JP2001110763A5 - - Google Patents

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Publication number
JP2001110763A5
JP2001110763A5 JP1999287682A JP28768299A JP2001110763A5 JP 2001110763 A5 JP2001110763 A5 JP 2001110763A5 JP 1999287682 A JP1999287682 A JP 1999287682A JP 28768299 A JP28768299 A JP 28768299A JP 2001110763 A5 JP2001110763 A5 JP 2001110763A5
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JP
Japan
Prior art keywords
semiconductor wafer
grindstones
polishing tool
circular
grindstone
Prior art date
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Application number
JP1999287682A
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English (en)
Japanese (ja)
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JP2001110763A (ja
JP3847500B2 (ja
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Priority to JP28768299A priority Critical patent/JP3847500B2/ja
Priority claimed from JP28768299A external-priority patent/JP3847500B2/ja
Publication of JP2001110763A publication Critical patent/JP2001110763A/ja
Publication of JP2001110763A5 publication Critical patent/JP2001110763A5/ja
Application granted granted Critical
Publication of JP3847500B2 publication Critical patent/JP3847500B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP28768299A 1999-10-08 1999-10-08 半導体ウェハ平坦化加工方法および平坦化加工装置 Expired - Fee Related JP3847500B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28768299A JP3847500B2 (ja) 1999-10-08 1999-10-08 半導体ウェハ平坦化加工方法および平坦化加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28768299A JP3847500B2 (ja) 1999-10-08 1999-10-08 半導体ウェハ平坦化加工方法および平坦化加工装置

Publications (3)

Publication Number Publication Date
JP2001110763A JP2001110763A (ja) 2001-04-20
JP2001110763A5 true JP2001110763A5 (https=) 2005-02-17
JP3847500B2 JP3847500B2 (ja) 2006-11-22

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ID=17720370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28768299A Expired - Fee Related JP3847500B2 (ja) 1999-10-08 1999-10-08 半導体ウェハ平坦化加工方法および平坦化加工装置

Country Status (1)

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JP (1) JP3847500B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5676832B2 (ja) * 2001-06-08 2015-02-25 エルエスアイ コーポレーション 半導体ウエハの化学的機械的研磨における欠陥密度低減方法及びスラリ流量制御方法
CN112091809B (zh) * 2014-10-03 2022-11-29 株式会社荏原制作所 处理组件及处理方法
JP7317532B2 (ja) * 2019-03-19 2023-07-31 キオクシア株式会社 研磨装置及び研磨方法
JP7562994B2 (ja) 2020-06-08 2024-10-08 株式会社Sumco ウェーハ外周部の研磨装置
JP7764258B2 (ja) * 2022-01-14 2025-11-05 株式会社ディスコ ウェーハの研磨方法及び貼り合わせワークの研磨方法

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