JP2001127312A - 光モジュール及びその製造方法並びに光伝達装置 - Google Patents
光モジュール及びその製造方法並びに光伝達装置Info
- Publication number
- JP2001127312A JP2001127312A JP30630099A JP30630099A JP2001127312A JP 2001127312 A JP2001127312 A JP 2001127312A JP 30630099 A JP30630099 A JP 30630099A JP 30630099 A JP30630099 A JP 30630099A JP 2001127312 A JP2001127312 A JP 2001127312A
- Authority
- JP
- Japan
- Prior art keywords
- optical
- platform
- electrode
- wiring layer
- optical element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 278
- 230000005540 biological transmission Effects 0.000 title claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000013307 optical fiber Substances 0.000 claims abstract description 50
- 239000004020 conductor Substances 0.000 claims abstract description 27
- 239000011347 resin Substances 0.000 claims description 91
- 229920005989 resin Polymers 0.000 claims description 91
- 239000000463 material Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 description 18
- 239000000758 substrate Substances 0.000 description 17
- 238000010586 diagram Methods 0.000 description 8
- 238000007789 sealing Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229910015363 Au—Sn Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Landscapes
- Semiconductor Lasers (AREA)
- Light Receiving Elements (AREA)
- Optical Couplings Of Light Guides (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30630099A JP2001127312A (ja) | 1999-10-28 | 1999-10-28 | 光モジュール及びその製造方法並びに光伝達装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30630099A JP2001127312A (ja) | 1999-10-28 | 1999-10-28 | 光モジュール及びその製造方法並びに光伝達装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001127312A true JP2001127312A (ja) | 2001-05-11 |
| JP2001127312A5 JP2001127312A5 (enExample) | 2004-11-25 |
Family
ID=17955452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30630099A Withdrawn JP2001127312A (ja) | 1999-10-28 | 1999-10-28 | 光モジュール及びその製造方法並びに光伝達装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001127312A (enExample) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005123268A (ja) * | 2003-10-14 | 2005-05-12 | Seiko Epson Corp | 光素子およびその製造方法、光素子と実装基板との実装構造、光素子と実装基板との実装方法、光モジュール、ならびに光伝達装置 |
| EP1548475A1 (en) * | 2003-12-26 | 2005-06-29 | Kabushiki Kaisha Toshiba | Optical semiconductor module and method of manufacturing the same |
| JP2005189605A (ja) * | 2003-12-26 | 2005-07-14 | Toshiba Corp | 光半導体モジュールおよびその製造方法 |
| JP2005338308A (ja) * | 2004-05-26 | 2005-12-08 | Kyosemi Corp | 半導体光学部品及びその製造方法 |
| WO2009119426A1 (ja) * | 2008-03-26 | 2009-10-01 | 住友電気工業株式会社 | 光電変換モジュールおよびその組み立て方法ならびにそれを用いた光電対応情報処理機器 |
| WO2009123313A1 (ja) * | 2008-04-04 | 2009-10-08 | 住友電気工業株式会社 | 光モジュール及びその組立方法 |
-
1999
- 1999-10-28 JP JP30630099A patent/JP2001127312A/ja not_active Withdrawn
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005123268A (ja) * | 2003-10-14 | 2005-05-12 | Seiko Epson Corp | 光素子およびその製造方法、光素子と実装基板との実装構造、光素子と実装基板との実装方法、光モジュール、ならびに光伝達装置 |
| EP1548475A1 (en) * | 2003-12-26 | 2005-06-29 | Kabushiki Kaisha Toshiba | Optical semiconductor module and method of manufacturing the same |
| JP2005189605A (ja) * | 2003-12-26 | 2005-07-14 | Toshiba Corp | 光半導体モジュールおよびその製造方法 |
| US7192199B2 (en) | 2003-12-26 | 2007-03-20 | Kabushiki Kaisha Toshiba | Optical semiconductor module and method of manufacturing the same |
| CN100370293C (zh) * | 2003-12-26 | 2008-02-20 | 株式会社东芝 | 光学半导体模块和制造该模块的方法 |
| JP2005338308A (ja) * | 2004-05-26 | 2005-12-08 | Kyosemi Corp | 半導体光学部品及びその製造方法 |
| WO2009119426A1 (ja) * | 2008-03-26 | 2009-10-01 | 住友電気工業株式会社 | 光電変換モジュールおよびその組み立て方法ならびにそれを用いた光電対応情報処理機器 |
| US8235603B2 (en) | 2008-03-26 | 2012-08-07 | Sumitomo Electric Industries, Ltd. | Optoelectric conversion module, method for assembling same, and optoelectric information processor using same |
| JP5327052B2 (ja) * | 2008-03-26 | 2013-10-30 | 住友電気工業株式会社 | 光電変換モジュールおよびそれを用いた光電対応情報処理機器 |
| EP2256881A4 (en) * | 2008-03-26 | 2014-12-24 | Sumitomo Electric Industries | PHOTOELECTRIC CONVERSION MODULE, PROCESS FOR ITS MANUFACTURE AND PHOTOELECTRIC INFORMATION PROCESSING DEVICE THEREFOR |
| WO2009123313A1 (ja) * | 2008-04-04 | 2009-10-08 | 住友電気工業株式会社 | 光モジュール及びその組立方法 |
| JP2009251224A (ja) * | 2008-04-04 | 2009-10-29 | Sumitomo Electric Ind Ltd | 光モジュール及びその組立方法 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20051220 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20060424 |
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| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060510 |
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| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20060707 |