JP2001133970A - Photosensitive transfer film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a photosensitive transfer film for a plasma display panel capable of forming a pattern through at least transfer, exposure, development and baking steps, capable of easily forming a pattern having high dimensional accuracy and excellent in adhesion to a substrate. SOLUTION: The photosensitive transfer film has a photosensitive transfer layer containing (A) inorganic particles, (B) an alkali-soluble resin, (C) a compound containing an ethylenically unsaturated group and (D) a photopolymerization initiator and having 5-30 μm thickness.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photosensitive transfer film which can be suitably used for forming a pattern having high dimensional accuracy, and more particularly, to an electrode, a fluorescent material, and a fluorescent material constituting each display cell of a plasma display panel. body,
The present invention relates to a photosensitive transfer film that can be suitably used for forming a pattern with high dimensional accuracy in forming a color filter and a black matrix.

[0002]

2. Description of the Related Art In recent years, a plasma display has attracted attention as a flat fluorescent display. FIG. 1 shows an AC type plasma display panel (hereinafter also referred to as “PDP”).
It is a schematic diagram which shows the cross-sectional shape of. In FIG. 1, reference numerals 1 and 2 denote glass substrates arranged opposite to each other, and reference numeral 3 denotes a partition. A cell is defined by the glass substrate 1, the glass substrate 2, and the partition 3. 4 is a transparent electrode fixed on the glass substrate 1, 5 is a bus electrode formed on the transparent electrode for the purpose of reducing the resistance of the transparent electrode, 6 is an address electrode fixed on the glass substrate 2, and 7 is a cell electrode. The retained phosphor, 8 is a dielectric layer formed on the surface of the glass substrate 1 so as to cover the transparent electrode 4 and the bus electrode 5, and 9 is formed on the surface of the glass substrate 2 so as to cover the address electrode 6. Dielectric layer,
Reference numeral 10 denotes a protective film made of, for example, magnesium oxide.
In a direct current type PDP, a resistor is usually provided between an electrode terminal (anode terminal) and an electrode lead (anode lead). Further, in order to improve the contrast of the PDP, a color filter of red, green, and blue, or a black matrix having a stripe shape or a lattice shape is provided between the glass substrate 1 and the dielectric layer 8 or the dielectric material. It may be provided between the layer 8 and the protective film 10. The above PD
The pattern height of the P electrode, the phosphor, the color filter, and the black matrix is preferably as low as possible without impairing the performance of each. As the pattern height increases, the flatness of the dielectric layer and the protective film covering the electrodes, the color filter, and the black matrix deteriorates, and this may appear as luminance unevenness of the PDP. Further, in the case of the phosphor, the discharge space is reduced due to the increase in the pattern height, and the luminance may be reduced.

[0003] As a method for producing such PDP electrodes, phosphors, color filters and black matrices, (1) a non-photosensitive paste containing inorganic particles is screen-printed on a substrate to obtain a pattern, which is then fired. (2) A screen is printed with a photosensitive inorganic particle-containing paste to form a film on a substrate, and the film is irradiated with ultraviolet rays through a photomask and developed to form a pattern on the substrate. There is known a photosensitive paste method in which the ink is left and baked.

[0004]

However, in the screen printing method, the demand for the positional accuracy of the pattern becomes very severe with the increase in the size and definition of the panel.
There is a problem that normal printing cannot cope. Also,
In the photosensitive paste method, although the positional accuracy of the pattern is excellent, when a film is formed on a substrate by screen printing, a variation in film thickness or a film defect is likely to occur due to paste properties or printing conditions, and a pattern having high dimensional accuracy is required. There is a problem that it is difficult to control the process for obtaining the same.

The present invention has been made based on the above circumstances. A first object of the present invention is to provide a photosensitive transfer film capable of forming a pattern through at least steps of transfer, exposure, development, and baking. A second object of the present invention is to provide a photosensitive transfer film that can easily form a pattern with high dimensional accuracy. A third object of the present invention is to provide a photosensitive transfer film having excellent adhesion to a substrate.

[0006]

Means for Solving the Problems The photosensitive transfer film of the present invention (hereinafter, also referred to as "photosensitive transfer film of the present invention" or "transfer film of the present invention") comprises (A) inorganic particles, (B) A photosensitive transfer layer containing an alkali-soluble resin, (C) an ethylenically unsaturated group-containing compound and (D) a photopolymerization initiator, and having a film thickness of 5 to 30 μm. Further, the photosensitive transfer film of the present invention,
When the firing treatment is performed at 600 ° C., the mass loss is 20
It is preferable to have a photosensitive transfer layer of from about 80% by mass to 80% by mass. Further, the transfer film of the present invention preferably has (A) a photosensitive transfer layer having an inorganic particle content of 20 to 80% by mass. The photosensitive transfer film of the present invention comprises a PD
It is suitably used for forming at least one member selected from a P electrode, a phosphor, a color filter and a black matrix.

[0007]

The details of the photosensitive transfer film of the present invention will be described below. Photosensitive transfer film The photosensitive transfer film of the present invention comprises (A) inorganic particles,
It is essential to have a photosensitive transfer layer containing (B) an alkali-soluble resin, (C) an ethylenically unsaturated group-containing compound, and (D) a photopolymerization initiator, and having a thickness of 5 to 30 μm. Further, the photosensitive transfer film of the present invention includes a support film and a photosensitive transfer layer formed thereon, and a protective film may be provided on a surface of the photosensitive transfer layer.

<Support Film and Protective Film> The support film constituting the photosensitive transfer film of the present invention is preferably a resin film having heat resistance, solvent resistance and flexibility. Since the support film has flexibility, the photosensitive transfer layer can be formed by applying the paste-like composition by a roll coater, and the photosensitive transfer layer is stored in a roll shape and stored. Can be supplied. As the resin forming the support film, for example, polyethylene terephthalate,
Examples thereof include fluorine-containing resins such as polyester, polyethylene, polypropylene, polystyrene, polyimide, polyvinyl alcohol, and polyfluoroethylene, nylon, and cellulose. The thickness of the support film is, for example, 20 to 100 μm. It is preferable that the surface of the support film is subjected to a release treatment. This makes it possible to easily perform the operation of peeling the support film in the pattern forming step described later. In addition, about a protective film, the same thing as a support film can be used. The surface of the protective film is usually subjected to a release treatment, and the peel strength between the protective film and the photosensitive transfer layer needs to be smaller than the peel strength between the support film and the photosensitive transfer layer.

<Photosensitive Transfer Layer> The photosensitive transfer layer constituting the photosensitive transfer film of the present invention usually comprises (A) inorganic particles, (B) an alkali-soluble resin, and (C) a compound containing an ethylenically unsaturated group. , (D) a photopolymerization initiator, (E) a solvent and, if necessary, (F) various additives, a paste-form photosensitive composition is coated on a support film, and the coating film is dried to form a solvent. Can be formed by removing part or all of

Applying the photosensitive composition onto a support film,
The method for obtaining the photosensitive transfer layer is preferably a method capable of efficiently forming a large (for example, 1 μm or more) coating film having excellent uniformity of the film thickness. Coating method using a coater, coating method using a blade coater, coating method using a slit coater,
Preferred examples include a coating method using a curtain coater, a coating method using a wire coater, and the like. The drying conditions of the coating film are as follows.
The drying time is about 5 to 30 minutes, and the residual ratio of the solvent after drying (content in the photosensitive transfer layer) is usually 2% by mass or less. The thickness of the photosensitive transfer layer formed on the support film as described above is 5 to 30 μm, preferably 8 to 25 μm, and more preferably 10 to 20 μm.
m.

In the photosensitive transfer film of the present invention, 6
The mass loss when the photosensitive transfer layer is baked at 00 ° C. is preferably 20 to 80% by mass. By setting the mass loss in the baking step of the photosensitive transfer layer to 20 to 80% by mass, it is possible to obtain a photosensitive transfer film that is more excellent in adhesion to a substrate and that can form a pattern with high dimensional accuracy. it can. The mass loss is more preferably from 25 to 75% by mass, and particularly preferably from 30 to 70% by mass.

The content of the inorganic particles (A) in the photosensitive transfer layer is preferably 20 to 80% by mass, more preferably 25 to 75% by mass, based on the entire photosensitive transfer layer in the transfer film. Particularly preferably, 30 to 70% by mass.
It is. By having such a photosensitive transfer layer,
A photosensitive transfer film having excellent adhesion to a substrate and capable of forming a pattern with high dimensional accuracy can be obtained.

<Photosensitive composition> The photosensitive composition used for forming the photosensitive transfer layer constituting the photosensitive transfer film of the present invention comprises (A) inorganic particles, (B) an alkali-soluble resin, C) a compound containing an ethylenically unsaturated group,
It is prepared by kneading (D) a photopolymerization initiator, (E) a solvent and, if necessary, (F) various additives using a kneader such as a roll kneader, a mixer, a homomixer, a ball mill, a bead mill, or the like. be able to. The photosensitive composition prepared as described above is a paste-like composition having fluidity suitable for coating, and has a viscosity of usually 100 to 100,000 cp, preferably 500 cp.
〜１０10,000 cp. Hereinafter, each component constituting the photosensitive composition will be described.

(A) Inorganic particles The inorganic particles used in the photosensitive composition may be of the type
Depends on PDP, LCD, organic EL element, pre
Circuit board, multilayer circuit board, multi-chip module
And inorganic particles used for electrode forming materials such as LSI
Ag, Au, Al, Ni, Ag-Pd alloy,
Cu, Cr, etc. can be mentioned. Among these
Also conductive due to oxidation even when fired in air
It is preferable to use relatively inexpensive Ag without causing a decrease in
New As the shape of inorganic particles used in electrode forming materials
Is not particularly limited, such as granular, spherical, flake, etc.
Or use a mixture of two or more types of inorganic particles
You can also. Further, as the average particle size, preferably
0.01 to 10 μm, more preferably 0.05 to 5 μm
Inorganic particles having different average particle sizes are mixed and used.
Can also be used. PDP, LCD, organic EL device
As inorganic particles used for any transparent electrode forming material,
Indium oxide, tin oxide, tin-containing indium oxide (IT
O), antimony-containing tin oxide (ATO), fluorinated acid
Indium oxide (FIO), fluorinated tin oxide (FT)
O), fluorinated zinc oxide (FZO), and A
1, one selected from Co, Fe, In, Sn and Ti
Zinc oxide fine particles containing one or more metals
And so on. Used for PDP phosphor forming material
The inorganic particles used are Y for red._Two O_Three : E
u³⁺, Y_Two SiO_Five : Eu³⁺, Y_Three Al_Five O₁₂: E
u³⁺, YVO_Four : Eu³⁺, (Y, Gd) BO_Three : E
u³⁺, Zn_Three (PO_Four )_Two : For green color such as Mn
Zn_Two SiO_Four : Mn, BaAl₁₂O₁₉: Mn, BaM
gAl₁₄O_{twenty three}: Mn, LaPO_Four : (Ce, Tb), Y
_Three (Al, Ga)_Five O₁₂: Y for blue color such as Tb
_Two SiO_Five : Ce, BaMgAl_TenO₁₇: Eu²⁺, Ba
MgAl₁₄O_{twenty three}: Eu²⁺, (Ca, Sr, Ba)_Ten(P
O_Four )₆ Cl_Two : Eu²⁺, (Zn, Cd) S: Ag, etc.
Can be mentioned. PDP, LCD, organic EL device
Inorganic particles used in color filter forming materials such as
Is Fe for red_Two O_Three C for green
r_Two O_Three CoO / Al for blue_Two O_Three Such
Can be mentioned. PDP, LCD, organic EL device
Black stripe (matrix) forming material
As the inorganic particles used, for example, Co, Cr, C
metals such as u, Fe, Mn, Ni, Ti, Zn
Oxides, composite oxides, carbides, nitrides, sulfides, silicon
, Boride, carbon black, graphite, etc.
Singly or in combination of two or more
Can be used. Among these, preferred inorganic particles
Co, Cr, Cu, Fe, Mn, Ni and Ti
Particles, metal oxide particles and composites selected from the group
Oxide particles. In addition, the average particle size is good.
Preferably 0.01 to 10 μm, more preferably 0.05
To 5 μm, particularly preferably 0.1 to 2 μm.
You. In addition, electrode, phosphor, color filter, black
Inorganic particles are used for forming the stripe (matrix)
May be used together with a low melting point glass frit. Low melting point
Glass frit compositions include, for example, lead oxide, oxide
Boron, silicon oxide (PbO-B_TwoO_Three-SiO
_TwoSystem), lead oxide, boron oxide, silicon oxide, aluminum oxide
Minium (PbO-B_TwoO_Three-SiO_Two-Al_TwoO
_ThreeSystem), zinc oxide, boron oxide, silicon oxide system (Zn
OB_TwoO_Three-SiO_TwoSystem), zinc oxide, boron oxide,
Silicon oxide, aluminum oxide (ZnO-B_TwoO_Three-S
iO_Two-Al_TwoO_ThreeSystem), lead oxide, zinc oxide, borane oxide
Element, silicon oxide (PbO-ZnO-B_TwoO _Three-SiO_Two
System), lead oxide, zinc oxide, boron oxide, silicon oxide
Element, aluminum oxide (PbO-ZnO-B_TwoO_Three-S
iO_Two-Al_TwoO_ThreeSystem), bismuth oxide, boron oxide,
Silicon oxide (Bi_TwoO_Three-B_TwoO_Three-SiO_TwoSystem), acid
Bismuth oxide, boron oxide, silicon oxide, aluminum oxide
System (Bi_TwoO_Three-B_TwoO_Three-SiO _Two-Al_TwoO_ThreeSystem),
Bismuth oxide, zinc oxide, boron oxide, silicon oxide
(Bi_TwoO_Three-ZnO-B_TwoO_Three-SiO_TwoSystem), oxide
Smuth, zinc oxide, boron oxide, silicon oxide, aluminum oxide
Minium (Bi_TwoO_Three-ZnO-B_TwoO_Three-SiO_Two-A
l_TwoO_ThreeSystem) and the like. These low melting points
Among glass frit, lead-free glass due to environmental problems
It is preferable to use a frit, and the aging of the photosensitive composition
Lead-free glass based on bismuth oxide from the viewpoint of stability
It is particularly preferred to use a frit. Above low melting point
The softening point of lath frit is usually 650 ° C or less.
Preferably, it is 400 to 600 ° C. Also,
The shape of the low melting glass frit is not particularly limited,
The average particle size is preferably 0.1 to 10 μm, more preferably
Preferably it is 0.5-5 μm. Above low melting point glass
Lits may be used alone or with different glass frit compositions,
Low melting point with different softening point, different shape, different average particle size
Use a combination of two or more point glass frit
Can be. Low melting glass frit content in this case
Depends on the application, but includes low melting glass frit
Usually, 70 parts by mass relative to 100 parts by mass of the inorganic particles
Or less, preferably 50 parts by mass or less, more preferably
Preferably it is 30 parts by mass or less.

(B) Alkali-soluble resin As the alkali-soluble resin used in the photosensitive composition, various resins can be used. Here, “alkali-soluble” refers to a property of being dissolved by an alkaline developer and having such a solubility as to achieve the intended development processing. Specific examples of such alkali-soluble resins include, for example, (meth) acrylic resins, hydroxystyrene resins, novolak resins, polyester resins, and the like. Among such alkali-soluble resins, particularly preferred are copolymers of the following monomers (a) and (c), copolymers of monomers (a), (b) and (c) And acrylic resins.

Monomer (A): Carboxyl group-containing monomers Acrylic acid, methacrylic acid, maleic acid, fumaric acid, crotonic acid, itaconic acid, citraconic acid, mesaconic acid, cinnamic acid, succinic acid mono (2- (meth) Acryloyloxyethyl), ω-carboxy-polycaprolactone mono (meth) acrylate, and the like. Monomer (b): OH-containing monomers Hydroxyl-containing monomers such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 3-hydroxypropyl (meth) acrylate;
o-hydroxystyrene, m-hydroxystyrene, p
-Phenolic hydroxyl group-containing monomers such as hydroxystyrene. Monomer (c): Other copolymerizable monomers Methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, n-lauryl (meth) acrylate, (meth) acrylic acid Benzyl, glycidyl (meth) acrylate, dicyclopentanyl (meth) acrylate, and other monomers (a) other than (a)
Acrylic esters; aromatic vinyl monomers such as styrene and α-methylstyrene; conjugated dienes such as butadiene and isoprene; polystyrene and poly (meth)
Macromonomers having a polymerizable unsaturated group such as a (meth) acryloyl group at one end of a polymer chain such as methyl acrylate, poly (meth) acrylate, and poly (benzyl meth) acrylate:

The copolymer of the monomer (a) and the monomer (c), or the copolymer of the monomer (a), the monomer (b) and the monomer (c) may be a monomer (a) and / or a monomer (b) Due to the presence of the copolymer component derived from the phenolic hydroxyl group-containing monomer of (1), the compound has alkali solubility. Above all, a copolymer of the monomer (a), the monomer (b) and the monomer (c) is particularly preferable from the viewpoint of the dispersion stability of the inorganic particles (A) and the solubility in an alkali developer described later. The content of the copolymer component derived from the monomer (A) in this copolymer is preferably 1 to 50% by mass, particularly preferably 5 to 30% by mass, and the content of the copolymer component derived from the monomer (B) is The content rate is
It is preferably from 1 to 50% by mass, particularly preferably from 5 to 30% by mass. Further, as the monomer (b) component, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxy (meth) acrylate
Hydroxyl-containing monomers such as hydroxypropyl are preferred.

The molecular weight of the alkali-soluble resin constituting the photosensitive composition is determined by the weight average molecular weight in terms of polystyrene by GPC (hereinafter simply referred to as “weight average molecular weight (M
w))) as 5,000-5,000,0
00, more preferably 10,000.
00 to 300,000. As the content ratio of the alkali-soluble resin in the photosensitive composition, the inorganic particles 10
The amount is usually 1 to 500 parts by mass, preferably 10 to 200 parts by mass with respect to 0 parts by mass. The photosensitive composition may contain a resin other than the alkali-soluble resin.

(C) Ethylenically Unsaturated Group-Containing Compound The ethylenically unsaturated group-containing compound constituting the photosensitive composition contains an ethylenically unsaturated group and undergoes a radical polymerization reaction with a photopolymerization initiator described later. Although there is no particular limitation as long as the compound can be used, a (meth) acrylate compound is usually used. Specific examples of such (meth) acrylate compounds include di (meth) alkylene glycols such as ethylene glycol and propylene glycol.
Acrylates; di (meth) acrylates of polyalkylene glycols such as polyethylene glycol and polypropylene glycol; di (meth) of hydroxyl-terminated polymers such as hydroxypolybutadiene, hydroxypolyisoprene and hydroxypolycaprolactone at both ends Acrylates; glycerin, 1,
2,4-butanetriol, trimethylolalkane,
Poly (meth) acrylates of trihydric or higher polyhydric alcohol such as tetramethylolalkane, pentaerythritol, dipentaerythritol; poly (meth) of polyalkylene glycol adduct of trihydric or higher polyhydric alcohol
Acrylates; 1,4-cyclohexanediol,
Poly (meth) acrylates of cyclic polyols such as 1,4-benzenediols; polyester (meth) acrylate, epoxy (meth) acrylate, urethane (meth) acrylate, alkyd resin (meth) acrylate, silicone resin (meth) Oligo (meth) acrylates such as acrylate and spirane resin (meth) acrylate can be exemplified. In addition, the compounds shown in the monomers (a), (b) and (c) constituting the alkali-soluble resin described above may be used. These (meth) acrylate compounds can be used alone or in combination of two or more. Usually, 20 to 500 parts by mass, more preferably 40 to 250 parts by mass, per 100 parts by mass of the alkali-soluble resin described above. Used in parts by weight.

(D) Photopolymerization Initiator As the photopolymerization initiator constituting the photosensitive composition, a radical is generated in an exposure step to be described later to initiate a polymerization reaction of the aforementioned ethylenically unsaturated group-containing compound. There is no particular limitation as long as it is a compound to be made. Specific examples of such a photopolymerization initiator include benzyl, benzoin,
Benzophenone, Michler's ketone, 4,4′-bisdiethylaminobenzophenone, camphorquinone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-hydroxycyclohexylphenyl ketone,
2,2-dimethoxy-2-phenylacetophenone, 2
-Methyl- [4 '-(methylthio) phenyl] -2-morpholino-1-propanone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, 2,4- Carbonyl compounds such as diethylthioxanthone and isopropylthioxanthone; bis (2,6-dimethoxybenzoyl) -2,4,4-trimethylpentylphosphine oxide, bis (2,4
Phosphine oxide compounds such as 6-trimethylbenzoyl) -phenylphosphine oxide; azo compounds or azide compounds such as azoisobutyronitrile and 4-azidobenzaldehyde; organic sulfur compounds such as mercaptan disulfide; benzoyl peroxide and di-tert-butyl Organic peroxides such as peroxide, tert-butyl hydroperoxide, cumene hydroperoxide, and paramethane hydroperoxide; 2,4-bis (trichloromethyl) -6- (2′-
(Chlorophenyl) -1,3,5-triazine, 2- [2
Trihalomethanes such as-(2-furanyl) ethylenyl] -4,6-bis (trichloromethyl) -1,3,5-triazine; 2,2'-bis (2-chlorophenyl)
Examples thereof include imidazole dimers such as -4,5,4 ', 5'-tetraphenyl1,2'-biimidazole and the like, and these can be used alone or in combination of two or more. Further, a sensitizer, a sensitization aid, a hydrogen donor, and a chain transfer agent may be used in combination. As the content ratio of the photopolymerization initiator, based on 100 parts by mass of the total amount of the alkali-soluble resin and the ethylenically unsaturated group-containing compound,
Usually, it is 0.1 to 100 parts by mass, preferably 1 to 5 parts by mass.
0 parts by mass.

(E) Solvent The photosensitive composition usually contains a solvent. Examples of the solvent include (A) affinity for inorganic particles, (B) an alkali-soluble resin, (C) an ethylenically unsaturated group-containing compound,
(D) The photopolymerization initiator and, if necessary, the various additives described below (F) have good solubility and can impart appropriate viscosity to the photosensitive composition, and are dried. Preferably, it can be easily removed by evaporation.
Specific examples of such a solvent include ketones such as diethyl ketone, methyl butyl ketone, dipropyl ketone and cyclohexanone; alcohols such as n-pentanol, 4-methyl-2-pentanol, cyclohexanol and diacetone alcohol; Ether alcohols such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, and propylene glycol monoethyl ether;
alkyl esters of saturated aliphatic monocarboxylic acids such as n-butyl and amyl acetate; lactates such as ethyl lactate and n-butyl lactate; methyl cellosolve acetate;
Examples thereof include ether esters such as ethyl cellosolve acetate, propylene glycol monomethyl ether acetate, and ethyl-3-ethoxypropionate, and these can be used alone or in combination of two or more. The content of the solvent in the photosensitive composition can be appropriately selected within a range in which good photosensitive transfer layer forming performance (fluidity or plasticity) can be obtained.
The amount is 1 to 10,000 parts by mass, preferably 10 to 1,000 parts by mass with respect to parts by mass.

(F) Various additives In addition to the above-mentioned components (A) to (E), a plasticizer, an adhesion aid, a dispersant, a storage stabilizer, a defoamer,
Various additives such as an antioxidant, an ultraviolet absorber, a leveling agent, and a development accelerator may be contained as optional components. Plasticizer A plasticizer is added in order to exhibit good flexibility and flammability in the formed photosensitive transfer layer. Specifically, a compound represented by the following formula (1) or (2) is preferably used because it is easily decomposed and removed by heat and does not adversely affect the performance of the obtained pattern.

[0023]

Embedded image

(Wherein, R ¹ and R ⁴ each represent the same or different alkyl groups having 1 to 30 carbon atoms;
² and R ³ each represent the same or different methylene group or alkylene group having 2 to 30 carbon atoms;
And t is a number from 1 to 10. )

[0025]

Embedded image

(Wherein, R ⁵ represents an alkyl or alkenyl group having 1 to 30 carbon atoms)

In the above formula (1), the alkyl group represented by R ¹ or R ⁴ and the alkylene group represented by R ² or R ³ may be linear or branched. May be a saturated group or an unsaturated group.
The carbon number of the alkyl group represented by R ¹ or R ⁴ is 1 to
30, preferably 2 to 20, more preferably 4
To 10. If the alkyl group has more than 30 carbon atoms, the solubility of the plasticizer in the solvent will decrease, and good flexibility of the transfer film may not be obtained.

Specific examples of the compound represented by the above formula (1) include dibutyl adipate, diisobutyl adipate, di-2-ethylhexyl adipate, di-2-ethylhexyl azelate, dibutyl sebacate, dibutyl diglycol adipate and the like. Can be Preferably, n is a compound represented by 2 to 6.

In the above formula (2), the alkyl group and alkenyl group represented by R ⁵ may be linear or branched, and may be a saturated group or an unsaturated group. You may. The alkyl group or alkenyl group represented by R ⁵ has 1 to 30 carbon atoms, preferably 2 to 2 carbon atoms.
0, more preferably 10 to 18. Specific examples of the compound represented by the above formula (2) include propylene glycol monolaurate and propylene glycol monooleate.

The content of the plasticizer in the photosensitive composition is 0.1 to 20 parts by weight based on 100 parts by weight of the inorganic particles.
Parts by weight, more preferably 0.5 parts by weight.
To 10 parts by weight.

Adhesion Aid As the adhesion aid, a silane coupling agent [saturated alkyl group-containing (alkyl) alkoxysilane] such as a compound represented by the following formula (3) is preferably used.

[0032]

Embedded image

(Where p is an integer of 3 to 20, m is 1 to 3)
, N is an integer of 1 to 3, and a is an integer of 1 to 3. )

In the above formula (3), p indicating the number of carbon atoms of the saturated alkyl group is an integer of 3 to 20, preferably 4
整数 16.

Specific examples of the silane coupling agent represented by the above formula (3) include n-propyldimethylmethoxysilane, n-butyldimethylmethoxysilane, n-decyldimethylmethoxysilane, and n-hexadecyldimethylmethoxysilane. , Saturated alkyldimethylmethoxysilanes such as n-icosanedimethylmethoxysilane (a =
1, m = 1, n = 1); saturation of n-propyldiethylmethoxysilane, n-butyldiethylmethoxysilane, n-decyldiethylmethoxysilane, n-hexadecyldiethylmethoxysilane, n-icosanediethylmethoxysilane, etc. Alkyldiethylmethoxysilanes (a =
1, m = 1, n = 2); saturated alkyldipropylmethoxy such as n-butyldipropylmethoxysilane, n-decyldipropylmethoxysilane, n-hexadecyldipropylmethoxysilane, n-icosanedipropylmethoxysilane Silanes (a = 1, m = 1, n = 3); n-propyldimethylethoxysilane, n-butyldimethylethoxysilane, n-decyldimethylethoxysilane, n
Saturated alkyldimethylethoxysilanes (a = 1, m = 2, n = 1) such as hexadecyldimethylethoxysilane and n-icosanedimethylethoxysilane; n-propyldiethylethoxysilane, n-butyldiethylethoxysilane, n-decyldiethylethoxysilane, n-
Saturated alkyl diethyl ethoxy silanes (a = 1, m = 2, n = 2) such as hexadecyl diethyl ethoxy silane and n-icosane diethyl ethoxy silane; n-butyl dipropyl ethoxy silane, n-decyl dipropyl ethoxy silane , N-hexadecyldipropylethoxysilane, n-icosanedipropylethoxysilane and other saturated alkyldipropylethoxysilanes (a = 1, m =
2, n = 3); saturated alkyldimethylpropoxysilanes such as n-propyldimethylpropoxysilane, n-butyldimethylpropoxysilane, n-decyldimethylpropoxysilane, n-hexadecyldimethylpropoxysilane, and n-icosanedimethylpropoxysilane (A = 1, m = 3, n = 1); n-propyldiethylpropoxysilane, n-butyldiethylpropoxysilane, n-decyldiethylpropoxysilane, n-hexadecyldiethylpropoxysilane, n-icosanediethylpropoxy Saturated alkyldiethylpropoxysilanes such as silane (a = 1, m = 3, n = 2); n-butyldipropylpropoxysilane, n-decyldipropylpropoxysilane, n-hexadecyldipropylpropoxysilane, n- Ikosan Saturated alkyl dipropyl propoxysilane such as propyl propoxysilane (a =
1, m = 3, n = 3);

N-propylmethyldimethoxysilane, n
Saturated alkylmethyldimethoxysilanes such as -butylmethyldimethoxysilane, n-decylmethyldimethoxysilane, n-hexadecylmethyldimethoxysilane, n-icosanemethyldimethoxysilane (a = 2, m = 1,
n = 1); n-propylethyldimethoxysilane, n-
Saturated alkylethyldimethoxysilanes such as butylethyldimethoxysilane, n-decylethyldimethoxysilane, n-hexadecylethyldimethoxysilane, and n-icosaneethyldimethoxysilane (a = 2, m = 1, n
= 2); saturated alkylpropyldimethoxysilanes such as n-butylpropyldimethoxysilane, n-decylpropyldimethoxysilane, n-hexadecylpropyldimethoxysilane, n-icosanepropyldimethoxysilane (a = 2, m = 1, n = 3) Saturated alkylmethyl such as n-propylmethyldiethoxysilane, n-butylmethyldiethoxysilane, n-decylmethyldiethoxysilane, n-hexadecylmethyldiethoxysilane, n-icosanemethyldiethoxysilane Diethoxysilanes (a = 2, m = 2, n = 1); n
Saturated alkylethyldiethoxysilanes such as -propylethyldiethoxysilane, n-butylethyldiethoxysilane, n-decylethyldiethoxysilane, n-hexadecylethyldiethoxysilane and n-icosaneethyldiethoxysilane ( a = 2, m = 2, n = 2); n
Saturated alkylpropyldiethoxysilanes such as -butylpropyldiethoxysilane, n-decylpropyldiethoxysilane, n-hexadecylpropyldiethoxysilane, n-icosanopropyldiethoxysilane (a =
2, m = 2, n = 3); n-propylmethyldipropoxysilane, n-butylmethyldipropoxysilane, n-
Saturated alkylmethyldipropoxysilanes such as decylmethyldipropoxysilane, n-hexadecylmethyldipropoxysilane, n-icosanemethyldipropoxysilane (a = 2, m = 3, n = 1); n-propylethyl Saturated alkylethyldipropoxysilanes such as dipropoxysilane, n-butylethyldipropoxysilane, n-decylethyldipropoxysilane, n-hexadecylethyldipropoxysilane, and n-icosaneethyldipropoxysilane (a = 2 , M = 3, n = 2); n-
Saturated alkyl propyl dipropoxy silanes such as butyl propyl dipropoxy silane, n-decyl propyl dipropoxy silane, n-hexadecyl propyl dipropoxy silane, n-icosane propyl dipropoxy silane (a = 2, m = 3, n = 3);

Saturated alkyltrimethoxysilanes such as n-propyltrimethoxysilane, n-butyltrimethoxysilane, n-decyltrimethoxysilane, n-hexadecyltrimethoxysilane, n-icosanetrimethoxysilane (a = 3 , M = 1); saturated alkyltriethoxysilanes such as n-propyltriethoxysilane, n-butyltriethoxysilane, n-decyltriethoxysilane, n-hexadecyltriethoxysilane, n-icosanetriethoxysilane ( a = 3, m = 2); saturated alkyl tripropoxy such as n-propyl tripropoxy silane, n-butyl tripropoxy silane, n-decyl tripropoxy silane, n-hexadecyl tripropoxy silane, and n-icosane tripropoxy silane Silanes (a = 3, m = ) And the like can be illustrated, these may be used alone or in combination of two or more.

Of these, n-butyltrimethoxysilane, n-decyltrimethoxysilane, n-hexadecyltrimethoxysilane, n-decyldimethylmethoxysilane, n-hexadecyldimethylmethoxysilane, n-butyltrimethoxysilane
Butyltriethoxysilane, n-decyltriethoxysilane, n-hexadecyltriethoxysilane, n-decylethyldiethoxysilane, n-hexadecylethyldiethoxysilane, n-butyltripropoxysilane, n
-Decyltripropoxysilane, n-hexadecyltripropoxysilane and the like are particularly preferred.

The content of the adhesion aid in the photosensitive composition was 0.001 to 100 parts by weight of the inorganic particles.
It is preferably from 10 to 10 parts by weight, more preferably from 0.001 to 5 parts by weight.

Dispersant Fatty acids are preferably used as a dispersant for the inorganic particles. In particular, fatty acids having 8 to 30 carbon atoms are preferred. Preferred specific examples of the above fatty acids include saturated fatty acids such as octanoic acid, undecylic acid, lauric acid, myristic acid, palmitic acid, pentadecanoic acid, stearic acid, and arachidic acid; elaidic acid, oleic acid, linoleic acid, linolenic acid, and arachidone. Examples thereof include unsaturated fatty acids such as acids, which can be used alone or in combination of two or more.

The content ratio of the dispersant in the photosensitive composition is 0.001 to 100 parts by weight of the inorganic particles.
It is preferably 10 parts by weight, more preferably 0.01 to 5 parts by weight.

Method for Forming Pattern The photosensitive transfer film of the present invention is particularly preferably used for forming a pattern having a height of 10 μm or less. In the method for forming a pattern using the photosensitive transfer film of the present invention, [1] a photosensitive transfer layer transfer step, [2] a photosensitive transfer layer exposure step, [3] a photosensitive transfer layer development step,
[4] Step of baking the photosensitive transfer layer pattern. [1] Transfer step of photosensitive transfer layer In the transfer step, the photosensitive transfer film of the present invention is used.
The photosensitive transfer layer constituting the photosensitive transfer film is transferred onto a substrate. As the substrate material, for example, a plate-like member made of glass, silicone, alumina, or the like is used.
A glass substrate is used for DP. It is also possible to use a plate-shaped member having a desired pattern formed on the surface in advance. For the substrate surface, if necessary, a chemical treatment with a silane coupling agent or the like; a plasma treatment; an appropriate treatment such as a thin film formation treatment by an ion plating method, a sputtering method, a gas phase reaction method, a vacuum evaporation method, or the like. Pre-processing may be performed. An example of the transfer step is as follows. After peeling off the protective film of the photosensitive transfer film used as necessary, the photosensitive transfer film is overlaid on the substrate so that the surface of the photosensitive transfer layer is in contact with the substrate. Thermocompression bonding with a heating roller. As a result, the photosensitive transfer layer is transferred onto the substrate and brought into close contact therewith. Here, as the transfer condition, for example, the surface temperature of the heating roller is 20 to 14
0 ° C, roll pressure by heating roller is 1-5kg / cm
^2. The moving speed of the heating roller can be 0.1 to 10.0 m / min. The substrate may be preheated, and the preheating temperature may be, for example, 40 to 100 ° C.

[2] Exposure Step of Photosensitive Transfer Layer In the exposure step, the surface of the photosensitive transfer layer is selectively irradiated (exposed) with radiation through an exposure mask to form a pattern on the photosensitive transfer layer. Is formed. The support film on the photosensitive transfer layer may be peeled and removed before the exposure step, or may be peeled and removed after the exposure step and before a development step described later. From the viewpoint of increasing the sensitivity, the support film on the photosensitive transfer layer is preferably peeled and removed after the exposure step and before the development step described later. The radiation to be selectively irradiated (exposed) with radiation in the exposure step includes visible light, ultraviolet light, far ultraviolet light, an electron beam or X-ray, and preferably visible light, ultraviolet light, and far ultraviolet light, More preferably, ultraviolet light is used.
The exposure pattern of the exposure mask varies depending on the purpose,
For example, a stripe having a width of 10 to 500 μm is used. The radiation irradiating device is not particularly limited, such as an ultraviolet irradiating device used in the photolithography method, an exposure device used in manufacturing a semiconductor and a liquid crystal display device.

[3] Developing Step of Photosensitive Transfer Layer In the developing step, the pattern (latent image) of the photosensitive transfer layer is developed by developing the exposed photosensitive transfer layer. As the developer used in the step of developing the photosensitive transfer layer, an alkali developer can be used. As a result, the alkali-soluble resin contained in the photosensitive transfer layer can be easily dissolved and removed. Incidentally, since the inorganic particles contained in the photosensitive transfer layer is uniformly dispersed in the alkali-soluble resin, by dissolving the alkali-soluble resin as a binder, by washing,
The inorganic particles are also removed at the same time. Examples of the effective component of the alkali developer include lithium hydroxide, sodium hydroxide, potassium hydroxide, sodium hydrogen phosphate, diammonium hydrogen phosphate, dipotassium hydrogen phosphate, disodium hydrogen phosphate, and ammonium dihydrogen phosphate. , Potassium dihydrogen phosphate, sodium dihydrogen phosphate, lithium silicate, sodium silicate, potassium silicate, lithium carbonate, sodium carbonate, potassium carbonate, lithium borate,
Inorganic alkaline compounds such as sodium borate, potassium borate, and ammonia; tetramethylammonium hydroxide, trimethylhydroxyethylammonium hydroxide, monomethylamine, dimethylamine, trimethylamine, monoethylamine, diethylamine, triethylamine, monoisopropylamine, diisopropylamine, Organic alkaline compounds such as ethanolamine can be exemplified. The alkaline developer used in the step of developing the photosensitive transfer layer can be prepared by dissolving one or more of the above alkaline compounds in water or the like. Here, the concentration of the alkaline compound in the alkaline developer is usually 0.001 to 1
0 mass%, preferably 0.01 to 5 mass%. The alkali developer may contain additives such as a nonionic surfactant and an organic solvent. After the development processing with an alkali developing solution, a washing treatment is usually performed. Further, if necessary, a step of scraping unnecessary portions remaining on the side surface of the photosensitive transfer layer pattern and the exposed portion of the substrate after the development processing may be included. Here, as the development processing conditions, the type, composition, and concentration of the developer, the development time, the development temperature, the development method (for example, the immersion method, the oscillating method, the shower method, the spray method, and the paddle method), the developing device, etc. You can choose. Through this development step, a photosensitive transfer layer pattern (a pattern corresponding to an exposure mask) composed of the photosensitive transfer layer remaining portion and the photosensitive transfer layer removal portion is formed.

[4] Step of Baking Photosensitive Transfer Layer Pattern In this step, the photosensitive transfer layer pattern is baked to form a pattern. Thereby, the organic substance in the remaining portion of the photosensitive transfer layer is burned off, and an inorganic pattern can be obtained on the surface of the substrate. Here, the temperature of the baking treatment needs to be a temperature at which the organic substance in the residual portion of the resin layer is burned off.
It is said. The firing time is usually set to 10 to 90 minutes. The height of the pattern formed on the substrate as described above is 10 μm or less, not including 0, and preferably 1 μm.
To 8 μm, and more preferably 2 to 6 μm.

[0046]

Hereinafter, embodiments of the present invention will be described.
The present invention is not limited by these. In the following, “parts” indicates “parts by mass”. The weight average molecular weight (Mw) was measured by gel permeation chromatography (GPC) (trade name: HPC manufactured by Tosoh Corporation).
LC-802A) is the average molecular weight in terms of polystyrene measured by LC-802A).

<Example 1> (1) Preparation of photosensitive composition: (A) 100 parts of Ag particles (granular) having an average particle size of 1 μm, and an average particle size of 2 were used as the inorganic particles.
μm Bi ₂ O ₃ —ZnO—B ₂ O ₃ —SiO ₂ —Al
₂ O ₃ low melting point glass frit (irregular, softening point 520
C) 10 parts, and (B) 30 parts of a copolymer (Mw = 100,000) of n-butyl methacrylate / 3-hydroxypropyl methacrylate / methacrylic acid = 60/20/20 (% by mass) as an alkali-soluble resin. , (C) 20 parts of trimethylolpropane triacrylate as an ethylenically unsaturated group-containing compound, and (D) 2 parts as a photopolymerization initiator.
-Benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one 5 parts, (E) as a solvent, propylene glycol monomethyl ether 150
Part and (F) 1 part of oleic acid as a dispersant was kneaded with a bead mill, and then filtered with a stainless mesh (200 mesh, 25 μm diameter),
A photosensitive composition was prepared.

(2) Preparation of photosensitive transfer film: A photosensitive transfer film of the present invention having a photosensitive transfer layer formed on a support film was prepared by the following operation (a). (A) A photosensitive composition is applied on a PET film (width 200 mm, length 30 m, thickness 38 μm) made of a PET film previously subjected to a mold release treatment using a blade coater, and the coating film is dried at 100 ° C. for 5 minutes. Then, the solvent was completely removed, and a photosensitive resin layer having a thickness of 10 μm was formed on the support film.

Transfer step of photosensitive transfer layer: A photosensitive transfer film is superimposed on the surface of a glass substrate for a 6-inch panel such that the surface of the photosensitive transfer layer is in contact with the surface of the glass substrate. Thermocompression bonding. here,
As the pressure bonding conditions, the surface temperature of the heating roller was set to 120 ° C.
The roll pressure was 4 kg / cm ² and the moving speed of the heating roller was 0.5 m / min. As a result, the photosensitive transfer layer was transferred to the surface of the glass substrate and brought into close contact therewith. When the film thickness of this photosensitive transfer layer was measured, it was 10 μm
It was in the range of ± 1 μm.

Exposure step and development step of photosensitive transfer layer: i-line (ultraviolet light having a wavelength of 365 nm) is applied to the photosensitive transfer layer by an ultra-high pressure mercury lamp through an exposure mask (a stripe pattern having a width of 50 μm). Irradiated. Here, the irradiation amount was 400 mJ / cm ² .

After the exposure step, the support film is peeled off from the photosensitive transfer layer, and the exposed photosensitive transfer layer is subjected to a 0.5% by mass aqueous solution of sodium carbonate (3%).
(0 ° C.) as a developing solution was performed over 1 minute by a shower method. Next, a washing treatment with ultrapure water was performed, whereby the uncured photosensitive transfer layer not irradiated with ultraviolet rays was removed to form a pattern.

Baking step of photosensitive transfer layer pattern: The glass substrate on which the photosensitive transfer layer pattern is formed is placed in a baking furnace for 6 hours.
The sintering treatment was performed in a temperature atmosphere of 00 ° C. for 30 minutes. As a result, a panel material having the electrode pattern formed on the surface of the glass substrate was obtained. For the electrode pattern in the obtained panel material, the line width and height of the electrode pattern were measured using a scanning electron microscope, and the accuracy of the pattern width was 50 μm ± 5 μm.
Those in the range of m were evaluated as ○, and the others were evaluated as ×. In addition, observations were made on the lack of patterns. Next, the pattern mass was measured before and after the photosensitive transfer layer pattern baking step, and the mass loss was calculated. Table 1 shows the results.

<Example 2> As (B) an alkali-soluble resin, n-butyl methacrylate / 3-hydroxypropyl methacrylate / methacrylic acid = 60/20/20 (% by mass) copolymer (Mw = 100,000) ) 60 parts,
(C) A photosensitive composition was prepared in the same manner as in Example 1, except that 40 parts of trimethylolpropane triacrylate was used as the ethylenically unsaturated group-containing compound.
A photosensitive transfer film of the present invention having a photosensitive transfer layer having a thickness of 15 μm formed on a support film was prepared in the same manner as in Example 1 except that the photosensitive composition was used. A panel material on which an electrode pattern was formed was prepared and evaluated in the same manner as in Example 1 except that the photosensitive transfer film was used. Table 1 shows the results.

Example 3 (B) n-butyl methacrylate / 3-hydroxypropyl methacrylate / methacrylic acid = 60/20/20 (% by mass) copolymer (Mw = 100,000) as the alkali-soluble resin ) 90 parts,
(C) A photosensitive composition was prepared in the same manner as in Example 1 except that 60 parts of trimethylolpropane triacrylate was used as the ethylenically unsaturated group-containing compound.
A photosensitive transfer film of the present invention having a photosensitive transfer layer having a thickness of 20 μm formed on a support film was produced in the same manner as in Example 1 except that the photosensitive composition was used. A panel material on which an electrode pattern was formed was prepared and evaluated in the same manner as in Example 1 except that the photosensitive transfer film was used. Table 1 shows the results.

Example 4 As the alkali-soluble resin (B), n-butyl methacrylate / 3-hydroxypropyl methacrylate / methacrylic acid = 60/20/20 (% by mass) copolymer (Mw = 100,000) 18)
(C) A photosensitive composition was prepared in the same manner as in Example 1, except that 12 parts of trimethylolpropane triacrylate was used as the ethylenically unsaturated group-containing compound.
A photosensitive transfer film of the present invention having a photosensitive transfer layer having a thickness of 15 μm formed on a support film was prepared in the same manner as in Example 1 except that the photosensitive composition was used. A panel material on which an electrode pattern was formed was prepared and evaluated in the same manner as in Example 1 except that the photosensitive transfer film was used. Table 1 shows the results.

Example 5 As (B) an alkali-soluble resin, n-butyl methacrylate / 3-hydroxypropyl methacrylate / methacrylic acid = 60/20/20 (% by mass) copolymer (Mw = 100,000) ) 27 parts,
(C) A photosensitive composition was prepared in the same manner as in Example 1 except that 18 parts of trimethylolpropane triacrylate was used as the ethylenically unsaturated group-containing compound.
A photosensitive transfer film of the present invention having a photosensitive transfer layer having a thickness of 20 μm formed on a support film was produced in the same manner as in Example 1 except that the photosensitive composition was used. A panel material on which an electrode pattern was formed was prepared and evaluated in the same manner as in Example 1 except that the photosensitive transfer film was used. Table 1 shows the results.

Example 6 (A) As inorganic particles, average
Cu-Fe-Mn composite oxide particles having a particle size of 0.3 µm (spheres)
State) 100 parts, Bi having an average particle size of 2 μm_Two O_Three -ZnO-
B_Two O_Three -SiO _Two -Al_Two O_Three System low melting glass frit
10 parts (amorphous, softening point 520 ° C), (B) alkali
As a soluble resin, n-butyl methacrylate / methacrylate
3-hydroxypropyl luate / methacrylic acid = 60/2
0/20 (% by mass) copolymer (Mw = 100,000)
120 parts, as (C) an ethylenically unsaturated group-containing compound
And 80 parts of trimethylolpropane triacrylate
A photosensitive composition was prepared in the same manner as in Example 1 except that the photosensitive composition was used.
Was prepared. Implemented except using the photosensitive composition
A 10 μm-thick photosensitive transfer layer is supported as in Example 1.
Photosensitive transfer film of the present invention formed on a film
Was made. After using the photosensitive transfer film
Other than the above, the black matrix pattern
Panel material on which
The matrix pattern was evaluated. Table 1 shows the results
Shown in

Example 7 As the alkali-soluble resin (B), n-butyl methacrylate / 3-hydroxypropyl methacrylate / methacrylic acid = 60/20/20 (% by mass) copolymer (Mw = 100,000) ) 180 parts,
(C) A photosensitive composition was prepared in the same manner as in Example 6, except that 120 parts of trimethylolpropane triacrylate was used as the ethylenically unsaturated group-containing compound. A photosensitive transfer film of the present invention having a 15 μm-thick photosensitive transfer layer formed on a support film was prepared in the same manner as in Example 6 except that the photosensitive composition was used. A panel material on which a black matrix pattern was formed was prepared and evaluated in the same manner as in Example 6 except that the photosensitive transfer film was used. Table 1 shows the results.

Example 8 As (B) an alkali-soluble resin, n-butyl methacrylate / 3-hydroxypropyl methacrylate / methacrylic acid = 60/20/20 (% by mass) copolymer (Mw = 100,000) ) 36 parts,
(C) A photosensitive composition was prepared in the same manner as in Example 6, except that 24 parts of trimethylolpropane triacrylate was used as the ethylenically unsaturated group-containing compound.
A photosensitive transfer film of the present invention having a photosensitive transfer layer having a thickness of 10 μm formed on a support film was prepared in the same manner as in Example 6 except that the photosensitive composition was used. A panel material on which a black matrix pattern was formed was prepared and evaluated in the same manner as in Example 6 except that the photosensitive transfer film was used. Table 1 shows the results.

Example 9 (B) As an alkali-soluble resin, n-butyl methacrylate / 3-hydroxypropyl methacrylate / methacrylic acid = 60/20/20 (% by mass) copolymer (Mw = 100,000) ) 60 parts,
(C) A photosensitive composition was prepared in the same manner as in Example 6, except that 40 parts of trimethylolpropane triacrylate was used as the ethylenically unsaturated group-containing compound.
A photosensitive transfer film of the present invention having a 15 μm-thick photosensitive transfer layer formed on a support film was prepared in the same manner as in Example 6 except that the photosensitive composition was used. A panel material on which a black matrix pattern was formed was prepared and evaluated in the same manner as in Example 6 except that the photosensitive transfer film was used. Table 1 shows the results.

Example 10 (B) As the alkali-soluble resin, n-butyl methacrylate / 3-hydroxypropyl methacrylate / methacrylic acid = 60/20/20
(% By mass) 90 parts of a copolymer (Mw = 100,000),
(C) A photosensitive composition was prepared in the same manner as in Example 6, except that 60 parts of trimethylolpropane triacrylate was used as the ethylenically unsaturated group-containing compound.
A photosensitive transfer film of the present invention having a photosensitive transfer layer having a thickness of 20 μm formed on a support film was prepared in the same manner as in Example 6, except that the photosensitive composition was used. A panel material on which a black matrix pattern was formed was prepared and evaluated in the same manner as in Example 6 except that the photosensitive transfer film was used. Table 1 shows the results.

<Comparative Example 1> As the alkali-soluble resin (B), n-butyl methacrylate / 3-hydroxypropyl methacrylate / methacrylic acid = 60/20/20 (% by mass) copolymer (Mw = 100,000) 9), (C)
A photosensitive composition was prepared in the same manner as in Example 1, except that 6 parts of trimethylolpropane triacrylate was used as the ethylenically unsaturated group-containing compound. A photosensitive transfer film of the present invention having a photosensitive transfer layer having a thickness of 4 μm formed on a support film was prepared in the same manner as in Example 1 except that the photosensitive composition was used. A panel material on which an electrode pattern was formed was prepared and evaluated in the same manner as in Example 1 except that the photosensitive transfer film was used. Table 1 shows the results.

Comparative Example 2 As the alkali-soluble resin (B), n-butyl methacrylate / 3-hydroxypropyl methacrylate / methacrylic acid = 60/20/20 (% by mass) copolymer (Mw = 100,000) ) 60 parts,
(C) A photosensitive composition was prepared in the same manner as in Example 1, except that 40 parts of trimethylolpropane triacrylate was used as the ethylenically unsaturated group-containing compound.
A photosensitive transfer film of the present invention having a photosensitive transfer layer having a thickness of 40 μm formed on a support film was prepared in the same manner as in Example 1 except that the photosensitive composition was used. A panel material on which an electrode pattern was formed was prepared and evaluated in the same manner as in Example 1 except that the photosensitive transfer film was used. Table 1 shows the results.

<Comparative Example 3> (B) As an alkali-soluble resin, n-butyl methacrylate / 3-hydroxypropyl methacrylate / methacrylic acid = 60/20/20 (% by mass) copolymer (Mw = 100,000) ) 36 parts,
(C) A photosensitive composition was prepared in the same manner as in Example 6, except that 24 parts of trimethylolpropane triacrylate was used as the ethylenically unsaturated group-containing compound.
A photosensitive transfer film of the present invention having a photosensitive transfer layer having a thickness of 4 μm formed on a support film was prepared in the same manner as in Example 6 except that the photosensitive composition was used.
A panel material on which a black matrix pattern was formed was prepared and evaluated in the same manner as in Example 6 except that the photosensitive transfer film was used. Table 1 shows the results.

Comparative Example 4 As (B) an alkali-soluble resin, n-butyl methacrylate / 3-hydroxypropyl methacrylate / methacrylic acid = 60/20/20 (% by mass) copolymer (Mw = 100,000) ) 180 parts,
(C) A photosensitive composition was prepared in the same manner as in Example 6, except that 120 parts of trimethylolpropane triacrylate was used as the ethylenically unsaturated group-containing compound. A photosensitive transfer film of the present invention, in which a photosensitive transfer layer having a thickness of 40 μm was formed on a support film, was prepared in the same manner as in Example 6 except that the photosensitive composition was used. A panel material on which a black matrix pattern was formed was prepared and evaluated in the same manner as in Example 6 except that the photosensitive transfer film was used. Table 1 shows the results.

[0066]

[Table 1]

[0067]

According to the photosensitive transfer film of the present invention,
A pattern with excellent adhesion to the substrate and high dimensional accuracy can be easily formed. The photosensitive transfer film of the present invention is an electrode of a plasma display panel, a phosphor,
It can be suitably used for forming a color filter and a black matrix.

[Brief description of the drawings]

FIG. 1 is a schematic view showing a cross-sectional shape of an AC type plasma display panel.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Glass substrate (front substrate) 2 Glass substrate (rear substrate) 3 Partition wall 4 Transparent electrode 5 Bus electrode 6 Address electrode 7 Phosphor 8 Dielectric layer (front substrate) 9 Dielectric layer (rear substrate) 10 Protective film

 ────────────────────────────────────────────────── ─── Continued on the front page F term (reference) 2H025 AA02 AA14 AB11 AB13 AB20 AC01 AD01 BC13 BC31 BJ00 CA00 CB42 CC08 CC15 CC20 DA01 EA08 FA29 5C040 GC18 GC19 GH03 GH07 JA09 JA15 JA22 KA04 KA16 KB03 KB14 KB17 KB19 KB28 MA24

Claims (4)

[Claims] 1. A composition comprising (A) inorganic particles, (B) an alkali-soluble resin, (C) a compound containing an ethylenically unsaturated group and (D) a photopolymerization initiator, and having a thickness of 5 to 30 μm.
A photosensitive transfer film, comprising a photosensitive transfer layer of 2. When baking treatment is performed at 600 ° C.,
The photosensitive transfer film according to claim 1, further comprising a photosensitive transfer layer having a mass loss of 20 to 80% by mass. 3. The photosensitive transfer film according to claim 1, further comprising (A) a photosensitive transfer layer having an inorganic particle content of 20 to 80% by mass. 4. The photosensitive transfer film according to claim 1, wherein the photosensitive transfer film is used to form at least one member selected from an electrode, a phosphor, a color filter, and a black matrix of a plasma display panel. .