JP2001102728A - Land on substrate for conductive adhesives - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a land on a substrate for conductive adhesives in which short circuit between both electrodes is prevented, even if conductive adhesives flows out. SOLUTION: Since U-shaped lands 11 are arranged oppositely on a substrate 20 for conductive adhesives while facing the recessed parts 11a each other, conductive adhesives 12 flowing out from the lands during heating process can be contained in the recessed parts, thus preventing short circuiting between both electrodes.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a land for a conductive adhesive substrate, and more particularly to a method for preventing a short circuit between electrodes due to the conductive adhesive.

[0002]

2. Description of the Related Art Conventionally, the shape of a land 11 on a circuit board 20 provided for fixing electrodes 2 provided on both ends of a main body 1 of a chip component 10 using a conductive adhesive 12 is shown in FIG. As shown in FIG. A conductive adhesive 12 is applied to the square land 11 by silk printing or the like, and both electrodes 3 provided on both edges of the main body 1 of the chip component 10 are aligned with the land 11 and mounted manually or automatically, and then heated. To stick. However, in the conventional shape of the land 11 of the conductive adhesive substrate, the distance between the lands is short. Therefore, when the conductive adhesive 12 flows out between the lands 11 in the heating step, a gap between the two electrodes 3 is generated due to a capillary phenomenon. There is a problem of short-circuiting.

[0003]

SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems and provides a land for a conductive adhesive substrate which does not cause a short circuit between both electrodes even when the conductive adhesive flows out. It is an object.

[0004]

According to the present invention, there is provided a land for a conductive adhesive substrate for fixing electrodes provided on both ends of a main body of a chip component with a conductive adhesive. The shape is formed in a U-shape, and the U-shaped concave side is opposed to be a land of a conductive adhesive substrate.

The concave area of the U-shaped land is substantially equal to or larger than the area of the land.

[0006]

As described above, in the land of the conductive adhesive substrate of the present invention, the land of the conductive adhesive substrate is formed in a U-shape, and the U-shaped concave portion is formed. Since the sides are arranged to face each other, in the heating step, the conductive adhesive flowing out of the land can be accommodated in the recess of the land, and a short circuit between both electrodes can be prevented.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The lands of a conductive adhesive substrate according to the present invention will be described below in detail with reference to the drawings. FIG. 1 is a side sectional view showing a main part of an embodiment of a land of a conductive adhesive substrate according to the present invention. In the figure, reference numeral 1 denotes a main body of the chip component 10, and 2 denotes an electrode provided on a peripheral edge of the end of the main body 1. 11
Are lands formed on the circuit board 20 on which the chip component 10 is mounted and fixing the electrodes 2 of the chip component with the conductive adhesive 12. As shown in FIG. 1- (C), the land 11 is formed in a U-shape, and the land 11a is disposed so as to face the concave portion 11a. The area of the recess 11a is
The area is approximately the same as or larger than the area.

Next, the mounting procedure of the above configuration will be described. First, the conductive adhesive 12 is applied on the lands 11 of the circuit board 20 by silk printing. Next, the chip component 10 is mounted by a manual or automatic mounter so that the electrode 2 is mounted on the land 11, and is heated and fixed in a furnace. At this time, the conductive adhesive 12 applied on the land 11 flows once by heat and flows into the lower surface of the main body 1 of the chip component 10, and the area of the recess 11 a is substantially the same as the area of the land 11. Since the conductive adhesive 12 is larger than that, the conductive adhesive 12 is accommodated in the concave portion 11a and solidified without short-circuiting between the electrodes.

[0009]

As described above, according to the land of the conductive adhesive substrate according to the present invention, the land of the conductive adhesive substrate is formed in a U-shape and the U-shaped concave portion is formed. Since the sides are arranged facing each other, in the heating process,
The conductive adhesive flowing out of the land can be accommodated in the concave portion of the land, and a short circuit between both electrodes can be prevented.

[Brief description of the drawings]

FIG. 1 is a sectional side view showing a main part of an embodiment of a land of a conductive adhesive substrate according to the present invention.

FIG. 2 is a side sectional view of a main part showing a land of a conventional conductive adhesive substrate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Main body 2 Electrode 10 Chip component 11 Land 11a Concave part 12 Conductive adhesive 20 Circuit board

Claims (2)

[Claims] 1. A land of a conductive adhesive substrate for fixing electrodes provided at both ends of a main body of a chip component with a conductive adhesive, the land having a U-shape and a U-shape. A land for a conductive adhesive substrate, wherein the lands are arranged with the concave sides facing each other. 2. The land of the conductive adhesive substrate according to claim 1, wherein the concave area of the U-shaped land is substantially equal to or larger than the area of the land.