CN101191811B - Substrate detecting device and substrate detecting method - Google Patents
Substrate detecting device and substrate detecting method Download PDFInfo
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- CN101191811B CN101191811B CN200710196206.6A CN200710196206A CN101191811B CN 101191811 B CN101191811 B CN 101191811B CN 200710196206 A CN200710196206 A CN 200710196206A CN 101191811 B CN101191811 B CN 101191811B
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- potential difference
- short circuit
- checkpoint
- circuit portion
- wiring pattern
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/0092—Arrangements for measuring currents or voltages or for indicating presence or sign thereof measuring current only
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
The invention relates to a substrate detecting device which can detect and not burn the suspected short circuit section of a suspected short circuit between close wire figures. The device detects the electrical property (13) of the wire graph between detecting points by producing a potential difference between the detecting points (12a, 12b) on the detecting substrate(11) and takes out a detecting signal from the detecting point. The substrate detecting device is provided with a plurality of probes(2a, 2b) conducted with the detecting points directly and indirectly, an output part which produces the potential difference between the detecting points by the probes, a detecting part(4) which detects the signal from the detecting points by the probes when the potential difference is given. The output part makes the detecting point produce the potential difference which conducts the suspected short circuit section of the suspected short circuit between close wire figures, but not to be burned by the current flowing through the suspected short circuit section.
Description
Technical field
The present invention relates between the checkpoint on inspection substrate, produce potential difference (PD) and take out the base board checking device and the method thereof that check the electrical characteristics of the wiring pattern between described checkpoint with signal of checking from described checkpoint by making.
In addition, the invention is not restricted to printed circuit board, also be applicable to the inspection of the electrical wiring on the various substrates such as base plate for packaging or thin-film carrier (film carrier) of battery lead plate that such as flexible substrate, multi-layer wire substrate, liquid crystal display or plasma display are used and semiconductor-sealing-purpose, in this manual above-mentioned various circuit boards be referred to as to " substrate ".
Background technology
Exist fine short circuit portion in the case of checking between the wiring pattern of object, between the checkpoint of wiring pattern, produce common potential difference (PD) if made, this fine short circuit portion, by excess current scaling loss, existed the inspection substrate of the problems such as defective insulation to be mistaken for the problems such as normal thereby produce originally sometimes.
For this point, in existing base board checking device, the magnitude of voltage or the current value phasic Chang that make to be applied on wiring pattern check, to prevent that defective insulation position of wiring pattern etc. is by excess current scaling loss (patent documentation 1).
But this problem that causes inspection substrate scaling loss solves so far not yet completely.
Patent documentation 1: Japanese kokai publication hei 6-230058 communique
Summary of the invention
In view of such situation, the inventor finds after having studied the reason of the inspection substrate scaling loss producing while inspection, and unsolved scaling loss produces the doubtful short circuit portion of doubtful short circuit between the wiring pattern that reason comprises adjacency.
Therefore, the problem that the present invention will solve is to provide a kind of base board checking device, can check and can not make the doubtful short circuit portion scaling loss of doubtful short circuit between the wiring pattern of adjacency.
In order to solve above-mentioned problem, the first technical scheme of the present invention provides a kind of base board checking device, by producing potential difference (PD) between the checkpoint that makes to set on the multiple wiring patterns on inspection substrate and taking out inspection signal from described checkpoint, check the electrical characteristics between described wiring pattern, it is characterized in that, this base board checking device has: the multiple probes that contact with the conducting of described checkpoint; Make to produce between described checkpoint the efferent of potential difference (PD) via described probe; And in the time giving described potential difference (PD) via described probe in detecting the test section from the signal of described checkpoint, described efferent makes to produce between described checkpoint following potential difference (PD),, make doubtful short circuit portion's conducting of doubtful short circuit between the described wiring pattern of adjacency but can not be flow through the electric current scaling loss of this doubtful short circuit portion.
In addition, in the second technical scheme of the present invention, according to the first technical scheme, make the described potential difference (PD) producing between described checkpoint be set to following level by described efferent, the described doubtful short circuit portion that, makes to form intermittently in bridging mode between the described wiring pattern of adjacency becomes conducting state but this doubtful short circuit portion can be by electric current scaling loss from nonconducting state.
In addition; in the 3rd technical scheme of the present invention; according to the first technical scheme; make the described potential difference (PD) producing between described checkpoint be set to following level by described efferent;, make between the described wiring pattern of adjacency to become conducting state but this doubtful short circuit portion can be by electric current scaling loss with the described doubtful short circuit formation in column intermittently of bridging mode, that formed from one or more fine conductor grains or fine conductor piece portion from nonconducting state.
In addition, in the 4th technical scheme of the present invention, according to any one in the first technical scheme to the three technical schemes, described potential difference (PD) that described efferent makes to produce between described checkpoint is interim becomes large, and described doubtful short circuit portion's conducting but described potential difference (PD) that can scaling loss are equivalent to any one level in multiple potential difference (PD) levels of this phasic Chang.
In addition, in the 5th technical scheme of the present invention, according to the 4th technical scheme, by described efferent, the described multiple potential difference (PD) levels that produce between described checkpoint are also comprised: the potential difference (PD) of the electric current scaling loss of this tiny short circuit portion can not flow through in described potential difference (PD) tiny short circuit portion little, that form continuously in bridging mode between the described wiring pattern of adjacency that can scaling loss than described doubtful short circuit portion; And described potential difference (PD) that than described doubtful short circuit portion's conducting but can scaling loss is large, the potential difference (PD) of the leakage current that causes for detection of the spark between described wiring pattern.
In addition, the 6th technical scheme of the present invention provides a kind of base board checking device, by producing potential difference (PD) between the checkpoint that makes to set on multiple wiring patterns of inspection substrate and taking out inspection signal from described checkpoint, check the electrical characteristics between described wiring pattern, it is characterized in that, this base board checking device has: the multiple probes that contact with the conducting of described checkpoint, make to produce between described checkpoint the efferent of potential difference (PD) via described probe, in the time giving described potential difference (PD), detect the test section of the current value flowing through between described checkpoint, and in controlling described efferent, derive the resistance value between described checkpoint according to giving described potential difference (PD) between described checkpoint and the detection current value of described test section, by the resistance value of relatively this derivation and the determinating reference resistance value of regulation, judge whether described wiring pattern exists the control part of defective insulation, the defect that described control part can have according to inspection substrate is set described efferent and is made the described current potential extent producing between described checkpoint, and can set according to described current potential extent the size of described determinating reference resistance value.
In addition,, in the 7th technical scheme of the present invention, according to the 6th technical scheme, described potential difference (PD) is configured to switch to: the first current potential difference; The second current potential difference larger than described the first current potential difference; And the three current potential difference larger than described the second current potential difference, described determinating reference resistance value is configured to switch to: the first reference resistor value of setting for described the first current potential difference; Set and large the second reference resistor value than the first reference resistor value for described the second current potential difference; For described the 3rd current potential difference set, large and three reference resistor value less than described the second reference resistor value than described the first reference resistor value.
In addition, the 8th technical scheme of the present invention provides a kind of substrate inspecting method, by producing potential difference (PD) between the checkpoint that makes to set on the multiple wiring patterns on inspection substrate and taking out inspection signal from described checkpoint, check the electrical characteristics between described wiring pattern, it is characterized in that, the defect having according to described inspection substrate, to increase gradually the mode of this potential difference (PD), described potential difference (PD) is set as to have the little of specialized range, in, large triphasic scope, the scope in described little stage is 0-1.2 volt, the scope in described middle stage is 0.2-20 volt, the scope of described megastage is for being greater than 10 volts, according to described little, in, large triphasic scope, by little for judging that inspection substrate defect whether benchmark is that benchmark electrical characteristics are set as, greatly, in three stages.
According to the first technical scheme to the five technical schemes of the present invention, the potential difference (PD) of giving wiring pattern is set as to doubtful short circuit portion's conducting of doubtful short circuit between the wiring pattern of adjacency but potential difference (PD) that can scaling loss checks, therefore, can check and can not make so doubtful short circuit portion scaling loss.
According to a fourth technical aspect of the present invention, can check and can not make the scaling loss such as the various defective insulations position including doubtful short circuit portion.
According to the 5th technical scheme of the present invention, for the spark between the tiny short circuit portion forming between wiring pattern, doubtful short circuit portion and wiring pattern, can check and can not make tiny short circuit portion and doubtful short circuit portion by excess current scaling loss.
According to the 6th technical scheme of the present invention, the potential difference (PD) applying according to the defect adjustment of substrate detects defect, therefore, can carry out correct defect inspection.
The 7th technical scheme according to the present invention adopts following structure: corresponding to make efferent give potential difference (PD) between checkpoint according to little, in, large order situation about changing, make to change according to little, big or middle order about the determinating reference resistance value of defective insulation, therefore, the various defective insulation reasons such as the leakage current causing for the spark between part and the wiring pattern of the fine short circuit portion between wiring pattern, doubtful short circuit, can be in preventing the scaling loss that excess current causes, carry out corresponding with various defective insulation reasons respectively inspection.
The 8th technical scheme according to the present invention adopts following structure: corresponding to make efferent give potential difference (PD) between checkpoint according to little, in, large order situation about changing, make to change according to little, big or middle order about the determinating reference resistance value of defective insulation, therefore, the various defective insulation reasons such as the leakage current causing for the spark between part and the wiring pattern of the fine short circuit portion between wiring pattern, doubtful short circuit, can be in preventing the scaling loss that excess current causes, carry out corresponding with various defective insulation reasons respectively inspection.
Brief description of the drawings
Fig. 1 is the block diagram of the base board checking device of an embodiment of the invention.
Fig. 2 is the process flow diagram that represents inspecting substrate order.
Fig. 3 (a) is the planimetric map that schematically represents the state of the tiny short circuit portion on inspection substrate, Fig. 3 (b) be Fig. 3 (a) want portion's sectional view.
Fig. 4 is the planimetric map that schematically represents the state of the doubtful short circuit portion on inspection substrate.
Fig. 5 schematically represents that the abnormal approaching figure of wiring pattern on inspection substrate approaches the planimetric map of portion.
Fig. 6 is the figure that represents various defective insulation reasons and can find the relation between the inspection voltage range of this defective insulation.
Symbol description
1 base board checking device; 2a, 2b probe; 3 efferents; 4 test sections; 5 control parts; 6a, 6b switch; 7a, 7b wiring; 11 inspection substrates; 12a, 12b checkpoint; 13,13a, 13b wiring pattern; 21 tiny short circuit portions; 22 doubtful short circuit portions; 23 figures approach portion.
Embodiment
Fig. 1 is the block diagram of the base board checking device of an embodiment of the invention.This base board checking device 1 has as shown in Figure 1: multiple probe 2a, 2b; Be provided for the efferent 3 of the curtage checking; Detect the magnitude of voltage of signal or the test section of current value 4 that apply via probe 2a, 2b; Control part 5; Multiple switch 6a, 6b, this base board checking device 1 produces potential difference (PD) and takes out inspection signal from checkpoint 12a, 12b by making between checkpoint 12a, the 12b on inspection substrate 11, check the electrical characteristics of the wiring pattern 13 between checkpoint 12a, 12b.
Efferent 3 is according to the control of control part 5, via probe 2a, 2b to the curtage that is provided for the prescribed level checking between checkpoint 12a, 12b.
The potential difference (PD) between checkpoint 12a, 12b or the current value flowing through between checkpoint 12a, 12b, according to the control of control part 5, in the time providing curtage by efferent 3 to checkpoint 12a, 12b, are detected via probe 2a, 2b in inspection portion 4.
It is upper that switch 6a, 6b are arranged on the wiring 7a, the 7b that connect between efferent 3 and test section 4 and probe 2a, 2b, according to the control of control part 5, switches the annexation between efferent 3 and test section 4 and probe 2a, 2b.
Control part 5 is controlled efferent 3, inspection portion 4 and switch 6a, 6b, checks the electrical characteristics of the wiring pattern 13 of inspection substrate 11.Its scope of examination comprises checking and test for short-circuit.
In checking, generally check the whether normally of each wiring pattern 13 in inspection substrate 11.Particularly, make efferent 3 via probe 2a, 2b for example, to the electric current that rated current value (20mA) is provided between checkpoint 12a, 12b, make test section 4 detect the potential difference (PD) between checkpoint 12a, 12b simultaneously.Then, carry out the resistance value of the wiring pattern 13 between calculating inspection point 12a, 12b according to the value of the potential difference (PD) that current value is provided and detects now, whether resistance value to this derivation and predefined determinating reference value (for example approximately 30 ohm) compare, thereby can check the on state characteristic (normally etc.) of wiring pattern 13.
In addition, in test for short-circuit, generally check whether the wiring pattern 13 that should insulate exists the defective insulations such as short circuit.Particularly, between two checkpoint 12a, 12b being electrically connected with two wiring patterns 13 that should be insulated from each other, give successively the voltage of the assigned voltage value of multistage setting via probe 2a, 2b, under each state of giving each stage voltage value, make test section 4 detect the current value flowing through between checkpoint 12a, 12b via probe 2a, 2b.Then, according to applying magnitude of voltage and detecting current value between checkpoint 12a, the 12b in this each stage, derive the resistance value between checkpoint 12a, 12b, resistance value to this derivation and in advance according to each stage voltage value come interim predefined multiple determinating reference resistance values compare, thereby can check whether 13 of the wiring patterns of object exist defective insulation.Particularly, in the case of all resistance values that derive while applying stage voltage are larger than the determinating reference resistance value of setting corresponding to this stage, be judged to be defective insulation; The resistance value deriving in any more than one stage below determinating reference resistance value in the situation that, is judged to be defective insulation.
Particularly, in the present embodiment, the output voltage values of efferent 3 became successively and carries out greatly test for short-circuit according to three stages., test for short-circuit divides first to the 3rd this three phases to carry out.And, as the determinating reference resistance value of judging for defective insulation, in the first test for short-circuit, use the first reference resistor value, in the second test for short-circuit, use than the first reference resistor value large the second reference resistor value, in the 3rd test for short-circuit, use three reference resistor value less greatly and than the second reference resistor value than the first reference resistor value.
Checking as above and the first to the 3rd test for short-circuit can be carried out according to the step (S1～S4) shown in aftermentioned Fig. 2.
Below, describe to the meaning of the 3rd test for short-circuit first of present embodiment.
The inventor carried out finding after investigation to the reason of wiring pattern 13 defective insulations, and the reason of defective insulation comprises that the figure shown in the doubtful short circuit portion 22 shown in the tiny short circuit portion 21 shown in Fig. 3 (a) and Fig. 3 (b), Fig. 4, Fig. 5 approaches portion 23.
Wherein, the tiny short circuit portion 21 shown in Fig. 3 (a) and Fig. 3 (b) is the fine short circuit portions that form continuously in bridging mode between wiring pattern 13a, the 13b of adjacency.This tiny short circuit portion 21 is for example owing to not removing the useless wiring material that should remove completely in the time carrying out the etch processes of wiring pattern 13a, 13b and residual etch residue etc. produces.The electric current scaling loss of tiny short circuit portion 21, owing to having the fine sizes of such as micron order etc., if therefore wiring pattern 13 is applied to high potential in the time carrying out test for short-circuit, can be flow through in this tiny short circuit portion 21.The resistance value of this tiny short circuit portion 21 mostly is approximately 100 ohm below left and right.
In addition, doubtful short circuit portion 22 shown in Fig. 4 makes the doubtful short circuit of wiring pattern 13a, 13b of adjacency and causes defective insulation, it forms intermittently in bridging mode between wiring pattern 13a, the 13b of adjacency, along with the increase of the voltage applying in this doubtful short circuit portion 22 and become conducting state from nonconducting state.This doubtful short circuit portion 22 for example between wiring pattern 13a, the 13b of adjacency with the formation in column intermittently of bridging mode, for example, formed by one or more fine conductor grains or fine conductor piece (the fine conductive powders being formed by the material of wiring pattern 13a, 13b or fine conductor piece).And, the in the situation that of this doubtful short circuit portion 22, if wiring pattern 13 is applied to high potential in the time carrying out test for short-circuit, also can be flow through the electric current scaling loss of doubtful short circuit portion 22.The resistance value of this doubtful short circuit portion 22 mostly is approximately 10 megaohms to approximately 100 megaohms left and right.
In addition, the figure shown in Fig. 5 approaches portion 23, and to be that figure when forming wiring pattern 13a, 13b is bad etc. produces, is wiring pattern 13a, the 13b extremely approaching part to each other of adjacency, the defective insulation that causes cremate to cause.The resistance value that this figure approaches portion 23 is essentially infinity cremating before occurring, and is for example, corresponding to the finite value of its gap size etc., about approximately 1 megaohm in the time that spark produces.
And the inventor has carried out finding after more deep investigation, for these defective insulation reasons (21～23), need to give the inspection voltage corresponding with the kind of its defective insulation reason to wiring pattern 13 and carry out test for short-circuit.
Fig. 6 is the figure that represents various defective insulation reasons and can find the relation between the inspection voltage range of this defective insulation.Scope R1 in Fig. 6 is applicable to find tiny short circuit portion 21, and scope R2 is applicable to find doubtful short circuit portion 22, and scope R3 is applicable to find that figure approaches portion 23.
As shown in Figure 6, scope R1 is greater than 0 volt and scope below approximately 1.2 volts, more preferably 0.1 volt to 1.0 volts.On this R1, being limited to approximately 1.2 volts is because may exist in the time applying the voltage that exceedes this upper limit tiny short circuit portion 21 by the danger of excess current scaling loss.
In addition, scope R2 is the scope of approximately 0.2 volt to approximately 20 volts, more preferably 1 volt to 10 volts.As mentioned above, under scope R2, be limited to approximately 0.2 volt be because, doubtful short circuit portion 22 is discontinuous structures under microcosmic, therefore below this lower limit apply voltage time doubtful short circuit portion 22 can conducting.In addition, on scope R2, being limited to approximately 20 volts is because may exist in the time applying the voltage that exceedes this upper limit doubtful short circuit portion 22 by the danger of excess current scaling loss.
In addition, scope R3 is more than approximately 10 volts scope, more preferably more than 100 volts.Under this scope R3, being limited to approximately 10 volts is because the voltage that is less than this lower limit can not produce spark and can not find defective insulation.
As mentioned above, scope R1 and scope R2 partly overlap and scope R2 is distributed in more high-tension region each other.In addition, scope R2 and scope R3 partly overlap and scope R3 is distributed in more high-tension region each other.In addition, the curve L1～L3 in Fig. 6 represents that tiny short circuit portion 21, doubtful short circuit portion 22 and figure approach resistance value (longitudinal axis value is corresponding to the resistance value) distribution of portion 23.
In sum, in the present embodiment, corresponding to above-mentioned various defective insulation reasons (21～23), three stages were applied to the voltage that applies on wiring pattern 13 when ground switches test for short-circuit, thereby can carry out reliably the inspection for various defective insulation reasons (21～23).
; in the first test for short-circuit S2 carrying out at first of the test for short-circuit S2～S4 shown in Fig. 2; by be suitable for finding tiny short circuit portion 21 be greater than 0 volt and below approximately 1.2 volts (more preferably 0.1 volt to 1.0 volts) the first scope (; tiny short circuit portion 21 can scaling loss scope) in i.e. the first magnitude of voltage (for example approximately 1 volt) of any one value, be applied between checkpoint 12a, 12b and carry out test for short-circuit.Now, the first reference resistor value of judging for defective insulation is set to approximately 50 kilo-ohms to 200 kilo-ohms (for example 100 kilo-ohms).
In ensuing the second test for short-circuit S3, by be suitable for finding doubtful short circuit portion 22 approximately 0.2 volt to approximately 20 volts (more preferably 1 volt to 10 volts) the second scope (, doubtful short circuit portion's 22 conductings but scope that can scaling loss) in any one value, the i.e. magnitude of voltage (for example 10 volt) larger than above-mentioned the first magnitude of voltage, be applied between checkpoint 12a, 12b and carry out test for short-circuit.Now, the second reference resistor value of judging for defective insulation is for example set to approximately 10 megaohms, to 200 megaohms (100 megaohms).
In ensuing the 3rd test for short-circuit S4, by be suitable for finding figure approach portion 23 approximately 10 volts above (more preferably more than 100 volts) the 3rd scope (, can effectively produce the scope that is approached the leakage current that the spark in portion 23 causes by figure) in any one value, be greater than the tertiary voltage value (for example approximately 250 volts) of above-mentioned second voltage value, be applied between checkpoint 12a, 12b and carry out test for short-circuit.Now, the 3rd reference resistor value of judging for defective insulation is for example set to approximately 1 megaohm, to 5 megaohms (2 megaohms).
In above-mentioned steps, carry out checking S1 with and subsequent first to the 3rd test for short-circuit S2～S4, in complete inspection S1～S4, be judged to be not have abnormal inspection substrate 11 to be judged as normally, if check in S1～S4 and be judged to be extremely at any one, abandon inspection after this and finish checking in this moment.
As mentioned above, according to present embodiment, test for short-circuit S2～S4 comprises the step (S3) that the value of the degree that the voltage of giving wiring pattern 13 is set as to doubtful short circuit portion's 22 conductings but can scaling loss checks, can not make doubtful short circuit portion 22 scaling loss so can check.
In addition, set respectively for executing of test for short-circuit alive first to the 3rd test for short-circuit S2～S4 owing to being provided with according to approach portion 23 at tiny short circuit portions 21 13 formation of wiring pattern, that become defective insulation reason, doubtful short circuit portion 22 and figure, and, applying the inspection that voltage is little when checking starts to carry out, thereby carry out successively first to the 3rd test for short-circuit S2～S4, therefore, can approach that portion 23 checks to tiny short circuit portion 21, doubtful short circuit portion 22 and figure and can be by excess current scaling loss tiny short circuit portion 21 and doubtful short circuit portion 22.
In addition, inspection method of the present invention, preferably check via three steps as mentioned above, if but via the inspection step (the second test for short-circuit S3) that can find doubtful short circuit portion, can also adjust the number of times of following test for short-circuit: the test for short-circuit of the first test for short-circuit (S2) and the second test for short-circuit (S3); The test for short-circuit of the second test for short-circuit (S3) and the 3rd test for short-circuit (S4); The test for short-circuit carrying out can carry out the current potential of the first test for short-circuit and the second test for short-circuit simultaneously; The test for short-circuit of two order three tests for short-circuit; And first test for short-circuit and can carry out twice test for short-circuit of the test for short-circuit that the current potential of the second test for short-circuit and the 3rd test for short-circuit carries out etc. simultaneously.
Claims (4)
1. a base board checking device, it is by producing potential difference (PD) and taking out inspection signal from described checkpoint between the checkpoint that makes to set on the multiple wiring patterns on inspection substrate, check the resistance characteristic between described wiring pattern, it is characterized in that, this base board checking device has:
The multiple probes that contact with the conducting of described checkpoint;
Make to produce between described checkpoint the efferent of potential difference (PD) via described probe; And
In the time giving described potential difference (PD) via described probe in detecting the test section from the signal of described checkpoint,
Described efferent makes between described checkpoint to produce doubtful short circuit portion's conducting of doubtful short circuit between the described wiring pattern that makes adjacency but the scope that can not be flow through the electric current scaling loss of this doubtful short circuit portion is the potential difference (PD) of 0.2-20 volt;
Described potential difference (PD) that described efferent makes to produce between described checkpoint is interim becomes large, and described doubtful short circuit portion's conducting but described potential difference (PD) that can scaling loss are equivalent to any one level in multiple potential difference (PD) levels of this phasic Chang;
By described efferent, the described multiple potential difference (PD) levels that produce between described checkpoint are also comprised: the scope that the electric current scaling loss of this tiny short circuit portion can not flow through in described potential difference (PD) tiny short circuit portion little, that form continuously in bridging mode between the described wiring pattern of adjacency that can scaling loss than described doubtful short circuit portion is the potential difference (PD) of 0-1.2 volt; And described potential difference (PD) that than described doubtful short circuit portion's conducting but can scaling loss is large, be to be greater than the potential difference (PD) of 10 volts for detection of the scope of the leakage current being caused by the spark between described wiring pattern;
Wherein, the resistance characteristic corresponding with doubtful short circuit portion, tiny short circuit portion, the leakage current that caused by the spark between described wiring pattern is little, big or middle three phases.
2. base board checking device according to claim 1, is characterized in that,
Make the described potential difference (PD) producing between described checkpoint be set to following level by described efferent, the described doubtful short circuit portion that, makes to form intermittently in bridging mode between the described wiring pattern of adjacency becomes conducting state but this doubtful short circuit portion can be by electric current scaling loss from nonconducting state.
3. base board checking device according to claim 1, is characterized in that,
Make the described potential difference (PD) producing between described checkpoint be set to following level by described efferent;, make between the described wiring pattern of adjacency to become conducting state but this doubtful short circuit portion can be by electric current scaling loss with the described doubtful short circuit formation in column intermittently of bridging mode, that formed from one or more fine conductor grains or fine conductor piece portion from nonconducting state.
4. a base board checking device, it is by producing potential difference (PD) and taking out inspection signal from described checkpoint between the checkpoint that makes to set on multiple wiring patterns of inspection substrate, check the electrical characteristics between described wiring pattern, it is characterized in that, this base board checking device has:
The multiple probes that contact with the conducting of described checkpoint;
Make to produce between described checkpoint the efferent of potential difference (PD) via described probe;
In the time giving described potential difference (PD), detect the test section of the current value flowing through between described checkpoint; And
In controlling described efferent, derive the resistance value between described checkpoint according to giving described potential difference (PD) between described checkpoint and the detection current value of described test section, by the resistance value of relatively this derivation and the determinating reference resistance value of regulation, judge whether described wiring pattern exists the control part of defective insulation
The defect that described control part can have according to inspection substrate is set described efferent and is made the described current potential extent producing between described checkpoint, and can set according to described current potential extent the size of described determinating reference resistance value;
Described potential difference (PD) is configured to switch to:
The first current potential difference;
The second current potential difference larger than described the first current potential difference; And
The three current potential difference larger than described the second current potential difference,
Described determinating reference resistance value is configured to switch to:
The first reference resistor value of setting for described the first current potential difference;
Set and large the second reference resistor value than the first reference resistor value for described the second current potential difference;
For described the 3rd current potential difference set, large and three reference resistor value less than described the second reference resistor value than described the first reference resistor value;
Wherein, the scope of described the first current potential difference is 0-1.2 volt, and the scope of described the second current potential difference is 0.2-20 volt, and the scope of described the 3rd current potential difference is for being greater than 10 volts.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006322850A JP4918339B2 (en) | 2006-11-30 | 2006-11-30 | Board inspection equipment |
| JP2006322850 | 2006-11-30 | ||
| JP2006-322850 | 2006-11-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101191811A CN101191811A (en) | 2008-06-04 |
| CN101191811B true CN101191811B (en) | 2014-07-30 |
Family
ID=39486937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200710196206.6A Active CN101191811B (en) | 2006-11-30 | 2007-11-29 | Substrate detecting device and substrate detecting method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4918339B2 (en) |
| KR (1) | KR101222802B1 (en) |
| CN (1) | CN101191811B (en) |
| TW (1) | TWI412765B (en) |
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| JP5866943B2 (en) * | 2011-10-06 | 2016-02-24 | 日本電産リード株式会社 | Board inspection equipment |
| JP6069884B2 (en) | 2012-05-08 | 2017-02-01 | 日本電産リード株式会社 | Insulation inspection method and insulation inspection apparatus |
| JP5991034B2 (en) * | 2012-06-08 | 2016-09-14 | 日本電産リード株式会社 | Electrical property detection method and detection apparatus |
| TWI498571B (en) * | 2013-03-29 | 2015-09-01 | Nidec Read Corp | Method and apparatus of inspecting insulation |
| JP6182974B2 (en) * | 2013-05-20 | 2017-08-23 | 日本電産リード株式会社 | Board inspection method |
| JP6229877B2 (en) * | 2013-08-27 | 2017-11-15 | 日本電産リード株式会社 | Inspection device |
| JP6339834B2 (en) * | 2014-03-27 | 2018-06-06 | 東京エレクトロン株式会社 | Board inspection equipment |
| JP6421463B2 (en) * | 2014-06-02 | 2018-11-14 | 日本電産リード株式会社 | Substrate inspection apparatus and substrate inspection method |
| JP6819238B2 (en) * | 2016-11-21 | 2021-01-27 | 株式会社デンソー | Wiring abnormality detection device |
| CN106824832B (en) * | 2017-02-15 | 2019-05-17 | 友达光电（苏州）有限公司 | A kind of detection device and its application method |
| JP7009814B2 (en) * | 2017-07-27 | 2022-02-10 | 日本電産リード株式会社 | Insulation inspection equipment and insulation inspection method |
| CN112212782B (en) * | 2019-06-25 | 2023-01-17 | 合肥欣奕华智能机器股份有限公司 | Glass substrate detection method, device and system |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI412765B (en) | 2013-10-21 |
| CN101191811A (en) | 2008-06-04 |
| JP4918339B2 (en) | 2012-04-18 |
| KR20080049624A (en) | 2008-06-04 |
| KR101222802B1 (en) | 2013-01-15 |
| TW200841030A (en) | 2008-10-16 |
| JP2008139036A (en) | 2008-06-19 |
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