JPS60178160A - Film sticking and cutting device - Google Patents

Film sticking and cutting device

Info

Publication number
JPS60178160A
JPS60178160A JP3175984A JP3175984A JPS60178160A JP S60178160 A JPS60178160 A JP S60178160A JP 3175984 A JP3175984 A JP 3175984A JP 3175984 A JP3175984 A JP 3175984A JP S60178160 A JPS60178160 A JP S60178160A
Authority
JP
Japan
Prior art keywords
film
substrate
roller
point
sticking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3175984A
Other languages
Japanese (ja)
Inventor
Saburo Miyamoto
三郎 宮本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP3175984A priority Critical patent/JPS60178160A/en
Publication of JPS60178160A publication Critical patent/JPS60178160A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
    • B65H37/04Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for securing together articles or webs, e.g. by adhesive, stitching or stapling

Landscapes

  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Adhesive Tape Dispensing Devices (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE:To stick the end portion of a film to a substrate intermittently fed sheet by sheet without projecting by sticking the film to the substrate in such a manner as to begin with a little inside from the leading end thereof so that the film is ended at a portion a little before the trailing end of the substrate. CONSTITUTION:While the leading end of a film 2 drawn out from a reel 2 is positioned at the rear point (a) of a sticking roller 11, a substrate 1 is transferred by a belt 5, so that the leading end thereof is detected by a detector 31 to suitably detect the travel of the substrate 1 with a detector. When the leading end of the substrate 1 reaches between the point (a) and a contact point CL between the sticking roller 11 and a receive roller 12, a pair of take-back rollers 22 of a separator 4 are turned in a designated angle. Thus, the leading end of the film 2 is moved to the CL point, and then the substrate 1 and the film 2 are pressed by the paired rollers 11, 12 and advanced. Subsequently, when the trailing end of the substrate 1 is detected by a detector 32, only the film 2 is cut by cutting means D to completely stick the film 2 to the substrate 1.

Description

【発明の詳細な説明】 この発明は、例えば、電気回路構成用プリント基板の製
造工程中における、感光フィルムの貼着などに用いるフ
ィルムの貼着と切断とを行なう装置に関するものである
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for adhering and cutting a film used for adhering a photosensitive film, for example, during the manufacturing process of a printed circuit board for configuring an electric circuit.

このような、基板に自動的にフィルムを貼着する装置と
して、受ローラと加圧ローラの間に基板とフィルムを供
給して、基板の片面または両面にフィルムを貼着してい
くものがある。
As such a device that automatically attaches a film to a substrate, there is a device that supplies the substrate and film between a receiving roller and a pressure roller, and attaches the film to one or both sides of the substrate. .

このような従来装置の場合、フィルムを貼着したあと、
手作業でナイフなどを用いて基板の縁に沿ってフィルム
を切断するが、第9図のように基板1の縁の凹凸のため
にフィルム2の切り口2が凹凸状となり、フィルム2の
端部が基板1の縁より突出し、露光焼付時に突出したフ
イルム?の端縁の一部が剥れるなどによりトラブルの原
因となることがある。
In the case of such conventional equipment, after applying the film,
The film is manually cut along the edge of the substrate using a knife or the like, but as shown in FIG. Is the film protruding from the edge of substrate 1 and protruding during exposure and printing? This may cause problems such as part of the edges peeling off.

このような問題を解決するためには第8図のようにフィ
ルム2の周縁を基板1の周縁と一致させるか基板10周
縁より引込むようにすればよいがこのような貼着を自動
的に行なうことは極めて困難であった。
In order to solve this problem, the periphery of the film 2 should be aligned with the periphery of the substrate 1 or be retracted from the periphery of the substrate 10 as shown in Fig. 8, but such adhesion should be done automatically. was extremely difficult.

この発明は」二記のような従来、困難とされていたフィ
ルムの貼着方法を自動的に実施し得る装置を提供するも
のである。
The present invention provides an apparatus that can automatically carry out the film adhesion method described in 2 above, which has been considered difficult in the past.

すなわち、この発明はほぼ水平状態の基板を1枚づつ間
欠的に搬送する基板搬送手段と、セパレータより分離し
た粘着フィルムを、粘着層を基板側として基板近くに供
給するフィルム供給手段と、供給されたフィルムを基板
に押し付けて貼着する貼着口〜うと受ローラからなる貼
着手段とを有し、フィルム供給手段の一部にはセパレー
タ上のフィルムのみを切断スるフィルム切断手段を設け
、フィルムの先端が貼着ローラと受ローラ間に進出した
条件で、基板を貼着ローラと受ローラ間に進入させ、基
板の後端が所定検出位置を通過した条件で、前記切断手
段を働かせてフィルムを切断するように、基板搬送手段
、フィルム供給手段、貼着手段、フィルム切断手段を制
御する制御回路を設け、前記貼着手段の貼着ローラの外
周と、同ローラの中心を通る鉛直線の交叉する点CLか
ら、前記切断手段のカッタ待機位置f点までの距離と、
前記点CLから搬送手段の基板後端の検出器:32まで
の距離をほぼ等しくしたもので、この発明の装置により
、基板からフィルムがはみ出さないようなフィルムの貼
着が自動的に行なえるのである。
That is, the present invention includes a substrate transport means for intermittently transporting nearly horizontal substrates one by one, a film supply means for supplying an adhesive film separated from a separator near the substrate with the adhesive layer on the substrate side, The film supplying means includes a film cutting means for cutting only the film on the separator; The substrate is entered between the sticking roller and the receiving roller under the condition that the leading edge of the film has advanced between the sticking roller and the receiving roller, and the cutting means is operated under the condition that the rear end of the substrate has passed a predetermined detection position. A control circuit is provided to control the substrate conveyance means, film supply means, sticking means, and film cutting means so as to cut the film, and a vertical line passing through the outer periphery of the sticking roller of the sticking means and the center of the roller is provided. the distance from the intersection point CL to the cutter standby position f of the cutting means;
The distance from the point CL to the detector 32 at the rear end of the substrate of the conveying means is made almost equal, and the device of this invention can automatically attach the film so that it does not protrude from the substrate. It is.

以下、この発明の詳細を添付図面に示す一実施例に基づ
いて説明する。
Hereinafter, details of the present invention will be explained based on an embodiment shown in the accompanying drawings.

第1図のAは搬送手段で無端ベルト5を前後のブーIJ
6.71こかけたもので矢印方向に而速■で間欠駆動す
る。フィルム2は第2図に示すように粘着層3を有し、
この層3にセパレータ4が重ねである。図示例では°粘
着層3は感光性レジストであるが、このレジストは感光
しない限り、フィルム2から分離し難く、がっ、粘着i
jl:を有するから粘着フィルムとして扱える。
A in FIG. 1 is a conveying means that moves the endless belt 5 to the front and rear IJs.
6.71 times, it is driven intermittently in the direction of the arrow at a speed ■. The film 2 has an adhesive layer 3 as shown in FIG.
A separator 4 is superimposed on this layer 3. In the illustrated example, the adhesive layer 3 is a photosensitive resist, but this resist is difficult to separate from the film 2 unless it is exposed to light.
Since it has jl:, it can be treated as an adhesive film.

フィルム供給手段Bは第1図のように、ロール巻きフィ
ルムを取(;Jけるリール8と、一対の引取りローラ9
と、セパレータ4を巻取るり−ル10からなり、両り1
取りローラ9は自由回転であるが、必要に応じブレーキ
をかけられるようなjjIll造である。
The film supply means B, as shown in FIG.
and a gill 10 for winding up the separator 4, and both 1
Although the take-up roller 9 is free-rotating, it is constructed in such a way that a brake can be applied as needed.

貼着手段Cは貼着ローラ11と受「j−ラ12からなり
、この両ローラは適宜の駆動手段により矢印方向に而速
■で駆動されている。また、貼着ローラ11は図示省略
しである昇降軸受により支承され1、この軸受を適宜の
駆動手段により昇降させることにより所定の時期に上昇
および下降する。
The pasting means C consists of a pasting roller 11 and a roller 12, both of which are driven by appropriate driving means in the direction of the arrow at a speed of 2. The pasting roller 11 is not shown. It is supported by an elevating bearing 1, and is raised and lowered at predetermined times by raising and lowering this bearing by an appropriate driving means.

13はセパレータ分離台で、先端が鋭角となり、後部の
軸14を支点として揺動するが、その揺動は適宜の駆動
手段によって所定の時期に行なわれる。また、分離台1
3の、後部は円弧状としてこの部分の上部に自由回転の
ローラ15を接触させる。
Reference numeral 13 denotes a separator separating table, which has an acute angle at its tip and swings about a rear shaft 14 as a fulcrum, and the swinging is performed at a predetermined time by an appropriate driving means. In addition, separation table 1
No. 3, the rear part is shaped like an arc, and a freely rotating roller 15 is brought into contact with the upper part of this part.

フィルム切断手段りは第1図のように、カッタ19を固
定したカンタローラ20とこのローラ20に対向する受
ローラ21とで構成され、適宜の駆動手段によりローラ
20を間欠駆動し、ローラ21は自由回転である。また
、ローラ20.21間の間隙を適当昏こ調整して、カッ
タ19がフィルム2と粘着層3のみを切断し、セパレー
タ4は切断しないようにする。
As shown in FIG. 1, the film cutting means is composed of a canter roller 20 to which a cutter 19 is fixed and a receiving roller 21 facing this roller 20. The roller 20 is intermittently driven by an appropriate driving means, and the roller 21 is driven freely. It is rotation. Further, the gap between the rollers 20 and 21 is appropriately adjusted so that the cutter 19 cuts only the film 2 and the adhesive layer 3, but does not cut the separator 4.

第1図の22はセパレータ4の引取り用の一対のローラ
で通常は自由回転であるが、必要なときのみ、電磁クラ
ッチζこよって駆動軸と結合し、回速Vで矢印方向に駆
動される。
Reference numeral 22 in FIG. 1 denotes a pair of rollers for taking up the separator 4, which normally rotate freely, but only when necessary are connected to the drive shaft by an electromagnetic clutch ζ and driven in the direction of the arrow at rotational speed V. Ru.

23.24はフィルム貼着後の基板1を挾んで搬送する
搬送用のローラであって而速Vで矢印方向に駆動されて
いる。
23 and 24 are conveyance rollers that pinch and convey the substrate 1 after the film has been pasted, and are driven at a speed V in the direction of the arrow.

25は中空の吸着器で、上昇位置の分離台13の表面に
沿って進退し得るが、その下面は第1図のように多孔板
となり、吸着器25内を真空ポンプなどの真空源をこ0
工撓ホースにより連結し、電磁弁などの制御Gこより吸
着器25内を所定の時期に真空吸引する。
Reference numeral 25 denotes a hollow adsorber that can move forward and backward along the surface of the separation table 13 in the raised position, but its lower surface is a perforated plate as shown in Fig. 1, and a vacuum source such as a vacuum pump is not allowed to run inside the adsorber 25. 0
The suction device 25 is connected by a flexible hose, and the interior of the adsorption device 25 is vacuum-suctioned at a predetermined time by a control G such as a solenoid valve.

Eは気流発生手段で、第1図に示すような複数のノズル
26からなっている。このノズル26は送気管274こ
設けたもので、これらのノズル26は受ローラ12の」
1方に向いている。また、基板搬送手段Aの前部と後部
よりには光電式などの任意方式の検出器31.32を設
け2るが、この検出器31.32は基板1の先端と後端
を検出するものである。また、基板1の後端を1.1!
出する検出器32と、貼着ローラ11の外周と、このロ
ーラ11の中心を通る鉛直線の交叉する点CLまでの距
離と、同じ<CL点からカッタ19の待機位置f点まで
の距離はほぼ等しくしておく。すなわち、CL点から、
フイルノ、切断位置e点に至る距離Gこ、さらにカッタ
19の待機位置の点fまでの距離を加えたフィルムの長
さにほぼ等しい、CL点からの距離に検出器32を設け
る。
Reference numeral E denotes an airflow generating means, which consists of a plurality of nozzles 26 as shown in FIG. This nozzle 26 is provided with 274 air supply pipes, and these nozzles 26 are connected to the receiving roller 12.
facing one direction. Furthermore, detectors 31 and 32 of any type such as photoelectric type are provided at the front and rear parts of the substrate transport means A, and these detectors 31 and 32 detect the front and rear ends of the substrate 1. It is. Also, the rear end of the board 1 is 1.1!
The distance from the output detector 32 to the point CL where the vertical line passing through the center of the roller 11 intersects the outer periphery of the sticking roller 11 is the same.<The distance from the point CL to the standby position f of the cutter 19 is Keep them almost equal. That is, from the CL point,
The detector 32 is provided at a distance from the point CL that is approximately equal to the length of the film, which is the sum of the distance G to the cutting position e and the distance to the standby position f of the cutter 19.

第10図は制御手段のブロック図でTTL。FIG. 10 is a block diagram of the control means TTL.

ICXLSIなどで構成した制御回路30を設け、前記
検出器31.32を始め、搬送手段Aのベルト移動量の
検出用のパルスジエイ・レークまたはタイマーなどの検
出器33、貼着ローラ11の圧着開始などを検出する検
出器34、ローラ9の回転量を検出する検出器35、吸
着器25の位置を検出する検出器36などの入力機器を
インターフェース37を介して制御回路30の入力ボー
トに接続する。
A control circuit 30 composed of ICXLSI or the like is provided, and includes the detectors 31 and 32, a detector 33 such as a pulse-ray rake or a timer for detecting the amount of belt movement of the conveyance means A, and the start of crimping of the pasting roller 11. Input devices such as a detector 34 for detecting the amount of rotation of the roller 9, a detector 35 for detecting the rotation amount of the roller 9, and a detector 36 for detecting the position of the suction unit 25 are connected to the input port of the control circuit 30 via an interface 37.

また、前記搬送手段Aの駆動手段41、貼着ローラ11
の駆動手段42、および昇降手段51、引取りローラ9
のブレーキ駆動手段43、分離台13の駆動手段44、
カッタローラ20の駆動手段45、セパレータ引取り用
のローラ22の駆動手段46および電磁クラッチ49、
吸着器25の電磁弁47や進退手段50、気流発生手段
Eの電磁弁48などの出力機器はインターフェース52
を介して制御回路30の出力ポートに接続する。
Further, the driving means 41 of the conveying means A, the sticking roller 11
driving means 42, elevating means 51, and take-up roller 9
brake drive means 43, drive means 44 for the separation table 13,
A drive means 45 for the cutter roller 20, a drive means 46 for the separator take-up roller 22, and an electromagnetic clutch 49;
Output devices such as the solenoid valve 47 of the adsorber 25, the advancing/retracting means 50, and the solenoid valve 48 of the airflow generating means E are connected to the interface 52.
It is connected to the output port of the control circuit 30 via.

つぎにその作用を説明する。Next, its effect will be explained.

第1図は準備状態を示し、駆動手段42によりすでに回
転している貼着ローラ11は圧着位11c(、すなわち
下降位置にあり、フィルム2の先′端は貼着ローラ11
の下部後寄りの点aにある。
FIG. 1 shows the preparation state, in which the adhesive roller 11, which has already been rotated by the drive means 42, is in the pressing position 11c (i.e., in the lowered position, and the tip of the film 2 is in the adhesive roller 11c).
It is located at point a near the bottom of .

このとき、ノズル26からは圧縮空気をa点に向は噴射
してフィルム2の先端の垂れ下りを防止している。
At this time, compressed air is injected from the nozzle 26 toward point a to prevent the tip of the film 2 from drooping.

この状態で駆動手段41により搬送手段Aが駆動され基
板1がベルト5上に載って進行し、その先端が検出器3
1により検出されるとその信号が11j御回路30に送
られ、制御回路30により検出器33が起動され、基板
1の移動量の検出がはじまる。検出器33により検出し
ている移動量があらかじめ設定した値に達したとき、基
板1の先端が第3図のようにa点より若干前のd点に達
するようにしである。d点に達すると検出器33からの
信号により駆動手段−46が起動1、フィルム2を分離
したのちのセパレータ4を挾んで圧着している両ローラ
22が設定された角度だけ回転して停止し、セパレータ
4を第3図矢印方向へ移動させる。この移動量は、貼着
ローラ11の外周と、ローラ11の中心を通る鉛直線の
交叉する点CLからa点までのローラ11の外周の距離
と同じにしであるから、剥離台13の鋭角の先端で剥離
しつつ進行したフィルム2の先端はa点からCL点に移
動するが、搬送手段Aで搬送されている基板1の先端も
同じようにCL点に達するから、フィルム2の先端は第
4図のように基板1の先端と等しい位置か、または基板
1の先端より僅かに後方に接着し、基板1とフィルム2
とはローラ11により圧着されながら進行する。
In this state, the conveying means A is driven by the driving means 41, and the substrate 1 is placed on the belt 5 and advances, and the tip of the substrate 1 is placed on the belt 5.
1, the signal is sent to the 11j control circuit 30, the control circuit 30 activates the detector 33, and starts detecting the amount of movement of the substrate 1. When the amount of movement detected by the detector 33 reaches a preset value, the tip of the substrate 1 is designed to reach point d, which is slightly ahead of point a, as shown in FIG. When the point d is reached, the driving means 46 is activated by a signal from the detector 33, and after separating the film 2, the rollers 22 which sandwich and press the separator 4 are rotated by a set angle and then stopped. , move the separator 4 in the direction of the arrow in FIG. This amount of movement is the same as the distance between the outer periphery of the sticking roller 11 and the outer periphery of the roller 11 from the point CL where the vertical line passing through the center of the roller 11 intersects to the point a. The leading edge of the film 2, which has progressed while peeling off at the leading edge, moves from point a to point CL, but since the leading edge of the substrate 1 being transported by transport means A also reaches the CL point, the leading edge of the film 2 moves from point a to point CL. 4 As shown in the figure, glue the substrate 1 and film 2 at the same position as the tip of the substrate 1 or slightly behind the tip of the substrate 1.
and progresses while being pressed together by rollers 11.

上記のようにフィルム2の先端の基板1への圧着が開始
された時点で電磁弁48が閉しノズル26からの圧縮空
気の吹ぎ出しは中止される。
As described above, when the tip of the film 2 starts to be crimped onto the substrate 1, the solenoid valve 48 closes and the blowing of compressed air from the nozzle 26 is stopped.

こうしてローラ11.12が基板1とフィルム2を挾み
込んで回速Vで進行し、フィルム2を基板1上に連続的
に貼り合せていく。この間引取りローラ9は自由回転、
セパレータ引取りp−ラ22も自由回転であるから、リ
ー/l/8からフィルム2がセパレータ4ととも※こ引
出され、リール8の外周Gこ巻かれたフィルム2と一体
のセパレータ4に接しているリール\10の外周のゼバ
レータ4に、分離後のセパレータ4が巻取られる。
In this way, the rollers 11 and 12 sandwich the substrate 1 and the film 2 and move at a rotational speed V, thereby continuously pasting the film 2 onto the substrate 1. During this time, the take-up roller 9 rotates freely.
Since the separator take-up p-ra 22 also rotates freely, the film 2 is pulled out together with the separator 4 from Lee/l/8, and comes in contact with the separator 4, which is integrated with the film 2 wound around the outer circumference of the reel 8. The separated separator 4 is wound around the zebrator 4 on the outer periphery of the reel \10.

士、記のように、ローラ11.12.23.24で挾ま
れて進行する基板1の後端を、検出器32が検出すると
、フィルム切断手段Cの駆動手段45が起動して、カッ
タローラ20が回り、そのカッタ19がローラ21」二
のフィルム2を粘着層3とともGこ切断して1回転し、
カッタ19の刃先がf点となったとぎ停止する。しかし
、セパレータ4は切らないから、フィルム2はセパレー
タ4と一体となって移動する。
As shown in FIG. 20 rotates, and the cutter 19 cuts the film 2 on the roller 21'' along with the adhesive layer 3, making one rotation.
When the cutting edge of the cutter 19 reaches point f, the cutting stops. However, since the separator 4 is not cut, the film 2 moves together with the separator 4.

ら検出器32までの長さを等しくするか、またはフィル
ム2の方を僅かに短かくしておくことにより、基板1」
二に貼着されるフィルム2の後端は基板1の後端と一致
するか僅かに前となる。
By making the length from the substrate 1 to the detector 32 equal, or by making the film 2 slightly shorter,
The rear end of the film 2 attached to the substrate 1 is aligned with or slightly in front of the rear end of the substrate 1.

こうして、フィルム2の切断個所gが、吸着器25の先
端部すの0点に達したとき、駆動手段44が作動して、
分離台13が下方へ若干回動する。このため、切断個所
gより前のフィルム2の後端部がセパレータの支持を失
ない、基板1上に落下するさい、落下角度が浅くなるの
で気泡や皺の発生が防止できる。
In this way, when the cutting point g of the film 2 reaches the zero point at the tip of the suction device 25, the driving means 44 is activated.
The separation table 13 rotates slightly downward. Therefore, when the rear end of the film 2 before the cutting point g does not lose support of the separator and falls onto the substrate 1, the falling angle becomes shallow, thereby preventing the generation of bubbles and wrinkles.

また、切断位置gが分離台13の先端部す点に達したと
きブレーキの駆動手段43が作動して両ローラ9にブレ
ーキをかけ、セパレータ4の引取りローラ22のクラッ
チ49が切れるので、フィルム2およびセパレータ4の
進行が止まるから、セパレータ4は停止し、切断位置g
より前のフィルム2だけが移動していくのである。
Furthermore, when the cutting position g reaches the tip of the separating table 13, the brake driving means 43 is activated to apply brakes to both rollers 9, and the clutch 49 of the separator 4 take-up roller 22 is disengaged, so that the film is not cut off. 2 and the separator 4 stop advancing, the separator 4 stops and reaches the cutting position g.
Only the earlier film 2 moves.

フィルム2を貼着した基板1の後端がCL点を通過する
と、昇降手段51の作動で貼着F −ラ11が第6図の
ように上昇し、駆動手段44により分離台13も元に戻
り、ついで電磁弁47が開き吸着器25が吸着を始め、
フィルム2を吸着する。
When the rear end of the substrate 1 to which the film 2 is pasted passes the CL point, the sticking F-ra 11 is raised by the operation of the lifting means 51 as shown in FIG. Then, the solenoid valve 47 opens and the adsorption device 25 starts adsorption.
Adsorb film 2.

ついで、クラッチ49が入り、両駆動手段46で回転し
ている両ローラ22がa点からb点までの長さに相当す
る角度回転すると同峙に5進退手段50により吸着器2
5も面速度Vで前進し、第6図のようにフィルム2の先
)111を貼着ローラ11の下方に進出させる。フィル
ム2の先端がa点に達すると同時に電磁弁48が開き、
ノズル26からの空気の吹き出しが始まり、ついで電磁
弁47が閉じ吸着器25によるフィルム2の吸着を停止
して吸着器25からフィルム2を離し、進退手段50に
より第7図のように吸着器25のみを元の位置へ戻す。
Next, the clutch 49 is engaged, and when both rollers 22 rotated by both drive means 46 rotate through an angle corresponding to the length from point a to point b, the suction device 2 is
5 also moves forward at a surface speed V, causing the tip 111 of the film 2 to advance below the sticking roller 11 as shown in FIG. At the same time as the leading edge of the film 2 reaches point a, the solenoid valve 48 opens.
Air starts blowing out from the nozzle 26, and then the electromagnetic valve 47 closes to stop the adsorption of the film 2 by the adsorption device 25 and release the film 2 from the adsorption device 25. Return the chisel to its original position.

吸着器25が元の位置に戻ると同時に昇降手段51の働
きで貼着ローラ11が下降し、第1図の最初の状態とな
る。
At the same time as the suction device 25 returns to its original position, the sticking roller 11 is lowered by the action of the elevating means 51, resulting in the initial state shown in FIG.

なお、粘着層3と一体のフィルム2の腰が強い場合、セ
パレータ4を引取りローラ22により引取るだけで、セ
パレータ4から分離したフィルム2の先端は貼着ローラ
11の下方へ直進するので、前記の吸着器25などは不
用である。
Note that if the film 2 integrated with the adhesive layer 3 is strong, the tip of the film 2 separated from the separator 4 will go straight below the sticking roller 11 by simply picking up the separator 4 with the picking roller 22. The adsorber 25 and the like described above are unnecessary.

また、図示例は基板1の片面にフィルム2を貼着する場
合を示したが、図示例と同様の機構を下部に設ければ基
板1の両面にフィルム2を貼着することができる。この
ときは受ローラ12のかわりに下方の貼着ローラが位置
する。
Further, although the illustrated example shows the case where the film 2 is attached to one side of the substrate 1, the film 2 can be attached to both sides of the substrate 1 by providing a mechanism similar to the illustrated example at the bottom. At this time, the lower sticking roller is positioned instead of the receiving roller 12.

この発明の切断装置は」1記のようにほぼ水平状態で1
枚づつ間欠的に送り込まれてくる基板にフィルムの端部
を貼着するさい、フィルムを基板前端またはそれより僅
かに内側から貼り始め、基板の後端またはそれより僅か
に前寄りの部分でフィルムが終るようQこしたものであ
るから、フィルムのI+]を基板のrljより狭くして
両側においてもフィルムの側縁が基板の両側と等しくな
るかそれより僅かに内方へ入るようにしておくことによ
って基板の周縁よりフィルムがはみ出さない状態のフィ
ルムの貼着が全自動的に行なわれる。また、この発明の
場合、フィルムの切断は、基板へ貼着する前のセパレー
クと重なっている間に行なわれる点に大きな特徴がある
。すなわち、フィルムを基板の後端上で切断する方式で
はフィルムを切断する場合、カッタの刃が基板を疵つけ
る」3それがあり、それを防ぐためカッタの切込みを浅
くすると、フィルムの切断が不確実となるが、この発明
の場合はそのようなおそれは全くなく、フィルムはセパ
レータ上で切断するのでフィルムの15J I:liが
確実に行なわれるという効果がある。
The cutting device of this invention can be
When attaching the edge of the film to the substrate that is being fed intermittently one by one, start attaching the film from the front edge of the substrate or slightly inside it, and place the film at the rear edge of the substrate or slightly in front of it. Since the film's I+] is narrower than the substrate's rlj, the side edges of the film on both sides should be equal to or slightly inward from both sides of the substrate. This allows the film to be attached completely automatically without protruding from the periphery of the substrate. Further, the present invention is characterized in that the film is cut while the film overlaps the separator before it is attached to the substrate. In other words, in the method of cutting the film on the rear edge of the substrate, when cutting the film, the cutter blade scratches the substrate.''3 To prevent this, making the cut of the cutter shallow makes it easier to cut the film. However, in the case of the present invention, there is no such fear at all, and since the film is cut on the separator, there is an effect that the 15J I:li of the film is reliably carried out.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明のフィルム貼着り断装置の側面図、第
2図は同」−の一部切欠拡大側面図、第3図ないし第7
図は要部の作動を示す工程別側面図、第8図はこの発明
装置によりフィルムを貼着された基板の斜視図、第9図
は従来の装置直により片面にフィルムを貼着された基板
の斜視図、第10図は制御手段の一例を示すブロック図
である。 A・・・搬送手段、B・・・フィルム供給手段、C・・
・貼着手段、D フィルム切断手段、E・・・気流発生
手段、1・・・基板、2・・・フィルム、3・・・粘着
層、4・・・セパレータ、11・・・貼着ローラ、12
・・・受ローラ、19・・・カッタ、20・・・カンタ
ローラ特許出願人 日東電気工業株式会社 同代理人 鎌 1) 文 二
Fig. 1 is a side view of the film adhesion/cutting device of the present invention, Fig. 2 is a partially cutaway enlarged side view of the same, and Figs. 3 to 7.
The figure is a side view of each process showing the operation of the main parts, Figure 8 is a perspective view of a board with a film pasted by the device of this invention, and Figure 9 is a board with a film pasted on one side by a conventional device. FIG. 10 is a block diagram showing an example of the control means. A...Transportation means, B...Film supply means, C...
- Adhering means, D Film cutting means, E... Airflow generation means, 1... Substrate, 2... Film, 3... Adhesive layer, 4... Separator, 11... Adhesive roller , 12
...Receiving roller, 19...Cutter, 20...Canter roller Patent applicant Nitto Electric Industry Co., Ltd. Agent Sickle 1) Text 2

Claims (1)

【特許請求の範囲】[Claims] はぼ水平状態の基板を1枚づつ間欠的に搬送する基板搬
送手段と、セパレータより分離した粘着フィルムを、粘
着層を基板側にして基板近くに供給するフィルム供給手
段と、供給されたフィルムを基板に押しイ」けて貼着す
る貼着ローラと、受ローラからなる貼着手段とを有し、
フィルム供給手段の一部にはセパレーターにのフィルム
のみを切断するフィルム切断手段を設け、フィルムの先
端が貼着ローラと受ローラ間に進出した条件で、基板を
貼着ローラと受ローラ間に進入させ、基板の後端が所定
検出位置を通過した条件で、前記切断手段を働かせてフ
ィルムを切断するように、基板搬送手段、フィルム供給
手段、貼着手段、フィルム切断手段を制御する制御回路
を設け、前記貼着手段の貼着ローラの外周と、同ローラ
の中心を通る鉛直線の交叉する点CLから、前記切断手
段のカッタ待機位置のf点までの距離と、前記点CLか
ら搬送手段の基板後端の検出盤32までの距離をほぼ等
しくしたことを特徴とするフィルム貼着切断装置。
A substrate transport means for intermittently transporting nearly horizontal substrates one by one, a film supply means for supplying an adhesive film separated from a separator near the substrate with the adhesive layer facing the substrate, and a film supply means for transporting the supplied film. It has an adhesion roller that presses onto the substrate and adheres it, and an adhesion means consisting of a receiving roller,
A part of the film supply means is provided with a film cutting means that cuts only the film on the separator, and the substrate is inserted between the sticking roller and the receiving roller under the condition that the leading edge of the film advances between the sticking roller and the receiving roller. and a control circuit for controlling the substrate conveying means, the film supplying means, the adhering means, and the film cutting means so as to operate the cutting means to cut the film under the condition that the rear end of the substrate passes a predetermined detection position. a distance from a point CL where the outer periphery of the sticking roller of the sticking means intersects with a vertical line passing through the center of the roller to a point f of the cutter standby position of the cutting means; and a distance from the point CL to the conveying means. A film adhering and cutting device characterized in that the distances from the rear end of the substrate to the detection plate 32 are approximately equal.
JP3175984A 1984-02-20 1984-02-20 Film sticking and cutting device Pending JPS60178160A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3175984A JPS60178160A (en) 1984-02-20 1984-02-20 Film sticking and cutting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3175984A JPS60178160A (en) 1984-02-20 1984-02-20 Film sticking and cutting device

Publications (1)

Publication Number Publication Date
JPS60178160A true JPS60178160A (en) 1985-09-12

Family

ID=12339953

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3175984A Pending JPS60178160A (en) 1984-02-20 1984-02-20 Film sticking and cutting device

Country Status (1)

Country Link
JP (1) JPS60178160A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63225065A (en) * 1987-03-11 1988-09-20 Fuji Photo Film Co Ltd Working device using both-side adhesive tape
JP2008007600A (en) * 2006-06-28 2008-01-17 Nitto Denko Corp Apparatus for attaching adhesive tape
JP2008063059A (en) * 2006-09-06 2008-03-21 Sun Tec:Kk Pressure sensitive adhesive sheet sticking apparatus
CN107651483A (en) * 2017-11-16 2018-02-02 中山市电赢科技有限公司 Two-in-one adhesive tape presses guillotine
CN110436249A (en) * 2019-07-29 2019-11-12 安徽润象新材料科技有限公司 A kind of the panel broadening equipment and its technique of wide cut composite plate
CN112078874A (en) * 2020-09-02 2020-12-15 饶明明 Packing apparatus is used in production of electric motorcycle car accessory

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63225065A (en) * 1987-03-11 1988-09-20 Fuji Photo Film Co Ltd Working device using both-side adhesive tape
JP2008007600A (en) * 2006-06-28 2008-01-17 Nitto Denko Corp Apparatus for attaching adhesive tape
JP2008063059A (en) * 2006-09-06 2008-03-21 Sun Tec:Kk Pressure sensitive adhesive sheet sticking apparatus
CN107651483A (en) * 2017-11-16 2018-02-02 中山市电赢科技有限公司 Two-in-one adhesive tape presses guillotine
CN110436249A (en) * 2019-07-29 2019-11-12 安徽润象新材料科技有限公司 A kind of the panel broadening equipment and its technique of wide cut composite plate
CN110436249B (en) * 2019-07-29 2021-01-26 安徽润象新材料科技有限公司 Panel widening equipment and process for wide composite board
CN112078874A (en) * 2020-09-02 2020-12-15 饶明明 Packing apparatus is used in production of electric motorcycle car accessory
CN112078874B (en) * 2020-09-02 2021-10-01 饶明明 Packing apparatus is used in production of electric motorcycle car accessory

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