JP3565303B2

JP3565303B2 - Jig, measuring device and measuring method for electrical characteristics between terminals of wiring board

Info

Publication number: JP3565303B2
Application number: JP13018597A
Authority: JP
Inventors: 一城森川; 正人長崎
Original assignee: NGK Spark Plug Co Ltd
Current assignee: NGK Spark Plug Co Ltd
Priority date: 1996-11-05
Filing date: 1997-05-20
Publication date: 2004-09-15
Anticipated expiration: 2017-05-20
Also published as: JPH10185985A

Description

【０００１】
【発明の属する技術分野】
本発明は、表面に複数のピン、パッド、半田バンプ、リード等の端子を有する半導体パッケージ等の配線基板の各端子相互間における絶縁性等を測定するために用いられる配線基板の端子間電気的特性測定治具と測定装置並びにこれらを用いた測定方法に関する。
【０００２】
【従来の技術とその問題点】
半導体集積回路（ＩＣ）を搭載するセラミック又はプラスチックからなるパッケージ等の配線基板には、この配線基板をプリント基板等に接続するため、外部端子として多数のピン等の端子がその表面に設けられている。これらの端子は、各々配線基板の表面或いは内部に設けられた回路配線と繋がっている。従って、ある端子と別のある端子との間は、絶縁、短絡、又は、所定の抵抗値、静電容量値、インダクタンス等の電気的特性を持つように設計される。しかし、上記配線基板を製造する際に、何らかの不具合により、ある端子と別のある端子との間において、例えば絶縁されている筈のものが短絡していたり、逆に短絡している筈のものが絶縁（開放）されていたり、或いは、所望の抵抗値になっていなかったりする場合がある。このような不具合を検出するために、例えば端子と端子との間の絶縁を確認するため、絶縁検査装置が用いられている。
【０００３】
例えば、図１１（Ａ）に示す絶縁検査装置２００は、絶縁体のホルダ２０２に多数のプローブ２０４を配線基板２１０の各ピンＰに対応して垂直に設けている。このプローブ２０４の先端部（図中の上端部）は、その軸方向に可動で、しかも図中の上方に付勢されている。また、各プローブ２０４の下端からリード線２０６が延出し、図示しない測定装置に接続されている。ホルダ２０２の上方には、上記各ピンＰを貫通させる貫通孔２０９を多数明けた絶縁性のガイド板２０８が平行に設置されている。そして、移動式のアーム２１２に上面が吸着された配線基板２１０を下降させ、各ピンＰを対向するプローブ２０４の先端部に押圧し、ピンＰとプローブ２０４を導通させた後、各プローブ２０４間に電圧を印加する。この際、通電する部分が検出されると、当該プローブ２０４に接触したピンＰ同士の間が短絡していることが検知される。図１１（Ｂ）は、配線基板２１０を上方に持ち上げ、各プローブ２０４がピンＰから離隔した状態である。
【０００４】
ところで、繰り返して上記のような絶縁性の検査を行っている間に、各プローブ２０４自体が故障して動かなくなってピンＰと接触しなくなったり、そのリード線２０６が断線してしまうことがある。係る状態になると、検査している各ピンＰ間は短絡しているにも拘わらず、誤って絶縁性有りと判断される。この誤判定では、絶縁性が不十分な配線基板が合格になるため、正常な配線基板の信頼性までも傷付けることになる。そのため、係る誤判定を必ず排除して検査する必要がある。このことは、表面に多数のパッドを設けた配線基板のパッド相互間の絶縁性の検査を各パッドに接離するプローブによって行う場合も同じである。
しかし、配線基板における多数のピン、パッド、半田バンプ、又はリード等の端子相互間の絶縁性を測定する度に、検査装置における多数のプローブの故障やそれらのリード線の断線の有無を確認することは、極めて煩雑な作業となり、且つ生産性の点からも困難であった。
【０００５】
【発明が解決すべき課題】
本発明は、以上の従来の技術が抱える問題点を解決し、各ピン又はパッド等の端子間の絶縁性等の測定と前後して、プローブの故障やそのリード線の断線の有無の検査を迅速且つ確実に行うことができる配線基板の端子間電気的特性測定治具と測定装置並びに測定方法を提供することを目的とする。
【０００６】
【課題を解決するための手段】
本発明は、上記の課題を解決するため、前記ガイド板を導電体とし、配線基板がない状態において、このガイド板を介してプローブの故障やリード線の断線の有無を検査することに着想して成されたものである。
即ち、本発明の配線基板の端子間電気的特性測定治具は、表面に複数の端子を設けてなる配線基板の電気的特性を測定する治具であって、上記端子に接触する複数のプローブと、このプローブが互いに平行にして周縁に当接し又は貫通する複数のガイド孔を有するガイド板とを有し、上記プローブが端子に接触して導通する測定時において、各プローブとガイド板とが不導通とされ、且つ上記プローブが端子と離隔して不導通となる非測定時において、各プローブとガイド板とが導通するように構成したことを特徴とする。
この治具によれば、配線基板の端子間の絶縁性等の電気的特性の測定と、この測定に用いるプローブの故障やプローブのリード線における断線有無の検査とが交互に確実且つ迅速に行うことが可能となる。尚、上記電気的特性には絶縁性の他、抵抗値、静電容量値、インダクタンス、インピーダンス等が含まれる。
【０００７】
また、表面に複数のピンを植設してなる配線基板の各ピンを表面からその裏面まで遊嵌状に貫挿可能な複数のガイド孔を有し、少なくとも前記裏面側が導電性を有するガイド板と、上記各ガイド孔の中心軸と略同心状の中心軸を有し、上記ガイド板の裏面に対向する先端部が中心軸方向に移動可能で、この先端部は上記ガイド板の裏面寄りに移動して該裏面と先端部が接触し導通するように付勢されており、前記ピンをガイド孔に貫挿することにより、ピンと先端部とが接触して導通し且つ上記ガイド板の裏面と先端部とが離隔して両者間が不導通となる複数のプローブと、を有する配線基板の端子間電気的特性測定治具も含まれる。
これによれば、ピンをガイド孔に貫挿させてピン相互間の電気的特性の測定を行うと共に、ピンを抜きプローブとガイド板の裏面とを導通させてそのリード線の断線有無の検査を行うことが、交互に確実に行い得る。
【０００８】
更に、表面に複数の端子を設けてなる配線基板の各端子に対し、先端部が接触可能な複数のプローブと、このプローブが互いに平行して貫通する複数のガイド孔を有し少なくとも裏面側が導電性を有するガイド板とを有し、各プローブは各ガイド孔の中心軸と略同心状の中心軸を有し、その先端部が中心軸に沿って端子側に移動可能に付勢されると共に、各プローブの中間に突設した突部を上記ガイド孔の周縁のガイド板の裏面に接離可能となるように構成した配線基板の端子間電気的特性測定治具も含まれる。
これによれば、偏平形状のパッドやリードはもとより、基板の表面に植設される前記ピンや半田バンプからなる端子を有する配線基板でも、ガイド孔を貫通するプローブの先端部が接触して端子相互間の電気的特性の測定を行える。しかも、端子から先端部が離脱するとプローブとガイド板が導通されて、プローブ自体の故障やそのリード線における断線有無の検査を行うことができる。
この治具で、端子がパッド等の偏平形状のもの場合、プローブの先端部の形状は特に限定されないが、端子が特にピン又は半田バンプである場合、後述する略円錐状又は略半球状の凹面を先端部に有するプローブを用いることが望ましい。
【０００９】
本発明は、表面に複数のピンを植設してなる配線基板の各ピンを表面からその裏面まで遊嵌状に貫挿可能な多数のガイド孔を有し、少なくとも前記裏面側が導電性を有するガイド板と、上記各ガイド孔の中心軸と略同心状の中心軸を有し、上記ガイド板の裏面に対向する軸方向に移動可能な先端部を含む複数のプローブを互いに平行に固定したプローブ固定具と、上記ガイド板又はプローブ固定具の何れか一方を他方側に移動可能とし、ガイド板の裏面と各プローブの先端部とを接触及び離隔させる移動具と、を有する配線基板の端子間電気的特性測定治具も提案する。
これによれば、ガイド板又は各プローブを移動して、ピンとプローブとの接触及びプローブとガイド板との接触を交互に確実に行わせることが可能となる。
尚、移動具には、搬送アーム、流体圧シリンダ、マニプレータ等が含まれる。
【００１０】
また、表面に複数の端子を設けてなる配線基板の各端子に対し、先端部が接触可能な複数のプローブと、上記プローブが互いに平行して貫通する複数のガイド孔を有し、少なくとも裏面側が導電性を有するガイド板と、上記複数のプローブをそれぞれ軸方向に移動可能に支持し、且つ空間を介して上記ガイド板を固定したプローブ固定具と、上記複数のプローブ、ガイド板、及びプローブ固定具とを上記配線基板に対し移動可能とする移動具とを有し、各プローブは各ガイド孔の中心軸と略同心状の中心軸を有し、且つ上記空間内におけるプローブの中間に突部を設け、上記プローブの先端部が配線基板の端子に接触したときに上記突部がガイド孔の周縁のガイド板の裏面と離隔し、且つプローブの先端部が配線基板の端子と離隔したときに上記突部がガイド孔の周縁のガイド板の裏面と接触するように構成した配線基板の端子間電気的特性測定治具も含まれる。
これによれば、複数のプローブ、ガイド板、及びプローブ支持具とを一体にして配線基板に対し接離するよう移動でき、且つ端子間の電気的特性測定と各プローブのリード線における断線の検査とを交互に確実に行うことが可能となる。
【００１１】
更に、前記ガイド板が導電体にて形成されている測定治具、又は前記ガイド板の各ガイド孔の内周面が絶縁体により形成されるか絶縁層が被覆されている測定治具、或いは、前記ガイド板が絶縁体の基板とその裏面側に設けた導電性部を有する配線基板の端子間電気的特性測定治具も含まれる。即ち、ガイド板は少なくとも裏面側が導電性を付与されておれば良く、例えばプローブが芯振れしてもその裏面とプローブの先端部又は突部とを確実に接離できる。
また、前記ピンに接離するプローブの先端部における先端面が、略円錐状又は略半球状の凹面である測定治具も含まれる。これにより、特にピン又は半田バンプとプローブとの接触を確実に行えるので、ピン間や半田バンプ間の電気的特性の測定を正確に行うことができる。
更に、前記ガイド孔を貫通して端子に接離するプローブにおいて、その突部と先端部との間の周面に絶縁層を被覆した測定治具も含まれる。これにより、プローブが芯振れしても端子との接触時にガイド板との不用意な導通を予防できる。
また、前記プローブの先端部の付勢が、各プローブの本体に内蔵されたバネ等の弾性体によって行われる測定治具も含まれる。これにより、プローブの先端部を端子に確実に接触させることができる。
【００１２】
更に本発明は、以上の配線基板の電気的特性測定治具と、前記配線基板をその厚さ方向に移動可能に保持する保持手段と、各端子と前記プローブの先端部とが接触し導通している間に、各プローブを通して配線基板内の端子相互間における電気的特性を測定する電気特性測定部と、ガイド板の裏面とプローブの先端部又は突部とが接触し導通している間に、ガイド板から各プローブを経由して、電源までの回路における電気的断線の有無を検出する断線検出部と、を有する配線基板の端子間電気的特性測定装置も提案する。
これによれば、測定すべき配線基板を取り替えている間に、プローブの故障やそのリード線の断線の有無等を検査できるので、多数の配線基板における端子間の電気的特性の測定を自動的に効率良く、確実に成さしめることができる。
上記保持手段には、例えば配線基板の端子のない表面側をエア吸着する３次元方向に移動可能な搬送アーム等が用いられる。また、上記電気特性測定部や断線検出部には、配線基板や測定項目に応じて種々の測定装置が用いられ、例えばテスタ装置が挙げられる。このテスタ装置は、各プローブを介して各端子（ピン）に接続している配線に対して、例えば１ピンと２ピン、１ピンと３ピン、…、のように次々に各配線間に電圧を印加して、絶縁性等を測定するものである。
尚、上記測定部と検出部とを１台のテスタ装置等に兼用させることもできる。
【００１３】
加えて、表面に複数の端子を設けてなる配線基板の各端子によって、各プローブの先端部を押圧し、このプローブの先端部をその軸方向に後退させて当該プローブの各先端部又は係るプローブの中間に設けた各突部を導電体から離隔し、端子とプローブの先端部とを接触して導通させ、各プローブを通して各端子間における電気的特性を測定する工程と、上記配線基板を除去して、上記プローブの各先端部をその軸方向に前進させるか又は上記導電体を移動させて、プローブの各先端部又は各突部を導電体に接触させて導通し、この導電体から各プローブを経由して電源までの回路における電気的導通を確認する工程と、を交互に繰り返して上記配線基板の端子間の電気的特性を測定し、且つ上記プローブ側の電気的導通を確認する、配線基板の端子間電気的特性測定方法も提案する。
これにより、配線基板の端子間の特性測定とリード線の断線等の検査を交互に行え、高い信頼性の品質管理を可能とする。尚、上記導電体には、前記の各ガイド板、又はこれと別体の物を用いることもできる。
【００１４】
【実施の形態】
以下に本発明の実施に好適な形態を図面と共に説明する。
図１は、本発明の端子間電気特性測定治具（装置）１に関し、同図（Ａ）及び（Ｂ）は、その縦断面図を示す。下方の図示しないフレーム上の四辺に立設された絶縁材からなる側壁２内に、アクリル樹脂製のホルダ４が水平に架設され、且つその上方に水平な真鍮製のガイド板６が固定される。上記ホルダ４には、複数のプローブ１０が垂直に貫通し、且つ配線基板Ｗの端子たるピンＰ群に対応した位置に固定されている。また、上記ガイド板６にも、配線基板ＷのピンＰ群を貫挿可能とする複数のガイド孔８が穿設されている。更に、各プローブ１０の下端からリード線１２がそれぞれ延びて後述する電気特性測定部及び断線検出部に接続され、ガイド板６からもリード線９が後述する断線検出部に接続されている。
【００１５】
図１（Ｃ）は、上記プローブ１０の断面図を示し、右側のリード線１２の先端をコネクタ１３に接続し、このコネクタ１３の左側にプランジャ１４の後（右）端をスライド可能に挿入する。このプランジャ１４の周囲にコイルバネ１７を巻き付け、バネ１７の両端をプランジャ１４の段部１４ａとパイプケース１８中央の紐出し部１９に当接させて、プランジャ１４を図中左方に付勢しつつ支持している。また、プランジャ１４左方の太径の先端部１５の先端面１６は、円錐状の凹面とされている。従って、通常各プランジャ１４は上方に付勢され、ガイド孔８にピンＰが貫挿していない時には、図１（Ｂ）のように、その先端面１６の周縁が前記ガイド板６裏面の各孔８の周縁に接触する。係る配線基板Ｗがない状態では、各プランジャ１４とガイド板６が導通しているため、プローブ１０に接続した各リード線１２の断線の有無やプローブ１０自体の故障の有無が検査可能となる。
【００１６】
一方、水平及び垂直方向に移動可能な保持手段たる搬送アーム２０の下端にエア吸着された配線基板Ｗを、その各ピンＰを下向きにして測定治具１に上方から下降して近接させ、ピンＰをガイド板６の各ガイド孔８に貫挿し、各ピンＰの下端で各プローブ１０の先端面１６を押圧（押し下げ）した状態が図１（Ａ）である。各ガイド孔８の内径は、ピンＰの直径よりも大きいため、ピンＰは遊嵌状に挿通され、両者は接触しない。この状態では、各ピンＰ間の配線基板Ｗ内において本来求められる絶縁性の測定が行われる。
即ち、測定治具１は、ガイド板６全体を導電体の真鍮製とし、プローブ１０の先端部１５をガイド板６の裏面と接触し導通するように付勢したので、配線基板ＷにおけるピンＰ間の絶縁性の測定という本来の目的と共に、その前後においてプローブ１０の故障やそれらのリード線１２の断線の有無も検査可能とし、誤りのないピンＰ間の絶縁性の測定を可能としたものである。
【００１７】
図２は、前記測定治具１における配線基板Ｗとガイド板６とホルダ４に固定されたプローブ１０群の配置関係を示す斜視図である。配線基板Ｗはピングリッドアレイ（ＰＧＡ）型基板で、その下表面の中央に搭載するＩＣの周囲に３列のピンＰを全体を枠状に且つ隣接するピンＰ同士を格子状に植設したものである。
また、ガイド板６は、これらのピンＰ群を貫挿させる複数のガイド孔８を同様に穿設している。更に、下方のホルダ４を貫通してそのパイプケース１８を固定された複数のプローブ１０も、上記ピンＰ群の配列パターンと同じ位置に固定され、それらの先端部１５の先端面１６を上向きにして、ピンＰの下（先）端に接触可能に対向している。
尚、上記先端面１６を円錐状の凹面としたのは、ピンＰの下端を先端面１６の中心部に案内し、その接触位置を一定にすると共に、ピンＰをガイド板６の各ガイド孔８の内周面に接触させないためである。
【００１８】
次に、本測定治具（装置）１の作用について説明する。
図３（Ａ）は、配線基板Ｗを前記搬送アーム２０と共に下降させ、そのピンＰをガイド板６のガイド孔８に貫挿させると共に、ピンＰの下端をプローブ１０における先端部１５の先端面１６に接触させ、且つ、そのプランジャ１４を下方に押し下げた状態を示す。
この状態において、例えば図４（Ａ）に示すように、２つのピンＰＡ，ＰＢをそれぞれプローブ１０Ａ，１０Ｂ、リード線１２Ａ，１２Ｂを通じて電気特性測定部３０に接続する。ここで、電気特性測定部３０から、例えば、一方のリード線１２Ａを通じて一方のピンＰＡに正電圧を、他方のリード線１２Ｂを通じて他方のピンＰＢに負電圧を印加する（或いは、ピンＰＢを接地する）。
【００１９】
本来、この２つのピンＰＡ，ＰＢに接続している配線基板Ｗに設けられた配線間が絶縁されていれば、配線基板Ｗは正常であり電流は流れず、２つの配線間、即ち２つのピンＰＡ，ＰＢ間で絶縁性が保たれていることが判る。一方、電流が流れた場合には、２つの配線間、即ち２つのピンＰＡ，ＰＢ間で短絡が生じており、配線基板Ｗが何らかの不具合を有していることが判定できる。
上記電気特性測定部３０としては、種々のものを用いることができるが、例えばプリント基板テスタ、オープンリークテスタ等と称される各種検査装置を使用すると良い。尚、上記においては、配線間（ピン間）の絶縁性について測定した例を示したが、ピン間の抵抗値や静電容量値等を測定することも可能である。
【００２０】
次いで、上記絶縁性の測定が済んだ配線基板Ｗを搬送アーム２０と共に上昇させ除去すると、各プローブ１０のプランジャ１４はそのバネ１７に付勢されて上昇し、図３（Ｂ）に示すように、その先端部１５は、ガイド板６裏面の対応するガイド孔８の周縁に接触する。この状態において、ガイド板６は真鍮製の導電体であるため、ガイド板６とプローブ１０の間、更には各プローブ１０間は、ガイド板６を介して導通可能になる。
この状態において、図４（Ｂ）に示すように、２つのプローブ１０Ａ，１０Ｂをリード線１２Ａ，１２Ｂを通じて断線検出部４０に接続する。また、同様にガイド板６もリード線９を通じて上記検出部４０に接続する。ここで、例えば検出部４０の図示しない電源からリード線９を通じてガイド板６に負電圧を印加し、リード線１２Ａを通じてプローブ１０Ａに正電圧を印加すると、ガイド板６とプローブ１０Ａとは接触導通しているため、電流が流れることになる。また、同様にして検出部４０の電源からリード線１２Ｂを通じてプローブ１０Ｂに正電圧を印加しても電流が流れる。これにより各プローブ１０Ａ，１０Ｂ内の故障によるピンＰＡ，ＰＢとの接触不良や各リード線１２Ａ，１２Ｂにおける断線等の電気的断線がないことが判明し、前記ピンＰＡ，ＰＢ間の絶縁性の測定が正しい前提のもとに行われたことが裏付けられる。
【００２１】
尚、以上の他、検出部４０の電源からリード線１２Ａを通じてプローブ１０Ａに正電圧を、リード線１２Ｂを通じてプローブ１０Ｂに負電圧をそれぞれ印加して、両者間に導通があることを確認するようにしても良い。
しかし、あるプローブ、例えばプローブ１０Ａに接続するリード線１２Ａ中に断線がある場合、電流は流れない。また、プローブ１０Ａが内部で故障し、その先端部１５Ａが上下に動かない状態となっている場合も同様となる。係る断線したリード線１２Ａに接続されたプローブ１０Ａや故障したプローブ１０Ａを用いて、前記ピンＰＡ，ＰＢ間の絶縁性測定を行っても、元々ピンＰＡが電気特性測定部３０に接続していないため、プローブ１０Ａ，１０Ｂに接触した各ピンＰＡ，ＰＢ間が配線基板Ｗ中で正しく絶縁されているか否か測定できない。むしろピンＰＡ，ＰＢの間が短絡している場合にも、絶縁性有りと誤った測定結果を出すことになる。そこで、上記リード線１２Ａの断線等が検知された場合、その導通がない旨を表示又はアラームすることによって知らせ、直ちに測定装置１を停止して当該部分の補修を行う。尚、前記電気特性測定部３０と上記断線検出部４０を一台の同じテスタ装置で兼用させて用いることもできる。
【００２２】
以上のように、本測定治具（装置）１によれば、各プローブ１０の先端部１５が上昇可能に付勢されているので、配線基板Ｗがない状態では、各プローブ１０の先端部１５がガイド板６の裏面に接触し、各プローブ１０の故障やリード線１２の断線を検査できる。また、搬送アーム２０によって新たな配線基板Ｗが搬入され、そのピンＰをガイド板６の各ガイド孔８を貫挿して対向するプローブ１０の先端部１５を押圧し下降させると、ガイド板６とプローブ１０は離隔され、本来のピンＰ間の絶縁性の測定が行える。そして、これら断線等の検査と絶縁性の測定が交互に且つ自動的に行われるので、配線基板ＷのピンＰ間の絶縁性の測定を正しく連続して行うことができ、極めて信頼性の高い測定を行うことができる。
【００２３】
尚、本測定治具（装置）１の形態には、以下のものも含まれる。
図５（Ａ）に示すように、プローブ１０のプランジャ１４の先端部１５における先端面１６を、中心部が下向きに窪んだ球面状の凹面１６′としたり、又は、同図（Ｂ）に示すように、周縁のみテーパ面とし中心部を急な傾斜の球面窪みを設けた凹面１６″とすることもできる。即ち、先端面１６の中心部が他より低位となる形状にすると良い。ピンＰの下（先）端が自ずと先端面１６の中心部に案内され、且つピンＰとガイド板６が接触し難くなるからである。
また、ガイド板６を真鍮製の単一体とせず、例えば図６（Ａ）に示すように、前記と同様の真鍮板５２にガイド孔５４を所定の位置に穿設し、且つこれをガラス繊維で強化したエポキシ製の基板たる樹脂板５６の下面に貼り付け、且つ樹脂板５６にガイド孔５４よりやや小径のガイド孔５８を連通させたガイド板５０を用いることもできる。
【００２４】
或いは、図６（Ｂ）に示すように、真鍮板６２にガイド孔６６を有するリングフランジ６４を一体に形成し、これを前記同様の絶縁性基板たる樹脂板６８の下面に貼り付け、且つ、この樹脂板６８から上記ガイド孔６６内にその下端部分を残して進入する小径のリングフランジ７０を垂下させたガイド板６０を用いることもできる。尚、上記真鍮板５２，６２は本発明における導電性部に相当する。
これらのガイド板５０、６０によれば、配線基板Ｗの各ピンＰが貫挿する際、絶縁性の樹脂板５６、６８のガイド孔５８内やフランジ７０に接触しても導通することなく下方にガイドされ、且つ、導電体の真鍮板５２，６２には接触しにくい。従って、前記図３（Ａ）のように各ピンＰをプローブ１０の先端部１５の先端面１６に確実に接触させ、導通することができる。
【００２５】
また、図７は、前記と同様にガイド板６を固定させ、プローブ１０群を固定したホルダ４をその周辺５において、移動具たる複数のエアシリンダ８２のピストンロッド８４の上端に連結し、該シリンダ８２によって上方のガイド板６の裏面に対し各プローブ１０の先端部１５を接離自在とする測定治具８０を示す。この治具８０は、プローブ１０の先端部１５の昇降ストロークが不足したり、互いにバラ付く場合、エアシリンダ８２の駆動によって、ガイド板６と各プローブ１０の接触と離隔を確実に行わせることができる。
【００２６】
更に、図８は、ガイド板６をその周辺７において複数のエアシリンダ９２の各ピストンロッド９４の上端に連結して昇降可能とし、ガイド板６の裏面を各プローブ１０に対し接離自在とした測定治具９０を示す。
尚、上記シリンダ８２、９２に替えて、例えばコイルバネ、板バネ、合成ゴム体等の弾性体を用いることもできる。何れの治具８０，９０によっても、配線基板Ｗの種類によってそれらのピンＰの長さが変更される場合に有効である。
【００２７】
図９は、表面に端子たる複数の接続用パッドｐを設けた配線基板ｗの各パッドｐ相互間の絶縁性等を検査する端子間電気的特性測定治具１００に関する。
図９（Ａ）はこの測定治具１００の垂直断面図を示し、この治具１００は矩形状のプローブ固定具たるホルダ１０２と、該ホルダ１０２を垂直に貫通して支持される複数のプローブ１１０と、各プローブ１１０の図示で下端の先端部１１４を貫通させるガイド孔１０８を穿設し、且つ上記ホルダ１０２にその周辺部１０９において固定されるガイド板１０６とを有する。
上記ホルダ１０２には、複数の貫通孔１０４が形成され、前記同様のプローブ１１０のパイプケース１１６が上記の各貫通孔１０４内に固定されて、このケース１１６内に内装した図示しないバネにより、各プローブ１１０におけるプランジャ１１２の先端部１１４を図示で下向き方向に付勢しつつ支持している。
【００２８】
また、ホルダ１０２とガイド板１０６との間には、空間１０５が形成され、各プローブ１１０のプランジャ１１２の中間において水平向きにリング状に設けた突部たる鍔１１８を上記空間１０５内に位置させると共に、各鍔１１８の下面をガイド板１０６の各ガイド孔１０８の上面（裏面）側の周縁に接触させている。
図９（Ａ）に示す非測定時においては、各鍔１１８とガイド板１０６とは互いに導通されている。従って、各プローブ１１０の上端のリード線１１９とガイド板１０６とを図示しない断線検出部に接続することにより、各プローブ１１０自体の故障や各リード線１１９における断線の有無を検査することができる。
【００２９】
一方、図９（Ｂ）に示すように、ホルダ１０２等を図示しないマニプレータ等の移動具に保持しつつ、絶縁性のテーブルＴ上の所定位置に載置された配線基板ｗに向けて下降すると、各プローブ１１０のプランジャ１１２の半球形状を呈する先端部１１４は配線基板ｗの上表面に配設された複数の端子たるパッドｐに接触する。接触した各プローブ１１０のプランジャ１１２は図示のように上昇して、その鍔１１８がガイド板１０６から離隔することによって、プローブ１１０とガイド板１０６とは不導通とされる。尚、配線基板ｗよりも外側に位置するプローブ１１０はテーブルＴ上に接触すると共に、ホルダ１０２等を図示よりも更に下降することで、その各鍔１１８もガイド板１０６から離隔する。
【００３０】
係る状態において、各プローブ１１０間にリード線１１９を介して図示しない電気特性測定部から電圧を印加する。すると、各プローブ１１０に接触するパッドｐ相互間における絶縁性が所定値以上に保たれているか否かが測定される。即ち、各パッドｐ間の基板ｗ内において短絡が存在すると、これらに接触するプローブ１１０間に電流が流れたことが検出される。これにより係る基板ｗを排除対象として、ラインから排出する。尚、テーブルＴは絶縁体からなるので、基板ｗの外周に位置してそのパッドｐに接触しないプローブ１１０との間でも不導通となり、上記の測定に支障を来さない。
【００３１】
尚、突部は前記鍔１１８に替えて、プローブ１１０の中間の周面から側方に突出し、且つガイド孔１０８の裏面側の周縁に接触可能であれば、種々の形状を有するフランジやリブ或いは突起等を用いることもできる。例えば図１０（Ａ）は断面が略三角形を呈する円錐形状の突部１１８ａを示し、そのテーパ面にてガイド孔１０８の裏面側の周縁に接触可能としたものである。また、同図（Ｂ）は略楕円形の断面を有する球形状の突部１１８ｂを示し、その球面にてガイド孔１０８の裏面側の周縁に接触するようにしたものである。そして、同図（Ｃ）はプランジャ１１２の中間から水平に延びる突起１１８ｃを設けたもので、突起１１８ｃの先端側がガイド孔１０８の裏面側の周縁に接触するものである。
【００３２】
また、プランジャ１１２がガイド孔１０８の中心線に対してその中心軸が芯振れして、パッドｐ等の端子に接触していない際に、ガイド孔１０８の内周面との不用意な接触を防ぐため、ガイド孔１０８の内周面を薄肉の樹脂製パイプ（図示せず）で被覆しても良く、或いは樹脂製塗料を塗布することで絶縁しても良い。
或いは、図１０（Ｄ）に示すように、プランジャ１１２における鍔１１８等の突部と先端部１１４との間の周面に薄い絶縁層１１３を予め被覆しておくこともできる。何れによっても、プランジャ１１２とガイド孔１０８との不用意な接触を予防できると共に、プランジャ１１２自体の磨耗等も防げるので、その耐久性を高めることにもなる。
【００３３】
更に、プランジャ１１２の半球形状を呈する先端部１１４は、パッドｐやリード等の扁平な形状の端子に対して接触し易いが、前記ピンＰや球形状の半田バンプのように突出する端子には接触しにくい。
そこで、図１０（Ｅ）に示すように、プランジャ１１２の下（先）端に前記と同様な下向きの略球面状の凹面１１５ａを有する先端部１１５を固定すると、図示のように配線基板（図示せず）の表面から立設するピンＰの先端に接触させることが可能となる。
即ち、この測定治具（装置）１００によれば、プローブ１１０の先端部１１４，１１５を選択することにより、パッドｐ等の扁平形状の端子の他、ピンＰのような突出する形状の端子を有する配線基板についても、各端子間における絶縁性、抵抗値、静電容量値、インダクタンス、インピーダンス等の電気的特性を測定することが可能であり、前記測定治具（装置）１等に比べ汎用性の高いものである。
【００３４】
また、測定治具１００は、複数のプローブ１１０の位置が測定すべき配線基板ｗのパッドｐ等の各端子の位置と略対応していれば良く、各プローブ１１０及びこれらが貫通するガイド板１０６のガイド孔１０８とが、各端子と同数でなくても良いので、種々の端子配列を有する配線基板の電気的特性を測定できる。
しかも、測定治具１００は、ホルダ１０２とガイド板１０６と複数のプローブ１１０とを予め一つのユニットとして一体化して移動可能とし、且つ電気的特性の測定時において端子との接触の有無に関わりなく各プローブ１１０を自由に移動するように構成されるので、製作し易く使用方法を簡便にする利点も有する。
【００３５】
本発明は、以上の各形態に限定されるものではない。
ガイド板の材質は、導電体であれば銅、鉄、鋼、ステンレス鋼、所謂インバー合金（Ｆｅ−Ｎｉ系の低膨張合金）、アルミ、又はチタン或いはこれらの合金を適用することや、これらを樹脂板の裏面に貼り付けた複合材を用いることもできる。
また、ガイド板に穿設する各孔は、ピン又はプランジャの挿入側を広くしたすり鉢状のテーパ孔とし、ピン等の挿通を容易化することもできる。
更に、ガイド板を複数のプローブを有するホルダと平行にして一体化し、各配線基板毎の専用測定治具としても良い。この場合、ガイド板の裏面に貼り付けられた前記樹脂板からホルダの周縁に連結部を形成して一体化することもできる。
【００３６】
また、ガイド板や複数のプローブを有するホルダを互いに平行にしたまま、垂直姿勢や斜めの傾斜姿勢にて用いることもできる。
更に、前記ホルダのプローブ取付け孔を複数種類用意し、各プローブをホルダに対し取り替え可能とし、プローブの配列パターンを配線基板の端子群の配列パターンに応じて変更可能とすることもできる。
加えて、プローブの先端部を付勢する弾性体も前記コイルバネの他に、リング状のゴム片やワイヤ状のバネ材を用いることもできる。
更に、配線基板の保持手段は、前記搬送アームやマニピュレータの他、移動可能なエアシリンダとし、そのロッド等の下（先）端にエア吸着部や磁気吸着部、或いは把持爪を取付けたものを用いることもできる。
【００３７】
【発明の効果】
以上において説明した本発明の端子間電気特性測定治具によれば、配線基板の各端子間における絶縁性等の測定が正確にできると共に、治具自体を構成するプローブの故障やそのリード線の断線の有無も端子間の絶縁性等の測定の前後で必ず検査して、測定治具自体の欠陥による誤測定も排除でき、信頼性の高い測定が行えるので、各種の端子付き配線基板に対して優れた品質保証を可能とする。
請求項２及び４の発明によれば、ピンを植設した基板側の電気的特性の測定と治具側の断線の検査が交互に確実に行える。
また、請求項３及び５の発明によれば、プローブの先端部を選択することで、パッド等の偏平形状はもとよりピンのような端子の測定もでき、プローブの位置も端子と互いに接触可能な範囲で適用できるので、各種の基板に使用できる。
【００３８】
更に、請求項７，８、及び１０によれば、ピン又はプローブがガイド孔に接触しても当該ピン又はプローブはガイド板と導通せず、誤測定を防止できる。
また、請求項９の発明によれば、ピン又は半田バンプとプローブの先端部の接触を確実に行わしめることができる。
更に、請求項１１の発明によれば、プローブ自体がその先端部又は突部をガイド板に対し接触可能に付勢しているので、治具や装置の構成を簡素化できる。
また、請求項１２及び１３の発明によれば、大量の配線基板の端子間における電気的特性を正確に且つ効率良く行うことができ、測定の自動化も可能となる。
【図面の簡単な説明】
【図１】（Ａ）及び（Ｂ）は本発明の測定治具／装置の各使用状態を示す縦断面図、（Ｃ）は本治具／装置に用いるプローブの断面図である。
【図２】配線基板を含む本測定治具の分解斜視図である。
【図３】（Ａ）はピンを貫挿したガイド板とプローブの状態を示す部分縦断面図、（Ｂ）はガイド板にプローブが接触した状態を示す部分縦断面図である。
【図４】（Ａ）は本測定装置の電気特性測定部を含む概略図、（Ｂ）は断線検査部を含む概略図である。
【図５】（Ａ）及び（Ｂ）は共に異なる形態のプローブを示す部分断面図である。
【図６】（Ａ）及び（Ｂ）は共にガイド板の異なる形態を示す部分断面図である。
【図７】測定治具の異なる形態を示す縦断面図である。
【図８】測定治具の更に異なる形態を示す縦断面図である。
【図９】（Ａ）及び（Ｂ）は共に異なる形態の測定治具の使用状態を示す縦断面図である。
【図１０】（Ａ）乃至（Ｅ）は共に更に異なる形態のプローブを示す部分断面図である。
【図１１】（Ａ）及び（Ｂ）は共に従来の絶縁検査装置の使用状態を示す縦断面図である。
【符号の説明】
１，８０，９０，１００…………ピン間電気的特性測定治具／装置
４，１０２…………………………ホルダ（プローブ固定具）
６，５０，６０，１０６……………ガイド板（導電体）
８，５４，５８，６６，１０８………ガイド孔
１０，１１０………………………プローブ
１５，１１５………………………先端部
１６，１６′，１６″，１１５ａ……先端面
１７…………………………………コイルバネ（バネ）
２０…………………………………搬送アーム（保持手段）
３０…………………………………電気特性測定部
４０…………………………………断線検出部
５２，６２…………………………真鍮板（導電性部）
５６，６８…………………………樹脂板（基板）
８２，９２…………………………エアシリンダ（移動具）
１０５………………………………空間
１１３………………………………絶縁層
１１８，１１８ａ〜ｃ……………鍔、突部、突起（突部）
Ｗ，ｗ………………………………配線基板
Ｐ……………………………………ピン（端子）
ｐ……………………………………パッド（端子）[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention is directed to an electrical connection between terminals of a wiring board used for measuring insulation between terminals of a wiring board such as a semiconductor package having a plurality of pins, pads, solder bumps, and leads on the surface. The present invention relates to a characteristic measuring jig, a measuring device, and a measuring method using the same.
[0002]
[Conventional technology and its problems]
2. Description of the Related Art A wiring board such as a ceramic or plastic package on which a semiconductor integrated circuit (IC) is mounted is provided with a large number of pins and other terminals as external terminals on its surface in order to connect the wiring board to a printed board or the like. I have. Each of these terminals is connected to a circuit wiring provided on the surface or inside of the wiring board. Therefore, between a certain terminal and another certain terminal is designed to be insulated, short-circuited, or to have predetermined electrical characteristics such as resistance value, capacitance value, and inductance. However, when manufacturing the above-mentioned wiring board, for example, between a certain terminal and another certain terminal, one that is supposed to be insulated is short-circuited or one that is supposed to be short-circuited due to some problem. May be insulated (open) or may not have the desired resistance. In order to detect such a defect, for example, an insulation inspection device is used to confirm insulation between terminals.
[0003]
For example, in an insulation inspection apparatus 200 shown in FIG. 11A, a large number of probes 204 are provided vertically on an insulating holder 202 so as to correspond to each pin P of a wiring board 210. The tip (the upper end in the figure) of the probe 204 is movable in the axial direction and is urged upward in the figure. A lead wire 206 extends from the lower end of each probe 204 and is connected to a measuring device (not shown). Above the holder 202, an insulative guide plate 208 having a large number of through holes 209 through which the pins P pass is provided in parallel. Then, the wiring board 210 whose upper surface is attracted to the movable arm 212 is lowered, and each pin P is pressed against the tip of the opposing probe 204 to make the pin P and the probe 204 conductive. Is applied. At this time, when a portion to be energized is detected, it is detected that the pins P in contact with the probe 204 are short-circuited. FIG. 11B shows a state in which the wiring board 210 is lifted upward and the probes 204 are separated from the pins P.
[0004]
By the way, while the above-described insulation test is repeatedly performed, each probe 204 itself may malfunction and stop moving, and may not contact the pin P, or the lead wire 206 may be disconnected. . In such a state, it is erroneously determined that there is insulation even though the pins P under inspection are short-circuited. In this erroneous determination, a wiring board with insufficient insulating properties passes, and thus damages even the reliability of a normal wiring board. For this reason, it is necessary to eliminate the erroneous determination and perform the inspection. The same applies to the case where the inspection of the insulation between the pads of a wiring board having a large number of pads on the surface is performed by a probe which comes into contact with and separates from each pad.
However, every time the insulation between terminals such as a large number of pins, pads, solder bumps, or leads on a wiring board is measured, it is checked whether a large number of probes have failed in the inspection apparatus and whether or not the lead wires are disconnected. This is an extremely complicated operation, and is difficult in terms of productivity.
[0005]
[Problems to be solved by the invention]
The present invention solves the above-mentioned problems of the conventional technology, and before and after the measurement of insulation between terminals such as each pin or pad, inspects for a probe failure and the presence or absence of a break in a lead wire thereof. An object of the present invention is to provide a jig, a measuring device, and a measuring method for measuring electrical characteristics between terminals of a wiring board, which can be performed quickly and reliably.
[0006]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, the present invention is conceived to inspect the probe for failure or disconnection of the lead wire through the guide plate in a state where the guide plate is a conductor and there is no wiring board. It was made.
That is, a jig for measuring electric characteristics between terminals of a wiring board according to the present invention is a jig for measuring electric characteristics of a wiring board having a plurality of terminals provided on a surface thereof, and a plurality of probes that contact the terminals. And a guide plate having a plurality of guide holes in which the probes are in parallel with each other and abut on or penetrate the periphery, and at the time of measurement in which the probes are brought into contact with the terminals to conduct electricity, each probe and the guide plate are separated from each other. In a non-measurement period in which the probe is disconnected and the probe is separated from the terminal and disconnected, the probe and the guide plate are electrically connected.
According to this jig, the measurement of the electrical characteristics such as the insulation between the terminals of the wiring board and the inspection of the failure of the probe used for this measurement and the presence or absence of disconnection in the lead wire of the probe are alternately and promptly performed. It becomes possible. Note that the electrical characteristics include resistance, capacitance, inductance, impedance, and the like, in addition to insulation.
[0007]
Further, a guide plate having a plurality of guide holes through which a plurality of pins are implanted on the front surface so that each pin of the wiring board can be loosely inserted from the front surface to the back surface thereof, and at least the back surface has conductivity. And a center axis substantially concentric with the center axis of each of the guide holes, and a tip portion facing the back surface of the guide plate is movable in the center axis direction, and the tip portion is closer to the back surface of the guide plate. It is urged to move and contact the back surface and the tip portion so as to make contact and conduct.By inserting the pin into the guide hole, the pin and the tip portion contact and conduct, and the back surface of the guide plate and A jig for measuring electrical characteristics between terminals of a wiring board, which includes a plurality of probes that are separated from the distal end and become electrically disconnected from each other, is also included.
According to this, the pins are inserted into the guide holes to measure the electrical characteristics between the pins, and at the same time, the pins are pulled out and the probe is connected to the back surface of the guide plate to check whether the lead wires are disconnected. What can be done alternately and reliably.
[0008]
Further, the probe has a plurality of probes that can be contacted at the distal end with each terminal of the wiring board having a plurality of terminals on the front surface, and a plurality of guide holes through which the probes penetrate in parallel with each other. Each probe has a central axis substantially concentric with the central axis of each guide hole, and the tip of the probe is movably biased toward the terminal along the central axis. Also, a jig for measuring electrical characteristics between terminals of a wiring board, which is configured such that a protrusion protruding in the middle of each probe can be brought into contact with and separated from the back surface of the guide plate on the periphery of the guide hole.
According to this, not only flat-shaped pads and leads, but also a wiring board having terminals made of the pins and solder bumps implanted on the surface of the board, the tip of the probe penetrating through the guide hole comes into contact with the terminal. Measurement of electrical characteristics between each other can be performed. In addition, when the distal end portion is detached from the terminal, the probe and the guide plate are electrically connected, and it is possible to inspect the probe itself for a failure and for the presence or absence of a break in the lead wire.
In this jig, when the terminal has a flat shape such as a pad, the shape of the tip of the probe is not particularly limited, but when the terminal is a pin or a solder bump, a substantially conical or substantially hemispherical concave surface described later is used. It is desirable to use a probe having at the tip.
[0009]
The present invention has a large number of guide holes through which a plurality of pins are implanted on a front surface so that each pin of the wiring substrate can be loosely inserted from the front surface to the back surface thereof, and at least the back surface has conductivity. A probe having a guide plate and a plurality of probes having a center axis substantially concentric with the center axis of each of the guide holes and including a plurality of probes movable in the axial direction opposed to the back surface of the guide plate and fixed in parallel with each other. A terminal between the terminals of the wiring board, comprising: a fixture; and a movable component that allows one of the guide plate and the probe fixture to be movable to the other side and that contacts and separates the back surface of the guide plate and the tip of each probe. An electrical property measurement jig is also proposed.
According to this, it is possible to move the guide plate or each probe so that the contact between the pin and the probe and the contact between the probe and the guide plate are alternately and reliably performed.
The moving tool includes a transfer arm, a fluid pressure cylinder, a manipulator, and the like.
[0010]
Also, for each terminal of the wiring board having a plurality of terminals on the front surface, the probe has a plurality of probes that can be contacted at the tip and a plurality of guide holes through which the probes penetrate in parallel with each other. A guide plate having conductivity, a probe fixture that supports the plurality of probes movably in the axial direction, and fixes the guide plate via a space, the plurality of probes, the guide plate, and the probe fixing A probe that has a central axis that is substantially concentric with the central axis of each guide hole, and that has a projection in the middle of the probe in the space. When the tip of the probe contacts the terminal of the wiring board, the protrusion separates from the back surface of the guide plate at the periphery of the guide hole, and the tip of the probe separates from the terminal of the wiring board. Serial projections inter-terminal electric characteristics measuring jig of the wiring substrate configured to contact a rear surface of the periphery of the guide plate of the guide holes are also included.
According to this, the plurality of probes, the guide plate, and the probe support can be integrally moved so as to be in contact with and separated from the wiring board, and the electrical characteristics between the terminals can be measured and the disconnection in the lead wire of each probe can be inspected. Can be reliably and alternately performed.
[0011]
Furthermore, a measurement jig in which the guide plate is formed of a conductor, or a measurement jig in which the inner peripheral surface of each guide hole of the guide plate is formed of an insulator or covered with an insulating layer, or The present invention also includes a jig for measuring electrical characteristics between terminals of a wiring board having the guide plate having an insulating substrate and a conductive portion provided on the back side thereof. That is, at least the back side of the guide plate may be provided with conductivity. core Even if it oscillates, the back surface thereof and the tip or protruding portion of the probe can be reliably brought into contact with or separated from each other.
Further, a measuring jig in which a distal end surface of a distal end portion of the probe which comes into contact with and separates from the pin is a substantially conical or substantially hemispherical concave surface is also included. As a result, the contact between the probe and the pins or the solder bumps can be reliably performed, and the electrical characteristics between the pins or the solder bumps can be accurately measured.
Further, in the probe that penetrates the guide hole and comes into contact with and separates from the terminal, a measuring jig in which an insulating layer is coated on a peripheral surface between the protruding portion and the tip portion is also included. This allows the probe core Even if it shakes, careless conduction with the guide plate at the time of contact with the terminal can be prevented.
Further, a measuring jig in which the distal end of the probe is urged by an elastic body such as a spring built in the main body of each probe is also included. This allows the tip of the probe to reliably contact the terminal.
[0012]
Further, the present invention provides a jig for measuring the electrical characteristics of the wiring board, holding means for holding the wiring board so as to be movable in its thickness direction, and contact between each terminal and the tip portion of the probe to conduct. While the electrical characteristics measurement unit that measures the electrical characteristics between the terminals in the wiring board through each probe, and while the back surface of the guide plate and the tip or protrusion of the probe are in contact and conducting In addition, the present invention also proposes a device for measuring the electrical characteristics between terminals of a wiring board having a disconnection detecting unit for detecting the presence or absence of an electrical disconnection in a circuit from a guide plate to each of the power supplies via each probe.
According to this, it is possible to inspect the failure of the probe or the disconnection of the lead wire while replacing the wiring board to be measured, so that the measurement of the electrical characteristics between the terminals on many wiring boards can be automatically performed. Efficiently and reliably.
For the holding means, for example, a transfer arm or the like movable in a three-dimensional direction for sucking air on the surface of the wiring board without terminals is used. In addition, various measuring devices are used for the electric characteristic measuring unit and the disconnection detecting unit according to a wiring board and a measurement item, for example, a tester device. In this tester device, a voltage is successively applied to each wiring (for example, 1 pin and 2 pins, 1 pin and 3 pins, etc.) to wiring connected to each terminal (pin) via each probe. Then, insulation properties and the like are measured.
The measuring section and the detecting section can be used as a single tester device or the like.
[0013]
In addition, the tip of each probe is pressed by each terminal of the wiring board having a plurality of terminals on the surface, and the tip of the probe is retracted in the axial direction. Separate each tip of the probe or each protrusion provided in the middle of the probe from the conductor. Contacting the terminals and the tips of the probes to make them conductive, measuring the electrical characteristics between the terminals through each probe, removing the wiring board, and moving the tips of the probes in the axial direction thereof. Move forward or the above Moving the conductor, contacting each tip or each protrusion of the probe with the conductor to conduct, and confirming the electrical continuity in the circuit from the conductor to the power supply via each probe, Are alternately repeated to measure the electrical characteristics between the terminals of the wiring board, and confirm the electrical continuity on the probe side , A method for measuring electrical characteristics between terminals of a wiring board is also proposed.
As a result, the measurement of the characteristics between the terminals of the wiring board and the inspection of the disconnection of the lead wire can be performed alternately, and the quality control with high reliability is enabled. In addition, each of the above-described guide plates or a separate object can be used as the conductor.
[0014]
Embodiment
A preferred embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 shows a jig (device) 1 for measuring electrical characteristics between terminals of the present invention, and FIGS. 1A and 1B are longitudinal sectional views thereof. An acrylic resin holder 4 is horizontally installed in a side wall 2 made of an insulating material provided on four sides of a lower frame (not shown), and a horizontal brass guide plate 6 is fixed above the holder. . A plurality of probes 10 penetrate the holder 4 vertically, and are fixed at positions corresponding to the pins P, which are terminals of the wiring board W. The guide plate 6 is also provided with a plurality of guide holes 8 through which the pins P of the wiring board W can be inserted. Further, lead wires 12 extend from the lower end of each probe 10 and are connected to an electrical characteristic measuring unit and a disconnection detecting unit described later, and the lead wire 9 is also connected from the guide plate 6 to a disconnection detecting unit to be described later.
[0015]
FIG. 1C shows a cross-sectional view of the probe 10, in which the tip of a right lead wire 12 is connected to a connector 13, and the rear (right) end of a plunger 14 is slidably inserted into the left side of the connector 13. . A coil spring 17 is wound around the plunger 14, and both ends of the spring 17 are brought into contact with the step 14 a of the plunger 14 and the threading portion 19 at the center of the pipe case 18, while urging the plunger 14 to the left in the drawing. I support it. The distal end face 16 of the large-diameter distal end 15 on the left side of the plunger 14 is formed as a conical concave surface. Therefore, each plunger 14 is normally urged upward, and when the pin P is not inserted through the guide hole 8, as shown in FIG. 8 contacts the periphery. In a state where there is no such wiring board W, since each plunger 14 and the guide plate 6 are electrically connected, it is possible to inspect whether each lead wire 12 connected to the probe 10 is disconnected or whether the probe 10 itself is faulty.
[0016]
On the other hand, the wiring board W sucked by air at the lower end of the transfer arm 20 as a holding means that can move in the horizontal and vertical directions is lowered from above to approach the measuring jig 1 with its pins P facing downward, FIG. 1A shows a state in which P is inserted into each guide hole 8 of the guide plate 6 and the tip end surface 16 of each probe 10 is pressed (pressed down) by the lower end of each pin P. Since the inner diameter of each guide hole 8 is larger than the diameter of the pin P, the pin P is loosely inserted and does not come into contact with each other. In this state, the measurement of insulation originally required in the wiring board W between the pins P is performed.
That is, in the measuring jig 1, the entire guide plate 6 is made of conductive brass, and the distal end portion 15 of the probe 10 is urged to be in contact with the back surface of the guide plate 6 so as to be conductive. In addition to the original purpose of measuring insulation between pins, it is also possible to inspect the failure of the probe 10 and the presence or absence of breakage of the lead wires 12 before and after that, and to measure the insulation between the pins P without error. It is.
[0017]
FIG. 2 is a perspective view showing an arrangement relationship of a wiring board W, a guide plate 6 and a group of probes 10 fixed to the holder 4 in the measuring jig 1. The wiring board W is a pin grid array (PGA) type board, and three rows of pins P are planted in a frame shape and adjacent pins P in a grid pattern around an IC mounted in the center of the lower surface thereof. Things.
The guide plate 6 also has a plurality of guide holes 8 through which the pins P are inserted. Further, the plurality of probes 10 to which the pipe case 18 is fixed by penetrating the lower holder 4 are also fixed at the same position as the arrangement pattern of the pin P group, and the tip surfaces 16 of the tip portions 15 are directed upward. Therefore, it is opposed to the lower (tip) end of the pin P so as to be able to contact.
The reason why the distal end surface 16 is formed as a conical concave surface is that the lower end of the pin P is guided to the center of the distal end surface 16 so that the contact position is fixed and the pin P is connected to each guide hole of the guide plate 6. This is because it does not contact the inner peripheral surface 8.
[0018]
Next, the operation of the measurement jig (apparatus) 1 will be described.
FIG. 3A shows that the wiring board W is lowered together with the transfer arm 20, the pins P are inserted through the guide holes 8 of the guide plate 6, and the lower ends of the pins P are connected to the distal end surface of the distal end portion 15 of the probe 10. 16 shows a state where the plunger 14 is brought into contact with the plunger 16 and the plunger 14 is pushed down.
In this state, for example, as shown in FIG. 4A, the two pins PA and PB are connected to the electrical characteristic measuring unit 30 through the probes 10A and 10B and the leads 12A and 12B, respectively. Here, for example, a positive voltage is applied to one pin PA through the one lead wire 12A and a negative voltage is applied to the other pin PB through the other lead wire 12B from the electrical characteristic measuring unit 30 (or the pin PB is grounded). Do).
[0019]
Originally, if the wiring provided on the wiring board W connected to the two pins PA and PB is insulated, the wiring board W is normal and no current flows and the two wirings, ie, the two It can be seen that the insulation between the pins PA and PB is maintained. On the other hand, when the current flows, a short circuit has occurred between the two wirings, that is, between the two pins PA and PB, and it can be determined that the wiring board W has some problem.
As the electrical characteristic measuring section 30, various types can be used. For example, various inspection apparatuses called a printed circuit board tester, an open leak tester and the like are preferably used. In the above description, an example in which the insulation between the wirings (between the pins) is measured has been described, but it is also possible to measure the resistance value and the capacitance value between the pins.
[0020]
Next, when the wiring board W on which the insulation properties have been measured is lifted and removed together with the transfer arm 20, the plungers 14 of the respective probes 10 are urged by the springs 17 to rise, and as shown in FIG. The tip 15 contacts the periphery of the corresponding guide hole 8 on the back surface of the guide plate 6. In this state, since the guide plate 6 is a conductor made of brass, conduction between the guide plate 6 and the probes 10 and further between the probes 10 can be conducted through the guide plate 6.
In this state, as shown in FIG. 4B, the two probes 10A and 10B are connected to the disconnection detecting unit 40 through the lead wires 12A and 12B. Similarly, the guide plate 6 is connected to the detection unit 40 through the lead wire 9. Here, for example, when a negative voltage is applied to the guide plate 6 from the power supply (not shown) of the detection unit 40 through the lead wire 9 and a positive voltage is applied to the probe 10A through the lead wire 12A, contact between the guide plate 6 and the probe 10A is brought into contact. Therefore, a current flows. Similarly, even when a positive voltage is applied to the probe 10B from the power supply of the detection unit 40 through the lead wire 12B, a current flows. As a result, it has been found that there is no electrical disconnection such as disconnection of the leads PA and PB due to failure in the probes 10A and 10B and disconnection of the lead wires 12A and 12B. This confirms that the measurements were made under the right assumptions.
[0021]
In addition, in addition to the above, a positive voltage is applied to the probe 10A from the power supply of the detection unit 40 through the lead wire 12A, and a negative voltage is applied to the probe 10B through the lead wire 12B. May be.
However, if there is a break in the lead wire 12A connected to a certain probe, for example, the probe 10A, no current flows. The same applies to the case where the probe 10A fails inside and the tip 15A does not move up and down. Even if the insulation property between the pins PA and PB is measured using the probe 10A connected to the broken lead wire 12A or the failed probe 10A, the pin PA is not originally connected to the electrical characteristic measuring unit 30. Therefore, it cannot be measured whether or not the pins PA and PB in contact with the probes 10A and 10B are properly insulated in the wiring board W. Rather, even when the pins PA and PB are short-circuited, an erroneous measurement result indicating that there is insulation is obtained. Therefore, when the disconnection or the like of the lead wire 12A is detected, the fact that there is no conduction is indicated by displaying or alarming, and the measuring device 1 is immediately stopped to repair the relevant portion. In addition, the electrical characteristic measuring unit 30 and the disconnection detecting unit 40 can be used as one and the same tester device.
[0022]
As described above, according to the present measurement jig (apparatus) 1, the distal end portion 15 of each probe 10 is urged to be able to ascend. Contact the back surface of the guide plate 6 to check for failure of each probe 10 and disconnection of the lead wire 12. Further, when a new wiring board W is carried in by the transfer arm 20 and the pins P are inserted through the respective guide holes 8 of the guide plate 6 to press the distal end portions 15 of the opposing probe 10 to be lowered, the guide plate 6 The probe 10 is separated, and the insulation between the original pins P can be measured. Since the inspection such as disconnection and the measurement of the insulation are alternately and automatically performed, the measurement of the insulation between the pins P of the wiring board W can be correctly and continuously performed, and the reliability is extremely high. A measurement can be made.
[0023]
Note that the form of the measurement jig (apparatus) 1 includes the following.
As shown in FIG. 5A, the distal end surface 16 of the distal end portion 15 of the plunger 14 of the probe 10 is a spherical concave surface 16 'whose central portion is depressed downward, or as shown in FIG. As described above, it is also possible to form a concave surface 16 ″ having a tapered surface only at the peripheral edge and a central portion provided with a spherical depression having a steep slope. That is, it is preferable that the central portion of the distal end surface 16 be shaped to be lower than the others. This is because the lower (tip) end is naturally guided to the center of the front end face 16 and the pin P and the guide plate 6 are less likely to come into contact with each other.
Also, the guide plate 6 is not formed as a single body made of brass. For example, as shown in FIG. 6A, a guide hole 54 is formed at a predetermined position in the same brass plate 52 as described above, and the guide hole 54 is made of glass fiber. It is also possible to use a guide plate 50 that is attached to the lower surface of a resin plate 56 as an epoxy substrate reinforced by the above, and in which a guide hole 58 having a slightly smaller diameter than the guide hole 54 communicates with the resin plate 56.
[0024]
Alternatively, as shown in FIG. 6 (B), a ring flange 64 having a guide hole 66 is formed integrally with the brass plate 62, and this is attached to the lower surface of the resin plate 68, which is the same insulating substrate as described above. A guide plate 60 having a small-diameter ring flange 70 that penetrates from the resin plate 68 into the guide hole 66 while leaving the lower end portion thereof may be used. The brass plates 52 and 62 correspond to the conductive portions in the present invention.
According to these guide plates 50, 60, when each pin P of the wiring board W is inserted, even if it contacts the inside of the guide hole 58 of the insulating resin plates 56, 68 or the flange 70, it does not conduct without contact. , And hardly contact the conductive brass plates 52, 62. Therefore, as shown in FIG. 3 (A), each pin P can be reliably brought into contact with the distal end surface 16 of the distal end portion 15 of the probe 10 to conduct electricity.
[0025]
FIG. 7 shows a state in which the guide plate 6 is fixed in the same manner as described above, and the holder 4 to which the group of probes 10 is fixed is connected to the upper end of the piston rod 84 of the plurality of air cylinders 82 serving as moving tools at the periphery 5 thereof. A measuring jig 80 that allows the distal end portion 15 of each probe 10 to freely contact and separate from the back surface of the upper guide plate 6 by a cylinder 82 is shown. The jig 80 ensures that the guide plate 6 and each probe 10 are brought into contact with and separated from each other by driving the air cylinder 82 when the up-and-down stroke of the distal end portion 15 of the probe 10 is insufficient or the strokes are displaced from each other. it can.
[0026]
Further, FIG. 8 shows that the guide plate 6 is connected to the upper end of each piston rod 94 of the plurality of air cylinders 92 at the periphery 7 so that the guide plate 6 can be moved up and down, and the back surface of the guide plate 6 can be freely moved toward and away from each probe 10. 9 shows a measurement jig 90.
Note that, instead of the cylinders 82 and 92, for example, an elastic body such as a coil spring, a leaf spring, or a synthetic rubber body may be used. Both the jigs 80 and 90 are effective when the length of the pins P is changed depending on the type of the wiring board W.
[0027]
FIG. 9 relates to an inter-terminal electrical characteristic measuring jig 100 for inspecting insulation properties between the respective pads p of a wiring board w provided with a plurality of connection pads p as terminals on the surface.
FIG. 9A shows a vertical cross-sectional view of the measuring jig 100. The jig 100 has a holder 102 which is a rectangular probe fixing tool, and a plurality of probes 110 which are vertically penetrated and supported. And a guide plate 108 which is provided with a guide hole 108 which penetrates a tip portion 114 at the lower end of each probe 110 and which is fixed to the holder 102 at a peripheral portion 109 thereof.
A plurality of through-holes 104 are formed in the holder 102, and a pipe case 116 of the same probe 110 is fixed in each of the above-described through-holes 104. The distal end 114 of the plunger 112 of the probe 110 is supported while being urged downward in the drawing.
[0028]
Further, a space 105 is formed between the holder 102 and the guide plate 106, and a flange 118 which is a ring-shaped protrusion provided horizontally in the middle of the plunger 112 of each probe 110 is located in the space 105. At the same time, the lower surface of each flange 118 is brought into contact with the peripheral edge of the upper surface (back surface) of each guide hole 108 of the guide plate 106.
At the time of non-measurement shown in FIG. 9A, each flange 118 and the guide plate 106 are electrically connected to each other. Therefore, by connecting the lead wire 119 at the upper end of each probe 110 and the guide plate 106 to a disconnection detection unit (not shown), it is possible to inspect the failure of each probe 110 itself and the presence or absence of disconnection in each lead wire 119.
[0029]
On the other hand, as shown in FIG. 9B, while holding the holder 102 and the like on a moving tool such as a manipulator (not shown), the holder 102 and the like are lowered toward the wiring board w placed at a predetermined position on the insulating table T. The tip 114 of the plunger 112 of each probe 110 having a hemispherical shape contacts a plurality of pads p, which are terminals arranged on the upper surface of the wiring board w. The plunger 112 of each contacted probe 110 rises as shown, and its flange 118 is separated from the guide plate 106, so that the probe 110 and the guide plate 106 are disconnected. The probe 110 located outside the wiring board w comes into contact with the table T, and further lowers the holder 102 and the like as compared with the drawing, so that each flange 118 is also separated from the guide plate 106.
[0030]
In this state, a voltage is applied between the probes 110 from a not-shown electrical characteristic measuring unit via the lead wire 119. Then, it is measured whether or not the insulation between the pads p contacting each probe 110 is maintained at a predetermined value or more. That is, if there is a short circuit in the substrate w between the pads p, it is detected that a current has flowed between the probes 110 that come into contact with them. As a result, the substrate w is discharged from the line as an exclusion target. Since the table T is made of an insulating material, the table T is not electrically connected to the probe 110 located on the outer periphery of the substrate w and not in contact with the pad p, so that the above-mentioned measurement is not hindered.
[0031]
Note that, instead of the flange 118, the protruding portion protrudes laterally from the intermediate peripheral surface of the probe 110, and can be in contact with the peripheral edge on the back surface side of the guide hole 108. A projection or the like can also be used. For example, FIG. 10A shows a conical protruding portion 118a having a substantially triangular cross section, and the tapered surface of the protruding portion 118a can be brought into contact with the peripheral edge on the back surface side of the guide hole 108. FIG. 8B shows a spherical projection 118b having a substantially elliptical cross section, and the spherical surface of the projection 118b comes into contact with the peripheral edge of the guide hole 108 on the back surface side. FIG. 7C shows a case in which a projection 118c extending horizontally from the middle of the plunger 112 is provided, and the tip side of the projection 118c contacts the periphery of the back surface of the guide hole 108.
[0032]
Also, the center axis of the plunger 112 with respect to the center line of the guide hole 108 is core In order to prevent inadvertent contact with the inner peripheral surface of the guide hole 108 when it swings and is not in contact with the terminal such as the pad p, the inner peripheral surface of the guide hole 108 is made of a thin resin pipe (not shown). ), Or may be insulated by applying a resin paint.
Alternatively, as shown in FIG. 10 (D), a thin insulating layer 113 may be previously coated on the peripheral surface between the protrusion 114 such as the flange 118 of the plunger 112 and the tip 114. In any case, inadvertent contact between the plunger 112 and the guide hole 108 can be prevented, and abrasion of the plunger 112 itself can be prevented, so that its durability can be enhanced.
[0033]
Furthermore, the hemispherical tip portion 114 of the plunger 112 is easy to come into contact with a flat terminal such as a pad p or a lead, but a terminal protruding like the pin P or a spherical solder bump. Difficult to contact.
Then, as shown in FIG. 10 (E), when a tip portion 115 having a downward substantially spherical concave surface 115a similar to the above is fixed to the lower (front) end of the plunger 112, a wiring board (FIG. (Not shown) can be brought into contact with the tip of the pin P standing upright.
That is, according to the measuring jig (apparatus) 100, by selecting the tip portions 114 and 115 of the probe 110, in addition to the flat terminal such as the pad p, the protruding terminal such as the pin P can be used. It is also possible to measure electrical properties such as insulation properties, resistance values, capacitance values, inductances, impedances, etc. between terminals of a wiring board having the same. It is highly likely.
[0034]
The measuring jig 100 only needs to correspond to the position of each terminal such as the pad p of the wiring board w to be measured, and the probe 110 and the guide plate 106 through which the probe 110 penetrates may be used. The number of the guide holes 108 need not be the same as the number of the terminals, so that the electrical characteristics of the wiring boards having various terminal arrangements can be measured.
In addition, the measuring jig 100 is configured such that the holder 102, the guide plate 106, and the plurality of probes 110 are integrated as a single unit in advance and can be moved. Since each probe 110 is configured to move freely, there is also an advantage that it is easy to manufacture and the method of use is simplified.
[0035]
The present invention is not limited to the above embodiments.
The material of the guide plate may be copper, iron, steel, stainless steel, a so-called invar alloy (Fe-Ni-based low expansion alloy), aluminum, or titanium or an alloy thereof, if it is a conductor. A composite material attached to the back surface of the resin plate can also be used.
In addition, each of the holes formed in the guide plate may be a mortar-shaped tapered hole having a wider insertion side of the pin or the plunger, to facilitate the insertion of the pin or the like.
Further, the guide plate may be integrated with a holder having a plurality of probes in parallel with each other to provide a dedicated measurement jig for each wiring board. In this case, it is also possible to form a connecting portion on the peripheral edge of the holder from the resin plate adhered to the back surface of the guide plate and integrate them.
[0036]
Further, the guide plate and the holder having a plurality of probes can be used in a vertical posture or an obliquely inclined posture while being kept parallel to each other.
Further, a plurality of types of probe mounting holes of the holder can be prepared, each probe can be exchanged for the holder, and the arrangement pattern of the probes can be changed according to the arrangement pattern of the terminal group of the wiring board.
In addition, a ring-shaped rubber piece or a wire-shaped spring material can be used as the elastic body for urging the tip of the probe in addition to the coil spring.
Further, the holding means of the wiring board may be a movable air cylinder other than the transfer arm and the manipulator, and an air suction unit, a magnetic suction unit, or a gripping claw attached to the lower (tip) end of a rod or the like. It can also be used.
[0037]
【The invention's effect】
According to the jig for measuring electrical characteristics between terminals of the present invention described above, it is possible to accurately measure the insulation property between the terminals of the wiring board, and to determine whether the probe constituting the jig itself has a failure or a lead wire. The presence or absence of disconnection is always inspected before and after the measurement of insulation between the terminals, and erroneous measurement due to the defect of the measuring jig itself can be eliminated, and highly reliable measurement can be performed. And excellent quality assurance.
According to the second and fourth aspects of the invention, it is possible to alternately and reliably measure the electrical characteristics of the substrate on which the pins are implanted and inspect the disconnection of the jig.
According to the third and fifth aspects of the present invention, by selecting the tip of the probe, not only a flat shape such as a pad but also a pin-like terminal can be measured, and the position of the probe can be in contact with the terminal. Since it can be applied in a range, it can be used for various substrates.
[0038]
Further, according to the seventh, eighth and tenth aspects, even if the pin or the probe contacts the guide hole, the pin or the probe does not conduct with the guide plate, and erroneous measurement can be prevented.
According to the ninth aspect, the contact between the pin or the solder bump and the tip of the probe can be reliably performed.
Furthermore, according to the eleventh aspect of the present invention, since the probe itself urges the distal end portion or the protruding portion so as to be able to contact the guide plate, the configuration of the jig and the device can be simplified.
Further, according to the twelfth and thirteenth aspects, electrical characteristics between terminals of a large number of wiring boards can be accurately and efficiently performed, and measurement can be automated.
[Brief description of the drawings]
1 (A) and 1 (B) are longitudinal sectional views showing each use state of a measuring jig / apparatus of the present invention, and FIG. 1 (C) is a sectional view of a probe used in the present jig / apparatus.
FIG. 2 is an exploded perspective view of a measurement jig including a wiring board.
3A is a partial longitudinal sectional view showing a state of a probe and a guide plate in which a pin is inserted, and FIG. 3B is a partial longitudinal sectional view showing a state where a probe is in contact with the guide plate.
FIG. 4A is a schematic diagram including an electrical characteristic measurement unit of the present measurement device, and FIG. 4B is a schematic diagram including a disconnection inspection unit.
FIGS. 5A and 5B are partial cross-sectional views showing different types of probes.
FIGS. 6A and 6B are partial cross-sectional views showing different forms of a guide plate.
FIG. 7 is a longitudinal sectional view showing a different form of the measuring jig.
FIG. 8 is a longitudinal sectional view showing a further different form of the measuring jig.
FIGS. 9A and 9B are longitudinal cross-sectional views showing the use state of a measuring jig having different forms.
FIGS. 10A to 10E are partial cross-sectional views each showing a probe in a further different form.
FIGS. 11A and 11B are longitudinal sectional views showing a usage state of a conventional insulation inspection apparatus.
[Explanation of symbols]
1,80,90,100... Jig / apparatus for measuring electrical characteristics between pins
4,102 ……………………… Holder (probe fixture)
6, 50, 60, 106 ... guide plate (conductor)
8, 54, 58, 66, 108 ... guide holes
10,110 …………………… Probe
15, 115 ............ Tip
16, 16 ′, 16 ″, 115a...
17 ... Coil spring (spring)
20 Transfer arm (holding means)
30 Electrical characteristic measurement section
40 …………………….
52, 62 ...... Brass plate (conductive part)
56, 68 .................. Resin plate (substrate)
82, 92 Air cylinder (moving tool)
105 ………………………… Space
113 ……………………… Insulating layer
118, 118a-c ... flange, protrusion, protrusion (protrusion)
W, w ………………………… Wiring board
P …………………………… Pin (terminal)
p ………………………… Pad (terminal)

Claims

A jig for measuring electrical characteristics of a wiring board having a plurality of terminals on a surface,
A plurality of probes that are in contact with the terminal, and a guide plate having a plurality of guide holes that are in parallel with each other and abut on or penetrate the periphery,
At the time of measurement in which the probe contacts the terminal and conducts, each probe and the guide plate are disconnected,
A jig for measuring electrical characteristics between terminals of a wiring board, wherein each probe and the guide plate are electrically connected during non-measurement when the probes are separated from terminals and become non-conductive.

A guide plate having a plurality of guide holes capable of loosely penetrating each pin of the wiring board formed by implanting a plurality of pins on the front surface from the front surface to the back surface thereof, at least the back surface having conductivity,
The guide plate has a center axis substantially concentric with the center axis of each of the guide holes, and a tip portion facing the back surface of the guide plate is movable in the center axis direction, and the tip portion moves toward the back surface of the guide plate. The rear surface and the front end are urged so as to be in contact with and conductive with each other. By inserting the pin into the guide hole, the pin and the front end are brought into contact with each other to conduct, and the back surface and the front end of the guide plate are A plurality of probes which are separated from each other and become non-conductive,
The jig for measuring electrical characteristics between terminals of a wiring board according to claim 1, comprising:

For each terminal of the wiring board having a plurality of terminals on the front surface, there are a plurality of probes that can be contacted at the tip, and a plurality of guide holes through which the probes penetrate in parallel with each other. At least the back side has conductivity. Having a guide plate having
Each probe has a center axis substantially concentric with the center axis of each guide hole, and its tip is movably urged to the terminal side along the center axis, and a protrusion is provided at the middle of each probe. 2. The jig for measuring electrical characteristics between terminals of a wiring board according to claim 1, wherein the portion is configured to be able to contact and separate from the back surface of the guide plate at the periphery of the guide hole.

A guide plate having a large number of guide holes capable of loosely penetrating each pin of the wiring board formed by implanting a plurality of pins on the front surface from the front surface to the back surface thereof, at least the back surface having conductivity,
A probe fixture having a plurality of probes including a central axis substantially concentric with the central axis of each of the guide holes, and a plurality of probes including an axially movable tip end opposed to the back surface of the guide plate, fixed in parallel to each other;
A moving tool that allows one of the guide plate and the probe fixture to move to the other side, and that contacts and separates the back surface of the guide plate and the tip of each probe,
A jig for measuring electrical characteristics between terminals of a wiring board, comprising:

For each terminal of the wiring board having a plurality of terminals on the surface, a plurality of probes that can be contacted at the tip,
The probe has a plurality of guide holes penetrating in parallel with each other, a guide plate having at least a back surface having conductivity,
A probe fixture that supports the plurality of probes so as to be movable in the axial direction, and fixes the guide plate via a space,
A moving tool that can move the plurality of probes, the guide plate, and the probe fixture with respect to the wiring board,
Each probe has a center axis substantially concentric with the center axis of each guide hole, and a projection is provided in the space between the probes in the space,
When the tip of the probe comes into contact with the terminal of the wiring board, the protrusion separates from the back surface of the guide plate at the periphery of the guide hole, and when the tip of the probe separates from the terminal of the wiring board, the protrusion projects. A jig for contacting the back surface of the guide plate at the periphery of the guide hole.

The jig for measuring electrical characteristics between terminals of a wiring board according to claim 1, wherein the guide plate is formed of a conductor.

The electrical connection between terminals of the wiring board according to any one of claims 1 to 6, wherein an inner peripheral surface of each guide hole of the guide plate is formed of an insulator or is coated with an insulating layer. Characteristic measurement jig.

The jig for measuring electrical characteristics between terminals of a wiring board according to any one of claims 1 to 5, wherein the guide plate has an insulating substrate and a conductive portion provided on a back surface thereof.

The jig for measuring electrical characteristics between terminals of a wiring board according to any one of claims 2 to 8, wherein a tip surface of the tip portion of the probe is a substantially conical or substantially hemispherical concave surface.

10. The probe which penetrates the guide hole and comes into contact with and separates from the terminal, wherein an insulating layer is coated on a peripheral surface between the projection and the tip. A jig for measuring electrical characteristics between terminals of a wiring board according to the above item.

11. The wiring board according to claim 2, wherein the urging of the tip of the probe is performed by an elastic body such as a spring built in a main body of each probe. 12. A jig for measuring electrical characteristics between terminals.

A jig for measuring electrical characteristics of the wiring board according to claim 1,
Holding means for holding the wiring board movably in its thickness direction,
While each terminal and the tip of the probe are in contact and conducting, an electrical property measurement unit that measures electrical properties between terminals in the wiring board through each probe,
While the back surface of the guide plate is in contact with the tip or the protruding portion of the probe and conducting, a disconnection detection unit that detects the presence or absence of electrical disconnection in the circuit from the guide plate to each power supply through each probe. ,
A device for measuring electrical characteristics between terminals of a wiring board, comprising:

By each terminal of the wiring board having a plurality of terminals on the surface, the tip of each probe is pressed, and the tip of the probe is retreated in the axial direction to be at the tip of the probe or the middle of the probe. A step of separating each of the provided protrusions from the conductor , bringing the terminals and the tip of the probe into contact and conducting, and measuring the electrical characteristics between the terminals through each probe,
To remove the wiring board, by moving the, or the conductor is advanced each tip of the probe in the axial direction, turned by contact with the tip or the protrusion of the probe to the conductor, A step of confirming electrical continuity in a circuit from the conductor to a power supply via each probe,
Alternately measure the electrical characteristics between the terminals of the wiring board, and confirm the electrical continuity of the probe side ,
A method for measuring electrical characteristics between terminals of a wiring board.