JPH04344237A - Automatic cutting laminator - Google Patents

Automatic cutting laminator

Info

Publication number
JPH04344237A
JPH04344237A JP3145199A JP14519991A JPH04344237A JP H04344237 A JPH04344237 A JP H04344237A JP 3145199 A JP3145199 A JP 3145199A JP 14519991 A JP14519991 A JP 14519991A JP H04344237 A JPH04344237 A JP H04344237A
Authority
JP
Japan
Prior art keywords
films
photosensitive resin
film
laminator
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3145199A
Other languages
Japanese (ja)
Inventor
Masao Adachi
足立 正雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
M NIKO KK
Original Assignee
M NIKO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by M NIKO KK filed Critical M NIKO KK
Priority to JP3145199A priority Critical patent/JPH04344237A/en
Publication of JPH04344237A publication Critical patent/JPH04344237A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/22Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
    • B32B37/223One or more of the layers being plastic
    • B32B37/226Laminating sheets, panels or inserts between two continuous plastic layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards

Landscapes

  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

PURPOSE:To feed films continuously and simplify the construction of a laminator in laminating photosensitive resin films, which form resists. on a copper-clad laminating base sheet for forming a circuit pattern, CONSTITUTION:Photosensitive resin films to be fed are guided to both faces of a base sheet while being sucked onto rolling surfaces of vacuum sucking rotary rolls. At the same time, a laminator presses the films, which have been cut by cutting means in length required for laminating, against the faces of the base sheet. In this laminator, the cut films 2a, 2b are sucked to, and transferred by, the vacuum sucking rotary rolls 6a, 6b on which sucking surface parts 17 are formed in the range only from portions where the photosensitive resin films 2a, 2b to be fed are brought into contact with the roller surfaces 15A to portions where they are brought into contact with the faces of the base sheet 21, i.e., in the required range necessary for substantially sucking the films 2a, 2b. Also, the cutting means are constituted of hot wire cutters 5a, 5b.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は、レジストとなる感光性
樹脂フィルム(以下、ドライフィルムという)を回路パ
ターン形成用の銅張り積層基板(以下、基板という)に
貼り合わせるための自動カッティングラミネータに関す
る。
[Field of Industrial Application] The present invention relates to an automatic cutting laminator for laminating a photosensitive resin film (hereinafter referred to as a dry film) serving as a resist onto a copper-clad laminate board (hereinafter referred to as a substrate) for forming a circuit pattern. .

【0002】0002

【従来の技術】現在、銅張り積層基板へのレジスト塗布
方法としては、簡便さ、清潔さ、生産性の理由からドラ
イフィルムによりラミネート法が主流を占めている。こ
のラミネート法では、基板にドライフィルムを貼り合わ
せるにあたって、基板とフィルム間に気泡が巻き込まれ
ないようにすることと、しわが発生しないようにするこ
とにも最も注意が払われている。
BACKGROUND OF THE INVENTION At present, as a method for applying resist to copper-clad laminated substrates, the lamination method using dry film is the mainstream method for reasons of simplicity, cleanliness, and productivity. In this lamination method, when attaching the dry film to the substrate, the greatest care is taken to prevent air bubbles from getting caught between the substrate and the film and to prevent wrinkles from occurring.

【0003】このような対策が施された従来のラミネー
タとしては、たとえば特公昭59−46116号、特開
昭62−27148号の各公報に記載されるものなどが
知られている。特公昭59−46116号のものでは、
フィルムを一種のゲート(真空ベイル)に吸着させて、
このゲートを基板面に移動し、ゲートの真空を解除した
あとにフィルムを基板面に貼り付けるようにしている。
Conventional laminators with such measures are known, for example, those described in Japanese Patent Publication No. 59-46116 and Japanese Patent Application Laid-open No. 62-27148. In the one of Special Publication No. 59-46116,
The film is adsorbed to a kind of gate (vacuum bail),
This gate is moved to the substrate surface, and after releasing the vacuum at the gate, the film is attached to the substrate surface.

【0004】また特開昭62−27148号のものでは
、全周に亙って真空吸着面が形成されている真空ドラム
(予備圧着ロール)と、基板に近接して設けられた真空
吸引用の支持ホルダとを有し、これら真空ドラムと支持
ホルダとでフィルムを吸着保持しながら基板面にフィル
ムが貼り付けられる。
[0004] Furthermore, in Japanese Patent Application Laid-Open No. 62-27148, a vacuum drum (preliminary pressure roll) is provided with a vacuum suction surface over its entire circumference, and a vacuum drum (preliminary pressure roll) is provided close to the substrate for vacuum suction. The film is attached to the substrate surface while being attracted and held by the vacuum drum and the support holder.

【0005】なお、基板面の縁を残してフィルムを貼り
付けるいわゆる額縁ラミネートを行なうものでは、たと
えば特開昭56−49592号の公報に記載されている
ものが知られている。
[0005] For example, there is known a method for performing so-called frame lamination, in which a film is pasted leaving the edges of the substrate surface, as described in Japanese Patent Application Laid-open No. 56-49592.

【0006】[0006]

【発明が解決しようとする課題】ところで、真空吸引可
能なゲートを用いるラミネータでは、ゲートへのフィル
ムの吸引、ゲートの移動、吸引の解除、ゲートの元位置
への復帰というように、フィルムの送り動作が間欠的と
なってしまう欠点がある。また真空ドラムを用いるもの
では、このドラムの全周が吸着面となっているため、こ
の真空ドラムと本圧着ロール間に真空吸引可能な支持ホ
ルダを設ける必要があり、構成が複雑化する。またこの
ラミネータでは、フィルムの切断をロール上の回転刃に
よって行なっており、切断機構の複雑化を招いている。
[Problems to be Solved by the Invention] By the way, in a laminator that uses a gate that can be vacuum-suctioned, the film is fed by suctioning the film to the gate, moving the gate, releasing the suction, and returning the gate to its original position. The disadvantage is that the operation is intermittent. Further, in the case of using a vacuum drum, since the entire circumference of the drum is a suction surface, it is necessary to provide a support holder capable of vacuum suction between the vacuum drum and the main pressure roll, which complicates the structure. Furthermore, in this laminator, the film is cut by a rotary blade on a roll, resulting in a complicated cutting mechanism.

【0007】本発明は、このような従来の技術が持つ課
題を解決するために提案されたものであり、フィルムの
送りを連続的に行なえるとともに、装置の構成が簡単化
される自動カッティングラミネータを提供することを目
的とする。
The present invention has been proposed in order to solve the problems of the conventional technology, and provides an automatic cutting laminator that allows continuous film feeding and simplifies the configuration of the device. The purpose is to provide

【0008】[0008]

【課題を解決するための手段】この目的を達成するため
に本発明は、送り込まれる感光性樹脂フィルムを真空吸
引用回転ロールのロール面に吸着させながら基板面に導
くとともに、切断手段によって所要の貼り付け長さに切
断した感光性樹脂フィルムを基板面に圧着するラミネー
タにおいて、送り込まれる感光性樹脂フィルムがローラ
面と接触する部位から基板面に接触する部位までの範囲
、すなわち実質的にフィルムを吸着移送するのに必要な
所要範囲だけに吸着面部が形成される真空吸引用回転ロ
ールによって感光性樹脂フィルムを吸着して、この感光
性樹脂フィルムを基板面に導いて圧着することを特徴と
する。
[Means for Solving the Problems] In order to achieve this object, the present invention has a method of guiding a photosensitive resin film fed in to a substrate surface while adhering it to the roll surface of a rotary roll for vacuum suction, and cutting it into the required size by cutting means. In a laminator that pressure-bonds a photosensitive resin film cut to the attachment length onto a substrate surface, the area where the photosensitive resin film being fed is in contact with the roller surface to the area where it contacts the substrate surface, that is, the film is substantially The photosensitive resin film is adsorbed by a rotating roll for vacuum suction, in which an adsorption surface portion is formed only in the required range for adsorption and transfer, and the photosensitive resin film is guided to the substrate surface and pressure-bonded. .

【0009】また本発明は、上記切断手段が、フィルム
の幅方向に張られた熱線によって感光性樹脂フィルムを
切断する熱線切断装置により構成される。
Further, in the present invention, the cutting means is constituted by a hot wire cutting device that cuts the photosensitive resin film with a hot wire stretched in the width direction of the film.

【0010】0010

【作用】上述した請求項1に対応する構成によれば、真
空吸引用回転ロールの所要範囲だけに吸着面部が形成さ
れているので、不要な部位でフィルムが吸着されず、動
作タイミングに応じた吸引の解除などの操作が不要とな
る。したがって、連続的にフィルムを吸引移送しながら
基板にラミネートできる。
[Operation] According to the structure corresponding to claim 1 described above, since the suction surface portion is formed only in the required range of the rotary roll for vacuum suction, the film is not suctioned in unnecessary areas and Operations such as canceling suction are not required. Therefore, the film can be laminated onto the substrate while being continuously transferred by suction.

【0011】また請求項2に対応する構成によれば、熱
線切断装置によって切断手段が構成されるので、フィル
ムの切断を瞬時に行なうことができる。したがって、真
空吸引用回転ロール上に回転刃を設ける場合のように、
フィルム切断時に回転ロールの回転を一時的に停止して
フィルムを切断する必要がなく、真空吸引用回転ロール
によって連続的にフィルムを移送しながらフィルムの切
断も行なえる。
Further, according to the structure corresponding to claim 2, since the cutting means is constituted by a hot wire cutting device, the film can be cut instantly. Therefore, as in the case where a rotary blade is provided on a rotary roll for vacuum suction,
When cutting the film, there is no need to temporarily stop the rotation of the rotating roll to cut the film, and the film can be cut while being continuously transported by the vacuum suction rotating roll.

【0012】0012

【実施例】以下、本発明による自動カッティングラミネ
ータの具体的な実施例を図面に基づき詳細に説明する。 図1に、このラミネータの一実施例を示す。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments of the automatic cutting laminator according to the present invention will be described in detail below with reference to the drawings. FIG. 1 shows an embodiment of this laminator.

【0013】この図で、上側のロール1aに巻かれた感
光性樹脂フィルム(ドライフィルム)2aは、送りロー
ル3a,4aによってロール1aから引き出され、熱線
切断装置(ヒートカッタ)5aを経て、上側ラミネート
ロール6aに送り出される。また下側のロール1bから
送りロール3b,4bによって引き出されたドライフィ
ルム2bは、熱線切断装置5bを経て、下側ラミネート
ロール6bに送り出される。このときフィルム面に貼り
付けられていた保護フィルム7a,7bは、剥離ロール
8a,8bによって剥がされ、保護フィルム巻取りロー
ル9a,9bにそれぞれ巻き取られる。
In this figure, a photosensitive resin film (dry film) 2a wound around the upper roll 1a is pulled out from the roll 1a by feed rolls 3a and 4a, passed through a hot wire cutting device (heat cutter) 5a, and then cut into the upper roll 1a. It is sent out to a laminating roll 6a. Further, the dry film 2b drawn out from the lower roll 1b by the feed rolls 3b and 4b is sent out to the lower lamination roll 6b via a hot wire cutting device 5b. At this time, the protective films 7a and 7b stuck to the film surface are peeled off by peeling rolls 8a and 8b, and wound up by protective film winding rolls 9a and 9b, respectively.

【0014】熱線切断装置5a,5bは、フィルム2a
,2bの幅方向に亙って熱線10a,10bを張架する
切断部11a,11bがフィルム2a,2bの切断動作
時にシリンダ12a,12bによって駆動されてフィル
ム面方向に移動するようになっており、このとき熱線1
0a,10bがフィルム面に接触し、フィルム2a,2
bが幅方向に亙って瞬時に切断される。
The hot wire cutting devices 5a and 5b cut the film 2a.
, 2b, which extend the hot wires 10a, 10b across the width of the films 2a, 2b, are driven by cylinders 12a, 12b to move in the direction of the film surface during the cutting operation of the films 2a, 2b. , at this time hot wire 1
0a and 10b contact the film surface, and the films 2a and 2
b is instantly cut across the width direction.

【0015】真空吸引用回転ロールを構成するラミネー
トロール6a,6bは、図2に示すように固定シャフト
13の外周部に軸受14を介して回転ドラム15が間隔
を隔てて回転自在に設けられている。回転ドラム15に
は、固定シャフト13側に貫通する多数の吸引口14が
フィルム2a,2bの幅わたりに全周に亙って穿設され
ている。固定シャフト13の中心部には、外部の真空源
に接続される吸引路16が軸方向に形成されている。固
定シャフト13の外周部には、図3に示すように回転ド
ラム15の内周面に気密に摺接し、回転ドラム面15A
に形成される吸着面部17の範囲を決める2つの隔壁1
8,18が突設されている。これら隔壁18,18は、
シャフト中心に対してたとえば90°の角度で突出して
おり、隔壁18,18と回転ドラム15、固定シャフト
13間に真空室19が形成される。この真空室19とシ
ャフト13側の吸引路16は、複数の連通孔20によっ
て接続されている。これにより回転ドラム面15Aには
固定シャフト13によって定められる位置と範囲に吸着
面部17が形成され、この吸着面部17から外れたフィ
ルム2a,2bは自動的に吸着が解除されて、ドラム面
15Aから剥離される。
As shown in FIG. 2, the laminate rolls 6a and 6b constituting the vacuum suction rotary rolls include rotary drums 15 rotatably provided at a spaced interval on the outer periphery of a fixed shaft 13 via bearings 14. There is. A large number of suction ports 14 penetrating toward the fixed shaft 13 are provided in the rotating drum 15 over the entire circumference across the width of the films 2a and 2b. A suction path 16 connected to an external vacuum source is formed in the center of the fixed shaft 13 in the axial direction. As shown in FIG. 3, the outer peripheral portion of the fixed shaft 13 is in airtight sliding contact with the inner peripheral surface of the rotating drum 15, and has a rotating drum surface 15A.
Two partition walls 1 that determine the range of the suction surface portion 17 formed in
8 and 18 are provided protrudingly. These partition walls 18, 18 are
It protrudes at an angle of, for example, 90 degrees with respect to the center of the shaft, and a vacuum chamber 19 is formed between the partition walls 18, 18, the rotating drum 15, and the fixed shaft 13. This vacuum chamber 19 and the suction path 16 on the shaft 13 side are connected through a plurality of communication holes 20 . As a result, a suction surface portion 17 is formed on the rotating drum surface 15A at a position and range determined by the fixed shaft 13, and the films 2a and 2b that have come off the suction surface portion 17 are automatically released from suction and are removed from the drum surface 15A. Peeled off.

【0016】この吸着面部17は、送り込まれるドライ
フィルム2a,2bがドラム面15Aと接触する部位か
ら基板21面に接触する部位までの範囲、すなわち実質
的にフィルム2a,2bを吸着移送するのに必要な所要
範囲だけに上下のラミネートロール6a,6bにそれぞ
れ形成されており(図1参照)、これら吸着面部17,
17によってフィルム2a,2bの吸着移送が行なわれ
る。
The suction surface portion 17 is designed to cover a range from a portion where the dry films 2a and 2b that are fed in contact with the drum surface 15A to a portion where they contact the surface of the substrate 21, that is, to substantially suction and transfer the films 2a and 2b. These suction surface portions 17,
17, the films 2a and 2b are attracted and transferred.

【0017】上下のラミネートロール6a,6b間には
、送りロール22によって基板21が送り込まれ、ラミ
ネートロール6a,6b間を出た基板21は、ロール2
3a,23b間を通過して送り出される。
A substrate 21 is fed between the upper and lower lamination rolls 6a and 6b by a feed roll 22, and the substrate 21 that has passed between the lamination rolls 6a and 6b is transferred to the roll 2.
It passes between 3a and 23b and is sent out.

【0018】つぎに、このように構成される自動カッテ
ィングラミネータの動作を説明する。まず、図示しない
基板検出センサによって基板21の前端が検出されると
、フィルム2a,2bが、回転するラミネートロール6
a,6bに送り込まれ、フィルム2a,2bの先端縁が
ラミネートロール6a,6bの吸着面部17,17に吸
着される。フィルム2a,2bは吸着状態のまま、回転
するラミネートロール6a,6bによって基板21の表
裏面にそれぞれ運ばれ、上下のラミネートロール6a,
6bにより基板21の先端からやや後退した位置にフィ
ルム先端縁が熱圧着される。フィルム先端縁が基板21
の表裏に固着されたあとは、回転するドラム面15Aの
吸着面部17,17の範囲から外れ、フィルム先端縁の
吸着は自動的に解除される。以降は、回転する上下のラ
ミネートロール6a,6bによってフィルム2a,2b
が吸着されながら連続して基板面に送り込まれ、基板2
1の表裏にラミネートされていく。
Next, the operation of the automatic cutting laminator constructed as described above will be explained. First, when the front end of the substrate 21 is detected by a substrate detection sensor (not shown), the films 2a and 2b are transferred to the rotating laminating roll 6.
a, 6b, and the leading edges of the films 2a, 2b are attracted to the attraction surfaces 17, 17 of the laminating rolls 6a, 6b. The films 2a and 2b are carried to the front and back surfaces of the substrate 21 by the rotating laminating rolls 6a and 6b, respectively, while remaining in an adsorbed state, and are then moved to the upper and lower laminating rolls 6a, 6b.
6b, the leading edge of the film is thermocompression bonded to a position slightly set back from the leading end of the substrate 21. The leading edge of the film is the substrate 21
After being fixed to the front and back sides of the film, the film moves out of the range of the suction surfaces 17, 17 of the rotating drum surface 15A, and the suction of the leading edge of the film is automatically released. After that, the films 2a, 2b are separated by the rotating upper and lower laminating rolls 6a, 6b.
is continuously fed to the substrate surface while being attracted, and the substrate 2
The front and back sides of 1 are laminated.

【0019】基板検出センサによって基板21の後端が
検出されると、額縁ラミネートを行ないうる適切な位置
で上下のフィルム2a,2bが熱線切断装置5a,5b
によってそれぞれ切断される。フィルム2a,2bが基
板21の表裏面に完全に貼り付けられると、図4に示す
ように額縁状にドライフィルム2a,2bを圧着したラ
ミネート基板24が作られる。なお、上下のラミネート
ロール6a,6bの径は同一のものであってもよい。
When the rear end of the substrate 21 is detected by the substrate detection sensor, the upper and lower films 2a, 2b are cut by hot wire cutting devices 5a, 5b at appropriate positions where frame lamination can be performed.
are respectively disconnected by. When the films 2a and 2b are completely attached to the front and back surfaces of the substrate 21, a laminate substrate 24 is produced in which the dry films 2a and 2b are pressed into a picture frame shape as shown in FIG. Note that the diameters of the upper and lower laminating rolls 6a and 6b may be the same.

【0020】[0020]

【発明の効果】以上説明したように本発明によれば、フ
ィルムの吸着移送に必要な所要範囲だけに吸着面部が形
成される真空吸引用ロールを用いているので、フィルム
の送りが連続的になるとともに、従来用いていた吸引可
能な支持ホルダが不要となり、装置の構成が簡単化され
る。
[Effects of the Invention] As explained above, according to the present invention, since a vacuum suction roll is used in which the suction surface portion is formed only in the required area for suction and transfer of the film, the film can be fed continuously. At the same time, the conventionally used suctionable support holder is no longer necessary, and the configuration of the device is simplified.

【0021】また熱線切断方式を採用しているので、従
来のような回転刃による切断方式に比べ速やかな切断動
作が可能となるとともに、大幅に切断機構が簡略化され
る。
Furthermore, since the hot wire cutting method is adopted, it is possible to perform a cutting operation more quickly than the conventional cutting method using a rotary blade, and the cutting mechanism is greatly simplified.

【図面の簡単な説明】[Brief explanation of the drawing]

【図1】本発明による自動カッティングラミネータの一
実施例を示す構成図である。
FIG. 1 is a configuration diagram showing an embodiment of an automatic cutting laminator according to the present invention.

【図2】図1のラミネータに用いられるラミネートロー
ルの断面図である。
FIG. 2 is a sectional view of a laminate roll used in the laminator of FIG. 1.

【図3】図2のA−A線断面図である。FIG. 3 is a sectional view taken along line AA in FIG. 2;

【図4】ドライフィルムがラミネートされた基板の平面
図である。
FIG. 4 is a plan view of a substrate laminated with a dry film.

【符号の説明】[Explanation of symbols]

1a,1b  ロール 2a,2b  感光性樹脂フィルム 3a,3b,4a,4b  送りロール5a,5b  
熱線切断装置 6a,6b  ラミネートロール 7a,7b  保護フィルム 8a,8b  剥離ロール 9a,9b  保護フィルム巻取りロール10a,10
b  熱線 11a,11b  切断部 12a,12b  シリンダ 13  固定シャフト 15  回転ドラム 15A  ドラム面 16  吸引路 17  吸着面部 18  隔壁 19  真空室 20  連通孔 21  基板 22  送りロール 23a,23b  ロール 24  ラミネート基板
1a, 1b Rolls 2a, 2b Photosensitive resin films 3a, 3b, 4a, 4b Feeding rolls 5a, 5b
Hot wire cutting devices 6a, 6b Laminating rolls 7a, 7b Protective films 8a, 8b Peeling rolls 9a, 9b Protective film winding rolls 10a, 10
b Hot wires 11a, 11b Cutting portions 12a, 12b Cylinder 13 Fixed shaft 15 Rotating drum 15A Drum surface 16 Suction path 17 Adsorption surface portion 18 Partition wall 19 Vacuum chamber 20 Communication hole 21 Substrate 22 Feed rolls 23a, 23b Roll 24 Laminated substrate

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】  送り込まれる感光性樹脂フィルムを真
空吸引用回転ロールのロール面に吸着させながら基板面
に導くとともに、切断手段によって所要の貼り付け長さ
に切断した感光性樹脂フィルムを基板面に圧着するラミ
ネータにおいて、実質的にフィルムを吸着移送するのに
必要な所要範囲だけに吸着面部が形成される真空吸引用
回転ロールによって感光性樹脂フィルムを吸着して、こ
の感光性樹脂フィルムを基板面に導いて圧着することを
特徴とする自動カッティングラミネータ。
Claim 1: The photosensitive resin film being sent in is guided to the substrate surface while being adsorbed to the roll surface of a rotating roll for vacuum suction, and the photosensitive resin film cut to the required attachment length by a cutting means is placed on the substrate surface. In the laminator that presses the photosensitive resin film, the photosensitive resin film is adsorbed by a rotating roll for vacuum suction, which has an adsorption surface area only in the necessary area to absorb and transfer the film, and then the photosensitive resin film is attached to the substrate surface. An automatic cutting laminator that is characterized by guiding and crimping.
【請求項2】  上記切断手段が、フィルムの幅方向に
張られた熱線によって感光性樹脂フィルムを切断する熱
線切断装置により構成されることを特徴とする請求項1
記載の自動カッティングラミネータ。
2. Claim 1, wherein the cutting means is constituted by a hot wire cutting device that cuts the photosensitive resin film with a hot wire stretched in the width direction of the film.
Automatic cutting laminator as described.
JP3145199A 1991-05-22 1991-05-22 Automatic cutting laminator Pending JPH04344237A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3145199A JPH04344237A (en) 1991-05-22 1991-05-22 Automatic cutting laminator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3145199A JPH04344237A (en) 1991-05-22 1991-05-22 Automatic cutting laminator

Publications (1)

Publication Number Publication Date
JPH04344237A true JPH04344237A (en) 1992-11-30

Family

ID=15379708

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3145199A Pending JPH04344237A (en) 1991-05-22 1991-05-22 Automatic cutting laminator

Country Status (1)

Country Link
JP (1) JPH04344237A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06244538A (en) * 1993-02-03 1994-09-02 Morton Internatl Spa Method and apparatus for removing cover sheet from laminated substrate
JPH0994882A (en) * 1995-09-29 1997-04-08 Washin Kogyo Kk Laminator
JP2001076743A (en) * 1999-07-02 2001-03-23 Toyota Motor Corp Thin film laminating device
US6618939B2 (en) * 1998-02-27 2003-09-16 Kabushiki Kaisha Miyake Process for producing resonant tag
JP2006523150A (en) * 2003-03-21 2006-10-12 サン−ゴバン グラス フランス Method for arranging functional film on substrate such as glass sheet and film coating apparatus for carrying out the method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06244538A (en) * 1993-02-03 1994-09-02 Morton Internatl Spa Method and apparatus for removing cover sheet from laminated substrate
JPH0994882A (en) * 1995-09-29 1997-04-08 Washin Kogyo Kk Laminator
US6618939B2 (en) * 1998-02-27 2003-09-16 Kabushiki Kaisha Miyake Process for producing resonant tag
US7256738B2 (en) 1998-02-27 2007-08-14 Kabushiki Kaisha Miyake Resonant circuits
JP2001076743A (en) * 1999-07-02 2001-03-23 Toyota Motor Corp Thin film laminating device
JP2006523150A (en) * 2003-03-21 2006-10-12 サン−ゴバン グラス フランス Method for arranging functional film on substrate such as glass sheet and film coating apparatus for carrying out the method
JP4653074B2 (en) * 2003-03-21 2011-03-16 サン−ゴバン グラス フランス Method for arranging functional film on substrate such as glass sheet and film coating apparatus for carrying out the method

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