JP2001152098A - Method for sticking fine on substrate - Google Patents

Method for sticking fine on substrate

Info

Publication number
JP2001152098A
JP2001152098A JP33624199A JP33624199A JP2001152098A JP 2001152098 A JP2001152098 A JP 2001152098A JP 33624199 A JP33624199 A JP 33624199A JP 33624199 A JP33624199 A JP 33624199A JP 2001152098 A JP2001152098 A JP 2001152098A
Authority
JP
Japan
Prior art keywords
film
substrates
substrate
continuously
interval
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP33624199A
Other languages
Japanese (ja)
Inventor
Toshihiko Takeda
俊彦 竹田
Takehiko Hayashi
武彦 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Plant Technologies Ltd
Original Assignee
Hitachi Techno Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Techno Engineering Co Ltd filed Critical Hitachi Techno Engineering Co Ltd
Priority to JP33624199A priority Critical patent/JP2001152098A/en
Publication of JP2001152098A publication Critical patent/JP2001152098A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a method for sticking a film on substrates in which substrates are continuously conveyed while treating an interval between substrates under a condition of temporarily stopping the feed of the film, a continuous sticking of the substrate to the film is carried out and the number of processed substrates per unit time is increased. SOLUTION: This method for sticking a film is to pass a plurality of sheets of substrates which are conveyed on a conveying route which maintaining a desired interval and the film which is fed from a wound roll and is applied by the treatment of an interval between substrates on parts corresponding to the interval between substrates between pressure rollers installed on the middle of the conveying route to stick the adhesive face of the film on each of the substrates. While continuously conveying a plurality of substrates on the conveying route, the feed of the film is intermittently and temporarily stopped and the treatment of an interval between substrates is performed, and after that the quantity fed of the film is stored by the rotation of a suction roller which leads to the relative displacement of suction zoned. The stored film and a plurality of substrates are continuously fed between the pressure rollers to continuously stick the film on the substrates.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、基板へのフィルム
貼付方法に係わり、特に、所望の間隔を維持して搬送路
上を搬送される複数の基板と巻回したロールから繰り出
し各基板の間隔に対応する部位に基板間処理を施したフ
ィルムとを搬送路の途中に設けられた圧着ローラ間を通
して、各基板にフィルムの粘着面を貼り付けるフィルム
貼付方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of attaching a film to a substrate, and more particularly, to a method of attaching a film to a plurality of substrates conveyed on a conveyance path while maintaining a desired interval and feeding the film from a roll wound around the substrate. The present invention relates to a film attaching method in which an adhesive surface of a film is attached to each substrate through a pressure roller provided in the middle of a transport path, with a film having a corresponding portion subjected to inter-substrate processing.

【0002】[0002]

【従来の技術】基板へのフィルム貼付方法として、所望
の間隔を維持して搬送路上を搬送される複数の基板に対
し巻回したロールからフィルムを繰り出し、カバーフィ
ルムを剥がしてから基板の寸法に合わせてフィルムを幅
方向に切断し、切断した先端や後端を基板の先端や後端
に位置合わせをして圧着する枚葉式の貼り付け方法で
は、この方法を具体化する装置が複雑でフィルムの先端
や後端に皺や気泡が発生しやすい問題がある。
2. Description of the Related Art As a method of affixing a film to a substrate, a film is fed from a roll wound around a plurality of substrates conveyed on a conveyance path while maintaining a desired interval, a cover film is peeled off, and the dimensions of the substrate are reduced. In the single-wafer bonding method, in which the film is cut in the width direction and the cut front or rear end is aligned with the front or rear end of the substrate and pressure-bonded, an apparatus for implementing this method is complicated. There is a problem that wrinkles and bubbles are easily generated at the leading and trailing ends of the film.

【0003】これに対し、繰り出したフィルムはカバー
フィルムを剥がすものの貼り付け前には切断しないで貼
り付け後にフィルムを切断する連続式フィルム貼付方法
が提案されている。
On the other hand, a continuous film sticking method has been proposed in which the unwound film is peeled off the cover film, but is not cut before sticking, but is cut after sticking.

【0004】この連続式フィルム貼付方法では、フィル
ムの粘着面が基板の長手方向(搬送方向)全体に貼り付
いてしまったり、基板間に対応するフィルムの部位が圧
着ローラに接触して圧着ローラを汚してしまう問題があ
る。そこで、基板間に対応するフィルムの部位を非粘着
面とする基板間処理を施さなければならず、この処理中
にフィルムの繰り出しを停止し、基板の搬送も停止させ
ている。
In this continuous film sticking method, the adhesive surface of the film is stuck on the entire length of the substrate (transfer direction), or the portion of the film between the substrates comes into contact with the pressure roller so that the pressure roller is pressed. There is a problem of getting dirty. Therefore, an inter-substrate process must be performed to make the portion of the film corresponding to between the substrates a non-adhesive surface. During this process, the feeding of the film is stopped and the transport of the substrate is also stopped.

【0005】[0005]

【発明が解決しようとする課題】上記した従来の連続式
のフィルム貼付方法は基板を間歇搬送するので、単位時
間当りの基板処理枚数が少なくなってしまう。
In the above-described conventional continuous film sticking method, the number of substrates processed per unit time is reduced because the substrate is intermittently transported.

【0006】それゆえ本発明の目的は、基板は連続して
搬送しつつ基板とフィルムの連続貼り付けを行うことを
可能とし、単位時間当りの基板処理枚数を多くした基板
へのフィルム貼付方法を提供することにある。
Accordingly, an object of the present invention is to provide a method for attaching a film to a substrate which enables continuous attachment of the substrate and the film while continuously transporting the substrate, and increases the number of substrates processed per unit time. To provide.

【0007】[0007]

【課題を解決するための手段】上記目的を達成する本発
明の特徴は、所望の間隔を維持して搬送路上を搬送され
る複数の基板と、巻回したロールから繰り出し各基板の
間隔に対応する部位に基板間処理を施したフィルムと
を、搬送路の途中に設けられた圧着ローラ間を通して各
基板にフィルムの粘着面を貼り付ける、基板へのフィル
ム貼付方法において、搬送路上を複数の基板が連続して
搬送される間にフィルムの繰り出しを間歇的に一時停止
させて基板間処理を施し、該基板間処理後に、吸着領域
が相対移動する吸着ローラの回転によりフィルム繰り出
し量の貯蔵を行い、該貯蔵されたフィルムと複数の基板
とを圧着ローラ間に連続供給して、基板とフィルムの連
続貼り付けをすることにある。
SUMMARY OF THE INVENTION A feature of the present invention that achieves the above object is that a plurality of substrates conveyed on a conveyance path while maintaining a desired interval and an interval between each substrate unwound from a wound roll are provided. In a method of attaching a film to a substrate, a film having been subjected to inter-substrate processing at a portion to be applied, and applying an adhesive surface of the film to each substrate through a pressure roller provided in the middle of the transport path, a plurality of substrates are transported on the transport path. While the film is continuously conveyed, the feeding of the film is intermittently temporarily stopped to perform the inter-substrate processing, and after the inter-substrate processing, the film feeding amount is stored by the rotation of the suction roller in which the suction area relatively moves. Another object of the present invention is to continuously supply the stored film and a plurality of substrates between the pressure rollers to continuously bond the substrate and the film.

【0008】本発明によれば、フィルムの繰り出しを一
時停止させ、基板間処理を施しつつ基板を連続して搬送
し、基板とフィルムの連続貼り付けをすることにより、
単位時間当りの基板処理枚数が多いフィルム貼付方法を
提供することができる。
According to the present invention, the feeding of the film is temporarily stopped, the substrate is continuously transported while performing the inter-substrate processing, and the substrate and the film are continuously attached to each other.
It is possible to provide a film sticking method in which the number of substrates processed per unit time is large.

【0009】[0009]

【発明の実施の形態】以下、図面に示した実施形態に基
いて本発明のフィルム貼付方法を説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method for attaching a film according to the present invention will be described based on an embodiment shown in the drawings.

【0010】図1は、本発明の一実施形態を説明するた
めのフィルム貼付装置を示している。
FIG. 1 shows a film sticking apparatus for explaining an embodiment of the present invention.

【0011】図1において、1はフィルム2を巻回した
フィルムロールである。このフィルム2はベースフィル
ム、粘着性を持つレジストフィルム、カバーフィルムの
三層構造になっていて、ベースフィルムが外周側でカバ
ーフィルムが内周側になるように巻回されていて、繰り
出したところで剥離ローラ3を介してカバーフィルムを
剥離してカバーフィルム巻取ローラ4に回収している。
In FIG. 1, reference numeral 1 denotes a film roll on which a film 2 is wound. The film 2 has a three-layer structure of a base film, an adhesive resist film, and a cover film. The base film is wound so that the outer peripheral side is on the outer peripheral side and the cover film is on the inner peripheral side. The cover film is peeled off via the peeling roller 3 and collected by the cover film winding roller 4.

【0012】5は基板間処理手段であり、固定ベース5
a、1対のフィルムクランパ5b及び1対のミシン目カ
ッタ5cから構成されている。各ミシン目カッタ5cの
間隔lは、後述する基板11の搬送間隔dより大きく設
定されている。各ミシン目カッタ5cは、円盤状で周縁
の歯(刃)に一定間隔毎に切欠きを有する所謂裁縫で使
用するルーレットあるいは薄い歯車状のカッタである。
Reference numeral 5 denotes an inter-substrate processing means.
a, a pair of film clampers 5b and a pair of perforated cutters 5c. The interval 1 between the perforated cutters 5c is set to be larger than the transport interval d of the substrate 11 described later. Each perforated cutter 5c is a roulette or thin gear-shaped cutter used for so-called sewing, which has a disk shape and has notches at regular intervals on peripheral teeth (blades).

【0013】ミシン目を形成するためには、フィルム2
の繰り出しを間歇的に一時停止させて、固定ベース5a
と1対のフィルムクランパ5bでフィルム2を挟んで、
各ミシン目カッタ5cをフィルム2に押しつけつつフィ
ルム2の幅方向(紙面に垂直な方向)に移動させる。こ
れにより、各ミシン目カッタ5cが回転し切欠きで途切
れた周縁の歯(刃)がフィルム2に一定間隔毎に喰い込
んでフィルム2の幅方向にミシン目が形成される。
In order to form perforations, the film 2
Is temporarily stopped intermittently, and the fixed base 5a
And the film 2 sandwiched between the pair of film clampers 5b,
Each perforated cutter 5c is moved in the width direction of the film 2 (the direction perpendicular to the paper surface) while being pressed against the film 2. As a result, the perforated cutters 5c rotate and the peripheral teeth (blades) cut off by the notches bite into the film 2 at regular intervals to form perforations in the width direction of the film 2.

【0014】このミシン目が形成された間隔lのフィル
ム2におけるレジストフィルムの幅方向に、テープ貼付
機構(図示略)によって保護テープを貼り付けて、フィ
ルム2におけるレジストフィルムの間隔lの領域が後述
する各基板11の前後各端部に貼り付かないようにす
る。これで基板間処理がなされる。
A protective tape is stuck by a tape sticking mechanism (not shown) in the width direction of the resist film on the film 2 at the interval l where the perforations are formed. So that it does not stick to each of the front and rear ends of each substrate 11 to be formed. Thus, the inter-substrate processing is performed.

【0015】6A、6Bは吸着ローラである。吸着ロー
ラ6A、6Bは、図2および図3に示す構造になってい
る。図2および図3では吸着ローラ6として説明する。
6A and 6B are suction rollers. The suction rollers 6A and 6B have a structure shown in FIGS. 2 and 3, the suction roller 6 will be described.

【0016】この吸着ローラ6は、片持ち梁状に右側端
部が固定される中空の静止軸6a、この静止軸6aの両
端にベアリング6bを介して同軸的に支持された回転筒
6c、この回転筒6cの左端部に固定した駆動軸6dを
備えている。静止軸6aは支持部材6eで直接装置の架
台Hに固定され、駆動軸6dはベアリング6fを介して
支持部材6gで架台Hに固定される。静止軸6aの中心
の延長上に駆動軸6dの中心が位置する。
The suction roller 6 has a hollow stationary shaft 6a having a right end fixed in a cantilever shape, a rotating cylinder 6c coaxially supported at both ends of the stationary shaft 6a via bearings 6b, and A drive shaft 6d fixed to the left end of the rotary cylinder 6c is provided. The stationary shaft 6a is directly fixed to the gantry H of the apparatus by a support member 6e, and the drive shaft 6d is fixed to the gantry H by a support member 6g via a bearing 6f. The center of the drive shaft 6d is located on the extension of the center of the stationary shaft 6a.

【0017】従って、駆動軸6dを回転させると回転筒
6cが静止軸6aを固定軸として図3に示すように回転
する。静止軸6aの両ベアリング6b近くに掛けての外
周には回転筒6cの内周近くまで伸びた放射状の2個の
突出部6hとその間に設けられた扇状のフランジ部6i
があって、静止軸6a、駆動軸6d、突出部6h及びフ
ランジ部6iで2個の空間Sa、Sbを区画している。
空間Saと静止軸6aの中空部を連通するように、扇状
フランジ部6i間において静止軸6aに複数の開孔6j
が穿けらている。また、回転筒6cには、静止軸6aの
扇状フランジ部6i間に相当する部位の全周において多
数の開孔6kが穿けらている。静止軸6aの中空部は右
端に図示していない真空源に接続しているパイプ7が結
合されていて吸引されているので、回転筒6cの開孔6
k、空間Sa、静止軸6aの開孔6jと中空部及びパイ
プ7を通路とする空気の流れが形成されている。一方、
空間Sbは多数の開孔6kを通して大気圧になっている
だけである。
Accordingly, when the drive shaft 6d is rotated, the rotary cylinder 6c rotates with the stationary shaft 6a as a fixed shaft as shown in FIG. On the outer periphery of the stationary shaft 6a near both bearings 6b, two radial projecting portions 6h extending to near the inner periphery of the rotary cylinder 6c and a fan-like flange portion 6i provided therebetween.
There are two spaces Sa and Sb defined by the stationary shaft 6a, the drive shaft 6d, the protrusion 6h, and the flange 6i.
A plurality of openings 6j are formed in the stationary shaft 6a between the fan-shaped flange portions 6i so as to communicate the space Sa and the hollow portion of the stationary shaft 6a.
Is pierced. The rotary cylinder 6c is provided with a large number of openings 6k all around the portion corresponding to the portion between the fan-shaped flange portions 6i of the stationary shaft 6a. The hollow portion of the stationary shaft 6a is connected to a pipe 7 connected to a vacuum source (not shown) at the right end and is sucked.
k, a space Sa, an opening 6j of the stationary shaft 6a, an air flow through the hollow portion and the pipe 7 are formed. on the other hand,
The space Sb is only at atmospheric pressure through a number of openings 6k.

【0018】この空気の流れのある回転筒6cの外周面
は回転筒6cの回転につれて相対的に周方向に移動する
ことになる。従って、空気の流れのある回転筒6cの外
周面にフィルム2が接触すると吸着されて回転に伴って
移動するが、大気圧になっている部位に至ると吸着され
なくなって、回転に伴って吸着から開放される。
The outer peripheral surface of the rotary cylinder 6c where the air flows moves relatively in the circumferential direction as the rotary cylinder 6c rotates. Therefore, when the film 2 comes into contact with the outer peripheral surface of the rotary cylinder 6c where air flows, the film 2 is attracted and moves with rotation. However, the film 2 is not attracted and reaches the part where the atmospheric pressure is reached. Be released from.

【0019】回転筒6cの外周面へのフィルム2の吸着
範囲は2個の突出部6hの放射角度、つまり空間Saの
周方向の長さで設定できる。
The range of adsorption of the film 2 to the outer peripheral surface of the rotary cylinder 6c can be set by the radiation angle of the two projections 6h, that is, the length of the space Sa in the circumferential direction.

【0020】図1に戻って、8は一点鎖線で示すように
左右に移動して基板間処理手段5と圧着ローラ10A、
10B間のフィルム2の長さを基板11の長さの整数倍
に調整する長さ調整手段である。なお、9はフィルム2
が圧着ローラ10A、10B間に円滑に配送されるよう
にするガイドローラである。基板11はローラ12で形
成された搬送路を図において左から右に搬送され、圧着
ローラ10A、10Bはその搬送路の上下に幅方向に延
在されている。圧着ローラ10Aの軸心は図示するよう
に基板11の搬送に伴って上下に僅かに移動されるが、
圧着ローラ10Bの軸心は移動しない。13、14はそ
れぞれピンチローラとニップローラである。フィルム2
のベースフィルムはニップローラ14のところで剥離さ
れ、ベースフィルム巻取ローラ15に回収する。
Returning to FIG. 1, reference numeral 8 indicates a right-and-left movement as indicated by a dashed line, and
This is a length adjusting means for adjusting the length of the film 2 between 10B to an integral multiple of the length of the substrate 11. 9 is film 2
Are guide rollers that allow smooth delivery between the pressure rollers 10A and 10B. The substrate 11 is transported from left to right in the transport path formed by the rollers 12 in the figure, and the pressure rollers 10A and 10B extend in the width direction above and below the transport path. Although the axis of the pressure roller 10A is slightly moved up and down as the substrate 11 is transported as shown in the figure,
The axis of the pressure roller 10B does not move. Reference numerals 13 and 14 denote a pinch roller and a nip roller, respectively. Film 2
Is peeled off at the nip roller 14 and collected by the base film winding roller 15.

【0021】なお、フィルムロール1、基板間処理手段
5、吸着ローラ6、圧着ローラ10等はそれぞれ電動機
により駆動されるが、これらの駆動を含めたフィルム貼
付装置の全体的な制御は、例えば、予め与えられたデー
タや基板検出センサ(図示せず)の基板端部検出情報等
に基いて、マイクロコンピュータにより構成される制御
手段(図示せず)が、所定の制御プログラムを実行する
ことによって行われる。
The film roll 1, the inter-substrate processing means 5, the suction roller 6, the pressure roller 10 and the like are each driven by an electric motor. The overall control of the film sticking apparatus including these drives is, for example, as follows. A control means (not shown) constituted by a microcomputer executes a predetermined control program on the basis of data given in advance, board edge detection information of a board detection sensor (not shown), and the like. Will be

【0022】次に、フィルムの貼付方法について説明す
る。各基板11は、所望の間隔dを維持して搬送路上を
連続して図において右方向に搬送されている。圧着ロー
ラ10Aはこの各基板11の間隔dのところで点線で示
すように上下する。つまり、先行する基板11の後端部
で上昇し、後行の基板11の先端部で下降する。その操
作は、基板検出センサの基板端部検出情報に基いて行わ
れている。
Next, a method for attaching the film will be described. Each substrate 11 is continuously transported rightward in the figure on the transport path while maintaining a desired interval d. The pressure roller 10A moves up and down at the distance d between the substrates 11 as shown by the dotted line. That is, it rises at the rear end of the preceding substrate 11 and falls at the front end of the subsequent substrate 11. The operation is performed based on the board edge detection information of the board detection sensor.

【0023】フィルム2は吸着ローラ6Aにおける回転
筒6cの回転で吸着されて左方に引っ張られてフィルム
ロール1から繰り出され、剥離ローラ3でカバーフィル
ムが剥離されレジストフィルムが露出する。基板11に
対するフィルム圧着長Lの長さ分が繰り出されると、一
旦、繰り出しを止めて基板間処理手段5で上述したよう
にミシン目の形成と保護テープの貼り付けをしてレジス
トフィルムが基板11の前後各端部に貼り付かないよう
にする。
The film 2 is sucked by the rotation of the rotary cylinder 6c of the suction roller 6A, pulled to the left and fed out from the film roll 1, the cover film is peeled off by the peeling roller 3, and the resist film is exposed. When the length of the film pressure bonding length L with respect to the substrate 11 is extended, the extension is stopped once, the perforation is formed by the inter-substrate processing means 5 and the protective tape is attached as described above, and the resist film is transferred to the substrate 11. So that it does not stick to each of the front and rear ends.

【0024】さて、フィルム2のレジストフィルムに基
板間処理を施す間は、吸着ローラ6Aにおける回転筒6
cの回転が停止される。吸着ローラ6Aが停止している
間に、吸着ローラ6Bは回転し、吸着ローラ6Bにおけ
る回転筒6cの周速度は連続して搬送されている基板1
1の搬送速度に一致しているので、各基板11に対して
フィルム2の供給は継続され、圧着ローラ10A、10
Bによるフィルム2の基板11への貼り付けが継続して
行われる。吸着ローラ6A、6Bにおける回転筒6cの
回転によるフィルム2の繰り出しや供給はベースフィル
ムを吸着して行っており、レジストフィルムの表面に非
接触であるから、レジストフィルムを汚すことはない。
While the inter-substrate processing is performed on the resist film of the film 2, the rotating cylinder 6 on the suction roller 6A is used.
The rotation of c is stopped. While the suction roller 6A is stopped, the suction roller 6B is rotated, and the peripheral speed of the rotary cylinder 6c in the suction roller 6B is changed to the speed of the substrate 1 being continuously conveyed.
1, the supply of the film 2 to each substrate 11 is continued, and the pressure rollers 10A, 10B.
The attachment of the film 2 to the substrate 11 by B is performed continuously. The feeding and supply of the film 2 by the rotation of the rotary cylinder 6c by the suction rollers 6A and 6B are performed by sucking the base film and are not in contact with the surface of the resist film, so that the resist film is not stained.

【0025】フィルム2のレジストフィルムに対する基
板間処理が終了すると吸着ローラ6Aにおける回転筒6
cの回転が再開され、その回転速度が吸着ローラ6Bの
回転速度より早くされる。従って、吸着ローラ6Aと6
B間に点線で示すように、吸着ロール6Aの高速回転中
にフィルム2がフィルム繰り出し量の貯蔵を行って吸着
ローラ6Aの停止に備えている。
When the inter-substrate processing on the resist film of the film 2 is completed, the rotating cylinder 6 in the suction roller 6A
The rotation of c is restarted, and the rotation speed is made faster than the rotation speed of the suction roller 6B. Therefore, the suction rollers 6A and 6A
As shown by the dotted line between B, during the high-speed rotation of the suction roll 6A, the film 2 stores the film feeding amount to prepare for stopping the suction roller 6A.

【0026】カバーフィルム巻取ローラ4によるカバー
フィルムの回収も、フィルム2の高速繰り出しや停止に
合わせられている。フィルム繰り出し量の貯蔵は、吸着
ローラ6Aと6Bの回転に伴うフィルム2の吸着とその
開放によって齎らされ、貼付装置は簡素なものになる。
The collection of the cover film by the cover film take-up roller 4 is also synchronized with the high-speed feeding and stopping of the film 2. The film feeding amount is stored by the suction and release of the film 2 accompanying the rotation of the suction rollers 6A and 6B, and the attaching device becomes simple.

【0027】フィルムの繰り出しを間歇的に一時停止さ
せ基板間処理を施しても、基板は連続して搬送すること
ができるので、基板の搬送が停止されない分、単位時間
当りの基板処理枚数は多いものとなる。
Even if the film feeding is intermittently temporarily stopped and the inter-substrate processing is performed, the substrates can be transported continuously. Therefore, the number of substrates processed per unit time is large because the substrate transport is not stopped. It will be.

【0028】基板間処理手段5はミシン目形成と保護テ
ープの貼り付けによるものに限定されない。例えば、間
隔lをもってレジストフィルムだけに対し幅方向に切れ
目を入れてその間のレジストフィルムだけ剥ぎ取ってし
まうとか、間隔lの幅を持つテープをレジストフィルム
上にフィルム2の幅方向に貼り付けるとか、非接着性の
塗料を吹き付けるとか、紫外線を照射してレジストフィ
ルムを劣化させるものなどの手段に代えることができ
る。
The inter-substrate processing means 5 is not limited to the method of forming perforations and attaching a protective tape. For example, a cut is made in the width direction with respect to only the resist film with an interval l, and only the resist film in between is cut off, a tape having a width of l is pasted on the resist film in the width direction of the film 2, Non-adhesive paint may be sprayed on or a means such as one that irradiates ultraviolet rays to deteriorate the resist film may be used.

【0029】吸着ローラ6Aの回転速度の設定によりフ
ィルム繰り出し貯蔵量が充分なものであれば、長さ調整
手段8は省略できる。
The length adjusting means 8 can be omitted as long as the film feeding and storing amount is sufficient by setting the rotation speed of the suction roller 6A.

【0030】吸着ローラ6Aは両持ち梁構造に支持し、
吸着ローラ6Bを吸着ローラ6Aの外周に設けても良
い。この場合はベアリング6fを省略できる他に、吸着
ローラ6Aと6Bの回転振れを僅かなものとすることが
できる。貼付装置の高さを低くするには、吸着ローラ6
Aと6Bの間隔を広く設定すれば良い。
The suction roller 6A is supported by a double-supported beam structure.
The suction roller 6B may be provided on the outer periphery of the suction roller 6A. In this case, the bearing 6f can be omitted, and the rotational runout of the suction rollers 6A and 6B can be reduced. To lower the height of the attaching device, the suction roller 6
The distance between A and 6B may be set wide.

【0031】図1の実施形態ではベースフィルムを圧着
後に連続して剥離回収しているが、基板11は直ちに次
の処理が施されるとは限らないので、剥離しないで下流
において基板間の個所でフィルム2を幅方向に切断し、
基板11に次の処理を施す時にベースフィルムを剥離し
ても良い。
In the embodiment shown in FIG. 1, the base film is continuously peeled and collected after pressure bonding. However, since the substrate 11 is not necessarily immediately subjected to the next process, the substrate 11 is not peeled off and the portion between the substrates is not separated. To cut the film 2 in the width direction,
The base film may be peeled off when the next processing is performed on the substrate 11.

【0032】またフィルムロール1、基板間処理手段5
や吸着ローラ6A、6Bなどをローラ12で形成された
基板11の搬送路の下側に配置して、基板11の上面に
レジストフィルムを貼り付けるようにしても良い。
Further, the film roll 1 and the inter-substrate processing means 5
Or, the suction rollers 6A and 6B may be arranged below the transport path of the substrate 11 formed by the rollers 12, and a resist film may be stuck on the upper surface of the substrate 11.

【0033】[0033]

【発明の効果】以上説明したように本発明によれば、フ
ィルムの繰り出しを一時停止させ基板間処理を施しつつ
単位時間当りに多くの基板を連続して搬送し、それらの
基板にフィルムを連続して貼り付けることができる。
As described above, according to the present invention, a large number of substrates are continuously transferred per unit time while the unwinding of the film is temporarily stopped and the processing between the substrates is performed, and the film is continuously transferred to those substrates. Can be pasted.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施形態を説明するためのフィルム
貼付装置の概略図である。
FIG. 1 is a schematic view of a film sticking apparatus for explaining an embodiment of the present invention.

【図2】図1に示したフィルム貼付装置で使用される吸
着ローラの縦断面図である。
FIG. 2 is a longitudinal sectional view of a suction roller used in the film sticking apparatus shown in FIG.

【図3】図2に示した吸着ローラのIII−III切断線に沿
った横断面図である。
FIG. 3 is a cross-sectional view of the suction roller shown in FIG. 2, taken along the line III-III.

【符号の説明】[Explanation of symbols]

1…フィルムロール、2…フィルム、5…基板間処理手
段、6A、6B…吸着ローラ、10A、10B…圧着ロ
ーラ、11…基板
DESCRIPTION OF SYMBOLS 1 ... Film roll, 2 ... Film, 5 ... Processing means between substrates, 6A, 6B ... Suction roller, 10A, 10B ... Crimping roller, 11 ... Substrate

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】所望の間隔を維持して搬送路上を搬送され
る複数の基板と、巻回したロールから繰り出し各基板の
間隔に対応する部位に基板間処理を施したフィルムと
を、搬送路の途中に設けられた圧着ローラ間を通して各
基板にフィルムの粘着面を貼り付ける、基板へのフィル
ム貼付方法において、 搬送路上を複数の基板が連続して搬送される間にフィル
ムの繰り出しを間歇的に一時停止させて基板間処理を施
し、 該基板間処理後に、吸着領域が相対移動する吸着ローラ
の回転によりフィルム繰り出し量の貯蔵を行い、 該貯蔵されたフィルムと複数の基板とを圧着ローラ間に
連続供給して、基板とフィルムの連続貼り付けをするこ
とを特徴とする基板へのフィルム貼付方法。
1. A transport path comprising: a plurality of substrates transported on a transport path while maintaining a desired interval; and a film unwound from a wound roll and subjected to inter-substrate processing at a portion corresponding to the interval between the substrates. In the method of attaching a film to a substrate, the adhesive surface of the film is attached to each substrate through a pressure roller provided in the middle of the method, intermittently feeding out the film while a plurality of substrates are continuously transported on a transport path. After the inter-substrate processing, the film feeding amount is stored by the rotation of the attraction roller in which the attraction area relatively moves, and the stored film and the plurality of substrates are moved between the pressure roller. A method for attaching a film to a substrate, comprising continuously supplying the film to the substrate and continuously attaching the film to the substrate.
【請求項2】請求項1に記載の基板へのフィルム貼付方
法において、前記吸着ローラは、中空の静止軸とその外
側に回転可能に軸支された回転筒を有し、静止軸と回転
筒の間の空間は静止軸から回転筒に向かって伸びた2個
の突出部で2つに区画され、該区画された一方の空間は
静止軸に穿れた開孔で連通され、該回転筒には全周に亘
って複数の開孔が穿れており、静止軸の中空部は真空源
に接続されており、 前記回転筒を回転させることにより該回転筒の外周にフ
ィルムが真空吸着されてフィルムが繰り出され、前記区
画された他方の空間に相当する個所でフィルムが前記真
空吸着から開放されるようにしたことを特徴とする基板
へのフィルム貼付方法。
2. The method according to claim 1, wherein said suction roller has a hollow stationary shaft and a rotating cylinder rotatably supported outside said stationary stationary shaft. Is divided into two by two protrusions extending from the stationary shaft toward the rotary cylinder, and one of the divided spaces is communicated with an opening formed in the stationary shaft, and Has a plurality of holes perforated over the entire circumference, the hollow portion of the stationary shaft is connected to a vacuum source, and the film is vacuum-adsorbed on the outer periphery of the rotary cylinder by rotating the rotary cylinder. Wherein the film is unwound from the vacuum at a location corresponding to the other of the divided spaces.
【請求項3】請求項1に記載の基板へのフィルム貼付方
法において、前記基板間処理は、ミシン目カッタにより
フィルムの幅方向にミシン目を形成して行うものである
ことを特徴とする基板へのフィルム貼付方法。
3. The method of attaching a film to a substrate according to claim 1, wherein the processing between the substrates is performed by forming perforations in a width direction of the film by using a perforation cutter. How to attach film to
JP33624199A 1999-11-26 1999-11-26 Method for sticking fine on substrate Pending JP2001152098A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33624199A JP2001152098A (en) 1999-11-26 1999-11-26 Method for sticking fine on substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33624199A JP2001152098A (en) 1999-11-26 1999-11-26 Method for sticking fine on substrate

Publications (1)

Publication Number Publication Date
JP2001152098A true JP2001152098A (en) 2001-06-05

Family

ID=18297105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33624199A Pending JP2001152098A (en) 1999-11-26 1999-11-26 Method for sticking fine on substrate

Country Status (1)

Country Link
JP (1) JP2001152098A (en)

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