JPH11289154A - Printed board with printed hole for applying adhesive - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent an adhesive applied to a substrate from becoming insufficient at the four corners of bare chip parts by extending printed holes formed on a printed board toward the four corners of the parts so that the adhesive may be extended towards the four corners of the parts. SOLUTION: A printed hole which is extended toward the four corners of a printed board is formed on the printed board. Although an adhesive 3 applied to a substrate is extended from the periphery of bare chip parts 1 when the parts 1 is pressed against the substrate 2 (a), the extended adhesive 3a spreads to the four corners of the parts 1 (b) due to the printed hole. Since the adhesive 3 is kept in advance near the four corners of the parts 1, the extended sections of the adhesive 3 can be formed at the four corners of the parts 1 when the parts 1 are pressed against the substrate 2 at the time of mounting the parts 1 on the substrate 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for applying an adhesive, which is used for applying an adhesive filling between a bare chip and a substrate to a substrate when mounting and fixing the bare chip component on the substrate. And printing holes provided in the printing plate.

[0002]

2. Description of the Related Art When mounting bare chip components on a substrate,
The gap between the bare chip component and the substrate is filled with an adhesive.

One method of filling the adhesive is to use a printing plate provided with a printing hole for applying the adhesive to the substrate.

A printing plate provided with a printing hole for applying an adhesive to a substrate based on the prior art will be described with reference to FIGS. 7 to 10. FIG.

FIG. 7 shows an outline of bare chip component mounting based on the prior art. The bare chip component 1 is mounted by pressing on the region 1a of the bare chip component set on the substrate 2.
At this time, a contact portion (not shown) provided on the back surface of the bare chip component 1 comes into contact with the substrate electrode 2a to achieve electrical conduction.

An adhesive 53 applied in advance is provided at the center of the area 1a of the bare chip component. The adhesive 53 is spread over the entire area 1a of the bare chip component by pressing the bare chip component 1. Bonding is performed.

The application of the adhesive will be described with reference to FIG. After a printing plate 54 is applied to the substrate 2 and a printing hole 55 formed in the printing plate 54 is filled with an adhesive 53, a predetermined amount of the adhesive 53 is removed by removing the printing plate 54. Painted on. Note that the adhesive 53 is not applied to the substrate electrode 2a provided on the substrate 2 at the time of application.

Referring to FIG. 9, the step of applying the adhesive will be described. As shown in FIG. 9A, the printing plate 5 applied to the substrate 2
The adhesive 53 is filled in the print hole 55 of No. 4.

As shown in FIG. 9B, when the printing plate 54 applied to the substrate 2 is removed, the adhesive 5 applied to the substrate 2 is removed.
3 remains at a predetermined position on the substrate 2.

As shown in FIG. 9C, the bare chip part 1 is placed at a predetermined position on the substrate 2 and pressed, so that the applied adhesive 53 causes the gap between the substrate 2 and the bare chip part 1 to be pressed. And a part thereof protrudes from the bare chip component region 1a (see FIG. 7) to form an adhesive 53a attached to the peripheral end surface of the bare chip component 1.

The bare chip component 1 is provided on the substrate 2
And the adhesive 53a attached to the peripheral end surface of the bare chip component 1 to realize a fixed state having heat resistance and impact resistance.

Referring to FIG. 10, the state of the bare chip component 1 fixed by an adhesive will be described. As shown in FIG. 10A, the adhesive 53 applied to the substrate 2 is
As shown in the figure, the bare chip component 1 is fixed from the side surface by the adhesive 53a which has protruded to the periphery by the pressing of the bare chip component 1.
The four corners do not exhibit sufficient spread, and the adhesive 53a may be insufficient at the four corners.

[0013]

As described above, the mounting of bare chip components according to the prior art has the following problems.

When the adhesive applied to the substrate is adhered to the periphery of the mounted bare chip component by extruding the adhesive, the adhesive may not be sufficiently extruded particularly at the four corners of the bare chip component.

As described above, if the adhesive does not protrude at the four corners of the bare chip component, the adhesion of the bare chip component by the adhesive decreases.

Further, if the adhesive does not protrude sufficiently at the four corners of the bare chip component, the gap between the substrate and the bare chip component is exposed, so that it is not possible to sufficiently prevent the invasion of the solvent in a later process, and the aging is deteriorated. There is a danger that conduction failure may occur due to this.

[0017]

In order to solve the above problems, the present invention employs the following means.

The shape of the adhesive applied to the substrate is extended so as to extend toward the four corners of the bare chip component.
The shape of the printing holes provided in the printing plate is a shape extending toward the four corners.

By taking this measure, when the adhesive is spread by the pressing of the bare chip component, an effect is obtained that the adhesive easily reaches the entire area of the bare chip component.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention takes the following forms.

1) The printing holes provided on the printing plate for applying the adhesive to the substrate are holes extending toward the four corners of the bare chip component mounted on the substrate.

2) Further, the printing holes provided in the printing plate are provided with small hole-shaped printing holes near the respective tips of the holes extending toward the four corners of the bare chip component mounted on the substrate. Shape.

3) Alternatively, the printing holes provided in the printing plate have bulges at the respective tips of the holes extending toward the four corners of the bare chip component mounted on the substrate.

By adopting this form, the bare chip component mounted on the substrate has an effect of providing an adhesive in the vicinity of its four corners before pressing.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A representative embodiment according to the present invention will be described with reference to FIGS.

FIGS. 1 and 2 show one representative embodiment according to the present invention. That is, as shown in FIG. 2, the printing plate 4 is provided with printing holes 5 extending in four corners. FIG. 1A shows the shape of the adhesive 3 applied to the substrate 2 by the printing holes 5 described above.

Further, as shown in FIG. 1 (b), the adhesive 3 protrudes from the periphery of the bare chip component 1 by being pressed by the bare chip component 1, but the adhesive that has protruded also at four corners of the bare chip component 1 Agent 3a
Go around.

FIGS. 3 and 4 show another representative embodiment of the present invention. That is, as shown in FIG. 4, the printing plate 14 is provided with a printing hole 15 extending in four corners and a printing hole 15b near the tip of each printing hole. FIG. 3A shows the shape of the adhesive 13 applied to the substrate 2 by the printing holes 15 and the printing holes 15b.

Further, as shown in FIG. 3 (b), the adhesive 13 protrudes from the periphery of the bare chip component 1 by being pressed by the bare chip component 1, but the adhesive that protrudes also at the four corners of the bare chip component 1 Agent 1
3a is widespread.

FIGS. 5 and 6 show another representative embodiment of the present invention. That is, as shown in FIG. 6, the printing plate 24 is provided with a printing hole 25 extending in four corners and having a bulge at its tip. FIG. 5A shows the shape of the adhesive 23 applied to the substrate 2 by the printing holes 25.

Further, as shown in FIG. 5B, the adhesive 23 protrudes from the periphery of the bare chip component 1 by being pressed by the bare chip component 1, but the protruding adhesive also extends at the four corners of the bare chip component 1. Agent 2
3a is widespread.

[0032]

According to the present invention, the following effects can be expected.

1) The printing holes provided in the printing plate for applying the adhesive to the substrate are holes extending toward the four corners of the bare chip component mounted on the substrate.

2) Further, the printing holes provided in the printing plate are provided with small hole-shaped printing holes near the respective tips of the holes extending toward the four corners of the bare chip component mounted on the substrate. Shape.

3) Alternatively, the printing holes provided in the printing plate have bulges at the respective tips of the holes extending toward the four corners of the bare chip component mounted on the substrate.

By taking this measure, the bare chip component mounted on the board is provided with an adhesive in the vicinity of its four corners when pressed, so that the bare chip component mounted on the board is also provided with adhesive at the four corners. This has the effect that a protruding portion can be formed.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing the principle of the present invention.

FIG. 2 is an explanatory view showing the principle of the present invention.

FIG. 3 is an explanatory view showing the principle of the present invention.

FIG. 4 is an explanatory view showing the principle of the present invention.

FIG. 5 is an explanatory view showing the principle of the present invention.

FIG. 6 is an explanatory view showing the principle of the present invention.

FIG. 7 is an explanatory diagram showing the principle of a conventional technique.

FIG. 8 is an explanatory view showing the principle of a conventional technique.

FIG. 9 is an explanatory diagram showing the principle of a conventional technique.

FIG. 10 is an explanatory diagram showing the principle of a conventional technique.

[Explanation of symbols]

1: bare chip component 1a: area of bare chip component 2: substrate 3, 3a, 13, 13a, 13b, 23, 23a: adhesive 4, 14, 24: printing plate 5, 15, 15b, 25: printing hole

Claims (3)

[Claims] 1. A printing plate having a printing hole for applying an adhesive for applying an adhesive for fixing a bare chip component (1) to a substrate (2), wherein the printing plate extends toward four corners of the bare chip component (1). A printing plate having printing holes for applying an adhesive, characterized in that the printing plate has printing holes (5) having a predetermined shape. 2. A printing plate having a printing hole for applying an adhesive, wherein a small hole is formed near a tip of a printing hole (15) extending toward four corners of the bare chip component (1). The printing plate having a printing hole for applying an adhesive according to claim 1, characterized in that the printing plate has a printing hole (15b). 3. A printing plate having a printing hole for applying an adhesive, wherein a printing hole (25) having a bulge at a tip extending toward four corners of the bare chip component (1) is provided. A printing plate having a printing hole for applying an adhesive according to claim 1.