JP2001091917A - Method and device for treating substrate - Google Patents

Method and device for treating substrate

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Publication number
JP2001091917A
JP2001091917A JP26426499A JP26426499A JP2001091917A JP 2001091917 A JP2001091917 A JP 2001091917A JP 26426499 A JP26426499 A JP 26426499A JP 26426499 A JP26426499 A JP 26426499A JP 2001091917 A JP2001091917 A JP 2001091917A
Authority
JP
Japan
Prior art keywords
processing
substrate
processing tank
tank
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26426499A
Other languages
Japanese (ja)
Inventor
Noriyoshi Yokosuka
憲善 横須賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Enya Systems Ltd
Original Assignee
Enya Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enya Systems Ltd filed Critical Enya Systems Ltd
Priority to JP26426499A priority Critical patent/JP2001091917A/en
Publication of JP2001091917A publication Critical patent/JP2001091917A/en
Pending legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To decrease the footprints of a treating device which continuously executes plural treating stages. SOLUTION: This device is provided with plural treating vessels (A1), (A2), (A3), (B1), (B2) and (B3) which accept substrates (1) therein and subject the substrates to various kinds of treatment. The treating vessels are dispersed to respective treating vessel groups (A) and (B) and are arrayed in three stages in such a manner that the continuous treatments are executed in the treating vessels of the opposite treating vessel groups (A) and (B). Transporting vessels (C) having transporting vessels (C1), (C2) and (C3) are parallel movably disposed between the treating vessel groups (A) and (B). The treating vessels and transporting vessel described above are internally provided with rollers (7),..., (11)... in such a manner that the substrates (1) are made to travel leftward or rightward. The substrates (1) taken out of a loader cassette (2) are alternately transported to the treating vessel group (A) and the treating vessel group (B), are subjected to various kinds of the treatments and are housed into an underloader cassette (3).

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、基板の処理方法及
び装置に関し、特に液晶ディスプレイ等の製造工程にお
いて、ガラス基板を洗浄処理、エッチング処理、レジス
ト剥離処理等する処理方法及び装置に係るものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for processing a substrate, and more particularly to a method and apparatus for cleaning, etching, and resist stripping a glass substrate in a process of manufacturing a liquid crystal display or the like. is there.

【0002】[0002]

【従来の技術】液晶ディスプレイの製造において、例え
ばTFT(薄膜トランジスタ)方式のカラ−LCD(液
晶ディスプレイ)は、TFTのアレイ基板とカラ−フィ
ルタを貼り合わせて作られるが、これらのアレイ基板や
カラ−フィルタは、ガラス基板に種々の処理を施して作
られている。すなわち、カラ−フィルタは、ガラス基板
を洗浄し、カラ−レジストを塗布し、露光し、現像し、
焼成し、この工程をR(赤),G(緑),B(青)につ
き3回繰り返した後、洗浄し、オ−バ−コ−ト材を塗布
し、焼成して得られる。また、アレイ基板は、ガラス基
板を洗浄し、成膜し、洗浄し、レジストを塗布した後、
露光し、現像し、焼成し、エッチングし、レジストを剥
離して得られる。さらに、上記アレイ基板とカラ−フィ
ルタを貼り合わせてパネルを組み立てる工程において
は、公知のように上記アレイ基板とカラ−フィルタを洗
浄し、配向剤を塗布し、焼成、ラビング処理、洗浄、シ
−ル剤塗布、スペ−サ散布、貼り合せ、パネル分断、液
晶注入、注入口封止、配合検査、偏光板貼り付け等の処
理が行われる。上記のように、各処理工程は、連続的に
行われている。
2. Description of the Related Art In the production of liquid crystal displays, for example, a TFT (thin film transistor) type color LCD (liquid crystal display) is manufactured by bonding a TFT array substrate and a color filter. The filter is made by performing various processes on a glass substrate. That is, the color filter cleans the glass substrate, applies a color resist, exposes, develops,
After firing, this process is repeated three times for R (red), G (green), and B (blue), followed by washing, applying an overcoat material, and firing. In addition, the array substrate, after cleaning the glass substrate, forming a film, cleaning, applying a resist,
It is obtained by exposing, developing, baking, etching and stripping the resist. Further, in the step of assembling the panel by laminating the array substrate and the color filter, the array substrate and the color filter are washed, an orientation agent is applied, firing, rubbing, washing, and sealing are performed in a known manner. Processing such as application of a lubricant, application of a spacer, lamination, panel division, liquid crystal injection, injection port sealing, compounding inspection, and polarizing plate attachment are performed. As described above, each processing step is performed continuously.

【0003】また、上記製造工程で頻繁に行われる洗浄
処理には、初期受け入れ洗浄、成膜前洗浄、レジスト前
洗浄、ラビング洗浄、仕上げ洗浄等の処理があり、それ
ぞれ目的とする処理工程によって内容は多少相違する
が、基本的にはブラシ、超音波、ハイプレッシャ−等の
物理的洗浄方法、中性洗剤、有機溶剤、ライトエッチン
グ等の化学的洗浄方法、UV(紫外線)洗浄等のドライ
洗浄を適宜組み合せて洗浄しており、一般的には、洗浄
ブラシスクラブ、純水シャワ−、US(超音波)ディッ
プ、MS(メガソニック)シャワ−、純水シャワ−、液
切り(エアナイフ)等の処理を連続的に行うことが多
い。
[0003] The cleaning processes frequently performed in the above manufacturing process include initial receiving cleaning, pre-film formation cleaning, pre-resist cleaning, rubbing cleaning, and finishing cleaning. Although it is slightly different, it is basically a physical cleaning method such as brush, ultrasonic wave, high pressure, etc., a chemical cleaning method such as neutral detergent, organic solvent, light etching, etc., and a dry cleaning such as UV (ultraviolet) cleaning. The cleaning is generally performed by appropriately combining a cleaning brush scrub, a pure water shower, a US (ultrasonic) dip, an MS (megasonic) shower, a pure water shower, a liquid drainer (air knife), and the like. Processing is often performed continuously.

【0004】一方、上記ガラス基板の大きさは、液晶製
造が開始された初期の段階では、300(320)×400 mmであ
ったが、次第に360(370)×470 mm, 500(550)×600(650)
mm,650×750 mm等々のように近年益々大型化してきてい
る。そのため、そのような大型のガラス基板に対して上
記のような各種の処理、特に洗浄等の処理を行う装置で
は、各処理工程の処理部を連続的に一連に配置しなけれ
ばならないので、必然的に装置が大きくなり、フットプ
リント(占有床面積)が大きくなる傾向にあった。
On the other hand, the size of the glass substrate was 300 (320) × 400 mm at the initial stage of the production of liquid crystal, but gradually increased to 360 (370) × 470 mm and 500 (550) × 600 (650)
mm, 650 × 750 mm, etc., in recent years, it has become increasingly larger. Therefore, in an apparatus that performs the above-described various processes on such a large-sized glass substrate, in particular, a process such as cleaning, the processing units in each processing process must be continuously arranged in series. In general, the size of the apparatus tends to increase, and the footprint (occupied floor area) tends to increase.

【0005】また、従来の処理装置では、処理目的によ
って異なる処理部を必要とするが、一連の処理部が連続
して設けられているので、途中に新たな処理を加えた
り、変更したり、順序を入れ換えたりすることができ
ず、専用の装置をその都度用意しなければならなかっ
た。
In the conventional processing apparatus, different processing units are required depending on the processing purpose. However, since a series of processing units are provided continuously, new processing can be added or changed in the middle. The order could not be changed, and a dedicated device had to be prepared each time.

【0006】[0006]

【発明が解決しようとする課題】本発明の解決課題は、
液晶ディスプレイ製造における上記ガラス基板のように
大型の基板を処理する際、装置のフットプリントを低減
化すると共に処理部の追加、変更、入れ換え等に容易に
対応できるようにした基板の処理方法及び装置を提供す
ることである。
The problem to be solved by the present invention is as follows.
When processing a large substrate such as the above glass substrate in the manufacture of a liquid crystal display, a substrate processing method and apparatus capable of reducing a footprint of the apparatus and easily coping with addition, change, replacement, etc. of processing units. It is to provide.

【0007】[0007]

【課題を解決するための手段】本発明によれば、複数の
処理を連続して行う基板の処理方法において、上記処理
を行う処理槽を対向する処理槽群に分散して配列し、一
方の処理槽群の処理槽で処理した基板を対向する他方の
処理槽群の処理槽へ搬送し、該処理槽で上記一方の処理
槽群の処理槽での処理に続く処理を行うようにしたこと
を特徴とする基板の処理方法が提供され、上記課題が解
決される。
According to the present invention, in a substrate processing method for performing a plurality of processes in succession, the processing baths for performing the above-mentioned processes are dispersed and arranged in a group of facing processing baths. The substrate processed in the processing tank of the processing tank group is transported to the processing tank of the other processing tank group opposed thereto, and the processing following the processing in the processing tank of the one processing tank group is performed in the processing tank. A method for processing a substrate is provided, which solves the above-mentioned problem.

【0008】また、本発明によれば、複数の処理を連続
して行う基板の処理装置において、基板を受け入れ処理
を行う複数の処理槽と、連続する処理が一方の処理槽群
の処理槽と他方の処理槽群の処理槽で交互に行われるよ
う上記複数の処理槽を対向する処理槽群に分散して配列
した一対の処理槽群と、一方の上記処理槽群から他方の
上記処理槽群へ基板を搬送する搬送手段を具備すること
を特徴とする基板の処理装置が提供され、上記課題が解
決される。
Further, according to the present invention, in a substrate processing apparatus for continuously performing a plurality of processes, a plurality of processing tanks for receiving a substrate and performing a continuous process, A pair of processing tank groups in which the plurality of processing tanks are dispersedly arranged in opposing processing tank groups so as to be alternately performed in the processing tanks of the other processing tank group, and from the one processing tank group to the other processing tank There is provided a substrate processing apparatus comprising a transfer means for transferring a substrate to a group, and the above-mentioned problem is solved.

【0009】本発明において、上記基板の搬送手段とし
ては、上記処理槽群間で並行移動する搬送槽群を用いた
り、一方の処理槽群を他方の処理槽群に対して並行移動
するようにした処理方法及び装置が提供され、上記課題
が解決される。
In the present invention, as the substrate transfer means, a transfer tank group moving in parallel between the processing tank groups may be used, or one of the processing tank groups may be moved in parallel with the other processing tank group. The above-mentioned subject is solved by providing a processing method and an apparatus.

【0010】[0010]

【発明の実施の形態】本発明は、ガラス基板等の基板を
処理する各処理工程において適宜に適用することができ
るが、図1においては液晶ディスプレイの大型のガラス
基板を洗浄処理する工程に本発明を適用した一実施例を
示している。上述したように洗浄工程には、種々の方
法、工程等が採用され、図1に示す実施例では、一例と
してロ−ダ−カセット(2)から取り出した基板(1)
に対して紫外線照射処理、純水又は薬液シャワ−、純水
又は薬液ジェット処理、メガソニック処理、液切り(エ
アナイフ)処理及び加熱乾燥処理し、アンロ−ダ−カセ
ット(3)に収納するまでの処理を連続して行うよう構
成されている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention can be appropriately applied to each processing step for processing a substrate such as a glass substrate. In FIG. 1, the present invention is applied to a step of cleaning a large glass substrate of a liquid crystal display. 1 shows an embodiment to which the invention is applied. As described above, various methods and steps are employed in the cleaning process. In the embodiment shown in FIG. 1, the substrate (1) taken out of the loader cassette (2) is an example.
UV irradiation treatment, pure water or chemical solution shower, pure water or chemical solution jet treatment, megasonic treatment, liquid drainage (air knife) treatment, heat drying treatment, and storage in the unloader cassette (3). The processing is performed continuously.

【0011】上記各処理を行う処理槽(4)は、側方に
基板(1)の出入口(5)と、該出入口(5)を開閉す
る扉(6)が有り、内部に基板(1)を支持し該槽内で
右行、左行させるためのロ−ラ(7)・・・が設けられ
ている。なお、図においては、上記ロ−ラ(7)を右回
転、左回転させるためのモ−タ等の駆動手段や上記ロ−
ラ上の基板に上記各処理を行うための処理機構は、省略
されているが、これらは公知の適宜の手段や機構を用い
ることができ、各処理槽に対応してそれぞれ設けられて
いる。
The processing tank (4) for performing each of the above-mentioned processes has an entrance (5) for the substrate (1) on the side and a door (6) for opening and closing the entrance (5). And a roller (7)... For supporting the right and left rows in the tank. In the figure, driving means such as a motor for rotating the roller (7) clockwise and counterclockwise, and the roller (7) are used.
Although a processing mechanism for performing each of the above-described processes on the substrate on the glass is omitted, well-known appropriate means and mechanisms can be used, and these are provided corresponding to each processing tank.

【0012】図において、上記処理槽(4)は、6ヶ所
に設けられ、これらは対向する一対の処理槽群(A),
(B)に分散して配列される。この分散は、上記連続す
る処理が、一方の処理槽群(A)の処理槽(A1),(A2),(A
3)と他方の処理槽群(B)の処理槽(B1),(B2),(B3)で交
互に行われるよう分配されている。また、図において
は、上記基板は水平方向に移動して処理槽に出入するよ
うに構成してあるので、上記処理槽はフットプリントを
低減するよう水平状態で多段に重なる方向に上下方向に
3段に配列してあるが、処理工程の数に応じて2段若し
くは4段以上に配列することもでき、後記するように基
板を起立させ垂直状態で移動して処理槽に出入するよう
に構成した場合は、処理槽を横方向に隣接して2列に配
列することもできる(図6)。
In the figure, the processing tanks (4) are provided at six locations, and they are arranged in a pair of processing tank groups (A),
(B). This dispersion is based on the fact that the above continuous processing is performed by the processing tanks (A1), (A2), (A) of one of the processing tank groups (A).
3) and the processing tanks (B1), (B2), and (B3) of the other processing tank group (B) are distributed alternately. Further, in the figure, the substrate is configured to move in the horizontal direction and enter and exit the processing tank. Therefore, the processing tank is vertically moved in a multi-stage overlapping direction to reduce the footprint. Although arranged in stages, it can also be arranged in two stages or four or more stages according to the number of processing steps. As described later, the substrate is raised and moved vertically to enter and exit the processing tank. In this case, the processing tanks can be arranged in two rows adjacent to each other in the horizontal direction (FIG. 6).

【0013】一方の処理槽群の処理槽で処理した基板を
対向する他方の処理槽群の処理槽へ搬送する搬送手段が
設けられている。該搬送手段は適宜のロボット等を用い
てもよいが、図においては、処理槽群に隣接する搬送槽
群(C)が用いられている。該搬送槽群(C)は、上記
処理槽群(A),(B)間に設けられ、複数の搬送槽
(8)を有している。該搬送槽(8)は、上記処理槽
(4)とほぼ同様に基板(1)の出入口(9)と、該出
入口(9)を開閉する扉(10)と、上記処理層のロ−ラ
(7)・・・の回転により送り出された基板(1)を受
取って左行若しくは右行させて次工程へ送るロ−ラ(11)
・・・を有しており、搬送槽群(C)全体として適宜の
駆動手段により上記処理槽群に沿って上下方向に並行移
動する。なお、図において搬送槽群(C)は、上記処理
槽の段数に対応するよう3つの搬送槽(C1),(C2),(C3)を
有しているが、段数よりも少なくしてもよい。
A transfer means is provided for transferring a substrate processed in one of the processing tank groups to a processing tank in the other processing tank group. As the transfer means, an appropriate robot or the like may be used, but in the figure, a transfer tank group (C) adjacent to the processing tank group is used. The transfer tank group (C) is provided between the processing tank groups (A) and (B), and has a plurality of transfer tanks (8). The transfer tank (8) includes an entrance (9) for the substrate (1), a door (10) for opening and closing the entrance (9), and a roller for the treatment layer in substantially the same manner as the processing tank (4). A roller (11) which receives the substrate (1) sent out by the rotation of (7)...
, And the entire transport tank group (C) is vertically moved in parallel along the processing tank group by an appropriate driving means. In the figure, the transport tank group (C) has three transport tanks (C1), (C2), and (C3) corresponding to the number of stages of the processing tank. Good.

【0014】上記搬送槽群(C)の搬送槽(8)の幅
は、少くとも上記基板(1)を槽内に収納できる大きさ
を有するが、上記処理槽(4)と同じ大きさに形成して
もよい。したがって、後記するように上記処理槽群の一
方を他方の処理槽群に対して並行移動するように設けれ
ば、上記搬送槽群を用いなくても該処理槽群で基板の搬
送手段を兼用することもできる(図5)。この場合、上
記処理槽群(A),(B)間の幅は、基板を受け渡しでき
る幅にしてある。
The width of the transfer tank (8) of the transfer tank group (C) is at least large enough to accommodate the substrate (1) in the tank, but is the same as that of the processing tank (4). It may be formed. Therefore, if one of the processing tank groups is provided so as to move in parallel with the other processing tank group as described later, the processing tank group can also serve as a substrate transfer unit without using the transfer tank group. (Figure 5). In this case, the width between the processing tank groups (A) and (B) is set to a width capable of delivering the substrate.

【0015】図1に示す実施例においては、処理槽群
(A)の3段の処理槽のうち、下段の処理槽(A1)で紫外
線(UV)照射処理を行い、その上方の処理槽(A2)で純
水又は薬液シャワ−、純水又は薬液ジェット処理を行
い、さらにその上方の処理槽(A3)で液切り(エアナイ
フ)処理を行うように配列してある。また、処理槽群
(B)の処理槽(B1)でブラッシング処理を行い、その上
方の処理槽(B2)でメガソニック(MS)シャワ−処理を
行い、さらにその上方の処理槽(B3)で加熱乾燥処理を行
うよう配列してある。そして、上記ロ−ダ−カセット
(2)からロボット等の適宜の手段で基板(1)を取り
出し、処理槽内のロ−ラ(7)・・・、搬送槽内のロ−
ラ(11)・・・を適時に左行、右行させることにより上記
基板(1)を水平方向左若しくは右に移動し、また上記
搬送槽群(C)を上下動させることにより上記基板
(1)を水平状態で上下に移動させ、上記各処理を連続
して行い、処理後の基板をアンロ−ダ−カセット(3)
に収納することができる。
In the embodiment shown in FIG. 1, of the three processing tanks in the processing tank group (A), the lower processing tank (A1) is subjected to ultraviolet (UV) irradiation, and the processing tank ( The arrangement is such that pure water or chemical solution showering, pure water or chemical solution jet treatment is performed in A2), and liquid drainage (air knife) treatment is performed in the treatment tank (A3) above it. In addition, brushing is performed in the processing tank (B1) of the processing tank group (B), megasonic (MS) shower processing is performed in the processing tank (B2) above the processing tank (B1), and further in the processing tank (B3) above the processing tank (B3). It is arranged to perform a heat drying process. Then, the substrate (1) is taken out of the loader cassette (2) by an appropriate means such as a robot, and is loaded into a roller (7) in the processing tank, a roller in the transfer tank.
.. Are moved to the left or right in the horizontal direction, and the substrate (1) is moved up and down in the horizontal direction. 1) is moved up and down in a horizontal state, and each of the above-mentioned processes is performed continuously, and the processed substrate is unloaded into an unloader cassette (3).
Can be stored.

【0016】上記処理工程の態様の一例を図2〜図4を
参照して詳述すると下記の通りである。なお、図2〜図
3において、〜はそれぞれガラス基板を示してい
る。図2(a) は、ロ−ダ−カセット(2)に基板が位
置している最初の状態を示し、基板が処理槽群(A)
の処理槽(A1)に送られると、該基板は該処理槽におい
て紫外線照射処理を受ける(同図(b))、このときロ−ダ
−カセット(2)には基板が位置する。
An example of the mode of the above-mentioned processing step will be described below in detail with reference to FIGS. In addition, in FIGS. 2 and 3, each represents a glass substrate. FIG. 2A shows an initial state in which the substrate is located in the loader cassette (2), and the substrate is in the processing tank group (A).
When the substrate is sent to the processing tank (A1), the substrate is subjected to an ultraviolet irradiation treatment in the processing tank (FIG. (B)). At this time, the substrate is located in the loader cassette (2).

【0017】基板に対する上記処理が終了すると、該
基板は搬送槽群(C)の下段の搬送槽(C1)を通って右
行し、他方の処理槽群(B)の処理槽(B1)に搬送され、
ブラッシング処理をうける。この間、基板は上記処理
槽(A1)に入って上記処理を受け、ロ−ダ−カセット
(2)には基板が待機する(同図(c))。
When the above-mentioned processing for the substrate is completed, the substrate goes right through the lower transfer tank (C1) of the transfer tank group (C) and goes to the processing tank (B1) of the other processing tank group (B). Transported,
Receive brushing treatment. During this time, the substrate enters the processing tank (A1) and undergoes the above processing, and the substrate waits in the loader cassette (2) (FIG. (C)).

【0018】上記基板のブラッシング処理が終了する
と、該基板は左行して上記搬送槽(C1)に搬送される
(同図(d))。そして、搬送槽群(C)を上昇させ(同図
(e))、基板を左行して処理槽群(A)の処理槽(A2)に
搬入(同図(f))した後、該搬送槽群(C)を降下させる
(同図(g))。処理槽(A2)に入った基板は純水シャワ−
等のシャワ−処理を受ける。
When the brushing of the substrate is completed, the substrate is transported leftward to the transport tank (C1) (FIG. 4 (d)). Then, the transport tank group (C) is raised (see FIG.
(e)), the substrate is moved to the left and carried into the processing tank (A2) of the processing tank group (A) ((f) in the same figure), and then the transfer tank group (C) is lowered (FIG. )). Substrate in processing tank (A2) is pure water shower
And so on.

【0019】基板の純水シャワ−等のシャワ−処理及
び基板の紫外線照射処理が終了したら、各基板,
はそれぞれ搬送槽(C2),(C1) を通って右行し、処理槽群
(B)の処理槽(B2),(B1)に入り、メガソニックシャワ
−処理及びブラッシング処理を受ける(同図(h))。この
間に、上記基板は、処理槽(A1)に送られ、ロ−ダ−カ
セット(2)には、基板が待機する。
After the shower processing such as pure water shower processing of the substrate and the ultraviolet irradiation processing of the substrate are completed, each substrate,
Goes to the right through the transport tanks (C2) and (C1), enters the processing tanks (B2) and (B1) of the processing tank group (B), and undergoes megasonic showering and brushing. (h)). During this time, the substrate is sent to the processing tank (A1), and the substrate stands by in the loader cassette (2).

【0020】基板のメガソニックシャワ−処理及び基
板のブラッシング処理が終了すると、各基板,は
左行し、それぞれ搬送槽群(C)の搬送槽(C2),(C1) に
入り(同図(i))、該搬送槽群(C)を上昇させ(同図
(j))た後、さらに左行し処理槽群(A)の処理槽(A3),
(A2)に入り(同図(k))、該搬送槽群(C)は降下する
(同図(l))。そして、上記基板はエアナイフ処理を受
け、基板は純水シャワ−処理を受ける。
When the megasonic showering process and the substrate brushing process of the substrate are completed, each substrate moves to the left and enters the transport tanks (C2) and (C1) of the transport tank group (C) (FIG. i)) and raise the transfer tank group (C) (see FIG.
(j)), and then move to the left. The treatment tanks (A3),
After entering (A2) ((k) in the figure), the transport tank group (C) descends ((l) in the figure). The substrate is subjected to an air knife process, and the substrate is subjected to a pure water shower process.

【0021】基板,,の各処理が終了すると、各
基板は搬送槽(C3),(C2),(C1)を通って右行し、処理槽群
(B)の処理槽(B3),(B2),(B1)に入り、基板は加熱乾
燥処理を受け、基板はメガソニックシャワ−処理を受
け、基板はブラッシング処理を受け、基板は処理槽
(A1)に入り、ロ−ダ−カセットには基板が待機する
(図3(a))。
When the processing of the substrates is completed, each substrate goes right through the transport tanks (C3), (C2), and (C1), and goes to the processing tanks (B3), (B) of the processing tank group (B). Entering (B2), (B1), the substrate is subjected to the heating and drying treatment, the substrate is subjected to the megasonic showering treatment, the substrate is subjected to the brushing treatment, and the substrate is subjected to the treatment tank.
In (A1), the substrates are on standby in the loader cassette (FIG. 3 (a)).

【0022】基板は加熱乾燥処理が終ると右行してア
ンロ−ダ−カセット(3)に収納され、上記基板,
は処理終了後左行して搬送槽(C2),(C1) に入る(同図
(b))。その後、搬送槽群(C)は上昇し(同図(c))、基
板,は左行して処理槽(A3),(A2) に入る(同図
(d))。この状態は、上記図2(k) とほぼ同じ状態である
から、以下上述と同様の手順で図3(e) 〜(l), 図4
(a) 〜(l) に示すように基板〜を連続してロ−ダ−
カセット(2)から取り出し、洗浄処理してアンロ−ダ
−カセット(3)に収納することができる。
When the heating and drying process is completed, the substrate is moved rightward and stored in an unloader cassette (3).
Moves to the left after the process is completed, and enters the transport tanks (C2) and (C1).
(b)). Thereafter, the transport tank group (C) rises ((c) in the same figure), and the substrate moves left and enters the processing tanks (A3) and (A2) (the same figure).
(d)). Since this state is almost the same as that of FIG. 2 (k), FIGS. 3 (e) to (l) and FIG.
As shown in (a) to (l), the substrate is continuously loaded.
It can be taken out of the cassette (2), washed and stored in the unloader cassette (3).

【0023】上記各処理工程における処理時間が大きく
相違するような場合は、同じ処理を行う複数の処理槽を
設けて繰り返して処理を受けるようにしたり、他の基板
を先行して搬送させることにより全体の搬送に支障を生
じないようにすればよい。また、上記処理槽のうち、不
要な処理がある場合は、その処理槽を飛ばして上記搬送
槽群を移動させればよく、新たな処理槽を付加して他の
処理を受けるようにしたり適宜に構成することができ
る。
In the case where the processing time in each of the above processing steps is greatly different, a plurality of processing tanks for performing the same processing may be provided so as to receive the processing repeatedly, or another substrate may be transported in advance. What is necessary is just to prevent the whole conveyance from being affected. In addition, among the processing tanks, when there is an unnecessary processing, the processing tank may be skipped and the transfer tank group may be moved, and a new processing tank may be added to receive another processing or may be appropriately performed. Can be configured.

【0024】図5に示す実施例は、上記処理槽群(B)
を、上記搬送槽群(C)とほぼ同様に他方の処理槽群
(A)に対して上下方向に並行移動させ、該処理槽群
(B)で搬送槽群を兼用することにより連続する処理を
行うようにした実施例である。この場合、同図(a),(b)
に示すように移動させて処理槽群(A),(B)の処理槽
(A1)→(B1)→(A2)→(B2)→(A3)を経てロ−ダ−カセット
(2)から取り出した基板に一連の処理を行うよう適宜
の処理部が分散配列され、最後にアンロ−ダ−カセット
(3)に基板を収納するようにしてあるが、アンロ−ダ
−カセット(3)を図5(a) 鎖線で示す下段の位置に設
けることもできる。そのようにするには、処理槽群
(A)の処理槽(A3)での処理が終った基板を受けとるよ
う他方の処理槽群(B)の下段の処理槽(B1)が上記処理
槽(A3)に対向する位置まで処理槽群(B)を上昇させ、
基板を処理槽(B1)に搬入した後、該処理槽(B1)がアンロ
−ダ−カセットに対向する位置まで該処理槽群(B)を
降下させ、アンロ−ダ−カセット(3)に処理された基
板を搬送するようにすればよい。
In the embodiment shown in FIG. 5, the processing tank group (B) is used.
Is moved in the vertical direction with respect to the other processing tank group (A) in substantially the same manner as the transfer tank group (C), and the processing tank group (B) also serves as the transfer tank group to perform continuous processing. This is an embodiment in which the following is performed. In this case, (a), (b)
And moved as shown in (a) and (b).
(A1) → (B1) → (A2) → (B2) → (A3), and appropriate processing units are distributed and arranged to perform a series of processing on the substrate taken out of the loader cassette (2). Although the substrate is stored in the unloader cassette (3), the unloader cassette (3) may be provided at a lower position shown by a chain line in FIG. To do so, the lower processing tank (B1) of the other processing tank group (B) is placed in the processing tank (B1) so as to receive the substrate after the processing in the processing tank (A3) of the processing tank group (A). Raise the processing tank group (B) to a position facing A3),
After carrying the substrate into the processing tank (B1), the processing tank group (B) is lowered to a position where the processing tank (B1) faces the unloader cassette, and the substrate is processed into the unloader cassette (3). The transported substrate may be transported.

【0025】上記実施例では、基板を水平状態で搬送処
理しているが、図6に示すように基板を起立させて垂直
状態で搬送して各種処理を行うようにしてもよい。図6
は、このような実施例を示す平面からみた説明図であっ
て、処理槽は起立して設けられ、上方に開口する基板の
出入口(5)と該出入口を開閉する扉(図示略)を有
し、槽内に各種の処理を行う処理機構(図示略)が設け
られている。また、処理槽群(A),(B)に配列される
複数の処理槽は連続する処理を交互に行うように分散さ
れ、処理槽(A1),(A2),(A3)を横方向に隣接して配列した
処理槽群(A)と、処理槽(B1),(B2)及び基板を一時的
に収納するバッファ−槽(BU)を横方向に隣接して配
列した処理槽群(B)を有し、ロ−ダ−カセット(2)
から取り出した基板(1)を処理槽(B1)→(A1)→(B2)→
(A2)→(BU)→(A3)→(BU)を経てアンロ−ダ−カセット
(3)に収納する一連の処理を行うようにしてある。な
お、上記バッファ−槽(BU)を、適宜の処理を行う処
理槽としてもよい。
In the above embodiment, the substrate is transported in a horizontal state. However, as shown in FIG. 6, the substrate may be raised and transported in a vertical state to perform various processes. FIG.
Is a plan view showing such an embodiment, in which a processing tank is provided upright and has an entrance (5) for a substrate that opens upward and a door (not shown) that opens and closes the entrance. A processing mechanism (not shown) for performing various types of processing is provided in the tank. Further, the plurality of processing tanks arranged in the processing tank groups (A) and (B) are dispersed so as to alternately perform continuous processing, and the processing tanks (A1), (A2) and (A3) are arranged in a horizontal direction. A processing tank group (B) in which a processing tank group (A) arranged adjacently and a buffer tank (BU) for temporarily storing the processing tanks (B1) and (B2) and a substrate are horizontally arranged. ) And a loader cassette (2)
The substrate (1) taken out from the processing tank (B1) → (A1) → (B2) →
(A2) → (BU) → (A3) → (BU), and a series of processing for storing in the unloader cassette (3) is performed. The buffer tank (BU) may be a processing tank for performing an appropriate process.

【0026】上記処理槽群(A),(B)間には上記実施
例のように複数の搬送槽を有する搬送槽群を設け、該搬
送槽群を介して基板を並行移動するようにしてもよい
が、図に示す実施例では上記処理槽群(B)を上記処理
槽群(A)に対して並行移動可能に設け、該処理槽群
(B)によって基板を並行移動させるようにしてある。
そして、上記処理槽群(A),(B)間には、一方の処理
槽群の処理槽の槽内に進入して基板を把持し、槽外に基
板を取り出し、他方の処理槽群の上方に横移動し、下方
に降下して該処理槽群内の処理槽に進入して該基板を槽
内に搬入する機能を有する適宜のロボット(図示略)が
設けられている。該ロボットは、処理槽群(A)の各処
理槽及びロ−ダ−カセット(2),アンロ−ダ−カセッ
ト(3)に対応して複数設けてあるが、1つのロボット
を搬送が必要な個所に移動させて上記基板の搬送搬入を
行うようにしてもよい。
A transfer tank group having a plurality of transfer tanks is provided between the processing tank groups (A) and (B) as in the above embodiment, and the substrate is moved in parallel through the transfer tank groups. Alternatively, in the embodiment shown in the figure, the processing tank group (B) is provided so as to be movable in parallel with the processing tank group (A), and the substrate is moved in parallel by the processing tank group (B). is there.
Then, between the processing tank groups (A) and (B), the substrate enters the processing tank of one processing tank group, grips the substrate, takes out the substrate outside the tank, and removes the substrate from the other processing tank group. An appropriate robot (not shown) having a function of moving laterally upward, descending downward, entering a processing tank in the processing tank group, and carrying the substrate into the tank is provided. A plurality of such robots are provided corresponding to each processing tank of the processing tank group (A), the loader cassette (2), and the unloader cassette (3), but one robot needs to be transported. The substrate may be moved to a location to carry the substrate.

【0027】図6に示す実施例においては、本質的に上
記図2〜図4に示す実施例と同じように、上記処理槽群
(A),(B)間を基板が交互に移動し、図6(a) 〜(n)
に示すような経過で一連の処理が行われる。その作動状
態は、上記実施例と本質的に同じであるので、その詳細
は省略する。
In the embodiment shown in FIG. 6, the substrate moves alternately between the processing tank groups (A) and (B), essentially as in the embodiment shown in FIGS. Fig. 6 (a)-(n)
A series of processes are performed in the course shown in FIG. The operation state is essentially the same as that of the above-described embodiment, and the details thereof are omitted.

【0028】[0028]

【発明の効果】本発明は上記のように構成され、複数の
処理を連続して行う基板の処理方法及び装置において、
上記処理を処理槽内で行い、連続する処理が一方の処理
槽群と他方の処理槽群で交互に行われるよう対向する処
理槽群に上記処理槽を分散して配列し、一方の処理槽群
の処理槽で処理した基板を対向する他方の処理槽群の処
理槽に搬入し、該処理槽で上記一方の処理槽群の処理槽
での処理に続く処理を行うようにしたから、連続処理す
る複数の処理槽が一対の処理槽群にまとめられて装置全
体のフットプリントを低減することができ、また各処理
を処理槽毎に独立させたから、処理槽を入れ換えたり、
取り外したり、付加したりすることにより種々の処理に
容易に対応することができ、不要な処理槽を通過させず
に基板を搬送することもでき、著しくフレキシビリティ
を増大させることが可能であり、液晶ディスプレイの大
型のガラス基板の洗浄工程、その他の処理工程の他、各
種の基板の処理等に好適に適用することができる。
According to the present invention, there is provided a method and an apparatus for processing a substrate configured as described above and performing a plurality of processes continuously.
Performing the above processing in a processing tank, dispersing and arranging the processing tanks in opposing processing tank groups so that continuous processing is alternately performed in one processing tank group and the other processing tank group, and one processing tank Since the substrate processed in the processing tank of the group is carried into the processing tank of the other processing tank group opposed thereto, the processing following the processing in the processing tank of the one processing tank group is performed in the processing tank. A plurality of processing tanks to be processed are combined into a pair of processing tank groups to reduce the footprint of the entire apparatus, and since each processing is independent for each processing tank, the processing tanks can be replaced,
By removing or adding, it is possible to easily cope with various processes, it is possible to transport the substrate without passing through unnecessary processing tanks, it is possible to significantly increase flexibility, The present invention can be suitably applied to a process of cleaning a large glass substrate of a liquid crystal display, a process of other substrates, and a process of various substrates.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施例を示し、(a) は搬送槽群が下
方位置にあるとき、(b) は上方位置にあるときの各正面
図である。
FIGS. 1A and 1B show an embodiment of the present invention, wherein FIG. 1A is a front view when a transport tank group is at a lower position, and FIG.

【図2】図1に示す装置の作動状態を示す説明図であ
る。
FIG. 2 is an explanatory diagram showing an operation state of the device shown in FIG.

【図3】図2の作動に続く作動状態を示す説明図であ
る。
FIG. 3 is an explanatory diagram showing an operation state following the operation of FIG. 2;

【図4】図3の作動に続く作動状態を示す説明図であ
る。
FIG. 4 is an explanatory diagram showing an operation state following the operation in FIG. 3;

【図5】本発明の他の実施例を示し、(a) は一方の処理
槽群が下方位置にあるとき、(b) は上方位置にあるとき
の各正面図である。
5A and 5B show other embodiments of the present invention, wherein FIG. 5A is a front view when one processing tank group is at a lower position, and FIG. 5B is a front view when it is at an upper position.

【図6】本発明の他の実施例を示す平面からみた説明図
である。
FIG. 6 is an explanatory diagram viewed from a plane showing another embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1 基板 2 ロ−ダ−カセット 3 アンロ−ダ−カセット 4 処理槽 8 搬送槽 A,B 処理槽群 C 搬送槽群 A1, A2, A3, B1, B2, B3 処理槽 C1, C2, C3 搬送槽 1 substrate 2 loader cassette 3 unloader cassette 4 processing tank 8 transfer tank A, B processing tank group C transfer tank group A1, A2, A3, B1, B2, B3 processing tank C1, C2, C3 transfer tank

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 複数の処理を連続して行う基板の処理方
法において、上記処理を行う処理槽を対向する処理槽群
に分散して配列し、一方の処理槽群の処理槽で処理した
基板を対向する他方の処理槽群の処理槽へ搬送し、該処
理槽で上記一方の処理槽群の処理槽での処理に続く処理
を行うようにしたことを特徴とする基板の処理方法。
In a method of processing a substrate, wherein a plurality of processes are continuously performed, the processing baths for performing the above-described processes are dispersedly arranged in a group of facing processing baths, and the substrates processed in one of the processing baths of the processing bath group. Wherein the substrate is transported to a processing tank of the other opposite processing tank group, and processing subsequent to the processing in the processing tank of the one processing tank group is performed in the processing tank.
【請求項2】 上記基板の搬送は、上記処理槽群間で並
行移動する複数の搬送槽を有する搬送槽群によって行わ
れる請求項1に記載の基板の処理方法。
2. The substrate processing method according to claim 1, wherein the transfer of the substrate is performed by a transfer tank group having a plurality of transfer tanks moving in parallel between the processing tank groups.
【請求項3】 上記基板の搬送は、一方の処理槽群を他
方の処理槽群に対して並行移動することにより行われる
請求項1に記載の基板の処理方法。
3. The substrate processing method according to claim 1, wherein the transport of the substrate is performed by moving one processing tank group in parallel with the other processing tank group.
【請求項4】 複数の処理を連続して行う基板の処理装
置において、基板を受け入れ処理を行う複数の処理槽
と、連続する処理が一方の処理槽群の処理槽と他方の処
理槽群の処理槽で交互に行われるよう上記複数の処理槽
を対向する処理槽群に分散して配列した一対の処理槽群
と、一方の上記処理槽群から他方の上記処理槽群へ基板
を搬送する搬送手段を具備することを特徴とする基板の
処理装置。
4. In a substrate processing apparatus for continuously performing a plurality of processes, a plurality of processing tanks for receiving a substrate and performing a continuous process, wherein one of the processing tanks in one processing tank group and the other in the other processing tank group. A pair of processing tanks arranged such that the plurality of processing tanks are dispersedly arranged in opposing processing tank groups so as to be alternately performed in the processing tanks, and a substrate is transferred from one of the processing tank groups to the other processing tank group. An apparatus for processing a substrate, comprising a transport unit.
【請求項5】 上記処理槽群の間に上記処理槽にそれぞ
れ対向する複数の搬送槽を配列した搬送槽群を設け、基
板を上記処理槽から搬送槽に収納し上記処理槽群間で該
搬送槽群を並行移動させて該基板を搬送するようにした
請求項4に記載の基板の処理装置。
5. A transfer tank group in which a plurality of transfer tanks respectively facing the processing tank are provided between the processing tank groups, and a substrate is stored in the transfer tank from the processing tank, and the substrate is placed between the processing tank groups. The substrate processing apparatus according to claim 4, wherein the substrate is transported by moving the transport tank group in parallel.
【請求項6】 上記処理槽群の一方を、他方の処理槽群
に対して並行移動させて基板を搬送するようにした請求
項4に記載の基板の処理装置。
6. The substrate processing apparatus according to claim 4, wherein one of the processing tank groups is moved in parallel with the other processing tank group to transfer the substrate.
JP26426499A 1999-09-17 1999-09-17 Method and device for treating substrate Pending JP2001091917A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26426499A JP2001091917A (en) 1999-09-17 1999-09-17 Method and device for treating substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26426499A JP2001091917A (en) 1999-09-17 1999-09-17 Method and device for treating substrate

Publications (1)

Publication Number Publication Date
JP2001091917A true JP2001091917A (en) 2001-04-06

Family

ID=17400765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26426499A Pending JP2001091917A (en) 1999-09-17 1999-09-17 Method and device for treating substrate

Country Status (1)

Country Link
JP (1) JP2001091917A (en)

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