JP2001135213A - 保護素子 - Google Patents
保護素子Info
- Publication number
- JP2001135213A JP2001135213A JP30935999A JP30935999A JP2001135213A JP 2001135213 A JP2001135213 A JP 2001135213A JP 30935999 A JP30935999 A JP 30935999A JP 30935999 A JP30935999 A JP 30935999A JP 2001135213 A JP2001135213 A JP 2001135213A
- Authority
- JP
- Japan
- Prior art keywords
- protection element
- insulating
- insulating substrate
- fusible alloy
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 claims abstract description 80
- 230000004907 flux Effects 0.000 claims abstract description 46
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 6
- 239000000956 alloy Substances 0.000 claims abstract description 6
- 229910000743 fusible alloy Inorganic materials 0.000 claims description 103
- 230000001681 protective effect Effects 0.000 claims description 17
- 238000002844 melting Methods 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 10
- 239000003566 sealing material Substances 0.000 claims description 6
- 239000011810 insulating material Substances 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000000565 sealant Substances 0.000 abstract 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 13
- 229910052744 lithium Inorganic materials 0.000 description 13
- 239000000155 melt Substances 0.000 description 9
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 238000007789 sealing Methods 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000002241 glass-ceramic Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 4
- 230000002265 prevention Effects 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 238000007664 blowing Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Fuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30935999A JP2001135213A (ja) | 1999-10-29 | 1999-10-29 | 保護素子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30935999A JP2001135213A (ja) | 1999-10-29 | 1999-10-29 | 保護素子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001135213A true JP2001135213A (ja) | 2001-05-18 |
| JP2001135213A5 JP2001135213A5 (enExample) | 2006-11-30 |
Family
ID=17992060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30935999A Withdrawn JP2001135213A (ja) | 1999-10-29 | 1999-10-29 | 保護素子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001135213A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010045056A (ja) * | 2009-11-25 | 2010-02-25 | Sony Chemical & Information Device Corp | 保護素子 |
| JP2010192453A (ja) * | 2010-04-12 | 2010-09-02 | Sony Chemical & Information Device Corp | 保護素子 |
| CN114335923A (zh) * | 2020-09-29 | 2022-04-12 | Sk新技术株式会社 | 接线端子保护盖及包括该接线端子保护盖的电池模块 |
-
1999
- 1999-10-29 JP JP30935999A patent/JP2001135213A/ja not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010045056A (ja) * | 2009-11-25 | 2010-02-25 | Sony Chemical & Information Device Corp | 保護素子 |
| JP2010192453A (ja) * | 2010-04-12 | 2010-09-02 | Sony Chemical & Information Device Corp | 保護素子 |
| CN114335923A (zh) * | 2020-09-29 | 2022-04-12 | Sk新技术株式会社 | 接线端子保护盖及包括该接线端子保护盖的电池模块 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100461321C (zh) | 保护元件 | |
| JP5301298B2 (ja) | 保護素子 | |
| EP1041597B1 (en) | Protective device | |
| JP4110967B2 (ja) | 保護素子 | |
| JP5130232B2 (ja) | 保護素子 | |
| US20110211284A1 (en) | Protective element and method for producing the same | |
| CN100566024C (zh) | 导电端子的焊接方法及导电端子结构 | |
| JP2000306477A (ja) | 保護素子 | |
| CN100458982C (zh) | 电路保护装置 | |
| JP2001325869A (ja) | 保護素子 | |
| JP2004214033A (ja) | 保護素子 | |
| WO2004070758A1 (ja) | 保護素子 | |
| JP2000285777A (ja) | 保護素子 | |
| CA1212989A (en) | Surge voltage arrester having an external short- circuit path | |
| JP4663758B2 (ja) | 抵抗付き温度ヒューズ及び電池保護回路板 | |
| JP4301474B2 (ja) | 保護素子 | |
| JP2001135213A (ja) | 保護素子 | |
| JPH0719075Y2 (ja) | 基板型温度ヒューズ | |
| JP4263543B2 (ja) | 保護素子 | |
| JP4112297B2 (ja) | サーモプロテクター及びサーモプロテクターの製造方法 | |
| JP2003022798A (ja) | リンクヒューズ | |
| JP2001067998A (ja) | 保護素子およびその製造方法 | |
| JP3866366B2 (ja) | 回路保護素子の製造方法 | |
| JP2000200529A (ja) | 保護素子およびその製造方法 | |
| JP4267332B2 (ja) | 保護素子 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20061016 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20061016 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20080603 |