example, , First measurement hole 5
If only holes 3 and 53 are insufficiently formed, it can be assumed that an abnormality has occurred in the second inspection information generation step).

When the ratio S3 / S0 is smaller than this range, the step of forming the first measurement holes 53, 53 or the second measurement hole 54 (the second inspection information generation step of performing a resistance value inspection or the like, Insufficient contact is likely to occur in at least one of the first inspection information generation steps for performing an inspection or the like, and an abnormality in the inspection can be detected by the measurement hole.
If the ratio is larger than this range, not only the appearance is not good but also the possibility of crushing of the solder bump 6 or disconnection of the substrate wiring inside the solder bump 6 due to the measurement hole increases. Therefore, the continuity inspection probe 55 is formed so as to form a measurement hole having such a range in the first inspection information generation step and the second inspection information generation step.
a, 55b and the second measurement probe 42
By performing the continuity test and the resistance value test while making a cut, the inspection can be performed with high precision, and a method of manufacturing a high-quality bumped substrate with less damage to the bumps can be provided.
Further, the first measurement holes 53 and 53 and the second measurement hole 54 having this range serve as a proof mark that a good inspection state has been performed, and the solder bumps 6 having such measurement holes are used for the inspection. You will be able to confirm.

Further, in the second inspection information generation step,
The second measurement probe 42 (FIG. 17) can be brought into contact with the surface of the solder bump 6 other than the second measurement hole 54. When the second measurement probe 42 is brought into contact with the second measurement hole 54 in the first inspection information generation step (for example, one probe element of the second measurement probe 42 is inserted into the second measurement hole 54). In such a case, since the contact surface is not flat, the second measurement probe 42 comes into contact with the inclined surface, resulting in an unstable contact state. Therefore, when the contact is made on the flat bump surface where the second measurement hole 54 is not formed, a stable contact is maintained and a good contact state is obtained, and a second inspection information generation step capable of measuring a resistance value with high accuracy is provided. Become. By providing such a process in the manufacturing method, highly accurate inspection can be performed,
In turn, it contributes to quality improvement.

For the inspection of the measurement hole formed in the solder bump 6, such an inspection method as shown in Japanese Patent No. 2881146, Japanese Patent No. 2881147, and Japanese Patent No. 2881148 may be used.

[Brief description of the drawings]

FIG. 1 is a perspective explanatory view showing an example of an inspection device of the present invention.

FIG. 2 is an enlarged view of a main part showing a contact state between a first terminal portion and a first measurement probe group.

FIG. 3 is a cross-sectional view illustrating an example of a method of attaching a substrate main body.

FIG. 4 is a partial cross-sectional view showing an example of the shape of a first measurement probe.

FIG. 5 is an explanatory view showing a contact state of the terminal of FIG. 4;

FIG. 6 is a view using a first measurement probe having a different shape in FIG. 2;

FIG. 7 is a diagram in which the first measurement probe group of FIG. 6 is used for a substrate main body having various terminal positions.

FIG. 8 is a diagram showing an example of a method of attaching a substrate main body having the shape shown in FIG. 6;

FIG. 9 is an enlarged perspective view showing the shape of the first measurement probe of FIG. 6;

FIG. 10 is a partial cross-sectional view showing the internal shape of the first measurement probe of FIG.

FIG. 11 is a sectional view showing a contact state in FIG. 10;

FIG. 12 is a block diagram showing an example of a device configuration of the present invention.

FIG. 13 is an explanatory diagram showing an example of position adjustment of a second measurement probe and an auxiliary measurement probe.

FIG. 14 is an explanatory diagram simply showing the wiring state of FIG. 1;

FIG. 15 is an explanatory diagram simply showing an erroneous wiring state in FIG. 14;

FIG. 16 is an explanatory view in which a leakage current suppressing means is attached to FIG.

FIG. 17 is an explanatory view showing an example of a terminal shape of the second measurement probe of FIG. 1;

FIG. 18 is an explanatory diagram showing an example of a solder bump shape.

FIG. 19 is an explanatory view showing another example 1 of a solder bump shape.

FIG. 20 is an explanatory view showing another example 2 of a solder bump shape.

FIG. 21 is a diagram conceptually illustrating a continuity test example (first test information generation step example).

FIG. 22 is a plan view showing an example of a substrate body.

FIG. 23 is a side sectional view showing a main part of FIG. 22;

[Explanation of symbols]

Reference Signs List 6 Solder bump (second measurement terminal) 7 Internal wiring (wiring net) 9 Land (first terminal part) 10 First measurement probe 10a First source terminal (first probe element, cylindrical probe element, current-carrying probe Element) 10b first sense terminal (second probe element, pin-shaped probe element, probe element for voltage measurement) 12 pin (first terminal part) 13 first measurement probe group 14 substrate body 16 first coil spring (first elasticity) 17 Second coil spring (second elastic biasing member) 21 Wiring for current supply 22 Wiring for voltage measurement 25 Auxiliary terminal holding plate 27 Auxiliary probe 32 Upper auxiliary terminal (auxiliary terminal section) 33 Lower auxiliary terminal (auxiliary terminal) Part) 42 second measuring probe 42a second source terminal (first probe element, probe element for passing current) 42b second sense terminal (second Probe elements, the probe element for voltage measurement) 43 wire segment 46 resistor (leakage current suppressing means) 48 for measuring the constant current source 0 53 first measurement hole 54 second measurement hole 55a, 55b continuity test probe

 ──────────────────────────────────────────────────の Continued on the front page F term (reference) 2G011 AA02 AA13 AA16 AB01 AC06 AC09 AC14 AE01 AF07 2G014 AA02 AA03 AA13 AA15 AB59 AC09 AC10 AC12 AC15 2G028 AA01 AA02 BC01 CG02 DH03 FK01 FK08 GL07 HN08 HN11 HN08 HN08 HN08 HN08

Claims (37)

[Claims] A plurality of first terminal portions are two-dimensionally arranged and formed on one plate surface of a substrate body, and a plurality of second terminal portions corresponding to the first terminal portions are formed on the other plate surface. Are two-dimensionally arranged and formed, and a board inspection device having a structure in which the corresponding ones of the first terminal portion and the second terminal portion are individually connected by a wiring net including vias. A first measurement probe having a current-carrying probe element and a voltage-measuring probe element, the first measurement probe detachably abutting on the first terminal part in the probe element, is a two-dimensional probe of the first terminal part. A plurality of first measurement probe groups arranged in accordance with the arrangement, comprising a current carrying probe element and a voltage measuring probe element, wherein the probe elements are selectively connected to any of the plurality of second terminal portions. And the detachable abutment The measurement probe, the first measurement probe group is brought into contact with the first terminal group, and the second measurement probe is brought into contact with the second terminal portion corresponding to the wiring net to be measured, and the state At the same time, a current for measurement is applied to the wiring net by the probe element for current supply, and based on a voltage level applied to the wiring net measured by the probe element for voltage measurement, a specific electric current of the wiring net is determined. A specific electric resistance value information generating means for generating information reflecting the resistance value; and comparing the generated specific electric resistance value information with reference information individually defined for each wiring net, to thereby obtain information on the wiring net. A board inspection apparatus, comprising: inspection information generation means for generating inspection information on pass / fail. 2. The method according to claim 1, wherein the second measurement probe is positioned on a side of the substrate main body on a side where the second terminal is formed, in order to select a second terminal corresponding to a wiring net to be measured. The substrate inspection apparatus according to claim 1, wherein the substrate inspection apparatus is provided so as to be movable in a vertical direction and to be able to approach and separate from the second terminal portion in a thickness direction. 3. A substrate support portion for detachably supporting the substrate substantially horizontally so that the first terminal portion side is a lower side, wherein the first measurement probe group is a lower surface side of the supported substrate. The second measuring probe is configured to selectively contact the second terminal portion on the upper surface side of the substrate while each of the second measuring probes is in contact with the first terminal portion. Board inspection equipment. 4. A wiring group for measurement led out downward from the first measurement probe group is extended to a position laterally deviated from a substrate position, and then the end is turned upward. Held, an auxiliary probe corresponding to the wiring net to be measured is brought into contact with the auxiliary terminal formed at the end, and the auxiliary probe, the corresponding measurement wiring and the first measurement probe are connected. Through,
4. The substrate inspection apparatus according to claim 3, wherein a resistance measurement of the wiring net is performed between the wiring net and the second measurement probe. 5. The substrate inspection apparatus according to claim 4, further comprising an auxiliary terminal holding plate for holding auxiliary terminal portions from each measurement wiring in a two-dimensional array corresponding to the first measurement probe group. 6. A current-carrying wire and a voltage-measurement wire which are respectively connected to a current-carrying probe element and a voltage-measurement probe element of a corresponding first measurement probe from the first measurement probe group. The substrate inspection apparatus according to claim 4, further comprising: a wiring for voltage measurement, wherein one of the wiring for voltage measurement and the wiring for current flow is connected to the auxiliary terminal portion, and the other is commonly connected. 7. The voltage measurement wiring is connected to the auxiliary terminal portion, while the current supply wiring is connected to a common measurement constant current power supply, and among the plurality of first measurement probes, Each end of the current supply wiring extending individually from the adjacently arranged one is connected adjacently to a common power supply wiring toward the measurement constant current power supply at different connection points, and the common power supply wiring has When the second measurement probe and the auxiliary probe are erroneously connected to different wiring nets in the wiring segments located between the adjacent connection points, the leakage of the measurement current to the wiring segment is suppressed. 7. The board inspection apparatus according to claim 6, further comprising a leakage current suppressing unit. 8. The substrate inspection apparatus according to claim 7, wherein said leakage current suppressing means includes a resistance element having at least a resistance value larger than a reference resistance value defined as said reference information. 9. The first measurement probe, wherein one of the current-flowing probe element and the voltage-measuring probe element is a first probe element and the other is a second probe element, and at least the first probe element is the second probe element. The first probe element is provided so as to be able to advance and retreat in the contact direction with the one terminal part, and is elastically deformed with the retreat of the first probe element due to the contact with the first terminal part, and the first probe element is elastically restored by its elastic return force. The substrate inspection apparatus according to claim 1, further comprising a first elastic urging member that urges the first terminal portion. 10. The second probe element is provided so as to be able to advance and retreat independently of the first probe element in a contact direction with the first terminal section. Along with the relative approach in the contact direction, to form a contact state between the first terminal element and the first terminal element at substantially the same time or later than the first probe element, A second elastic biasing member that elastically deforms with the retraction of the second probe element due to the contact of the second probe element and biases the second probe element toward the first terminal portion by the elastic return force is provided. The substrate inspection apparatus according to claim 9. 11. The first measurement probe includes a cylindrical probe element and a pin-shaped probe element arranged coaxially inside the cylindrical probe element, and one of the cylindrical probe elements is the second probe element. The substrate inspection apparatus according to claim 9, wherein one probe element is used and the other is a second probe element. 12. A second coil spring that is disposed coaxially within the cylindrical probe element and biases the pin-shaped probe element from the rear side, and is coaxially disposed outside the second coil spring. A first coil spring for urging the cylindrical probe element from the rear side, one of the first coil spring and the second coil spring functions as the first elastic urging member, and the other is a second elastic urging member. The substrate inspection apparatus according to claim 11, which functions as a member. 13. The method according to claim 1, wherein the pin-shaped probe element is the first probe element, and a tip end of the pin-shaped probe element is arranged so as to protrude by a predetermined amount from a tip end of the cylindrical probe element serving as the second probe element. The substrate inspection apparatus according to claim 11, wherein 14. The pin-shaped probe element is the first probe element, and the distal end surface of the cylindrical probe element, which is the second probe element, is a tapered surface that retracts at the center of the axial cross section. The substrate inspection apparatus according to claim 11, wherein a tip edge position of the probe element protrudes in an axial direction from an inner edge position of the tapered surface. 15. The substrate inspection apparatus according to claim 14, wherein a tip edge position of the pin-shaped probe element is located to be retracted in an axial direction from an outer edge position of the tapered surface. 16. The second measurement probe is formed such that a tip end side is sharp with a contact direction with the second terminal portion being a tip end side, one of which is the current conducting probe element, and the other is a voltage supply. Including a pair of needle-shaped probe elements to be measurement probe elements, the needle-shaped probe elements are inclined in opposite directions with respect to the contact direction so that the arrangement interval becomes narrower toward the distal end side. The substrate inspection apparatus according to any one of claims 1 to 15, wherein the substrate inspection apparatus is used in a state in which the substrate inspection is performed. 17. A plurality of second terminal portions each formed of a solder bump are two-dimensionally arranged and formed on one plate surface of the substrate body, and correspond to each second terminal portion on the other plate surface. A structure in which a plurality of first terminal portions are two-dimensionally arranged and formed, and the corresponding ones of the second terminal portion and the first terminal portion are individually connected by a wiring net including a via. A substrate forming step of obtaining a substrate having bumps, using the substrate inspection apparatus according to any one of claims 1 to 16, for a second terminal portion made of the solder bump corresponding to a wiring net to be inspected, The tip of the second measurement probe is brought into contact with the solder bump so that a measurement hole of a predetermined depth is formed therein, and
The first measurement probe is brought into contact with the first terminal portion corresponding to the wiring net, and a current for measurement is applied to the wiring net via the second measurement probe and the first measurement probe in that state. An electrical resistance value information generating step of generating information on the electrical resistance value of the wiring net; and an inspection information generating step of generating inspection information on the acceptability of the wiring net based on the generated electrical resistance value information. A selecting step of selecting only a substrate whose generated inspection information satisfies a predetermined condition. 18. When the depth of the measurement hole is d1, and the height of the solder bump is H, d1 / H is 0.1 to 0.1.
18. The substrate manufacturing method according to claim 17, wherein the second measurement probe is made to bite into the solder bump so as to fall within a range of 9. 19. A ratio S to a bump bottom area S0, where S1 is an area of a hole opening of the measurement hole in a plan view.
19. The substrate manufacturing method according to claim 17, wherein the second measurement probe is cut into the solder bump such that 1 / S0 is 0.002 to 0.45. 20. The second measurement probe includes a pair of needle-like probe elements, each of which has a tip end in a contact direction with the solder bump and whose tip side is sharp. In order that the arrangement interval becomes narrower toward the distal end side, those arranged in a state where they are inclined in directions opposite to each other with respect to the contact direction are used. A voltage measuring probe element includes a pair of probe elements, a tip of the current applying probe element in a contact direction with the second terminal portion, and a contact between the tip of the voltage measuring probe element and the second terminal portion. The distance in the contact direction is L, and the ratio L / R to the diameter R of the solder bump is 0.2 to 0.2.
The substrate manufacturing method according to claim 17, wherein the value is 0.85. 21. A pair of said measurement holes which are respectively opened on a surface of said solder bump are formed in a surface layer portion of at least a part of said solder bump by biting of said second measurement probe. A hole is defined as a distance between holes defined as a distance between geometric centers of gravity of hole openings in plan view, and
The ratio r / R to the diameter R of the solder bump is 0.2 to 0.8.
21. The substrate manufacturing method according to claim 20, wherein the second measurement probe is made to bite into the solder bump so as to be 5. 22. A pair of the measurement holes which are respectively opened on the surface of the solder bump are formed in a surface layer of at least a part of the solder bump by the biting of the second measurement probe, When the depth of each measurement hole is d2 and the height of the solder bump is H, d2 / H is 0.1.
22. The substrate manufacturing method according to claim 20, wherein the second measurement probe is made to bite into the solder bump so as to be 0.9. 23. The pair of measurement holes each have a substantially V-shaped vertical cross-sectional shape whose axial cross-sectional area decreases toward the bottom, and have a depth direction so as to approach each other on the V-shaped bottom side. 23. The substrate manufacturing method according to claim 20, wherein the substrate is formed to be inclined. 24. Assuming that the total area of the hole openings of the pair of measurement holes in plan view is S, the ratio S / S0 to the bump bottom area S0 is 0.002 to 0.45.
24. The substrate manufacturing method according to claim 20, wherein the second measurement probe is made to bite into the solder bump. 25. A continuity inspection probe is used as the second measurement probe, and the probe is bitten into contact with the solder bump while forming a second measurement hole, based on electrical resistance information at that time. A first inspection information generating step of generating first inspection information relating to a conduction state of a corresponding wiring net; and a first sorting step of selecting only substrates whose generated first inspection information satisfies predetermined conditions as non-defective products. A pair of needle-like probe elements are used as the second measurement probe for the substrate selected as a non-defective product in the first selection step, and the pair of solder bumps are opened on the surface of the solder bump. While forming the first measurement hole, these probes are bitten and abutted, and in that state, one of the needle-shaped probes is used as a current carrying probe element to connect to the wiring net. By applying the constant current and using the other needle probe as a voltage measuring probe element, the voltage level applied to the wiring net is measured, and information reflecting the specific electric resistance value of the wiring net is generated. A second test information generation step for determining whether or not the wiring net is good by comparing the generated specific electric resistance information with reference information individually defined for each wiring net; 25. The substrate manufacturing method according to claim 17, further comprising: a second sorting step of sorting only substrates for which the generated second inspection information satisfies a predetermined condition. 26. In the second inspection information generation step,
The second measurement probe is brought into contact with a surface of the solder bump other than the second measurement hole.
6. The substrate manufacturing method according to 5. 27. A plurality of second terminal portions each consisting of a solder bump are two-dimensionally arranged and formed on one plate surface of the substrate body, and correspond to each second terminal portion on the other plate surface. A structure in which a plurality of first terminal portions are two-dimensionally arranged and formed, and the corresponding ones of the first terminal portions and the second terminal portions are individually connected by a wiring net including vias. A substrate with bumps, wherein a measurement hole having a predetermined depth is formed in a surface layer of at least a part of the solder bumps, the measurement hole being opened on a surface of the solder bumps. 28. Assuming that the depth of the measurement hole is d1 and the height of the solder bump is H, d1 / H is 0.1-0.
28. The bumped substrate according to claim 27, wherein the substrate is adjusted in the range of 9. 29. Assuming that the area of the hole opening of the measurement hole in plan view is S1, the ratio S to the bump bottom area S0 is
29. The substrate with bumps according to claim 27, wherein 1 / S0 is 0.002 to 0.45. 30. The bumped substrate according to claim 27, wherein the measurement hole is formed with a pair of the measurement holes that are respectively opened on a surface of the solder bump. 31. When the depth of each of the pair of measurement holes is d2 and the height of the solder bump is H,
31. The bumped substrate according to claim 30, wherein d2 / H is adjusted in a range of 0.1 to 0.9. 32. A ratio S2 / S0 to a bump bottom area S0 is 0.002 to 0.4, where S2 is a total area of the hole openings of the pair of measurement holes in plan view.
The substrate with bumps according to claim 30, wherein the number is 5. 33. The measurement hole includes a first measurement hole as the pair of measurement holes, and a second measurement hole different from the first measurement hole. Or 32
A substrate with bumps according to any one of the above. 34. The substrate with bumps according to claim 33, wherein the second measurement hole is a single hole having a hole opening area and a depth larger than the first measurement hole. 35. Assuming that the sum of the respective areas of the apertures of the first measurement hole and the second measurement hole in plan view is S3, the ratio S3 / S0 to the bump bottom area S0 is 0.0.
35. The substrate with bumps according to claim 33, wherein the ratio is from 02 to 0.45. 36. A ratio r to a solder bump diameter R, where r is a distance between holes defined as a geometric distance between centers of gravity of respective hole openings of the first measurement hole in plan view.
36. The substrate with bumps according to claim 30, wherein / R is 0.2 to 0.85. 37. The pair of measurement holes each have a substantially V-shaped vertical cross-sectional shape in which the axial cross-sectional area decreases toward the bottom, and each of the measurement holes has a depth direction so as to approach each other at the V-shaped bottom side. 37. The substrate with bumps according to claim 30, wherein the substrate is formed to be inclined.