JP3080512B2 - Wiring board for mounting surface mount components and component mounting connection method - Google Patents

Wiring board for mounting surface mount components and component mounting connection method

Info

Publication number
JP3080512B2
JP3080512B2 JP05119788A JP11978893A JP3080512B2 JP 3080512 B2 JP3080512 B2 JP 3080512B2 JP 05119788 A JP05119788 A JP 05119788A JP 11978893 A JP11978893 A JP 11978893A JP 3080512 B2 JP3080512 B2 JP 3080512B2
Authority
JP
Japan
Prior art keywords
connection
lead
solder
component
surface mount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP05119788A
Other languages
Japanese (ja)
Other versions
JPH06334317A (en
Inventor
行人 高橋
圭一 山田
孝治 戸内
浩偉 仲山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP05119788A priority Critical patent/JP3080512B2/en
Publication of JPH06334317A publication Critical patent/JPH06334317A/en
Application granted granted Critical
Publication of JP3080512B2 publication Critical patent/JP3080512B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【産業上の利用分野】本発明は表面実装部品搭載用配線
基板及び部品搭載接続方法に係り、特に部品接続用リー
ドの形状が細く狭ピッチの表面実装部品の接続に好適な
表面実装部品搭載用配線基板及び部品搭載接続方法に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board for mounting surface-mounted components and a method for mounting and connecting the components. The present invention relates to a wiring board and a component mounting connection method.

【０００２】[0002]

【従来の技術】従来の表面実装部品の接続例を図３、図
４により説明する。図３は配線基板１上に表面実装部品
３が搭載され、リード４が接続用電極２にはんだ接続さ
れた状態を示す斜視図であり、図４は図３の接続部Ｃの
拡大断面図である。2. Description of the Related Art A connection example of a conventional surface mount component will be described with reference to FIGS. FIG. 3 is a perspective view showing a state in which the surface mount component 3 is mounted on the wiring board 1 and the leads 4 are connected to the connection electrodes 2 by soldering, and FIG. 4 is an enlarged sectional view of the connection portion C in FIG. is there.

【０００３】図示のように、配線基板１上に設けられた
接続用電極２は、表面実装部品３の接続リード４の幅よ
り大きな幅を有し、はんだペーストを印刷等により接続
用電極２上に供給し、この後、はんだペースト上へ部品
のリード４が来るように表面実装部品を搭載し、リフロ
ー等によってはんだを溶融させ接続を行う方法が一般的
であった。[0003] As shown in the figure, a connection electrode 2 provided on a wiring board 1 has a width larger than the width of a connection lead 4 of a surface mount component 3, and a solder paste is printed on the connection electrode 2 by printing or the like. Then, a surface mount component is mounted so that the lead 4 of the component comes on the solder paste, and the solder is melted by reflow or the like to perform connection.

【０００４】図９はこの接続工程例を示したもので、
（ａ）は配線基板１の接続用電極２上に、はんだペース
ト５ａを印刷した直後の状態、（ｂ）は部品搭載前の経
過時間により、はんだペースト５ａがだれた状態、
（ｃ）は部品を搭載し、リード４をはんだペースト５ａ
中に押し込んだ状態、（ｄ）ははんだ５を溶融して接続
した状態を、それぞれ示している。FIG. 9 shows an example of this connection process.
(A) is a state immediately after the solder paste 5a is printed on the connection electrode 2 of the wiring board 1, (b) is a state where the solder paste 5a is dropped due to an elapsed time before the component mounting,
(C) shows the mounting of the component, and the lead 4 is replaced with the solder paste 5a.
(D) shows a state in which the solder 5 is melted and connected, and FIG.

【０００５】図１０も図９と同様の工程図を示してお
り、隣接する接続用電極２間の間隔は図９と同じである
が接続用電極２の幅をさらに狭くした場合の例である。FIG. 10 also shows a process diagram similar to that of FIG. 9, in which the distance between adjacent connection electrodes 2 is the same as that of FIG. 9, but the width of the connection electrodes 2 is further reduced. .

【０００６】なお、この技術に関連するものとして、例
えば(株)プレスジャーナル発行「サーフェースマウント
テクノロジー９２年夏号（１９９２年６月１日発
行）」、第１０３頁、図９の（ａ）「最適はんだフィレ
ットの設計」の項が挙げられる。As related to this technology, for example, "Surface Mount Technology Summer Issue 92 (published June 1, 1992)", published by Press Journal, page 103, FIG. 9 (a) The section “Designing the optimum solder fillet” is mentioned.

【０００７】[0007]

【発明が解決しようとする課題】従来の技術では、図９
（ｃ）、（ｄ）にその工程例を示したように、部品３の
リード４をはんだペースト５ａ上に実装したとき、はん
だペースト５ａがリード４につぶされ、はんだペースト
５ａが接続用電極２をはみ出してしまい、隣接する部品
リード４間のショートやブリッジの発生原因となってい
た。In the prior art, FIG.
(C) and (d), as shown in the process example, when the lead 4 of the component 3 is mounted on the solder paste 5a, the solder paste 5a is crushed by the lead 4, and the solder paste 5a is And protruded, causing a short circuit or a bridge between adjacent component leads 4.

【０００８】また、接続用電極２上へのはんだペースト
５ａの供給位置ずれやはんだペースト５ａの過多によ
り、はんだペースト５ａのはみ出しは一層多くなり、不
良を促進させる問題があった。[0008] Further, due to a shift in the supply position of the solder paste 5a onto the connection electrode 2 or an excessive amount of the solder paste 5a, the solder paste 5a protrudes much more, and there is a problem of promoting defects.

【０００９】さらに、接続用電極２は絶縁基板１の面よ
りその厚さ分だけ高い位置にあり、はみ出したはんだペ
ースト５ａは接続用電極２の段差により隣の接続用電極
２へ流れ易くなるという問題もあった。今後、導体の細
線化により導体の厚膜化が進むとその傾向はより顕著に
なってくる。また、図１０に示したように図９の接続用
電極２の幅をさらに狭くした例でも同様の問題点があ
る。Further, the connection electrode 2 is located at a position higher than the surface of the insulating substrate 1 by the thickness thereof, and the protruding solder paste 5a is apt to flow to the adjacent connection electrode 2 due to the step of the connection electrode 2. There were also problems. In the future, as the thickness of the conductor increases due to the thinning of the conductor, the tendency will become more remarkable. Also, as shown in FIG. 10, there is a similar problem in the example in which the width of the connection electrode 2 in FIG. 9 is further reduced.

【００１０】したがって、本発明の目的は、上記従来技
術の問題点を解消することにあり、高密度実装に対処し
て表面実装部品のリード４の形状が細く狭ピッチとなっ
た場合においても、はんだ洩れによる短絡不良の発生し
難い改良された表面実装部品搭載用配線基板及び部品搭
載接続方法を提供することにある。Accordingly, an object of the present invention is to solve the above-mentioned problems of the prior art, and even if the shape of the lead 4 of the surface mount component becomes narrow and the pitch becomes narrow due to high density mounting. An object of the present invention is to provide an improved surface mounting component mounting wiring board and a component mounting connection method which are less likely to cause a short circuit failure due to solder leakage.

【００１１】さらには、この接続方法により表面実装部
品が搭載された回路基板及びこの回路基板を用いた電子
装置をも提供することにある。It is still another object of the present invention to provide a circuit board on which surface mounting components are mounted by this connection method, and an electronic device using the circuit board.

【００１２】[0012]

【課題を解決するための手段】上記の課題は、部品リー
ドの下面に接続用電極を配置せず、部品リードの側面に
並列して部品接続用電極を配設することにより解決され
る。以下に具体的な目的達成手段について説明する。The above object can be achieved by disposing a component connecting electrode in parallel with a side surface of a component lead without disposing a connection electrode on the lower surface of the component lead. Hereinafter, specific means for achieving the purpose will be described.

【００１３】（１）配線基板の接続用電極を、表面実装
部品のリードの幅より大きな間隔をあけリードの両側に
並列に短冊状の一組の電極として配設する。すなわち、
一つのリードに対して両側に一組の短冊状の接続電極を
配置することで、はんだペーストをこの短冊状の接続電
極間に供給し、はんだペーストの「だれ」によるはみ出
しを抑制するものである。この短冊状の接続電極にリー
ドをはんだ接続するに際して、仮りにはんだ供給量が多
く、電極からはみ出しそうになったとしてもその場合に
は電極外部に溢れることはなく、リードの長手方向、す
なわち、リードの先端方向及び後端方向にはみ出す構造
（表面張力でリードに付着）となっているので高品質の
はんだ接続が可能である。 (1) The connecting electrodes of the wiring board are arranged as a pair of strip-shaped electrodes in parallel on both sides of the lead with a space larger than the width of the lead of the surface mount component. That is,
By arranging a pair of strip-shaped connection electrodes on both sides for one lead, the solder paste is applied to the strip-shaped connection electrodes.
It is supplied between the poles to suppress the protrusion of the solder paste due to "drip". Leads are connected to this strip-shaped connection electrode.
When soldering the solder with solder,
Even if you are about to protrude from the electrode,
Does not overflow to the outside of the electrode.
That is, a structure that protrudes toward the leading and trailing ends of the lead
(Attached to the lead due to surface tension).
Solder connection is possible.

【００１４】（２）一組の接続用電極間の絶縁基板上に
はんだペーストを供給することにより、はんだペースト
の「だれ」によるはみ出しを抑制するものである。(2) By supplying the solder paste onto the insulating substrate between a pair of connection electrodes, the solder paste is prevented from protruding due to "drip".

【００１５】（３）接続用電極を表面実装部品のリード
接続位置に隣接、並列して配設することで、はんだペー
ストの「だれ」によるはみ出しを抑制するものである。(3) By arranging the connection electrodes adjacent to and in parallel with the lead connection positions of the surface-mounted component, the solder paste is prevented from protruding due to "drip".

【００１６】（４）接続用電極に隣接、並列して配設さ
れたリード接続位置の絶縁基板上にはんだペーストを供
給することにより、はんだペーストの「だれ」によるは
みだしを抑制するものである。(4) The solder paste is supplied onto the insulating substrate at the lead connection position, which is disposed adjacent to and in parallel with the connection electrode, so that the solder paste is prevented from overflowing due to "drip".

【００１７】（５）少なくとも接続用電極とリードとの
両側面間をはんだによって接続することにより、隣接す
る他の接続用電極とのショートやはんだブリッジの発生
を防ぐものである。(5) By connecting at least the both side surfaces of the connection electrode and the lead with solder, a short circuit with another adjacent connection electrode and the occurrence of a solder bridge are prevented.

【００１８】（６）表面実装部品のリード側面と接続用
電極側面及び上面をはんだによって接続することによ
り、隣接する他の接続用電極とのショートやフリッジの
発生を防ぐものである。(6) By connecting the side surfaces of the leads of the surface-mounted component to the side surfaces and the upper surface of the connection electrodes by soldering, short-circuiting and fringing with other adjacent connection electrodes are prevented.

【００１９】（７）表面実装部品のリード側面及び下面
と接続用電極側面とをはんだによって接続することによ
り、隣接する他の接続用電極とのショートやフリッジの
発生を防ぐものである。(7) By connecting the side surfaces and the lower surfaces of the leads of the surface mount component to the side surfaces of the connection electrodes by soldering, short-circuiting and fringing with other adjacent connection electrodes are prevented.

【００２０】（８）表面実装部品のリード側面及び下面
と接続用電極側面及び上面とをはんだによって接続する
ことにより、隣接する他の接続用電極とのショートやフ
リッジの発生を防ぐものである。(8) By connecting the side surfaces and the lower surface of the leads of the surface-mounted component to the side surfaces and the upper surface of the connection electrodes by soldering, short-circuiting with other adjacent connection electrodes and the occurrence of fridges are prevented.

【００２１】（９）接続用部材として、はんだ以外に導
電性接着剤を使用することができる。(9) A conductive adhesive other than solder can be used as the connecting member.

【００２２】以上の目的達成手段を総括すると、上記目
的は、 （１０）絶縁基板上に表面実装部品を搭載し、実装する
接続回路部を形成した配線基板において、前記接続回路
部の接続用電極を、実装される表面実装部品のリード接
続位置に隣接して、前記リード幅より大きな間隔をあけ
て一つのリードに対しその両側に並列に一組配設して成
る表面実装部品搭載用配線基板により、達成される。The above objects can be summarized as follows. (10) In a wiring board on which a surface mounting component is mounted on an insulating substrate and a connection circuit portion to be mounted is formed, a connection electrode of the connection circuit portion is formed. A wiring board for mounting a surface mount component, wherein one set is arranged in parallel on both sides of one lead with an interval larger than the lead width adjacent to the lead connection position of the surface mount component to be mounted. Is achieved by

【００２３】（１１）絶縁基板上に表面実装部品を搭載
し、実装する接続回路部を形成した配線基板において、
前記接続回路部の接続用電極を、実装される表面実装部
品のリード接続位置に隣接して片側に配設して成る表面
実装部品搭載用配線基板によっても、達成される。(11) In a wiring board in which a surface mounting component is mounted on an insulating substrate and a connection circuit portion to be mounted is formed,
This is also achieved by a surface mounting component mounting wiring board in which the connection electrodes of the connection circuit portion are arranged on one side adjacent to the lead connection position of the surface mounting component to be mounted.

【００２４】（１２）上記（１０）記載の表面実装部品
搭載用配線基板の各一組の接続用電極間に、はんだペー
ストを供給する段階と、表面実装部品を搭載し、対応す
る一組の接続用電極間に表面実装部品のリードを位置合
わせして前記はんだペースト中に押し込む段階と、はん
だを溶融して少なくとも前記接続用電極とリードの両側
面間をはんだ接続する段階とを有して成る部品搭載接続
方法によっても、達成される。(12) A step of supplying a solder paste between each pair of connection electrodes of the wiring board for mounting a surface mount component according to the above (10), and a step of mounting the surface mount component and a corresponding set of Aligning the leads of the surface mount component between the connecting electrodes and pushing them into the solder paste, and melting the solder and soldering at least between the both sides of the connecting electrodes and the leads. This is also achieved by the component mounting connection method described above.

【００２５】（１３）上記（１１）記載の表面実装部品
搭載用配線基板の各接続用電極に隣接するリード接続位
置に、はんだペーストを供給する段階と、表面実装部品
を搭載し、対応する接続用電極に隣接して表面実装部品
のリードを位置合わせして前記はんだペースト中に押し
込む段階と、はんだを溶融して少なくとも前記接続用電
極とリードの両側面間をはんだ接続する段階とを有して
成る部品搭載接続方法によっても、達成される。(13) A step of supplying a solder paste to a lead connection position adjacent to each connection electrode of the wiring board for mounting a surface mount component according to the above (11); Aligning the lead of the surface mount component adjacent to the electrode and pressing it into the solder paste, and melting the solder to solder-connect at least between the both sides of the connection electrode and the lead. This is also achieved by the component mounting connection method.

【００２６】（１４）上記（１２）、（１３）何れか記
載の部品搭載接続方法により表面実装部品を配線基板に
搭載接続して成る回路基板によりっても、達成される。(14) This is also achieved by a circuit board formed by mounting and connecting a surface mounting component to a wiring board by the component mounting and connection method according to any one of the above (12) and (13).

【００２７】[0027]

【作用】本発明によれば、配線基板の接続用電極と表面
実装部品のリードとの接続関係が、従来のように重なら
ずに互いに同一平面上に並列状態で配列し、相互の少な
くとも側面同志がはんだ接続される構成を有しているた
め、接続工程時のはんだペーストの形成状態及びその後
のはんだ接続状態が良好で、信頼性の高い接続を実現し
ている。According to the present invention, the connection relationship between the connection electrode of the wiring board and the lead of the surface mount component is arranged in a parallel state on the same plane without overlapping as in the prior art, Since the members have a configuration in which they are connected by solder, the state of formation of the solder paste during the connection step and the state of subsequent solder connection are good, and highly reliable connection is realized.

【００２８】特に好ましい一つのリードに対して一組の
接続用電極を形成した配線基板では、リード接続位置の
両側の電極により形成された凹部に、はんだペーストが
印刷されるため、その印刷性は良好で、隣接する電極へ
のはんだペーストの「だれ」によるはみ出しを接続用電
極が抑制し、安定したはんだペーストの印刷を可能とと
している。In a wiring board in which a set of connection electrodes is formed for one lead particularly preferably, the solder paste is printed in the recess formed by the electrodes on both sides of the lead connection position. The connection electrode suppresses the protrusion of the solder paste to the adjacent electrode due to the "drip", and enables stable printing of the solder paste.

【００２９】しかも、はんだペースト印刷が多少ずれて
もリフロー時に溶融したはんだは、リードの片側又は両
側に配設された接続用電極の凹部へ流れ接続用電極から
はみ出すことはない。Moreover, even if the solder paste printing is slightly displaced, the solder melted during the reflow flows into the recess of the connection electrode provided on one or both sides of the lead and does not run off the connection electrode.

【００３０】また、表面実装部品のリードを実装した時
のはんだが、接続部からはみ出た場合でも、その量はリ
ードの片側又は両側の接続用電極がはんだのはみ出しを
防ぐため、従来に比べてはるかに少なくなる。Further, even when the solder at the time of mounting the lead of the surface mount component protrudes from the connection portion, the amount is smaller than that of the conventional one because the connection electrodes on one or both sides of the lead prevent the solder from protruding. Much less.

【００３１】はんだのはみ出しがないため、リフロー時
に溶融したはんだが短絡する不良が防止され、歩留まり
向上、高信頼のはんだ接続が実現できる。したがって、
高密度実装に対処して、リードの形状が細く、狭ピッチ
となった場合でも、はんだによる短絡を発生し易い表面
実装部品の接続を事故なしで良好に行うことが可能とな
る。Since there is no protrusion of the solder, it is possible to prevent a defect that the molten solder is short-circuited at the time of reflow, thereby improving the yield and realizing a highly reliable solder connection. Therefore,
Even if the lead shape is narrow and the pitch is narrow in response to high-density mounting, it becomes possible to connect surface-mounted components that are liable to cause a short circuit due to solder without any accident.

【００３２】[0032]

【実施例】以下、本発明の一実施例を図面を用いて説明
する。 〈実施例１〉図１は、本発明の回路基板１及びそれを用
いた表面実装部品３の実装の一例を示した斜視図であ
り、図２は図１Ａ−Ａ’の断面における要部Ｂの拡大断
面図である。また、この実装の具体的な製造フローを図
５に示す。An embodiment of the present invention will be described below with reference to the drawings. <Embodiment 1> FIG. 1 is a perspective view showing an example of mounting a circuit board 1 of the present invention and a surface mounting component 3 using the same, and FIG. 2 is a main part B in a cross section of FIG. 1A-A '. It is an expanded sectional view of. FIG. 5 shows a specific manufacturing flow of this mounting.

【００３３】図１、図２に示したように、回路基板１に
は、配線用電極２が表面実装部品３の搭載領域面の外周
部に配設されており、各配線用電極２は表面実装部品の
リード４がその中心部に介挿される間隔を有して一組の
電極２ａ、２ｂから構成されている。図２は、この様子
を具体的に示している。同図の５は、はんだペースト５
ａを溶融接続したはんだである。リード４の両側に配設
された一組の電極２ａ、２ｂが、はんだペースト５ａを
印刷した後のだれ防止と共に、接続時にはんだ５のダム
の役割を果たして、電極２の外部に余分なはんだが洩れ
出さないようになっている。As shown in FIGS. 1 and 2, wiring electrodes 2 are provided on the circuit board 1 at the outer periphery of the mounting area surface of the surface mount component 3, and each wiring electrode 2 The lead 4 of the mounted component is constituted by a pair of electrodes 2a, 2b with an interval inserted at the center thereof. FIG. 2 specifically shows this state. 5 in the figure is a solder paste 5
a is a fusion-connected solder. A pair of electrodes 2a, 2b disposed on both sides of the lead 4 prevent the dripping after printing the solder paste 5a, and at the same time, serve as a dam of the solder 5 at the time of connection. It does not leak out.

【００３４】以下、図５の工程図にしたがって表面実装
部品３を回路基板１に実装する一例を説明する。図５
（ａ）は、配線基板上の電極間にリード接続用のはんだ
ペーストパターンを形成した直後の状態を示した断面工
程図である。すなわち、セラミックやガラスエポキシ等
からなる絶縁基板上にＡｇＰｄやＣｕ等の導体からなる
配線（図中省略）が設けられた配線基板１（ＲｕＯ2や
カーボン等からなる抵抗体を含む場合もある）に、導体
からなる接続用電極２を表面実装部品３のリード４幅よ
りやや大きな間隔で一組の電極２ａ、２ｂとして配置
し、表面実装部品３のリード４が搭載されるこの一組の
電極間へ、はんだペースト５ａを印刷等により供給した
直後の状態を示している。Hereinafter, an example of mounting the surface mount component 3 on the circuit board 1 according to the process chart of FIG. 5 will be described. FIG.
(A) is a sectional process view showing a state immediately after a solder paste pattern for lead connection is formed between electrodes on a wiring board. That is, a wiring board 1 in which a wiring (not shown) made of a conductor such as AgPd or Cu is provided on an insulating substrate made of ceramic, glass epoxy, or the like (sometimes includes a resistor made of RuO 2 , carbon, or the like) The connecting electrodes 2 made of a conductor are arranged as a set of electrodes 2a and 2b at intervals slightly larger than the width of the leads 4 of the surface mount component 3, and the set of electrodes on which the leads 4 of the surface mount component 3 are mounted. The state immediately after supplying the solder paste 5a by printing or the like is shown.

【００３５】図５（ｂ）は、はんだペースト５ａを印刷
した後の表面実装部品３を搭載する前の状態を示してい
る。すなわち、印刷直後のはんだペースト５ａは、図５
（ａ）に示したように所期の形状を維持しているが、は
んだ接続時の時間の経過と共に図５（ｂ）に示したよう
にだれてくる。しかし、本発明においては両側の接続用
電極２ａ、２ｂがこれを抑制する。FIG. 5B shows a state before mounting the surface mount component 3 after printing the solder paste 5a. That is, the solder paste 5a immediately after printing is the same as that in FIG.
Although the expected shape is maintained as shown in FIG. 5A, as shown in FIG. However, in the present invention, the connection electrodes 2a and 2b on both sides suppress this.

【００３６】図２（ｃ）は、表面実装部品３を搭載した
状態を示している。図示のように、はんだペースト５ａ
中にリード４を押し込むことにより、はんだペースト５
ａはリード４の両側に盛り上がるものの接続用電極２
ａ、２ｂを越えて隣接する電極２´間に洩れ出すことは
ない。FIG. 2C shows a state where the surface mount component 3 is mounted. As shown, the solder paste 5a
By pushing the lead 4 into the solder paste 5
a is the connection electrode 2 although it swells on both sides of the lead 4
There is no leakage between adjacent electrodes 2 'beyond a and 2b.

【００３７】図５（ｄ）は、図５（ｃ）の状態からリフ
ロー等により、はんだ５を加熱溶融させ、表面実装部品
３のリード４を接続用電極２に接続した状態を示してい
る。図示のように接続時には、はんだペースト４ａ中の
フラックス等が分解除去され体積減少が生じる上に、は
んだの表面張力で、はんだ５はリード４と電極２とを良
好に接続し、はんだ洩れによる短絡がなく信頼性の高い
はんだ接続を実現している。なお、図５（ｄ）におい
て、リード４と配線基板１との間に隙間が存在するが、
これは図５（ｃ）に示したように部品搭載時にリード４
を配線基板１から少し浮かした状態で位置決めしたこと
による。FIG. 5D shows a state in which the solder 5 is heated and melted by reflow or the like from the state of FIG. 5C and the leads 4 of the surface mount component 3 are connected to the connection electrodes 2. As shown in the drawing, at the time of connection, the flux and the like in the solder paste 4a are decomposed and removed to reduce the volume. In addition, due to the surface tension of the solder, the solder 5 satisfactorily connects the lead 4 and the electrode 2 and short-circuits due to solder leakage. And realizes highly reliable solder connection. In FIG. 5D, there is a gap between the lead 4 and the wiring board 1,
As shown in FIG.
Is positioned while slightly floating from the wiring board 1.

【００３８】〈実施例２〉図６は、実施例１における図
２の接続用電極２を、表面実装部品３のリード４の片側
にのみ寄せて配設した他の実施例となる工程断面図を示
したものである。この場合、接続用電極２は一つのリー
ド４に対して一つであり、図２の一つのリード４に対し
て両側に一組の電極２ａ、２ｂを配設した構成とは異な
る。<Embodiment 2> FIG. 6 is a process sectional view showing another embodiment in which the connection electrode 2 of FIG. 2 in the embodiment 1 is arranged only on one side of the lead 4 of the surface mount component 3. It is shown. In this case, one connection electrode 2 is provided for one lead 4, which is different from the configuration in which a pair of electrodes 2 a and 2 b are provided on both sides of one lead 4 in FIG.

【００３９】すなわち、図６（ａ）は、はんだペースト
５ａを接続用電極２に隣接して印刷した直後の状態、図
６（ｂ）は、はんだペースト５ａがその後の時間経過に
よりだれてきた状態、図６（ｃ）は、表面実装部品３を
搭載し、リード４をペースト５ａ中に押し込んだ状態、
図６（ｄ）は、はんだ５を加熱溶融して接続した状態
を、それぞれ示している。FIG. 6A shows a state immediately after the solder paste 5a is printed adjacent to the connection electrode 2, and FIG. 6B shows a state in which the solder paste 5a has dropped over time. FIG. 6C shows a state in which the surface mount component 3 is mounted and the lead 4 is pressed into the paste 5a.
FIG. 6D shows a state in which the solder 5 is connected by heating and melting.

【００４０】図６（ｂ）に示したように、リード４の片
側に電極２が無い方については、はんだペースト５ａの
だれの抑制ができないが、隣接する他の接続用電極２´
との間隔が離れていることと、電極による段差が無いこ
とにより、はんだ洩れ出しによる短絡はなく、図６
（ｄ）に示したように、溶融したはんだ５は表面張力に
よりリード４及び電極２に引き寄せられ、良好なはんだ
接続が実現する。As shown in FIG. 6 (b), when the electrode 4 is not provided on one side of the lead 4, the solder paste 5a cannot be prevented from dripping, but the other adjacent connection electrode 2 'can be prevented.
6 and there are no steps due to the electrodes, there is no short circuit due to solder leakage, and FIG.
As shown in (d), the molten solder 5 is attracted to the lead 4 and the electrode 2 by the surface tension, and a good solder connection is realized.

【００４１】〈実施例３〉以下の図７、図８は、接続用
電極２の構成と、はんだ５の接続状態の組合せについて
の変形例を示した要部断面図である。<Embodiment 3> FIGS. 7 and 8 are cross-sectional views of essential parts showing a modification of the combination of the configuration of the connection electrode 2 and the connection state of the solder 5.

【００４２】すなわち、図７（ａ）は部品搭載時に表面
実装部品のリード４を配線基板１に密着させて位置決め
し、接続用電極２とリード４の間にのみはんだを供給
し、両者の側面同志のみをはんだ５で接続した場合の断
面図である。なお、図８（ａ）は実施例２と同様に電極
２を片側のみとした場合の例である。That is, FIG. 7 (a) shows the position of the lead 4 of the surface mount component in close contact with the wiring board 1 at the time of component mounting, solder is supplied only between the connection electrode 2 and the lead 4, FIG. 6 is a cross-sectional view when only the competitors are connected by solder 5. FIG. 8A shows an example in which the electrode 2 has only one side, as in the second embodiment.

【００４３】図７（ｂ）は実施例３と同様に部品搭載時
に表面実装部品のリード４を配線基板１に密着させて位
置決めし、接続用電極２と表面実装部品リード４の間と
接続用電極２上の一部にまで延在させてはんだ５を供給
し接続した場合の断面図である。なお、図８（ｂ）は電
極２を片側のみとした場合の例である。FIG. 7 (b) shows the position of the lead 4 of the surface mount component in close contact with the wiring board 1 at the time of component mounting as in the third embodiment, and the connection between the connection electrode 2 and the lead 4 of the surface mount component. FIG. 5 is a cross-sectional view of a case where solder 5 is supplied and connected so as to extend to a part on an electrode 2. FIG. 8B shows an example in which the electrode 2 has only one side.

【００４４】図７（ｃ）は実施例１、２と同様に部品搭
載時に表面実装部品のリード４を配線基板１から少し浮
かせて位置決めし、接続用電極２と表面実装部品リード
４との間とリード４の下面にはんだを供給し接続した場
合の断面図である。なお、図８（ｃ）は電極２を片側の
みとした場合であり、接続用電極２と反対側のリード４
の側面にもはんだが付いている場合を示しているが、こ
のはんだ５は無くともよい。FIG. 7C shows the position of the lead 4 of the surface-mounted component when the component is mounted, slightly floating from the wiring board 1 as in the first and second embodiments, and the position between the connection electrode 2 and the surface-mounted component lead 4. FIG. 4 is a cross-sectional view when solder is supplied and connected to the lower surfaces of the leads 4 and 4. FIG. 8C shows a case where the electrode 2 is provided on only one side, and the lead 4 on the opposite side to the connection electrode 2 is used.
Although the case where solder is also attached to the side surface is shown, the solder 5 may be omitted.

【００４５】図７（ｄ）は接実施例１、２と同様に部品
搭載時に表面実装部品のリード４を配線基板１から少し
浮かせて位置決めし、接続用電極２と表面実装部品リー
ド４との間、さらには接続用電極２上の一部にまで延在
させると共にリード４下面に、はんだ５を供給した場合
の断面図である。なお、図８（ｄ）は電極２を片側のみ
とした場合であり、接続用電極２と反対側のリード４の
側面にもはんだが付いている場合を示しているが、この
はんだ５は無くともよい。FIG. 7D shows the position of the lead 4 of the surface-mounted component when the component is mounted, slightly floating from the wiring board 1 and positioning between the connection electrode 2 and the surface-mounted component lead 4 as in the first and second embodiments. FIG. 4 is a cross-sectional view of a case where solder 5 is supplied to the lower surface of the lead 4 while extending to a part on the connection electrode 2. FIG. 8 (d) shows a case where the electrode 2 is only on one side, and shows a case where solder is also attached to the side surface of the lead 4 opposite to the connection electrode 2, but this solder 5 is not provided. May be.

【００４６】この他に表面実装部品のリード４上にはん
だが存在してもよく、少なくとも接続用電極２と表面実
装部品のリード４の間の側面同志がはんだで接続されて
いることである。In addition, solder may be present on the lead 4 of the surface mount component, and at least the side surfaces between the connection electrode 2 and the lead 4 of the surface mount component are connected by solder.

【００４７】また、表面実装部品のリード４と接続用電
極２との接続には、はんだ以外の導電性接着剤を用いる
こともできる。For connection between the lead 4 of the surface mount component and the connection electrode 2, a conductive adhesive other than solder can be used.

【００４８】以上の方法を用いて表面実装部品を接続し
回路基板とすることにより、回路基板及び装置を実現で
きる。The circuit board and the device can be realized by connecting the surface mount components to form a circuit board using the above method.

【００４９】[0049]

【発明の効果】以上詳述したように、本発明により所期
の目的を達成することができた。すなわち、配線基板の
接続用電極への表面実装部品のリード接続は、少なくと
もこれら電極、リード両者の側面間をはんだ接続するも
のであるため、はんだペースト印刷時及びその後のはん
だリフロー等の溶融接続時においても、接続用電極がは
んだペーストのはみ出しを抑制し安定したはんだペース
ト印刷及びその後のはんだ接続が可能となり、部品実装
時の歩留まり向上と高信頼はんだ接続が実現できるとい
う効果がある。As described in detail above, the intended object has been achieved by the present invention. That is, since the lead connection of the surface mount component to the connection electrode of the wiring board is performed by solder connection between at least the side surfaces of both the electrode and the lead, the solder connection is performed during solder paste printing and subsequent fusion connection such as solder reflow. Also in this case, the connection electrode suppresses the solder paste from flowing out, so that stable solder paste printing and subsequent solder connection can be performed, and there is an effect that the yield at the time of component mounting can be improved and highly reliable solder connection can be realized.

【００５０】特に高密度実装に対処するためには、リー
ドの形状が細く、かつ狭ピッチとなるため、本発明の効
果を十分に発揮し、はんだによる短絡が発生し易い表面
実装部品の接続を良好に行うことが可能となる効果があ
る。In particular, in order to cope with high-density mounting, the shape of the lead is small and the pitch is narrow, so that the effects of the present invention are sufficiently exhibited and the connection of the surface mounting component in which short-circuiting due to solder is likely to occur. There is an effect that it can be performed well.

【００５１】配線基板の接続用電極と搭載部品リードと
は側面同志が接続されるため、配線基板の上から直接接
続部の外観が見えるので、外観検査を容易に行える効果
もある。Since the connection electrodes of the wiring board and the mounting component leads are connected to each other on the side surface, the appearance of the connection portion can be directly seen from above the wiring board, so that the appearance inspection can be easily performed.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の一実施例を示す斜視図。FIG. 1 is a perspective view showing one embodiment of the present invention.

【図２】同じく図１Ａ−Ａ’断面Ｂ部の拡大図。FIG. 2 is an enlarged view of a section B in FIG. 1A-A ';

【図３】従来の表面実装部品の接続例を示す斜視図。FIG. 3 is a perspective view showing a connection example of a conventional surface mount component.

【図４】同じく図３Ａ−Ａ’断面Ｃ部の拡大図。FIG. 4 is an enlarged view of a section C in FIG. 3A-A ′.

【図５】本発明の一実施例の製造工程を示す断面図。FIG. 5 is a sectional view showing a manufacturing process according to one embodiment of the present invention.

【図６】同じく他の実施例の製造工程を示す断面図。FIG. 6 is a sectional view showing a manufacturing process of another embodiment.

【図７】同じく本発明により接続された、表面実装部品
のリード接続部の断面図。FIG. 7 is a cross-sectional view of a lead connection portion of a surface mount component, also connected according to the present invention.

【図８】同じく本発明により接続された、表面実装部品
のリード接続部の断面図。FIG. 8 is a cross-sectional view of a lead connection portion of a surface mount component, also connected according to the present invention.

【図９】従来の表面実装部品接続の製造工程を示す断面
図。FIG. 9 is a sectional view showing a manufacturing process of a conventional surface mount component connection.

【図１０】同じく電極幅を変えた場合の製造工程を示す
断面図。FIG. 10 is a sectional view showing a manufacturing process when the electrode width is changed.

【符号の説明】[Explanation of symbols]

１…配線基板、 ２…接続電極、 ３
…表面実装部品、４…表面実装部品のリード、 ５…は
んだ、 ５ａ…はんだペースト。DESCRIPTION OF SYMBOLS 1 ... Wiring board 2 ... Connection electrode 3
... Surface mount parts, 4 ... Lead of surface mount parts, 5 ... Solder, 5a ... Solder paste.

フロントページの続き (72)発明者 仲山 浩偉 神奈川県横浜市戸塚区戸塚町216番地 株式会社日立製作所情報通信事業部内 (56)参考文献 特開 平４−44292（ＪＰ，Ａ) 特開 昭50−132487（ＪＰ，Ａ) 特開 平２−127095（ＪＰ，Ａ) 実開 昭60−176577（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 3/34 Continuation of the front page (72) Inventor Hiroi Nakayama 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Inside the Information and Communication Business Division, Hitachi, Ltd. (56) References JP-A-4-44292 (JP, A) JP-A Sho50 -132487 (JP, A) JP-A-2-127095 (JP, A) Japanese Utility Model Application Sho 60-176577 (JP, U) (58) Fields investigated (Int. Cl. 7 , DB name) H05K 3/34

Claims (4)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】絶縁基板上に表面実装部品を搭載し、実装
する接続回路部を形成した配線基板において、前記接続
回路部の接続用電極を、実装される表面実装部品のリー
ド接続位置に隣接して、前記リード幅より大きな間隔を
あけて一つのリードに対しその両側に並列に一組の短冊
状電極として配設して成る表面実装部品搭載用配線基
板。1. A wiring board on which a surface mount component is mounted on an insulating substrate and a connection circuit portion to be mounted is formed, wherein a connection electrode of the connection circuit portion is adjacent to a lead connection position of the surface mount component to be mounted. And a pair of strips arranged in parallel on both sides of one lead with an interval larger than the lead width.
A wiring board for mounting surface mount components, which is provided as a shape electrode . 【請求項２】請求項１記載の表面実装部品搭載用配線基
板の各一組の接続用電極間に、はんだペーストもしくは
導電性接着剤を供給する段階と、表面実装部品を搭載
し、対応する一組の接続用電極間に表面実装部品のリー
ドを位置合わせして前記はんだペーストもしくは導電性
接着剤中に押し込む段階と、はんだを溶融して少なくと
も前記接続用電極とリードの両側面間をはんだ接続する
段階とを有して成る部品搭載接続方法。2. A solder paste or a solder paste between each pair of connection electrodes of the wiring board for mounting a surface mount component according to claim 1.
Supplying the conductive adhesive , mounting the surface-mounted component, aligning the lead of the surface-mounted component between a pair of corresponding connection electrodes, and applying the solder paste or the conductive paste .
A component mounting / connecting method, comprising the steps of: pushing into an adhesive ; and melting the solder to solder-connect at least between the connection electrodes and both side surfaces of the lead. 【請求項３】表面実装部品のリードを位置合わせして前
記はんだペーストもしくは導電性接着剤中に押し込む段
階において、リードを配線基板からわずかに浮上させた
状態で位置合わせし、はんだ接続する段階において、少
なくとも前記接続用電極とリードの両側面間及びリード
下面とをはんだ接続する段階として成る請求項２記載の
部品搭載接続方法。3. A step of aligning the leads of the surface mount component and pressing the leads into the solder paste or the conductive adhesive, in the step of aligning the leads while slightly floating from the wiring board, and connecting the leads by soldering. 3. The component mounting connection method according to claim 2 , further comprising the step of soldering at least the connection electrode and both sides of the lead and the lower surface of the lead. 【請求項４】表面実装部品のリードを位置合わせして前
記はんだペーストもしくは導電性接着剤中に押し込む段
階において、リードを配線基板に密着させた状態で位置
合わせし、はんだ接続する段階において、少なくとも前
記接続用電極とリードの両側面間とをはんだ接続する段
階として成る請求項２記載の部品搭載接続方法。4. The method according to claim 1, wherein, in the step of aligning the leads of the surface mount component and pressing the leads into the solder paste or conductive adhesive , at least the step of aligning the leads in close contact with the wiring board and performing the solder connection 3. The component mounting connection method according to claim 2, wherein the step of soldering the connection electrode and both sides of the lead is performed.
JP05119788A 1993-05-21 1993-05-21 Wiring board for mounting surface mount components and component mounting connection method Expired - Fee Related JP3080512B2 (en)

Priority Applications (1)

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JP05119788A JP3080512B2 (en) 1993-05-21 1993-05-21 Wiring board for mounting surface mount components and component mounting connection method

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Application Number Priority Date Filing Date Title
JP05119788A JP3080512B2 (en) 1993-05-21 1993-05-21 Wiring board for mounting surface mount components and component mounting connection method

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JPH06334317A JPH06334317A (en) 1994-12-02
JP3080512B2 true JP3080512B2 (en) 2000-08-28

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JP5153574B2 (en) * 2007-11-05 2013-02-27 パナソニック株式会社 Mounting structure

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JPH06334317A (en) 1994-12-02

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