JP2001094266A - Manufacturing equipment for multilayer wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simplify manufacturing processes and improve an alignment accuracy for an internal and an external layer of a multilayer wiring board. SOLUTION: The manufacturing equipment of a multilayer wiring board wherein a photo mask 20 formed with an original drawing of a circuit pattern, and a multilayer wiring board 31 provided with a photosensitive external layer 33 and formed with an internal layer target mark 32 are closely adhered to each other to form the circuit pattern on the external layer 33. The photo mask 20 is formed with a mask-side target mark 21 corresponding to the internal layer target mark 32, and see-through means (15, 16, 17) which simultaneously detects the internal layer target mark 32 and the mask-side target mark 22 is installed. Based on the output of the see-through means, the photo mask 20 and the multilayer wiring board 31 are aligned with each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing a multilayer wiring board for forming a circuit pattern on an outer layer portion of a multilayer wiring board, and more particularly, to an alignment between a multilayer wiring board having an inner layer target mark and a photomask. The present invention relates to an apparatus for manufacturing a multilayer wiring board with an improved method.

[0002]

2. Description of the Related Art FIG. 3A is a process chart showing a conventional method for manufacturing a multilayer wiring board. First, a multi-layer press substrate 41 on which an inner layer target mark 42 is formed is manufactured (FIG. 3 (a1)). The inner layer target mark 42 of the multi-layer press substrate 41 is detected by X-ray fluoroscopy, and a guide for the next step is formed. A hole 43 is drilled [FIG. 3 (a2)], and further, end face processing is performed [FIG. 3 (a3)].

The next step is to process via holes and photomask guide holes. Pins are passed through the guide holes 43, and a plurality of substrates are simultaneously used for a plurality of via holes.
Drill holes 44 for corner photomask guides [FIG.
(A4)]. Then, the plating process of the hole 44 is performed.

Further, a photosensitive laminate film 45 is attached [FIG. 3 (a5)], and the photomask 50 is aligned with the guide holes 43 [FIG. 3 (a)].
6)]. Then, exposure [FIG. 3 (a7)], development [FIG.
(A8)] and etching [FIG. 3 (a9)], the circuit pattern 47 having a shape corresponding to the unexposed portion 46 is obtained.
Is completed.

[0005] In a multilayer wiring board by the build-up method, via hole drilling can be performed at the time of laminating the inner layers (at the time of forming conduction between upper and lower circuit patterns).
For this reason, in order to form a circuit pattern on the outer layer, the target mark of the land formed on the inner layer is detected by X-ray fluoroscopy, drill guide drilling is performed, and alignment of the photomask with respect to the guide hole is performed. And can be exposed.

[0006]

However, in the above-mentioned prior art, since a secondary target called a guide hole is used in the alignment step, there is a problem that the alignment accuracy of the inner and outer layers of the multilayer wiring board is poor. there were. Further, the manufacturing process is complicated, such as a guide hole processing step and a positioning step between the photomask and the multilayer wiring board using the guide hole.

An object of the present invention is to solve the above-mentioned problems,
An object of the present invention is to provide a multilayer wiring board manufacturing apparatus that can simplify the manufacturing process and improve the alignment accuracy of the inner and outer layer portions of the multilayer wiring board.

[0008]

In order to solve the above-mentioned problems, a first aspect of the present invention is a photomask (20) on which an original of a circuit pattern is formed, and a photosensitive outer layer (3).
3) The apparatus for manufacturing a multilayer wiring board, wherein the circuit pattern is formed on the outer layer portion by closely adhering to the multilayer wiring board (31) on which the inner layer target mark (32) is formed. A mask-side target mark (2) corresponding to the inner layer target mark (32) is formed on the mask (20).
1) is formed, and fluoroscopic means (15, 16, 17) for simultaneously detecting the inner layer target mark (32) and the mask-side target mark (21) are provided, and based on the output of the fluoroscopic means, An apparatus for manufacturing a multilayer wiring board, comprising: performing positioning between a mask and the multilayer wiring board.

According to a second aspect of the present invention, in the apparatus for manufacturing a multilayer wiring board according to the first aspect, the mask-side target mark (21) is provided with a see-through blocking part (21a) of the see-through means.
A target seal formed on the photomask (20) by forming a see-through window (21b) having a predetermined shape sufficiently larger than the inner layer target mark (32). Manufacturing equipment.

[0010]

BRIEF DESCRIPTION OF THE DRAWINGS FIG.
An embodiment of the present invention will be described in more detail.
FIG. 1 is a diagram showing an embodiment of an apparatus for manufacturing a multilayer wiring board according to the present invention, FIG. 2 is a view for explaining a mask-side target mark according to the present embodiment, and FIG. It is process drawing which shows a manufacturing process in comparison with a conventional example.

In the manufacturing apparatus 10 for the multilayer wiring board 30, a multilayer press substrate 31 is placed and moved in the xyθ directions.
An exposure table 11 that can be aligned, a mask support frame 12 that is supported above the exposure table 11 movably in the up-down direction, and on which a photomask 20 is attached;
A substrate carrying carrier 13 for carrying the multilayer press substrate 31 into the exposure table 11, and light having an exposure wavelength from the photomask 20 of the mask support frame 12 being brought into close contact with the multilayer press substrate 31 placed on the exposure table 11. And an exposure lamp 14 for irradiating.

In this embodiment, an X-ray generator 15 arranged below the exposure table 11, an intensifier 16 arranged above the mask support frame 12, and
An X-ray fluoroscopic unit including a camera 17 and the like that captures an image sensitized by the intensifier 16 is provided.

FIG. 2A shows the photomask 20.
As shown in (c), a seal 21A of the mask-side target mark 21 in which an X-ray transparent window 21a having a diameter of 3 mm is formed in an X-ray non-transparent part 21a on which a metal film such as a copper foil is formed. Is affixed. On the other hand, the multilayer press substrate 3
1 has an inner layer target mark 32 formed inside and an outer layer portion 33 outside (see FIG. 1).

The target mark 21 on the mask side preferably has a sufficiently large size with respect to the target mark 32 on the inner layer. The reason for this is that, as shown in FIG. 2A, even when the multilayer press substrate 31 roughly positioned with respect to the photomask 20 is misaligned, the mask-side target mark 21 hides the inner layer target mark 32. The reason for this is that there is no deviation and the amount of deviation is known. Therefore, as long as the size is such, the shape is not limited to the circular window, and may be other shapes such as a rectangle.

Next, the operation of this embodiment will be described. This embodiment is also based on a build-up method of a multilayer press substrate, as in the conventional example. As before, FIG.
As shown in (b), the end face processing [FIG. 3 (b3)] and the laminating [FIG. 3 (b5)] are performed.

The alignment exposure step of this embodiment [FIG.
7)] detects the inner layer target mark 32 of the land applied to the inner layer of the multilayer press substrate 31 by X-ray fluoroscopy using the X-ray generator 15, the intensifier 16, the camera 17, and the like, and performs image processing and position recognition. At the same time, the mask-side target mark 21 affixed to the photomask 20 and the inner-layer target mark 32 are compared and assigned (aligned).

That is, as shown in FIG. 2A, the mask-side target mark 2 affixed on the photomask 20 is used.
Read the XY correction of 1. Then, as shown in FIG. 2B, the center of the inner layer target mark 32 is recognized, and the exposure table 11 is moved to perform alignment (alignment). Further, as shown in FIG. 2C, adhesion is confirmed before exposure. Thereafter, as shown in FIG. 3B, development and etching steps are performed as in the conventional example.

As described above, according to the present embodiment, the following effects can be obtained. (1) Improvement of positioning accuracy In the positioning process, positioning can be performed directly without using a secondary target (conventional guide hole).
Since the alignment position can be confirmed by X-ray fluoroscopy before the exposure step of forming a circuit pattern, the alignment accuracy of the inner and outer layers of the multilayer wiring board 30 is improved.

(2) Simplification of Manufacturing Process A manufacturing process such as a conventional guide drilling process using a drill and a process of joining the photomask 20 and the multi-layer press substrate 31 using the guide holes is omitted. Can be reduced.

Various modifications and changes are possible without being limited to the above-described embodiment, and these are also within the equivalent scope of the present invention. For example, as shown in FIG. 2D, a plurality of relatively small inner layer target marks 33 may be used. In this case, a bump such as a silver paste formed on the inner layer of the multilayer press substrate 31 may be used as the inner layer target mark. At this time, as shown in FIG. 2E, a small circular mark such as the mask-side target mark 23 may be used. It is preferable that the positions of the plurality of inner layer target marks are determined by their centers of gravity. Further, although not shown, each target mark may be a cross line, a frame such as [], or the like. A plurality of mask-side target marks may be prepared in advance so that they can be appropriately selected according to the shape of the inner layer pattern.

The sticking position of the target mark on the mask is
It may not be very accurate, measure the position where it is attached,
What is necessary is just to store it as correction data. Further, the sticking positions may be formed at four corners of a blank portion of the substrate, or may be formed as a pair on the left, right, upper and lower sides.

[0022]

As described in detail above, according to the present invention, the photomask and the multilayer wiring board can be directly detected and aligned by the see-through of the see-through means. The positioning accuracy of the layer portion is improved.
In addition, by combining the alignment step by the see-through means and the exposure step by the exposure means, the conventional drill guide drilling step and the like can be omitted, so that the manufacturing process can be simplified.

[Brief description of the drawings]

FIG. 1 is a diagram showing an embodiment of an apparatus for manufacturing a multilayer wiring board according to the present invention.

FIG. 2 is a diagram illustrating a mask-side target mark according to the present embodiment.

FIG. 3 is a process diagram showing a manufacturing process of the multilayer wiring board according to the present embodiment in comparison with a conventional example.

DESCRIPTION OF SYMBOLS 10 Manufacturing apparatus for multilayer wiring board 11 Exposure table 12 Mask support frame 14 Exposure lamp 15 X-ray generator 16 Intensifier 17 Camera 20 Photomask 21 Mask-side target mark 21a X-ray non-transparent portion 31b X-ray Transparent window 30 Multilayer wiring board 31 Multilayer press board 32 Inner layer target mark 33 Photosensitive outer layer

Claims (2)

[Claims] 1. A photomask on which an original circuit pattern is formed and a multilayer wiring board having a photosensitive outer layer portion and an inner layer target mark formed thereon are brought into close contact with each other, and the circuit pattern is formed on the outer layer portion. A multi-layered wiring board manufacturing apparatus, wherein a mask-side target mark corresponding to the inner-layer target mark is formed on the photomask, and a see-through means for simultaneously detecting the inner-layer target mark and the mask-side target mark. A multilayer wiring board manufacturing apparatus, comprising: positioning the photomask and the multilayer wiring board based on an output of the see-through means. 2. The apparatus for manufacturing a multilayer wiring board according to claim 1, wherein the mask-side target mark has a see-through window of a predetermined shape sufficiently larger than the inner-layer target mark at a see-through blocking part of the see-through means. An apparatus for manufacturing a multilayer wiring board, which is a target seal formed and adhered to the photomask.