JP2001091574A - Control method of test burn-in apparatus and test burn- in apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the measurement reliability by detecting that the measurement start temperature of a test burn-in apparatus and the device temperature reach within ratings, and reduce the program developing and evaluating time and improve the apparatus availability by removing the device temperature rise waiting time from device programs. SOLUTION: The apparatus comprises a temperature controller 7 for receiving signals from thermocouples 6a, 6b for controlling the temperature of a thermostatic tank, a delayed temperature sensor 21 for detecting that the device temperature rises within a test control range, a test start temperature detector 20 connected for receiving a signal outputted from the temperature controller 7 when it comes within a set range and a signal from the delayed temperature sensor 21 and receiving the set condition from the temperature controller, and a test controller 8 for receiving a signal from the test start temperature detector 20 to start tests.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a test burn-in apparatus, and more particularly, to a control system in which temperature control of a thermostat and test start temperature are made independent.

[0002]

2. Description of the Related Art In a known example described in Japanese Patent Application Laid-Open No. 1-227374, a gas heated by a heater 1 is sent out by a blower 2 in a thermostat having an inner / outer double tank structure shown in FIG. The air passes through the vent 4 and is sent to the inside,
The burn-in board 9 in a is heated. On the other hand, the inner layer 3a
Passes through the hot air exhaust port 5 and returns to the heater 1 in the outer layer 3b. The gas temperature at the hot-air outlet 4 is detected by a thermocouple 6a, and the gas temperature at the hot-air outlet 5 is detected by a thermocouple 6b. Control is performed such that the air temperature of 3a falls within the set range.

A second known example described in Japanese Patent Application Laid-Open No. Hei 9-152465 discloses a space region 11a-1 formed between IC sockets 10 on a burn-in board 9 shown in FIG.
1d, a connector 1 for electrically connecting the burn-in board 9 and the control unit with temperature sensors 12a to 12d for detecting the temperature of the gas surrounding the mounted semiconductor device.
A signal is sent from some terminals of 3a to the temperature control unit 7 to control the temperature.

[0004]

The first problem is that, from the above two known examples, the determination of the measurement start temperature of the test burn-in device is determined when the gas temperature in the bath reaches the set temperature. Therefore, since the temperature of the semiconductor IC (hereinafter referred to as “device”) mounted on the burn-in board does not fall within the set range, a measurement start signal is output, so that an error may be obtained to obtain measurement reliability. It is necessary to set an extra time including a factor by a device program, which lowers the operation of the apparatus.

The reason is that due to the influence of the heat capacity load of the burn-in board 9 shown in FIG. 6, the inner layer gas temperature profile 100 and the device temperature profile 101 have a time lag with respect to the temperature rise as shown in FIG. is there. More specifically, since the conventional temperature control measures the temperature of the gas, the gas temperature profile 10
Intersection 111a when 0 reaches set lower limit temperature 110
The intersection point 111b with the device temperature profile 101 on the same time axis is a portion 112 outside the set temperature range.
The test burn-in device determines that the temperature is within the temperature standard, and a signal is sent from the temperature control unit 7 shown in FIGS. 5 and 6 to the test control unit 8 to start the test. Set lower limit temperature
This is because a time longer than the device temperature rise waiting time 113 at the intersection 111c of the intersection 110 and the intersection 111a must be described in the device program.

The second problem is disclosed in Japanese Patent Application Laid-Open No. 9-152465.
In the known example described in Japanese Patent Application Laid-Open No. H10-260, the temperature control is performed by the gas temperature around the device by providing the space regions 11a to 11d in each burn-in board 9 shown in FIG. 6 and disposing the temperature sensors 12a to 12d. , This method is also the first
Along with the problem pointed out in the above problem, the burn-in board 9 and the burn-in device become expensive.

The reason is that the spatial regions 11a to 11a shown in FIG.
In order to secure the area of 11d and arrange the temperature sensors 12a to 12d, the number of sockets for mounting the devices must be reduced, so that the unit price per unit becomes high, and the temperature sensor mounted on each burn-in board is required. This is because a large number of temperature detection circuits, each of which is multiplied by the number of boards, are required, and the control scale becomes large.

[0008]

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-mentioned problems, improve the reliability of measurement of a test burn-in apparatus, and eliminate a device temperature rise waiting time from a device program, thereby improving program development and evaluation. The object is to shorten the period and improve the operation of the apparatus.

[0009]

The object of the present invention can be achieved by providing the following means. 1. The temperature in the constant temperature layer of the burn-in device is controlled to be the set temperature, and the temperature near the hot air exhaust port of the constant temperature bath is measured by a delay temperature sensor that detects a temperature rise equivalent to the device temperature. When the temperature reaches the set value and the temperature detected by the delay sensor reaches the set value, a device test is started (claim 1). 2. Regarding the temperature control in the constant temperature layer of the burn-in device, a delay temperature sensor for detecting a temperature rise equivalent to the device temperature is provided separately from a thermocouple used for temperature control in the tank, and a signal of the thermocouple is sent to a temperature control unit. Then, the output signal from the temperature controller and the signal from the delay sensor and the signal from the delay sensor are sent to the test start temperature detector, and when the detected temperatures of the temperature controller and the delay sensor are within the set temperature range, the AND operation is performed. A signal is sent to the unit to start a test (claim 6). 3. Temperature measuring means used for temperature control in a thermostat of a burn-in apparatus, hot air generating means, a delay temperature sensor for detecting a temperature rise equivalent to the temperature of a device to be tested in the thermostat, and the temperature measuring means By controlling the hot air generating means with the measured value of the predetermined temperature set value and controlling the inside of the constant temperature bath to the set value, the temperature in the constant temperature bath is the set value And a temperature control unit that outputs an output signal when the output signal of the delay temperature sensor reaches the set value and an output signal when an AND condition of the output signal of the temperature control unit is satisfied. A test start temperature detecting section for outputting, and a test control section for starting a test of a device in the constant temperature bath according to an output signal of the test start temperature detecting section. There so as to initiate a test of the thermostatic 漕内 devices upon entering the set temperature range (claim 11). 4. A thermostatic bath comprising an outer row, an inner row, and a hot air generating means installed between the outer row and the inner row; and thermoelectric elements respectively disposed near the hot air inlet and the hot air exhaust port of the inner row. A pair, a delay temperature sensor arranged near the hot air exhaust port of the inner tank and detecting a temperature rise equivalent to the temperature of a device housed in the inner tank, and each detection signal of each thermocouple, With a predetermined temperature set value, while controlling the hot air generating means, a temperature control unit that outputs a signal when the temperature in the thermostat enters the set temperature range, and a detection signal of the delay temperature sensor A test start temperature detection unit that outputs an output signal when an AND condition is satisfied between a signal when the set value is reached and an output signal of the temperature control unit, and an output signal of the test start temperature detection unit. Testing of devices in the oven A test control unit which, consist (claim 17). 5. Detect the temperature of the gas circulating in the thermostat, heat the burn board in the thermostat by detecting the temperature of this gas, and apply a predetermined temperature stress to the device through the socket mounted on the burn-in board. In the burn-in device to be applied, a temperature control unit that receives a signal from a thermocouple for temperature control in a thermostatic oven, a delay sensor that detects that the device temperature is within a test condition range, And a signal from the test start temperature detector connected to receive the set condition from the temperature controller and a signal from the test start temperature detector. And a test control unit for starting a test. 6. The delay temperature sensor is installed at the same height as a burn-in board of an arbitrary slot accommodated in a thermostat (claims 2, 7, 13, 18, 24). 7. The structure of the delay temperature sensor is the same as the structure of the socket mounted on the burn-in board (claims 3, 8, 14, 19, 25). 8. The heat capacity of the delay temperature sensor is set to be the same as the heat capacity of the socket mounted on the burn-in board (claims 4, 9, 15, 20, 26). 9. The object can be achieved by installing the delay temperature sensor in each of a plurality of types of slots and adding a function of switching according to the type of the delay temperature sensor (claims 5, 10, 16, and 2).
1, 27).

[0010]

According to the construction of the present invention, the thermocouples 6a to 6b installed in the thermostat as shown in FIG. 1 are sent to the temperature control unit 7 for the gas in the thermostat and are set to a predetermined temperature. In addition to performing temperature control, set temperature information is sent to the test start temperature detection unit 20. Test start temperature detector 20
Is constantly monitoring the temperature signal sent from the delay temperature sensor 21 installed in the hot air exhaust port 5, comparing with the set temperature information received from the temperature control unit 7, and detecting that the temperature is within the range. Since a test start signal is sent to the test control unit 8, the test can be started after the device temperature surely falls within a predetermined set temperature range.

[0011]

Next, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a diagram showing a first embodiment of the present invention. In FIG. 1, the burn-in device is a thermostatic bath having a double structure of an outer layer 3b and an inner layer 3a, and sends out a gas heated by a heater 1 by a blower 2,
The air passes through the hot air vent 4 in the inner layer 3a and the outer layer 3b and is sent to the inside to heat the burn-in board 9 in the inner layer 3a.

On the other hand, the gas in the inner layer 3a passes through the hot air exhaust port 5 and returns to the heater 1 in the outer layer 3b. A thermocouple 6 a for detecting the gas temperature of the hot air supply port 4 and a thermocouple 6 b for detecting the gas temperature of the hot air exhaust port 5 are connected to the temperature control unit 7.

FIG. 2 is a view showing the state of attachment of the delay temperature sensor. In order to detect a temperature rise equivalent to the temperature of the device mounted on the burn-in board 9, the fixing plate 3
The delay temperature sensor 21 attached at 0 is attached to the inner layer 3 a of the hot air exhaust port 5 so as to be at the same height as the burn-in board 9, and is connected to the test start temperature detector 20. The test start temperature detection section 20 is connected to the temperature control section 7 and also to the test control section 8.

FIG. 3 is a diagram showing the configuration of the delay temperature sensor. The delay temperature sensor 21 described here has a fixing plate 30 for attachment to the inner layer 3a and a socket block 31 formed in the same shape as the socket.
To 32b, the depth of embedding from the bottom surface of the opening 32a is set to the dimension A, and the thermocouple 33 for the delay temperature sensor is embedded. The shape of the socket block 31 is not specific to the shape as long as it can be correlated with the temperature of the device mounted on the actual burn-in board. The embedded depth of the thermocouple 33 for the delay temperature sensor is:
Since it greatly affects the shape of the socket block 31, it is not specified. In order to detect a temperature rise equivalent to the temperature of the device mounted on the burn-in board 9, the delay temperature sensor has the same structure as the socket mounted on the burn-in board, or is mounted on the burn-in board. It is desirable to have a heat capacity similar to that of a socket. Further, although not shown, the delay temperature sensor has a replaceable structure.

[0015]

The operation of the present invention having the above configuration will be described below. In the burn-in apparatus, a program including a temperature condition of a device mounted on the burn-in board 9 set in the inner layer 3a is set, and the program is started.
When the program is started, the temperature information set by the program is sent to the temperature control unit 7 and internally set, and then the set temperature is sent to the test start unit temperature detection unit 20 to set the test start temperature.

The temperature control section 7 heats the heater 1 to raise the temperature to the set temperature, and the heated gas is sent out by the blower 2 and passes through the hot air blowing port 4 composed of the inner layer 3a and the outer layer 3b. Then, the burn-in board 9 is fed into the inner layer 3a and heated.

On the other hand, the hot air of the inner layer 3a is directed toward the hot air exhaust port 5 composed of the inner layer 3a and the outer layer 3b.
-40b flows through the delay temperature sensor 21 and returns to the heater 1 in the outer layer 3b. The temperature of the hot air 40a to 40b is determined by the thermocouple 6a for detecting the gas temperature of the hot air vent 4.
Is detected by a thermocouple 6b for detecting the gas temperature of the hot air exhaust port 5, and the signal is sent to the temperature control unit 7 to control the amount of current applied to the heater 1.

Thermocouple 6a connected to temperature controller 7
6b directly detects the temperature of the gas, and when the temperature reaches the temperature set by the program, enters the stability control and sends a signal to the test start temperature detection unit 20. The test start temperature detection unit 20
When detecting that the temperature of the thermocouple 33 for the delay temperature sensor embedded in the socket block 31 of the delay temperature sensor 21 has reached the set temperature, an AND with a signal indicating that the gas temperature has entered the stable control is performed. Then, a test start signal is sent to the test control unit 8 to start the test.

FIG. 4 is a block diagram showing another embodiment of the present invention. Plural types of delay temperature sensors 21a-21
e is attached so as to have the same height as the burn-in board 9 of the inner layer 3a, and is connected to the test start temperature detecting section.

The operation of the above configuration will be described. As preparations before the start of measurement in the burn-in apparatus, registration of product information and setting of a program including device temperature conditions are performed. Thereafter, when the apparatus is started, the program is started and the delay temperature sensors 21a to 21a-2 are obtained from the product information.
1e is selected and the operation described in the above embodiment is performed.

[0021]

The first effect is that it is possible to detect that the temperature of the device has reached a specified temperature and to output a test start signal, thereby minimizing the operation loss time. This makes it possible to shorten the program development time by eliminating the need for setting conditions when creating a device program.

The reason is that a signal output from a temperature control unit connected to a thermocouple for controlling temperature in a thermostatic chamber when the temperature falls within a set range, and a delayed temperature sensor having the same characteristics as the temperature rise of the device. Is taken by the test start temperature detection unit, and the output signal from the temperature control unit and the AND of the delay temperature sensor are taken, so that the test start signal can be output to the test control unit after the device temperature reaches the set temperature. That's why.

The second effect is that an optimum sensor can be selected without being affected by the shape of the socket mounted on the burn-in board, and there is an effect that it can be applied to various types. The reason is to arrange multiple types of delay temperature sensors at the height where the burn-in board is set, select the corresponding delay temperature sensor from product information, and AND the output signal of the temperature control unit and the delay temperature sensor signal. This is because a test start signal can be output to the test controller after the device temperature reaches the set temperature.

[Brief description of the drawings]

FIG. 1 is a diagram showing a first embodiment of the present invention.

FIG. 2 is a diagram showing an attached state of a delay temperature sensor according to the present invention.

FIG. 3 is a diagram showing a configuration of a delay temperature sensor of the present invention.

FIG. 4 is a configuration diagram showing another embodiment of the present invention.

FIG. 5 is a diagram showing a conventional example.

FIG. 6 is a configuration diagram showing another conventional example.

FIG. 7 is a diagram showing profiles of gas temperature and device temperature.

[Explanation of symbols]

Reference Signs List 1 heater 2 blower 3a inner layer 3b outer layer 4 hot air inlet 5 hot air exhaust port 6a, 6b thermocouple 7 temperature controller 8 test controller 9 burn-in board 10 IC socket 11a, 11b, 11c, 11d space area 12a, 12b, 12c , 12d Temperature sensor 13a, 13b Connector 20 Test start temperature detector 21, 21, 21a, 21b, 21c, 21d, 21e Delay temperature sensor 30 Fixing plate 31 Socket block 32a, 32b Opening 33 Thermocouple for delay temperature sensor 40a, 40b Hot air Reference Signs List 100 gas temperature profile 101 device temperature profile 110 set lower limit temperature 111a, 111b, 111c intersection point 112 outside set temperature range 113 device temperature rise waiting time

Claims (27)

[Claims] 1. A temperature control device for controlling the temperature in a constant temperature bath of a burn-in device to be a set temperature and measuring a temperature in the vicinity of a hot air exhaust port of the constant temperature bath by a delay temperature sensor detecting a temperature rise equivalent to a device temperature. And controlling the test burn-in device when the temperature in the thermostat reaches the set value and the temperature detected by the delay sensor reaches the set value. 2. The control method for a test burn-in apparatus according to claim 6, wherein said delay temperature sensor is installed at the same height as a burn-in board of an arbitrary slot accommodated in a constant temperature bath. 3. The control method according to claim 6, wherein the delay temperature sensor has a structure similar to a socket mounted on a burn-in board. 4. The control method according to claim 6, wherein the delay temperature sensor has a heat capacity similar to that of a socket mounted on a burn-in board. 5. The control method for a test burn-in apparatus according to claim 6, wherein a plurality of types of said delay temperature sensors are installed in each slot, and have a function of switching according to a type. 6. A temperature control in a thermostatic chamber of a burn-in apparatus, wherein a delay temperature sensor for detecting a temperature rise equivalent to a device temperature is provided separately from a thermocouple used for temperature control in the chamber.
The signal of the thermocouple is sent to the temperature control unit, and the output signal and the signal of the delay sensor which have entered the set temperature range from the temperature control unit are sent to the test start temperature detection unit, and the detected temperatures of the temperature control unit and the delay sensor are set. A test burn-in device, which performs an AND operation when the temperature is within a temperature range and sends a signal to a test control unit to start a test. 7. The test burn-in apparatus according to claim 1, wherein the delay temperature sensor is installed at the same height as a burn-in board of an arbitrary slot accommodated in a constant temperature bath. 8. The test burn-in device according to claim 1, wherein the delay temperature sensor has a structure similar to a socket mounted on a burn-in board. 9. The test burn-in apparatus according to claim 1, wherein the delay temperature sensor has a heat capacity similar to that of a socket mounted on a burn-in board. 10. The test burn-in apparatus according to claim 1, wherein a plurality of types of said delay temperature sensors are installed in each of the slots and have a function of switching according to the type. 11. A temperature measuring means used for controlling the temperature in a thermostatic oven of a burn-in apparatus, a hot air generating means, and a delay temperature sensor for detecting a temperature rise equivalent to the temperature of a device to be tested in the thermostatic oven. By controlling the hot air generating means by the measured value of the temperature measuring means and a predetermined temperature set value, while controlling the inside of the constant temperature tank to the set value, the inside of the constant temperature tank A temperature control unit that outputs an output signal when the temperature reaches the set value; and an AND condition of a signal when the detection signal of the delay temperature sensor reaches the set value and an output signal of the temperature control unit is satisfied. A test start temperature detection unit that outputs an output signal when the test is started, and a test control unit that starts a test of a device in the constant temperature bath based on an output signal of the test start temperature detection unit. A test burn-in apparatus characterized in that a test of a device in the constant temperature bath is started when the temperature detected by the delay sensor falls within the set temperature range. 12. The test burn-in apparatus according to claim 11, wherein said temperature measuring means is a thermocouple provided in the vicinity of a hot-air inlet and a hot-air outlet of a thermostatic oven, respectively. 13. The test burn-in apparatus according to claim 11, wherein the delay temperature sensor is installed at the same height as a burn-in board of an arbitrary slot accommodated in a thermostat. 14. The test burn-in device according to claim 11, wherein the delay temperature sensor has a structure similar to a socket mounted on the burn-in board. 15. The test burn-in apparatus according to claim 11, wherein said delay temperature sensor has a heat capacity similar to that of a socket mounted on said burn-in board. 16. The test burn-in apparatus according to claim 11, wherein a plurality of types of said delay temperature sensors are installed in each slot, and have a function of switching according to the type. 17. A constant temperature bath comprising an outer row, an inner row, and a hot air generating means provided between the outer row and the inner row, and a hot air outlet and a hot air exhaust port near the inner row, respectively. A thermocouple disposed, a delay temperature sensor disposed near the hot air exhaust port of the inner tank and detecting a temperature rise equivalent to the temperature of a device housed in the inner tank; and A temperature control unit that controls the hot air generating means by each detection signal and a predetermined temperature set value, and outputs a signal when the temperature in the constant temperature bath falls within the set temperature range; and A test start temperature detection unit that outputs an output signal when an AND condition is satisfied between a signal when a sensor detection signal reaches the set value and an output signal of the temperature control unit; and the test start temperature detection unit. The output signal of the A test controller to initiate the test of the scan, the test burn-in system, characterized in that it consists of. 18. The test burn-in apparatus according to claim 17, wherein the delay temperature sensor is installed at the same height as a burn-in board of an arbitrary slot accommodated in the constant temperature bath. 19. The test burn-in apparatus according to claim 17, wherein said delay temperature sensor has a structure similar to a socket mounted on a burn-in board. 20. The test burn-in apparatus according to claim 17, wherein the delay temperature sensor for detecting a temperature rise equivalent to the device temperature has a heat capacity similar to that of a socket mounted on a burn-in board. 21. The test burn-in apparatus according to claim 17, wherein a plurality of types of said delay temperature sensors are installed in each slot, and have a function of switching according to the type. 22. A temperature of a gas circulating in the constant temperature bath is detected, and by detecting the temperature of the gas, a burn board in the constant temperature bath is heated, and the device is connected to a device via a socket mounted on the burn-in board. In a burn-in device for applying a predetermined temperature stress, a temperature controller for receiving a signal from a thermocouple for controlling the temperature in a thermostatic oven, a delay sensor for detecting that a device temperature is within a test condition range, and the temperature controller A test start temperature detection unit connected to receive a signal output when the temperature reaches a set temperature range and a signal of the delay sensor, and to receive a set condition from the temperature control unit; and the test start temperature detection unit. A test burn-in device, comprising: a test control unit that receives a signal from the control unit and starts a test; 23. The test burn-in apparatus according to claim 22, wherein the thermocouple is a thermocouple provided in the vicinity of a hot-air inlet and a hot-air outlet of a thermostat. 24. The test burn-in apparatus according to claim 17, wherein the delay temperature sensor is installed at the same height as a burn-in board of an arbitrary slot accommodated in the constant temperature bath. 25. The test burn-in apparatus according to claim 17, wherein the delay temperature sensor has a structure similar to a socket mounted on a burn-in board. 26. The test burn-in apparatus according to claim 17, wherein the delay temperature sensor for detecting a temperature rise equivalent to the device temperature has a heat capacity similar to that of a socket mounted on a burn-in board. 27. The test burn-in device according to claim 17, wherein a plurality of types of said delay temperature sensors are installed in each slot, and have a function of switching according to the type.