JP2001138518A - サーマルインクジェット用大型ノズルアレイを備えたプリントヘッド - Google Patents
サーマルインクジェット用大型ノズルアレイを備えたプリントヘッドInfo
- Publication number
- JP2001138518A JP2001138518A JP2000314950A JP2000314950A JP2001138518A JP 2001138518 A JP2001138518 A JP 2001138518A JP 2000314950 A JP2000314950 A JP 2000314950A JP 2000314950 A JP2000314950 A JP 2000314950A JP 2001138518 A JP2001138518 A JP 2001138518A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- ink
- printhead
- resistor
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007639 printing Methods 0.000 title abstract description 35
- 239000000758 substrate Substances 0.000 claims abstract description 147
- 238000007641 inkjet printing Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 42
- 238000000034 method Methods 0.000 abstract description 30
- 238000004519 manufacturing process Methods 0.000 abstract description 20
- 230000003071 parasitic effect Effects 0.000 abstract description 7
- 239000012528 membrane Substances 0.000 abstract 1
- 239000000976 ink Substances 0.000 description 147
- 239000010410 layer Substances 0.000 description 95
- 230000004888 barrier function Effects 0.000 description 38
- 239000010409 thin film Substances 0.000 description 38
- 238000010304 firing Methods 0.000 description 31
- 238000002161 passivation Methods 0.000 description 18
- 230000008569 process Effects 0.000 description 14
- 239000004020 conductor Substances 0.000 description 13
- 239000000919 ceramic Substances 0.000 description 10
- 238000003491 array Methods 0.000 description 9
- 238000012546 transfer Methods 0.000 description 9
- 238000005530 etching Methods 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 230000008878 coupling Effects 0.000 description 7
- 238000010168 coupling process Methods 0.000 description 7
- 238000005859 coupling reaction Methods 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 238000000059 patterning Methods 0.000 description 6
- RVSGESPTHDDNTH-UHFFFAOYSA-N alumane;tantalum Chemical group [AlH3].[Ta] RVSGESPTHDDNTH-UHFFFAOYSA-N 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- 229910010271 silicon carbide Inorganic materials 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 239000002178 crystalline material Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical group [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910004490 TaAl Inorganic materials 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/04546—Multiplexing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/0458—Control methods or devices therefor, e.g. driver circuits, control circuits controlling heads based on heating elements forming bubbles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/14129—Layer structure
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/420,141 US6582062B1 (en) | 1999-10-18 | 1999-10-18 | Large thermal ink jet nozzle array printhead |
| US09/420141 | 1999-10-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001138518A true JP2001138518A (ja) | 2001-05-22 |
| JP2001138518A5 JP2001138518A5 (enExample) | 2005-07-07 |
Family
ID=23665252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000314950A Pending JP2001138518A (ja) | 1999-10-18 | 2000-10-16 | サーマルインクジェット用大型ノズルアレイを備えたプリントヘッド |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US6582062B1 (enExample) |
| EP (1) | EP1093920B1 (enExample) |
| JP (1) | JP2001138518A (enExample) |
| DE (1) | DE60042002D1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007525344A (ja) * | 2004-02-27 | 2007-09-06 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー. | フィードバック回路を備えた流体吐出デバイス |
| JP2010173279A (ja) * | 2009-01-31 | 2010-08-12 | Brother Ind Ltd | ドライバicの配線構造および液滴吐出装置 |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6582062B1 (en) * | 1999-10-18 | 2003-06-24 | Hewlett-Packard Development Company, L.P. | Large thermal ink jet nozzle array printhead |
| US6922203B2 (en) * | 2001-06-06 | 2005-07-26 | Hewlett-Packard Development Company, L.P. | Barrier/orifice design for improved printhead performance |
| US7384113B2 (en) * | 2004-04-19 | 2008-06-10 | Hewlett-Packard Development Company, L.P. | Fluid ejection device with address generator |
| US7296871B2 (en) * | 2004-12-29 | 2007-11-20 | Lexmark International, Inc. | Device and structure arrangements for integrated circuits and methods for analyzing the same |
| JP4618789B2 (ja) * | 2005-03-24 | 2011-01-26 | キヤノン株式会社 | インクジェット記録装置およびインクジェット記録方法 |
| US20060221140A1 (en) * | 2005-04-01 | 2006-10-05 | Lexmark International, Inc. | Low profile printhead |
| KR100711263B1 (ko) * | 2005-09-24 | 2007-04-25 | 삼성전자주식회사 | 화상형성장치 및 그 제어방법 |
| US7784916B2 (en) * | 2006-09-28 | 2010-08-31 | Lexmark International, Inc. | Micro-fluid ejection heads with multiple glass layers |
| US8061811B2 (en) * | 2006-09-28 | 2011-11-22 | Lexmark International, Inc. | Micro-fluid ejection heads with chips in pockets |
| US7677701B2 (en) * | 2006-09-28 | 2010-03-16 | Lexmark International, Inc. | Micro-fluid ejection head with embedded chip on non-conventional substrate |
| US7635179B2 (en) * | 2006-10-05 | 2009-12-22 | Eastman Kodak Company | Array printhead with three terminal switching elements |
| US20080122896A1 (en) * | 2006-11-03 | 2008-05-29 | Stephenson Iii Stanley W | Inkjet printhead with backside power return conductor |
| US7959261B2 (en) * | 2007-05-08 | 2011-06-14 | Lexmark International, Inc. | Micro-fluid ejection devices having reduced input/output addressable heaters |
| US20090002422A1 (en) * | 2007-06-29 | 2009-01-01 | Stephenson Iii Stanley W | Structure for monolithic thermal inkjet array |
| US20090079774A1 (en) * | 2007-09-24 | 2009-03-26 | Stephenson Iii Stanley W | Motion compensation for monolithic inkjet head |
| US7901057B2 (en) * | 2008-04-10 | 2011-03-08 | Eastman Kodak Company | Thermal inkjet printhead on a metallic substrate |
| US8622524B2 (en) | 2010-05-27 | 2014-01-07 | Funai Electric Co., Ltd. | Laminate constructs for micro-fluid ejection devices |
| ES2955508T3 (es) | 2019-02-06 | 2023-12-04 | Hewlett Packard Development Co | Troquel para un cabezal de impresión |
| ES2904246T3 (es) * | 2019-02-06 | 2022-04-04 | Hewlett Packard Development Co | Troquel de un cabezal de impresión |
| WO2020162909A1 (en) | 2019-02-06 | 2020-08-13 | Hewlett-Packard Development Company, L.P. | Die for a printhead |
| KR102621225B1 (ko) | 2019-02-06 | 2024-01-04 | 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. | 인쇄헤드용 다이 |
| MX2021009109A (es) | 2019-02-06 | 2021-09-14 | Hewlett Packard Development Co | Matriz para un cabezal de impresion. |
| TW202136064A (zh) | 2020-02-24 | 2021-10-01 | 瑞士商西克帕控股有限公司 | 熱噴墨印刷頭及印刷組件及包含其之印刷設備 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55132291A (en) | 1979-04-02 | 1980-10-14 | Canon Inc | Recording device |
| US4490728A (en) | 1981-08-14 | 1984-12-25 | Hewlett-Packard Company | Thermal ink jet printer |
| US4500895A (en) | 1983-05-02 | 1985-02-19 | Hewlett-Packard Company | Disposable ink jet head |
| US4862197A (en) | 1986-08-28 | 1989-08-29 | Hewlett-Packard Co. | Process for manufacturing thermal ink jet printhead and integrated circuit (IC) structures produced thereby |
| US4809428A (en) | 1987-12-10 | 1989-03-07 | Hewlett-Packard Company | Thin film device for an ink jet printhead and process for the manufacturing same |
| US5016023A (en) * | 1989-10-06 | 1991-05-14 | Hewlett-Packard Company | Large expandable array thermal ink jet pen and method of manufacturing same |
| US5030971B1 (en) | 1989-11-29 | 2000-11-28 | Xerox Corp | Precisely aligned mono- or multi-color roofshooter type printhead |
| US5274401A (en) * | 1990-04-27 | 1993-12-28 | Synergy Computer Graphics Corporation | Electrostatic printhead |
| US5469199A (en) * | 1990-08-16 | 1995-11-21 | Hewlett-Packard Company | Wide inkjet printhead |
| US5568171A (en) | 1992-04-02 | 1996-10-22 | Hewlett-Packard Company | Compact inkjet substrate with a minimal number of circuit interconnects located at the end thereof |
| EP0661162B1 (en) * | 1993-12-28 | 2000-07-12 | Canon Kabushiki Kaisha | Substrate for ink-jet head, ink-jet head, and ink-jet apparatus |
| SG44309A1 (en) * | 1994-03-04 | 1997-12-19 | Canon Kk | An ink jet recording apparatus |
| JP3268937B2 (ja) | 1994-04-14 | 2002-03-25 | キヤノン株式会社 | インクジェット記録ヘッド用基板及びそれを用いたヘッド |
| WO1996009170A1 (en) * | 1994-09-23 | 1996-03-28 | Dataproducts Corporation | Apparatus for printing with ink jet chambers utilizing a plurality of orifices |
| US5665249A (en) * | 1994-10-17 | 1997-09-09 | Xerox Corporation | Micro-electromechanical die module with planarized thick film layer |
| US5689296A (en) * | 1995-11-02 | 1997-11-18 | Pitney Bowes Inc. | Digital printing apparatus |
| US6180018B1 (en) * | 1996-04-12 | 2001-01-30 | Canon Kabushiki Kaisha | Ink jet printing head, manufacturing method therefor, and ink jet printing apparatus |
| US6183067B1 (en) * | 1997-01-21 | 2001-02-06 | Agilent Technologies | Inkjet printhead and fabrication method for integrating an actuator and firing chamber |
| JP3957851B2 (ja) | 1997-12-26 | 2007-08-15 | キヤノン株式会社 | 液体吐出方法 |
| US6331048B1 (en) * | 1998-08-19 | 2001-12-18 | Canon Kabushiki Kaisha | Inkjet printhead having multiple ink supply holes |
| US6309052B1 (en) * | 1999-04-30 | 2001-10-30 | Hewlett-Packard Company | High thermal efficiency ink jet printhead |
| US6582062B1 (en) * | 1999-10-18 | 2003-06-24 | Hewlett-Packard Development Company, L.P. | Large thermal ink jet nozzle array printhead |
-
1999
- 1999-10-18 US US09/420,141 patent/US6582062B1/en not_active Expired - Lifetime
-
2000
- 2000-10-03 EP EP00308671A patent/EP1093920B1/en not_active Expired - Lifetime
- 2000-10-03 DE DE60042002T patent/DE60042002D1/de not_active Expired - Lifetime
- 2000-10-16 JP JP2000314950A patent/JP2001138518A/ja active Pending
-
2003
- 2003-05-16 US US10/439,403 patent/US6921156B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007525344A (ja) * | 2004-02-27 | 2007-09-06 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー. | フィードバック回路を備えた流体吐出デバイス |
| US7604312B2 (en) | 2004-02-27 | 2009-10-20 | Hewlett-Packard Development Company, L.P. | Fluid ejection device with feedback circuit |
| JP2010173279A (ja) * | 2009-01-31 | 2010-08-12 | Brother Ind Ltd | ドライバicの配線構造および液滴吐出装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1093920A3 (en) | 2002-02-20 |
| US6921156B2 (en) | 2005-07-26 |
| DE60042002D1 (de) | 2009-05-28 |
| EP1093920A2 (en) | 2001-04-25 |
| US20030184618A1 (en) | 2003-10-02 |
| US6582062B1 (en) | 2003-06-24 |
| EP1093920B1 (en) | 2009-04-15 |
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